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SW-SC001-003
User Manual
25 pgs952.77 Kb0

GE Industrial Solutions SW-SC001-003 User Manual

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GE
Data Sheet
October 14, 2013
Page 1
Features
Compliant to RoHS II EU Directive 2011/65/EC (-Z versions) Compliant to ROHS EU Directive 2002/95/EC with lead solder
exemption (non-Z versions)
Delivers up to 3.5A Output current
15V (1A), 12V (1.25A), 5.0V (3A) and 3.3V (3.5A)
High efficiency – 86% at 5.0V full load (V
IN
=54 Vdc)
Low output ripple and noise Small Size and low profile
27.94mm x 24.38mm x 8.5mm
(1.10 x 0.96 x 0.335 in)
Industry Standard pin-out:
TH version is LW series compatible
Surface mount (SMT) or Through hole (TH) Remote On/Off (optional pin on TH version) Output overcurrent/voltage protection Single Tightly regulated output Output voltage adjustment trim 10% Wide operating temperature range (-40°C to 85°C) Meets the voltage insulation requirements for ETSI 300-132-2
and complies with and is Licensed for Basic Insulation rating per EN 60950
CE mark meets the 2006/95/EC directive
§
UL* 60950-1Recognized, CSA
†
C22.2 No. 60950-1-03 Certified,
and VDE‡ 0805: (IEC60950, 3rd Edition) Licensed
ISO** 9001 and ISO 14001 certified manufacturing facilities Approved for Basic Insulation
Applications
Wireless Networks Distributed power architectures Optical and Access Network Equipment Enterprise Networks Latest generation IC’s (DSP, FPGA, ASIC) and
Microprocessor powered applications
Options
Remote On/Off logic (positive or negative), pin
optional for TH version (Suffix 1 or 4)
Output voltage adjustment-Trim, pin optional for
TH version (Suffix 9)
Surface Mount/Tape and Reel (-SR Suffix)
Description
The SW/SC series power modules are isolated dc-dc converters that operate over a wide range of input voltage (VIN = 18 - 36Vdc for SC modules and VIN = 36 – 75Vdc for SW modules) and provide a single precisely regulated output. This series is a low cost, smaller size alternative to the existing LW/LAW/LC with enhanced performance parameters. The output is fully isolated from the input, allowing versatile polarity configurations and grounding connections. The modules exhibit high efficiency, typical efficiency of 86% for 5.0V/3A. Built-in filtering for both input and output minimizes the need for external filtering.
§ This product is intended for integration into end-use equipment. All of the required procedures of end-use equipment should be followed.
* UL is a registered trademark of Underwriters Laboratories, Inc.
†
CSA is a registered trademark of Canadian Standards Association.
‡
VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
** ISO is a registered trademark of the International Organization of Standards
RoHS Compliant
Representative Photo. Actual product may vary.
SW/SC001/003 Series DC-DC Converter Power Modules:
18-36V & 36-75Vdc Input; 3.3V-15Vdc Output; 1-3.5A Output Current
GE
Data Sheet
SW/SC001/003 Series DC-DC Power Module
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
October 14, 2013
Page 2
Parameter
Device
Symbol
Min
Max
Unit
Input Voltage (Continuous)
SW
V
IN
-0.3
80
Vdc
SC
V
IN
-0.3
50
Transient (100ms)
All
V
IN, trans
-0.3
100
Vdc
Operating Ambient Temperature
All
TA -40
85
°C
(see Thermal Considerations section)
Storage Temperature
All
T
stg
-55
125
°C
I/O Isolation Voltage (100% factory Hi-Pot tested)
All
2250
Vdc
Parameter
Device
Symbol
Min
Typ
Max
Unit
Operating Input Voltage
SW
VIN
36
54
75
Vdc SC
VIN
18
27
36
Vdc
Maximum Input Current (VIN=0V to 75V, IO=I
O, max
)
SW
I
IN,max
0.6
Adc
(VIN=0V to 36V, IO=I
O, max
)
SC
I
IN,max
1.2
Adc
Inrush Transient
All
I2t
0.05
A2s
Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 12μH source impedance; VIN=0V to 75V, IO= I
Omax
; see Test configuration section)
All
30 mAp-p Input Ripple Rejection (120Hz)
All
50 dB
EMC, EN55022 See EMC Considerations section
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to being part of complex power architecture. To preserve maximum flexibility, internal fusing is not included; however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 3A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information.
GE
Data Sheet
SW/SC001/003 Series DC-DC Power Module
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
October 14, 2013
Page 3
Parameter
Device
Symbol
Min
Typ
Max
Unit
Output Voltage Set-point
All
V
O, set
-1.5  +1.5
% V
O, set
(VIN=V
IN,nom
, IO=I
O, max
, TA=25°C)
Output Voltage
VO -3.0  +3.0
% V
O, set
(Over all operating input voltage, resistive load, and temperature conditions until end of life)
Adjustment Range
All
V
O, adj
-10.0
+10.0
% V
O, set
Selected by external resistor
Output Regulation
Line (VIN=V
IN, min
to V
IN, max
) (relative to actual V
O, set
at 50% load)
All
 0.05
0.3
% V
O, set
Load (IO=I
O, min
to I
O, max
) (relative to actual V
O, set
at Typical VIN)
All
 0.05
0.2
% V
O, set
Temperature (T
ref=TA, min
to T
A, max
)
All
1.00
% V
O, set
Output Ripple and Noise on nominal output
Measured with 10uF Tantalum and 1uF ceramic
(VIN=V
IN, nom IO
=80%I
O, max TA
=25°C)
RMS (5Hz to 20MHz bandwidth)
5V, 3.3V
25
mV
rms
Peak-to-Peak (5Hz to 20MHz bandwidth)
5V, 3.3V
75
mV
pk-pk
RMS (5Hz to 20MHz bandwidth)
15V, 12V
35
mV
rms
Peak-to-Peak (5Hz to 20MHz bandwidth)
15V, 12V
100
mV
pk-pk
External Capacitance
3.3V, 5V
C
O, max
0  1000
μF
12V, 15V
C
O, max
0  220
μF
Output Current
15V
Io 0  1.0
Adc 12V
Io 0  1.25
Adc 5V
Io 0  3.0
Adc
3.3V
Io 0  3.5
Adc
Output Current Limit Inception
15V
I
O, lim
1.1
Adc
(Hiccup Mode)
12V
I
O, lim
1.4
Adc
5V
I
O, lim
3.2
4.2  Adc
3.3V
I
O, lim
3.7
Adc
Output Short-Circuit Current
15V
I
O, s/c
0.8
Arms
VO ≤ 250 mV @ 25o C
12V
I
O, s/c
1.2
Arms
5V
I
O, s/c
0.7
Arms
3.3V
I
O, s/c
1.5
Arms
Efficiency
SW (15V)
η 88.0  %
VIN=V
IN, nom
, TA=25°C
SW (12V)
η 87.0  %
IO=I
O, max, VO
= V
O, set
SW (5.0V)
η 86.0  %
SW (3.3V)
η
83.0
85.0  %
SC (12V)
η 85.0  %
SC (5.0V)
η 85.5  %
SC (3.3V)
η 85.5  %
Switching Frequency (Variable with Line & Load)
VIN=V
IN, nom
and IO= I
O, max
All
f
sw
300  kHz
VIN=V
IN, nom
and IO= 0.5 x I
O, max
All
f
sw
440  kHz
Electrical Specifications (continued)
GE
Data Sheet
SW/SC001/003 Series DC-DC Power Module
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
October 14, 2013
Page 4
Parameter
Device
Symbol
Min
Typ
Max
Unit
Dynamic Load Response
(Io/t=0.1A/s, VIN=V
IN, nom, TA
=25°C)
Load Change from Io= 50% to 75% or 25% to 50% of Io,max:
Peak Deviation
All
V
pk
1.5  % V
O, set
Settling Time (Vo<10% peak deviation)
All
t
s
800
s
Parameter
Symbol
Min
Typ
Max
Unit
Isolation Capacitance
C
iso
65  pF
Isolation Resistance
R
iso
10
MΩ
I/O Isolation Voltage
All
2250
Vdc
Parameter
Min
Typ
Max
Unit
Calculated MTBF (for SW003A0A91 in accordance with Lineage Power RIN: IO=80% of I
O, max
,
TA=25°C, airflow=1m/s)
8,200,000
Hours
Weight
7.9 (0.28)  g (oz.)
Electrical Specifications (continued)
Isolation Specifications
General Specifications
GE
Data Sheet
SW/SC001/003 Series DC-DC Power Module
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
October 14, 2013
Page 5
Parameter
Device
Symbol
Min
Typ
Max
Unit
Remote On/Off Signal Interface
(VIN=V
IN, min
to V
IN, max
; open collector or equivalent,
Signal referenced to V
IN-
terminal)
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On
Logic Low - Remote On/Off Current
All
I
on/off
1.0
mA
Logic Low - On/Off Voltage
All
V
on/off
-0.7  1.2
V
Logic High Voltage – (Typ = Open Collector)
All
V
on/off
5.8
15 V Logic High maximum allowable leakage current
All
I
on/off
50
μA
Turn-On Delay and Rise Times
(IO=80% of I
O, max
, TA=25°C)
Case 1: On/Off input is set ON and then input power is applied (T
delay
= from instant at which VIN=V
IN, min
until VO =
10% of V
O, set
).
All
T
delay
Case1
20
50
ms
Case 2: Input power is applied for at least 1 second and then On/Off input is set from OFF to ON (T
delay
= from instant
at which VIN=V
IN, min
until VO = 10% of V
O, set
).
All
T
delay
Case2
20
50
ms
T
rise
= time for VO to rise from 10% of V
O, set
to 90% of V
O, set
.
All
T
rise
 0.1 1 ms
T
rise
= time for VO to rise from 10% of V
O, set
to 90% of V
O, set
with max ext capacitance
All
T
rise
 1.5  ms
Output Voltage Overshoot
3
% V
O, set
(IO=80% of I
O, max
, VIN= 54V, TA=25°C)
Output Overvoltage Protection
15V
V
O, limit
16.6  21.0
V
12V
V
O, limit
13.3  16.0
V
5.0V
V
O, limit
5.6  7.0
V
3.3V
V
O, limit
3.7  5.4
V
Input Undervoltage Lockout
Turn-on Threshold
SW
V
uv/on
33
36
V
Turn-off Threshold
SW
V
uv/off
27.5
30.5  V
Hysterisis
SW
V
hyst
 2.5  V
Turn-on Threshold
SC
V
uv/on
17
18
V
Turn-off Threshold
SC
V
uv/off
13.5
14.5  V
Hystersis
SC
V
hyst
 3.0  V
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information.
GE
Data Sheet
SW/SC001/003 Series DC-DC Power Module
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
October 14, 2013
Page 6
EFFICIENCY (%)
70
72
74
76
78
80
82
84
86
88
90
0 0.2 0.4 0.6 0.8 1
VI = 36V VI = 54V VI = 75V
On/Off VOLTAGE, OUTPUT VOLTAGE
V
ON/OFF
(V) (2V/div) V
O
(V) (5V/div)
OUTPUT CURRENT, Io (A)
TIME, t (5ms/div)
Figure 1. Converter Efficiency versus Output Current.
Figure 4. Typical Start-Up Using Remote On/Off, negative logic version shown.
OUTPUT CURRENT, Io (A)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 10 20 30 40 50 60 70 80 90 100 110
3.0 m/s (600 ft./min.)
2.0 m/s (400 ft./min.)
1.0 m/s (200 ft./min.) Natural Convection
OUTPUT VOLTAGE, OUTPUT CURRENT
V
O
(V) (50mV/div), I
O
(A) (0.2A/div)
AMBIENT TEMPERATURE, TA OC
TIME, t (1ms/div)
Figure 2. Derating Output Current versus Local Ambient Temperature and Airflow.
Figure 5. Transient Response to Dynamic Load Change from 50% to 75% to 50% of full load.
OUTPUT VOLTAGE,
V
O
(V) (20mV/div)
OUTPUT VOLTAGE
V
O
(V) (2.5V/div)
TIME, t (1s/div)
TIME, t (500s/div)
Figure 3. Typical Output Ripple and Noise, VIN=V
IN, nom
IO=80% of I
O, max.
Figure 6. Typical Start-Up Output Voltage Rise Characteristic.
Characteristic Curves
The following figures provide typical characteristics for the SW001A0C91 (15.0V, 1A) at 25ºC. The figures are identical for either positive or negative Remote On/Off logic.
GE
Data Sheet
SW/SC001/003 Series DC-DC Power Module
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
October 14, 2013
Page 7
EFFICIENCY (%)
70
72
74
76
78
80
82
84
86
88
0.0 0.2 0.4 0.6 0.8 1.0 1.2
VI = 36V VI = 54V VI = 75V
On/Off VOLTAGE, OUTPUT VOLTAGE
V
ON/OFF
(V) (2V/div) V
O
(V) (5V/div)
OUTPUT CURRENT, Io (A)
TIME, t (5ms/div)
Figure 7. Converter Efficiency Vs Load at Vo= 12 V.
Figure 10. Typical Start-Up Using Remote On/Off, negative logic version shown.
OUTPUT CURRENT, Io (A)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0 10 20 30 40 50 60 70 80 90 100 110
3.0 m/s (600 ft./min.)
2.0 m/s (400 ft./min.)
1.0 m/s (200 ft./min.) Natural Convection
OUTPUT VOLTAGE, OUTPUT CURRENT
V
O
(V) (50mV/div), I
O
(A) (0.2A/div)
AMBIENT TEMPERATURE, TA OC
TIME, t (1.0ms/div)
Figure 8. Derating Output Current versus Local Ambient Temperature and Airflow.
Figure 11. Transient Response to Dynamic Load Change from 50% to 75% to 50% of full load.
OUTPUT VOLTAGE,
V
O
(V) (50mV/div) OUTPUT VOLTAGE
V
O
(V) (2V/div)
TIME, t (1s/div)
TIME, t (100s/div)
Figure 9. Typical Output Ripple and Noise, VIN=V
IN, nom
IO=80% of I
O, max.
Figure 12. Typical Start-Up Output Voltage Rise Characteristic.
Characteristic Curves (continued)
The following figures provide typical characteristics for the SW001A2B91 (12.0V, 1.2A) at 25ºC. The figures are identical for either
positive or negative Remote On/Off logic.
GE
Data Sheet
SW/SC001/003 Series DC-DC Power Module
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
October 14, 2013
Page 8
EFFICIENCY (%)
70
72
74
76
78
80
82
84
86
88
VI = 36V VI = 54V VI = 75V
On/Off VOLTAGE, OUTPUT VOLTAGE
V
ON/OFF
(V) (2V/div) V
O
(V) (5V/div)
OUTPUT CURRENT, Io (A)
TIME, t (5ms/div)
Figure 13. Converter Efficiency Vs Load at Vo= 5V.
Figure 16. Typical Start-Up Using Remote On/Off, negative logic version shown.
OUTPUT CURRENT, Io (A)
0
1
2
3
4
0 10 20 30 40 50 60 70 80 90 100 110
3.0 m/s (600 ft./min.)
2.0 m/s (400 ft./min.)
1.0 m/s (200 ft./min.) Natural Convection
OUTPUT VOLTAGE, OUTPUT CURRENT
V
O
(V) (50mV/div), I
O
(A) (0.2A/div)
AMBIENT TEMPERATURE, TA OC
TIME, t (1.0ms/div)
Figure 14. Derating Output Current versus Local Ambient Temperature and Airflow.
Figure 17. Transient Response to Dynamic Load Change from 50% to 75% to 50% of full load.
OUTPUT VOLTAGE,
V
O
(V) (20mV/div) OUTPUT VOLTAGE
V
O
(V) (1V/div)
TIME, t (1s/div)
TIME, t (100s/div)
Figure 15. Typical Output Ripple and Noise, VIN=V
IN, nom
IO=80% of I
O, max.
Figure 18. Typical Start-Up Output Voltage Rise Characteristic.
Characteristic Curves (continued)
The following figures provide typical characteristics for the SW003A0A91 (5.0V, 3A) at 25ºC. The figures are identical for either positive or negative Remote On/Off logic.
GE
Data Sheet
SW/SC001/003 Series DC-DC Power Module
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
October 14, 2013
Page 9
EFFICIENCY (%)
70
72
74
76
78
80
82
84
86
88
0 0.5 1 1.5 2 2.5 3 3.5
VI = 36V VI = 54V VI = 75V
On/Off VOLTAGE, OUTPUT VOLTAGE
V
ON/OFF
(V) (2V/div) V
O
(V) (5V/div)
OUTPUT CURRENT, Io (A)
TIME, t (1.0ms/div)
Figure 19. Converter Efficiency Vs Load.
Figure 22. Typical Start-Up Using Remote On/Off, negative logic version shown.
OUTPUT CURRENT, Io (A)
0
1
2
3
4
0 10 20 30 40 50 60 70 80 90 100 110
3.0m/s (600ft/min)
2.0m/s (400ft/min)
1.0m/s (200ft/min)
Natural Convection
OUTPUT VOLTAGE, OUTPUT CURRENT
V
O
(V) (50mV/div), I
O
(A) (0.2A/div)
AMBIENT TEMPERATURE, TA OC
TIME, t (1.0ms/div)
Figure 20. Derating Output Current versus Local Ambient Temperature and Airflow.
Figure 23. Transient Response to Dynamic Load Change from 50% to 75% to 50% of full load.
OUTPUT VOLTAGE,
V
O
(V) (20mV/div)
OUTPUT VOLTAGE
V
O
(V) (1V/div)
TIME, t (2s/div)
TIME, t (100s/div)
Figure 21. Typical Output Ripple and Noise, VIN=V
IN, nom
IO=80% of I
O, max.
Figure 24. Typical Start-Up Output Voltage Rise Characteristic.
Characteristic Curves (continued)
The following figures provide typical characteristics for the SW003A5F91 (3.3V, 3.5A) at 25ºC. The figures are identical for either positive or negative Remote On/Off logic.
GE
Data Sheet
SW/SC001/003 Series DC-DC Power Module
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
October 14, 2013
Page 10
EFFICIENCY (%)
70
72
74
76
78
80
82
84
86
88
0.0 0.2 0.4 0.6 0.8 1.0 1.2
VI = 18V VI = 27V VI = 36V
On/Off VOLTAGE, OUTPUT VOLTAGE
V
ON/OFF
(V) (2V/div) V
O
(V) (5V/div)
OUTPUT CURRENT, Io (A)
TIME, t (5ms/div)
Figure 25. Converter Efficiency Vs Load.
Figure 28. Typical Start-Up Using Remote On/Off, negative logic version shown.
OUTPUT CURRENT, Io (A)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0 10 20 30 40 50 60 70 80 90 100 110
3.0 m/s (600 ft./min.)
2.0 m/s (400 ft./min.)
1.0 m/s (200 ft./min.) Natural Convection
OUTPUT VOLTAGE, OUTPUT CURRENT
V
O
(V) (50mV/div), I
O
(A) (0.2A/div)
AMBIENT TEMPERATURE, TA OC
TIME, t (1.0ms/div)
Figure 26. Derating Output Current versus Local Ambient Temperature and Airflow.
Figure 29. Transient Response to Dynamic Load Change from 50% to 75% to 50% of full load.
OUTPUT VOLTAGE,
V
O
(V) (50mV/div) OUTPUT VOLTAGE
V
O
(V) (2V/div)
TIME, t (1s/div)
TIME, t (100s/div)
Figure 27. Typical Output Ripple and Noise, VIN=V
IN, nom
IO=80% of I
O, max.
Figure 30. Typical Start-Up Output Voltage Rise Characteristic.
Characteristic Curves (continued)
The following figures provide typical characteristics for the SC001A2B91 (12.0V, 1.2A) at 25ºC. The figures are identical for either positive or negative Remote On/Off logic.
GE
Data Sheet
SW/SC001/003 Series DC-DC Power Module
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
October 14, 2013
Page 11
EFFICIENCY (%)
70
72
74
76
78
80
82
84
86
88
0 0.5 1 1.5 2 2.5 3
VI = 18V VI = 27V VI = 36V
On/Off VOLTAGE, OUTPUT VOLTAGE
V
ON/OFF
(V) (2V/div) V
O
(V) (5V/div)
OUTPUT CURRENT, Io (A)
TIME, t (5ms/div)
Figure 31. Converter Efficiency Vs Load.
Figure 34. Typical Start-Up Using Remote On/Off, negative logic version shown.
OUTPUT CURRENT, Io (A)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 10 20 30 40 50 60 70 80 90 100 110
3.0 m/s (600 ft./min.)
2.0 m/s (400 ft./min.)
1.0 m/s (200 ft./min.)
Natural Convection
OUTPUT VOLTAGE, OUTPUT CURRENT
V
O
(V) (50mV/div), I
O
(A) (0.2A/div)
AMBIENT TEMPERATURE, TA OC
TIME, t (1.0ms/div)
Figure 32. Derating Output Current versus Local Ambient Temperature and Airflow.
Figure 35. Transient Response to Dynamic Load Change from 50% to 75% to 50% of full load.
OUTPUT VOLTAGE,
V
O
(V) (20mV/div) OUTPUT VOLTAGE
V
O
(V) (1V/div)
TIME, t (1s/div)
TIME, t (100s/div)
Figure 33. Typical Output Ripple and Noise, VIN=V
IN, nom
IO=80% of I
O, max.
Figure 36. Typical Start-Up Output Voltage Rise Characteristic.
Characteristic Curves (continued)
The following figures provide typical characteristics for the SC003A0A91 (5.0V, 3A) at 25ºC. The figures are identical for either positive or negative Remote On/Off logic.
GE
Data Sheet
SW/SC001/003 Series DC-DC Power Module
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
October 14, 2013
Page 12
EFFICIENCY (%)
70
72
74
76
78
80
82
84
86
88
0 0.5 1 1.5 2 2.5 3 3.5
VI = 18V VI = 27V VI = 36V
On/Off VOLTAGE, OUTPUT VOLTAGE
V
ON/OFF
(V) (2V/div) V
O
(V) (5V/div)
OUTPUT CURRENT, Io (A)
TIME, t (5ms/div)
Figure 37. Converter Efficiency Vs Load.
Figure 40. Typical Start-Up Using Remote On/Off, negative logic version shown.
OUTPUT CURRENT, Io (A)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0 10 20 30 40 50 60 70 80 90 100 110
3.0 m/s (600 ft./min.)
2.0 m/s (400 ft./min.)
1.0 m/s (200 ft./min.)
Natural Convection
OUTPUT VOLTAGE, OUTPUT CURRENT
V
O
(V) (50mV/div), I
O
(A) (0.2A/div)
AMBIENT TEMPERATURE, TA OC
TIME, t (1.0ms/div)
Figure 38. Derating Output Current versus Local Ambient Temperature and Airflow.
Figure 41. Transient Response to Dynamic Load Change from 50% to 75% to 50% of full load.
OUTPUT VOLTAGE,
V
O
(V) (20mV/div)
OUTPUT VOLTAGE
V
O
(V) (1V/div)
TIME, t (2s/div)
TIME, t (50s/div)
Figure 39. Typical Output Ripple and Noise, VIN=V
IN, nom
IO=80% of I
O, max.
Figure 42. Typical Start-Up Output Voltage Rise Characteristic.
Characteristic Curves (continued)
The following figures provide typical characteristics for the SC003A5F91 (3.3V, 3.5A) at 25ºC. The figures are identical for either positive or negative Remote On/Off logic.
GE
Data Sheet
SW/SC001/003 Series DC-DC Power Module
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
October 14, 2013
Page 13
TO OSCILLOSCOPE
CURRENT PROBE
L
TEST
12μH
BATTERY
CS 220μF
E.S.R.<0.1
@ 20°C 100kHz
33μF
Vin+
Vin-
NOTE: Measure input reflected ripple current with a simulated
source inductance (L
TEST
) of 12μH. Capacitor CS offsets possible battery impedance. Measure current as shown above.
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance.
V
O
(+)
V
O
( – )
1uF .
RESISTIVE
LOAD
SCOPE
COPPER STRIP
GROUND PLANE
10uF
Vout+
Vout-
Vin+
Vin-
R
LOAD Rcontact Rdistribution
R
contact Rdistribution Rcontact
R
contact Rdistribution
R
distribution
V
IN VO
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance.
=
VO.
I
O
VIN.
I
IN
x 100 % Efficiency
Test Configurations
Design Considerations
Input Source Impedance
The power module should be connected to a low ac-impedance source. Highly inductive source impedance can affect the stability of the power module. For the test configuration in Figure 43, a 33μF electrolytic capacitor (ESR<0.7 at 100kHz), mounted close to the power module helps ensure the stability of the unit. Consult the factory for further application guidelines.
Safety Considerations
For safety-agency approval of the system in which the power
Figure 43. Input Reflected Ripple Current Test Setup.
Figure 44. Output Ripple and Noise Test Setup.
Figure 45. Output Voltage and Efficiency Test Setup.
module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e., UL 60950-1-3, CSA C22.2 No. 60950-00, and VDE 0805 (IEC60950, 3rd Edition).
If the input source is non-SELV (ELV or a hazardous voltage greater than 60 Vdc and less than or equal to 75Vdc), for the
module’s output to be considered as meeting the requirements
for safety extra-low voltage (SELV), all of the following must be true:
The input source is to be provided with reinforced
insulation from any other hazardous voltages, including the ac mains.
One V
pin and one V
IN
pin are to be grounded, or both
OUT
the input and output pins are to be kept floating.
The input pins of the module are not operator accessible. Another SELV reliability test is conducted on the whole
system (combination of supply source and subject module), as required by the safety agencies, to verify that under a single fault, hazardous voltages do not appear at the module’s output.
Note: Do not ground either of the input pins of the module
without grounding one of the output pins. This may allow a non-SELV voltage to appear between the output pins and ground.
The power module has extra-low voltage (ELV) outputs when all inputs are ELV.
For input voltages exceeding –60 Vdc but less than or equal to –75 Vdc, these converters have been evaluated to the applicable requirements of BASIC INSULATION between secondary DC MAINS DISTRIBUTION input (classified as TNV-2 in Europe) and unearthed SELV outputs.
The input to these units is to be provided with a maximum 3A time-delay fuse in the ungrounded lead.
GE
Data Sheet
SW/SC001/003 Series DC-DC Power Module
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
October 14, 2013
Page 14
ON/OFF
Vin+
Vin-
I
on/off
V
on/off
Vout+
TRIM
Vout-
 
 
H
VV
GLV
R
adjonomo
adjo
downadj
)(
)(
,,
,
Vout+
TRIM
Vout-
R
adj-down
R
LOAD
Vin+
ON/OFF
Vin-
Feature Description
Remote On/Off
Two remote on/off options are available. Positive logic turns the module on during a logic high voltage on the ON/OFF pin, and off during a logic low. Negative logic remote On/Off, device
code suffix “1”, turns the module off during a logic high and on
during a logic low. To maintain compatibility with LW series power modules the
Remote On/Off pin is optional for the TH (through hole) version. Standard TH modules have no On/Off pin fitted. TH modules
ordered with device code suffix “1” are negative logic with the
On/Off pin fitted. The On/Off pin shall always be fitted on SMT versions.
operate once the input voltage is raised above the undervoltage lockout turn-on threshold, V
UV/ON
.
Once operating, the module will continue to operate until the input voltage is taken below the undervoltage turn-off threshold, V
UV/OFF
.
Over Voltage Protection
The output overvoltage protection consists of circuitry that internally clamps the output voltage. If a more accurate output overvoltage protection scheme is required then this should be implemented externally via use of the remote on/off pin.
Output Voltage Programming
Trimming allows the user to increase or decrease the output voltage set point of the module. This is accomplished by connecting an external resistor between the TRIM pin and either the Vout+ pin or the Vout- pin.
Note: Trim pin is optional on TH module version and always present on SMT versions.
Trim Down – Decrease Output Voltage
By connecting an external resistor between the TRIM pin and Vout+ pin (Radj-down), the output voltage set point decreases (see figure 17). The following equation determines the external resistor value to obtain an output voltage change from Vo, nom to the desired Vo, adj:
Figure 46. Circuit configuration for using Remote On/Off Implementation.
To turn the power module on and off, the user must supply a switch (open collector or equivalent) to control the voltage (V
) between the ON/OFF terminal and the VIN(-) terminal.
on/off
Logic low is 0V ≤ V
≤ 1.2V. The maximum I
on/off
on/off
during a logic low is 1mA, the switch should be maintain a logic low level whilst sinking this current.
During a logic high, the typical V is 5.8V, and the maximum allowable leakage current at V
generated by the module
on/off
on/off
5.8V is 50μA. If not using the remote on/off feature: For positive logic, leave the ON/OFF pin open. For negative logic, short the ON/OFF pin to VIN(-).
Overcurrent Protection
To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting continuously. At the point of current-limit inception, the unit enters hiccup mode. The unit operates normally once the output current is brought back into its specified range. The average output current during hiccup is 10% I
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout limit, the module operation is disabled. The module will only begin to
O, max
.
Note: Values for G, H, L and K are defined for each module version in the following table 1.
=
Figure 17. Circuit Configuration to Decrease Output Voltage.
Trim Up – Increase Output Voltage
By connecting an external resistor between the TRIM pin and Vout- pin (Radj-up), the output voltage set point increases (see figure 48). The following equation determines the external resistor value to obtain an output voltage change from Vo, nom to the desired Vo, adj:
GE
Data Sheet
SW/SC001/003 Series DC-DC Power Module
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
October 14, 2013
Page 15
 
 
H
KLV
LG
R
adjo
upadj
)( ,
Vout+
TRIM
Vout-
R
adj-up
R
LOAD
Vin+
ON/OFF
Vin-
Module
G H K
L
Sx001A0C
10,000
5110
12.5
2.5
Sx001A2B
10,000
5110
9.5
2.5
Sx003A0A
5110
2050
2.5
2.5
Sx003A5F
5110
2050
0.8
2.5
 
 
2050
)9.40.5(
5110)5.29.4(
downadjR
590,120downadjR
Tref
Feature Descriptions (continued)
Note: Values for G, H, L and K are defined for each module version in the following table 1.
Figure 48. Circuit Configuration to Increase Output Voltage.
Table 1. Trim Constants SW series
The combination of the output voltage adjustment and the output voltage initial tolerance must not exceed the allowable trim range of 90% to 110% of the nominal output voltage as measured between the Vout+ and Vout- pins.
The SW/SC power modules have a fixed current-limit set point. Therefore, as the output voltage is adjusted down, the available output power is reduced.
Trim Examples
For SW003A0A, nominal 5.0V module. To trim module down to
4.90V:
Considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A reduction in the operating temperature of the module will result in an increase in reliability. The thermal data presented here is based on physical measurements taken in a wind tunnel.
The thermal reference point, T shown in Figure 49. For reliable operation this temperature should not exceed 120oC.
Figure 49. T
Temperature Measurement Location.
ref
used in the specifications is
ref
Heat Transfer via Convection
Increased airflow over the module enhances the heat transfer via convection. Derating figures showing the maximum output current that can be delivered by each module versus local ambient temperature (TA) for natural convection and up to 3m/s (600 ft./min) are shown in the respective Characteristics Curves section.
Please refer to the Application Note “Thermal Characterization Process For Open-Frame Board-Mounted Power Modules” for a detailed discussion of thermal aspects including maximum device temperatures.
EMC Considerations
Figure 50 shows a suggested configuration to meet the conducted emission limits of EN55022 Class B.
Notes: C1, C2, C3 and C6 are low impedance SMT ceramics. C4 is a low impedance polymer film type (Paktron CS4). Common Mode inductor is Pulse Engineering type P0354 1.17mH.
Thermal Considerations
The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation.
GE
Data Sheet
SW/SC001/003 Series DC-DC Power Module
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
October 14, 2013
Page 16
VI(+)
SW003A0A
VI(-)
Vo +
Vo -
Pulse P0354
CMC 1.17mH
L1 10uH
C6 2 x 56nF
C5 N/F
C4
4.7uF
Polymer
C1
0.68uF
C2
0.68uF
5V @ 3A
C3
0.68uF
100K 500K 1M 5M 10M 30M
Frequency(Hz)
10
20
30
40
50
60
70
80
90
Level (dBµV)
EN 55022 Class B Conducted Average dBuV
12.70
10.7
Ø6.5 NOZZLE.
Figure 50. Suggested Configuration for EN55022 Class B.
that the temperature of the power module board is kept below 210C. For Pb solder, the recommended pot temperature is 260C, while the Pb-free solder pot is 270C max. Not all RoHS- compliant through-hole products can be processed with paste­through-hole Pb or Pb-free reflow process. If additional information is needed, please consult with your GEPower representative for more details.
Surface Mount Information
Pick and Place
The SW/SC-SR series of DC-to-DC power converters use an open-frame construction and are designed for surface mount assembly within a fully automated manufacturing process.
The SW/SC-SR series modules are designed to use the main magnetic component surface to allow for pick and place.
Figure 51. EMC signature using above filter, SW003A0A.
For further information on designing for EMC compliance, please refer to the FLTR100V10 data sheet (FDS01-043EPS).
Layout Considerations
The SW/SC power module series are low profile in order to be used in fine pitch system card architectures. As such, component clearance between the bottom of the power
Note: All dimensions in mm.
Figure 52. Pick and Place Location.
Z Plane Height
The ‘Z’ plane height of the pick and place location is 7.50mm
nominal with an RSS tolerance of +/-0.25 mm.
module and the mounting board is limited. Avoid placing copper areas on the outer layer directly underneath the power module. Also avoid placing via interconnects underneath the power module.
For additional layout guide-lines, refer to the FLTR100V10 data sheet.
Nozzle Recommendations
The module weight has been kept to a minimum by using open frame construction. Even so, they have a relatively large mass when compared with conventional SMT components. Variables such as nozzle size, tip style, vacuum pressure and placement speed should be considered to optimize this
The SW/SC family of power modules is available for either Through-Hole (TH) or Surface Mount (SMT) soldering.
process.
The minimum recommended nozzle diameter for reliable operation is 5mm. The maximum nozzle outer diameter, which
Through-Hole Soldering Information
will safely fit within the allowable component spacing, is
6.5mm.
The RoHS-compliant (Z codes) through-hole products use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components. They are designed to be processed through single or dual wave soldering machines. The pins have an RoHS-compliant finish that is compatible with both Pb and Pb­free wave soldering processes. A maximum preheat rate of 3C/s is suggested. The wave preheat process should be such
Oblong or oval nozzles up to 11 x 6 mm may also be used within the space available.
For further information please contact your local GE Sales Representative.
GE
Data Sheet
SW/SC001/003 Series DC-DC Power Module
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
October 14, 2013
Page 17
Power Module Board
Insulator
Solder Ball
End assembly PCB
MAX TEMP SOLDER (C)
TIME LIMIT (S)
Figure 54. Recommended Reflow Profile for Sn/Pb solder.
REFLOW TEMP (C)
REFLOW TIME (S)
Reflow Soldering Information
These power modules are large mass, low thermal resistance devices and typically heat up slower than other SMT components. It is recommended that the customer review data sheets in order to customize the solder reflow profile for each application board assembly.
The following instructions must be observed when SMT soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability.
Surface Mount Information (continued)
The surface mountable modules in the SW/SC family use our
SMT technology called “Column Pin” (CP) connectors. Figure
53 shows the CP connector before and after reflow soldering onto the end-board assembly.
Figure 53. Column Pin Connector Before and After Reflow Soldering.
The CP is constructed from a solid copper pin with an integral solder ball attached, which is composed of tin/lead (Sn63/Pb37) solder for non-Z codes, or Sn/Ag codes. The CP connector design is able to compensate for large amounts of co-planarity and still ensure a reliable SMT solder joint. Typically, the eutectic solder melts at 183oC (Sn/Pb solder) or 217-218 oC (SAC solder), wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint.
/Cu
(SAC) solder for –Z
3.8
0.7
There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. The recommended linear reflow profile using Sn/Pb solder is shown in Figure 54 and 55. For reliable soldering the solder reflow profile should be established by accurately measuring the modules CP connector temperatures.
Lead Free Soldering
The –Z version SMT modules of the SW/SC series are lead-free (Pb-free) and RoHS compliant and are compatible in a Pb-free soldering process. Failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect long-term reliability
Figure 55. Time Limit, T
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. D (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This standard provides a recommended forced-air-convection reflow profile based on the volume and thickness of the package (table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Figure. 56.
, Curve Above 205oC Reflow .
lim
GE
Data Sheet
SW/SC001/003 Series DC-DC Power Module
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
October 14, 2013
Page 18
Figure 56. Recommended linear reflow profile using Sn/Ag/Cu solder.
MSL Rating
The SW/SC series SMT modules have a MSL rating of 2A.
Storage and Handling
The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 2 or greater. These sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of 30°C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages will be a minimum of 12 months from the bag seal date, when stored at the following conditions: < 40° C, < 90% relative humidity.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to Lineage Power Board Mounted Power Modules: Soldering and Cleaning Application Note (AN04-001).
GE
Data Sheet
SW/SC001/003 Series DC-DC Power Module
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
October 14, 2013
Page 19
Top View
(1.1)
24.4
(0.96)
27.9
Side View
height
min stand-off
(0.100)
2.54
0.5
(.020)
max
compliance
MAX
(0.335)
8.50
Bottom View
1
2
3
4
5
6
10.16
(0.400)
20.32
(0.800)
(0.800)
(0.15)
7.62
(0.300)
12.70
(0.500)
(0.08)
20.32
3.8
2.0
Pin
Function
1
Vin +
2
Vin -
3
ON/OFF
4
Vout +
5
TRIM
6
Vout -
Mechanical Outline for SW/SC Surface-Mount Module
Dimensions are in millimeters and (inches). Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) [Unless otherwise indicated] x.xx mm 0.25 mm (x.xxx in 0.010 in.)
GE
Data Sheet
SW/SC001/003 Series DC-DC Power Module
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
October 14, 2013
Page 20
Top View
(1.1)
24.4
(0.96)
27.9
Side View
*For optional pin lengths, see Table 3, Device Options
Bottom View
(0.400)
(0.08)
2.0
3.8
20.32
(0.800)
(0.15)
(0.300)
7.62
12.70
(0.500)
4
5
6
1
2
3
20.32
(0.800)
10.16
Pin
Function
1
Vin +
2
Vin -
3
ON/OFF
(Optional)
4
Vout +
5
TRIM
(Optional)
6
Vout -
Mechanical Outline for SW/SC Through Hole Module
Dimensions are in millimeters and (inches). Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) [Unless otherwise indicated] x.xx mm 0.25 mm (x.xxx in 0.010 in.)
GE
Data Sheet
SW/SC001/003 Series DC-DC Power Module
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
October 14, 2013
Page 21
Top View
Side View
Bottom View
Pin
Function
1
Vin +
2
Vin -
3
ON/OFF
(Optional)
4
Vout +
5
TRIM
(Optional)
6
Vout -
Mechanical Outline for SW/SC -35 Option Through Hole Module
Dimensions are in millimeters and (inches). Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) [Unless otherwise indicated] x.xx mm 0.25 mm (x.xxx in 0.010 in.)
GE
Data Sheet
SW/SC001/003 Series DC-DC Power Module
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
October 14, 2013
Page 22
1
2
3
4
5
6
10.16
(0.400)
20.32
(0.800)
(0.800)
(0.15)
7.62
(0.300)
12.70
(0.500)
(0.08)
20.32
3.8
2.0
IN 6 POSITIONS
MINIMUM PAD Ø 1.9mm
RECOMMENDED PAD Ø 2.8mm
Pin
Function
1
Vin +
2
Vin -
3
ON/OFF
4
Vout +
5
TRIM
6
Vout -
Surface Mount Pad Layout – Component side view
Pin
Function
1
Vin +
2
Vin -
3
ON/OFF
(Optional)
4
Vout +
5
TRIM
(Optional)
6
Vout -
Through-Hole Pad Layout – Component side view
Recommended Pad Layout for Surface Mount and Through Hole Module
Dimensions are in millimeters and (inches). Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) [Unless otherwise indicated] x.xx mm 0.25 mm (x.xxx in 0.010 in.)
GE
Data Sheet
SW/SC001/003 Series DC-DC Power Module
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
October 14, 2013
Page 23
Tape Dimensions
Dimensions are in millimeters and (inches).
NOTE: CONFORMS TO EAI-481 REV. A STANDARD
EMBOSSED CARRIER
TOP COVER TAPE
4.00
(0.157)
(0.750)
PICK POINT
(1.260)
FEED
DIRECTION
19.05
32.00
(1.450)
(1.590)
(1.732)
36.80
40.40
44.00
9.14
(0.360)
Reel Dimensions
Outside Diameter: 330.2 mm (13.00”) Inside Diameter: 177.8 mm (7.00”)
Tape Width: 44.00 (1.732)
Packaging Details
The SW001/003 series SMT versions are supplied in tape & reel as standard. Details of tape dimensions are shown below. Modules are shipped in quantities of 150 modules per reel.
GE
Data Sheet
SW/SC001/003 Series DC-DC Power Module
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
October 14, 2013
Page 24
Product codes
Input
Voltage
Output
Voltage
Output
Current
Remote On/Off
Logic
Connector
Type
Comcodes
SW001A0C91Z
48 Vdc
15.0V
1.0A
Negative
Through-Hole
CC109107331
SW001A2B
48 Vdc
12.0V
1.2A
Not present
Through-Hole
108989637
SW001A2B9
48 Vdc
12.0V
1.2A
Not present
Through-Hole
108984576
SW001A2B91
48 Vdc
12.0V
1.2A
Negative
Through-Hole
108981788
SW001A2B91-33Z
48 Vdc
12.0V
1.2A
Negative
Through-Hole
CC109104568
SW001A2B9Z
48 Vdc
12.0V
1.2A
Not present
Through-Hole
CC109107348
SW001A2B91Z
48 Vdc
12.0V
1.2A
Negative
Through-Hole
CC109107356
SW001A2B94
48 Vdc
12.0V
1.2A
Positive
Through-Hole
108987314
SW001A2B961-33BZ
48 Vdc
12.0V
1.2A
Negative
Through-Hole
CC109120623
SW001A2B91-SR
48 Vdc
12.0V
1.2A
Negative
SMT (tape & reel)
108988787
SW001A2B91-SRZ
48 Vdc
12.0V
1.2A
Negative
SMT (tape & reel)
108995718
SW003A0A
48 Vdc
5.0V
3.0A
Not present
Through-Hole
108985276
SW003A0A1
48 Vdc
5.0V
3.0A
Negative
Through-Hole
108985284
SW003A0A9
48 Vdc
5.0V
3.0A
Not present
Through-Hole
108984790
SW003A0A91
48 Vdc
5.0V
3.0A
Negative
Through-Hole
108981549
SW003A0A91Z
48 Vdc
5.0V
3.0A
Negative
Through-Hole
CC109107380
SW003A0A94
48 Vdc
5.0V
3.0A
Positive
Through-Hole
108986928
SW003A0A94Z
48 Vdc
5.0V
3.0A
Positive
Through-Hole
CC109107397
SW003A0A961
48 Vdc
5.0V
3.0A
Negative
Through-Hole
108989901
SW003A0A9Z
48 Vdc
5.0V
3.0A
Not present
Through-Hole
CC109107372
SW003A0AZ
48 Vdc
5.0V
3.0A
Not present
Through-Hole
CC109107364
SW003A0A91-SR
48 Vdc
5.0V
3.0A
Negative
SMT (tape & reel)
108984550
SW003A0A91-SRZ
48 Vdc
5.0V
3.0A
Negative
SMT (tape & reel)
109100468
SW003A0A94-SRZ
48 Vdc
5.0V
3.0A
Positive
SMT (tape & reel)
109100476
SW003A5F
48 Vdc
3.3V
3.5A
Not present
Through-Hole
108988275
SW003A5F91
48 Vdc
3.3V
3.5A
Negative
Through-Hole
108981556
SW003A5F91Z
48 Vdc
3.3V
3.5A
Negative
Through-Hole
CC109107406
SW003A5F94
48 Vdc
3.3V
3.5A
Positive
Through-Hole
108986902
SW003A5F94Z
48 Vdc
3.3V
3.5A
Positive
Through-Hole
CC109107414
SW003A5F961
48 Vdc
3.3V
3.5A
Negative
Through-Hole
108989620
SW003A5F961Z
48 Vdc
3.3V
3.5A
Negative
Through-Hole
CC109144457
SW003A5F961-35Z
48 Vdc
3.3V
3.5A
Negative
Through-Hole
150030970
SW003A5F91-SR
48 Vdc
3.3V
3.5A
Negative
SMT (tape & reel)
108982059
SW003A5F91-SRZ
48 Vdc
3.3V
3.5A
Negative
SMT (tape & reel)
109100492
SW003A5F94-SR
48 Vdc
3.3V
3.5A
Positive
SMT (tape & reel)
108986910
SW003A5F94-SRZ
48 Vdc
3.3V
3.5A
Positive
SMT (tape & reel)
CC109114526
SC001A2B91
24 Vdc
12.0V
1.2A
Negative
Through-Hole
108988267
SC001A2B91Z
24 Vdc
12.0V
1.2A
Negative
Through-Hole
CC109107298
SC001A2B91-SR
24 Vdc
12.0V
1.2A
Negative
SMT (tape & reel)
108996468
SC001A2B91-SRZ
24 Vdc
12.0V
1.2A
Negative
SMT (tape & reel)
CC109121976
SC003A0A
24 Vdc
5.0V
3.0A
Not present
Through-Hole
108988291
SC003A0A91
24 Vdc
5.0V
3.0A
Negative
Through-Hole
108988283
SC003A0A91Z
24 Vdc
5.0V
3.0A
Negative
Through-Hole
CC109107307
SC003A0A94
24 Vdc
5.0V
3.0A
Positive
Through-Hole
108989967
SC003A0A94Z
24 Vdc
5.0V
3.0A
Positive
Through-Hole
CC109107315
SC003A0A91-SR
24 Vdc
5.0V
3.0A
Negative
SMT (tape & reel)
108988325
SC003A5F
24 Vdc
3.3V
3.5A
Not present
Through-Hole
108988300
SC003A5F91
24 Vdc
3.3V
3.5A
Negative
Through-Hole
108982034
SC003A5F91Z
24 Vdc
3.3V
3.5A
Negative
Through-Hole
CC109107323
SC003A5F91-SR
24 Vdc
3.3V
3.5A
Negative
SMT (tape & reel)
108990644
SC003A5F91-SRZ
24 Vdc
3.3V
3.5A
Negative
SMT (tape & reel)
109100435
Ordering Information
Please contact your GE Sales Representative for pricing, availability and optional features.
Table 2. Device Codes
GE
Data Sheet
SW/SC001/003 Series DC-DC Power Module
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
Contact Us
For more information, call us at
USA/Canada:
+1 888 546 3243, or +1 972 244 9288
Asia-Pacific:
+86.021.54279977*808
Europe, Middle-East and Africa:
+49.89.878067-280
India: +91.80.28411633
www.ge.com/powerelectronics
October 14, 2013
Version 1.97
Option*
Device Code Suffix**
Negative remote on/off logic (On/Off pin fitted)†
1
Positive remote on/off logic (On/Off pin fitted) †
4
Mechanically Trimmed Short Pins, 3.68 mm ± 0.25mm (0.145 in. ± 0.010 in.)
6
Output Voltage Adjustment (Trim pin fitted) †
9
Uncut Short Pins, 3.68 mm ± 0.25mm (0.145 in. ± 0.020 in.)
-35
Surface mount connections, SMT (Tape & Reel)
-SR
RoHS Compliant
-Z
Table 3. Device Options
* Please contact GE Sales Representative for availability of these options, samples, minimum order quantity and lead times. Legacy device codes may contain a –B option suffix to indicate 100% factory Hi-Pot tested to the isolation voltage specified in the Absolute Maximum Ratings table. The 100% Hi-Pot test is now applied to all device codes, with or without the –B option suffix. Existing comcodes for devices with the –B suffix are still valid; however, no new comcodes for devices containing the –B suffix will be created.
** When adding multiple options to the product code, add numerical suffix codes in the descending order.
† Either negative or positive logic (1 or 4), and output voltage adjustment (trim, 9) must be ordered on surface mount , SMT (-SR)
device codes. Both the on/off pin and trim pin will be provided on all –SR device codes.
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