These instructions do not purport to cover all details or variations in equipment, nor to provide for every possible
contingency to be met during installation, operation, and maintenance. The information is supplied for informational
purposes only, and GE makes no warranty as to the accuracy of the information included herein. Changes, modifications,
and/or improvements to equipment and specifications are made periodically and these changes may or may not be reflected
herein. It is understood that GE may make changes, modifications, or improvements to the equipment referenced herein or to
the document itself at any time. This document is intended for trained personnel familiar with the GE products referenced
herein.
This document is approved for public disclosure.
GE may have patents or pending patent applications covering subject matter in this document. The furnishing of this
document does not provide any license whatsoever to any of these patents.
GE provides the following document and the information included therein as is and without warranty of any kind, expressed
or implied, including but not limited to any implied statutory warranty of merchantability or fitness for particular purpose.
For further assistance or technical information, contact the nearest GE Sales or Service Office, or an authorized GE Sales
Representative.
___________________________________
* Indicates a trademark of General Electric Company and/or its subsidiaries.
All other trademarks are the property of their respective owners.
Refer to the section, Contact Information for support on this product.
Please send documentation comments or suggestions to controls.doc@ge.com
For public disclosure
Acronyms and Abbreviations
ACPIAdvanced Configuration and Power Interface
APICAdvanced Programmable Interrupt Controller
ATAATAttachment
BIOSBasic Input/Output System
BITBuilt-In Test
COMComputer on Module
CPUCentral Processing Unit
DDR3 SDRAMThird-Generation Double Data Rate Synchronous Dynamic RAM
DMADirect Memory Access
DIMMDual In-line Memory Module
DPDisplayPort
DVIDigital Visual Interface
ECCError Correcting Code
eDPEmbedded DisplayPort
EEPROMElectrically-Erasable Programmable Read-Only Memory
EFIExtensible Firmware Interface
EHCIEnhanced Host Controller Interface
FPGAField-Programmable Gate Array
FRUField Replaceable Unit
GPIOGeneral-Purpose Input/Output
GPUGraphics Processing Unit
HDMIHigh-Definition Multimedia Interface
2
I
CInter-Integrated Circuit
IEEEInstitute of Electrical and Electronic Engineers
JTAGJoint Test Access Group
LANLocal Area Network
LPCLow Pin-Count
LSBLeast-Significant Byte
LVDSLow-Voltage Differential Signaling
MACMedia Access Control
MDIMedia-Dependent Interface
MSBMost-Significant Byte
MSIMessage-Signaled Interrupt
NMINon-Maskable Interrupt
OSOperating System
PCIPeripheral Component Interconnect
PCIePCI Express
PHYPhysical
PICProgrammable Interrupt Controller
PICMGPCI Industrial Computer Manufacturers Group
PXEPreboot Execution Environment
RoHSReduction of Hazardous Substances
RTCReal-Time Clock
SATASerial ATA
SCISystem Control Interrupt
Hardware Reference ManualGFK-28963
For public disclosure
SIMDSingle Instruction, Multiple Data
SKUStock-keeping unit
SMBusSystem Management Bus
SMISystem Management Interrupt
SPDSerial Presence Detect
SPISerial Peripheral Interconnect
SR-IOVSingle Root I/O Virtualization
TAPTest Access Port
TDPThermal Design Power
TPMTrusted Platform Module
UARTUniversal Asynchronous Receiver/Transmitter
UDIMMUnbuffered DIMM
UEFIUnified EFI
UHCIUniversal Host Controller Interface
USBUniversal Serial Bus
VMDqVirtual Machine Device Queues
WDTWatchDog Timer
4GFK-2896Mini COM Express Type 10 Module mCOM10-L1500
For public disclosure
Safety Symbol Legend
Indicates a procedure, condition, or statement that, if not
strictly observed, could result in personal injury or death.
Warning
Indicates a procedure, condition, or statement that, if not
strictly observed, could result in damage to or destruction of
equipment.
Caution
Indicates a procedure, condition, or statement that should be
strictly followed to improve these applications.
Attention
For public disclosure
Support, Service, and Warranty
For support on the web and
product information, visit
our website at http://www.
ge-ip.com/.
This section provides information about our product warranty terms and details about what
action to take if you experience a problem with the product.
Warranty
The manufacturer grants the original purchaser of GE Intelligent Platforms products a warranty
of 24 months from the date of delivery. For details regarding this warranty, refer to the Terms
and Conditions of the initial sale.
Support
The GE Intelligent Platforms’ product support program features two regional support
headquarters and regional customer centers for support, service, RMA returns, and other
functions.
World-wide headquarters of GE Intelligent Platforms, Inc.
GE Intelligent Platforms Inc.
2500 Austin Drive
Charlottesville, VA 22911 U.S.A.
Regional Areas
WWworld-wide
EUEurope, Russia, Near East, India, Africa
USAmericas and Pacific Rim (Japan, Korea, China, Philippines, AUS, NZ)
Technical Support
Free technical support is available by phone or email. Telephone support is available at main
locations or at the regional center where the product was purchased.
4.5 Test and Debug ...................... ....................... ....................... ....................... .......................................... 30
4.6 Fan Monitor..................... ..................... .............................................. .............................................. .... 30
2
C Bus .................................. .............................................. ..................... .................................... 28
For public disclosure
GFK-2896 Hardware Reference Manual 7
4.7 LED Status Indicators........................ .. ..................... .............................................. ................................ 30
10GFK-2896Mini COM Express Type 10 Module mCOM10-L1500
For public disclosure
1Introduction
The mCOM10-L1500 is a miniature Computer-on-Module (mCOM) Type 10
single-board computer approximately the size of a credit card, based on an AMD
G-Series System-on-chip (SoC). It contains one channel of DDR3L 72-bit ECC memory
and all components necessary for the bootable host computer packaged as a super
component. The mCOM10-L1500 module is combined with a carrier board required to
provide power, and support I/O and startup. The mCOM10-L1500 provides a Gigabit
Ethernet interface, four lanes of PCI Express (PCIe), two Serial ATA (SATA) ports, eight
USB 2.0 host interfaces (two of which support USB 3.0), low-voltage differential
signaling (LVDS) flat-panel or embedded DisplayPort plus a Digital Display Interface
(DDI), LPC, SPI, SMBus, I
audio ports to the module connector.
2
C, secure digital or general-purpose I/O, and high-definition
Refer to PICMG COM.0 R2.1
COM Express Module Base
Specification, located at
www.picmg.org.
This document describes the mCOM10-L1500 based on the PICMG COM Express
Module Base Specification. The module can operate in convection or conduction-cooled
environments, and uses a wide input-range main power rail (4.75 to 20 V), 5 V Standby,
and 3 V Real-Time Clock (RTC) battery power.
mCOM10-L1500
IntroductionGFK-2896 Hardware Reference Manual 11
For public disclosure
1.1Features
The mCOM10-L1500 provides the following core hardware and firmware features:
•AMD G-Series SoC, including:
−Two or four CPU cores
−GPU core
−Northbridge
−DDR3 memory controller
−Integrated display output
−I/O controller
−Dual-core 9W TDP and quad-core 15W TDP SKUs available
•Single-channel 72-bit DDR3L SDRAM with ECC support: 2 GB, 4 GB, and 8 GB
options
•Gigabit Ethernet interface
•Four PCIe lanes, configurable as either 4×1 or 1×4
•Eight MB SPI Flash for UEFI/BIOS firmware
•Two SATA ports
•Eight USB 2.0 host interfaces, two of which also support USB 3.0 SuperSpeed
•Two simultaneous display outputs: LVDS/eDP (configurable), and DDI
•LPC Bus
•One internal plus one external SPI bus
•SMBus
2
•I
C bus
•SDIO or GPIO (configurable)
•High-definition Audio
•Two 16550-compatible serial ports
•Express Card support
•Power and system management
•Thermal protection
•4.75 – 20 V primary power, 5 V Standby, and 3 V RTC power supply input
12GFK-2896Mini COM Express Type 10 Module mCOM10-L1500
For public disclosure
G-Series SoC
CPUCore
L1Cache
CPUCore
L1Cache
CPUCore
L1Cache
CPU Core
L1 Cache
L2 Cache
North Bridge
GPU
South Bridge
LVDS/eDP
DDI0
VGA
I210
PCIe
PCIe[0:3]
GbE0
DDR3L
2/4/8GB
ECC
2x SATA
8x USB
2x USB_SS
HDA
GPIO/SD
Flash
SMBus
LPC
FPGA
UART
I2C
WDog
UART
Supv
Ser0
Ser1
I2C
WDT
SPD
Debug
SPI
EeeP
SMBus
User
mCOM10-L1500 Functional Block Diagram
IntroductionGFK-2896 Hardware Reference Manual 13
For public disclosure
Notes
14GFK-2896Mini COM Express Type 10 Module mCOM10-L1500
For public disclosure
2Unpacking and Inspection
This chapter describes unpacking, initial inspection, and required preparation
considerations prior to using the mCOM10-L1500. Follow the procedures provided in this
chapter to verify proper operation after shipping and prior to system integration.
2.1Electrostatic Discharge
Electrostatic Discharge (ESD), the discharge of static electricity, is a major cause of
electronic component failure. The module has been packed in a static-safe bag to protect
the board from ESD. Before removing the module or any other electronic product from its
static-safe bag, be prepared to handle it in a static-safe environment.
Static-sensitive devices; handle only at static safe work
stations.
Warning
This is an FCC Class A product for use in an industrial
environment. In a home or residential environment, this
product may cause radio interference in which case the
Caution
user may be required to take adequate measures.
Drain static electricity before you install or remove any
parts. Installing or removing modules without observing
this precaution could result in damage to this and/or
other modules in your system.
Caution
Wear a properly-functioning anti-static strap and make sure you are fully grounded. Any
surface upon which you place the unprotected module should be static-safe, which is
usually facilitated by the use of anti-static mats. From the time the board is removed from
the anti-static bag until it is in the card carrier and functioning properly, extreme care
should be taken to avoid zapping the board with ESD. Be aware that you could zap the
board without knowing it; a small discharge, imperceptible to the eye and touch, can often
be enough to damage electronic components. Extra caution should be taken in cold and
dry weather when electrostatics easily builds up.
Only after ensuring that both you and the surrounding area are protected from ESD,
carefully remove the board or module from the shipping carton by grasping the module
on its edges. Place the board, in its anti-static bag, flat down on a suitable surface. You
may then remove the board from the anti-static bag by tearing the ESD warning labels.
Unpacking and InspectionGFK-2896 Hardware Reference Manual 15
For public disclosure
2.2Package Contents
Verify that the delivered package contains one mCOM10-L1500 module.
2.3Unpacking and Inspecting
Warning
Warning
Before installing or removing any board, ensure that
the system power and external supplies have been
turned off.
After unpacking the module, inspect it for visible
damage that could have occurred during shipping or
unpacking. If damage is observed (usually in the form
of bent component leads or loose socketed components),
contact GE Intelligent Platforms for additional
instructions. Depending on the severity of the damage,
it may be necessary to return the product to the factory
for repair.
DO NOT apply power to the board if it has visible
damage. Doing so may cause further, possibly
irreparable damage, as well as introduce a fire or shock
hazard.
Retain all packing material in case of future need.
Attention
Before unpacking the board or module, or fitting the device into your system, read the
manual carefully. Also adhere to the following guidelines:
•Observe all precautions for electrostatic sensitive modules
•If the product contains batteries, do not place the board on conductive surfaces,
anti-static plastic, or sponge, which can cause shocks and lead to battery or board
trace damage. Do not exceed the specified operational temperatures. Batteries and
storage devices might also have temperature restrictions.
•Keep all original packaging material for future storage or warranty shipments of the
board.
Although the module is carefully packaged to protect it against the rigors of shipping, it is
still possible that shipping damages may occur. Careful inspection of the shipping carton
should reveal some information about how the package was handled by the shipping
service. If evidence of damage or rough handling is found, notify the shipping service and
GE Intelligent Platforms as soon as possible.
16GFK-2896Mini COM Express Type 10 Module mCOM10-L1500
For public disclosure
2.4Handling
Proper handling of the board or module is critical to ensure proper operation and
long-term reliability. When unpacking and handling the board, be sure to hold the board
as displayed in the following figure.
Board Handling
Unpacking and InspectionGFK-2896 Hardware Reference Manual 17
For public disclosure
Notes
18GFK-2896Mini COM Express Type 10 Module mCOM10-L1500
For public disclosure
3Installation and Startup
This chapter describes the installation of the mCOM10-L1500 module on a carrier board
and initial startup operations.
3.1Required Materials
The following items are required to start the board in a standard configuration:
•Carrier board and power supply
•Keyboard and mouse
•Video monitor
3.1.1Carrier Board and Power Supply
A carrier routes the I/O signals
of the mCOM10-L1500 to the
connectors.
Refer to chapter,
Specifications.
The keyboard is attached to the
carrier board.
You will need a carrier board wired with either an integrated or external regulated power
supply capable of providing stable low noise primary and standby sources. Verify that the
supply meets the voltage and total power requirements of the mCOM10-L1500.
Verify that the power supply is turned OFF while
plugging or unplugging the board onto or from a
carrier card, respectively.
Warning
3.1.2Keyboard and Mouse
A compatible keyboard for initial system operation on the carrier board is required.
Depending on your application, this may be a standard keyboard, or one that uses
membrane switches for harsh environments.
3.1.3Video Monitor
Any video monitor with an appropriate connection to a Digital Display Interface (DDI)
can be used initially for display output. Compatible interfaces are DisplayPort, DVI, and
HDMI. Access to the video signal is provided through the carrier board.
Installation and StartupGFK-2896 Hardware Reference Manual 19
For public disclosure
3.2General Installation Guidelines
Adhere to the following guidelines during installation:
•Observe all safety procedures to avoid damaging the system and protect operators
and users.
•Before installing or removing any board, verify that the system power and external
supplies have been turned off.
•Verify that the jumpers on the carrier board are correctly configured for your
application.
•Mount the board on the carrier board very carefully. Refer to the procedure, To install
the mCOM10-L1500 onto the carrier board.
•Do not restore power until all modules are fitted correctly and all connections have
been made properly.
20GFK-2896Mini COM Express Type 10 Module mCOM10-L1500
For public disclosure
3.3Installation Procedures
3.3.1Install the mCOM10-L1500 onto the Carrier
Board
A carrier board with a matching connector is required. Refer to the carrier board manual.
�� To install the mCOM10-L1500 onto the carrier board
1.Carefully slide the mCOM10-L1500 board onto the connector on the carrier board.
2.Fasten the mCOM10-L1500 to the board using four M2.5 screws. Tighten the screws
with a torque of 0.6 N-m (5 in-lb).
Installing the mCOM10-L1500 onto the Carrier Card
Installation and StartupGFK-2896 Hardware Reference Manual 21
For public disclosure
3.3.2Install the Combined Unit
�� To install the mCOM10-L1500 plus carrier board into a system
1.Before installing or removing any board, verify that the system power and external
2.Verify that the jumpers, if any, are correctly configured for your application.
3.Mount the unit very carefully.
4.Connect all I/O cables.
5.When all units are correctly fitted into the system and all connections have been
3.4Initial Startup
A few seconds after powerup, the mCOM10-L1500 system UEFI Firmware banner
displays on the screen. If you do not see any error messages up to this point, the board is
running properly and ready to be installed and configured for your application.
3.4.1UEFI Firmware Setup
Contact GE Intelligent
Platforms for technical
support. Refer to the section,
Support, Service, and
Warranty.
�� To enter setup during the initial startup sequence: press the Delete or F2
supplies have been turned off.
made properly, restore power.
during the boot up sequence. Adhere to the applicable on-screen messages when
prompted.
22GFK-2896Mini COM Express Type 10 Module mCOM10-L1500
For public disclosure
4System Architecture
This chapter describes the features, capabilities, and compatibilities of the mini COM
Express Type 10 module.
4.1G-Series SoC Processor
The main component of the mCOM10-L1500 is the AMD G-Series SoC, which integrates
the following functions:
•Two or four processor cores
•Level1 and Level2 cache memory
•DDR3 memory controller
•Graphics processing unit (GPU)
•Support for two simultaneous displays on eDP or 18 bpp single-channel LVDS, or
DisplayPort 1.2, DVI, HDMI
•One ×4 PCI Express Gen2 link
•Four ×1 PCI Express Gen2 links
•Eight USB 2.0 host interfaces, two of which also support USB 3.0 SuperSpeed
•Two SATA 2.x/3.x controllers
•SD card reader 3.0 or SDIO controller
•LPC Bus interface
•High-definition audio
•General-purpose I/O
•SPI bus controller
•Two SMBus controllers
•Clock generator
The G-Series SoC uses the new generation Jaguar embedded processor from AMD that
offers the following features:
•32-KB instruction and 32-KB L1 data caches per core
•1-MB (dual-core) or 2-MB (quad-core) shared instruction/data L2 cache
Supported G-series SOC Models
Model NumberDescription
GX-209HADual-core, 9 W TDP, Industrial (-40 to 105°C, –40 to 221 °F T
GHz core clock
GX-411GAQuad-core, 15 W TDP, Industrial, 1.1 GHz core clock
J), 1.0
System ArchitectureGFK-2896 Hardware Reference Manual 23
For public disclosure
4.1.1Memory
The main memory array contains one channel of 72-bit wide DDR3L SDRAM, with
optional 2 GB, 4 GB, or 8 GB density. The system memory controller is integrated in the
G-Series SoC processor. A Serial Presence Detect (SPD) EEPROM, attached to the
internal SMBus, provides memory configuration information to the boot firmware.
Memory displays as a single-rank (2 or 4 GB) or dual-rank (8 GB) unbuffered DIMM.
The SPD chip also contains a temperature sensor physically located near the memory
array, allowing the refresh-time adjustments required for high-temperature operation.
Supported System Memory Options
DensityRanksBus Width
2 GB172 bit
4 GB172 bit
8 GB272 bit
4.1.2Digital Display Interface
The mCOM10-L1500 supports two simultaneous video outputs with multiple modes. The
G-Series SoC integrates the new generation Radeon Sea Islands GPU, which supports
DirectX 11.1. There is no independent memory dedicated to the GPU video frame buffer
so a portion of main memory must be reserved for this purpose. Two digital video outputs
are provided. Analog video is not used.
Video Outputs
Video Output
DP0LVDS or Embedded DisplayPortWired to COMe LVDS/eDP connector pins
DP1DVI, HDMI, or DisplayPortWired to COMe DDI0 connector pins
Description
Configuration
4.1.3PCI Express
The G-Series SoC hosts two PCI Express (PCIe) root complex ports. Four ×1
general-purpose PCIe lanes are wired to the COM Express connector, and support Gen1
(2.5 Gbps) and Gen2 (5 Gbps) speeds. One lane of a ×4 PCIe port is wired to an on-board
Ethernet controller, while the remaining three lanes are unused.
24GFK-2896Mini COM Express Type 10 Module mCOM10-L1500
For public disclosure
4.1.4BIOS/UEFI Firmware
Refer to PICMG COM.0 R2.1
COM Express Module Base
Specification located at
The mCOM10-L1500 has an on-board 8 MByte SPI Flash ROM device that holds the
BIOS/UEFI firmware load. Alternatively, the module may be configured to boot from the
Flash located on the carrier board, on either the external SPI bus or LPC bus. This is
controlled by the carrier board using the BIOS_DIS[0:1]# straps.
UEFI Load
Chipset SPI_
CS0#
Carrier SPI_
CS#
SPI_
Descriptor
BIOS Entry
4.1.5Serial ATA
Two Serial ATA (SATA) controllers, integrated into the G-Series SoC, host mass storage
units on the carrier through the COM Express connector. SATA 2.x (3 Gbps) and 3.x (6
Gbps) are supported. A combined SATA activity indicator is also provided.
4.1.6USB
The mCOM10-L1500 provides eight G-Series SoC USB controllers to host serial links
through the COM Express connector. All ports support USB 2.0, while ports 8 and 9 also
support USB 3.0 SuperSpeed. The following table provides port mapping between the
G-Series SoC and the COM Express connector.
USB Port Assignments
PortUSB Interface
0UnusedN/A
1UnusedN/A
2mCOMe USB 2
3mCOMe USB 3
4mCOMe USB 4
5mCOMe USB 5
6mCOMe USB 6
7mCOMe USB 7
8mCOMe USB 0
9mCOMe USB 1
Speed
FS, HS
FS, HS
FS, HS
FS, HS
FS, HS
FS, HS
FS, HS, SS
FS, HS, SS
4.1.7Secure Digital or General-purpose I/O
The G-Series SoC provides a Secure Digital (SD) 3.0 compliant host controller wired
directly to the COM Express connector. Alternatively, these pins may be used as simple
general-purpose input/output (four pins each).
4.1.8Audio
The G-Series SoC provides a basic PC speaker output, as well as a High Definition Audio
(HDA) controller wired to the COM Express connector.
System ArchitectureGFK-2896 Hardware Reference Manual 25
For public disclosure
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