Note: Nominal specs represent the design specs. All units should be able to approximate these – some will
exceed and some may drop slightly below these specs. Limit specs repres ent the absolute worst con dition that
still might be considered acceptable; In no case should a unit fail to meet limit specs.
1-1-1E9710SP
Page 4
< DVD Section >
ItemConditionsUnitNominalLimit
1. VIDEO
1-1. Video Output75 Ω load Vp-p1.0
1-2. S-Video Output
Y (Luminance)75 Ω load Vp-p1.0
C (Chrominance)75 Ω load Vp-p0.3
2. AUDIO
2-1. Output LevelVrms2.0
2-2. Frequency Response
DVD-VIDEO LPCMfs = 96 kHzHz20 - 44 k
3-1. Video Output75 Ω load Vp-p1.0
3-2. Video S/NdB42
3-3. Audio OutputdBv-12
3-4. Audio S/NdB46
Notes:
1. All Items are measured without pre-emphasis unless otherwise specified.
2. Power supply: 220 - 240 V ~ 50 Hz
3. Load imp.: 100 kΩ
4. Room ambient : 5 °C ~ 40 °C
1-1-2E9710SP
Page 5
LASER BEAM SAFETY PRECAUTIONS
This DVD player uses a pickup that emits a laser beam.
Do not look directly at the laser beam coming
from the pic kup or allo w it to strike a gainst your
skin.
The laser beam is emitted from the location shown in the figure. When checking the laser diode, be sure to keep
your eyes at least 30 cm away from the pickup lens when the diode is turned on. Do not look directly at the laser
beam.
CAUTION: Use of controls and adjustments, or doing procedures other than those specified herein, may result in
hazardous radiation exposure.
Drive Mechanism Assembly
Laser Beam Radiation
Laser Pickup
Turntable
Location: Top of DVD mechanism.
1-2-1R2P_LASER
Page 6
IMPORTANT SAFETY PRECAUTIONS
Product Safety Notice
Some electrical and mechanical parts have special
safety-related characteristic s which are often not evident from visual inspection, nor can the protection
they give necessarily be obtained by replacing them
with components rated for higher voltage, wattage,
etc. Parts that have special s afety characteristics are
identifi ed b y a ! on schematics and in parts lists. Use
of a substitute replacement that does not have the
same safety characteristics as the recommended
replacement part might create shock, fire, and/or other
hazards. The Product’s Safety is under review continuously and new instructions are issued whenever
appropriate. Prior to shipment from the factory, our
products are carefully inspected to confirm with the
recognized product safety and electr ical codes of the
countries in which they are to be sold. However, in
order to maintai n suc h c omp li anc e, it is e qual ly imp or tant to implement the following precautions when a set
is being serviced.
Precautions during Servicing
A. Parts identified by the ! symbol are critical for
safety. Replace only with part number specified.
B. In addition to safety, other parts and assemblies
are specified for conformance with regulations
applying to spur ious radi ation. Thes e must also be
replaced only with specified replacements.
Examples: RF conver ters, RF cables, noise blocking capacitors, and noise blocking filters, etc.
C. Use specified internal wiring. Note especially:
1)Wires covered with PVC tubing
2)Double insulated wires
3)High voltage leads
D. Use specified insulating materials for hazardous
live parts. Note especially:
1)Insulation tape
2)PVC tubing
3)Spacers
4)Insulators for transistors
E. When replacing AC primary side components
(transformers, power cord, etc.), wrap ends of
wires securely about the terminals before soldering.
F. Observe that the wires do no t co ntac t he at prod uc -
ing parts (heatsink s, oxide metal film resist ors, fusible resistors, etc.).
G. Check that replaced wires do not contact sharp
edges or pointed parts.
H. When a power cord has b een replac ed, check that
5 - 6 kg of force in any direction will not loosen it.
I. Also check areas surrounding repaired locations.
J. Be careful that foreign objects (screws, solder
droplets, etc.) do not remain inside the set.
K. Crimp type wire connector
The power transformer uses crimp type connectors
which connect the power cord and the primary side
of the transformer. When replacing the transformer,
follow these steps carefully and precisely to prevent shock hazards.
Replacement procedure
1)Remove the old connector by cutting the wires at a
point close to the connector.
Important: Do not re-use a connector. (Discard it.)
2)Strip about 15 mm of the insu lation from the ends
of the wires. If the wires are stranded, twist the
strands to avoid frayed conductors.
3)Align the lengths of the wires to be connected.
Insert the wires fully into the connector.
4)Use a crimping tool to crimp the metal sleeve at its
center. Be sure to crimp fully to the comp lete closure of the tool.
L. When connecting or disconnecting the internal
connectors, first, disconne ct the AC plug from the
AC outlet.
1-3-1DVD_SFNP
Page 7
Safety Check after Servicing
Examine the area surrounding the repaired location
for damage or deterioration. Observe that screws,
parts, and wires have been returned to their original
positions. Afterwards, do the following tests and confirm the specified values to verify compliance with
safety standards.
1. Clearance Distance
When replacing primary circuit components, confirm
specified clearance dista nce (d) and (d’) between soldered terminals, and between terminals and surrounding metallic parts. (See Fig. 1)
Table 1 : Ratings for selected area
AC Line VoltageClearance Distance (d), (d’)
Chassis or Secondary Conductor
Primary Circuit
d'd
220 to 240 V
Note: This table is unofficial and for reference only.
Be sure to confirm the precise values.
≥3 mm(d)
≥6 mm(d’)
2. Leakage Curre nt Test
Confirm the specified (or lower) leakage current
between B (earth ground, power cord plug prongs)
and externally exposed accessible parts (RF terminals, antenna terminals, video and audio input and
output terminals, microphone jacks, earphone jacks,
etc.) is lower than or equal to the specified value in the
table below.
Measuring Method (Power ON) :
Insert load Z between B (earth ground, power cord
plug prongs) and exposed accessible parts. Use an
AC voltmeter to measure across t he ter minals of l oad
Z. See Fig. 2 and the following table.
Exposed Accessible Part
Z
One side of
B
Power Cord Plug Prongs
Fig. 1
AC Voltmeter
(High Impedance)
Fig. 2
Table 2: Leakage current ratings for selected areas
AC Line VoltageLoad ZLeakage Current (i)
2kΩ RES.
Connected in
220 to 240 V
Note: This table is unofficial and for reference only. Be sure to confirm the precise values.
parallel
50kΩ RES.
Connected in
parallel
i≤0.7mA AC Peak
i≤2mA DC
i≤0.7mA AC Peak
i≤2mA DC
1-3-2DVD_SFNP
One side of power cord plug
prongs (B) to:
RF or
Antenna terminals
A/V Input, Output
Page 8
STANDARD NOTES FOR SERVICING
Circuit Board Indications
1. The output pin of the 3 pin Regu lator ICs is indicated as shown.
Top View
Input
Out
2. F or other ICs, pin 1 and every fifth pin are indicated
as shown.
In
Pin 1
3. The 1st pin of ever y mal e con nec to r is ind ic ate d as
shown.
Bottom View
5
10
Pb (Lead) Free Solder
When soldering, be sure to use the Pb free solder.
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:.
(1)Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
Fig. S-1-1
Pin 1
Instructions for Connectors
1. When you connect or disconnect the FF C (Flexible
Foil Connector) cable, be sure to first disconnect
the AC cord.
2. FFC (Flexible Foil Connector) cable should be
inserted parallel into the connector, not at an angle.
FFC Cable
Connector
CBA
(2)Remove the flat pack-IC with tweezers while apply-
ing the hot air.
(3)B ottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to c ent er of the fla t pack-IC and hea t
up. Then remove (glue will be melted). (Fig. S-1-6)
(4)Rel ease the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
Caution:
1. The Flat Pack-IC shape may differ by models. Use
an appropriate hot-air flat pack-IC desoldering
machine, whose shape matches that of the Flat
Pack-IC.
2. Do not supply hot air to the chi p parts aro und the
flat pack-IC for over 6 seconds because damage to
the chip parts may occur. Put masking tape around
the flat pack-IC to protect other parts from damage.
(Fig. S-1-2)
* Be careful to avoid a short circuit.
1-4-1DVD_NOTE
Page 9
3. The flat pack-IC on the CBA is affixed with glue, so
be careful not to break or dama ge the foil of each
pin or the solder lands under the IC when removing
it.
Hot-air
Flat Pack-IC
Desoldering
Machine
CBA
With Soldering Iron:
(1)Using desoldering braid, remove the solder from all
pins of the flat pack-IC. When you use sol der flux
which is applied to all pins of the flat pack-IC, you
can remove it easily . (Fig. S-1-3)
Flat Pack-IC
Desoldering Braid
Masking
Tape
Tweezers
Flat Pack-IC
Fig. S-1-2
Soldering Iron
Fig. S-1-3
(2) Lift each lead of the flat pack-IC upward one by
one, using a sharp pi n or wire to which solder will
not adhere (iron wire). W hen heating th e pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Sharp
Pin
Fine Tip
Soldering Iron
Fig. S-1-4
(3)B ottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to c ent er of the fla t pack-IC and hea t
up. Then remove (glue will be melted). (Fig. S-1-6)
(4)Rel ease the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
With Iron Wire:
(1)Using desoldering braid, remove the solder from all
pins of the flat pack-IC. When you use sol der flux
which is applied to all pins of the flat pack-IC, you
can remove it easily . (Fig. S-1-3)
(2) Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
(3) While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solder
melts so as to l ift the IC leads from the CBA contact pads as shown in Fig. S-1-5.
1-4-2DVD_NOTE
Page 10
(4)Bo ttom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to cente r o f the fl at p ack-IC and h eat
up. Then remove (glue will be melted). (Fig. S-1-6)
(5)Rel ease the fla t pack-IC from the C BA us ing twee -
zers. (Fig. S-1-6)
Note:
When using a solder ing iron, care must be taken
to ensure that the fl at pack-IC i s not bein g held by
glue. When the flat pack-IC is removed from the
CBA, handle it gentl y b ec ause i t m ay be dama ged
if force is applied.
2. Installation
(1) Using desoldering braid, remove the solder from
the foil of each pin of the flat pack-IC on the CBA
so you can install a repla cement flat p ack-IC more
easily.
(2) The “I” mark on the flat pack-IC indicates pin 1.
(See Fig. S-1-7.) Be sure this mar k matches the 1
on the PCB when p ositioning for install ation. Then
presolder the four corn ers of the flat pack-IC. (See
Fig. S-1-8.)
(3)Solder all pins of the flat pack-IC. Be sure that none
of the pins have solder bridges.
To Solid
Mounting Point
CBA
Hot Air Blower
Iron Wire
Soldering Iron
Fig. S-1-5
Fine Tip
Soldering Iron
Example :
or
Pin 1 of the Flat Pack-IC
is indicated by a " " mark.
Fig. S-1-7
Presolder
Flat Pack-IC
CBA
Fig. S-1-8
Tweezers
Flat Pack-IC
Fig. S-1-6
1-4-3DVD_NOTE
Page 11
Instructions for Handling
Semi-conductors
Electrostatic breakdown of the semi-conductors may
occur due to a potenti al difference caused by electrostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a groundi ng ban d (1M Ω) that is properly grounded to remove any static electr icity that may
be charged on the body.
2. Ground for Workbench
(1)Be sure to place a conductive sheet or copper plate
with proper grounding ( 1MΩ) on the wor kbench or
other surface, where the semi-conductors are to be
placed. Because the static electricity charge on
clothing will not escap e through the body grounding band, be care ful to avoid contacting semi-con ductors with your clothing.
< Incorrect >
< Correct >
1MΩ
CBA
Grounding Band
1MΩ
CBA
Conductive Sheet or
Copper Plate
1-4-4DVD_NOTE
Page 12
PREPARATION FOR SERVICING
How to Enter the Service Mode
About Optical Sensors
Caution:
An optical sensor system is used for the Tape Start
and End Sensors on th is equipment. Carefully read
and follow the instructions below. Otherwise the unit
may operate erratically.
What to do for preparation
Insert a tape into the Deck Mechanism Asse mbly and
press the PLAY button. The tape will be loaded into
the Deck Mechanism Assembly. Make sure the power
is on, connect TP501 (S-INH) to GND. This will st op
the function of Tape Start Sensor, Tape End Sensor
and Reel Sensors. (If these TPs ar e c on nected before
plugging in the unit, the function of the sensors will
stay valid.) See Fig. 1.
Q503
Q504
S-INH
TP501
Fig. 1
Note: Because the Tape End Sensors are inactive, do
not run a tape al l t he way to the start or the end of the
tape to avoid tape damage.
1-5-1E9710PFS
Page 13
CABINET DISASSEMBLY INSTRUCTIONS
1. Disassembl y Flowchart
This flowchar t indi cates the di sass embly ste ps to ga in
access to item(s) to be ser v iced. Whe n reassembling,
follow the steps in reverse order. Bend, route, and
dress the cables as they were originally.
(1):Identification (location) No. of parts in the figures
(2):Name of the part
(3):Figure Number for reference
(4): Identification of parts to be removed, unhooked,
unlocked, released, unplugged, unclamped, or
desoldered.
P=Spring, L=Locking Tab, S=Screw,
CN=Connector
*=Unhook, Unlock, Release, Unplug, or Desolder
e.g. 6(S-1) = six Screws (S-1),
5(L-1) = five Locking Tabs (L-1)
(5):Refer to “Reference Notes.”
1-6-1E9709DC
Page 14
Reference Notes
CAUTION 1: Locking Tabs (L-1) and (L-2 ) are fragile.
Be careful not to break them.
1-1. Release five Locking Tabs (L-1).
1-2. Release three Locking Tabs (L-2)
1-3. Disconnect Connector (CN1505), and remove
the Front Assembly.
2. When reassembling, solder wire jumpers as shown
in Fig. D8.
3. Before installing the Deck Assembly, be sure to
place the pin of LD-SW on Main CB A as shown in
Fig. D8. Then, install the Deck Assembly while
aligning the hole of Cam Gear with the pin of LDSW, the shaf t of Ca m Gea r wi th t he ho le of LD -S W
as shown in Fig. D8.
(S-1)
(S-1)
[1] T op Cover
(S-1)
CN601
(S-5A)
[7] DVD
Mechanism
&
DVD Main
CBA
Assembly
[5] Jack Bracket
Jack Earth Plate
CN501
(S-4)
[6] Front
Jack CBA
Fig. D3
(S-5A)
(S-5B)
(S-2)
[3] Front
Bracket
(L-2)
Fig. D1
[4] Radiation Sheet
(S-2)
(S-3)
Fig. D4
(L-1)
(L-1)
CN1505
[2] Front
Assembly
(L-1)
Fig. D2
1-6-2E9709DC
Page 15
(S-7)
(S-8A)
(S-6A)
CN1503
(S-6B)
(S-7)
[8] Rear
Panel Unit
(S-8B)
(S-7)
(S-13)
(S-15)
(S-14)
(S-14)
(S-16)
[14] VCR
Chassis
Unit
(S-13)
(S-13)
(S-14)
(S-14)
(S-14)
(S-12)
[12] Rear Panel
[10] DC Fan Motor
CN1504
(S-11)
[13] Bracket R
Fig. D5
Fig. D7
(S-10)
(S-11)
[9] Power
Supply CBA
(S-9)
(S-9)
(S-9)
Earth
Plate
[11] PCB
Holder
Fig. D6
1-6-3E9709DC
Page 16
[15] Deck
Assembly
FE Head
[19] AFV CBA
[16] Power
SW CBA
Cylinder
Assembly
ACE Head
Assembly
[18] Rear
Jack CBA
Pin
SW507
LD-SW
Ground Plate
[19] Main CBA
Lead
with
blue
stripe
(S-17)
Desolder
From
Capstan
Motor
Assembly
Desolder
from bottom
(S-18)
[17] Function CBA
Desolder
Lead with
blue stripe
Printing side
[19] Main
CBA
From
ACE Head
Assembly
Desolder
LD-SW
Lead with
blue stripe
Lead with
blue stripe
Desolder
[15] Deck Assembly
Shaft
Hole
From
Cylinder
Assembly
From
FE Head
Hole
Pin
Desolder
Lead with
gray stripe
Cam Gear
[19] Main CBA
BOTT OM VIEW
Lead connections of Deck Assembly and Main CBA
1-6-4E9709DC
Fig. D8
Page 17
(S-19)
(S-19)
[20] Deck
Pedestal
[21] Front
Bracket R
(S-20)
Fig. D9
3. How to Eject Manually
< Method 1 >
Note: When servicing, do not touch white resin part as shown below.
When rotating the gear, be careful not to damage the gear.
1. Remove the Top Cover.
2. Rotate the gear in the direction of the arrow manually as shown below.
View for A
Do not touch!
Rotate this gear in
the direction of the arrow
A
1-6-5E9709DC
Page 18
< Method 2 >
Note: When servicing, do not touch white resin part
as shown below.
1. Remove the Top Cover, the Front Assembly and
the DVD Mechanism & DVD Main CBA Assembly.
Then, remove the DVD Mechanism Unit.
2. Remove two screws, and remove the Insulating
Plate.
Screw
Insulating Plate
4. Release the other side of two Locking Tabs, and
remove the Clamper Assembly.
Clamper Assembly
Locking Tabs
5. Remove the disc.
Disc
Do not touch!
3. Release two Locking Tabs, and lift up one side of
the Clamper Assembly.
Clamper Assembly
Locking Tabs
1-6-6E9709DC
Page 19
ELECTRICAL ADJUSTMENT INSTRUCTIONS
c
General Note: "CBA" is an abbreviation for
"Circuit Board Assembly."
NOTE:
1.Electri cal adjustm ents are re quired after re placing
circuit components and certain mechanical par ts.
It is impor tant to do these adjustments only after
all repairs and replacements have been completed. Also, do not attempt these adjustments
unless the proper equipment is available.
2.To perform these align ment / confir mation procedures, make sure that the tracking control is set in
the center position: Press either "PROG. L5??" or
"PROG. K" button on the front panel first, then the
"PLAY" button on the front panel.
Test Equipment Required
1.Oscilloscope: Dual-trace with 10:1 probe,
V-Range: 0.001~50V/Div.,
F-Range: DC~AC-20MHz
2.Alignment Tape (FL6A)
Head Switching Position Adjustment
Figure 1
EXT. Syncronize Trigger Point
CH1
CH2
Reference Notes:
Playback the Alignment tape and adjust VR501 so that
the V-sync front edg e of the CH1 video out put waveform is at the 6.5H±1H (416µs±64µs) delayed position
from the rising edge o f the CH2 head switching pulse
waveform.
1.0H
6.5H±1H (416µs±64µs)
Switching Pulse
0.5H
V-Syn
Purpose:
To determine the Head Swi tching position during
playback.
Symptom of Misadjustment:
May cause Head Switching n oise or vertical jitter
in the picture.
Test pointAdj.PointModeInput
J236(JK1-V-OUT)
TP504(RF-SW)
GND
Tape
FL6AOscilloscope
Connections of Measurement Equipment
TP751
Main CBA
TP504
VR501
(Switching Point)
(MAIN CBA)
Measurement
Equipment
GND
PLAY
(SP)
Spec.
6.5H±1H
(416µs±64µs)
Oscilloscope
-----
CH1 CH2
Trig. (+)
1-7-1H9710EA
Page 20
HOW TO INITIALIZE THE DVD RECORDER & VCR
To put the program back at the factory-default, initialize the DVD recorder & VCR as the following procedure.
< DVD Section >
1. Turn the DVD recorder on.
2. Confirm that no disc is loaded or that the disc tray
is open. To put the DVD recorder into the Version
display mode, press [CM SKIP], [1], [2], and [3]
buttons on the remote control in that order.
Fig. a appears on the screen.
*1: "
*2: Firmware Version differs depending on the
models, and this indication is one example.
" differs depending on the models.
*******
F/W VERSION
Model Name :
Firmware Version
BE :
FE :
API :
TT :
DEFAULT SETTING : ENTER
EXIT : RETURN
*******
W2E3075H2D
R20_054_000
Ver 1.09
T20031GVP
Fig. a Version Display Mode Screen
3. Press [ENTER] button, then the DVD recorder
starts initializing. When the initializing is
completed, the DVD recorder exits the Version
display mode and turns off the power
automatically.
*To move into the Normal mode from the
V ersion display mode, press [RETURN] button
on the remote control instead of [ENTER]
button.
*When [STANDBY-ON] button is pressed
before [ENTER] button is pressed, the DVD
recorder exits the Version display mode, then
the power turns off.
1-8-1E9700INT
Page 21
FIRMWARE RENEWAL MODE
1. Turn the power on and remove the disc on the tray.
2. To put the DVD recorder into version up mode,
press [CM SKIP], [6], [5], and [4] buttons on the
remote control unit in that order. Then the tray will
open automatically.
Fig. a appears on the screen and Fig. b appears
on the VFD.
* Firmware Version differs depending on the
models, and this indication is one example.
Firm Update Mode
Please insert a disc.
Fig. a Version Up Mode Screen
Fig. b VFD in Version Up Mode
ver. W2E3075H2D
Current
F/W version
is displayed.
4. Select the firmware version pressing arrow
buttons, then press [ENTER].
Fig. d appears on the screen and Fig. e appears
on the VFD. The DVD recorder starts updating.
About VFD indication of Fig. e:
1) When Fig. d is displayed on the screen, “F-UP”
is displayed on the VFD.
2) When “Firmware Updating... XX% Complete.”
is displayed on the screen, “XX”% is displayed
on the VFD.
* Firmware Version differs depending on the
models, and this indication is one example.
Selected
F/W version
is displayed.
Firm Update Mode
W2E3075H2D
File Loading...
(*1)
Fig. d Programming Mode Screen
ver.
W2E3075H2D
3. Load the disc for version up.
Fig. c appears on the screen. The file on the top is
highlighted as the default.
When there is only one file to exist, Step 4 will
start automatically.
* Firmware Version differs depending on the
models, and this indication is one example.
Firm Update Modever. W2E3075H2D
Disc name
is displayed.
VOL_200408250934
1 W2E3075H2D
2 W2E3076H2D
3 W2E3077H2D
4 W2E3078H2D
Fig. c Update Disc Screen
Files included
in the disc are
displayed.
1 / 1
Fig. e VFD in Programming Mode (Example)
The appearance shown in (*1) of Fig. d is
described as follows.
No.AppearanceState
1File Loading...Sending files into the memory
Firmware
2
Updating...
Writing new version data
XX% Complete.
Firmware
---
Update Failure
Failed in updating
1-9-1E9700FW
Page 22
5. After updating is finished, the tray opens
automatically.
Fig. f appears on the screen and Fig. g appears on
the VFD.
* Firmware Version differs depending on the
models, and this indication is one example.
Firm Update Modever. W2E3075H2D
W2E3075H2D
B/E Firmware
Update End
Fig. f Completed Program Mode Screen
Fig. g VFD in Completed Program Mode
At this time, no button is available.
6. Press [STANDBY-ON] button to turn the power off.
Then press it again.
1-9-2E9700FW
Page 23
FUNCTION INDICATOR SYMBOLS
< VCR Section >
Note:
If a mechanical ma lfunction occurs, the power is tur ned off. When the power comes on agai n after that by
pressing [STANDBY-ON] button, an error message is displayed on the TV screen for 5 seconds.
MODEINDICATOR ACTIVE
When reel or capstan mechanism is not
functioning correctly
When tape loading mechanism is not functioning correctly
When cassette loading mechanism is not
functioning correctly
When the drum is not working properly
P-ON Power safety detection
“A R” is displayed on a TV screen. (Refer to Fig. 1.)
“A T” is displayed on a TV screen. (Refer to Fig. 2.)
“A C” is displayed on a TV screen. (Refer to Fig. 3.)
“A D” is displayed on a TV screen. (Refer to Fig. 4.)
“A P” is displayed on a TV screen. (Refer to Fig. 5.)
TV screen
When reel or capstan mechanism is not functioning
correctly
A
R
SP 0 : 00 : 00
Recording mode
Elapsed time
Fig. 1
When the drum is not working properly
A
D
SP 0 : 00 : 00
Recording mode
Elapsed time
Fig. 4
When tape loading mechanism i s not function ing correctly
A
T
SP 0 : 00 : 00
Recording mode
When cassette loadi ng mechanism is not functi oning
correctly
A
C
Elapsed time
Fig. 2
SP 0 : 00 : 00
Recording mode
Elapsed time
Fig. 3
P-ON Power safety detection
A
P
SP 0 : 00 : 00
Recording mode
Elapsed time
Fig. 5
1-10-1E970SFIS
Page 24
< DVD Section >
Note: If an error occurs, a message with the error number appears on the screen.
Recording Error
MessageSolution
Can not record on this disc.
This program is not allowed to
be recorded.
This program is not recordable
in Video mode.
This program is not allowed to
be recorded on this disc.
You cannot record on this disc as
Power Calibration Area is full.
Insert the recordable disc, and
ensure the disc status satisfies
the recording requiremen ts.
You cannot record copy
prohibite d programs.
Set “DVD-RW Recording
Format” to “VR mode”.
Insert a ver.1.1 CPRM
compatible DVD-RW disc.
Error message
E35
Error
No.
1An error occurs during data reading.2
3
4An error occurs with OPC.-
5During recovery in a record.6
7An error occurs in a format.-
8It cannot start an encode.9
10
11
12
13It is a reply that “ATAPI is not readable.”14
15
16An error occurs in Finalize Close.-
17An error occurs in Rec Stop Close.18An error occurs in PCA Full (DVD_R).19Safety Stop occur s during editing.20High Speed Disc.2
21The disc is not formatted.5
22Disc Error has occurred.3
23The -R Disc of VR Mode.6
24
25During the Macrovision picture input.11
26During the CGMS picture input.12
27
28
Error No.
Error DescriptionPriority
There is no reply for 15 seconds in Test
Unit Read y.
Cannot write the data after trying three
times.
An error occurs ev en if recov ery has been
tried three times.
NV_PCK/RDI_PCK is not in encoded
data.
Encode Paus e co ndi tio n co ntinued for 10
minutes.
Encode Pause condition continued in
normal REC condition for 10 minutes.
Difference in the addres s and ca n not get
StreamID of RDI/VIDEO.
Cannot write the data after recovering
SMALL VMGI.
Cannot write the data after DVD-R
Reverse Track.
The disc except DVD-R/RW or finalized
DVD-R.
During the CGMS picture (possible to
record once) input. (Video Format Disc)
During the CGMS picture (possible to
record once) input. (Disc which is not for
the correspondence to VR Format
CPRM)
-
-
-
-
-
-
-
-
-
1
12
12
1-10-2E970SFIS
Page 25
MessageSolution
This disc is protected and not
recordable.
Disc is full.
(No area for new recording)
You cannot record more than
99 titles on one disc.
(The maximum is 99.)
You cannot record more than
999 chapters on one disc.
(The maximum is 999.)
You cannot record on this disc
as Control Information is full.
You cannot record on the disc
as Power Calibration Area is
full.
This disc is already finalized.
Can not record on this disc.Repeat the same operation.
Release th e disc protect
setting in the Disc Setting
menu.
Insert the recordable disc with
enough recording space.
Delete unnecessary titles.
Delete unnecessary chapter
markers.
Delete unnecessary titles.34
Insert a new disc.35PCA is Full. (in REC star t)4
Release th e finalizin g for this
disc.
Error
No.
Error DescriptionPriority
29Disc Protected Disc.7
30No avilable recording space.5
Its recording capacity has been reach ed.
31
(Video Format Disc)
Its recording capacity has been reach ed.
32
(VR Format Disc)
The 999 chapter has been reached. (VR
33
Format Disc)
There is not space to record field of
control information.
36It is finalized. (Video Format Disc)6
37Access to Memory Area range outside.-
38Sector Address is wrong.39BUP writing error of chapter editing.-
7
8
9
10
If an error occurs during the timer recording, one of the following error numbers (40 to 42) or the above error
messages (error number: 1 to 39) is displayed on the recording menu after timer recording.
(Once the screen of the program line is exited, the program line for the error will be cleared.)
(No Error Message is displayed for the error No. 40 ~ 42.)
A program with the error number is grayed out and asterisked on the timer programming list.
MessageSolution
Error message is not
displayed.
Timer Programming
DateStartEndCHSpeed
JAN/01 12:57AM 1:57AM 8 DVD E40
*
2. ---
3. ---
4. ---
5. ---
6. ---
7. ---
8. ---
- Set the timer programming
correctly.
- Set the timer programming
before the start time.
- Insert a recordable videotape
with a record tab.
Turn the power on and set the
clock correctly then set timer
programming again.
Insert the recordable disc.42No disc when recording-
VCR DVD
DVD
VCR
The speed mode changes
to the error number.
Error
No.
Error DescriptionPriority
- Some portion has not been recorded
because of program overlapping.
40
- Recording did not start at the start time.
- No Videotape is inserted.
Videotape ran out during recording.
41Power failed-
-
1-10-3E970SFIS
Page 26
BLOCK DIAGRAMS
Servo/System Control Block Diagram
POWER
DUBBING
OPEN/CLOSE
SW682
SW681
OPEN/CLOSE-SW
DUBBING-SW
11
22
CN510CN681
TP501
SW671
FUNCTION CBA
33POWER-SW
CN508CN671
SENS-INH
VCR KEY
SWITCH
REMOTE
SENSOR
DVD KEY SWITCH
RM1501
7
8
14
KEY- 1
KEY- 2
REMOCON-IN
AL+5V
POWER
D671
POWER SW CBA
POWER-LED
22
AL+5V
REC-SAFETY
SW506
31
REC-SAF-SW
AL+5V
1
POWER-LED
IC612
(FIP DRIVER)
DVD
D502
3
DVD-LED
VCR
D503
2
VCR-LED
FL601
42
1G
GRID
36
FIP
7G
SEGMENT
20
28
i
a
DRV-DIN
7
68
DRV-DATA
DRV-CLK
DRV-STB
8
9
69
DRV-CLK70DRV-STB
TO AUDIO
BLOCK DIAGRAM
IIC-BUS SCL
IIC-BUS SDA
AUDIO-MUTE-H
83
VCR-AUDIO-MUTE
TO Hi-Fi AUDIO
BLOCK DIAGRAM
A-MODE
Hi-Fi-H-SW
IIC-BUS SCL
IIC-BUS SDA
19
Hi-Fi-H-SW
IIC-BUS SCL
IIC-BUS SDA
AUDIO-MUTE-2
86
28
71
72
A-MODE
IIC-BUS SCL
IIC-BUS SDA
AUDIO-MUTE-2
RF-SW
D-REC-H
18
33
RF-SW
D-REC-H
TO VIDEO
BLOCK DIAGRAM
H-A-SW
C-ROTA
D-V-SYNC
13
15
H-A-SW
C-ROTA
D-V-SYNC
V-ENV
H-A-COMP
6
17
16
V-ENV
H-A-COMP
C-SYNC
TRICK-H
58
62
C-SYNC
TRICK-H
SECAM-H
61
SECAM-H
S-REEL79
ST-S
T-REEL
END-S
CTL(+)
CTL(-)
LD-SW9
IC501
(SERVO/SYSTEM CONTROL)
949510480
MAIN CBA
AL+5V
AL+5V
LD-SW
SW507
END-S
TP502
CN504
5 CTL(+)
6 CTL(-)
PS502
Q506
D555
Q515
S-REEL
T-REEL
S-LED
CTL
RESET
34
97
TP503
RESET
AL+5V
TIMER+5V
PG-DELAY
2
CTL
VR501
SW-POINT
SYSTEM-RESET
S-DATA-OUT
S-DATA-IN
656366
Q517
CN1502CN601
3029272528
SUB-RXD27SUB-TXD25SUB-SCLK
30 SYS-RESET
29
Y2A2V7
SUB-TXD
SUB-RXD
SYS-RESET
READY/BUSY
S-CLOCK
64
67
Q516
RDY
28
DVD MAIN CBA
U8
H2
RDY
SUB-SCLK
C-CONT
LM-FWD/REV
C-FG
87
CN502
3 C-FG
D-CONT77
C-F/R
76
81
78
C-F/R5C-CONT7LM-FWD/REV
D-CONT9D-PFG
4
8
MOTOR
DRIVE
CIRCUIT
CAPSTAN MOTOR
D-PFG
90
M
CAPSTAN
MOTOR
VIDEO-SW1
VIDEO-SW3
22
23 VIDEO-SW2
24
VIDEO-SW2
VIDEO-SW3
VIDEO-SW1
OUTPUT-SELECT
82
IIC-BUS SDA
IIC-BUS SCL
OUTPUT-SELECT
29 DVD-AUDIO-MUTE
27 RGB-THROUGH
RGB-THROUGH
DVD-AUDIO-MUTE
RGB-THROUGH
OUTPUT-SELECT
OUTPUT-SELECT
IIC-BUS SDA
IIC-BUS SCL
CONTROL
HEAD
ACE HEAD ASSEMBLY
(DECK ASSEMBLY)
SENSOR CBA
ST-S
Q504
SENSOR CBA
END-S
Q503
IC601 (DVD MICRO CONTROLLER)
1-11-1
PG
SENSOR
M
CYLINDER ASSEMBLY
DRUM
MOTOR
M
LOADING
MOTOR
TO VIDEO
INPUT SELECT
BLOCK DIAGRAM
TO VIDEO
OUTPUT SELECT
BLOCK DIAGRAM
TO AUDIO
INPUT/OUTPUT
E970SBLS
SELECT
BLOCK DIAGRAM
Page 27
Digital Signal Process Block Diagram
TO VIDEO
OUTPUT
SELECT
BLOCK
VIDEO-Y(I)
VIDEO-Y(I/P)
DIAGRAM
VIDEO-C
VIDEO-Cb/Pb
VIDEO-Cr/Pr
TO VIDEO
INPUT
SELECT
BLOCK
DIAGRAM
VIDEO-C
VIDEO-Y/CVBS
SPDIF
BCK
DATA
LRCK
MD
MC
TO AUDIO
MS
INPUT/
OUTPUT
SELECT
BLOCK
DIAGRAM
SCK
LRCK
BCK
DATA
SYSCLK
REC VIDEO SIGNAL PB VIDEO SIGNALREC AUDIO SIGNAL PB AUDIO SIGNAL
IC601 (MPEG2 AV CODEC)IC201
J18
D/A
H18
D/A
K18
D/A
VIDEO
ENCODER
VIDEO
I/F
H19
D/A
G19
D/A
V15
W17
VIDEO
DECODER
BACK-END
DIGITAL
SIGNAL
FRONT-END
E20
PROCESS
DIGITAL
SIGNAL
T20
PROCESS
N19
M19
V4W4V3
AUDIO
H20
G20
F20
FLASH MEMORY
IC604 (FLASH MEMORY)
DDR SDRAM
IC602,IC603 (DDR SDRAM)
P19
U20
I/F
SDRAM
IC204
RF/
IC101
DVD MECHANISM
ERROR AMP
IC102
CN101
LPC
TILT
PICK
-UP
IC402
TRACKING
FOCUS
MOTOR
DRIVER
CN1003
FE
1-11-2
IC410
ENCODER
ENCODER CBA
OP AMP
CN401
CN1001
TRAY OPEN
IC202
+3.3V
FLASH
MEMORY
LOADER CBA
IC401
SLED
MOTOR
M
MOTOR
DRIVER
CN1002
SPINDLE
MOTOR
DVD MAIN CBA
RELAY CBA
M
E970SBLD
Page 28
Video Block Diagram
MODE: SP/RECPB-VIDEO SIGNAL
VIDEO (L)-1
HEAD
VIDEO (R)-1
HEAD
VIDEO (L)-2
HEAD
CYLINDER ASSEMBLY
VIDEO (R)-2
HEAD
REC-VIDEO SIGNAL
TO SERVO/SYSTEM
IIC-BUS SCL
CONTROL BLOCK
DIAGRAM
IIC-BUS SDA
(DECK ASSEMBLY)
CN251
7978
Y. DELAY
4643
6968
SERIAL
DECORDER
65
123
VIDEO(L)-1
VIDEO(R)-1
VIDEO-COM
969594
SP
HEAD
SP
P
R
LUMINANCE
SIGNAL
PROCESS
AGC
456
VIDEO(L)-2
VIDEO(R)-2
VIDEO-COM
93
AMP
EP
WF1
RF-SW
TP504
908988
EP
HEAD
AMP
REC FMAGC
Y
CCD 1H DELAY
CHARA.
INS.
D-REC-H
87
+
C
1/2
RF-SW
C-ROTA
70
80
D-REC-H
RF-SW/C-ROTA
CHROMINANCE
FBC
TO SERVO/SYSTEM
CONTROL BLOCK
DIAGRAM
V-ENV
H-A-SW
H-A-COMP
71
62
H-A-SW
D-V-SYNC
RPRP
SIGNAL
PROCESS
C-SYNC
67
84
83
V-ENV
C-SYNC
H-A-COMP
Y/C
PR
D-V-SYNC
TRICK-H
SECAM-H
IC370 (PAL/SECAM DECTECTOR)
44
PB-H OUT
21
25
2928
VXO
MIX
AGC
28
1
TP301
29
C-PB
X301
PAL/SECAM
DETECTOR
171418216
WF2
4.43MHz
MAIN CBA
IC501 (OSD)
50
OSD
CHARACTER
MIX
52
55
COLOR-IN
VIDEO SIGNAL PROCESS
/HEAD AMP
IC301
DVD-VIDEO(DUB)
TO VIDEO
OUTPUT SELECT
BLOCK DIAGRAM
(DVD VCR DUBBING)
BYPASS
DVD
VCR
50
VCR-VIDEO
TO VIDEO
PB/EE
48
56
PB/EE-VIDEO
INPUT SELECT
BLOCK DIAGRAM
1-11-3
MUTE
5859
61
VCR-VIDEO(DUB)
TO VIDEO
INPUT SELECT
BLOCK DIAGRAM
(VCR DVD DUBBING)
E970SBLV
Page 29
Video Input Select Block Diagram
JK1204
C
S-VIDEO IN(FRONT)
VIDEO-IN
(FRONT)
REC VIDEO SIGNALPB VIDEO SIGNAL
31
BUFFER
TO VIDEO
VIDEO-OUT2
VIDEO-OUT1
30
DRIVER
6dB
6dB
AMP
OUTPUT SELECT
BLOCK DIAGRAM
DVD-VIDEO
WF3
JK1-V-OUT
J236
29
DRIVER
AMP
CONTROL
LOGIC
TO VIDEO
BLOCK DIAGRAM
PB/EE-VIDEO
VCR-VIDEO
3
5
VCR
DVD
SW CTL
(VCR DVD DUBBING)
10911
TO VIDEO
BLOCK DIAGRAM
VCR-VIDEO(DUB)
15
MUTE
S-VIDEO-Y
VCR
8
VIDEO
10
12
TU/LINE
MUTE
2
1
34
Y
CN1201
FRONT-VIDEO-IN
22FRONT-Y-IN
11FRONT-C-IN
44
CN1505
4
MUTE
S-VIDEO-C
CONTROL
LOGIC
JK1201
22 23 24
TO SERVO/SYSTEM CONTROL
VIDEO-SW2
VIDEO-SW1
VIDEO-SW3
BLOCK DIAGRAM
IIC-BUS SCL
IIC-BUS SDA
OUTPUT-SELECT
FRONT JACK CBA
IC1518 (VIDEO INPUT SELECT)
TU1501 (TUNER UNIT)
28
24
VIDEO OUT
JK1502
1
20
VIDEO IN
3
11
JK2-VIDEO-IN
11
CN2001CN1507
IC1508 (SW)
5
33
32
4
(VIDEO INPUT SELECT)IC1507
LPF
BUFFER
19
BUFFER
Q1521,
Q1541
CN1502
VIDEO-Y/CVBS
2121
CN601
2323VIDEO-C
MAIN CBA
BUFFERLPF
20
21
BUFFER
Q1520
JK2001
20
JK2
-VIDEO-IN
REAR JACK CBA
VIDEO-Y/CVBS
VIDEO-C
DVD MAIN CBA
TO DIGITAL
SIGNAL
PROCESS
BLOCK
DIAGRAM
1-11-4
E970SBLVIS
Page 30
Video Output Select Block Diagram
JK1506
S-VIDEO
OUT
2
1
34
YC
REC VIDEO SIGNAL PB VIDEO SIGNAL
VIDEO-G OUT
JK1-VIDEO-OUT
11
19
JK1502
VIDEO-B OUT
VIDEO-R OUT
JK2-16P
7
15
16
WF9
5
2dB
AMP
8dB
LPFDRIVER
4dB
AMP
IC1515 (VIDEO DRIVER)
3
6
DRIVER
AMP
-6dB
7
2dB
AMP
LPFDRIVER
4dB
AMP
1
DVD-VIDEO(DUB)
TO VIDEO
BLOCK DIAGRAM
(DVD VCR DUBBING)
DVD-VIDEO
VIDEO-OUT2
VIDEO-OUT1
TO VIDEO INPUT SELECT
BLOCK DIAGRAM
11
2dB
AMP
2dB
LPFDRIVER
4dB
4dB
AMP
IC1514 (VIDEO DRIVER)
6
15
IC1509 (SW)
2
1
5
15
AMP
LPFDRIVER
AMP
1
4
3
10
2dB
AMP
LPFDRIVER
4dB
AMP
8
14
12
13
SW
CONTROL
9 10 11
P-ON+3.3V
Q1529
RGB-THROUGH
TO SERVO/SYSTEM CONTROL
BLOCK DIAGRAM
OUTPUT-SELECT
MAIN CBA
Q1527
WF4
3
VIDEO-Cb/Pb
VIDEO-Cr/Pr
553
VIDEO-Cb/Pb
VIDEO-Cr/Pr
BLOCK
DIAGRAM
WF7
WF5
WF6
CN1502
VIDEO-Y(I/P)
VIDEO-C
VIDEO-Y(I)
7799
11
CN601
VIDEO-Y(I/P)
VIDEO-C
VIDEO-Y(I)
TO DIGITAL
SIGNAL
PROCESS
1-11-5
Q1530
9
CN1507
14
13
VIDEO-G-IN
VIDEO-B-IN
JK2-VIDEO-OUT
9
14
13
CN2001
VIDEO-R-IN1515
Q1533
12
JK2-16P
12
Q1531
REAR JACK CBA
JK2001
7
111915
VIDEO-B IN
VIDEO-R IN
VIDEO-G IN
16
JK2-16P
DVD MAIN CBA
JK2-VIDEO-OUT
E970SBLVOS
Page 31
Audio Block Diagram
Mode : SP/REC
ALC
12
DET
LINE
11
MUTE
AMP
ALC
REC-ON
SERIAL
DECODER
TO SERVO/SYSTEM
CONTROL BLOCK
DIAGRAM
IIC-BUS SCL
IIC-BUS SDA
AUDIO-MUTE-H
71
68 69
PB-AUDIO SIGNALREC-AUDIO SIGNAL
MAIN CBA
151317
IC301
(AUDIO SIGNAL PROCESS)
IN1
TUNERIN2
INV
PB-ON
P
R
ATT
98
7
EQ
AMP
SP/LP-ON
5
6
+5V
Q404
Q403
BIAS
OSC
REC
AUTO
1
AMP
100
3
BIAS
2
Q406
16
AUDIO HD-SW
CONTROL
SWITCHING
D-REC-OFF
Q405
+5V
Q401
(PB=ON)
N-A-PB
N-A-REC
TO Hi-Fi AUDIO
BLOCK DIGRAM
1-11-6
CN504
ACE HEAD ASSEMBLY
(DECK ASSEMBLY)
AUDIO-PB/REC
4
3 A-COM
1 AE-H
2 AE-H/FE-H
AUDI O
HEAD
AUDI O
ERASE
HEAD
CN501
2 FE-H
FE HEAD
FULL
ERASE
E970SBLA
1 FE-H-GND
HEAD
Page 32
Audio Input/Output Select Block Diagram
AUDIO(L)-IN2
AUDIO(R)-IN2
AUDIO(L)-OUT2
AUDIO(R)-OUT2
2
613
JK2001
MUTE-ON
REAR JACK CBA
CN2001
CN1507
REC AUDIO SIGNAL PB AUDIO SIGNAL
MUTE-ON
2
JK2-AUDIO-MUTE
JK2-AUDIO(L)-OUT
JK2-AUDIO(L)-IN
JK2-AUDIO(R)-IN
JK2-AUDIO(R)-OUT
2
44
77
66
11
Q2002,
Q2004
Q2003,
Q2005
AUDIO(L)-IN1
613
JK1502
AUDIO(R)-IN1
AUDIO(L)-OUT1
AUDIO(R)-OUT1
2
Q1537Q1535
Q1538
MUTE-ON
Q1536
MUTE-ON
+5V
Q1507
IF SINAL
PROCESS
AFV CBA
CN1
TU-AUDIO(R)
SIF
TU-AUDIO
TU-AUDIO(L)
44
22
11
55
CN1506
Q1527
TU1501 (TUNER UNIT)
9
10
SW
1415
AUDIO OUT
21
11
CTL
SIF OUT
22
13 12 1 2
JK1505
AUDIO(L)
-OUT
MUTE-ONDRIVE
REAR
Q1532 Q1539
AUDIO(R)
-OUT
MUTE-ON
Q1540
TO SERVO/SYSTEM
CONTROL
RGB-THROUGH
OUTPUT-SELECT
BLOCK DIAGRAM
DVD-AUDIO-MUTE
(DVD VCR DUBBING))
DVD-AUDIO(L)
DVD-AUDIO(R)
TO Hi-Fi AUDIO
BLOCK DIAGRAM
PB/EE-AUDIO(L)
PB/EE-AUDIO(R)
VCR-AUDIO(L)
VCR-AUDIO(R)
AUDIO(L)
JK1202
FRONT JACK CBA
(VCR DVD DUBBING))
FRONT
-IN
JK1203
6
CN1201
AUDIO(L)-IN-F
6
CN1505
AUDIO(R)
-IN
88
AUDIO(R)-IN-F
6
6
8
10
24
AMP
BUFFER
IC1518 (INPUT/OUTPUT SELECT)
27
DIGITAL
AUDIO OUT
(COAXIAL)
DIGITAL
FIBER OPTIC
TRANS MODULE
JK1504
Q1534
CN1501
JK1503
BUFFER
WF10
25
AMP
DRIVER
AUDIO OUT
(OPTICAL)
26
DRIVER
14
BUFFER
23
162012
AMP
LOGIC
33
IIC-BUS SCL
TO SERVO/SYSTEM
CONTROL
32
IIC-BUS SDA
CONTROLBLOCK
DIAGRAM
AMP
22
21
DRIVER
DRIVER
IC1508
(SW)
4
5111
12
TU/IN1/2
(R-CH)
VCR
14
FRONT
SW CTL
9
13
10
2
1
1
7
VCR
FRONT
(OP AMP)IC1513
OP AMP
OP AMP
2
6
13 15
WF8
AUDIO(L)-OUT
AUDIO(R)-OUT
DVD-AUDIO-MUTE
AUDIO(L)-IN
AUDIO(R)-IN
1717
1515
1919
1313
1111
CN601CN1502
1
L-CH
2
R-CH
151416
L-CH
R-CH
MUTE
TU/IN1/2
(L-CH)
(AUDIO INPUT SELECT)
IC1501
3
6
)
OP AMP
(
IC1506
7
MAIN CBA
CN501
SPDIF
11SPDIF
TO
DIGITAL
SIGNAL
IC901
(AUDIO D/A CONVERTER)
PROCESS
BLOCK
DIAGRAM
AUDIO D/A
768
CONVERTER
435
IC902
(AUDIO A/D CONVERTER)
101112
AUDIO A/D
CONVERTER
15
DVD MAIN CBA
BCK
DATA
LRCKMDMC
SCK2MS
LRCK
BCK
DATA
SYSCLK
1-11-7E970SBLAS
Page 33
Hi-Fi Audio Block Diagram
TO AUDIO
INPUT/OUTPUT
SELECT
BLOCK DIAGRAM
TO
SERVO/ SYSTEM
CONTROL BLOCK
DIAGRAM
Hi-Fi
AUDIO(R)
HEAD
Hi-Fi
AUDIO(L)
HEAD
CYLINDER ASSEMBLY
REC-AUDIO SIGNALPB-AUDIO SIGNALMode : SP/REC
PB/EE-AUDIO(L)
PB/EE-AUDIO(R)
IIC-BUS SCL
IIC-BUS SDA
37
38
SERIAL
DATA
DECODER
R-CH
BPF
COMP
SW
NOISE
P
A-MODE
Hi-Fi-H-SW
767774
MUTE-ON
LPF
VCO
LIMDEV
R
OUTPUT
MUTE-ON
SELECT
39
73
HOLD
(DECK ASSEMBLY)
AUDIO-MUTE-2
75
26
53
COMP
MIX
PULSE
NOISE
DET
Q451
21
ENV
LPF
VCO
LIMDEV
DET
R
DO
7
CN251
AUDIO(R)
Hi-Fi-
24
R
DET
P
Hi-Fi-COM 8
34 33
LIM
L-CH
SW
9
AUDIO(L)
Hi-Fi-
27
L
BPF
COMP
NOISE
MAIN CBA
IC451 ( Hi-Fi AUDIO PROCESS)
R-CH
PNR
DVD-AUDIO(R)
(DVD VCR DUBBING)
47
48
R-CH
INSEL
50
52
VCR-AUDIO(R)
DVD-AUDIO(L)
VCR-AUDIO(L)
TO AUDIO
INPUT/OUTPUT
SELECT
BLOCK DIAGRAM
6
14
L-CH
4
15
INSEL
L-CH
PNR
NOR
SW
78
80
N-A-REC
N-A-PB
TO AUDIO
BLOCK DIAGRAM
1-11-8
E970SBLH
Page 34
Power Supply Block Diagram
P-ON-H
P-ON+44V
SW+44V
Q1516,Q1517
CAUTION !
Fixed voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown , check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
P-ON+15V
<TO PIN 75 OF IC501>
AL+12V
P-ON-DECK+5V
SW+5V
Q1542
Q1515
P-ON+9V
SW+9V
AL+5V
Q1518
P-ON+5V
Q1513
SW+5V
P-DOWN-H
TIMER+5V
<TO PIN 32 OF IC501>
SW+5V
Q1512
MAIN CBAPOWER SUPPLY CBA
13588
135
CN051A
10
10
19
121416
1214161918
18
C-POW-SW
AL+16V/+12V
<TO PIN 84 OF IC501>
IC1504
SW+16V
Q1508,Q1509
CN1501
+2.5V REG.
IC1505
+3.3V REG.
P-ON+2.5V
4-6 EV+10.5V
20-22
14-17 EV+2.4V
P-ON+3.3V
P-ON+5V
25-27
11-13
DVD P-ON+3.3V
SW+5V
Q1510
Q1519
EV+5V
DVD-P-ON+5V
DVD P-ON+12V
-FL
SW+12V
Q1511,Q1514
FAN
GND
1 FAN+12V
2
Q1501
CN1503
Q1502
FAN CONT1
<TO PIN 11 OF IC501>
F2
F1
REG-CONT
<TO PIN 42 OF IC501>
JUNCTION
CBA
CL051ACL051BCN1504
NOTE:
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
T0011
D1001 - D1004
L1003
8
5
10
AL+5V
8
19
RECTIFIER
FILTER
AL+16V
10
1 AL+44V13 AL+12V35 FAN AL+12V
20
2
BRIDGE
LINE
2
469
8
4 AL+2.4V
6 AL+4V
12
9F18
F2
Q1004
11
IC1001
ERROR
8
VOLTAGE DET
1
4
23
2 AL-30V
CL052ACL052B
18
17
16
15
14
13
4
7
HOTCOLD
Q1001
Q1003
Q1008
CAUTION !
For continued protection against fire hazard,
HOT CIRCUIT. BE CAREFUL.
replace only with the same type fuse.
F1001
T1.6A L 250V
AC1001
1-11-9
E970SBLP
Page 35
SCHEMATIC DIAGRAMS / CBA’S AND TEST POINTS
Standard Notes
WARNING
Many electrical and mechanical parts in this chassis
have special characteristics. These characteris tics
often pass unnoticed and the protection afforded by
them cannot necessarily be obtained by using
replacement components rated for higher voltage,
wattage, etc. Replacement parts that have these
special safety characteristics are identified in this
manual and its supplements; electrical components
having such features are identified by the mark " ! "
in the schematic diagram and the parts list. Before
replacing any of these components, read the parts list
in this manual carefully. The use of substitute
replacement parts that do not have the same safety
characteristics as specified in the parts list may create
shock, fire, or other hazards.
Notes:
1. Do not use the part number shown on these
drawings for ordering. The correct part number is
shown in the parts list, and may be slightly different
or amended since these drawings were prepared.
2. All resistance values are indicated in ohms
3
(K=10
3. Resistor wattages are 1/4W or 1/6W unless
otherwise specified.
4. All capacitance values are indicated in µF
(P=10
5. All voltages are DC voltages unless otherwise
specified.
6. Electrical parts such as capacitors, connectors,
diodes, IC’s, transistors, resistors, switches, and
fuses are identified by four digits. The first two
digits are not shown for each component. In each
block of the diagram, there is a note such as shown
below to indicate these abbreviated two digits.
, M=106).
-6
µF).
1-12-1W2P_SC
Page 36
LIST OF CAUTION, NOTES, AND SYMBOLS USED IN THE SCHEMATIC DIAGRAMS ON
THE FOLLOWING PAGES:
1. CAUTION:
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH THE SAME TYPE FUSE.
2. CAUTION:
Fixed Voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown, first check to see that all components in the power supply circuit are not
defective before you connect the AC plug to the AC power supply. Otherwise it may cause some components
in the power supply circuit to fail.
3. Note:
1. Do not use the part number shown on the drawings for ordering. The correct part number is shown in the
parts list, and may be slightly different or amended since the drawings were prepared.
2. To maintain original function and reliability of repaired units, use only original replacement parts which are
listed with their part numbers in the parts list section of the service manual.
4. Voltage indications for PLAY and REC modes on the schematics are as shown below:
< DVD Section >
231
5.0
The same voltage for
both PLAY & STOP modes
5.0
(2.5)
Indicates that the voltage
is not consistent here.
5. How to read converged lines
1-D3
Distinction Area
Line Number
(1 to 3 digits)
Examples:
1. "1-D3" means that line number "1" goes to the line number
"1" of the area "D3".
2. "1-B1" means that line number "1" goes to the line number
"1" of the area "B1".
6. Test Point Information
: Indicates a test point with a jumper wire across a hole in the PCB.
: Used to indicate a test point with a component lead on foil side.
: Used to indicate a test point with no test pin.
PLAY mode
STOP mode
< VCR Section >
5.0
The same voltage for
both PLAY, REC & DVD
modes
5.0
(2.5)
< >
PLAY mode
REC mode
DVD mode
231
Indicates that the voltage
is not consistent here.
3
AREA D3
2
1
AREA B1
1-D3
ABCD
Unit: Volts
1-B1
: Used to indicate a test point with a test pin.
1-12-2W2P_SC
Page 37
Main 1/10 Schematic Diagram < VCR Section >
1-12-3
E970SSCM1
Page 38
7G6G5G4G3G2G1G
a
b
c
d
e
f
g
c
d
e
f
gg
c
d
e
f
g
c
d
e
f
g
c
d
e
f
g
c
d
e
f
g
hh
i
ababababa
b
FL601 MATRIX CHART
REPEAT
PM
REC
VCD VCRDVD
R
XP
SP
LP
EP
SLP
P.SCAN
SEP
W
CD
T
C
Main 2/10, Power SW, Function & Sensor Schematic Diagram < VCR Section >
7G
6G
5G4G3G2G1G
VCD VCR
REC
PM
REPEAT
CD
TC
h
g
h
c
DVD
a
d
g
R
XP SP
b
LP EP
SLP
ef
P.SCAN
W
SEP
1-12-4
E970SSCM2
Page 39
Main 3/10 Schematic Diagram < VCR Section >
1-12-5
E970SSCM3
Page 40
Main 4/10 Schematic Diagram < VCR Section >
1-12-6
E970SSCM4
Page 41
Main 5/10 Schematic Diagram < VCR Section >
1-12-7
E970SSCM5
Page 42
Main 6/10 & Front Jack Schematic Diagram < VCR Section >
1-12-8
E970SSCM6
Page 43
Main 7/10 Schematic Diagram < VCR Section >
1-12-9
E970SSCM7
Page 44
Main 8/10 Schematic Diagram < VCR Section >
1-12-10
E970SSCM8
Page 45
Main 9/10 Schematic Diagram < VCR Section >
1-12-11
E970SSCM9
Page 46
Main 10/10 Schematic Diagram < VCR Section >
1-12-12
E970SSCM10
Page 47
Power Supply & Junction Schematic Diagram < VCR Section >
CAUTION !
Fixed voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown , check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE:
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
1-12-13
E970SSCP
Page 48
Rear Jack Schematic Diagram < VCR Section >
1-12-14
E970SSCRJ
Page 49
AFV Schematic Diagram < VCR Section >
1-12-15
E970SSCAFV
Page 50
DVD Main 1/6 Schematic Diagram < DVD Section >
1-12-16
E970SSCD1
Page 51
DVD Main 2/6 Schematic Diagram < DVD Section >
1-12-17
E970SSCD2
Page 52
DVD Main 3/6 Schematic Diagram < DVD Section >
1-12-18
E970SSCD3
Page 53
DVD Main 4/6 Schematic Diagram < DVD Section >
NOTE:
1. The order of pins shown in this diagram is different from that of actual IC601.
2. IC601 is divided into six and shown as IC601 (1/6) ~ IC601 (6/6) in this DVD Main Schematic Diagram Section.
1-12-19
E970SSCD4
Page 54
DVD Main 5/6 Schematic Diagram < DVD Section >
NOTE:
1. The order of pins shown in this diagram is different from that of actual IC601.
2. IC601 is divided into six and shown as IC601 (1/6) ~ IC601 (6/6) in this DVD Main Schematic Diagram Section.
1-12-20
E970SSCD5
Page 55
DVD Main 6/6 Schematic Diagram < DVD Section >
NOTE:
1. The order of pins shown in this diagram is different from that of actual IC601.
2. IC601 is divided into six and shown as IC601 (1/6) ~ IC601 (6/6) in this DVD Main Schematic Diagram Section.
1-12-21
E970SSCD6
Page 56
Main CBA Top View
WF3
J236
JK1-V-OUT
Sensor CBA Top View
TO SENSOR CBA
(END-SENSOR)
BHF300F01012A
TO SENSOR CBA
(START-SENSOR)
BHF300F01012B
WF2
TP301
C-PB
VR501
SW-P
TP503
CTL
WF1
TP504
RF-SW
1-12-22
TP501
S-INH
BE9700F01015A
Page 57
Main CBA Bottom View
WF9
PIN 6 OF
IC1515
WF10
PIN 1 OF
CN1501
WF4
PIN 3 OF
IC1502
WF5
PIN 5 OF
CN1502
WF6
PIN 7 OF
CN1502
WF7
PIN 9 OF
CN1502
WF8
PIN 17 OF
CN1502
1-12-23
BE9700F01015A
Page 58
BE9700F01015B
Function CBA Top View Function CBA Bottom ViewPower SW CBA Top View Power SW CBA Bottom View
Front Jack CBA Top View Front Jack CBA Bottom View
BE9700F01015C
BE9700F01015D
1-12-24
Page 59
Power Supply CBA Top View
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE:
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
CAUTION !
Fixed voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown , check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
Because a hot chassis ground is present in the power
supply circut, an isolation transformer must be used.
Also, in order to have the ability to increase the input
slowly, when troubleshooting this type power supply
circuit, a variable isolation transformer is required.
1-12-25
BE9700F01022A
Page 60
Power Supply CBA Bottom View
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE:
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
CAUTION !
Fixed voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown , check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
Because a hot chassis ground is present in the power
supply circut, an isolation transformer must be used.
Also, in order to have the ability to increase the input
slowly, when troubleshooting this type power supply
circuit, a variable isolation transformer is required.
2SA966-Y(TE6 F M)
2SA1015-GR(TE2 F T)
2SA1020-Y(TE6 F M)
2SC1815-(BL,GR,Y)(TE2 F T)
2SC2120-Y(TE2 F T)
2SC3266-Y(TPE2 F)
KTA1273-Y-AT/P
KTA1281Y-AT/P
KTC3198-(GR,Y)-AT/P
KTC3203-Y-AT/P
KTC3205-Y-AT/P
E C B
EL817(A,B,C)
LTV-817(B,C)-F
PS2561A-1(Q,W)
1
2
4
3
CD4053BCSJX
CD4053BNSR
TC4053BF(EL N F)
CD4052BPWR
BU4053BCF-E2
CD4053BCSJX_NL
A: Anode
K: Cathode
E: Emitter
C: Collector
B: Base
12
100
31
R: Reference
S: Source
1
11
1
30
G: Gate
D: Drain
1-16-1E970SLE
Page 69
Cabinet
EXPLODED VIEWS
2L065
AFV CBA
Sensor CBA
2L033
POWR SW CBA
JW001
2L052
Main CBA
2L071
1B1
2L022
2L054
FUNCTION CBA
2L017
2L071
2L033
2B46
2L030
2B1
2B16
RM1501
2L017
2B17
JW002
2L017
2L017
2L071
JW2002
2L021
2L071
2L011
2B60
JW2001
2L033
B
2L017
Rear Jack CBA
2L033
A
2L033
JW103
C
2L011
2L045
Sensor CBA
2B31
A2
2B2
2L045
A34
2B14
2B19
2L011
2L013
Power Supply CBA
2L011
Junction CBA
2L043
F1001
2L043
JW1001
JW102
2B3
See Electrical Parts List
for parts with this mark.
2L011
JW1002
JW101
A'
B'
2L111
D'
2L110
A3
2B20
2L019
E'
FM1001
2L043
2B18
2L060
2L111
2L043
2B9
2L060
2L081
A4
2B10
E
2L110
2B9
DVD Mechanism &
DVD Main CBA Assembly
2L015
2L015
2B4
2L018
2L082
D
2L062
A10
2L083
2L044
2L100
2L081
2L044
2L044
A14
2L081
A1X
2B11
C'
2L014
2L061
2B13
Front Jack CBA
2B59
A34
1-17-1E970SCEX
Page 70
Packing
X1
S2
S3
S2
X3
X2
X9
X22
X20
X4
S2
S2
X6
S12
Shipping
Mark
Label
A14
S1
1-17-2E970SPEX
Page 71
MECHANICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a
! have special characteristics important to safety.
Before replacing any of these components, read
carefully the product safety notice in this service
manual. Don't degrade the safety of the product
through improper servicing.
NOTE: Parts that are not assigned part numbers
(---------) are not available.
RF CABLE CC1001020012010WPZ0122LW001
X4ACCESSORY BAG E5700UD0VM415576
X621P CABLE(BYR SUPPL Y) H9300ED0VMN03276
X9REMOCON BAG E9704ED1VM422101
X20!OWNERS MANUAL(FRE) E 9702FD1VMN20806A
X22QUICK GUIDE(FRE) E9702FD1VMN20807A
200601191-18-1E970SCA
Page 72
ELECTRICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a
! have special characteristics important to safety.
Before replacing any of these components, read
carefully the product safety notice in this service
manual. Don't degrade the safety of the product
through improper servicing.
NOTES:
1. Parts that are not assigned part numbers (---------)
are not available.
2. Tolerance of Capacitors and Resistors are noted
with the following symbols.
C.....±0.25%D.....±0.5%F.....±1%
G.....±2%J......±5%K.....±10%
M.....±20%N.....±30%Z.....+80/-20%
DVD MECHANISM & D VD MAIN CBA
ASSEMBLY
Ref. No.DescriptionPart No.
DVD MECHANISM & D VD MAIN CBA
ASSEMBL Y
N7RGCBFN
MCV CBA
Ref. No.DescriptionPart No.
MCV CBA
Consists of the following:
MAIN CBA (MCV-A )
POWER SW CBA (MCV-B)
FUNCTION CBA (MCV-C)
FRONT JACK CBA (MCV -D)
SENSOR CBA
MAIN CBA
Ref. No.DescriptionPart No.
MAIN CBA (MCV-A )
Consists of the following:
CAPACITORS
C251ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMAVSL100
ALUMINUM ELECTROL YT IC CAP 10µF/16V H7 CE1CMAV SM100
C252CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C253CHIP CERAMIC CAP .(1608) B K 1000pF/50VCHD1JK30B102
C254ELECTROLYTIC CAP. 1µF/50V M H7 orCE1JMA VSL1 R0
ALUMINUM ELECTROL YT IC CAP 1µF/50V H7 CE1JMAVSM1R 0
C301CHIP CERAMIC CAP . CH J 150pF/50VCHD1JJ3CH151
C302ELECTROLYTIC CAP. 1µF/50V M H7 orCE1JMA VSL1 R0
ALUMINUM ELECTROL YT IC CAP 1µF/50V H7 CE1JMAVSM1R 0
C303CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C305ELECTROLYTIC CAP. 1µF/50V M H7 orCE1JMA VSL1 R0
ALUMINUM ELECTROL YT IC CAP 1µF/50V H7 CE1JMAVSM1R 0
C306CHIP CERAMIC CAP .(1608) B K 0.047µF/50V or CHD1JK 30B47 3
CHIP CERAMIC CAP .(1608) B K 0.047µF/25VCHD1EK30B473
C307CHIP CERAMIC CAP .(1608) B K 0.022µF/50V or CHD1JK 30B22 3
CHIP CERAMIC CAP .(1608) B K 0.022µF/25VCHD1EK30B223
C308CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C311CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C312ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMAVSL100
ALUMINUM ELECTROL YT IC CAP 10µF/16V H7 CE1CMAV SM100
1VSA12966
----------
----------
----------
---------1VSA13519
----------
Ref. No.DescriptionPart No.
C313ELECTROLYTIC CAP. 1µF/50V M H7 orCE1JMASSL1R0
ELECTROLYTIC CAP . 1µF/50V M H7CE1JMASSM1R0
C314CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C315CHIP CERAMIC CAP.(1608) B K 0.047µF/50V or CHD1JK30B473
CHIP CERAMIC CAP.(1608) B K 0.047µF/25VCHD1EK30B473
C316ELECTROLYTIC CAP. 1µF/50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROLYTIC CAP 1µF/50V H7 CE1JMAVSM1R0
C317CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C322CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C324CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C325CHIP CERAMIC CAP. B K 8200pF/50VCHD1JK30B822
C326CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C327ELECTROLYTIC CAP. 220µF/6.3V M H7 orCE0KMAVSL221
ALUMINUM ELECTROLYTIC CAP 220µF/6.3V H7CE0KMAVSM221
C328ELECTROLYTIC CAP. 47µF/6.3V M H7 orCE0KMAVSL470
ALUMINUM ELECTROLYTIC CAP 47µF/6.3V H7CE0KMAVSM470
C329CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C331ELECTROLYTIC CAP. 220µF/6.3V M H7 orCE0KMAVSL221
ALUMINUM ELECTROLYTIC CAP 220µF/6.3V H7CE0KMAVSM221
C333CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C334ELECTROLYTIC CAP. 1µF/50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROLYTIC CAP 100µF/6.3V H7CE0KMAVSM101
C336CHIP CERAMIC CAP . CH J 220pF/50VCHD1JJ3CH221
C337CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C339CHIP CERAMIC CAP . CH J 120pF/50VCHD1JJ3CH121
C340ELECTROLYTIC CAP. 1µF/50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROLYTIC CAP 1µF/50V H7 CE1JMAVSM1R0
C341CHIP CERAMIC CAP.(1608) CH D 10pF/50VCHD1JD3CH100
C342CHIP CERAMIC CAP.(1608) CH J 1000pF/50V CHD1JJ3CH102
C343ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMAVSL100
ALUMINUM ELECTROLYTIC CAP 10µF/16V H7 CE1CMA VSM100
C344ELECTROLYTIC CAP. 4.7µF/25V M NP H7 orCP1EMAVSB4R7
ELECTROLYTIC CAP . 4. 7µF/25V NPCP1EMAVSC4R7
C345ELECTROLYTIC CAP. 0.47µF/50V M H7 orCE1JMAVSLR47
ALUMINUM ELECTROLYTIC CAP 0.47µF/50V H7CE1JMAVSMR47
C346CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C347CHIP CERAMIC CAP.(1608) B K 0.1µF/25V orCHD1EK30B104
CHIP CERAMIC CAP.(1608) B K 0.1µF/16VCHD1CK30B104
C349ELECTROLYTIC CAP. 0.47µF/50V M H7 orCE1JMAVSLR47
ALUMINUM ELECTROLYTIC CAP 0.47µF/50V H7CE1JMAVSMR47
C350CERAMIC CAP.(AX) F Z 0.1µF/50VCCA1JZTFZ104
C370CERAMIC CAP.(AX) Y M 0.01µF/16VCCA1CMT0Y103
C371CHIP CERAMIC CAP.(1608) B K 0.022µF/50V or CHD1JK30B223
CHIP CERAMIC CAP.(1608) B K 0.022µF/25VCHD1EK30B223
C372CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C373CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C374CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C375CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
200601191-19-1E970SEL
Page 73
Ref. No.DescriptionPart No.
C376CHIP CERAMIC CAP .(1608) B K 0.022µF/50V or CHD1JK 30B22 3
CHIP CERAMIC CAP .(1608) B K 0.022µF/25VCHD1EK30B223
C377CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C378CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C379ELECTROLYTIC CAP. 0.47µF/50V M H7 orCE1JMAVSLR47
ALUMINUM ELECTROL YT IC CAP 0.47µF/50V H7CE1JMA VS MR47
C381CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C382CHIP CERAMIC CAP . B K 2200pF/50VCHD1JK30B222
C383CHIP CERAMIC CAP . B K 2200pF/50VCHD1JK30B222
C384ELECTROLYTIC CAP. 2.2µF/50V M H7 orCE1JMAVSL2R2
ALUMINUM ELECTROL YT IC CAP 2.2µF/50V H7CE1JMA VS M2R2
C402FILM CAP.(P) 0.018µF/50V J orCMA1JJP00183
FILM CAP.(P) 0.018µF/50V JCA1J183MS029
C403CERAMIC CAP. B K 470pF/100VCCD2AKS0B471
C404ELECTROLYTIC CAP. 220µF/6.3V M H7 orCE0KMASSL221
ELECTROLYTIC CAP. 220µF/6.3V M H7CE0KMASSM221
C405ELECTROLYTIC CAP. 47µF/6.3V M H7 orCE0KMAVSL470
ALUMINUM ELECTROL YT IC CAP 47µF/6.3V H7CE0KMAVSM470
Ref. No.DescriptionPart No.
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C467CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C468ELECTROLYTIC CAP. 220µF/6.3V M H7 orCE0KMAVSL221
ALUMINUM ELECTROLYTIC CAP 220µF/6.3V H7CE0KMAVSM221
C469ELECTROLYTIC CAP. 22µF/10V M H7 orCE1AMAVSL220
ALUMINUM ELECTROLYTIC CAP 22µF/10V H7 CE1AMA VSM220
C470CHIP CERAMIC CAP.(1608) B K 4700pF/50VCHD1JK30B472
C471CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C472ELECTROLYTIC CAP. 4.7µF/25V M H7 orCE1EMAVSL4R7
ALUMINUM ELECTROLYTIC CAP 4.7µF/25V H7CE1EMAVSM4R7
C473ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMAVSL100
ALUMINUM ELECTROLYTIC CAP 10µF/16V H7 CE1CMA VSM100
C474CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C475CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C476ELECTROLYTIC CAP. 22µF/6.3V M H7 orCE0KMAVSL220
ALUMINUM ELECTROLYTIC CAP 22µF/6.3V H7CE0KMAVSM220
C407CHIP CERAMIC CAP .(1608) B K 1000pF/50VCHD1JK30B102
C408CHIP CERAMIC CAP . B K 1800pF/50VCHD1JK30B182
C409CHIP CERAMIC CAP .(1608) CH J 33pF/50VCHD1JJ3CH330
C410ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMAVSL100
ALUMINUM ELECTROL YT IC CAP 10µF/16V H7 CE1CMAV SM100
C411CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C412ELECTROLYTIC CAP. 33µF/6.3V M H7 orCE0KMAVSL330
ALUMINUM ELECTROL YT IC CAP 33µF/6.3V H7CE0KMAVSM330
C413CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C414CHIP CERAMIC CAP .(1608) B K 0.022µF/50V or CHD1JK 30B22 3
CHIP CERAMIC CAP .(1608) B K 0.022µF/25VCHD1EK30B223
C415ELECTROLYTIC CAP. 4.7µF/25V M H7 orCE1EMAVSL4R7
ALUMINUM ELECTROL YT IC CAP 4.7µF/25V H7CE1EMAVSM4R7
C416CHIP CERAMIC CAP .(1608) B K 4700pF/50VCHD1JK30B472
C417ELECTROLYTIC CAP. 22µF/6.3V M H7 orCE0KMAVSL220
ALUMINUM ELECTROL YT IC CAP 22µF/6.3V H7CE0KMAVSM220
C418CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C419CHIP CERAMIC CAP . CH J 220pF/50VCHD1JJ3CH221
C421ELECTROLYTIC CAP. 47µF/6.3V M H7 orCE0KMAVSL470
ALUMINUM ELECTROL YT IC CAP 47µF/6.3V H7CE0KMAVSM470
C452ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMAVSL100
ALUMINUM ELECTROL YT IC CAP 10µF/16V H7 CE1CMAV SM100
C453ELECTROLYTIC CAP. 22µF/10V M H7 orCE1AMAVSL220
ALUMINUM ELECTROL YT IC CAP 22µF/10V H7 CE1AMAVSM220
C454CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C455CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C456ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMAVSL100
ALUMINUM ELECTROL YT IC CAP 10µF/16V H7 CE1CMAV SM100
C457ELECTROLYTIC CAP. 4.7µF/25V M H7 orCE1EMAVSL4R7
ALUMINUM ELECTROL YT IC CAP 4.7µF/25V H7CE1EMAVSM4R7
C458CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C461CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C462CHIP CERAMIC CAP .(1608) B K 4700pF/50VCHD1JK30B472
C463ELECTROLYTIC CAP. 22µF/10V M H7 orCE1AMAVSL220
ALUMINUM ELECTROL YT IC CAP 22µF/10V H7 CE1AMAVSM220
C464CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C465ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMAVSL100
ALUMINUM ELECTROL YT IC CAP 10µF/16V H7 CE1CMAV SM100
C466CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
C478CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C479ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMAVSL100
ALUMINUM ELECTROLYTIC CAP 10µF/16V H7 CE1CMA VSM100
C480ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMA V SL100
ALUMINUM ELECTROLYTIC CAP 10µF/16V H7 CE1CMA VSM100
C481ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMA V SL100
ALUMINUM ELECTROLYTIC CAP 10µF/16V H7 CE1CMA VSM100
C482CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C483ELECTROLYTIC CAP. 4.7µF/25V M H7 orCE1EMAVSL4R7
ALUMINUM ELECTROLYTIC CAP 4.7µF/25V H7CE1EMAVSM4R7
C484ELECTROLYTIC CAP. 4.7µF/25V M H7 orCE1EMAVSL4R7
ALUMINUM ELECTROLYTIC CAP 4.7µF/25V H7CE1EMAVSM4R7
C485ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMAVSL100
ALUMINUM ELECTROLYTIC CAP 10µF/16V H7 CE1CMA VSM100
C486CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C487ELECTROLYTIC CAP. 47µF/16V M H7 orCE1CMAVSL470
ALUMINUM ELECTROLYTIC CAP 47µF/16V H7 CE1CMA VSM470
C488CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C502CHIP CERAMIC CAP.(1608) B K 0.022µF/50V or CHD1JK30B223
CHIP CERAMIC CAP.(1608) B K 0.022µF/25VCHD1EK30B223
C505CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C506ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP 1µF/50V MCE1JMASTM1R0
C507CHIP CERAMIC CAP.(1608) B K 1000pF/50VCHD1JK30B102
C508CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C509CHIP CERAMIC CAP.(1608) B K 1000pF/50VCHD1JK30B102
C510CHIP CERAMIC CAP.(1608) B K 4700pF/50VCHD1JK30B472
C511CHIP CERAMIC CAP.(1608) CH J 100pF/50VCHD1JJ3CH101
C512CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C514CHIP CERAMIC CAP. B K 330pF/50VCHD1JK30B331
C515CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C516ELECTROLYTIC CAP. 22µF/6.3V M H7 orCE0KMAVSL220
ALUMINUM ELECTROLYTIC CAP 22µF/6.3V H7CE0KMAVSM220
C517CERAMIC CAP.(AX) F Z 0.022µF/25VCCA1EZTFZ223
C518ELECTROLYTIC CAP. 22µF/6.3V M H7 orCE0KMAVSL220
ALUMINUM ELECTROLYTIC CAP 22µF/6.3V H7CE0KMAVSM220
C519CHIP CERAMIC CAP . CH J 560pF/50VCHD1JJ3CH561
C521ELECTROLYTIC CAP. 22µF/6.3V M H7 orCE0KMAVSL220
200601191-19-2E970SEL
Page 74
Ref. No.DescriptionPart No.
ALUMINUM ELECTROL YT IC CAP 22µF/6.3V H7CE0KMAVSM220
C522CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C524CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C527CERAMIC CAP.(AX) B K 100pF/50VCCA1JKT0B101
C531CHIP CERAMIC CAP .(1608) B K 4700pF/50VCHD1JK30B472
C533CHIP CERAMIC CAP .(1608) B K 0.047µF/50V or CHD1JK 30B47 3
CHIP CERAMIC CAP .(1608) B K 0.047µF/25VCHD1EK30B473
C534ELECTROLYTIC CAP. 47µF/6.3V M H7 orCE0KMAVSL470
ALUMINUM ELECTROL YT IC CAP 47µF/6.3V H7CE0KMAVSM470
C535CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C536CHIP CERAMIC CAP . CH J 560pF/50VCHD1JJ3CH561
C538CHIP CERAMIC CAP . CH J 180pF/50VCHD1JJ3CH181
C539CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C540CHIP CERAMIC CAP .(1608) B K 4700pF/50VCHD1JK30B472
C541CHIP CERAMIC CAP . CH J 18pF/50VCHD1JJ3CH180
C542CHIP CERAMIC CAP . CH J 18pF/50VCHD1JJ3CH180
C543CHIP CERAMIC CAP .(1608) CH J 22pF/50VCHD1JJ3CH220
C544CHIP CERAMIC CAP .(1608) CH J 22pF/50VCHD1JJ3CH220
C545CHIP CERAMIC CAP .(1608) CH J 22pF/50VCHD1JJ3CH220
C546CHIP CERAMIC CAP .(1608) CH J 22pF/50VCHD1JJ3CH220
C547CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C548CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C549ELECTROLYTIC CAP. 1µF/50V M H7 orCE1JMA VSL1 R0
ALUMINUM ELECTROL YT IC CAP 1µF/50V H7 CE1JMAVSM1R 0
C550ELECTROLYTIC CAP. 100µF/6.3V H7 orCE0KMAVSL1 01
ALUMINUM ELECTROL YT IC CAP 100µF/6.3V H7CE0KMAVSM101
C553ELECTROLYTIC CAP. 22µF/10V M H7 orCE1AMAVSL220
ALUMINUM ELECTROL YT IC CAP 22µF/10V H7 CE1AMAVSM220
C554ELECTROLYTIC CAP. 100µF/6.3V H7 orCE0KMAVSL1 01
ALUMINUM ELECTROL YT IC CAP 100µF/6.3V H7CE0KMAVSM101
C555CHIP CERAMIC CAP .(1608) B K 0.1µF/25V orCHD1EK30B104
CHIP CERAMIC CAP .(1608) B K 0.1µF/16VCHD1CK30B104
C560CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C611ELECTROLYTIC CAP. 22µF/50V M H7 orCE1JMASSL220
ALUMINUM ELECTROL YT IC CAP 22µF/50V H7 CE1JMASSM220
C612CHIP CERAMIC CAP .(1608) B K 4700pF/50VCHD1JK30B472
C614CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C615ELECTROLYTIC CAP. 100µF/6.3V H7 orCE0KMAVSL1 01
ALUMINUM ELECTROL YT IC CAP 100µF/6.3V H7CE0KMAVSM101
C616CHIP CERAMIC CAP .(1608) B K 1000pF/50VCHD1JK30B102
C1500ELECTROLYTIC CAP. 47µF/16V M H7 orCE 1CMA V SL470
ALUMINUM ELECTROL YT IC CAP 47µF/16V H7 CE1CMAV SM470
C1502ELECTROLYTIC CAP. 47µF/6.3V M orCE0KMASDL4 70
ELECTROLYTIC CAP. 47µF/6.3V MCE0KMASTM470
C1503CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C1504ELECTROLYTIC CAP. 10µF/16V M H7 orCE 1CMA V SL100
ALUMINUM ELECTROL YT IC CAP 10µF/16V H7 CE1CMAV SM100
C1505ELECTROLYTIC CAP. 10µF/16V M H7 orCE 1CMA V SL100
ALUMINUM ELECTROL YT IC CAP 10µF/16V H7 CE1CMAV SM100
C1506ELECTROLYTIC CAP. 47µF/16V M orCE1CMASDL470
ALUMINUM ELECTROL YT IC CAP 47µF/16V M CE1CMASTM470
C1507ELECTROLYTIC CAP. 10µF/16V M orCE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTM100
C1508CERAMIC CAP.(AX) B K 0.1µF/25VCCA1EKT0B104
C1509ELECTROLYTIC CAP. 10µF/16V M orCE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTM100
C1510ELECTROLYTIC CAP. 10µF/16V M orCE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTM100
C1511ELECTROLYTIC CAP. 220µF/16V M orCE1CMASDL221
ELECTROLYTIC CAP. 220µF/16V MCE1CMASTM221
Ref. No.DescriptionPart No.
C1512ELECTROLYTIC CAP . 10µF/16 V M H7 orCE1CMA VSL10 0
ALUMINUM ELECTROLYTIC CAP 10µF/16V H7 CE1CMA VSM100
C1513CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C1517ELECTROLYTIC CAP . 47µF/16V M orCE1CMASDL470
ALUMINUM ELECTROLYTIC CAP 47µF/16V M CE1CMASTM470
C1518CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C1519CHIP CERAMIC CAP. F Z 1µF/10VCHD1AZ30F105
C1520CHIP CERAMIC CAP. F Z 1µF/10VCHD1AZ30F105
C1521CHIP CERAMIC CAP. F Z 1µF/10VCHD1AZ30F105
C1524CHIP CERAMIC CAP.(1608) B K 0.1µF/25V orCHD1EK30B104
CHIP CERAMIC CAP.(1608) B K 0.1µF/16VCHD1CK30B104
C1525CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C1526CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C1527ELECTROLYTIC CAP . 47µF/25V M orCE1EMASDL470
ALUMINUM ELECTROLYTIC CAP 47µF/25V M CE1EMASTM470
C1528ELECTROLYTIC CAP . 100µF/16V M orCE1CMASDL101
ELECTROLYTIC CAP . 100µF/16V MCE1CMASTM101
C1529ELECTROLYTIC CAP . 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP . 470µF/6.3V MCE0KMASTM471
C1530ELECTROLYTIC CAP . 22µF/16V M orCE1CMASDL220
ALUMINUM ELECTROLYTIC CAP 22µF/16V M CE1CMASTM220
C1531ELECTROLYTIC CAP . 47µF/6.3V M orCE0KMASDL470
ELECTROLYTIC CAP . 47µF/6.3 V MCE0KMASTM470
C1532ELECTROLYTIC CAP . 10µF/16V M orCE1CMASDL100
ELECTROLYTIC CAP . 10µF/16V MCE1CMASTM100
C1533ELECTROLYTIC CAP . 100µF/6.3V M orCE0KMASDL101
ELECTROLYTIC CAP . 100µF/6.3V MCE0KMASTM101
C1534ELECTROLYTIC CAP . 100µF/6.3V M orCE0KMASDL101
ELECTROLYTIC CAP . 100µF/6.3V MCE0KMASTM101
C1535ELECTROLYTIC CAP . 10µF/16V M orCE1CMASDL100
ELECTROLYTIC CAP . 10µF/16V MCE1CMASTM100
C1536ELECTROLYTIC CAP . 10µF/16V M orCE1CMASDL100
ELECTROLYTIC CAP . 10µF/16V MCE1CMASTM100
C1537ELECTROLYTIC CAP . 220µF/6.3V M H7 orCE0KMASSL221
ELECTROLYTIC CAP . 220µF/6.3V M H7CE0KMASSM221
C1538CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C1539CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C1540CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C1541ELECTROLYTIC CAP . 100µF/6.3V M orCE0KMASDL101
ELECTROLYTIC CAP . 100µF/6.3V MCE0KMASTM101
C1542ELECTROLYTIC CAP . 100µF/16V M orCE1CMASDL101
ELECTROLYTIC CAP . 100µF/16V MCE1CMASTM101
C1543CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C1544ELECTROLYTIC CAP . 47µF/6.3V M H7 orCE0KMAVSL470
ALUMINUM ELECTROLYTIC CAP 47µF/6.3V H7CE0KMAVSM470
C1546CHIP CERAMIC CAP. F Z 0.01µF/50VCHD1JZ30F103
C1548CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C1549CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C1550ELECTROLYTIC CAP . 47µF/6.3V M orCE0KMASDL470
ELECTROLYTIC CAP . 47µF/6.3 V MCE0KMASTM470
C1552CHIP CERAMIC CAP. CH J 27pF/50VCHD1JJ3CH270
C1553CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C1554ELECTROLYTIC CAP . 10µF/16V M orCE1CMASDL100
ELECTROLYTIC CAP . 10µF/16V MCE1CMASTM100
C1555CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
200601191-19-3E970SEL
Page 75
Ref. No.DescriptionPart No.
C1556ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMAV SL100
ALUMINUM ELECTROL YT IC CAP 10µF/16V H7 CE1CMAV SM100
C1557ELECTROLYTIC CAP. 47µF/16V M orCE1CMASDL470
ALUMINUM ELECTROL YT IC CAP 47µF/16V M CE1CMASTM470
C1558CHIP CERAMIC CAP.(1608) CH J 100pF/50VCHD1JJ3CH101
C1560CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30 F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C1563ELECTROLYTIC CAP. 100µF/16V M orCE1CMASDL101
ELECTROLYTIC CAP. 100µF/16V MCE1CMASTM101
C1564CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30 F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C1565ELECTROLYTIC CAP. 100µF/6.3V M orCE0KMASD L101
ELECTROLYTIC CAP. 100µF/6.3V MCE0KMASTM1 01
C1566ELECTROLYTIC CAP. 10µF/16V M orCE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTM100
C1567ELECTROLYTIC CAP. 47µF/16V M orCE1CMASDL470
ALUMINUM ELECTROL YT IC CAP 47µF/16V M CE1CMASTM470
C1569ELECTROLYTIC CAP. 470µF/6.3V M orCE0KMASD L471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTM4 71
C1572ELECTROLYTIC CAP. 10µF/16V M orCE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTM100
C1573ELECTROLYTIC CAP. 10µF/16V M orCE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTM100
C1576CHIP CERAMIC CAP.(1608) CH J 270pF/50VCHD1JJ3CH271
C1577CHIP CERAMIC CAP.(1608) CH J 270pF/50VCHD1JJ3CH271
C1578CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C1580ELECTROLYTIC CAP. 22µF/16V M orCE1CMASDL220
ALUMINUM ELECTROL YT IC CAP 22µF/16V M CE1CMASTM220
C1581ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL1R 0
ELECTROLYTIC CAP 1µF/50V MCE1JMASTM1R0
C1585ELECTROLYTIC CAP. 100µF/6.3V M orCE0KMASD L101
ELECTROLYTIC CAP 1µF/50V MCE1JMASTM1R0
C1591ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL1R 0
ELECTROLYTIC CAP 1µF/50V MCE1JMASTM1R0
C1592CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C1594CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30 F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C1595ELECTROLYTIC CAP. 22µF/16V M orCE1CMASDL220
ALUMINUM ELECTROL YT IC CAP 22µF/16V M CE1CMASTM220
C1597CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C1598ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL1R 0
ELECTROLYTIC CAP 1µF/50V MCE1JMASTM1R0
C1599CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30 F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C1601ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMAV SL100
ALUMINUM ELECTROL YT IC CAP 10µF/16V H7 CE1CMAV SM100
C1602ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMAV SL100
ALUMINUM ELECTROL YT IC CAP 10µF/16V H7 CE1CMAV SM100
C1605ELECTROLYTIC CAP. 470µF/6.3V M orCE0KMASD L471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTM4 71
C1609CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30 F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C1612ELECTROLYTIC CAP. 100µF/6.3V M orCE0KMASD L101
ELECTROLYTIC CAP. 100µF/6.3V MCE0KMASTM1 01
C1617CHIP CERAMIC CAP.(1608) B K 0.1µF/25V orCHD1EK30B104
CHIP CERAMIC CAP .(1608) B K 0.1µF/16VCHD1CK30B104
C1618ELECTROLYTIC CAP. 470µF/6.3V M orCE0KMASD L471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTM4 71
C1619CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30 F104
Ref. No.DescriptionPart No.
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C1620CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C1626CHIP CERAMIC CAP. F Z 0.22µF/16VCHD1CZ30F224
C1627CHIP CERAMIC CAP. F Z 0.22µF/16VCHD1CZ30F224
C1628CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1629CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C1630CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C1631CHIP CERAMIC CAP.(1608) B K 1000pF/50VCHD1JK30B102
C1632CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1633CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C1634CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C1637ELECTROLYTIC CAP . 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP 1µF/50V MCE1JMASTM1R0
C1639CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1640CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1643ELECTROLYTIC CAP . 47µF/6.3V M orCE0KMASDL470
ELECTROLYTIC CAP . 47µF/6.3 V MCE0KMASTM470
C1648CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1649CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1652CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C1657ELECTROLYTIC CAP . 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP 1µF/50V MCE1JMASTM1R0
C1658CHIP CERAMIC CAP.(1608) B K 1000pF/50VCHD1JK30B102
C1659ELECTROLYTIC CAP . 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP 1µF/50V MCE1JMASTM1R0
C1660CHIP CERAMIC CAP.(1608) B K 1000pF/50VCHD1JK30B102
C1661ELECTROLYTIC CAP . 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP 1µF/50V MCE1JMASTM1R0
C1662ELECTROLYTIC CAP . 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP 1µF/50V MCE1JMASTM1R0
C1663CHIP CERAMIC CAP.(1608) B K 0.1µF/25V orCHD1EK30B104
CHIP CERAMIC CAP.(1608) B K 0.1µF/16VCHD1CK30B104
C1664ELECTROLYTIC CAP . 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP 1µF/50V MCE1JMASTM1R0
C1665CHIP CERAMIC CAP.(1608) B K 1000pF/50VCHD1JK30B102
C1671ELECTROLYTIC CAP . 4.7µF/25V M orCE1EMASDL4R7
ALUMINUM ELECTROLYTIC CAP 4.7µF/25V M CE1EMASTM4R7
C1672ELECTROLYTIC CAP . 4.7µF/25V M orCE1EMASDL4R7
ALUMINUM ELECTROLYTIC CAP 4.7µF/25V M CE1EMASTM4R7
C1673ELECTROLYTIC CAP . 47µF/16V M orCE1CMASDL470
ALUMINUM ELECTROLYTIC CAP 47µF/16V M CE1CMASTM470
C1675ELECTROLYTIC CAP . 47µF/25V M orCE1EMASDL470
ALUMINUM ELECTROLYTIC CAP 47µF/25V M CE1EMASTM470
C1681ELECTROLYTIC CAP . 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP 1µF/50V MCE1JMASTM1R0
C1684ELECTROLYTIC CAP . 4.7µF/25V M orCE1EMASDL4R7
ALUMINUM ELECTROLYTIC CAP 4.7µF/25V M CE1EMASTM4R7
C1685ELECTROLYTIC CAP . 4.7µF/25V M orCE1EMASDL4R7
ALUMINUM ELECTROLYTIC CAP 4.7µF/25V M CE1EMASTM4R7
C1686ELECTROLYTIC CAP . 4.7µF/25V M orCE1EMASDL4R7
ALUMINUM ELECTROLYTIC CAP 4.7µF/25V M CE1EMASTM4R7
C1687ELECTROLYTIC CAP . 4.7µF/25V M orCE1EMASDL4R7
ALUMINUM ELECTROLYTIC CAP 4.7µF/25V M CE1EMASTM4R7
C1688ELECTROLYTIC CAP . 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP 1µF/50V MCE1JMASTM1R0
C1689ELECTROLYTIC CAP . 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP 1µF/50V MCE1JMASTM1R0
C1691CHIP CERAMIC CAP.(1608) CH J 47pF/50VCHD1JJ3CH470
C1692ELECTROLYTIC CAP . 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP . 470µF/6.3V MCE0KMASTM471
C1693ELECTROLYTIC CAP . 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP . 470µF/6.3V MCE0KMASTM471
C1694CHIP CERAMIC CAP. F Z 1µF/10VCHD1AZ30F105
200601191-19-4E970SEL
Page 76
Ref. No.DescriptionPart No.
C1695ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL1R 0
ELECTROLYTIC CAP 1µF/50V MCE1JMASTM1R0
C1696ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL1R 0
ELECTROLYTIC CAP 1µF/50V MCE1JMASTM1R0
C1697ELECTROLYTIC CAP. 4.7µF/25V M orCE1EMASDL4R7
ALUMINUM ELECTROL YT IC CAP 4.7µF/25V M CE1EMASTM4R7
C1698ELECTROLYTIC CAP. 4.7µF/25V M orCE1EMASDL4R7
ALUMINUM ELECTROL YT IC CAP 4.7µF/25V M CE1EMASTM4R7
C1699CHIP CERAMIC CAP.(1608) CH J 47pF/50VCHD1JJ3CH470
C1700CHIP CERAMIC CAP. F Z 1µF/10VCHD1AZ30F105
C1701ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMAV SL100
ALUMINUM ELECTROL YT IC CAP 10µF/16V H7 CE1CMAV SM100
C1702ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMAV SL100
ALUMINUM ELECTROL YT IC CAP 10µF/16V H7 CE1CMAV SM100
CONNECTORS
CN1503PH CONNECTOR (WHITE) TOP 2P B2B-PH-K-
CN1504242 SERIE S CONNECT OR 224202 119W1J322C19TG001
CN1505FE CONNECTOR TOP 8P 08FE-BT-VK-NJCFEJ08JG001
CN1506AFV PCB ASSEMBL Y E9772AFVE9772AFV
SYSCON IC M3776AMCH-AD2GPQSZAB0RHT068
IC612VFD DRIVER IC PT6315(L)NSZBA0RG2009
IC1501IC(ANALOG SW) CD4052BPWRNSZBA0TTY142
IC1504V OL TAGE REGULA TOR PQ070XF01SZHQSZBA0SSH054
IC1505V OL TAGE REGULA TOR PQ070XF01SZHQSZBA0SSH054
IC1506IC OP AMP RC4580IPNSZBA0STY173
IC1507VIDEO SWITCH MM1697AJBEQSZBA0TMM150
IC1508IC SWITCH TC4053BF(EL N F) orQSZBA0TTS163
IC ANALOG MUL TIPLEXERS
CD4053BCSJX _NL or
IC ANALOG MUL TIPLEXER CD4053BNSRNSZBA0TTY093
IC1509IC SWITCH TC4053BF(EL N F) orQSZBA0TTS163
IC ANALOG MUL TIPLEXERS
CD4053BCSJX _NL or
IC ANALOG MUL TIPLEXER CD4053BNSRNSZBA0TTY093
IC1513IC OP AMP KIA4558P/P orNSZBA0SJY035
IC OP AMP RC4580IPNSZBA0STY173
IC1514DRIVER FOR DVD MM1637XVBEQSZBA0TMM102
IC1515DRIVER FOR DVD MM1636XWREQSZBA0TMM108
IC1518AV SWITCH MM1443XJBEQSZBA0TMM152
TRANSISTOR 2SC1815-GR(TE2 F T)QQS12SC1815F
Q401CHIP TRANSISTOR RN1511(TE85R.F)QQ2Z0RN1511F
Q403TRANSISTO R KTC3203-Y-AT/P orNQSYKTC3203P
TRANSISTOR 2SC2120-Y(TE2 F T)QQSY2SC2120F
Q404TRANSISTO R KTA-1266-GR-A T/P orNQS4KT A1266P
TRANSISTOR 2SA1015-GR(TE2 F T)QQS12SA1015F
Q405RES. BUILT-IN TRANSIST OR KRA103M-AT/PNQSZ0KRA103M
Q406CHIP TRANSIST OR KTC3875S-Y-RTK/PNQ1YKTC3875S
Q451TRANSISTO R KRC103S-RTK/PNQ1ZKRC103SP
Q506PHOTO TRANSIST OR P T204-6B -12 orNPWZT2046B12
PHOTO TRANSIST OR MID-32A22FNPWZ1D32A22F
Q513NPN TRANSISTOR KRC103M-AT/PNQSZKRC103MP
Q514TRANSISTO R KTC3199-BL-AT/P orNQS5KTC3199P
TRANSISTOR 2SC1815-BL(TE2 F T)QQS22SC1815F
Q515TRANSISTO R KTC3199-BL-AT/P orNQS5KTC3199P
ELECTROLYTIC CAP . 4700µF/6.3V SM orCE0KMZPDL472
ALUMINUM ELECTROL YT IC CAP 4700µF/6.3V MCE0KMZPTM472
C018ELECTROLYTIC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP . 470µF/6.3V MCE0KMASTM471
C020ELECTROLYTIC CAP. 22µF/50V M orCE1JMASDL220
ELECTROLYTIC CAP 22µF/50V MCE1JMASTM220
C022ELECTROLYTIC CAP. 470µF/35V M orCE1GMASDL471
ELECTROLYTIC CAP . 470µF/35V MCE1GMASTM471
C1001! MET ALIZED FILM CAP. 0.068µF/250V K orCT2E683DC011
!METALIZED FILM CAP . 0.068µF/250V K orCT2E683 DC014
!METALIZED FILM CAP . 0.068µF/250V MCT2E683MS037
C1004! ELECTROLYTIC CAP. 100µF/400V MCA2H101S6016
C1005! CERAMIC CAP. SL K 56pF/1KV orCCD3AKPSL560
!CERAMIC CAP. SL J 56pF/1KVCCD3AJPSL560
C1006! SAFTY CAP. 2200pF/250V orCCN2EMA0E222
!SAFETY CAP . 2200pF/250VCA2E222MR049
C1007ELECTROLYTIC CAP . 1000µF/6.3V M orCE0KMASDL102
ELECTROLYTIC CAP . 1000µF/6.3 V MCE0KMASTM102
C1013CERAMIC CAP .(AX) B J 1000pF/50VCCA1JJT0B102
C1018ELECTROLYTIC CAP . 100µF/10V M orCE1AMASDL101
ELECTROLYTIC CAP . 100µF/10V MCE1AMASTM101
C1021CERAMIC CAP.(AX) Y M 0.01µF/16VCCA1CMT0Y103
C1025CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C1029! CERAMIC CAP.(AX) X K 1800pF/16VCCA1CKT0X182
C1032ELECTROLYTIC CAP . 10µF/16V M orCE1CMASDL100
ELECTROLYTIC CAP . 10µF/16V MCE1CMASTM100
C1033CERAMIC CAP. YV Z 0.022µF/50VCCD1JZSYV223
C1035ELECTROLYTIC CAP . 3300µF/6.3V SL orCE0KMZADL332
ELECTROLYTIC CAP . 3300µF/6.3V SM orCE0KMZPDL332
ALUMINUM ELECTROL YT IC CAP 3300µF/6.3V MCE0KMZPTM332
C1036CERAMIC CAP. B K 470pF/500VCCD2JKP0B471
C1037ELECTROLYTIC CAP . 1000µF/16V M orCE1CMASDL102
1VSA12986
----------
----------
----------
----------
200601191-19-10E970SEL
Page 82
Ref. No.DescriptionPart No.
ALUMINUM ELECTROL YT IC CAP 1000µF/16V MCE1CMASTM102
C2003CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C2004CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C2005CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C2006CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C2007CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C2008CHIP CERAMIC CAP. B K 1000pF/50VCHD1JKB0B102
C2009ELECTROLYTIC CAP. 10µF/16V M orCE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTM100
C2010ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL1R 0
ELECTROLYTIC CAP 1µF/50V MCE1JMASTM1R0
C2011CHIP CERAMIC CAP. B K 1000pF/50VCHD1JKB0B102
C2012ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL1R 0
ELECTROLYTIC CAP 1µF/50V MCE1JMASTM1R0
C2013CHIP CERAMIC CAP. B K 1000pF/50VCHD1JKB0B102
CHIP CERAMIC CAP. CH D 3pF/50VCHD1JD3CH3R0
C8CHIP CERAMIC CAP. CH C 3pF/50V orCHD1JC3CH3R0
CHIP CERAMIC CAP. CJ C 3pF/50V orCHD1JC3CJ3R0
CHIP CERAMIC CAP. CH D 3pF/50VCHD1JD3CH3R0
C11CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C12ELECTROL YTIC CAP. 10µF/16V M H7 orCE1CMASSL100
ELECTROLYTIC CAP . 10µF/16V M H7CE1CMASSM100
C13CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C14CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C15ELECTROL YTIC CAP. 10µF/16V M H7 orCE1CMASSL100
ELECTROLYTIC CAP . 10µF/16V M H7CE1CMASSM100
C16ELECTROL YTIC CAP. 10µF/16V M H7 orCE1CMASSL100
ELECTROLYTIC CAP . 10µF/16V M H7CE1CMASSM100
C17CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C19CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C20ELECTROL YTIC CAP. 3.3µF/50V M H7 orCE1JMASSL3R3
ALUMINUM ELECTROLYTIC CAP 3.3µF/50V H7CE1JMASSM3R3
C21CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
1VSA13522
200601191-19-12E970SEL
Page 84
Ref. No.DescriptionPart No.
C22ELECTROL YTIC CAP. 10µF/16V M H7 orCE1CMASSL100
ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSM100
C23CHIP CERAMIC CAP . F Z 0.47µF/10V orCHD1AZ30F474
CHIP CERAMIC CAP . F Z 0.47µF/16VCHD1CZ30F474
C24ELECTROL YTIC CAP. 0.22µF/50V M H7 orCE1JMASSLR22
ALUMINUM ELECTROL YT IC CAP 0.22µF/50V H7CE1JMASSMR22