I Specifications
I Preparation for Servicing
I Adjustment Procedures
I Schematic Diagrams
I CBA’s
I Exploded views
I Parts List
This service manual is for the DPVR-7630
different DVD Main CBA UNIT model, which
is different from the previous model.
For the DPVR-7630 different DVD Main CBA
UNIT model, the letter (E8D00ED) is printed
on the Bar code Label on the back of the
unit. Refer to the Bar code Label illustration
at right.
When servicing the deck
mechanism, refer to MK14 Deck
Mechanism Section.
Deck Mechanism Part No.:
N25E0FL
Bar code Label
U -E8D00ED
"E8D00ED"
DVD PLAYER &
VIDEO CASSETTE RECORDER
DPVR-7630
PAL
Page 2
MAIN SECTION
DVD PLAYER &
VIDEO CASSETTE RECORDER
DPVR-7630
Main Section
I Specifications
I Preparation for Servicing
I Adjustment Procedures
I Schematic Diagrams
I CBA’s
I Exploded Views
I Par ts L ist
Note: Nominal specs represent the design specs. All units should be able to approximate these – some will
exceed and some may drop slightly below these specs. Limit specs repres ent the absolute worst con dition that
still might be considered acceptable; In no case should a unit fail to meet limit specs.
1. All Items are measured without pre-emphasis unless otherwise specified.
2. Power supply : 220 - 240 V ~ 50 Hz
3. Ambient temperature : 5
°C ~ 40 °C
1-1-2E8B00SP
Page 5
LASER BEAM SAFETY PRECAUTIONS
This DVD player uses a pickup that emits a laser beam.
Do not look directly at the laser beam coming
from the pic kup or allo w it to strike a gainst your
skin.
The laser beam is emitted from the location shown in the figure. When checking the laser diode, be sure to keep
your eyes at least 30 cm away from the pickup lens when the diode is turned on. Do not look directly at the laser
beam.
CAUTION: Use of controls and adjustments, or doing procedures other than those specified herein, may result in
hazardous radiation exposure.
Drive Mechanism
Assembly
Laser Beam Radiation
Laser Pickup
Turntable
CAUTION- CLASS
-
TION WHEN OPEN. DO NOT VIEW
DIRECTLY WITH OPTICAL INSTRUMENTS
1M
LASER RADIA
-
Location: Top of DVD mechanism.
1-2-1E6P_LASER
Page 6
IMPORTANT SAFETY PRECAUTIONS
Product Safety Notice
Some electrical and mechanical parts have special
safety-related characteristic s which are often not evident from visual inspection, nor can the protection
they give necessarily be obtained by replacing them
with components rated for higher voltage, wattage,
etc. Parts that have special s afety characteristics are
identifi ed b y a ! on schematics and in parts lists. Use
of a substitute replacement that does not have the
same safety characteristics as the recommended
replacement part might create shock, fire, and/or other
hazards. The Product’s Safety is under review continuously and new instructions are issued whenever
appropriate. Prior to shipment from the factory, our
products are carefully inspected to confirm with the
recognized product safety and electr ical codes of the
countries in which they are to be sold. However, in
order to maintai n suc h c omp li anc e, it is e qual ly imp or tant to implement the following precautions when a set
is being serviced.
Precautions during Servicing
A. Parts identified by the ! symbol are critical for
safety. Replace only with part number specified.
B. In addition to safety, other parts and assemblies
are specified for conformance with regulations
applying to spur ious radi ation. Thes e must also be
replaced only with specified replacements.
Examples: RF conver ters, RF cables, noise blocking capacitors, and noise blocking filters, etc.
C. Use specified internal wiring. Note especially:
1)Wires covered with PVC tubing
2)Double insulated wires
3)High voltage leads
D. Use specified insulating materials for hazardous
live parts. Note especially:
1)Insulation tape
2)PVC tubing
3)Spacers
4)Insulators for transistors
E. When replacing AC primary side components
(transformers, power cord, etc.), wrap ends of
wires securely about the terminals before soldering.
F. Observe that the wires do no t co ntac t he at prod uc -
ing parts (heatsink s, oxide metal film resist ors, fusible resistors, etc.).
G. Check that replaced wires do not contact sharp
edges or pointed parts.
H. When a power cord has b een replac ed, check that
5 - 6 kg of force in any direction will not loosen it.
I. Also check areas surrounding repaired locations.
J. Be careful that foreign objects (screws, solder
droplets, etc.) do not remain inside the set.
K. Crimp type wire connector
The power transformer uses crimp type connectors
which connect the power cord and the primary side
of the transformer. When replacing the transformer,
follow these steps carefully and precisely to prevent shock hazards.
Replacement procedure
1)Remove the old connector by cutting the wires at a
point close to the connector.
Important: Do not re-use a connector. (Discard it.)
2)Strip about 15 mm of the insu lation from the ends
of the wires. If the wires are stranded, twist the
strands to avoid frayed conductors.
3)Align the lengths of the wires to be connected.
Insert the wires fully into the connector.
4)Use a crimping tool to crimp the metal sleeve at its
center. Be sure to crimp fully to the comp lete closure of the tool.
L. When connecting or disconnecting the internal
connectors, first, disconne ct the AC plug from the
AC outlet.
1-3-1DVD_SFNP
Page 7
Safety Check after Servicing
Examine the area surrounding the repaired location
for damage or deterioration. Observe that screws,
parts, and wires have been returned to their original
positions. Afterwards, do the following tests and confirm the specified values to verify compliance with
safety standards.
1. Clearance Distance
When replacing primary circuit components, confirm
specified clearance dista nce (d) and (d’) between soldered terminals, and between terminals and surrounding metallic parts. (See Fig. 1)
Table 1 : Ratings for selected area
AC Line VoltageClearance Distance (d), (d’)
220 to 240 V
Note: This table is unofficial and for reference only.
Be sure to confirm the precise values.
2. Leakage Curre nt Test
≥3 mm(d)
≥6 mm(d’)
Chassis or Secondary Conductor
Primary Circuit
d'd
Fig. 1
Exposed Accessible Part
Confirm the specified (or lower) leakage current
between B (earth ground, power cord plug prongs)
and externally exposed accessible parts (RF terminals, antenna terminals, video and audio input and
output terminals, microphone jacks, earphone jacks,
etc.) is lower than or equal to the specified value in the
table below.
Measuring Method (Power ON) :
Insert load Z between B (earth ground, power cord
plug prongs) and exposed accessible parts. Use an
AC voltmeter to measure across t he ter minals of l oad
Z. See Fig. 2 and the following table.
Table 2: Leakage current ratings for selected areas
AC Line VoltageLoad ZLeakage Current (i)
220 to 240 V
2kΩ RES.
Connected in
parallel
50kΩ RES.
Connected in
parallel
i≤0.7mA AC Peak
i≤2mA DC
i≤0.7mA AC Peak
i≤2mA DC
Z
One side of
B
Power Cord Plug Prongs
One side of power cord plug
AC Voltmeter
(High Impedance)
prongs (B) to:
RF or
Antenna terminals
A/V Input, Output
Fig. 2
Note: This table is unofficial and for reference only. Be sure to confirm the precise values.
1-3-2DVD_SFNP
Page 8
STANDARD NOTES FOR SERVICING
Circuit Board Indications
1. The output pin of the 3 pin Regu lator ICs is indicated as shown.
Top View
Input
Out
2. F or other ICs, pin 1 and every fifth pin are indicated
as shown.
In
Pin 1
3. The 1st pin of every male connec to r is ind ic ate d as
shown.
Bottom View
5
10
Pb (Lead) Free Solder
When soldering, be sure to use the Pb free solder.
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:.
(1)Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
Fig. S-1-1
Pin 1
Instructions for Connectors
1. When you connect or disconnect the FF C (Flexible
Foil Connector) cable, be sure to first disconnect
the AC cord.
2. FFC (Flexible Foil Connector) cable should be
inserted parallel into the connector, not at an angle.
FFC Cable
Connector
CBA
(2)Remove the flat pack-IC with tweezers while apply-
ing the hot air.
(3)B ottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to c ent er of the fla t pack-IC and hea t
up. Then remove (glue will be melted). (Fig. S-1-6)
(4)Rel ease the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
Caution:
1. The Flat Pack-IC shape may differ by models. Use
an appropriate hot-air flat pack-IC desoldering
machine, whose shape matches that of the Flat
Pack-IC.
2. Do not supply hot air to the chi p parts aro und the
flat pack-IC for over 6 seconds because damage to
the chip parts may occur. Put masking tape around
the flat pack-IC to protect other parts from damage.
(Fig. S-1-2)
* Be careful to avoid a short circuit.
1-4-1DVD_NOTE
Page 9
3. The flat pack-IC on the CBA is affixed with glue, so
be careful not to break or dama ge the foil of each
pin or the solder lands under the IC when removing
it.
Hot-air
Flat Pack-IC
Desoldering
Machine
CBA
With Soldering Iron:
(1)Using desoldering braid, remove the solder from all
pins of the flat pack-IC. When you use sol der flux
which is applied to all pins of the flat pack-IC, you
can remove it easily . (Fig. S-1-3)
Flat Pack-IC
Desoldering Braid
Masking
Tape
Tweezers
Flat Pack-IC
Fig. S-1-2
Soldering Iron
Fig. S-1-3
(2) Lift each lead of the flat pack-IC upward one by
one, using a sharp pi n or wire to which solder will
not adhere (iron wire). W hen heating th e pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Sharp
Pin
Fine Tip
Soldering Iron
Fig. S-1-4
(3)B ottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to c ent er of the fla t pack-IC and hea t
up. Then remove (glue will be melted). (Fig. S-1-6)
(4)Rel ease the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
With Iron Wire:
(1)Using desoldering braid, remove the solder from all
pins of the flat pack-IC. When you use sol der flux
which is applied to all pins of the flat pack-IC, you
can remove it easily . (Fig. S-1-3)
(2) Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
(3) While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solder
melts so as to l ift the IC leads from the CBA contact pads as shown in Fig. S-1-5.
1-4-2DVD_NOTE
Page 10
(4)Bo ttom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to cente r o f the fl at p ack-IC and h eat
up. Then remove (glue will be melted). (Fig. S-1-6)
(5)Rel ease the fla t pack-IC from the C BA us ing twee -
zers. (Fig. S-1-6)
Note:
When using a solder ing iron, care must be taken
to ensure that the fl at pack-IC i s not bein g held by
glue. When the flat pack-IC is removed from the
CBA, handle it gentl y b ec ause i t m ay be dama ged
if force is applied.
2. Installation
(1) Using desoldering braid, remove the solder from
the foil of each pin of the flat pack-IC on the CBA
so you can install a repla cement flat p ack-IC more
easily.
(2) The “I” mark on the flat pack-IC indicates pin 1.
(See Fig. S-1-7.) Be sure this mar k matches the 1
on the PCB when p ositioning for install ation. Then
presolder the four corn ers of the flat pack-IC. (See
Fig. S-1-8.)
(3)Solder all pins of the flat pack-IC. Be sure that none
of the pins have solder bridges.
To Solid
Mounting Point
CBA
Hot Air Blower
Iron Wire
Soldering Iron
Fig. S-1-5
Fine Tip
Soldering Iron
Example :
or
Pin 1 of the Flat Pack-IC
is indicated by a " " mark.
Fig. S-1-7
Presolder
Flat Pack-IC
CBA
Fig. S-1-8
Tweezers
Flat Pack-IC
Fig. S-1-6
1-4-3DVD_NOTE
Page 11
Instructions for Handling
Semi-conductors
Electrostatic breakdown of the semi-conductors may
occur due to a potenti al difference caused by electrostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a groundi ng ban d (1M Ω) that is properly grounded to remove any static electr icity that may
be charged on the body.
2. Ground for Workbench
(1)Be sure to place a conductive sheet or copper plate
with proper grounding ( 1MΩ) on the wor kbench or
other surface, where the semi-conductors are to be
placed. Because the static electricity charge on
clothing will not escap e through the body grounding band, be care ful to avoid contacting semi-con ductors with your clothing.
< Incorrect >
< Correct >
1MΩ
CBA
Grounding Band
1MΩ
CBA
Conductive Sheet or
Copper Plate
1-4-4DVD_NOTE
Page 12
PREPARATION FOR SERVICING
How to Enter the Service Mode
About Optical Sensors
Caution:
An optical sensor system is used for the Tape Start
and End Sensors on th is equipment. Carefully read
and follow the instructions below. Otherwise the unit
may operate erratically.
What to do for preparation
Insert a tape into the Deck Mechanism Asse mbly and
press the PLAY button. The tape will be loaded into
the Deck Mechanism Assembly. Make sure the power
is on, connect TP501 (S- INH) to GND. This will stop
the function of Tape Start Sensor, Tape End Sensor
and Reel Sensors. (If these TPs ar e c on nected before
plugging in the unit, the function of the sensors will
stay valid.) See Fig. 1.
Note: Because the Tape End Sensors are inactive, do
not run a tape al l t he way to the start or the end of the
tape to avoid tape damage.
Q503
TP501 S-INH
Q504
Fig. 1
1-5-1E8BA0PFS
Page 13
CABINET DISASSEMBLY INSTRUCTIONS
1. Disassembl y Flowchart
This flowchar t indi cates the di sass embly ste ps to ga in
access to item(s) to be ser v iced. Whe n reassembling,
follow the steps in reverse order. Bend, route, and
dress the cables as they were originally.
[1] T op Case
[2] Front Assembly
[3] T op Bracket
[4] DVD Mechanism Assembly
[5] Partition Plate
[6] Power Supply CBA
[7] Loader Holder
[9] VCR Chassis Unit
[10] Deck Assembly
[11] DVD Open/Close CBA
[12] Main CBA
[13] Jack-A CBA
[8] DVD Main CBA Unit
2. Disassembl y Method
REMOVAL
LOC.
No.
PART
REMOVE/*UNHOOK/
Fig.
UNLOCK/RELEASE/
No.
UNPLUG/DESOLDER
Note
REMOVAL
ID/
LOC.
No.
[9]
[10]
[11]
[12] Main CBAD6 ----------[13] Jack-A CBA D6 Desolder, 6(S-13)-
↓
(1)
Note:
(1):Identification (location) No. of parts in the figures
(2):Name of the part
(3):Figure Number for reference
(4): Identification of parts to be removed, unhooked,
(5):Refer to “Reference Notes.”ID/
PART
VCR
Chassis Unit
Deck
Assembly
DVD Open/
Close CBA
↓
(2)
unlocked, released, unplugged, unclamped, or
desoldered.
P=Spring, L=Locking Tab, S=Screw,
CN=Connector
*=Unhook, Unlock, Release, Unplug, or Desolder
e.g. 2(S-2) = two Screws (S-2),
2(L-2) = two Locking Tabs (L-2)
REMOVE/*UNHOOK/
Fig.
UNLOCK/RELEASE/
No.
UNPLUG/DESOLDER
5(S-8), 2(S-9), (S-10),
D5
(L-3)
Desolder,
D6
2(S-11), (S-12)
D6 Desolder-
↓
(3)
↓
(4)
Note
-
4,5
↓
(5)
[1]Top CaseD1 8(S-1)-
Front
[2]
Assembly
[3]Top BracketD2 3(S-2)-
DVD
[4]
Mechanism
Assembly
Partition
[5]
Plate
Power
[6]
Supply CBA
Loader
[7]
Holder
DVD Main
[8]
CBA Unit
D2 *3(L-1), *3(L-2)
4(S-3), *CN401,
D3
*CN601
D3 (S-4)-
D3 2(S-5), CN501-
D3 2(S-6)-
2(S-7), *CN201,
D4
*CN301
1-1
1-2
2-1
2-2
1
-
2
3
1-6-1E8B00DC
Page 14
Reference Notes
CAUTION 1: Locking Tabs (L-1) and (L-2) are fragile.
Be careful not to break them.
1-1. Release three Locking Tabs (L-1).
1-2. Release three Locking Tabs (L-2), then remove
the Front Assembly.
CAUTION 2: Electrostatic breakdown of the laser
diode in the optical system block may occur as a
potential difference caused by electrostatic charge
accumulated on cloth, human body etc., during
unpacking or repair work.
To avoid damage of pickup follow next procedures.
2-1. Disconnect Connector (CN301). Remove a
Screw (S-7) and lift the DVD Main CBA Unit. (Fig.
D4)
2-2. Short the three short land s of F PC cable wi th so l-
der before removing the FFC cable (CN201) from
it. If you disconnect th e FFC cable (CN201), the
laser diode of pickup will be destroyed. (Fig. D4)
CAUTION 3: When reassembling, confirm the FFC
cable (CN201) is connected co mpletely. Then remove
the solder from the three short lands of FPC cable.
(Fig. D4)
4. When reassembling, solder wire jumpers as shown
in Fig. D6.
5. Before installing the Deck Assembly, be sure to
place the pin of LD-SW on Main CB A as shown in
Fig. D6. Then, install the Deck Assembly while
aligning the hole of Cam Gear with the pin of LDSW, the shaft of Cam Gear wi th t he ho le of LD -SW
as shown in Fig. D6.
(S-1)
(L-1)
(S-1)
[1] T op Case
(S-1)
(S-1)
Fig. D1
(S-2)
[3] T op Bracket
(S-2)
(L-2)
(L-1)
[2] Front
Assembly
Fig. D2
1-6-2E8B00DC
Page 15
[4] DVD
Mechanism
Assembly
[5] Partition Plate
(S-6)
[7] Loader
Holder
(S-3)
CN501
CN401
CN601
(S-4)
[6] Power
Supply CBA
(S-3)
(S-5)
(S-3)
(S-8)
(S-8)
(S-10)
(S-9)
(S-8)
(S-9)
[9] VCR Chassis Unit
(L-3)
(S-7)
[8] DVD Main
CBA Unit
CN301
A
DVD Mechanism
Short the three short lands by soldering.
(Either of two places.)
Fig. D5
Fig. D3
(S-7)
CN201
Connector
View for A
Fig. D4
1-6-3E8B00DC
Page 16
[10] Deck
Assembly
FE Head
Cylinder
Assembly
ACE Head
Assembly
Pin
[12] Main CBA
[11] DVD
Open/Close CBA
(S-11)
Lead with blue stripe
[13] Jack-A CBA
(S-11)
Desolder
from bottom
(S-12)
Desolder
Lead with
blue stripe
(S-13)
(S-13)
From
ACE Head
Assembly
[12] Main CBA
[10] Deck Assembly
Shaft
Hole
LD-SW
Lead with
blue stripe
Lead with
blue stripe
From
Cylinder
Assembly
Desolder
From
FE Head
SW507
LD-SW
Cam Gear
Hole
Pin
[12] Main CBA
Lead with
red stripe
Desolder
Printing side
From
Capstan
Motor
Assembly
Desolder
BOTT OM VIEW
Lead connections of Deck Assembly and Main CBA
1-6-4E8B00DC
Fig. D6
Page 17
HOW TO EJECT MANUALLY
1. Remove the Top Case, Front Assembly and T op Brac ket.
2. Remove four Screws (S-3) in Fig. D3. Do not disconnect connectors.
3. While lifting up the DVD Mechanism, rotate the roulette in the direction of the arrow as
shown below.
4. Pull the tray slowly manually.
View for A
Rotate this roulette in
the direction of the arrow
DVD Mechanism
A
1-6-5E8B00DC
Page 18
ELECTRICAL ADJUSTMENT INSTRUCTIONS
General Note: "CBA" is an abbreviation for
"Circuit Board Assembly."
NOTE:
Electrical adjustments are required after replacing
circuit components and certain mechanical parts. It is
important to do these adjustments only after all repairs
and replacements have been completed. Also, do not
attempt these adjustments unless the proper
equipment is available.
1. Test Equipment Required
Alignment Tape (FL6A)
2. Head Switching Position
Adjustment
Purpose:
To deter mine the Head Switching position dur ing
playback.
Symptom of Misadjustment:
May cause Head Switching n oise or vertical jitter
in the picture.
Procedures:
1. Eject a tape and turn the power off.
2. To enter the service mode, press [CHANNEL K]
and [F.FWD] buttons on the unit simultaneously for
at least 2 seconds.
- The unit turn the power on in the service mode.
- Fig. E1 appears on the display.
"*" or "-" differs depending on the models.
1 : SW P AUTO
3 : SW P MANU
0 : FUNC SET
--
**
0***
Fig. E1
3. Insert the Alignment Tape (FL6A).
Auto adjustment starts.
4. After short time, “OK” appears on the display and
auto adjustment completes.
Press [STOP] to cancel the auto adjustment mode.
5. Eject the Alignment Tape (FL6A).
*1
3. To check/reset the initial function
setting
Preparation:
1. Enter the service mode.
2. Check the “0: FUNC SET” value (*1) in Fig. E1.
When the “0: FUNC SET” value is “038D” :
1. To cancel the service mode, press [MENU] button
on the remote control.
2. If necessary, eject a tape.
3. To turn the power off, press [STANDBY-ON] button.
When the “0: FUNC SET” value is not “038D”:
1. To enter the initial function setting mode, press [0]
button on the remote control.
- Fig. E2 appears on the display.
"*" or "-" differs depending on the models.
1 : SW P AUTO
3 : SW P MANU
0 : FUNC SET0***
0---
Fig. E2
2. Set the “0: FUNC SET” value at "038D" by using
[K/L/{/B (up/down/left/right)] buttons on the
remote control.
3. T o r eturn to the service mode, press [STOP] button
on the unit.
4. To cancel the service mode, press [MENU] button
on the remote control.
5. If necessary, eject a tape.
6. To turn the power off, press [STANDBY-ON] button.
7. To reset the unit, press [CHANNEL K] and [REW]
buttons on the unit simultaneously for at least 2
seconds.
1-7-1E8D00EA
Page 19
HOW TO INITIALIZE THE DVD PLAYER & VCR
To put the program back at the factory-default,
initialize the DVD player & VCR as the following
procedure.
< DVD Section >
1. Press [DVD], [1], [2], [3], [4], and [DISPLAY]
buttons on the remote control unit in that order.
Fig. a appears on the screen.
"
" differs depending on the models.
*******
MODEL : *******
Version
Region
: *.**
: *
EXIT: POWEREEPROM CLEAR : CLEAR
Fig. a
"
" differs depending on the models.
*******
2. Press [CLEAR] button on the remote control unit.
Fig. b appears on the screen.
MODEL : *******
Version
Region
: *.**
: *
EXIT: POWEREEPROM CLEAR : CLEAR
EEPROM CLEAR : OK
Fig. b
When “OK” appears on the screen, the factory
default will be set.
3. To exit this mode, press [STANDBY-ON] button.
1-8-1E8BA0INT
Page 20
FIRMWARE RENEWAL MODE
1. Turn the power on and remove the disc on the tray .
2. To put the DVD player into v ersion up mode, press
[DVD], [9], [8], [7], [6], and [SEARCH MODE]
buttons on the remote control unit in that order.
The tray will open automatically.
Fig. a appears on the screen and Fig. b appears
on the VFD.
"
" differs depending on the models.
*******
F/W Version Up ModeModel No : *******
Please insert a DISC
for F/W Version Up.
VERSION : *.**
EXIT: POWER
Fig. a Version Up Mode Screen
Fig. b VFD in Version Up Mode
The DVD player can also enter the version up
mode with the tray open. In this case, Fig. a will be
shown on the screen while the tray is open.
3. Load the disc for version up.
4. The DVD player enters the F/W version up mode
automatically. Fig. c appears on the screen and
Fig. d appears on the VFD. If you enter the F/W for
different models, “Disc Error” will appear on the
screen, then the tray will open automatically.
"
" differs depending on the models.
*******
(*1)
F/W Version Up ModeModel No : *******
VERSION : ************.ab7
Reading...
VERSION : *.**
5. After programming is finished, the tray opens
automatically. Fig. e appears on the screen and
the checksum in (*2) of Fig. e appears on the VFD
(Fig. f).
"
" differs depending on the models.
*******
F/W Version Up Mode
VERSION : ************.ab7
Completed
SUM : 7ABC
Model No : *******
VERSION : *.**
Fig. e Completed Program Mode Screen
Fig. f VFD upon Finishing the Programming Mode (Example)
At this time, no button is available.
6. Remove the disc on the tray.
7. Unplug the AC cord from the AC outlet. Then plug
it again.
8. Turn the power on by pressing the [ST ANDBY-ON]
button and the tray will close.
9. Press [DVD], [1], [2], [3], [4], and [DISPLAY]
buttons on the remote control unit in that order.
Fig. g appears on the screen.
"
" differs depending on the models.
*******
MODEL : *******
Version
Region
: *.**
: *
Fig. c Programming Mode Screen
Fig. d VFD in Programming Mode (Example)
The appearance shown in (*1) of Fig. c is
described as follows:
No.AppearanceState
1Reading...Sending files into the memory
2Erasing...Erasing previous version data
3Programming... Writing new version data
EXIT: POWEREEPROM CLEAR : CLEAR
Fig. g
1-9-1E8B00FW
Page 21
10. Press [CLEAR] button on the remote control unit.
Fig. h appears on the screen.
"
" differs depending on the models.
*******
MODEL : *******
Version
Region
: *.**
: *
EXIT: POWEREEPROM CLEAR : CLEAR
EEPROM CLEAR : OK
Fig. h
When “OK” appears on the screen, the factory
default will be set. Then the firmware renewal
mode is complete.
11. To exit this mode, press [STANDBY-ON] button.
1-9-2E8B00FW
Page 22
FUNCTION INDICATOR SYMBOLS
Note:
If a mechanical ma lfunction occurs, the power is tur ned off. When the power comes on agai n after that by
pressing [STANDBY-ON] button, an error message is displayed on the TV screen for 5 seconds.
MODEINDICATOR ACTIVE
When reel or capstan mechanism is not
functioning correctly
When tape loading mechanism is not functioning correctly
When cassette loading mechanism is not
functioning correctly
When the drum is not working properly
P-ON Power safety detection
“A R” is displayed on a TV screen. (Refer to Fig. 1.)
“A T” is displayed on a TV screen. (Refer to Fig. 2.)
“A C” is displayed on a TV screen. (Refer to Fig. 3.)
“A D” is displayed on a TV screen. (Refer to Fig. 4.)
“A P” is displayed on a TV screen. (Refer to Fig. 5.)
TV screen
When reel or capstan mechanism is not functioning
correctly
A
R
Fig. 1
When the drum is not working properly
A
D
Fig. 4
When tape loading mechanism i s not function ing correctly
A
T
Fig. 2
When cassette loadi ng mechanism is not functi oning
correctly
A
C
Fig. 3
P-ON Power safety detection
A
P
Fig. 5
1-10-1E8BA0FIS
Page 23
BLOCK DIAGRAMS <VCR SECTION>
Servo / System Control Block Diagram
TO AUDIO
BLOCK DIAGRAM
TO Hi-Fi AUDIO
BLOCK DIAGRAM
TO VIDEO
BLOCK DIAGRAM
TO DVD SYSTEM
CONTROL /SERVO
BLOCK DIAGRAM
<DVD SECTION>
TO DVD VIDEO/
AUDIO BLOCK
DIAGRAM
<DVD SECTION>
KEY SWITCH
SENS-INH
TP501
Q507
KEY SWITCH
8
7
23
KEY- 1
KEY- 2
POWER-LED
DRV-DATA
DRV-STB
DRV-CLK
REMOCON-IN
IC501
(SERVO/SYSTEM CONTROL)
68
69
70
14
DISPLAY-DATA
DISPLAY-STB
DISPLAY-CLK
REMOTE-VIDEO
POWER
D505
AL+5V
Q508
DVD
D502
CTL(-)
LD-SW
9
29
DVD-LED
ST-S
CTL(+)
109495
Q509
VCR
D503
END-S
T-REEL
4
80
30
VCR-LED
S-REEL
79
SDA
SCL
IC502 (MEMORY)
5
6
Q515
IIC-BUS SDA
RESET
34
RESET
IIC-BUS SCL
AUDIO-MUTE-H
83
AUDIO-MUTE-H
A-MODE
Hi-Fi-H-SW
IIC-BUS SCL
IIC-BUS SDA
19
Hi-Fi-H-SW
LINE-MUTE
IIC-BUS SDA
OUTPUT-SELECT
28
86
A-MODE
LINE-MUTE
REC-SAF-SW
31
SW506
AL+5V
REC-SAFETY
RF-SW
D-REC-H
IIC-BUS SCL
18
33
71
72
RF-SW
D-REC-H
IIC-BUS SCL
IIC-BUS SDA
CTL
97
CTL
TP503
H-A-SW
C-ROTA
D-V-SYNC
16
13
15
H-A-SW
C-ROTA
D-V-SYNC
AL+20.5V/+12V
P-ON+5V
V-ENV
INPUT-SELECT
OUTPUT-SELECT
6
41
82
17
V-ENV
H-A-COMP
INPUT-SELECT
OUTPUT-SELECT
C-CONT
C-F/R
LM-
C-SYNC
58
C-SYNC
FWD/REV
H-A-COMP
C-FG
8778768177
D-PFG
D-CONT
90
DVD-POWER
OUTPUT-SELECT
21
DVD-POWER
C-POW-SW
666732
AL+12V(2)
P-ON+15V
P-ON-H
C-POW-SW
OUTPUT-SELECT
P-ON-H
P-DOWN-H
P-DOWN-H
TO DVD SYSTEM
CONTROL /SERVO
BLOCK DIAGRAM
<DVD SECTION>
AL+5V
D555
S-LED
MAIN CBA
(DECK ASSEMBLY)
AL+5V
LD-SW
SW507
CN504
1 CTL(-)
2 CTL(+)
CONTROL
HEAD
ACE HEAD ASSEMBLY
TP502
PS502
Q506
END-S
S-REEL
T-REEL
ST-S
Q504
TIMER+5V
SENSOR CBA
Q503
END-S
SENSOR CBA
CN502
AL+20.5V/+12V
1
2 P-ON+5V
3 C-FG
4 C-F/R
5 C-CONT
6 GND
MOTOR
CAPSTAN MOTOR
CAPSTAN
M
PG
SENSOR
DRUM
CYLINDER ASSEMBLY
MOTOR
LM-FWD/REV
7
8 D-CONT
9 D-PFG
10 GND
DRIVE
CIRCUIT
M
MOTOR
11 AL+12V(2)
12 P-ON+15V
M
LOADING
MOTOR
TO POWER
SUPPLY BLOCK
DIAGRAM
1-11-1
E8D00BLS
Page 24
Video Block Diagram
MODE: SP/RECPB-VIDEO SIGNAL DVD VIDEO SIGNAL
VIDEO (L)-1
HEAD
VIDEO (R)-1
HEAD
VIDEO (L)-2
HEAD
CYLINDER ASSEMBLY
VIDEO (R)-2
HEAD
MAIN CBA
REC-VIDEO SIGNAL
TO SERVO/SYSTEM
CONTROL BLOCK
DIAGRAM
IIC-BUS SCL
IIC-BUS SDA
(DECK ASSEMBLY)
CN251
7978
Y. DELAY
4643
6968
SERIAL
DECORDER
65
123
VIDEO(L)-1
VIDEO(R)-1
VIDEO-COM
969594
SP
HEAD
SP
P
R
LUMINANCE
SIGNAL
PROCESS
AGC
456
VIDEO(L)-2
VIDEO(R)-2
VIDEO-COM
93
AMP
EP
WF1
RF-SW
TP504
908988
EP
HEAD
AMP
REC FMAGC
Y
CCD 1H DELAY
CHARA.
INS.
87
+
1/2
RF-SW
D-REC-H
80
D-REC-H
C
FBC
C-ROTA
70
RF-SW/C-ROTA
CHROMINANCE
TO SERVO/SYSTEM
CONTROL BLOCK
DIAGRAM
V-ENV
H-A-SW
H-A-COMP
83
71
62
H-A-SW
D-V-SYNC
H-A-COMP
RPRP
PROCESS
C-SYNC
67
84
V-ENV
C-SYNC
Y/C
PR
MIX
D-V-SYNC
SIGNAL
VXO
AGC
21
2928
C-PB
TP301
X301
4.43MHz
WF2
IC501 (OSD)
50
OSD
CHARACTER
MIX
52
VIDEO SIGNAL PROCESS
/HEAD AMP
IC301
(SW)
IC1404
24
VIDEO OUT
JK752
VIDEO
TU701 (TUNER UNIT)
-IN
VCR
5
FRONT
4
DVD
3
BYPASS
IN1
TUNER
485052
SW CTL
5859
IN2
FRT
IN2
FRT
MUTE
PB/EE
IN1
MUTE
TUNER
PB/EE
3
56
54
JK101
19
9
INPUT-SELECT
DVD-VIDEO
TO DVD
VIDEO/AUDIO
BLOCK DIAGRAM
DIAGRAM
<DVD SECTION>
TO
SERVO/SYSTEM
CONTROL BLOCK
20
VIDEO-IN1
VIDEO-OUT1
61
63
8
CN2017
VIDEO-OUT2
8
CN2018
BUFFER
JK1402
19
VIDEO
-OUT2
VIDEO-IN2
1010
Q103
20
VIDEO
-IN2
BUFFER
Q104
JACK-A CBA
5
DVD
VCR
IC751
(OUTPUT SELECT)
4
1-11-2
TO SERVO/SYSTEM
OUTPUT-SELECT
11109
SW CTL
WF3
V-OUT
TP751
E8D00BLV
CONTROL BLOCK DIAGRAM
Page 25
Audio Block Diagram
Mode : SP/REC
PB-AUDIO SIGNALREC-AUDIO SIGNAL
TO SERVO/SYSTEM
CONTROL BLOCK
11
12
SERIAL
DECODER
AUDIO HD-SW
CONTROL
71
68 69
16
MUTE
LINE
AMP
ALC
ALC
TUNERIN2
DET
INV
P
R
ATT
171513
IN1
REC-ON
REC
AMP
DIAGRAM
IIC-BUS SCL
IIC-BUS SDA
AUDIO-MUTE-H
98
7
MAIN CBA
IC301
(AUDIO SIGNAL PROCESS)
EQ
PB-ON
5
AMP
6
SP/LP-ON
+5V
Q404
CN504
AUTO
1
BIAS
OSC
Q403
AUDIO-PB/REC
3
4 A-COM
6 AE-H
5 AE-H/FE-H
100
3
BIAS
2
Q406
+5V
SWITCHING
D-REC-OFF
Q405
CN501
2 FE-H
Q401
(PB=ON)
1 FE-H-GND
N-A-PB
N-A-REC
TO Hi-Fi AUDIO
BLOCK DIGRAM
1-11-3
ACE HEAD ASSEMBLY
(DECK ASSEMBLY)
AUDIO
HEAD
AUDIO
ERASE
HEAD
FE HEAD
FULL
ERASE
E8D00BLA
HEAD
Page 26
Hi-Fi Audio Block Diagram
TO
SERVO/ SYSTEM
CONTROL BLOCK
DIAGRAM
TO DVD
VIDEO/AUDIO
BLOCK DIAGRAM
<DVD SECTION>
TO
SERVO/ SYSTEM
CONTROL BLOCK
DIAGRAM
Hi-Fi
AUDIO
CYLINDER
ASSEMBLY
(R)
HEAD
Hi-Fi
AUDIO
(L)
HEAD
12
13
VCR
REC-AUDIO SIGNALPB-AUDIO SIGNALMode : SP/RECDVD AUDIO SIGNAL
DVD
IC751
(OUTPUT SELECT)
14
2
VCR
DVD
15
(DECK ASSEMBLY)
A-MODE
Hi-Fi-H-SW
39
73
MUTE-ON
HOLD
LINE-MUTE
53
75
PULSE
26
COMP
MIX
NOISE
DET
Q451
IIC-BUS SCL
DVD-AUDIO(L)-OUT
DVD-AUDIO(R)-OUT
OUTPUT-SELECT
1
11109
SW CTL
IIC-BUS SDA
37
38
SERIAL
DATA
DECODER
R-CH
BPF
COMP
SW
NOISE
P
767774
MUTE-ON
LPF
VCO
LIMDEV
R
OUTPUT
SELECT
21
ENV
LPF
VCO
LIMDEV
DET
R
DO
7
CN251
AUDIO(R)
Hi-Fi-
24
R
DET
P
Hi-Fi-COM 8
34 33
LIM
L-CH
COMP
SW
9
AUDIO(L)
Hi-Fi-
27
L
BPF
NOISE
MAIN CBA
5
4
CN2017CN2018
AUDIO(R)-IN2
AUDIO(L)-IN2
5
4
JACK-A CBA
JK1402
2
6
2
1
AUDIO(R)-OUT2
AUDIO(L)-OUT2
2
1
1
3
TO DVD VIDEO/AUDIO
BLOCK DIAGRAM
<DVD SECTION>
AUDIO(L)-MUTE
AUDIO(R)-MUTE
JK101
2
6
1
3
R-CH
PNR
47
48
SW
ALC
6171
6270
ALC
SW
IC451 (MTS/ SAP/ Hi-Fi AUDIO PROCESS/ Hi-Fi HEAD AMP)
67
65
Q753Q754
JK751
AUDIO(R)
-OUT
AUDIO(L)
-OUT
JK753
52
AUDIO(L)
-IN
R-CH
56
INSEL
50
54
JK754
AUDIO(R)
-IN
L-CH
PNR
15
14
L-CH
INSEL
NOR
SW
2
6
4
60
58
8
12
10
5
4
CN701CN1
TU-AUDIO(R)
TU-AUDIO(L)
5
4
AFV CBA
IF SINAL
PROCESS
2
SIF
2
CN701CN1
22
78
80
N-A-REC
N-A-PB
TO AUDIO
BLOCK DIAGRAM
AUDIO(R)-IN2
AUDIO(L)-IN2
AUDIO(R)-OUT2
AUDIO(L)-OUT2
AUDIO(R)-IN1
AUDIO(L)-IN1
AUDIO(R)-OUT1
AUDIO(L)-OUT1
REAR
1-11-4
FRONT
TU701
(TUNER UNIT)
SIF OUT
E8D00BLH
Page 27
Power Supply Block Diagram
TO DVD MAIN
CBA UNIT
(CN401)
1 EV+1.2V
CL1051
2 EV+1.2V
3 EV+3.3V
4 EV+3.3V
5 EV+3.3V
DVD-P-ON+5V
7
8 EV+11V
9 EV+11V
DVD-P-ON+3.3V
6
17 PWRCON
111316
111316
AL+5V
Q056
P-ON+5V
SW+5V
15
15
TIMER+5V
SW+5V
Q058
Q057
P-ON+44V
SW+44V
Q053,Q054
CAUTION !
Fixed voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown , check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
P-ON-H
P-ON+15V
CN051A
CL051ACL051BCN051
AL+12V
5
AL+5V
AL+9V
SW+9V
Q055
7
9
7
9
7
AL+20.5V
7
<TO PIN 67 OF IC501>
135
135
1 AL+44V13 AL+12V35
P-DOWN-H
CL052ACL052B
C-POW-SW
AL+20.5V/+12V
<TO PIN 32 OF IC501>
SW+20.5V
Q051,Q052
1
358
1 AL-30V
3 AL+2.8V
5 AL+4V
<TO PIN 66 OF IC501>
8F17
EV+5V
SW+3.3V
DVD-P-ON+5V
-FL
DVD-P-ON+3.3V
DVD P-ON+12V
EV+3.3V
SW+12V
Q1053,
Q1054
F2
F1
MAIN CBAPOWER SUPPLY CBA
AL-30V
SW+5V
Q1055
Q1052
IC1003
+1.2V REG.
+3.3V REG.
JUNCTION
CBA
IC1002
7
F2
20
NOTE:
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
T0011
2
BRIDGE
RECTIFIER
D001 - D004
LINE
FILTER
L1003
F1001
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
HOT CIRCUIT. BE CAREFUL.
T1.6A L 250V
AC1001
Q1004
19
18
17
16
15
14
13
12
11
4
7
8
IC1001
ERROR
VOLTAGE DET
1
4
23
HOTCOLD
Q1001
Q1003
Q1008
1-11-5
E8D00BLP
Page 28
BLOCK DIAGRAMS <DVD SECTION>
DVD System Control / Servo Block Diagram
DVD OPEN/CLOSE CBA
DVD-OPEN/CLOSE
SW2020
1
2
CN2016CN2015
DVD-OPEN/CLOSE
1 EV+3.3V
2
EV+3.3V
REMOTE
RM2001
EV+3.3V
SENSOR
IC611
SW2021 STOP
SW2022 PLAY
(FIP DRIVER)
IC612
CN401CL1051
GRIDFIP
~
789
23
17
~
a
7G
1G
2825DVD-PLAY
2926DVD-STOP
2623DVD-POWER
7880777956
SEGMENT
12
10
11
FP-STB
FP-DIN
2281
FP-DIN
2421FP-STB
2219
54FP-DIN
f
e
FP-CLK
2320FP-CLK
2522REMOTE-DVD
49
55
bcd
2724DVD-OPEN/CLOSE
131416
g
h
3027OUTPUT-SELECT
76
i
DISPLAY-CLK
DISPLAY-DATA
TO SERVO/SYSTEM
CONTROL BLOCK
DIAGRAM
<VCR SECTION>
DVD-POWER
DISPLAY-STB
REMOTE-VIDEO
OUTPUT-SELECT
MAIN CBA
IC101
(MICRO CONTROLLER)
ASPECT
60
ASPECT
IC462
+3.3V
IC461
+3.3V
RESET70
RESET
13
RESET
21
VREF
IC301
(SERVO DRIVE)
FOCUS DRIVE
FD-OFST
127
124
25
27
26
-
+
-
+
FOCUS
ACTUATOR
DRIVE
15
16
FS(+)
FS(-)
TS(+)
24
TS(-)
DVD-PLAY
TRACKING
DRIVE
TD-OFST
126
123
-
+
-
+
TRACKING
ACTUATOR
DRIVE
14
13
DVD-STOP
DVD-POWER
DVD-OPEN/CLOSE
312
SPINDLE
12
FP-STB
SPDL
66
-
+
-
+
MOTOR
DRIVE
11
FP-CLK
REMOTE-DVD
645
OUTPUT-SELECT
SLD
67
23
-
+
SLED
MOTOR
DRIVE
17
18
IC202
(OP AMP)
SL-ADS
122
7
6
5
1SP(+)
2SP(-)
SL-AMP
63
8
10
+3.3V
6TRAY-IN
3GND
9
4SL(-)
5SL(+)
SP-ROT
121
1
2
3
CN301
TRAY-IN
65
DVD MAIN CBA UNITDRIVE CBA
TO DVD
VIDEO/ AUDIO
1 NOTE:
Either IC461 or IC462 is used for DVD MAIN CBA UNIT.
BLOCK DIAGRAM
TO DIGITAL SIGNAL
PROCESS BLOCK
DIAGRAM
1-11-6
TRAY-IN
SPINDLE
MOTOR
M
SLED
MOTOR
M
E8D00BLSD
Page 29
Digital Signal Process Block Diagram
TO DVD
VIDEO
/AUDIO
BLOCK
DIAGRAM
DVD AUDIO SIGNAL
DATA(AUDIO) SIGNAL
DATA
RAM
INST.
ROM
DATA
RAM
SPDIF
DVD-AUDIO(L)
DVD-AUDIO(R)
152
144
146
AUDIO D/A
CONVERTER
AUDIO
I/F
INST.
ROM
DVD-AUDIO-MUTE
151
VIDEO-Y(I)
138
Y(I)
D/A
VIDEO-Y(I/P)
Y(I/P)
131
D/A
VIDEO-C
139
C
D/A
NTSC/PAL
ENCODER
VIDEO
I/F
VIDEO-Pr/Cr
VIDEO-Pb/Cb
129
130
Pr/Cr
Pb/Cb
D/A
D/A
DATA
RAM
IC103 (FLASH ROM)
1
~
9
FLASH
~
162548
FADR (0-19)
ROM
~
293638
FDQ (0-15)
~
45
DATA(VIDEO/AUDIO) SIGNALDVD VIDEO SIGNAL
194
~~
222629
IC503 (SDRAM)IC101 (MICRO CONTROLLER)
DSP
DECODER
STREAM
I/F
DECODER
I/F
ECC
EXTERNAL
MEMORY
I/F
SDRAM
159
~~
2
134253
SDRAM DATA(0-15)
~
178
SDRAM DATA(0-15)
SDRAM ADDRESS(0-10)
~
209
SDRAM ADDRESS(0-10)
34
I/O
PROCESSOR
DMA
999897
100
DVD/CD
RF
SIGNAL
115
CN201
C16
FORMATTER
PROCESS
CIRCUIT
116
113
A17
D18
DETECTOR
114
B15
UMAC
BCU
111
E14
SERIAL
112
F12
CD/DVD 19
GENERAL
I/O
INTERRUPT
CPU
I/F
READ
MEMORY
32BIT
INST.
ROM
106
AMP
Q253,Q254
CN201
CD-LD 10
CONTROLLER
CPU
DATA
RAM
104
105
Q251,Q252
AMP
DVD-LD 8
PD-MONI 7
TIMER
WATCH DOG
103
6
5
GND(CD-PD)
GND(DVD-PD)
TIMER
REMOTE
9
GND(LD)
CONTROL
CPU
I/F
WATCH DOG
TIMER
TIMER
INTERRUPT
CONTROLLER
32BIT CPU
BCU
1 3
INST
RAM
DEBUG
34~42 212
21~30
17~18 215~216
7~14
1~4
CD/DVD
62
TO DVD SYSTEM
CONTROL/SERVO
BLOCK DIAGRAM
6
IC201
(SW)
4
CDDVD
FS
TS
FS(+)
CN201
FS(+) 2
FS(-)
FS(-) 3
TS(+)
TS(+) 1
TS(-)
TS(-) 4
DVD MAIN CBA UNIT
PICK-UP
UNIT
1-11-7
E8D00BLD
Page 30
DVD Video / Audio Block Diagram
-G
DVD-R
JK1401
S-VIDEO
OUT
2
DVD AUDIO SIGNALDATA(AUDIO) SIGNALDVD VIDEO SIGNAL
1
34
YC
DVD-B
JK101
15711
DVD-G
VIDEO-RVIDEO
15
JK1402
CN2018
14
VIDEO
11
-B
7
DIGITAL
AUDIO OUT
JK1202(REAR)
FIBER OPTIC
TRANS MODULE
IC1204
3
JACK-A CBA
DVD-
AUDIO(L)-OUT
TO Hi-Fi AUDIO
BLOCK DIAGRAM
DVD-
AUDIO(R)-OUT
<VCR SECTION>
AUDIO(L)-MUTE
AUDIO(R)-MUTE
MAIN CBADVD MAIN CBA UNIT
TO VIDEO
BLOCK DIAGRAM
DVD-VIDEO
5
6
DRIVER
8dB AMP
-6dB
LPFDRIVER
(VIDEO DRIVER)
4dB AMP2dB AMP
IC1403
3
<VCR SECTION>
WF6
LPFDRIVER
4dB AMP2dB AMP
17
10
15
LPFDRIVER
LPFDRIVER
4dB AMP2dB AMP
4dB AMP2dB AMP
IC102 (VIDEO DRIVER)
8
1
4
14
11
DRIVER
LPF
4dB AMP2dB AMP
6
15
VIDEO-R
14
CN2017
1313VIDEO-G
1212VIDEO-B
TO SERVO/SYSTEM
CONTROL BLOCK
DIAGRAM
<VCR SECTION>
OUTPUT-SELECT
BUFFER
Q1351
(AMP)
IC1201
WF9
WF7
CN601CN1601
7
6
5
16
SPDIF
DVD-AUDIO(L)
1212
16
213
DVD-AUDIO(R)
DVD-AUDIO-MUTE
1414
1313
Q1203
DVD-P-ON+3.3V
AUDIO+5V
WF8
CN1601
11VIDEO-Y(I)
CN601
VIDEO-Y(I)
VIDEO-C
IC101
WF5
WF4
44VIDEO-Pr/Cr
88VIDEO-Y(I/P)
1010VIDEO-C
VIDEO-Pr/Cr
VIDEO-Y(I/P)
TO DIGITAL
SIGNAL PROCESS
BLOCK DIAGRAM
(OUTPUT SELECT)
VIDEO-Pb/Cb
33ASPECT
66
VIDEO-Pb/Cb
ASPECT
TO DVD SYSTEM
CONTROL/SERVO
5
BLOCK DIAGRAM
11
10
9
SW CTL
2
3
1
12
13
+5V
Q1502
DVD-AUDIO(R)
SPDIF
DVD-AUDIO(L)
TO DIGITAL
SIGNAL
PROCESS
BLOCK
DVD-AUDIO-MUTE
DIAGRAM
1-11-8
E8D00BLVD
Page 31
SCHEMATIC DIAG RAMS / CBA’S AND TEST POINTS
Standard Notes
WARNING
Many electrical and mechanical parts in this chassis
have special characteristics. These characteristics
often pass unnoticed and the protection afforded by
them cannot necessarily be obtained by using
replacement components rated for higher voltage,
wattage, etc. Replacement parts that have these special safety character istics are id entified in th is manual
and its supplements; electrical components having
such features are identified by the m ark " ! " in the
schematic diagram and the par ts list. Before replacing
any of these components, read the parts list in this
manual carefully. The use of substitute replacement
parts that do not have the same safety characterist ics
as specified in the pa r ts list may create sh ock, fire, or
other hazards.
Notes:
1. Do not use the p ar t number sh own on these draw-
ings fo r orde ring. The cor rect part number is sho wn
in the parts list, and may be slightly different or
amended since these drawings were prepared.
2. All resistance values are indicated in ohms
3
(K=10
3. Resistor wattages are 1/4W or 1/ 6W unless other-
wise specified.
4. All capacitance values are indicated in µF
(P=10
5. All voltages are DC voltages unless otherwise
specified.
6. Electrical parts such as capacitors, connectors,
diodes, IC’s, transistors, resistors, switches, and
fuses are identified by four digits. The first two digits are not shown for each component. In each
block of the diagram, there is a note such as shown
below to indicate these abbreviated two digits.
, M=106).
-6
µF).
1-12-1SCPA1
Page 32
LIST OF CAUTION, NOTES, AND SYMBOLS USED IN THE SCHEMATIC DIAGRAMS ON THE FOLLOW ING
PAGES:
1. CAUTION:
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH THE SAME TYPE FUSE.
2. CAUTION:
Fixed Voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown, first che ck to see that all components in the power supply ci rcui t ar e n ot defective before you connect the AC plug to the AC power supply. Otherwise it may cause some components in the
power supply circuit to fail.
3. Note:
(1) Do not use the par t number shown on th e drawings for ordering. The correct p art number is shown i n the
parts list, and may be slightly different or amended since the drawings were prepared.
(2) To maintai n original function and reliabi lity of repaired units, use only orig inal replacement par ts which are
listed with their part numbers in the parts list section of the service manual.
4. Voltage indications for PLAY and REC modes on the schematics are as shown below:
< DVD Section >
231
5.0
The same voltage for
both PLAY & STOP modes
Indicates that the voltage
is not consistent here.
5. How to read converged lines
1-D3
Distinction Area
Line Number
(1 to 3 digits)
Examples:
1. "1-D3" means that line number "1" goes to the line number
"1" of the area "D3".
2. "1-B1" means that line number "1" goes to the line number
"1" of the area "B1".
6. Test Point Information
: Indicates a test point with a jumper wire across a hole in the PCB.
: Used to indicate a test point with a component lead on foil side.
5.0
(2.5)
PLAY mode
STOP mode
< VCR Section >
5.0
The same voltage for
both PLAY, REC & DVD
modes
5.0
(2.5)
< >
PLAY mode
REC mode
DVD mode
231
Indicates that the voltage
is not consistent here.
3
2
1
ABCD
Unit: Volts
1-B1
AREA D3
AREA B1
1-D3
: Used to indicate a test point with no test pin.
: Used to indicate a test point with a test pin.
1-12-2SCRK05
Page 33
Main 1/8 Schematic Diagram < VCR Section >
1-12-3
E8D00SCM1
Page 34
Main 2/8 & Sensor Schematic Diagram < VCR Section >
7G6G5G4G3G2G1G
a
b
c
d
e
f
g
c
d
e
ff
g
c
d
e
f
g
c
d
e
f
g
c
d
e
f
g
c
d
e
f
g
h
ii
ababababa
b
IC611 MATRIX CHART
REPEAT
TITLE
GROUP
VCR
CHP
REC
SACD
TRK
ALL
B
PSCAN
DVD
P
M
HD
V
CD
A
A
5G4G 3G2G1G
7G
6G
a
d
g
c
b
ef
f
i
i
REPEAT
TITLE
GROUP
VCR
CHP
REC
SACD
TRK
A
ALL
B
PSCAN
DVD
PM
HDVCD
A
1-12-4
E8D00SCM2
Page 35
Main 3/8 Schematic Diagram < VCR Section >
1-12-5
E8D00SCM3
Page 36
Main 4/8 Schematic Diagram < VCR Section >
1-12-6
E8D00SCM4
Page 37
Main 5/8 Schematic Diagram < VCR Section >
1-12-7
E8D00SCM5
Page 38
Main 6/8 Schematic Diagram < VCR Section >
1-12-8
E8D00SCM6
Page 39
Main 7/8 & DVD Open/Close Schematic Diagram < VCR Section >
1-12-9
E8D00SCM7
Page 40
Main 8/8 Schematic Diagram < VCR Section >
1-12-10
E8D00SCM8
Page 41
Power Supply & Junction Schematic Diagram < VCR Section >
CAUTION !
Fixed voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown , check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE:
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
1-12-11
E8D00SCP
Page 42
Jack - A Schematic Diagram < VCR Section >
1-12-12
E8D00SCJ
Page 43
AFV Schematic Diagram < VCR Section >
1-12-13
E8D00SCAFV
Page 44
DVD Main 1/3 Schematic Diagram < DVD Section >
1 NOTE:
Either IC461 or IC462 is used for DVD MAIN CBA UNIT.
1-12-14
E8D00SCD1
Page 45
DVD Main 2/3 Schematic Diagram < DVD Section >
1-12-15
E8D00SCD2
Page 46
DVD Main 3/3 Schematic Diagram < DVD Section >
1-12-16
E8D00SCD3
Page 47
Main CBA Top View
Sensor CBA Top View
BHF300F01012A
BHF300F01012B
WF3
TP751
V-OUT
WF2
TP301
C-PB
WF1
TP504
RF-SW
TP501
S-INH
TP503
CTL
1-12-17
BE8B00F01013A
Page 48
Main CBA Bottom View
WF6
PIN 6 OF
IC1403
WF9
PIN 16 OF
CN1601
WF8
PIN 14 OF
CN1601
WF7
PIN 12 OF
CN1601
WF5
PIN 10 OF
CN1601
WF4
PIN 8 OF
CN1601
1-12-18
BE8B00F01013A
Page 49
DVD Open/Close
DVD Open/Close
AFV CBA Top View
AFV CBA Bottom View
CBA Top View
CBA Bottom View
BE8B00F01013C
Jack -A CBA Top View
BE6800F01091
Jack -A CBA Bottom View
1-12-19
BE8B00F01021C
Page 50
Power Supply CBA Top View
Because a hot chassis ground is present in the power
supply circut, an isolation transformer must be used.
Also, in order to have the ability to increase the input
slowly, when troubleshooting this type power supply
circuit, a variable isolation transformer is required.
Power Supply CBA Bottom View
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE:
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
CAUTION !
Fixed voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown , check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
See Electrical Parts List
for parts with this mark.
Some Ref. Numbers are
not in sequence.
Jack-A CBA
2B55
2L012
A14
2B54
2L020
A5
A
Junction CBA
2L082
JW007
B
AC1001
2L021
JW002
2L021
2L062
2L020
JW001
2L021
2L053
2B21
2L041
2L020
F1001
2L021
1B2
L0-9
A
These FFC cables are included
in 1B2 (DVD mechanism).
2B33
Power Supply CBA
2L041
L0-9
B
DVD Main
CBA Unit
2L041
A1X
2B9
A22
A7
2B40
2L041
A10
A3
2B18
A22
2L041
A2
2L041
2L041
2L041
1-17-1E8D04CEX
Page 59
Packing
Some Ref. Numbers
are not in sequence.
X1
S2
X3
X2
S2
X20C
X4
X22X21
A24
X5
X20BX20A
S2
S3
S7
Unit
S1
A14
1-17-2E8D00PEX
Page 60
MECHANICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a
! have special characteristics important to safety.
Before replacing any of these components, read
carefully the product safety notice in this service
manual. Don't degrade the safety of the product
through improper servicing.
NOTE: Parts that are not assigned part numbers
(---------) are not available.
Ref. No.DescriptionPart No.
A1XFRONT ASSEMBL Y E8B00ED1VM222640
A2TOP CASE(D5 P AL FTZ) H9700ED0VM101358
A3CHASSIS E8B00ED1VM221969
A7BOTTOM P ANEL H992URD1VM321771
A10!RATING LABEL E8D00ED---------A14BARCODE LABEL UNFIGURE E9704ED or----------
BAR CODE LABEL E8D00ED---------A22CHASSIS FOOT H79P9JD0VM412315
A24LABEL SERIAL NO. E5441JD or----------
LABEL SERIAL NO. E5705JD---------1B1DECK ASSEMBLY CZD014/VM25E0N25E0FL
1B2DVD M ECHA E7 N79F0KVMN79F0KVM
2B2TO P BRA CKET H97 00ED0VM204531
2B3LOAD ER HOLDE R H9600U D0VM306676
2B5SHEIL D CYLIN DER H970 0ED0VM306780
2B9CUSHIO N HC 460 ED0VM413251
2B16TAPE HIMELON H9206JD0VM413956
2B18FIBER TOP CASE HC460ED0VM412906
2B21!LASER CAUTION LABEL H9900ED---------2B40PARTITION PLATE E8B00ED1VM424064
2B54PLAT E GRO UND(RC A) H9700 ED0VM306867
2B55PLAT E GRO UND(21 P) H970 0ED0VM4164 44
2L011SCREW P-TIGHT M3X8 BIND HEAD+GBJP3080
2L012SCREW S-TIGHT M3X6 BIND HEAD+GBJS3060
2L020SCREW P-TIGHT M3X8 BIND HEAD+GBJP3080
2L021SCREW P-TIGHT M3*12 BIND+GBJP3120
2L022SCREW P-TIGHT M3X8 BIND HEAD+GBJP3080
2L041SCREW P-TIGHT 3X6 BIND HEAD+GBCP3060
2L051SCREW P-TIGHT M3X6 BIND HEAD+GBJP3060
2L054SCREW P-TIGHT M3X6 BIND HEAD+GBJP3060
2L071SCREW P-TIGHT M3*10 WASHERHEAD+GCJP3100
2L091SCREW P-TIGHT M3X8 BIND HEAD+GBCP3080
L0-9SCREW P-TIGHT M3X8 BIND HEAD+GBJP3080
PACKING
S1GIFT BOX CARTON E8B00ED1VM322617
S2STYROFOAM H9 600UD0VM204474E
S3UNIT BAG E5500UD0VM411683
S721P P AD HC4 63FD0VM413384
ACCESSORIES
X1REMOTE CONTROL UNIT 364/CZF05DDNB126ED
X2DRY BA TTER Y R6P/2S orXB0M451T0001
DRY BATTERY R6UW/2S orXB0M311MS001
DRY BATTERY ES-GR6M-CXB0M571GLP01
X3RF CORD P AL 1.2M orWPZ0122LG001
RF CABLE CC1001020012010WPZ0122LW001
X4ACCESSORY BAG E5795ED0VM416059
X5SCART CABLE 1. 5M CE10 130200 85710WX1E4300-012
X20A!OWNERS MANUAL(IT) E8B00ED1VMN22073
X20B!OWNERS MANUAL(GE) E8B00ED1VMN22074
X20C!OWNERS MANUAL(GR) E8B00ED1VMN22075
X21WARRANTY CARD(GR) E8B0 0ED1VMN22453
X22SERVICE CENTER LIST HC2C0ED0VMN03071C
200608301-18-1E8D00CA
Page 61
ELECTRICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a
! have special characteristics important to safety.
Before replacing any of these components, read
carefully the product safety notice in this service
manual. Don't degrade the safety of the product
through improper servicing.
NOTES:
1. Parts that are not assigned part numbers (---------)
are not available.
2. Tolerance of Capacitors and Resistors are noted
with the following symbols.
C.....±0.25%D.....±0.5%F.....±1%
G.....±2%J......±5%K.....±10%
M.....±20%N.....±30%Z.....+80/-20%
DVD MAIN CBA UNIT
Ref. No.DescriptionPart No.
DVD MAIN CBA UNITN7CGAKEP
MCV CBA
Ref. No.DescriptionPart No.
MCV CBA
Consists of the following:
MAIN CBA (MCV-A )
DVD OPEN/CLOSE CBA (MCV-C)
SENSOR CBA
MAIN CBA
Ref. No.DescriptionPart No.
MAIN CBA (MCV-A)
Consists of the following:
CAPACITORS
C056ELECTROL YTIC CAP. 47µF/25V M orCE1EMASDL470
ALUMINUM ELECTROL YT IC CAP 47µF/25V M CE1EMASTM470
C057ELECTROL YTIC CAP. 10µF/16V M H7 orCE 1CMA V SL100
ALUMINUM ELECTROL YT IC CAP 10µF/16V H7 CE1CMA VS M100
C058ELECTROL YTIC CAP. 220µF/6.3V M H7 orCE0KMASSL221
ELECTROLYTIC CAP . 22 0µF/6.3V M H7CE0KMASSM221
C059ELECTROL YTIC CAP. 100µF/6.3V M o rCE0KMASDL1 01
ELECTROLYTIC CAP . 10 0µF/6.3V MCE0KMASTM101
C062CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F1 04
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C063ELECTROL YTIC CAP. 47µF/16V M orCE1CMASDL470
ALUMINUM ELECTROL YT IC CAP 47µF/16V M CE1CMASTM470
C104ELECTROL YTIC CAP. 100µF/16V M orCE1CMASDL101
ELECTROLYTIC CAP . 10 0µF/16V MCE1CMASTM101
C107ELECTROL YTIC CAP. 470µF/6.3V M o rCE0KMASDL4 71
ELECTROLYTIC CAP . 47 0µF/6.3V MCE0KMASTM471
C109CHIP CERAMIC CAP .(1608) CH J 470pF/50VCHD1JJ3CH471
C112CHIP CERAMIC CAP .(1608) CH J 470pF/50VCHD1JJ3CH471
C113CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F1 04
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C114CHIP CERAMIC CAP .(1608) B K 1000pF/50VCHD1JK30B102
C116CHIP CERAMIC CAP . B K 2200pF/50VCHD1JK30B222
C117ELECTROL YTIC CAP. 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP 1µF/50V MCE1JMASTM1R0
C118CHIP CERAMIC CAP . B K 2200pF/50VCHD1JK30B222
C121ELECTROL YTIC CAP. 1µF/50V M H7 orCE 1JMA VS L1R0
ALUMINUM ELECTROL YT IC CAP 1µF/50V H7 CE1JMAVSM1R 0
1VSA14192
----------
---------1VSA10047
----------
Ref. No.DescriptionPart No.
C122ELECTROLYTIC CAP. 1µF/50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROLYTIC CAP 1µF/50V H7 CE1JMAVSM1R0
C123ELECTROLYTIC CAP. 1µF/50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROLYTIC CAP 1µF/50V H7 CE1JMAVSM1R0
C124ELECTROLYTIC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTM471
C125ELECTROLYTIC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTM471
C126ELECTROLYTIC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTM471
C127ELECTROLYTIC CAP. 10µF/16V M orCE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTM100
C128ELECTROLYTIC CAP. 22µF/6.3V M H7 orCE0KMASSL220
ALUMINUM ELECTROLYTIC CAP 22µF/6.3V H7CE0KMASSM220
C133CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C135CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C136ELECTROLYTIC CAP. 100µF/6.3V M H7 orCE0KMASSL101
ELECTROLYTIC CAP. 100µF/6.3V M H7CE0KMASSM101
C251ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMA VS L100
ALUMINUM ELECTROLYTIC CAP 10µF/16V H7 CE1CMAVSM100
C252CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C253CHIP CERAMIC CAP .(1608) B K 1000pF/50VCHD1JK30B102
C254ELECTROLYTIC CAP. 1µF/50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROLYTIC CAP 1µF/50V H7 CE1JMAVSM1R0
C301CHIP CERAMIC CAP .(1608) B K 0.022µF/50V or CHD1JK30B223
CHIP CERAMIC CAP.(1608) B K 0.022µF/25VCHD1EK30B223
C302ELECTROLYTIC CAP. 1µF/50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROLYTIC CAP 1µF/50V H7 CE1JMAVSM1R0
C303CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C305ELECTROLYTIC CAP. 1µF/50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROLYTIC CAP 1µF/50V H7 CE1JMAVSM1R0
C306CHIP CERAMIC CAP .(1608) B K 0.047µF/50V or CHD1JK30B473
CHIP CERAMIC CAP.(1608) B K 0.047µF/25VCHD1EK30B473
C307CHIP CERAMIC CAP .(1608) B K 0.022µF/50V or CHD1JK30B223
CHIP CERAMIC CAP.(1608) B K 0.022µF/25VCHD1EK30B223
C308CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C309CHIP CERAMIC CAP.(1608) CH J 68pF/50VCHD1JJ3CH680
C310CHIP CERAMIC CAP.(1608) CH J 68pF/50VCHD1JJ3CH680
C311CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C312ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMA VS L100
ALUMINUM ELECTROLYTIC CAP 10µF/16V H7 CE1CMAVSM100
C313ELECTROLYTIC CAP. 1µF/50V M H7 orCE1JMASSL1R0
ELECTROLYTIC CAP. 1µF/50V M H7CE1JMASSM1R0
C314CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C315CHIP CERAMIC CAP .(1608) B K 0.047µF/50V or CHD1JK30B473
CHIP CERAMIC CAP.(1608) B K 0.047µF/25VCHD1EK30B473
C316ELECTROLYTIC CAP. 1µF/50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROLYTIC CAP 1µF/50V H7 CE1JMAVSM1R0
C317CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C319CHIP CERAMIC CAP.(1608) CH J 68pF/50VCHD1JJ3CH680
C320CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C321CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C322CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C323CHIP CERAMIC CAP.(1608) CH J 68pF/50VCHD1JJ3CH680
200608301-19-1E8D00EL
Page 62
Ref. No.DescriptionPart No.
C324CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C325CHIP CERAMIC CAP . B K 8200pF/50VCHD1JK30B822
C326CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F1 04
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C328ELECTROL YTIC CAP. 47µF/6.3V M H7 orCE0KMAVSL470
ALUMINUM ELECTROL YT IC CAP 47µF/6.3V H7CE0KMAVSM470
C329CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F1 04
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C331ELECTROL YTIC CAP. 47µF/6.3V M H7 orCE0KMAVSL470
ALUMINUM ELECTROL YT IC CAP 47µF/6.3V H7CE0KMAVSM470
C333CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F1 04
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C334ELECTROL YTIC CAP. 1µF/50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROL YT IC CAP 1µF/50V H7 CE1JMAVSM1R 0
C335ELECTROL YTIC CAP. 100µF/6.3V H7 o rCE0KMA V SL101
ALUMINUM ELECTROL YT IC CAP 100µF/6.3V H7CE0KMAVSM101
C336CHIP CERAMIC CAP . CH J 220pF/50VCHD1JJ3CH221
C337CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F1 04
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C339CHIP CERAMIC CAP . CH J 120pF/50VCHD1JJ3CH121
C340ELECTROL YTIC CAP. 1µF/50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROL YT IC CAP 1µF/50V H7 CE1JMAVSM1R 0
C341CHIP CERAMIC CAP .(1608) CH D 10pF/50VCHD1JD3CH100
C342CHIP CERAMIC CAP .(1608) B K 1000pF/50VCHD1JK30B102
C343ELECTROL YTIC CAP. 10µF/16V M H7 orCE 1CMA V SL100
ALUMINUM ELECTROL YT IC CAP 10µF/16V H7 CE1CMA VS M100
C344ELECTROL YTIC CAP. 4.7µF/25V M NP H7CP1EMAVSB4R7
C345ELECTROL YTIC CAP. 0.47µF/50V M H7 orCE1JMAVS LR47
ALUMINUM ELECTROL YT IC CAP 0.47µF/50V H7CE1JMA VS MR47
C346CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F1 04
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C347CHIP CERAMIC CAP .(1608) B K 0.1µF/25V orCHD1EK30B104
CHIP CERAMIC CAP .(1608) B K 0.1µF/16VCHD1CK30B104
C349ELECTROL YTIC CAP. 0.47µF/50V M H7 orCE1JMAVS LR47
ALUMINUM ELECTROL YT IC CAP 0.47µF/50V H7CE1JMA VS MR47
C350CERAMIC CAP.(AX) F Z 0.1µF/50VCCA1JZTFZ104
C402FILM CAP.(P) 0.018µF/50V J orCMA1JJP00183
FILM CAP.(P) 0. 018 µF/50V J orCA1J183MS029
FILM CAP.(P) 0. 018 µF/100V JCMA2AJP0018 3
C403CERAMIC CAP. B K 470pF/100VCCD2AKS0B471
C404ELECTROL YTIC CAP. 220µF/6.3V M H7 orCE0KMASSL221
ELECTROLYTIC CAP . 22 0µF/6.3V M H7CE0KMASSM221
C405ELECTROL YTIC CAP. 47µF/6.3V M H7 orCE0KMAVSL470
ALUMINUM ELECTROL YT IC CAP 47µF/6.3V H7CE0KMAVSM470
C407CHIP CERAMIC CAP .(1608) B K 1000pF/50VCHD1JK30B102
C408CHIP CERAMIC CAP . B K 1800pF/50VCHD1JK30B182
C409CHIP CERAMIC CAP .(1608) CH J 33pF/50VCHD1JJ3CH330
C410ELECTROL YTIC CAP. 10µF/16V M H7 orCE 1CMA V SL100
ALUMINUM ELECTROL YT IC CAP 10µF/16V H7 CE1CMA VS M100
C411CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C412ELECTROL YTIC CAP. 33µF/6.3V M H7 orCE0KMAVSL330
ALUMINUM ELECTROL YT IC CAP 33µF/6.3V H7CE0KMAVSM330
C413CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F1 04
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C414CHIP CERAMIC CAP .(1608) B K 0.022µF/50V or CHD1JK30 B223
CHIP CERAMIC CAP .(1608) B K 0.022µF/25VCHD1EK30B223
C415ELECTROL YTIC CAP. 4.7µF/25V M H7 orCE1EMAVSL4R7
ALUMINUM ELECTROL YT IC CAP 4.7µF/25V H7CE1EMAVSM4R7
C416CHIP CERAMIC CAP .(1608) B K 4700pF/50VCHD1JK30B472
C417ELECTROL YTIC CAP. 22µF/6.3V M H7 orCE0KMAVSL220
ALUMINUM ELECTROL YT IC CAP 22µF/6.3V H7CE0KMAVSM220
Ref. No.DescriptionPart No.
C418CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C419CHIP CERAMIC CAP . CH J 220pF/50VCHD1JJ3CH221
C421ELECTROLYTIC CAP. 47µF/6.3V M H7 orCE0KMAVSL470
ALUMINUM ELECTROLYTIC CAP 47µF/6.3V H7CE0KMAVSM470
C451CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C452ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMA VS L100
ALUMINUM ELECTROLYTIC CAP 10µF/16V H7 CE1CMAVSM100
C453ELECTROLYTIC CAP. 22µF/10V M H7 orCE1AMAVSL220
ALUMINUM ELECTROLYTIC CAP 22µF/10V H7 CE1AMAVSM220
C454CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C455CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C456ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMA VS L100
ALUMINUM ELECTROLYTIC CAP 10µF/16V H7 CE1CMAVSM100
C457ELECTROLYTIC CAP. 4.7µF/25V M H7 orCE1EMAVSL4R7
ALUMINUM ELECTROLYTIC CAP 4.7µF/25V H7CE1EMAVSM4R7
C458CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C461CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C462CHIP CERAMIC CAP .(1608) B K 4700pF/50VCHD1JK30B472
C463ELECTROLYTIC CAP. 22µF/10V M H7 orCE1AMAVSL220
ALUMINUM ELECTROLYTIC CAP 22µF/10V H7 CE1AMAVSM220
C464CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C465ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMA VS L100
ALUMINUM ELECTROLYTIC CAP 10µF/16V H7 CE1CMAVSM100
C466CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C467CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C468ELECTROLYTIC CAP. 220µF/6.3V M H7 orCE0KMAVSL221
ALUMINUM ELECTROLYTIC CAP 220µF/6.3V H7CE0KMAVSM221
C469ELECTROLYTIC CAP. 22µF/10V M H7 orCE1AMAVSL220
ALUMINUM ELECTROLYTIC CAP 22µF/10V H7 CE1AMAVSM220
C470CHIP CERAMIC CAP .(1608) B K 4700pF/50VCHD1JK30B472
C471CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C472ELECTROLYTIC CAP. 4.7µF/25V M H7 orCE1EMAVSL4R7
ALUMINUM ELECTROLYTIC CAP 4.7µF/25V H7CE1EMAVSM4R7
C473ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMA VS L100
ALUMINUM ELECTROLYTIC CAP 10µF/16V H7 CE1CMAVSM100
C474CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C475CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C476ELECTROLYTIC CAP. 22µF/6.3V M H7 orCE0KMAVSL220
ALUMINUM ELECTROLYTIC CAP 22µF/6.3V H7CE0KMAVSM220
C477CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C478CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C479ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMA VS L100
ALUMINUM ELECTROLYTIC CAP 10µF/16V H7 CE1CMAVSM100
C480ELECTROLYTIC CAP. 4.7µF/25V M H7 orCE1EMAVSL4R7
ALUMINUM ELECTROLYTIC CAP 4.7µF/25V H7CE1EMAVSM4R7
C481ELECTROLYTIC CAP. 4.7µF/25V M H7 orCE1EMAVSL4R7
ALUMINUM ELECTROLYTIC CAP 4.7µF/25V H7CE1EMAVSM4R7
C482CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C483ELECTROLYTIC CAP. 4.7µF/25V M H7 orCE1EMAVSL4R7
ALUMINUM ELECTROLYTIC CAP 4.7µF/25V H7CE1EMAVSM4R7
C484ELECTROLYTIC CAP. 4.7µF/25V M H7 orCE1EMAVSL4R7
200608301-19-2E8D00EL
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Ref. No.DescriptionPart No.
ALUMINUM ELECTROL YT IC CAP 4.7µF/25V H7CE1EMAVSM4R7
C485ELECTROL YTIC CAP. 10µF/16V M H7 orCE 1CMA V SL100
ALUMINUM ELECTROL YT IC CAP 10µF/16V H7 CE1CMA VS M100
C486CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F1 04
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C487ELECTROL YTIC CAP. 47µF/16V M H7 orCE 1CMA V SL470
ALUMINUM ELECTROL YT IC CAP 47µF/16V H7 CE1CMA VS M470
C488CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F1 04
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C502CHIP CERAMIC CAP .(1608) B K 0.022µF/50V or CHD1JK30 B223
CHIP CERAMIC CAP .(1608) B K 0.022µF/25VCHD1EK30B223
C505CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C506ELECTROL YTIC CAP. 220µF/6.3V M H7 orCE0KMAVSL221
ALUMINUM ELECTROL YT IC CAP 220µF/6.3V H7CE0KMAVSM221
C507CHIP CERAMIC CAP .(1608) B K 1000pF/50VCHD1JK30B102
C508CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F1 04
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C509CHIP CERAMIC CAP .(1608) B K 1000pF/50VCHD1JK30B102
C510CHIP CERAMIC CAP .(1608) B K 4700pF/50VCHD1JK30B472
C511CHIP CERAMIC CAP .(1608) CH J 100pF/50VCHD1JJ3CH101
C512CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C514CHIP CERAMIC CAP . CH J 330pF/50VCHD1JJ3CH331
C515CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F1 04
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C516ELECTROL YTIC CAP. 22µF/6.3V M H7 orCE0KMASSL220
ALUMINUM ELECTROL YT IC CAP 22µF/6.3V H7CE0KMASSM220
C517CHIP CERAMIC CAP .(1608) B K 0.022µF/50V or CHD1JK30 B223
CHIP CERAMIC CAP .(1608) B K 0.022µF/25VCHD1EK30B223
C518ELECTROL YTIC CAP. 22µF/6.3V M H7 orCE0KMAVSL220
ALUMINUM ELECTROL YT IC CAP 22µF/6.3V H7CE0KMAVSM220
C519CHIP CERAMIC CAP . CH J 560pF/50VCHD1JJ3CH561
C521ELECTROL YTIC CAP. 22µF/6.3V M H7 orCE0KMASSL220
ALUMINUM ELECTROL YT IC CAP 22µF/6.3V H7CE0KMASSM220
C524CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C527CERAMIC CAP.(AX) B K 100pF/50VCCA1JKT0B101
C530CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F1 04
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C531CHIP CERAMIC CAP .(1608) B K 4700pF/50VCHD1JK30B472
C533CHIP CERAMIC CAP .(1608) B K 0.047µF/50V or CHD1JK30 B473
CHIP CERAMIC CAP .(1608) B K 0.047µF/25VCHD1EK30B473
C534ELECTROL YTIC CAP. 47µF/6.3V M H7 orCE0KMAVSL470
ALUMINUM ELECTROL YT IC CAP 47µF/6.3V H7CE0KMAVSM470
C535CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F1 04
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C538CHIP CERAMIC CAP . CH J 180pF/50VCHD1JJ3CH181
C539CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C540CHIP CERAMIC CAP .(1608) B K 4700pF/50VCHD1JK30B472
C541CHIP CERAMIC CAP . CH J 18pF/50VCHD1JJ3CH180
C542CHIP CERAMIC CAP . CH J 18pF/50VCHD1JJ3CH180
C543CHIP CERAMIC CAP . CH J 18pF/50VCHD1JJ3CH180
C544CHIP CERAMIC CAP . CH J 20pF/50VCHD1JJ3CH200
C545CHIP CERAMIC CAP .(1608) CH J 22pF/50VCHD1JJ3CH220
C546CHIP CERAMIC CAP . CH J 18pF/50VCHD1JJ3CH180
C547CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C548CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F1 04
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C549ELECTROL YTIC CAP. 1µF/50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROL YT IC CAP 1µF/50V H7 CE1JMAVSM1R 0
C550ELECTROL YTIC CAP. 100µF/6.3V H7 o rCE0KMA V SL101
ALUMINUM ELECTROL YT IC CAP 100µF/6.3V H7CE0KMAVSM101
C553ELECTROL YTIC CAP. 22µF/10V M H7 orCE1AMAVSL220
ALUMINUM ELECTROL YT IC CAP 22µF/10V H7 CE1AMAVSM220
C555CHIP CERAMIC CAP .(1608) B K 0.1µF/25V orCHD1EK30B104
Ref. No.DescriptionPart No.
CHIP CERAMIC CAP.(1608) B K 0.1µF/16VCHD1CK30B104
C612CHIP CERAMIC CAP .(1608) B K 4700pF/50VCHD1JK30B472
C614CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C615ELECTROLYTIC CAP. 100µF/6.3V M H7 orCE0KMASSL101
ELECTROLYTIC CAP. 100µF/6.3V M H7CE0KMASSM101
C703CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C704CERAMIC CAP .(AX) SL J 39pF/50VCCA1JJTSL390
C709CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C711CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C712CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C715CHIP CERAMIC CAP. F Z 0.22µF/16VCHD1CZ30F224
C716CHIP CERAMIC CAP. F Z 0.22µF/16VCHD1CZ30F224
C751CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C752ELECTROLYTIC CAP. 47µF/10V M orCE1AMASDL470
ALUMINUM ELECTROLYTIC CAP 47µF/10V M CE1AMASTM470
C753ELECTROLYTIC CAP. 4.7µF/50V M orCE1JMASDL4R7
ALUMINUM ELECTROLYTIC CAP 4.7µF/50V M CE1JMASTM4R7
C754ELECTROLYTIC CAP. 4.7µF/50V M H7 orCE1JMASSL4R7
ALUMINUM ELECTROLYTIC CAP 4.7µF/50V H7CE1JMASSM4R7
C755CHIP CERAMIC CAP . B K 2200pF/50VCHD1JK30B222
C756CHIP CERAMIC CAP . B K 2200pF/50VCHD1JK30B222
C757ELECTROLYTIC CAP. 47µF/6.3V M H7 orCE0KMASSL470
ALUMINUM ELECTROLYTIC CAP 47µF/6.3V H7CE0KMASSM470
C758CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C783CHIP CERAMIC CAP.(1608) CH J 470pF/50VCHD1JJ3CH471
C784CHIP CERAMIC CAP.(1608) CH J 470pF/50VCHD1JJ3CH471
C1036CHIP CERAMIC CAP .(1608) B K 1µF/10VCHD1AK30B105
C1038CHIP CERAMIC CAP .(1608) B K 0.33µF/10VCHD1AK30B334
C1040ELECTROLYTIC CAP. 100µF/6.3V M orCE0KMASDL101
ELECTROLYTIC CAP. 100µF/6.3V MCE0KMASTM101
C1042ELECTROLYTIC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTM471
C1050CHIP CERAMIC CAP .(1608) B K 0.33µF/10VCHD1AK30B334
C1051CHIP CERAMIC CAP .(1608) B K 0.33µF/10VCHD1AK30B334
C1052ELECTROLYTIC CAP. 220µF/16V M orCE1CMASDL221
ELECTROLYTIC CAP. 220µF/16V MCE1CMASTM221
C1056CHIP CERAMIC CAP .(1608) B K 1000pF/50VCHD1JK30B102
C1201ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMASSL100
ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSM100
C1202ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMASSL100
ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSM100
C1205CHIP CERAMIC CAP. CH J 220pF/50VCHD1JJ3CH221
C1206CHIP CERAMIC CAP. CH J 220pF/50VCHD1JJ3CH221
C1207CHIP CERAMIC CAP .(1608) CH J 6 8pF/50VCHD1JJ3CH680
C1208CHIP CERAMIC CAP .(1608) CH J 6 8pF/50VCHD1JJ3CH680
C1221ELECTROLYTIC CAP. 10µF/16V M orCE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTM100
C1222ELECTROLYTIC CAP. 10µF/16V M orCE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTM100
C1245CHIP CERAMIC CAP .(1 608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C1246CHIP CERAMIC CAP .(1 608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C1247ELECTROLYTIC CAP. 470µF/16V M orCE1CMASDL471
ELECTROLYTIC CAP. 470µF/16V MCE1CMASTM471
C1249ELECTROLYTIC CAP. 47µF/16V M orCE1CMASDL470
ALUMINUM ELECTROLYTIC CAP 47µF/16V M CE1CMASTM470
C1352CHIP CERAMIC CAP .(1 608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C1353CHIP CERAMIC CAP .(1608) B K 0.1µF/25V orCHD1EK30B104
CHIP CERAMIC CAP.(1608) B K 0.1µF/16VCHD1CK30B104
C1354CHIP CERAMIC CAP .(1608) CH J 1 00pF/50VCHD1JJ3CH101
200608301-19-3E8D00EL
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Ref. No.DescriptionPart No.
C1355CHIP CERAMIC CAP. F Z 1µF/10V orCHD1AZB0F105
CHIP CERAMIC CAP . F Z 1µF/10VCHD1AZ30F105
C1359CHIP CERAMIC CAP. CH D 9pF/50VCHD1JD3CH9R0
C1421CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C1422CHIP CERAMIC CAP.(1608) B K 0.1µF/25V orCHD1EK30B104
CHIP CERAMIC CAP .(1608) B K 0.1µF/16VCHD1CK30B104
C1441CHIP CERAMIC CAP.(1608) B K 0.33µF/10VCHD1AK30B334
C1442ELECTROLYTIC CAP. 470µF/6.3V M orCE0KMAS DL471
ELECTROLYTIC CAP . 47 0µF/6.3V MCE0KMASTM471
C1523CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C1524ELECTROLYTIC CAP. 100µF/6.3V M orCE0KMAS DL101
ELECTROLYTIC CAP . 10 0µF/6.3V MCE0KMASTM101
C1535CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C1536ELECTROLYTIC CAP. 22µF/6.3V M orCE0KMASDL220
ALUMINUM ELECTROL YT IC CAP 22µF/6.3V M CE0KMASTM220
C2002CHIP CERAMIC CAP.(1608) B K 1000pF/50VCHD1JK30B102
C2004ELECTROLYTIC CAP. 100µF/6.3V M H7 orCE0KMASSL101
ELECTROLYTIC CAP . 10 0µF/6.3V M H7CE0KMASSM101
C2012CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
CONNECTORS
CN051242 SERIE S CONNEC TOR 224202 117W1J322C17TG001
CN701AFV PCB ASSEMBL Y H990PEDH990PAFV
JK754RCA JA CK 1P MSP-2 81V31 -A(B110 )JYRL010LY027
JK1202RCA JACK MSP-28 1V41- B( B110)JXRL010LY140
JK1401S TYPE JACK MDC-050V -2.4 LF(B110 orJXEL040L Y003
S TYPE JACK DIN-425-01JXEL040YUQ01
JW006FFC CABLE 27P FFC/P1.00/260WX1E8B00-103
JW007FFC CABLE 16P FFC/P1.00/170WX1E8B00-101
PS502PHOTO INTERRUPTER RPI-302C70QPWZP1302C70
RM2001SENSOR REMOTE RECEIVER KSM-602LU2S orUSESJRSKK048
Q1001! FET 2SK3566QFWZ02SK3566
Q1003TRANSISTOR 2SC1815-GR(TE2 F T)QQS12SC1815F
Q1004TRANSISTOR KT A1 267-Y-AT /P orNQSYKTA1267P
Ref. No.DescriptionPart No.
TRANSISTOR KTA1267-GR-A T/PNQS1KTA1267P
Q1008TRANSISTOR KTC3199-Y-A T/P orNQSYKTC3199P
TRANSISTOR KTC3199-GR-AT/P orNQS4KTC3199P
TRANSISTOR 2SC1815-Y(TE2 F T) orQQSY2SC1815F
TRANSISTOR 2SC1815-GR(TE2 F T)QQS12SC1815F
RESISTORS
R057CHIP RES. 1/10W J 22 0 k Ω orRRXAJR5Z0224
RES CHIP 1608 1/10W J 220 k ΩRRXA224YF002
R1002CARBON RES. 1/4W J 560 k ΩRCX4JATZ0564
R1003CARBON RES. 1/4W J 560 k ΩRCX4JATZ0564
R1004METAL O XIDE FILM RES . 2W J 82 k Ω orRN02JZLZ0823
MET AL OXIDE FILM RES. 2W J 82 k Ω orRN02JZQZ0823
MET AL OXIDE FILM RES. 2W J 82 k ΩRN02JZPZ0823
R1005CARBON RES. 1/4W J 1M ΩRCX4JATZ0105
R1006CARBON RES. 1/4W J 1M ΩRCX4JATZ0105
R1007CARBON RES. 1/4W J 1M ΩRCX4JATZ0105
R1008CARBON RES. 1/4W J 560 ΩRCX4JATZ0561
R1010CARBON RES. 1/6W J 8.2 k Ω orRCX6JA TZ0822
CARBON RES. 1/4W J 8.2 k ΩRCX4JATZ0822
R1011METAL OXIDE FILM RES. 1W J 1.3 Ω orRN01JZLZ01R3
MET AL OXIDE FILM RES. 1W J 1.3 Ω orRN01JZQZ0 1R3
MET AL OXIDE FILM RES. 1W J 1.3 ΩRN01JZPZ01R3
R1020CHIP RES. 1/10W J 1.8 k Ω orRRXAJR5Z0182
RES CHIP 1608 1/10W J 1.8 k ΩRRXA182YF002
R1021CHIP RES. 1/10W J 1 k Ω orRRXAJR5Z0102
RES CHIP 1608 1/10W J 1.0 k ΩRRXA102YF002
R1022CHIP RES. 1/10W J 4.7 k Ω orRRXAJR5Z0472
RES CHIP 1608 1/10W J 4.7 k ΩRRXA472YF002
R1023CHIP RES. (160 8) 1 /10W F 2 .2 k Ω orRRXAFR5H0222
CHIP RES. 1/10W F 2.2 k Ω orRRXAFR5Z0222
RES CHIP 1608 1/10W F 2.20 k ΩRTW2201YF002
R1025CHIP RES. 1/10W F 5.6 k Ω orRRXAFR5H0562
CHIP RES. 1/10W F 5.6 k Ω orRRXAFR5Z0562
RES CHIP 1608 1/10W F 5.60 k ΩRTW5601YF002
R1029CARBON RES. 1/6W J 100 k Ω orRCX6JA TZ0104
CARBON RES. 1/4W J 100 k ΩRCX4JATZ0104
R1032CARBON RES. 1/4W G 1 k ΩRCX4GA TZ0102
R1035CARBON RES. 1/6W J 1 k Ω orRCX6JA TZ0 102
CARBON RES. 1/4W J 1 k ΩRCX4JATZ0102
R1036CARBON RES. 1/6W J 100 k Ω orRCX6JA TZ0104
CARBON RES. 1/4W J 100 k ΩRCX4JATZ0104
R1037CARBON RES. 1/6W J 10 k Ω orRCX6JA TZ0103
CARBON RES. 1/4W J 10 k ΩRCX4JATZ0103
R1038CARBON RES. 1/6W J 100 k Ω orRCX6JA TZ0104
CARBON RES. 1/4W J 100 k ΩRCX4JATZ0104
R1039CARBON RES. 1/6W J 470 k Ω orRCX6JA TZ0474
C101CHIP CERAMIC CAP .(1608) B K 1000pF/50VCHD1JK30B102
C102ELECTROL YTIC CAP. 1µF/50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROL YT IC CAP 1µF/50V H7 CE1JMAVSM1R 0
C103ELECTROL YTIC CAP. 100µF/16V M orCE1CMASDL101
ELECTROLYTIC CAP . 10 0µF/16V MCE1CMASTM101
C105CHIP CERAMIC CAP . B K 2200pF/50VCHD1JK30B222
C106CHIP CERAMIC CAP .(1608) CH J 470pF/50VCHD1JJ3CH471
C108ELECTROL YTIC CAP. 470µF/6.3V M o rCE0KMASDL4 71
ELECTROLYTIC CAP . 47 0µF/6.3V MCE0KMASTM471
C110CHIP CERAMIC CAP . B K 2200pF/50VCHD1JK30B222
C111CHIP CERAMIC CAP .(1608) CH J 470pF/50VCHD1JJ3CH471
C119CHIP CERAMIC CAP . B K 2200pF/50VCHD1JK30B222
CHIP CERAMIC CAP. CH D 3pF/50VCHD1JD3CH3R0
C8CHIP CERAMIC CAP. CH C 3pF/50V orCHD1JC3CH3R0
CHIP CERAMIC CAP. CJ C 3pF/50V orCHD1JC3CJ3R0
CHIP CERAMIC CAP. CH D 3pF/50VCHD1JD3CH3R0
C11CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C12ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMASSL100
ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSM100
C13CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C14CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C15ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMASSL100
ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSM100
C16ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMASSL100
ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSM100
C17CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C19CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C20ELECTROLYTIC CAP. 3.3µF/50V M H7 orCE1JMASSL3R3
ALUMINUM ELECTROLYTIC CAP 3.3µF/50V H7CE1JMASSM3R3
C21CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C22ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMASSL100
ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSM100
C24ELECTROLYTIC CAP. 0.22µF/50V M H7 orCE1JMASSLR22
ALUMINUM ELECTROLYTIC CAP 0.22µF/50V H7CE1JMASSMR22
C26CHIP CERAMIC CAP.(1608) CH J 22pF/50VCHD1JJ3CH220
C27CERAMIC CAP.(AX) F Z 0.1µF/50VCCA1JZTFZ104