Note: Nominal specs represent the design specs. All units should be able to approximate these – some will exceed
and some may drop slightly below these specs. Limit s pecs represent the ab solute worst conditi on that still might
be considered acceptable; In no case should a unit fail to meet limit specs.
1. All Items are measured without pre-emphasis unless otherwise specified.
2. Power supply : AC230 V 60 Hz
3. Load imp. : 100 K ohm
4. Room ambient : 5
°C ~ 40 °C
1-1-2H9500SP
Page 5
LASER BEAM SAFETY PRECAUTIONS
This DVD player uses a pickup that emits a laser beam.
Do not look directly at the l aser beam coming
from the pickup or allo w it t o str ike agai nst your
skin.
The laser beam is emitted from the locatio n shown in the figure. When ch ecking the laser d iode, be sure to keep
your eyes at least 30cm away from the pickup lens when the diode is tur ned on. Do not loo k directly at the laser
beam.
Caution: Use of controls an d adjustments, or doing pr ocedures other than th ose specified here in, may result in
hazardous radiation exposure.
Drive Mecha Assembly
Laser Beam Radiation
Laser Pickup
Turntable
1-2-1DVD_LASER
Page 6
IMPORTANT SAFETY PRECAUTIONS
Product Safety Notice
Some electrical and mechanical parts have special
safety-related characteristics which are often not evident from visual inspection, nor can the protection they
give necessarily be obtained by replacing them with
components rated for higher voltage, wattage, etc.
Parts that have special safety characteristics are identified by a ! on schematics and in parts lists. Use of a
substitute replacement that does not have the same
safety characteristics as the recommended replacement par t might create shock, fire, and/or other h azards. The Product’s Safety is under review
continuously and new instructions are issued whenever appropriate. Prior to shipment from the factory,
our products are carefully inspected to confirm with
the recognized product safety and electrical codes of
the countries in which they are to be sold. However, in
order to maintain such compli ance, it is equall y impor tant to implement the following precautions when a set
is being serviced.
Precautions during Servicing
A. Parts identified by the ! symbol are critical for
safety. Replace only with part number specified.
B. In addition to safety, other parts and assemblies
are specified for conformance with regulations
applying to spurious radiation. These must also be
replaced only with specified re pla ce men ts.
Examples: RF converters, RF cables, noise blocking capacitors, and noise blocking filters, etc.
C. Use specified internal wiring. Note especially:
1)Wires covered with PVC tubing
2)Double insulated wires
3)High voltage leads
D. Use specified insulating materials for hazardous
live parts. Note especially:
1)Insulation tape
2)PVC tubing
3)Spacers
4)Insulators for transistors
E. When replacing AC primary side components
(transformers, power cord, etc.), wrap ends of
wires securely about the terminals before soldering.
F. Observe that the wires do not conta ct heat produc -
ing parts (heats inks, oxide metal fil m resis tors, fusible resistors, etc.).
G. Check that replaced wires do not contact sharp
edges or pointed parts.
H. When a power cord has been replaced, check that
5 - 6 kg of force in any direction will not loosen it.
I. Also check areas surrounding repair ed loc at ion s.
J. Be careful that foreign objects (screws, solder
droplets, etc.) do not remain inside the set.
K. Crimp type wire connector
The power transformer uses cri mp type con nector s
which connect the power cord and the primary side
of the transformer. When replacing the transformer,
follow these steps carefully and precisely to prevent
shock hazards.
Replacement procedure
1)Remove the old connector by cutting the wires at a
point close to the connector.
Important: Do not re-use a connector. (Discard it.)
2)Strip about 15 mm of the insulation from the ends
of the wires. If the wires are stranded, twist the
strands to avoid frayed conductors.
3)Align the lengths of the wires to be connected.
Insert the wires fully into the connector.
4)Use a crimping tool to crimp the metal sleeve at its
center. Be sure to crimp fully to t he complete closure of the tool.
L. When connecting or disconnecting the internal
connectors, first, disc onnect the AC plug from the
AC outlet.
1-3-1DVD_SFNP
Page 7
Safety Check afte r Servicing
Examine the area surrounding the repaired location for
damage or deteri oration. Observe that screws, par ts,
and wires have been returned to their original positions. Afterwards, do the following tests and confirm
the specified values to verify compliance with safety
standards.
1. Clearance Distance
When replacing primary circuit components, confirm
specified clearanc e distance (d ) and (d’) be tween soldered terminals, and between terminals and surrounding metallic parts. (See Fig. 1)
Table 1 : Ratings for selected area
AC Line VoltageClearance Distance (d) (d’)
Chassis or Secondary Conductor
Primary Circuit Terminals
dd'
230 V
Note: This table is unofficial and for reference only.
Be sure to confirm the precise values.
≥3mm(d)
≥6 mm(d’)
2. Leakage Current Test
Confirm the specified (or lower) leakage current
between B (earth ground, power cord plug prongs)
and externally exposed accessible parts (RF terminals, antenna terminals, video and audio input and
output terminals, microphone jacks, earphone jacks,
etc.) is lower than or equal to the specified value in the
table below.
Measuring Method (Power ON) :
Insert load Z between B (earth ground, power cord
plug prongs) and exposed accessible parts. Use an
AC voltmeter to measure across the ter minals of load
Z. See Fig. 2 and the following table.
Table 2: Leakage current ratings for selected areas
AC Line VoltageLoad ZLeakage Current (i)
2kΩ RES.
Connected in
parallel
230 V
50kΩ RES.
Connected in
parallel
i≤0.7mA AC Peak
i≤2mA DC
i≤0.7mA AC Peak
i≤2mA DC
Exposed Accessible Part
Z
One side of
B
Power Cord Plug Prongs
One side of power cord plug
prongs (B) to:
Antenna terminals
A/V Input, Output
AC Voltmeter
(High Impedance)
RF or
Fig. 1
Fig. 2
Note: This table is unofficial and for reference only. Be sure to confirm the precise values.
1-3-2DVD_SFNP
Page 8
STANDARD NOTES FOR SERVICING
Circuit Board Indications
a. The output pin of the 3 pin Regulator ICs is indi-
cated as shown.
Top View
Out
b. For other ICs, pin 1 and every fifth pin are indicated
as shown.
Input
In
Pin 1
c. The 1st pin of every ma le c on nec tor i s indi ca ted a s
shown.
Pin 1
Bottom View
5
10
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:.
(1) Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
Fig. S-1-1
(2) Remove the flat pack-IC with tweezers while apply-
ing the hot air.
(3) Bottom of the flat pack-IC is fixed with glue t o the
CBA; when rem oving enti re flat pa ck-IC, first apply
soldering iron to ce nter of the flat pack-IC and hea t
up. Then remove (glue will be melted). (Fig. S-1-6)
(4) Release the flat pack-IC from the CB A using twee-
zers. (Fig. S-1-6)
Instructions for Connectors
1. When you conn ect or disconn ect t he FFC (Flexible
Foil Connector) cable, be sure to first disconnect
the AC cord.
2. FFC (Flexible Foil Connector) cable should be
inserted parallel into the connector, not at an angle.
FFC Cable
Connector
CBA
* Be careful to avoid a short circuit.
Caution:
1. D o not supply hot air to the chip par ts around the
flat pack-IC for over 6 seconds because damage to
the chip parts may occur. Put masking tape around
the flat pack-IC to protect other parts from damage.
(Fig. S-1-2)
2. The flat pack-IC on the CBA is affixed with glue, so
be careful not to brea k or damage the foil of each
pin or the solder lands under the IC when removing
it.
Hot-air
Flat Pack-IC
Desoldering
CBA
Masking
Tape
Tweezers
Machine
Flat Pack-IC
Fig. S-1-2
1-4-1DVD_NOTE
Page 9
With Soldering Iron:
(1)Using desoldering braid, remove the solder from all
pins of the flat pack-IC. When you use solder flux
which is applied to all pins of the flat pack-IC, you
can remove it easily. (Fig. S-1-3)
Flat Pack-IC
Desoldering Braid
(4) Bottom of the flat pack-IC is fixed with glue t o the
CBA; when rem oving enti re flat pa ck-IC, first apply
soldering iron to ce nter of the flat pack-IC and hea t
up. Then remove (glue will be melted). (Fig. S-1-6)
(5) Release the flat pack-IC from the CB A using twee-
zers. (Fig. S-1-6)
Note:
When using a solder ing iron, care must be taken
to ensure that the flat pack-IC is not bei ng held by
glue. When the flat pack-IC is removed from the
CBA, handle it gently beca use it may be damaged
if force is applied.
Soldering Iron
Fig. S-1-3
(2) Lift each lead of the flat pack-IC upward one by
one, using a shar p pin or wire to which s older will
not adhere (iron wi re). When he ating the pins, us e
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Sharp
Pin
Fine Tip
Soldering Iron
Fig. S-1-4
(3)Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to c en ter of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
(4)Release the flat pack-IC from the CBA us ing twee-
zers. (Fig. S-1-6)
With Iron Wire:
(1)Using desoldering braid, remove the solder from all
pins of the flat pack-IC. When you use solder flux
which is applied to all pins of the flat pack-IC, you
can remove it easily. (Fig. S-1-3)
(2) Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
(3) While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solde r
melts so as to lift the IC leads from the CBA contact
pads as shown in Fig. S-1-5
To Solid
Mounting Point
CBA
Tweezers
Hot Air Blower
or
Iron Wire
Soldering Iron
Fig. S-1-5
Fine Tip
Soldering Iron
Flat Pack-IC
Fig. S-1-6
1-4-2DVD_NOTE
Page 10
2. Installation
(1) Using desoldering braid, remove the solder from
the foil of each pin of the flat pack-IC on the CBA
so you can install a replacement fla t pack-IC more
easily.
(2) The “I” mark on the flat pack-IC indicates pin 1.
(See Fig. S-1-7.) Be s ure this mark matches the 1
on the PCB when positioni ng for installation. Then
presolder the four cor ners of the fl at pack-IC. (See
Fig. S-1-8.)
(3)Solder all pins of the flat pack-IC. Be sure that none
of the pins have solder bridges.
Example :
Pin 1 of the Flat Pack-IC
is indicated by a " " mark.
Fig. S-1-7
Instructions for Handling
Semi-conductors
Electrostatic breakdown of the semi-conductors may
occur due to a potential di fference caused by electrostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a groun ding band (1M Ω) that is properly grounded to re move any static electr ici ty that may
be charged on the body.
2. Ground for Workbench
(1) Be sure to place a conductive sheet or copper plate
with proper grounding (1MΩ) on the workbench or
other surface, where the semi-conductors are to be
placed. Because the static electricity charge on
clothing will not escape thr ough the body grounding band, be careful t o avoid contacting semi-conductors with your clothing.
< Incorrect >
CBA
Presolder
Flat Pack-IC
Fig. S-1-8
CBA
< Correct >
Grounding Band
1MΩ
CBA
1MΩ
Conductive Sheet or
Copper Plate
1-4-3DVD_NOTE
Page 11
PREPARATION FOR SERVICING
How to Enter the Service Mode
About Optical Sensors
Caution:
An optical sensor system is used for the Tape Start
and End Sensors on this equipment. Carefully read
and follow the instructions below. Otherwise the unit
may operate erratically.
What to do for preparation
Insert a tap e into the Deck Mechan ism Assembly and
press the PLAY button. The tape will be loaded into
the Deck Mechanism Assembly. Make sure the power
is on, connect TP501 (SENSOR INHIBITION) to
GND. This will stop the function of Tape Star t Sensor,
Tape End Senso r and Reel Se nsors. (If the se TPs are
connected before plugging in the unit, the funct ion of
the sensors will stay valid.) See Fig. 1.
Note: Because the Tape E nd Sensor s are in active, do
not run a tape all the way to the start or the en d of the
tape to avoid tape damage.
Q503
Q504
TP501
S-INH
Fig. 1
1-5-1H9500PFS
Page 12
CABINET DISASSEMBLY INSTRUCTIONS
1. Disassembly Flowchart
This flowchart indicates the disassembly steps to gain
access to item(s) to be ser vic ed. When reasse mbling,
follow the steps in reverse order. Bend, route, and
dress the cables as they were originally.
[2] Front
Assembly
[18] Side
Bracket
[5] DVD Main
CBA
[14] DVD OPEN/
CLOSE CBA
[13] Main CBA
[15] Function
CBA
[3] Top Bracket
[4] DVD Mecha
Assembly
[6] Jack Holder
[7] Rear Unit
[11] VCR
Chassis Unit
[16] Jack CBA
[10] Rear Panel
[9] PCB Bracket
[8] Power
Supply CBA
[12] Deck
Assembly
[17] Deck
Pedestal
ID/
LOC.
No.
[8]
[9]
[10]
[11]
[12]Main CBA D8-----------
[13]
[14]
[15]Jack CBAD8Desolder[16]
[17]
PART
PCB
Bracket
Rear Panel
VCR
Chassis
Unit
Deck
Assembly
DVD
OPEN/
CLOSE
CBA
Function
CBA
Deck
Pedestal
Side
Bracket
Fig.
No.
D63(S-9)D6-----------
D7
D8
D8Desolder-
D8Desolder-
D97(S-13)-
D9(S-14)-
REMOVAL
REMOVE/*UNHOOK/
UNLOCK/RELEASE/
UNPLUG/DESOLDER
5(S-10), 2(S-11),
2(S-11A)
Desolder , (S-12),
(S-12A)
Note
-
4,5
2. Disassembly Method
ID/
LOC.
No.
[1]Top Cover D17(S-1)-
[2]
[3]
[4]
[5]
[6]Rear UnitD5
[7]
PART
Front
Assembly
Top
Bracket
DVD
Mecha
Assembly
DVD Main
CBA
Pow er Supply CBA
Fig.
No.
D2(S-2), *7(L-1)
D22(S-3), 2(S-3A)-
D3
D4
D62(S-8), 2(S-8A)-
REMOVAL
REMOVE/*UNHOOK/
UNLOCK/RELEASE/
UNPLUG/DESOLDER
3(S-4), *CN302,
*CN401, *CN601
2(S-5), *CN201,
*CN301
5(S-6), 4(S-7),
CN1005
Note
1
1-1
1-2
-
2
2-1
2-2
2-3
3
-
↓
(1)
Note:
(1): Identification (location) No. of parts in the figures
(2):Name of the part
(3):Figure Number for reference
(4): Identification of parts to be removed, unhooked,
unlocked, released, unplugged, unclamped, or
desoldered.
P=Spring, L=Locking Tab, S=Screw,
CN=Connector
*=Unhook, Unlock, Release, Unplug, or Desolder
e.g. 2(S-2) = two Screws (S-2),
2(L-2) = two Locking Tabs (L-2)
(5): Refer to “Reference Notes.”
↓
(2)
↓
(3)
↓
(4)
↓
(5)
1-6-1H95B0DC
Page 13
Reference Notes
CAUTION 1: Locking Tabs (L-1) are fragil e. Be caref ul
not to break them.
1-1. Remove Screw (S-3).
1-2. Release seven Locking Tabs (L-1) (to do this, first
release five Locking Tabs (A) at th e side and top,
and then release two Locking Tabs (B) at the bottom.)
CAUTION 2: Electrostatic breakdown of the laser
diode in the optical system block may occur as a
potential difference caused by electrostatic charge
accumulated on cloth, human body etc., during
unpacking or repair work.
To avoid damage of pickup follow next procedures.
2-1. Slide the pickup unit as shown in Fig. D4.
2-2. Short the three short lands of FPC cable with sol-
der before removing the FFC cable (CN301) from
it. If you disconnect the FFC ca ble (CN301), the
laser diode of pickup will be destroyed. (Fig. D4)
2-3. Disconnect Connector (CN201). Remove two
Screws (S-5) and lift the DVD Main CBA. (Fig.
D4)
CAUTION 3: When reassembling, confirm the FFC
cable (CN301) is conne cted compl etely. Then remove
the solder from the three short lands of FPC cable.
(Fig. D4)
CAUTION 4: When reassembling, solder wire jump ers
as shown in Fig. D8.
CAUTION 5: Before installing the Deck Assembly, be
sure to place the pin of LD-SW on Main CBA as shown
in Fig. D8. Then, install the Deck Assembly while
aligning the hole of Cam Gear with the pin of LD-SW,
the shaft of Cam Gear with the hole of LD-SW as
shown in Fig. D8.
(L-1)
(A)
(L-1)
(S-2)
(B)
[2] Front Assembly
CN601
CN302
(S-4)
CN401
(S-3)
(S-3A)
[3] T op Bracket
(S-3A)
(A)
(L-1)
(A)
Fig. D2
(S-4)
(S-4)
[4] DVD Mecha Assembly
(S-1)
[1] T op Cover
(S-1)
Fig. D1
Fig. D3
(S-1)
1-6-2H95B0DC
Page 14
(S-5)
CN301
CN201
(S-5)
[5] DVD Main
CBA Unit
A
DVD Mecha
[6] Rear Unit
(S-7)
(S-6)
(S-7)
CN003
(S-7)
B
Short the three short lands by soldering
Connector
View for A
OR
Slide
C
Pickup Unit
Short the three short
lands by soldering
View for B
FPC Cable
View for C
(S-8A)
(S-8)
(S-8)
(S-11A)
(S-8A)
[8] PCB Bracket
[7] Power Supply CBA
(S-11)
(S-10)
Fig. D5
(S-9)
[9] Rear Panel
Fig. D6
(S-10)
(S-11)
(S-10)
Fig. D4
[10] VCR Chassis Unit
(S-11A)
Fig. D7
1-6-3H95B0DC
Page 15
[11] Deck
Assembly
FE Head
Cylinder Assembly
ACE Head
Assembly
Pin
SW507
LD-SW
Desolder
Lead with
blue stripe
[13] DVD OPEN/
CLOSE CBA
[12] Main CBA
(S-12)
[14] Function CBA
From
ACE Head
Assembly
[15] Jack CBA
(S-12A)
Lead with
blue stripe
[11] Deck Assembly
Shaft
Hole
LD-SW
Lead with blue stripe
Desolder from bottom
Desolder
Lead with
blue stripe
From
Cylinder
Assembly
[12] Main CBA
Cam Gear
Hole
Pin
[12] Main CBA
From
FE Head
From
Capstan
Motor
Assembly
Lead with
white stripe
Printing side
Desolder
Desolder
BOTT OM VIEW
Lead connections of Deck Assembly and Main CBA
Fig. D8
1-6-4H95B0DC
Page 16
[17] Deck Pedestal
(S-13)
(S-14)
[18] Side
Bracket
(S-13)
To Remove the Disc Manually
Fig. D9
1. Remove the Top Cover.
2. Rotate this roulette in the direction of the arrow as
shown below.
Top Cover
1
DVD Mecha
Tray
Deck Assembly
3
2
Rotate this roulette in
the direction of the arrow
2
1-6-5H95B0DC
Page 17
ELECTRICAL ADJUSTMENT INSTRUCTIONS
General Note: "CBA" is an abbreviation for
"Circuit Board Assembly."
NOTE:
1.Electric al adjust ments are required a fter repla cing
circuit components and ce rtain mechanical par ts.
It is impor tant to do these adjustments only afte r
all repairs and replacements have been completed. Also, do not attempt these adjustments
unless the proper equipment is available.
2.To perform th ese alignment / confirmation proce dures, make sure that the tracking control is set in
the center position: P ress ei ther "CHA NNEL L5??" or
"CHANNEL K" button on th e front panel first , then
the "PLAY" button on the front panel.
CH1
CH2
Figure 1
EXT. Syncronize Trigger Point
1.0H
6.5H±1H (416.0µs±60µs)
Switching Pulse
0.5H
V-Sync
Test Equipment Required
1.Oscilloscope: Dual-trace with 10:1 probe,
V-Range: 0.001~50V/Div.,
F-Range: DC~AC-20MHz
2.Alignment Tape (FL6A)
Head Switching Position Adjustment
Purpose:
To determine the Head Switching point during
playback.
Symptom of Mi sadjustm e n t:
May cause Head Switching noise or ver tical jitter
in the picture.
Test pointAdj.PointModeInput
TP751(V-OUT)
TP504(RF-SW)
GND
Tape
FL6AOscilloscope
VR501
(Switching Point)
(MAIN CBA)
Measurement
Equipment
PLAY
(SP)
6.5H±1H
(416.0µs±60µs)
-----
Spec.
Reference Notes:
Playback the Alignment tape and adjust VR501 so that
the V-sync front edge of the CH1 video output waveform is at the 6.5H(416 .0µs) del ayed position from the
rising edge of the CH2 head switching pulse waveform.
Connections of Measurement Equipment
Oscilloscope
TP751
Main CBA
GND
TP504
CH1 CH2
Trig. (+)
1-7-1H9500EA
Page 18
FIRMWARE RENEWAL MODE
1. Turn the power on and remove the disc on the tray.
2. To put the DVD player into version up mode, press
[9], [8], [7], [6], and [SEARCH MO DE] but tons on
the remote control unit in that order. The tray will
open automatically.
Fig. a appears on the screen and Fig. b appears on
the VFD.
F/W Version Up Mode
Please insert a DISC
for F/W Version Up.
EXIT: POWER
Fig. a Version Up Mode Screen
Fig. b VFD in Version Up Mode
The DVD player can also enter the version up
mode with the tray open. In this case, Fig. a will be
shown on the screen while the tray is open.
3. Load the disc for version up.
4. The DVD player enters the F/W version up mode
automatically. Fig. c appears on the screen and
Fig. d appears on the VFD.
F/W Version Up Mode
VERSION : ********
Reading...(*2)
5. A fter programming is fini shed, the tray opens au tomatically. Fig. e appears on the screen and the
checksum in (*3) of Fig. e appears on the VFD.
(Fig. f)
F/W Version Up Mode
VERSION : ********
Completed
SUM : 7abc (*3)
Fig. e Completed Program Mode Screen
Fig. f VFD upon Finishing the Programming Mode (Example)
At this time, no buttons are available.
6. Unplug the AC cord from the AC outlet. Then plug it
again.
7. Turn the power on by pressing the power button
and the tray will close.
8. Press [1], [2], [3], [4], and [DISPLAY] buttons on the
remote control unit in that order.
Fig. g appears on the screen.
The appearance shown in (*2) of Fig. c is
described as follows:
AppearanceNo.State
Reading...Sending files into the memory
1
Erasing...Erasing previous version data
2
Programming...
3Writing new version data
Fig. g
9. Press [3] button on the remote control unit.
Fig. h appears on the screen.
model: ******Ver: ****Region: **
TEST 3: EEPROM CLEAR
EEPROM CLEAR: OK
EXIT: POWERRETURN: -----
Fig. h
10.To finish this mode, press [POWER] button.
1-8-1H9500TEST
Page 19
Servo/System Control Block Diagram
(DECK ASSEMBLY)
AC HEAD ASSEMBLY
CL287
CONTROL
HEAD
Q504
ST-S
55CTL(+)
66CTL(-)
SENSOR CBA
Q503
END-S
SENSOR CBA
CYLINDER ASSEMBLYCAPSTAN MOTOR
PG
SENSOR
DRUM
MOTOR
M
CL504
TP502
END-S
CAPSTAN
MOTOR
MLOADING
MOTOR
SW507
LD-SW
M
AL+5V
Q506
T-REEL
PS502
S-REEL
CL502
1
AL+20.5V/+12V
2 P-ON+5V
3 C-FG
C-F/R
4
C-CONT
5
GND
6
LM-FWD/REV
7
D-CONT
8
D-PFG
9
GND
10
AL+12V(2)
11
P-ON+15V
12
AL+5V
D555
S-LED
TIMER+5V
TO DVD SYSTEM
CONTROL BLOCK
<DVD SECTION>
VR501
SW-POINT
TO
POWER
SUPPLY
BLOCK
BLOCK DIAGRAMS
IC501
MAIN CBA
Q515
RESET
REMOTE-VIDEO
TP503
CTL
Q510
AL+5V
AL+5V
SW506
REC-SAFETY
AL+20.5V/+12V
P-ON+5V
AL+12V(2)
P-ON+15V
C-POW-SW
P-ON-H
P-DOWN-L
P-OFF-H
(SERVO/SYSTEM CONTROL)
LD-SW
9
95
CTL(+)
CTL(-)
94
10
ST-S
4
END-S
T-REEL
80
S-REEL79
RESET
34
REMOTE-VIDEO
14
CTL97
FF/REW-L84
PG-DELAY
2
REC-SAF-SW
31
C-FG
87
C-F/R
78
C-CONT
76
LM-FWD/REV
81
D-CONT77
D-PFG
90
C-POW
66
-SW
P-ON-H
67
86 P-DOWN-L
73 P-OFF-H
KEY- 2
KEY- 1
POWER-LED
TIMER-LED
DVD-LED
VCR-LED
REC-LED
DRV-DATA
DRV-STB
DRV-CLK
DVD-POWER
A-MUTE-H
Hi-Fi-H-SW
A-MODE
LINE-MUTE
IIC-BUS SDA
IIC-BUS SCL
D-REC-H
RF-SW
C-ROTA
D-V-SYNC
H-A-SW
H-A-COMP
V-ENV
OUTPUT-SELECT
C-SYNC
INPUT-SELECT
23
25
29
30
26
68
69
70
21
83
19
32
82
72
71
33
18
15
13
16
17
74
58
41
20DAVN-L
TP501
S-INH
KEY
8
7
6
SWITCH
Q507
Q502
Q508
Q509
Q511
D501
D502
D503
D504
TIMER
DVD
VCR
REC
CL505
22KEY-1
44
POWER-LED
AL+5V
CL591
DVD-POWER
IIC-BUS SDA
IIC-BUS SDA
OUTPUT-SELECT
IIC-BUS SDA
OUTPUT-SELECT
INPUT-SELECT
FUNCTION CBA
KEY SWITCH
DRV-DATA
DRV-STB
DRV-CLK
IC502 (MEMORY)
SDA
5
SCL
6
IIC-BUS SCL
A-MUTE-H
IIC-BUS SCL
Hi-Fi-H-SW
A-MODE
LINE-MUTE
IIC-BUS SCL
D-REC-H
RF-SW
C-ROTA
D-V-SYNC
H-A-SW
H-A-COMP
V-ENV
C-SYNC
DAVN-L
AL+5V
D591
POWER
TO DVD SYSTEM
CONTROL BLOCK
<DVD SECTION>
TO
AUDIO BLOCK
TO
Hi-Fi AUDIO
BLOCK
TO
VIDEO BLOCK
1-9-11-9-2H95B0BLS
Page 20
Video Block Diagram
(VPS)
IC631
TU701
JK752
V-IN-F
TO SERVO
/SYSTEM
CONTROL
BLOCK
TO DVD
VIDEO BLOCK
<DVD SECTION>
JK1402
V-IN2
19
20
V-OUT2
DAVN-L
IIC-BUS SDA
IIC-BUS SCL
VPS-V
TU-VIDEO
INPUT SELECT
DVD-VIDEO
CL2018
BUFFER
Q103
14
6
7
16
6VIDEO
24
IC1404 (SW)
5
3
SW CTL
9
V-OUT1
V-IN1
8
V-OUT2
V-IN2
1010
19
20
4
JK101
CL2017
8
IC501 (OSD)
Q301
BUFFER
52
IC301
(Y/C SIGNAL PROCESS)
48
50
52
54
56
61
63
OSD
CHARACTER
MIX
TUNER
IN1
IN2
FRT
IN2
FRT
PB/EE
MUTE
TUNER
IN1
PB/EE
MUTE
50
BYPASS
DAVN-L
IIC-BUS SDA
IIC-BUS SCL
65
6968
4643
SERIAL
DECORDER
AGC
LUMINANCE
SIGNAL
PROCESS
CHARA.
INS.
CCD 1H DELAY
1/2
FBC
CHROMINANCE
SIGNAL
PROCESS
PR
Y/C
MIX
AGCVXO
TO SERVO/SYSTEM
CONTROL BLOCK
Y. DELAY
RP RP
REC-VIDEO SIGNAL
MODE: SP/RECPB-VIDEO SIGNAL DVD VIDEO SIGNAL
MAIN CBA
7978
(DECK ASSEMBLY)
CL251
R
P
SP
SP
HEAD
AMP
EP
96
95
94
93
V-COM
V(L)-1
V(L)-2
V-COM
V(R)-2
V(R)-1
EP
Y
REC FM
+
C
AGC
HEAD
AMP
D-REC-H
RF-SW/C-ROTA
D-V-SYNC
H-A-SW
H-A-COMP
V-ENV
89
88
87
80
70
62
71
83
84
C-SYNC 67
90
WF1
TP504
RF-SW
D-REC-H
RF-SW
C-ROTA
D-V-SYNC
H-A-SW
H-A-COMP
V-ENV
C-SYNC
1
2
3
4
5
6
TO SERVO/SYSTEM
CONTROL BLOCK
CYLINDER ASSEMBLY
VIDEO (R)-1
HEAD
VIDEO (L)-1
HEAD
VIDEO (L)-2
HEAD
VIDEO (R)-2
HEAD
JACK CBA
5859
212928
Q104
BUFFER
IC751 (SW)
4
SW CTL
DVD
VCR
11109
5
3
Q752
TP751
V-OUT
WF3
OUTPUT-SELECT
X301
4.43MHz
TO SERVO/SYSTEM
TP301
C-PB
WF2
CONTROL BLOCK
1-9-31-9-4H95B0BLV
Page 21
Audio Block Diagram
PB-AUDIO SIGNALREC-AUDIO SIGNALMode : SP/REC
MAIN CBA
TO Hi-Fi
AUDIO BLOCK
(DECK ASSEMBLY)
ACE HEAD ASSEMBLY
AUDIO
HEAD
AUDIO
ERASE
HEAD
N-A-PB
N-A-REC
CL287
A-PB/REC 4
A-COM 3
AE-H 1
AE-H/FE-H 2
CL504
4 A-PB/REC
3 A-COM
1 AE-H
2 AE-H/FE-H
Q404
Q403
BIAS
OSC
+5V
Q406
IC301
(AUDIO SIGNAL PROCESS)151317
TUNERIN2
INV
R
98
ATT
P
REC
AMP
5
6
1
2
PB-ON
EQ
AMP
SP/LP-ON
AUTO
BIAS
7
3
100
IN1
ALC
DET
ALC
LINE
AMP
REC-ON
MUTE
12
11
FULL
ERASE
HEAD
FE HEAD
SERIAL
DECODER
68 69
71
A-MUTE-H
IIC-BUS SDATO SERVO/SYSTEM
IIC-BUS SCL
CONTROL BLOCK
CL501
2 FE-H
1 FE-H-GND
Q401
(PB=ON)
Q405
SWITCHING
D-REC-OFF
+5V
AUDIO HD-SW
CONTROL
16
1-9-51-9-6H95B0BLA
Page 22
Hi-Fi Audio Block Diagram
A-IN2(R)
A-IN2(L)
A-OUT2(R)
A-OUT2(L)
A-OUT1(R)
A-OUT1(L)
A-IN1(R)
A-IN1(L)
REAR
TU701
AUDIO
A-OUT(R)
A-OUT(L)
JK753
A-IN(L)-F
JK754
A-IN(R)-F
SIF
22
JK1402
2
6
1
3
1
3
2
6
2
JACK CBA
JK101
JK751
2
SIF
TO AUDIO BLOCK
4
5
1
2
2
A-IN2(R)
A-IN2(L)
A-OUT2(R)
A-OUT2(L)
AFV CBA
IF SINAL
PROCESS
CL2017CL2018
4
5
1
2
4
5
N-A-REC
N-A-PB
TU-AUDIO(R)
TU-AUDIO(L)
REC-AUDIO SIGNALPB-AUDIO SIGNALMode : SP/REC
MAIN CBA
Q107
BUFFER
Q108
BUFFER
IC451 (MTS/ SAP/ Hi-Fi AUDIO PROCESS/ Hi-Fi HEAD AMP)
67
65
SW
SW
P
R
LIMDEV
LIMDEV
R
P
SW
NOISE
SW
NOISE
COMP
VCO
OUTPUT
SELECT
HOLD
PULSE
NOISE
DET
VCO
COMP
ALC
ALC
6270
6171
52
56
54
50
58
60
10
12
CN701CN1CN701CN1
4
5
78
80
R-CH
INSEL
2
6
L-CH
8
4
INSEL
NOR
SW
48
14
R-CH
PNR
47
15
L-CH
PNR
IC751 (SW)
14
15
SW CTL
R-CH
BPF
LPF
MIX
LPF
L-CH
BPF
VCR
DVD
VCR
DVD
11109
13
12
1
2
Q752
OUTPUT-SELECT
COMP
LIM
DVD-A(R)
DVD-A(L)
SERIAL
DATA
DECODER
DO
DET
3433
TO SERVO
/SYSTEM
CONTROL
BLOCK
TO DVD AUDIO
BLOCK
<DVD SECTION>
ENV
DET
MUTE-ON
MUTE-ON
R
L
37
38
21
77
76
74
73
39
75
53
26
24
27
DVD AUDIO SIGNAL
Q451
CL251
Hi-Fi-A(R) 7
Hi-Fi-COM 8
Hi-Fi-A(L) 9
IIC-BUS SDA
IIC-BUS SCL
A-MODE
TO
SERVO/ SYSTEM
CONTROL BLOCK
Hi-Fi-H-SW
LINE-MUTE
(DECK ASSEMBLY)
CYLINDER
ASSEMBLY
Hi-Fi
AUDIO
(R)
HEAD
Hi-Fi
AUDIO
(L)
HEAD
1-9-71-9-8H95B0BLH
Page 23
Power Supply Block Diagram
NOTE :
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
HOT CIRCUIT. BE CAREFUL.
CAUTION
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,
REPLACE ONLY WITH THE SAME TYPE T1.6AL/250V FUSE.
CAUTION !
Fixed voltage (or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
TO SERVO/SYSTEM
CONTROL BLOCK
DIAGRAM
<VCR SECTION>
DVD MAIN CBA UNITMAIN CBA
1-9-111-9-12H95B0BLSD
Page 25
Digital Signal Process Block Diagram
IC102 (SDRAM)IC101 (MICRO CONTROLLER)
24
DETECTOR
SDRAM
27
60
66
13
31
56
74
85
C 6
D 7
A 8
B 5
F 10
E 2
CD/DVD 9
~~
2
~~~
CN201
210
235
2
13
184
205
247
256
124
125
122
123
128
129
126
127
131
130
~
~~~
SDRAM ADDRESS(0-10)SDRAM ADDRESS(0-10)
SDRAM DATA(0-31)SDRAM DATA(0-31)
RF
SIGNAL
PROCESS
CIRCUIT
EXTERNAL
MEMORY
I/F
DVD/CD
FORMATTER
ECC
DECODER
I/F
DMA
BCU
STREAM
I/F
UMAC
DSP
DECODER
PIXEL
OPERATION
I/O
PROCESSOR
SERIAL
DATA(VIDEO/AUDIO) SIGNALDVD VIDEO SIGNAL
DATA
ROM
INST.
ROM
DATA
ROM
INST.
ROM
DATA
ROM
INST.
ROM
AUDIO
I/F
DATA(AUDIO) SIGNAL
181
175
176
174
SPDIF
PCM-BCK
PCM-DATA0
PCM-LRCLK
TO DVD
VIDEO
/AUDIO
BLOCK
DIAGRAM
PICK-UP
UNIT
CD-LD 12
DVD-LD 14
PD-MONI 13
GND(DVD-PD)
GND(CD-PD)
GND(LD)
CN201
15
16
11
Q253,Q254
AMP
AMP
Q251,Q252
1 3
CDDVD
4
6
IC201
(SW)
DVD MAIN CBA UNIT
135
133
132
134
78
INTERRUPT
CONTROLLER
CD/DVD
INST.
ROM
DATA
ROM
TIMER
32BIT
CPU
WATCH DOG
TIMER
CPU
I/F
READ
MEMORY
EXT ADT (0-15), EXT ADR (16-19)
CPU
I/F
BCU
DEBUG
EXT ADT (0-15), EXT ADR (16-19)
EXT ADT (0-7)
EXT ADT (8-15)
GENERAL
I/O
INTERRUPT
CONTROLLER
TIMER
WATCH DOG
TIMER
32BIT CPU
INST
CACHE
IC105 (LATCH)
2
9
IC104 (LATCH)
2
9
D TYPE
~
LATCH
D TYPE
~
LATCH
DATA
CACHE
VIDEO
I/F
12
~
EXT ADR (0-7)
19
12
~
EXT ADR (8-15)
19
NTSC/PAL
ENCODER
D/A
D/A
D/A
D/A
D/A
EXT ADT (0-15)
EXT ADR (16-19)
EXT ADR (0-15)
Y
C
R
G
B
163
164
161
158
160
VIDEO-Y
VIDEO-C
VIDEO-R
VIDEO-G
VIDEO-B
IC103 (FLASH ROM)
29
~~
36
38
45
FLASH
ROM
1
~
9
16
~
25
48
TO DVD
VIDEO
/AUDIO
BLOCK
DIAGRAM
1-9-131-9-14H95B0BLD
Page 26
DVD Video / Audio Block Diagram
DVD VIDEO SIGNAL
DVD AUDIO SIGNALDATA(AUDIO) SIGNAL
FROM DIGITAL
SIGNAL PROCESS
BLOCK DIAGRAM
VIDEO-Y
VIDEO-C
VIDEO-R
VIDEO-G
VIDEO-B
CN601
11VIDEO-Y
99VIDEO-C
33VIDEO-R
77VIDEO-G
55VIDEO-B
CN1601
WF4
WF5
IC1402 (VIDEO DRIVER)
14
16
12
4dB
6
AMP
4dB
2
AMP
4dB
AMP
4dB
AMP
4dB
AMP
LPFDRIVER
LPFDRIVER
LPFDRIVER
LPFDRIVER
LPFDRIVER
2dB
AMP
2dB
AMP
2dB
AMP
2dB
AMP
2dB
AMP
2dB
AMP
DRIVER
28
31
33
22
19
25
WF6
Y
34
1
2
DVD-VIDEO
JK101
C
JK1401
S-VIDEO OUT
TO VIDEO
BLOCK DIAGRAM
<VCR SECTION>
15
DVD-R
11
DVD-G
7
DVD-B
IC1204
FIBER OPTIC
TRANS MODULE
FROM
DIGITAL
SIGNAL
PROCESS
BLOCK
DIAGRAM
FROM
DVD
SYSTEM
CONTROL
/SERVO
BLOCK
DIAGRAM
SPDIF
PCM-BCK
PCM-DATA0
PCM-LRCLK
ADAC-MD
ADAC-MC
ADAC-ML
PCM-SCLK
A-MUTE
IC601 (AUDIO DAC)
1
2
3
13
14
15
SERIAL
PORT
SERIAL
CONTROL
4X/8X
OVERSAMPLING
DIGITAL FILTER
/FUNCTION
CONTROLLER
ENPHANCED
MULTI-LEVEL
DELTA-SIGMA
MODULATOR
ZERO DETECT
SYSTEM CLOCK
16
DAC
DAC
LPF+AMP
LPF+AMP
L-CH
R-CH
12
11
3
Q1201
JK1202
DVD-A(L)
DVD-A(R)
DIGITAL
AUDIO OUT
TO
AUDIO
BLOCK
DIAGRAM
<VCR
SECTION>
WF7
WF8
Q1351
BUFFER
VREF
Q1204
+3.3V
IC1201
3
2
6
5
(AMP)
1
7
Q1202
Q1203
7
WF9
8
CN601CN1601
1818SPDIF
1313DVD-A(L)
1515DVD-A(R)
1414
DVD-A(L)-MUTE
1616
DVD-A(R)-MUTE
1212
DVD-A-MUTE
+3.3V
1-9-151-9-16H95B0BLVD
MAIN CBADVD MAIN CBA UNIT
Page 27
SCHEMATIC DIAGRAMS / CBA’S AND TEST POINTS
Standard Notes
WARNING
Many electrical and m echanical parts in this chassis
have special characteristics. These characteristics
often pass unnoticed and the protection afforded by
them cannot necessarily be obtained by using replacement components rated for higher voltage, wattage,
etc. Replacement par ts that have these specia l safety
characteristics are identified in this manual and its
supplements; electr ical components having such features are identified by the mark " ! " in the schematic
diagram and the parts list. Before replacing any of
these components, read the par ts list in this manual
carefully. The use of substitut e replacem ent par ts that
do not have the same safety characteristics as specified in the parts list may create shock, fire, or other
hazards.
Notes:
1. Do not use the part number shown on these drawings for ordering. The correct part number is shown
in the parts list, and may be slightly different or
amended since these drawings were prepared.
2. All resistance values are indicated in ohms
3
(K=10
3. Re sistor wattages are 1/4W or 1/6W unless otherwise specified.
4. All capacitance values are indicated in µF
(P=10
5. All voltages are DC voltages unless otherwise
specified.
6. Electrical parts such as capacitors, connectors,
diodes, IC’s, transistors, resistors, switches, and
fuses are identified by four digits. The first two digits are not shown for each component. In each
block of the diagram, there is a note such as shown
below to indicate these abbreviated two digits.
, M=106).
-6
µF).
1-10-1SCPA1
Page 28
LIST OF CAUTION, NOTES, AND SYMBOLS U SED IN THE SCHEMATIC DIAGRAMS ON THE FOLLOWING
PAGES:
1. CAUTION:
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH THE SAME TYPE FUSE.
2. CAUTION:
Fixed Voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown, first check to see th at all compon ents in the power supply circ uit are not defective before you connect the AC plug to the AC power supply. Otherw ise it m ay cause some co mpo nents in the
power supply circuit to fail.
3. Note:
(1) Do not use the part number shown on the drawings for ordering. The correct part number is shown in the parts
list, and may be slightly different or amended since the drawings were prepared.
(2) To maintain original function and reliability of repaired units, use only original replacement parts which are listed
with their part numbers in the parts list section of the service manual.
4. Wire Connectors
(1) Prefix symbol "CN" means "connector" (can disconnect and reconnect).
(2) Prefix symbol "CL" means "wire-solder holes of the PCB" (wire is soldered directly).
5. Voltage indications for PLAY and REC modes on the schematics are as shown below:
< DVD Section >
231
5.0
The same voltage for
both PLAY & STOP modes
Indicates that the voltage
is not consistent here.
6. How to read converged lines
1-D3
Distinction Area
Line Number
(1 to 3 digits)
Examples:
1. "1-D3" means that line number "1" goes to area "D3".
2. "1-B1" means that line number "1" goes to area "B1".
7. Test Point Information
: Indicates a test point with a jumper wire across a hole in the PCB.
: Used to indicate a test point with a component lead on foil side.
: Used to indicate a test point with no test pin.
5.0
(2.5)
PLAY mode
STOP mode
< VCR Section >
5.0
The same voltage for
both PLAY, REC & DVD
modes
5.0
(2.5)
< >
PLAY mode
REC mode
DVD mode
231
Indicates that the voltage
is not consistent here.
3
2
1
ABCD
Unit: Volts
1-B1
AREA D3
AREA B1
1-D3
: Used to indicate a test point with a test pin.
1-10-2SCRK05
Page 29
Main 1/10 Schematic Diagram < VCR Section >
1-10-3
1-10-4
H95B0SCM1
Page 30
Main 2/10 & Sensor Schematic Diagram < VCR Section >
1
Note:
*
When it is necessary to replace one or more of the following Diodes,
all one should be replaced: D501, D502, D503, D504.
1-10-5
1-10-6
H95B0SCM2
Page 31
Main 3/10 Schematic Diagram < VCR Section >
1-10-7
1-10-8
H95B0SCM3
Page 32
Main 4/10 Schematic Diagram < VCR Section >
1-10-9
1-10-10
H95B0SCM4
Page 33
Main 5/10 Schematic Diagram < VCR Section >
1-10-11
1-10-12
H95B0SCM5
Page 34
Main 6/10 Schematic Diagram < VCR Section >
1-10-13
1-10-14
H95B0SCM6
Page 35
Main 7/10 Schematic Diagram < VCR Section >
1-10-15
1-10-16
H95B0SCM7
Page 36
Main 8/10 & DVD Open/ Close Schematic Diagram < VCR Section >
1-10-17
1-10-18
H95B0SCM8
Page 37
Main 9/10 Schematic Diagram < VCR Section >
1-10-191-10-20
H95B0SCM9
Page 38
Main 10/10 Schematic Diagram < VCR Section >
1-10-21
1-10-22
H95B0SCM10
Page 39
Power Supply & Junction Schematic Diagram < VCR Section >
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE :
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
CAUTION !
Fixed voltage ( or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
1-10-23
1-10-24
H95B0SCP
Page 40
Jack Schematic Diagram < VCR Section >
1-10-25
1-10-26
H95B0SCJ
Page 41
Function Schematic Diagram < VCR Section >
1-10-27
1-10-28
H95B0SCF
Page 42
AFV Schematic Diagram < VCR Section >
1-10-291-10-30
H95B0SCAFV
Page 43
Main CBA Top View & Sensor CBA Top View
Sensor CBA Top View
BHB300F01014-A
BHB300F01014-B
WF2
TP301
C-PB
WF3
TP751
V-OUT
WF1
TP504
RF-SW
1-10-31
1-10-32
VR501
SW-P
TP503
CTL
TP501
S-INH
BH9510F01014A
Page 44
Main CBA Bottom View
1-10-33
1-10-34
BH9510F01014A
Page 45
Function CBA Top View
Function CBA Bottom View
BH9510F01014B
DVD OPEN/CLOSE CBA Top ViewDVD OPEN /CLOSE CBA Bottom View
BH9510F01014C
1-10-35
1-10-36
Page 46
Power Supply CBA Top View
Power Supply CBA Bottom View
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE :
The voltage for parts in hot circuit is measured
using hot GND as a common terminal.
CAUTION !
Fixed voltage ( or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
BECAUSE A HOT CHASSIS GROUND IS PRESENT IN THE POWER
SUPPLY CIRCUIT , AN ISOLATION TRANSFORMER MUST BE USED.
ALSO , IN ORDER TO HAVE THE ABILITY TO INCREASE THE INPUT
SLOWLY , WHEN TROUBLESHOOTING THIS TYPE POWER SUPPLY
CIRCUIT , A VARIABLE ISOLATION TRANSFORMER IS REQUIRED.
Junction CBA Top ViewJunction CBA Bottom View
1-10-37
BH9510F01022A
BH9510F01022B
1-10-38
Page 47
Jack CBA Top ViewJack CBA Bottom View
BH9510F01022C
AFV CBA Top ViewAFV CBA Bottom View
1-10-39
BHC400F01091
1-10-40
Page 48
DVD Main 1/3 Schematic Diagram < DVD Section >
1-10-411-10-42
H95B0SCD1
Page 49
DVD Main 2/3 Schematic Diagram < DVD Section >
1-10-43
1-10-44
H95B0SCD2
Page 50
IC101 VO LTAGE CH ART
PIN.NO PLAYSTOP PIN.NO PLAYSTOP PIN. NO PLAYSTOP PIN.NO PLAYSTOP
1.Clean all par ts for the tape transpor t (Up per Drum with V ideo Head / Pinch Rol ler / Audio Control Head / Full
Erase Head) using 90% lsopropyl Alcohol.
2.After cleaning the parts, do all DECK ADJUSTMENTS.
3.For the reference numbers listed above, refer to Deck Exploded Views.
* B73 ------ Recording model only
* B86 ------ Not used in 2 head model.
M Brake (TU) Assembly (HI)
LDG Belt
II
II
2-1-1U27MENHS
Page 62
Cleaning
Cleaning of Video Head
Clean the head with a head clea ning stick or chamois
cloth.
Procedure
1.Remove the top cabinet.
2.Put on a glove (thin type) to avoid touching the
upper and lower drum with your bare hand.
3.Put a few drops of 90% Isopro pyl al cohol on the
head cleaning stick or on the chamois cloth and,
by slightly pressing it against the head tip, turn the
upper drum to the right and to the left.
Notes:
1.The video head surface is made of very hard
material, but since it is very thin, avoid cleaning it
vertically.
2.Wait for the cleaned par t to dry thoroughly before
operating the unit.
3.Do not reuse a stained head cleaning stick or a
stained chamois cloth.
Cleaning of Audio Control Head
Clean the head with a cotton swab.
Procedure
1.Remove the top cabinet.
2.Dip the cotton swab in 90% is opropyl alcohol and
clean the audio control head. Be careful not to
damage the upper drum and other tape running
parts.
Notes:
1.Avoid cleaning the audio control head vertically.
2.Wait for the cleaned part to dr y thoroughly before
operating the unit or damage may occur.
ACE Head
Upper
Cylinder
Do Not !
Video Head
Cleaning Stick
2-1-2U27MENHS
Page 63
SERVICE FIXTURE AND TOOLS
J-1-1, J-1-2
J-3
J-2
J-4
J-5
Ref. No. NamePart No.Adjustment
J-1-1Alignment TapeFL6AHead Adjustment of Audio Control Head
J-1-2Alignment TapeFL6N 8
(1 speed only)
FL6NS8
(2 speed only)
J-2Guide Roller Adj.Sc rewdr iverAvailable
Locally
J-3M irrorAvailable
Locally
J-4Azimuth Adj.Screwdriver +Available
Locally
J-5X Value Adj.Screwdriver -Available
Locally
2-2-1U25PFIX
Azimuth and X Value Adjustment of Audio Control
Head / Adjustment of Envelope Waveform
Guide Roller
Tape Transportation Check
A/C Head Height
X Value
Page 64
MECHANICAL ALIGNMENT PROCEDURES
Explanation of alignment for the tape to correctly run
starts on the next page. Refer to the information below
on this page i f a tape gets stuck, for example, in the
mechanism due to some electrical trouble of the unit.
4-4-1 Service Information
A. Method for Manual Tape Loading/Unloading
To load a cassette tape manually:
1. Disconnect the AC plug.
2. Remove the Top Case and Front Assembly.
3. Insert a ca ss et te t ape. T ho ugh the ta pe will not be
automatically loaded, m ake sure that the cassette
tape is all the way in at the inlet of the Cassette
Holder. To confirm th is, lightly push the cassette
tape furt her in and see if the tape come s back out,
by a spring motion, just as much as you have
pushed in.
4. Turn the LDG Belt in the appropriate direction
shown in Fig. M1 for a minute or two to compl ete
this task.
To unload a cassette tape manually:
1. Disconnect the AC plug.
2. Remove the Top Case and Front Assembly.
3. Make sure that the Moving guide preparations are
in the Eject Position.
4. Turn the LDG Belt in the appropriate direction
shown in Fig. M1 un til the Moving guide preparations come to the Eject Position. Stop turning when
the preparations begin clicking or can not be
moved further. However, the tape will be left
wound around the cylinder.
5. Turn the LDG Belt in the appropria te direct ion continuously, and the cassette tape will be ejected.
Allow a minute or two to complete this task.
B. Method to place t he Cassette Holder in the tape-
loaded position without a cassette tape
1. Disconnect the AC Plug.
2. Remove the Top Case and Front Assembly.
3. Turn the LDG Belt in the appropriate direction
shown in Fig. M1. Release the lo cking tabs shown
in Fig. M1 and continue tur ning the LDG Belt until
the Cassette Holder comes to the tape-loaded
position. Allow a minute or two to complete this
task.
Top View
Moving guide T preparation
(Eject Position)
Moving guide S preparation
(Eject Position)
Push the tape
to load it.
Push the locking tab gently to unlock
when loading without a cassette.
UNLOAD
/EJECT
LOAD
Side View
LDG Belt
Fig. M1
Bottom View
LDG Belt (B)
UNLOAD
/EJECT
Cam Gear
Fig. M2
2-3-1H9500MA
Page 65
1.Tape Interchangeability Alignment
Note:
To do these alignment pr ocedur es, make sure that the
Tracking Control Circuit is set to the center position
every time a tape is loaded or unloaded. (Refer to
page 2-3-4, procedure 1-C, step 2.)
Note: Before starting this Mechanical Alignment, do all
Electrical Adjustment procedures.
Flowchart of Alignment for tape traveling
Loading (Use a blank tape.)
Adjust the height of the Guide Rollers
(Supply side and take-up side).
(Use a blank tape.) (pg. 2-3-3)
1-A
Not good
Check to see that the tape is not creasing
and that there is no slack on the supply
and take-up side Guide Rollers.
(Use a blank tape.)
Adjust the X Value for maximum envelope.
(pg. 2-3-3) (Use Alignment Tape.)
Adjust the envelope. (pg. 2-3-4)
Check the envelope.
OK
Adjust the Audio Section.
(Azimuth Alignment) (pg. 2-3-4)
Check the audio output.
OK
1-A
1-B
1-C
1-C
1-D
1-D
Not good
Not good
Do the final tape-traveling test to see that
the tape runs normally in play mode without creasing or slacking.
OK
Completion
1-A
Check the following:
1. X Value (pg. 2-3-3)
2. Envelope (pg. 2-3-4)
OK
1-B, 1-C
Not good
2-3-2H9500MA
Adjust the X value and envelope.
1-B, 1-C
Page 66
1-A. Preliminary/Final Checking and
Alignment of Tape Path
Purpose:
To make sure that the tape path is well stabilized.
Symptom of Misalignment:
If the tape path is unstable, the tape will be damaged.
Note: Do not use an Alignment Tape for this proce-
dure. If the unit is not correctly ali gned, the tape may
be damaged.
1. Playback a blank cass ette tape and check to see
that the tape runs without creasing at Guide Rollers
[2] and [3], and at points A and B on the lead s urface. (Refer to Fig M3 and M4.)
2. If creasing is apparent, align the height of the guide
rollers by turning the t op of Guide Rollers [2] and
[3] with a Guide Roller Adj . Screwdriver. (R efer to
Fig. M3 and M5.)
Guide Roller [2]
A
Take-up Guide Post [4]
Lead Surface of Cylinder
Correct
Guide Roller
Tape
Guide Roller [3]
B
Tape
Incorrect
AC Head
Fig. M3
Fig. M4
3. Check to see that the tape run s withou t cr ea si ng a t
Take-up Guide Post [4] or witho ut s na king bet ween
Guide Roller [3] and AC Head. (Fig. M3 and M5)
4. If creasing or snaking is apparent, adjust the Tilt
Adj. Screw of the AC Head. (Fig. M6)
Azimuth Adj. Screw
AC Head
X-Value Adj.
Screwdriver
Tilt Adj. Screw
Fig. M6
1-B. X Value Alignment
Purpose:
To align the Horizontal Position of the Audio/Control/
Erase Head.
Symptom of Misalignment:
If the Horizontal Position of the Audio/Control/Erase
Head is not proper ly aligne d, maxi mum envelope cannot be obtained at the Neutral position of the Track ing
Control Circuit.
1. Connect the oscilloscope to TP301 (C-PB) and
TP503 (CTL) on the Main CBA. Use TP504 (RFSW) as a trigger.
2. Playback the Gray Scale of the Alignment Tape
(FL6NS8) and confirm that the PB FM signal is
present.
3. S et the Tracking Control Circui t to the center position by pressing CH UP button then “ PLAY ” button
on the unit. (Refer to note on bottom of page
2-3-4.)
4. Use the X-Value Adj. Screwdriver so that the PB
FM signal at TP301 (C-PB) is maximum. (Fig. M6)
5. Press CH UP button on the unit until the CTL waveform has shifted by approx. +2msec. Make sure
that the envelope is simply attenuated (shrinks in
height) during this process so that you will know
the envelope has been at its peak.
Tape
Take-up Guide
Post
Fig. M5
2-3-3H9500MA
Page 67
6. Press CH DOWN button on the unit until the CTL
waveform has sh ifted from its or iginal positio n (not
the position achi eved in step 5, but the position of
CTL waveform in step 4) by approximately -2m sec.
Make sure that the envelope is simply atte nuated
(shrinks in height ) once CTL waveform passes its
original position and is further brought in the minus
direction.
7. Set the Tracking Control Circui t to the center position by pressing CH UP button and then “ PLAY ”
button.
1-C. Checking/Adjustment of Envelope
Waveform
Purpose:
To achieve a satisfactory picture and precise tracking.
Symptom of Misalignment:
If the envelope output is poor, noise will appear in the
picture. The tracking will then lose precision and the
playback picture will be distor ted by any slight variation of the Tracking Control Circuit.
1. Connec t the oscilloscope to TP301 (C-P B) on the
Main CBA. Use TP504 (RF-SW) as a trigger.
2. Playback the Gray Scale on the Alignment Tape
(FL6NS8). Set the Tracking Control Cir cuit to the
center position by pressi ng CH UP button an d t hen
“ PLAY ” button on the unit. Adjust the height of
Guide Rollers [2] and [3] (Fig. M3, Page 2-3-3)
watching the oscillosco pe display so that the envelope becomes as flat as poss ible. To do this adj us tment, turn the top of the Guide Roller with the
Guide Roller Adj. Screwdriver.
3. If the envelope is as shown in Fig. M7, adjus t the
height of Guide Rol le r [2] ( Refer to Fig . M 3) s o that
the waveform looks like the one shown in Fig. M9.
4. If the envelope is as shown in Fig. M8, adjus t the
height of Guide Rol le r [3] ( Refer to Fig . M 3) s o that
the waveform looks like the one shown in Fig. M9.
5. When Guide Rollers [2] and [3] (Refer to Fig.M3)
are aligned properly, there is no envelope drop
either at the beginn ing or end of track as shown in
Fig. M9.
Dropping envelope level at the beginning of track.
Dropping envelope level at the end of track.
Fig. M8
Envelope is adjusted properly. (No envelope drop)
Fig. M9
Note: Upon completion of the adjustment of Guide
Rollers [2] and [3] (Refer to Fig. M3), check the X
Value by pushing the CH UP or DOWN buttons alternately, to check the sym metry of the envelope. Check
the number of pushe s to ensure cente r position. T he
number of pushes CH UP button to achi eve 1 /2 level
of envelope should match the number of pushes CH
DOWN button from center. If required, redo the “X
Value Alignment.”
1-D. Azimuth Alignment of Audio/Control/
Erase Head
Purpose:
To correct the Azimuth alignment so that the Audio/
Control/Erase Head meets tape tracks properly.
Symptom of Misalignment:
If the position of the Audio/Con trol/Erase Head is not
properly aligned, the Audio S/N Ratio or Frequency
Response will be poor.
1. C onnect the oscilloscope to th e audio output jack
on the rear side of the deck.
2. Playback the alignment tape (FL6NS8) and confirm
that the audio signal output level is 8kHz.
3. Adjust Azimuth Adj. Screw so that the output level
on the AC Vol tmeter or the waveform on the oscilloscope is at maximum. (Fig. M6)
Fig. M7
2-3-4H9500MA
Page 68
DISASSEMBLY/ASSEMBLY PROCEDURES
OF DECK MECHANISM
Before following the procedures described below, be sure to remove the deck assembly from the cabinet. (Refer to
CABINET DISASSEMBLY INSTRUCTIONS on page 1-6-1.)
All the following procedures, includi ng those for adjustment and replacement of par ts, should be done in Eject
mode; see the positions of [44] and [45] in Fig. DM1 on page 2-4-3. When reassembling, follow the steps in reverse
order.
[9][9]AC Head AssemblyTDM1,DM7(S-4)
[10][2]Tape Guide Arm Assembly TDM1,DM8*(P-2)
[11][10]C Door Opener TDM1,DM8*(L-4)
[12][11]Pinch Arm (B)TDM1,DM8*(P-3)
[13][12]Pinch Arm AssemblyTDM1,DM8
[14][14]FE Head AssemblyTDM1,DM9(S-5)
[15][15]PrismTDM1,DM9(S-6)
[16][2]Slider ShaftTDM10*(L-5)
[17][16]C Drive Lever (SP)TDM10
[18][16]C Drive Lever (TU)TDM10(S-7),*(P-4)
[19][19]Capstan MotorBDM2,DM11 3(S-8), Cap Belt
[20]
(1): Follow steps in sequence. When reassembling, follow the steps in reverse order.
These numbers are also used as identification (location) No. of parts in the figures.
(2): Indicates the part to start disassembling with in order to disassemble the part in column (1).
(3): Nam e of the part
(4): Location of the part: T=Top B=Bottom R=Right L=Left
(5): Figure Number
(6): Identification of parts to be removed, unhooked, unlocked, released, unplugged, unclamped, or desoldered.
e.g., 2(L-2) = two Locking Tabs (L-2).
(7): Adjustment Information for Installation
(+):Refer to Deck Exploded Views for lubrication.
.
2-4-2H9500DA
Page 70
T op View
[14]
[38]
[37]
[45][44][46][9]
[7][49][8]
[32][43][41][40][31][42]
[13]
[11]
[15]
[10]
[12]
[36]
Bottom View
[23]
[24]
[27]
Fig. DM1
[19]
[35]
[34]
[25]
[26]
[33][20][28][22]
Fig. DM2
2-4-3H9500DA
Page 71
(S-1)
[1]
(S-1)
Fig. DM3
(S-1A)
[7]
[3]
(L-1)
[6]
(L-2)
(P-1)
[49]
[4]
(L-3)
[5]
Fig. DM5
Pin D
Pin C
Slots B
First, while pushing the locking tab as
shown in the right, slide and pull up the right
side on [2] to release Pin A and Pin B from
the slots A.
Then, remove Pin C and Pin D on [2] from
the slots B as shown.
[2]
Pin A
Locking tab
2
Pull up
A
1
Slide
Pin B
Slot A
Slot A
View for A
Fig. DM4
Desolder
from bottom
(S-2)
View for A
[50]
(L-12)
A
Lead with
Red Stripe
Fig. DM6
2-4-4H9500DA
Page 72
[9]
A
(S-4)
[8]
[14]
(S-5)
(S-6)
[15]
(S-3)
Adj. Screw
[13]
LDG
Belt
Desolder
from bottom
Lead with White Stripe
View for A
[8]
Fig. DM7
[11]
(L-4)
(P-3)
[12]
[10]
Fig. DM9
[17]
(L-5)
[16]
[18]
(P-4)
(P-2)
Pin of [12]
View for A
Pin of [10]
Groove of [27]
[27]
A
(S-7)
Fig. DM10
When reassembling [10] and
[12], confirm that pin of [10]
and pin of [12] are in the
groove of [27] as shown.
Fig. DM8
2-4-5H9500DA
Page 73
Cap Belt
[19]
(S-8)
Fig. DM11
[24]
[27]
(S-9)
(L-8)
(C-4)
[26]
(C-5)
[28]
[29]
[30]
(C-3)
[23]
(L-7)
(C-2)
[25]
[22]
turn
(L-6)
(C-1)
[21]
Pin on [22]
[20]
[31]
Position of Mode Lever when installed
Pin of [36]
Bottom View
[27]
Pin of [33]
Align [26] and [27] as shown.
First groove on [27]
Pin of [37]
First tooth on [44]
[26]
Position of pin on [22]
[27]
Fig. DM12
[27]
When reassembling [27],
meet the first groove on
[27] to the first tooth on
T op Vie w
[44] as shown.
Fig. DM13
2-4-6H9500DA
Page 74
[33]
(P-5)
[32]
(L-9)
Refer to the Alignment
Section, Page 2-4-8.
[35]
[34]
Fig. DM14
[44]
[45]
[46]
(L-11)
Fig. DM16
(P-6)
[37]
(C-7)
[41]
[39]
turn
(C-6)
[40]
turn
[43]
(L-10)
[38]
[42]
[36]
turn
[48]
[47]
Slide
Fig. DM17
Fig. DM15
2-4-7H9500DA
Page 75
ALIGNMENT PROCEDURES OF MECHANISM
The following procedures describe how to align the
individual gears and levers that make up the tape loading/unloading mechanism. Since information about the
state of the mechanism is provided to the System
Control Circuit only through the Mode Switch, it is
essential that the co rrect re lationsh ip between ind ividual gears and levers be maintained.
All alignments are t o be p erformed with the mechanism in Eject mode, in the sequence given. Each
procedure assumes th at all previous procedur es have
been completed.
IMPORTANT:
If any one of these alig nments is not per formed properly, even if off by only one tooth , the unit will unload
or stop and it may result in damage to the mechanic al
or electrical parts.
Alignment points in Eject Position
T op View
Alignment 3
Alignment 1
Loading Arm (SP) and (TU) Assembly
Install Loading A rm (SP) and (TU) Assembly so that
their triangle marks point to each other as shown in
Fig. AL2.
Alignment 2
Mode Gear
Keeping the two triangles pointing at each other, install
the Loading Ar m (SP) Assembly so that the last tooth
of the gear meets the most ins ide teeth of the Mode
Gear. See Fig. AL2.
Alignment 1
Triangle Marks
Loading Arm
(SP) Assembly
Last T ooth
Alignment 2
Loading Arm
(TU) Assembly
Most inside teeth
of Mode Gear
Mode Gear
Fig. AL2
Bottom View
Alignment 1
Alignment 2
Fig. AL1
Alignment 3
Cam Gear (A) (HI), Rack Assembly
Install the Rack Assembly so that the firs t tooth on the
gear of the Rack Assembly meets the first groove on
the Cam Gear (A) (HI) as shown in Fig. AL3.
See Electrical Parts List
for parts with this mark.
Some Ref. Numbers are
not in sequence.
L1-B
DVD Main
CBA Unit
2B16
2L051
2B7
2L041
2L021
1B2
2L021
2L031
F1001
2B33
2L053
2L041
A2
2B18
Power Supply CBA
2L052
2L031
2L053
2L052
2B33
JW006
JW005
Junction CBA
2L041
2B40
2L061
2L041
2L081
AC1001
2L061
2L041
2L062
2L041
2L041
2L054
DVD OPEN/
CLOSE CBA
2L062
JW009
2L071
2L071
1B1
2L033
Sensor CBA
A'
C'
B'
2B46
RM2001
2B15
2L012
Function CBA
2L011
2B54
2B15
2B13
2L054
2L071
2L035
2B11
2L071
2L071
2B53
Jack CBA
2L033
JW008
Main CBA
Sensor CBA
AFV CBA
2L091
JW007
2L011
2L011
2L034
A1X
2L032
2L011
2B3
A10
A3
A4
A11
2L081
2L081
2L082
2B1
3-1-13-1-2H95B0CEX
Page 78
Packing
Some Ref. Numbers
are not in sequence.
X5
S7
S2
X20
X1
X3
X2
X4
S2
S3
Unit
A14
S1
3-1-3H95B0PEX
Page 79
DECK EXPLODED VIEWS
Deck Mechanism View 1
B2
B9
L1191
B73
B10
L1053
B411
B567
L1467
B494
MarkDescription
Floil G-684G or Multemp MH-D
SLIDUS OIL #150
B35
B553
(Blue grease)
B11
B12
B571
L1450
B492
B74
L1051
B37
B410
L1450
B121
B8
Chassis Assembly
Top View (Lubricating Point)
B501
L1466
B126
B86
Some Ref. Numbers are not in sequence.
Chassis Assembly
Bottom View (Lubricating Point)
3-1-4H9500DEX
Page 80
Deck Mechanism View 2
B487
B587
B416
B521
B591
MarkDescription
Floil G-684G or Multemp MH-D
SLIDUS OIL #150
SANKOUL FG84M
(Yellow grease)
(Blue grease)
B508
B414
B572
B565
B499
B417
B568
B573
B585
B574
B518
B564
B584
B590
B148
B592
B31
B522
L1151
L1406
B525
B3
B558
B557
B578
B579
B582
B580
B583
B579
View
for A
Some Ref. Numbers are not in sequence.
A
B581
B559
B516
B133
B52
B551
B507
B488
B491
B513
Bottom Side (Grease point)
Bottom Side
(Grease point)
3-1-5H9500DEX
Page 81
Deck Mechanism View 3
L1321
B355
L1341
B347
B482
MarkDescription
Floil G-684G or Multemp MH-D
SLIDUS OIL #150
L1321
B354
B483
B425
(Blue grease)
B562
B563
B300
B313
B529
B360
B359
B361
B555
Some Ref. Numbers are not in sequence.
B303
B514
3-1-6H9500DEX
Page 82
MECHANICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a !
have special characteristics important to safety. Before
replacing any of these comp onents, read carefully the
product safety notice in this service manual. Don't
degrade the safety of the product through improper servicing.
NOTE:
Parts that are not assigned par t numbers (---------) ar e
not available.
Ref. No.DescriptionPart No.
A1XFRONT ASSEMBLY H95B0ED0VM204325
A2TOP COVER H9400UD0VM101208
A3CHASSIS(E4+U27) H9400UD0VM101207A
A4P ANEL, RE AR H951 0ED0VM204130
A10!LABEL, RA TING(U) H95B0ED or---------!LABEL, RATING(D) H95B0ED---------A11LABEL, RESET H9300ED---------A14LABEL, SERIAL NO . HE240ED or----------
! have special characteristics important to safety.
Before replacing any of these comp onents, read carefully the product safety notice in this service manual.
Don't degrade the safety of the product through
improper servicing.
NOTES:
1.Par ts that are not assigned par t numbers (-------- -)
are not available.
2.Tolerance of Capacitors and Resistors are noted
with the following symbols.
C.....±0.25%D.....±0.5%F.....±1%
G.....±2%J......±5%K.....±10%
M.....±20%N.....±30%Z.....+80/-20%
3.LED Type:
When it is necessary to replace one or mo re of the
following diodes, all four should be replaced: D501,
D502, D503, and D504 on the Main CBA.
DVD MAIN CBA UNIT
Ref. No. DescriptionP art No.
DVD MAIN CBA UNITN79GMGEP
MCV CBA
Ref. No. DescriptionPart No.
MCV CBA
Consists of the following
MAIN CBA (MC V-A)
FUNCTION CBA (MCV-B)
DVD OPEN/CLOSE CBA (MCV -C)
SENSOR CBA
MAIN CBA
Ref. No. DescriptionPart No.
MAIN CBA (MCV-A)
Consists of the following
CAPACITORS
C056ELECTROLYTIC CAP. 47µF/25V M orCE1EMASDL470
ELECTROLYTIC CAP. 47µF/25V MCE1 EMASTL470
C057ELECTROLYTIC CAP. 10µF/16V M orCE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MC E1CMASTL100
C058ELECTRIC DOUBLE LAYER CAP0.047F/5.5V Z or CA0J473NE003
ELECTRIC DOUBLE LAYE R CAP. 0.047F/5.5V ZCA0J473MS014
C059ELECTROLYTIC CAP. 100µF/6.3V M orCE0KMASDL101
ELECTROLYTIC CAP. 100µF/6.3V MCE0KMASTL101
C060CHIP CERAMIC CAP. B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP. B K 0.047µF/25VCHD1EK30B473
C062CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C113CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1 EZ30F10 4
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C114CHIP CERAMIC CAP. B K 1000pF/50VCHD1JK30B102
C116CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C117ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C118CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C127ELECTROLYTIC CAP. 10µF/16V M orCE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE 1CMASTL100
C129ELECTROLYTIC CAP. 100µF/16V M H7CE1CMA VSL101
C130ELECTROLYTIC CAP. 4.7µF/50V M H7CE1JMAV SL4R7
C131ELECTROLYTIC CAP. 4.7µF/50V M H7CE1JMAV SL4R7
C132ELECTROLYTIC CAP. 4.7µF/50V M H7CE1JMAV SL4R7
C251ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C252CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1 EZ30F10 4
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C253CHIP CERAMIC CAP. B K 1000pF/50VCHD1JK30B102
C254ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAV SL1R 0
C301CHIP CERAMIC CAP. B K 0.022µF/50V orCHD1JK30B223
CHIP CERAMIC CAP. B K 0.022µF/25VCHD1EK30B223
C302ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAV SL1R 0
C303CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1 EZ30F10 4
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C305ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAV SL1R 0
C306CHIP CERAMIC CAP. B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP. B K 0.047µF/25VCHD1EK30B473
C307CHIP CERAMIC CAP. B K 0.022µF/50V orCHD1JK30B223
CHIP CERAMIC CAP. B K 0.022µF/25VCHD1EK30B223
C308CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1 EZ30F10 4
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C309CHIP CERAMIC CAP. CH J 68pF/50V orCHD1JJ3CH680
CHIP CERAMIC CAP . CG J 68pF/50VCHD1JJ3CG680
C311CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1 EZ30F10 4
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C312ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C313ELECTROLYTIC CAP. 1µF/50V M H7CE1JMASSL1R0
C314CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C315CHIP CERAMIC CAP. B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP. B K 0.047µF/25VCHD1EK30B473
200307103-3-1H95B0EL
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Ref. No. DescriptionPart No.
C316ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C317CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
CHIP CERAMIC CAP . CG J 68pF/50VCHD1JJ3CG680
C324CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C325CHIP CERAMIC CAP. B K 8200pF/50VCHD1JK30B822
C326CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C328ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C329CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C330ELECTROLYTIC CAP. 100µF/16V M H7CE1CMA VSL101
C331ELECTROLYTIC CAP. 220µF/6.3V M H7CE0KMAVSL221
C333CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . CG J 120pF/50VCHD1JJ3CG121
C340ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C341CHIP CERAMIC CAP. CH D 10pF/50V orCHD1JD3CH100
CHIP CERAMIC CAP . CG D 10pF/50VCHD1JD3CG100
C342CHIP CERAMIC CAP. B K 1000pF/50VCHD1JK30B102
C343ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C344ELECTROLYTIC CAP. 4.7µF/25V M NP H7CP1EMAVSB4R7
C345ELECTROLYTIC CAP. 0.47µF/50V M H7CE1JMA VSLR47
C346CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . CG J 68pF/50VCHD1JJ3CG680
C348CERAMIC CAP.(AX) F Z 0.1µF/50VCCA1JZTFZ104
C349ELECTROLYTIC CAP. 0.47µF/50V M H7CE1JMA VSLR47
C350CERAMIC CAP.(AX) F Z 0.1µF/50VCCA1JZTFZ104
C402FILM CAP .(P) 0.018µF/50V JCMA1JJP0018 3
C403CERAMIC CAP. B K 470pF/100VCCD2AKS0B471
C404ELECTROLYTIC CAP. 220µF/6.3V M H7CE0KMASSL221
C405ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C407CHIP CERAMIC CAP. CH J 820pF/50V orCHD1JJ3CH821
CHIP CERAMIC CAP . CH J 820pF/25V orCHD1EJ3CH821
Ref. No. DescriptionPart No.
CHIP CERAMIC CAP . CG J 820pF/50VCHD1JJ3CG821
C408CHIP CERAMIC CAP. B K 1800pF/50VCHD1JK30B182
C409CHIP CERAMIC CAP. CH J 33pF/50V orCHD1JJ3CH330
CHIP CERAMIC CAP . CG J 33pF/50VCHD1JJ3CG330
C410ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C411CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C412ELECTROLYTIC CAP. 33µF/6.3V M H7CE0KMAVSL330
C413CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1 EZ30F10 4
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C414CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C415ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C416CHIP CERAMIC CAP. B K 4700pF/50VCHD1JK30B472
C417ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
C418CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1 EZ30F10 4
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C419CHIP CERAMIC CAP. CH J 220pF/50V orCHD1JJ3CH221
CHIP CERAMIC CAP . CG J 220pF/50VCHD1JJ3CG221
C420CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C421ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C451CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1 EZ30F10 4
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C452ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C453ELECTROLYTIC CAP. 22µF/10V M H7CE1AMAVSL220
C454CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1 EZ30F10 4
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C455CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1 EZ30F10 4
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C456ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C457ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C458CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C461CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C462CHIP CERAMIC CAP. B K 4700pF/50VCHD1JK30B472
C463ELECTROLYTIC CAP. 22µF/10V M H7CE1AMAVSL220
C464CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C465ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C466CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1 EZ30F10 4
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C467CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1 EZ30F10 4
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C468ELECTROLYTIC CAP. 220µF/6.3V M H7CE0KMA VS L221
C469ELECTROLYTIC CAP. 22µF/10V M H7CE1AMAVSL220
C470CHIP CERAMIC CAP. B K 4700pF/50VCHD1JK30B472
C471CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C472ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C473ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C474CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1 EZ30F10 4
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C475CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1 EZ30F10 4
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C476ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
C477CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1 EZ30F10 4
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Ref. No. DescriptionPart No.
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C478CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C479ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C480ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C481ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C482CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C483ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C484ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C485ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C486CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C487ELECTROLYTIC CAP. 47µF/16V M H7CE1CMAVSL470
C488CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C505CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C506ELECTROLYTIC CAP. 220µF/6.3V M H7CE0KMAVSL221
C508CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C509CHIP CERAMIC CAP. B K 1000pF/50VCHD1JK30B102
C510CHIP CERAMIC CAP. B K 4700pF/50VCHD1JK30B472
C511CHIP CERAMIC CAP. CH J 100pF/50V orCHD1JJ3CH101
CHIP CERAMIC CAP . CG J 100pF/50VCHD1JJ3CG101
C513CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C514CHIP CERAMIC CAP. CH J 330pF/50V orCHD1JJ3CH331
CHIP CERAMIC CAP . CG J 330pF/50VCHD1JJ3CG331
C515CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C516ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
C517CERAMIC CAP.(AX) F Z 0.022µF/25VCCA1EZTFZ223
C518ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
C519CHIP CERAMIC CAP. CH J 560pF/50V orCHD1JJ3CH561
CHIP CERAMIC CAP . CG J 560pF/50VCHD1JJ3CG561
C521ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
C522CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C524CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C527CERAMIC CAP.(AX) B K 100pF/50VCCA1JKT0B101
C531CHIP CERAMIC CAP. B K 4700pF/50VCHD1JK30B472
C533CHIP CERAMIC CAP. B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP. B K 0.047µF/25VCHD1EK30B473
C534ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C535CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . CG J 22pF/50VCHD1JJ3CG220
C547CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C548CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1 EZ30F10 4
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C549ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAV SL1R 0
C550ELECTROLYTIC CAP. 100µF/6.3V H7CE0KMAVSL101
C553ELECTROLYTIC CAP. 22µF/10V M H7CE1AMAVSL220
C555CHIP CERAMIC CAP. B K 0.1µF/25V orCHD1EK30B104
CHIP CERAMIC CAP. B K 0.1µF/16VCHD1CK30B104
C556CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1 EZ30F10 4
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C611ELECTROLYTIC CAP. 22µF/50V M orCE1JMASDL220
ELECTROLYTIC CAP. 22µF/50V MCE1JMAST L220
C612CHIP CERAMIC CAP. B K 4700pF/50VCHD1JK30B472
C614CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1 EZ30F10 4
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C631CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1 EZ30F10 4
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C632ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAV SL1R 0
C633ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAV SL1R 0
C634CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C635SEMICONDUCTOR CAP. SR K 0.018µF/25VCDA1EKS0X183
C636ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C637ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C701ELECTROLYTIC CAP. 100µF/6.3V H7CE0KMAVSL101
C703CHIP CERAMIC CAP. B K 1000pF/50VCHD1JK30B102
C706CHIP CERAMIC CAP. B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP. B K 0.047µF/25VCHD1EK30B473
C708ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C709CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C711CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C712CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1 EZ30F10 4
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C714CHIP CERAMIC CAP. B K 1500pF/50VCHD1JK30B152
C715CHIP CERAMIC CAP. F Z 0.22µF/16V orCHD1CZ30F224
CHIP CERAMIC CAP . FZ Z 0.22µF/25VCHD1EZ3FZ224
C716CHIP CERAMIC CAP. F Z 0.22µF/16V orCHD1CZ30F224
CHIP CERAMIC CAP . FZ Z 0.22µF/25VCHD1EZ3FZ224
C751CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C752ELECTROLYTIC CAP. 47µF/10V M H7CE1AMAVSL470
C753ELECTROLYTIC CAP. 4.7µF/50V M H7CE1JMASSL4R7
C754ELECTROLYTIC CAP. 4.7µF/50V M H7CE1JMASSL4R7
C755CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C756CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C757ELECTROLYTIC CAP. 47µF/6.3V M orCE0KMASDL470
ELECTROLYTIC CAP. 47µF/6.3V MCE0KMASTL470
C758CERAMIC CAP.(AX) Y M 0.01µF/16VCCA1CMT0Y103
C783CHIP CERAMIC CAP. CH J 470pF/50V orCHD1JJ3CH471
CHIP CERAMIC CAP . CG J 1000pF/50VCHD1JJ3CG102
C1224CHIP CERAMIC CAP. B K 1000pF/50VCHD1JK30B102
C1245CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1246CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1247ELECTROL YTIC CAP. 470µF/16V M orCE1CMASDL471
ELECTROLYTIC CAP. 470µF/16V MCE1CMASTL471
C1249ELECTROL YTIC CAP. 47µF/16V M H7CE1CMAVSL470
C1351ELECTROL YTIC CAP. 22µF/6.3V M H7CE0KMA VS L220
C1352CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1353CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . CG J 100pF/50VCHD1JJ3CG101
C1355CHIP CERAMIC CAP. F Z 1µF/10VCHD1AZ30F105
C1359CHIP CERAMIC CAP. CH D 9pF/50VCHD1JD3CH9R0
C1393ELECTROL YTIC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C1394ELECTROL YTIC CAP. 47µF/6.3V M H7CE0KMA VS L470
C1402PCB JUMPER D0.6-P5.0JW5.0T
C1421CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C1422CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1441CHIP CERAMIC CAP. B K 0.33µF/10VCHD1AK30B334
C1442ELECTROL YTIC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C1445ELECTROL YTIC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C1461ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C1462ELECTROL YTIC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C1471ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C1481ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C1482ELECTROL YTIC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
Ref. No. DescriptionPart No.
C1486ELECTROLYTIC CAP . 1µF/50V M H7CE1JMAVSL1 R0
C1487CHIP CERAMIC CAP. B K 1000pF/50VCHD1JK30B102
C1523CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1 EZ30F10 4
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C1531CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C1532ELECTROLYTIC CAP . 22µF/6.3V M H7CE0KMAVSL220
C2002CHIP CERAMIC CAP. B K 1000pF/50VCHD1JK30B102
C2004ELECTROLYTIC CAP . 100µF/6.3V H7CE0KM AVSL101
C2012CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1 EZ30F10 4
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C2013CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1 EZ30F10 4
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C2016CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1 EZ30F10 4
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
CONNECTORS
CN050CONNECTOR BASE, 18P TUC-P18P-B1J3TUA18TG001
CN701AFV PCB ASSEMBL Y CP2500/9300H9300AFV
CN1051 FMN CONNECTOR, SIDE 22P 22FMN-STRKJCFNG22JG004
CN1601 FMN CONNECTOR, SIDE 18P 18FMN-STKJCFNG18JG003
CN2014 FMN CONNECTOR, SIDE 4P 04FMN-STRKJCFNG04JG004
R150CHI P RES .(160 8) 1/10W J 47k ΩRRXAJR5Z0473
R251CHI P RES .(160 8) 1/10W J 39k ΩRRXAJR5Z0393
R252CHI P RES .(160 8) 1/10W J 2.2k ΩRRXAJR5Z0222
R301CHI P RES .(160 8) 1/10W J 1.2k ΩRRXAJR5Z0122
R303CHI P RES .(160 8) 1/10W J 5.6k ΩRRXAJR5Z0562
R304CHIP INDUCTOR MLG1608B18NJT000 orLLACJB3TE18N
CHIP INDUCTOR HK1608 18NJ-TLLACJB3TU18N
R305CHI P RES .(160 8) 1/10W J 10k ΩRRXAJR5Z0103
R306CHI P RES .(160 8) 1/10W J 5.6M ΩRRXAJR5Z0565
R307CARBON RES. 1/6W J 33 Ω orRCX6JATZ0330
CARBON RES. 1/4W J 33 ΩRCX4JATZ0330
R311CHI P RES .(160 8) 1/10W J 75 ΩRRXAJR5Z0750
R314CHI P RES .(160 8) 1/10W J 3.9k ΩRRXAJR5Z0392
R316CHI P RES .(160 8) 1/10W J 1.8k ΩRRXAJR5Z0182
R317CHI P RES .(160 8) 1/10W J 220 ΩRRXAJR5Z0221
R318CARBON RES. 1/4W J 680 ΩRCX4J ATZ0681
R319CHI P RES .(160 8) 1/10W J 1k ΩRRXAJR5Z0102
R320CHI P RES .(160 8) 1/10W J 47k ΩRRXAJR5Z0473
R321CHI P RES .(160 8) 1/10W J 150 ΩRRXAJR5Z0151
R322CHI P RES .(160 8) 1/10W J 10k ΩRRXAJR5Z0103
R323CHI P RES .(160 8) 1/10W J 150 ΩRRXAJR5Z0151
R324CHI P RES .(160 8) 1/10W J 2.7k ΩRRXAJR5Z0272
R325CHI P RES .(160 8) 1/10W J 1.2k ΩRRXAJR5Z0122
R326CHI P RES .(160 8) 1/10W J 4.7k ΩRRXAJR5Z0472
R327CHI P RES .(160 8) 1/10W J 6.8k ΩRRXAJR5Z0682
R328CHI P RES .(160 8) 1/10W J 1k ΩRRXAJR5Z0102
R330CHI P RES .(160 8) 1/10W J 2.2k ΩRRXAJR5Z0222
R331CHI P RES .(160 8) 1/10W J 18k ΩRRXAJR5Z0183
R332CHI P RES .(160 8) 1/10W J 10k ΩRRXAJR5Z0103
R333CHI P RES .(160 8) 1/10W J 18k ΩRRXAJR5Z0183
R334CHI P RES .(160 8) 1/10W J 10k ΩRRXAJR5Z0103
R335CHI P RES .(160 8) 1/10W J 100 ΩRRXAJR5Z0101
R336CHI P RES .(160 8) 1/10W J 4.7k ΩRRXAJR5Z0472
R337CHI P RES .(160 8) 1/10W J 6.8k ΩRRXAJR5Z0682
R339CHI P RES. (1608) 1/10W 0 ΩRRXAZR5Z0000
R401CARBON RES. 1/4W J 820 ΩRCX4J ATZ0821
R402CARBON RES. 1/6W J 100 Ω orRCX6JA TZ01 01
CARBON RES. 1/4W J 100 ΩRCX4J ATZ0101
R404CHI P RES. (1608) 1/10W 0 ΩRRXAZR5Z0000
R405CHI P RES .(160 8) 1/10W J 47k ΩRRXAJR5Z0473
R406CHI P RES .(160 8) 1/10W J 22k ΩRRXAJR5Z0223
R407CHI P RES .(160 8) 1/10W J 5.6k ΩRRXAJR5Z0562
R408CHI P RES .(160 8) 1/10W J 12k ΩRRXAJR5Z0123
R409CHI P RES .(160 8) 1/10W J 5.6k ΩRRXAJR5Z0562
R410CHI P RES .(160 8) 1/10W J 1k ΩRRXAJR5Z0102
R411CHI P RES .(160 8) 1/10W J 27k ΩRRXAJR5Z0273
R412CHI P RES .(160 8) 1/10W J 120 ΩRRXAJR5Z0121
R413CHI P RES .(160 8) 1/10W J 330k ΩRRXAJR5Z0334
R414CHI P RES .(160 8) 1/10W J 12k ΩRRXAJR5Z0123
R415CHI P RES .(160 8) 1/10W J 1.8k ΩRRXAJR5Z0182
R416CHI P RES .(160 8) 1/10W J 1.2k ΩRRXAJR5Z0122
R417CHI P RES .(160 8) 1/10W J 2.2k ΩRRXAJR5Z0222
R418CHI P RES .(160 8) 1/10W J 12k ΩRRXAJR5Z0123
R419CHI P RES .(160 8) 1/10W J 10k ΩRRXAJR5Z0103
R420CHI P RES .(160 8) 1/10W J 4.7k ΩRRXAJR5Z0472
R421CHI P RES .(160 8) 1/10W J 4.7k ΩRRXAJR5Z0472
R451CHI P RES .(160 8) 1/10W J 8.2k ΩRRXAJR5Z0822
R533CHI P RES .(160 8) 1/10W J 3.9k ΩRRXAJR5Z0392
R534CARBON RES. 1/6W J 330 Ω orRCX6JA TZ03 31
CARBON RES. 1/4W J 330 ΩRCX4J ATZ0331
R535CHI P RES .(160 8) 1/10W J 3.9k ΩRRXAJR5Z0392
R536CHI P RES .(160 8) 1/10W J 1.8k ΩRRXAJR5Z0182
R537CHI P RES .(160 8) 1/10W J 680 ΩRRXAJR5Z0681
R538CHI P RES .(160 8) 1/10W J 1.5k ΩRRXAJR5Z0152
R539CHI P RES .(160 8) 1/10W J 10k ΩRRXAJR5Z0103
R540CHI P RES .(160 8) 1/10W J 10k ΩRRXAJR5Z0103
R541CHI P RES .(160 8) 1/10W J 18k ΩRRXAJR5Z0183
R542CHI P RES .(160 8) 1/10W J 1k ΩRRXAJR5Z0102
R543CARBON RES. 1/4W J 1k ΩRCX4JATZ0102
R544CHI P RES .(160 8) 1/10W J 10k ΩRRXAJR5Z0103
R545CHI P RES .(160 8) 1/10W J 10k ΩRRXAJR5Z0103
R546CHI P RES .(160 8) 1/10W J 1k ΩRRXAJR5Z0102
R548CHI P RES .(160 8) 1/10W J 10k ΩRRXAJR5Z0103
R549CHI P RES .(160 8) 1/10W J 10k ΩRRXAJR5Z0103
R552CHI P RES .(160 8) 1/10W J 10k ΩRRXAJR5Z0103
R555CHI P RES .(160 8) 1/10W J 1k ΩRRXAJR5Z0102
R558CHI P RES .(160 8) 1/10W J 10k ΩRRXAJR5Z0103
R560CHI P RES .(160 8) 1/10W J 10k ΩRRXAJR5Z0103
R563CHI P RES .(160 8) 1/10W J 10k ΩRRXAJR5Z0103
R565CHI P RES .(160 8) 1/10W J 10k ΩRRXAJR5Z0103
R567CHI P RES .(160 8) 1/10W J 39k ΩRRXAJR5Z0393
R568CHI P RES .(160 8) 1/10W J 220k ΩRRXAJR5Z0224
R569CHI P RES .(160 8) 1/10W J 10k ΩRRXAJR5Z0103
R570CARBON RES. 1/6W J 4.7k Ω orRCX6JA TZ04 72
CARBON RES. 1/4W J 4.7k ΩRCX4JATZ0472
R572CHI P RES .(160 8) 1/10W J 1k ΩRRXAJR5Z0102
R574CHI P RES .(160 8) 1/10W J 560 ΩRRXAJR5Z0561
R575CHI P RES .(160 8) 1/10W J 330k ΩRRXAJR5Z0334
R576CHI P RES .(160 8) 1/10W J 10k ΩRRXAJR5Z0103
R577CHI P RES .(160 8) 1/10W J 1.5k ΩRRXAJR5Z0152
R578CHI P RES .(160 8) 1/10W J 1k ΩRRXAJR5Z0102
R581CHI P RES .(160 8) 1/10W J 10k ΩRRXAJR5Z0103
R582CHI P RES .(160 8) 1/10W J 100k ΩRRXAJR5Z0104
R583CHI P RES .(160 8) 1/10W J 1k ΩRRXAJR5Z0102
R584CHI P RES .(160 8) 1/10W J 100 ΩRRXAJR5Z0101
R585CHI P RES .(160 8) 1/10W J 1.8k ΩRRXAJR5Z0182
R586CHI P RES .(160 8) 1/10W J 820 ΩRRXAJR5Z0821
R588CHI P RES .(160 8) 1/10W J 470 ΩRRXAJR5Z0471
R601CHI P RES .(160 8) 1/10W J 3.9k ΩRRXAJR5Z0392
R602CHI P RES .(160 8) 1/10W J 1.5k ΩRRXAJR5Z0152
R603CARBON RES. 1/6W J 2.2k Ω orRCX6JA TZ02 22
CARBON RES. 1/4W J 2.2k ΩRCX4JATZ0222
R611CHI P RES .(160 8) 1/10W J 3.3k ΩRRXAJR5Z0332
R613CHI P RES .(160 8) 1/10W J 8.2k ΩRRXAJR5Z0822
R614CHI P RES .(160 8) 1/10W J 5.1k ΩRRXAJR5Z0512
R615CHI P RES .(160 8) 1/10W J 5.1k ΩRRXAJR5Z0512
R616CHI P RES .(160 8) 1/10W J 8.2k ΩRRXAJR5Z0822
R617PCB JUMPER D0.6-P5.0JW5.0T
R632CHI P RES .(160 8) 1/10W J 100 ΩRRXAJR5Z0101
R633CHI P RES .(160 8) 1/10W J 10k ΩRRXAJR5Z0103
R634CHI P RES .(160 8) 1/10W J 10k ΩRRXAJR5Z0103
R635CHI P RES .(160 8) 1/10W J 2.7k ΩRRXAJR5Z0272
R636CHI P RES .(160 8) 1/10W J 10k ΩRRXAJR5Z0103
R637CHI P RES .(160 8) 1/10W J 5.6k ΩRRXAJR5Z0562
R703CARBON RES. 1/6W J 1.8k Ω orRCX6JA TZ01 82
CARBON RES. 1/4W J 1.8k ΩRCX4JATZ0182
R704CHI P RES .(160 8) 1/10W J 1k ΩRRXAJR5Z0102
R705CHI P RES .(160 8) 1/10W J 1k ΩRRXAJR5Z0102
Q503PHOTO TRANSIS T OR PT204- 6B-1 2 orNPWZT2046B12
PHOTO TRANSIST OR MID-32A22 orNPWZM1D32A22
PHOTO TRANSIST OR MID-32A22FNPWZ1D32A22F
Q504PHOTO TRANSIS T OR PT204- 6B-1 2 orNPWZT2046B12
PHOTO TRANSIST OR MID-32A22 orNPWZM1D32A22
PHOTO TRANSIST OR MID-32A22FNPWZ1D32A22F
PSV CBA
Ref. No. DescriptionPart No.
PSV CBA
Consists of the following
POWER SUPPLY CBA (PSV-A)
JUNCTION CBA (PSV-B)
JACK CBA (PSV -C)
POWER SUPPLY CBA
Ref. No. DescriptionPart No.
POWER SUPPLY CBA (PSV-A)
Consists of the following
CAPACITORS
C013ELECTROLYTIC CAP. 10µF/50V M orCE1JMASDL100
ELECTROLYTIC CAP. 10µF/50V MCE1JMASTL100
C014ELECTROLYTIC CAP. 470µF/25V M orCE1EMASDL471
ELECTROLYTIC CAP. 470µF/25V MCE1EMASTL471
C017ELECTROLYTIC CAP. 1000µF/1 6 V MC E 1 C M Z P T L 1 02
C018ELECTROLYTIC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
0VSA14040
--------------
--------------
--------------
----------
200307103-3-10H95B0EL
Page 93
Ref. No. DescriptionPart No.
C020ELECTROLYTIC CAP. 22µF/50V M orCE1JMASDL220
ELECTROLYTIC CAP. 22µF/50V MCE1JMASTL220
C021CERAMIC CAP.(AX) F Z 0.1µF/50VCCA1JZTFZ104
C022ELECTROLYTIC CAP. 470µF/35V M orCE1GMASDL471
ELECTROLYTIC CAP. 470µF/35V MCE1GMASTL471
C1001! MET ALLIZED FILM CAP . 0.068µF/275V K orCT2E683HJE06
!METALLIZED FILM CAP. 0.068µF/250V KCT2E683DC011
C1003CERAMIC CAP. B K 0.01µF/500VCCD2JKP0B103
C1004ELECTROL YTIC CAP. 100µF/400V MCA2H101S6016
C1005CERAMIC CAP. SL K 56pF/1KV orCCD3AKPSL560
ELECTROLYTIC CAP. 100µF/10V MCE1AMASTL101
C1021CERAMIC CAP.(AX) Y M 0.01µF/16VCCA1CMT0Y103
C1022CERAMIC CAP.(AX) Y M 0.012µF/16VCCA1CMT0Y123
C1029CERAMIC CAP. (AX) X K 5600pF/16VCCA1CKT0X562
C1032ELECTROL YTIC CAP. 10µF/16V M orCE1CMASDL100
CHIP CERAMIC CAP . CG J 56pF/50VCHD1JJ3CG560
C7CHIP CERAMIC CAP. CH C 3pF/50V orCHD1JC3CH3R0
CHIP CERAMIC CAP . CJ C 3pF/50V orCHD1JC3CJ3R0
CHIP CERAMIC CAP . CH D 3pF/50VCHD1JD3CH3R0
C8CHIP CERAMIC CAP. CH C 3pF/50V orCHD1JC3CH3R0
CHIP CERAMIC CAP . CJ C 3pF/50V orCHD1JC3CJ3R0
CHIP CERAMIC CAP . CH D 3pF/50VCHD1JD3CH3R0
C11CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C12ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSL100
C13CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C14CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C15ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSL100
C16ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSL100
C17CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C19CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C20ELECTROLYTIC CAP. 3.3µF/50V M H7CE1JMASSL3R3
C21CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C22ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSL100
C24ELECTROLYTIC CAP. 0.22µF/50V M H7CE1JMASSLR22
Four different, but interchangeable, types of B558
(LOADING MOTOR) may be installed in these models.
Please confirm B558 (LOADING MOTOR) type by a
part number on it. B558 (LOADING MOTOR) type varies in combin ation with L1151. Please see Table 1 for
details and combination.
Table 1 (B558 and L1151 Combination)
LOADING MOTOR (B558)SCREW (L1151)
DescriptionParts No.DescriptionParts No.
LOADING MOTOR
M31E-1 R-14 7376
LOADING MOTOR
M31E-1 R-14 7391
LOADING MOTOR
MDB2B80
LOADING MOTOR
MDB2B82
MMDZB12 MM0 0 3
MMDZB12 MM0 0 4
MMDZB12 SJ 00 8
MMDZB10 SJ 00 1
SCREW, SEMS
M2.6X4 PAN HEAD+
SCREW, SEMS
M3X4 PAN HEAD+
CPM39040
CPM33040
Ref.NoDescriptionPart No.
B2CYLINDER ASSEMBLY MK12 PAL 4HD HIFI orN1767CYL
CYLINDER ASSEMBL Y( V) MK12 PAL 4HD HIFIN1769CYL
B3LOADING MOTOR ASSEMBLY MK11 TVCR0VSA13465
B8PULLEY ASSEMBLY(HI) MK120VSA13501
B9MOVING GUIDE S PREPARATION MK120VSA13560
B10MOVING GUIDE T PREP ARATION MK120VSA13562
B11LOADING ARM(TU) ASSEMBL Y MK120VSA13300
B12LOADING ARM(SP) ASSEMBL Y MK120VSA13299
B31AC HEAD ASSEMBL Y MK120VSA13275
B35T APE GUIDE ARM ASSEMBLY MK120VSA13277
B37CAPST AN MO T OR 288/VCCM012N9671CML
B52CAP BELT M K100VM411138
B73FE HEAD ASSEMBLY MK11 orN9742FEL
FE HEAD ASSEMBLY MK11 orN9743FEL
FE HEAD(MK11) MH-131SF11 orDHVEC01Z0005
FE HEAD(MK11) VTR-1X2ERS11-148 orDHVEC01TE004
FE HEAD(MK12) VTR-1X2ERS11-155 orDHVEC01TE005
FE HEAD(MK12) HVFHP0047ADHVEC01AL007
B74PRISM MK100VM202870
B86F BRAKE ASSEMBLY(HI) MK120VSA13447
B121WORM MK120VM414091
B126PULLEY MK120 VM414 330B
B133IDLER ASSEMBLY(HI) MK120VSA13451
B148TG CAP MK60VM407664C
B300C DRIVE LEVER(TU) MK120VM203773
B303F DOOR OPENER M K12 or0VM203751C
F DOOR OP ENER MK120VM203751
B313C DRIVE SPRING MK120VM414145
B347GUIDE HOLDER A MK100VM304920
B354SLIDER(TU) MK120VM101172F
B355SLIDER(SP) MK12 or0VM101182F
SLIDER(SP) SUB ASSEMBLY MK12 or0VDM12542
SLIDER(SP) MK120VM101182H
B359CLEANER LEVER MK100VM304413
B360CLEANER ROLLER MK90VM410032C
Ref.NoDescriptionPart No.
B361CL POST MK100VM411114
B410PINCH ARM(A) ASSEMBLY(4) MK12 or0VSA13572
PINCH ARM(A) ASSEMBL Y(5) MK120VSA13788
B411PINCH SPRING MK120VM414644
B414M BRAKE(SP) ASSEMBLY(HI) MK120VSA13655
B416M BRAKE(TU) ASSEMBLY(HI) MK120VSA13449
B417TENSION SPG(3002645) MK120VM414221F
B425LOCK LEVER SPRING MK100VM411110
B482CASSETTE PLATE MK120VM203749
B483LOCK LEVER MK120VM414095
B487BAND BRAKE(SP) MK120VM305723
B488MODE LEVER(HI) MK120VM101175J
B491CAM GEAR(A)(HI) MK120VM101176
B492MODE GEAR(LM) MK120VM204236
B494C DOOR OPENER MK120VM305719
B499T LEVER HOLDER MK120VM305729
B501WORM HOLDER MK12 or0VM203767
WORM HOLDER(R) MK120VM204324
B507REEL WASHER MK9 5*2.1*0.50VM410058
B508S BRAKE SPRING(HI) MK120VM414899
B513P .S .W F 6* 2.55* 0.50VM402629A
B514SCREW RACK MK100VM411535
B516REEL WASHER MK9 5*2.1*0.50VM410058
B518P . S.W C UT 1.6X4 .0X0. 5T0VM408485A
B521REV BRAKE SPG(HI) MK120VM414943
B522TG POST ASSEMBLY MK100VSA11012
B525LDG BEL T MK110VM412804
B529CLEANER ASSEMBLY MK100VSA11161
B551FF ARM(HI) MK120VM306183
B553REV SPRING MK110VM412555
B555RACK ASSEMBL Y MK120VSA13289
B557MOTOR PULLEY U50VM403205A
B558LOADING MOT O R MDB2B8 2 orMMDZB10SJ001
LOADING MO T OR M DB2B80 orMMDZB12SJ008
LOADING MO T OR M 31E-1 R- 14 7376 orMMDZB12MM00 3
LOADING MO T OR M 31E-1 R14 7 391MMDZB12MM004
B559CLUTCH ASSEMBLY(HI) MK120VSA13450
B562C DRIVE LEVER(SP) MK120VM203772
B563SLIDER SHAFT MK120VM305762
B564M GEAR(HI) MK120VM305755
B565SENSOR GEAR(HI) MK120VM305756
B567PINCH ARM(B) MK120VM305718
B568BT ARM MK120VM305728
B571P . S.W C UT 1.6X4 .0X0. 5T0VM408485A
B572P . S.W C UT 1.6X4 .0X0. 5T0VM408485A
B573REEL S MK110VM203436
B574REEL T MK100VM202872C
B578TR GEAR A MK100VM304440
B579TR GEAR B MK120VM305900
B580TR GEAR C MK120VM305743A
B581CENTER GEAR MK110VM305081
B582TR GEAR SPRING MK100VM411187C
B583CAM WASHER MK120VM414741
B584TR GEAR SHAFT MK100VM411186
B585PSW(317505) MK110VM413663
B587TENSION LEVER ASSEMBLY MK120VSA13279
B590BRAKE ARM(TU) MK120VM203752E
200307103-4-1H95B0DPL
Page 97
Ref.NoDescriptionPart No.
B591BAND BRAKE(TU) MK120VM305724C
B592TG POST MK100VM411108E
L1051SCREW , B- TIGHT M2.6X6 PAN HEAD+GPMB9060
L1053SCREW , S- TIGHT M2.6X8 W ASHER HEA D+GCMS9080
L1151SCREW , SEMS M3X4 PAN HEAD + orCPM33040
SCREW, SEMS M2.6X4 PAN HEAD+CPM39040
L1191SCREW , S- TIGHT M2.6X8 W ASHER HEA D+GCMS9080
L1321SCREW , S-TIGHT M3X6 BIND HEAD+GBMS3060
L1341SCREW , P- TIGHT M2X6 PAN HEAD+GPMP2060
L1406AC HEAD SCREW MK90VM410964
L1450SCREW , SEMS M2.6X5 PAN HEAD+CPM39050
L1466SCREW , S- TIGHT M2.6X6 BIND HEAD+GBMS9060
L1467SCREW M2.6X5 WASHER HEAD+SCM39050
200307103-4-2H95B0DPL
Page 98
DPVR-4604
H95B0ED
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