Note: Nominal specs represent the design specs. All units should be able to approximate these – some will exceed
and some may drop slightly below these specs. Limit s pecs represent the ab solute worst conditi on that still might
be considered acceptable; In no case should a unit fail to meet limit specs.
1. All Items are measured without pre-emphasis unless otherwise specified.
2. Power supply : AC220 - 240 V 50 Hz
3. Load imp. : 100 K ohm
4. Room ambient : 5
°C ~ 40 °C
1-1-2H9510SP
Page 5
LASER BEAM SAFETY PRECAUTIONS
This DVD player uses a pickup that emits a laser beam.
Do not look directly at the l aser beam coming
from the pickup or allo w it t o str ike agai nst your
skin.
The laser beam is emitted from the locatio n shown in the figure. When ch ecking the laser d iode, be sure to keep
your eyes at least 30cm away from the pickup lens when the diode is tur ned on. Do not loo k directly at the laser
beam.
Caution: Use of controls an d adjustments, or doing pr ocedures other than th ose specified here in, may result in
hazardous radiation exposure.
Drive Mecha Assembly
Laser Beam Radiation
Laser Pickup
Turntable
1-2-1DVD_LASER
Page 6
IMPORTANT SAFETY PRECAUTIONS
Product Safety Notice
Some electrical and mechanical parts have special
safety-related characteristics whi ch are often not evident from visual inspection, nor can the protection they
give necessarily be obtained by replacing them with
components rated for higher voltage, wattage, etc.
Parts that have special safety characteristics are identified by a ! on schematics and in parts lists. Use of a
substitute replacement that does not have the same
safety characteristics as the recommended replacement par t might create shock, fire, and/or other h azards. The Product’s Safety is under review
continuously and new instructions are issued whenever appropriate. Prior to shipment from the factory,
our products are carefully inspected to confirm with
the recognized product safety and electrical codes of
the countries in which they are to be sold. However, in
order to maintain suc h comp liance, it is equall y impor tant to implement the following precautions when a set
is being serviced.
Precautions during Servicing
A. Parts identified by the ! symbol are critical for
safety. Replace only with part number specified.
B. In addition to safety, other parts and assemblies
are specified for conformance with regulations
applying to spurious radiation. These must also be
replaced only with specified re pla ce men ts.
Examples: RF converter s, RF cables, noise blocking capacitors, and noise blocking filters, etc.
C. Use specified internal wiring. Note especially:
1)Wires covered with PVC tubing
2)Double insulated wires
3)High voltage leads
D. Use specified insulating materials for hazardous
live parts. Note especially:
1)Insulation tape
2)PVC tubing
3)Spacers
4)Insulators for transistors
E. When replacing AC primary side components
(transformers, power cord, etc.), wrap ends of
wires securely about the terminals before soldering.
F. Observe that the wires do not conta ct heat produc -
ing parts (heats inks, oxide metal fil m resis tors, fusible resistors, etc.).
G. Check that replaced wires do not contact sharp
edges or pointed parts.
H. When a power cord has been replaced, check that
5 - 6 kg of force in any direction will not loosen it.
I. Also check areas surrounding repa ired loc at ion s.
J. Be careful that foreign objects (screws, solder
droplets, etc.) do not remain inside the set.
K. Crimp type wire connector
The power transformer uses cri mp type con nec tors
which connect the power cord and the primary side
of the transformer. When replacing the transformer,
follow these steps carefully and precisely to prevent
shock hazards.
Replacement procedure
1)Remove the old connector by cutting the wires at a
point close to the connector.
Important: Do not re-use a connector. (Discard it.)
2)Strip about 15 mm of the insulation from the ends
of the wires. If the wires are stranded, twist the
strands to avoid frayed conductors.
3)Align the lengths of the wires to be connected.
Insert the wires fully into the connector.
4)Use a crimping tool to crimp the metal sleeve at its
center. Be sure to crimp fully to t he complete closure of the tool.
L. When connecting or disconnecting the internal
connectors, first, disc onnect the AC plug from the
AC outlet.
1-3-1DVD_SFNP2
Page 7
Safety Check after Servicing
Examine the area surrounding the repaired location for
damage or deteri oration. Observe that screws, par ts,
and wires have been returned to their original positions. Afterwards, do the following tests and confirm
the specified values to verify compliance with safety
standards.
1. Clearance Distance
When replacing primary circuit components, confirm
specified clearanc e distance (d ) and (d’) be tween soldered terminals, and between terminals and surrounding metallic parts. (See Fig. 1)
Table 1 : Ratings for selected area
AC Line VoltageClearance Distance (d) (d’)
Chassis or Secondary Conductor
Primary Circuit Terminals
dd'
220 - 240 V
Note: This table is unofficial and for reference only.
Be sure to confirm the precise values.
≥3mm(d)
≥6 mm(d’)
2. Leakage Current Test
Confirm the specified (or lower) leakage current
between B (earth ground, power cord plug prongs)
and externally exposed accessible parts (RF terminals, antenna terminals, video and audio input and
output terminals, microphone jacks, earphone jacks,
etc.) is lower than or equal to the specified value in the
table below.
Measuring Method (Power ON) :
Insert load Z between B (earth ground, power cord
plug prongs) and exposed accessible parts. Use an
AC voltmeter to measure across the ter minals of load
Z. See Fig. 2 and the following table.
Table 2: Leakage current ratings for selected areas
AC Line VoltageLoad ZLeakage Current (i)
2kΩ RES.
Connected in
parallel
220 - 240 V
50kΩ RES.
Connected in
parallel
i≤0.7mA AC Peak
i≤2mA DC
i≤0.7mA AC Peak
i≤2mA DC
Exposed Accessible Part
Z
One side of
B
Power Cord Plug Prongs
One side of power cord plug
prongs (B) to:
Antenna terminals
A/V Input, Output
AC Voltmeter
(High Impedance)
RF or
Fig. 1
Fig. 2
Note: This table is unofficial and for reference only. Be sure to confirm the precise values.
1-3-2DVD_SFNP2
Page 8
STANDARD NOTES FOR SERVICING
Circuit Board Indications
a. The output pin of the 3 pin Regulator ICs is indi-
cated as shown.
Top View
Out
b. For other ICs, pin 1 and every fifth pin are indicated
as shown.
Input
In
Pin 1
c. The 1st pin of every ma le c on nec tor i s indi ca ted a s
shown.
Pin 1
Bottom View
5
10
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:.
(1) Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
Fig. S-1-1
(2) R emove the flat pack-IC with tweezers while apply -
ing the hot air.
(3) Bott om of the flat pack-IC is fixed with glue to the
CBA; when rem oving enti re flat pa ck-IC, first apply
soldering iron to ce nter of the flat pack-IC and hea t
up. Then remove (glue will be melted). (Fig. S-1-6)
(4) R elease the f lat pack-IC from the CB A using twee-
zers. (Fig. S-1-6)
Instructions for Connectors
1. When you conn ect or disconn ect t he FFC (Flexible
Foil Connector) cable, be sure to first disconnect
the AC cord.
2. FFC (Flexible Foil Connector) cable should be
inserted parallel into the connector, not at an angle.
FFC Cable
Connector
CBA
* Be careful to avoid a short circuit.
Caution:
1. D o not supply hot air to the chip par ts around the
flat pack-IC for over 6 seconds because damage to
the chip parts may occur. Put masking tape around
the flat pack-IC to protect other parts from damage.
(Fig. S-1-2)
2. The flat pack-IC on the CBA is affixed with glue, so
be careful not to brea k or damage the foil of each
pin or the solder lands under the IC when removing
it.
Hot-air
Flat Pack-IC
Desoldering
CBA
Masking
Tape
Tweezers
Machine
Flat Pack-IC
Fig. S-1-2
1-4-1DVD_NOTE
Page 9
With Soldering Iron:
(1)Using desoldering braid, remove the solder from all
pins of the flat pack-IC. When you use solder flux
which is applied to all pins of the flat pack-IC, you
can remove it easily. (Fig. S-1-3)
Flat Pack-IC
Desoldering Braid
(4) Bott om of the flat pack-IC is fixed with glue to the
CBA; when rem oving enti re flat pa ck-IC, first apply
soldering iron to ce nter of the flat pack-IC and hea t
up. Then remove (glue will be melted). (Fig. S-1-6)
(5) R elease the f lat pack-IC from the CB A using twee-
zers. (Fig. S-1-6)
Note:
When using a solder ing iron, care must be taken
to ensure that the flat pack-IC is not bei ng held by
glue. When the flat pack-IC is removed from the
CBA, handle it gently beca use it may be damaged
if force is applied.
Soldering Iron
Fig. S-1-3
(2) Lift each lead of the flat pack-IC upward one by
one, using a shar p pin or wire to which s older will
not adhere (iron wi re). When he ating the pins, us e
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Sharp
Pin
Fine Tip
Soldering Iron
Fig. S-1-4
(3)Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to c en ter of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
(4)Relea se the flat pack-IC fro m the CBA using twee-
zers. (Fig. S-1-6)
With Iron Wire:
(1)Using desoldering braid, remove the solder from all
pins of the flat pack-IC. When you use solder flux
which is applied to all pins of the flat pack-IC, you
can remove it easily. (Fig. S-1-3)
(2) Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
(3) While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solde r
melts so as to lift the IC leads from the CBA contact
pads as shown in Fig. S-1-5
To Solid
Mounting Point
CBA
Tweezers
Hot Air Blower
or
Iron Wire
Soldering Iron
Fig. S-1-5
Fine Tip
Soldering Iron
Flat Pack-IC
Fig. S-1-6
1-4-2DVD_NOTE
Page 10
2. Installation
(1) Using desoldering braid, remove the solder from
the foil of each pin of the flat pack-IC on the CBA
so you can install a replacement fla t pack-IC more
easily.
(2) The “I” mark on the flat pack-IC indicates pin 1.
(See Fig. S-1-7.) Be s ure this mark matches the 1
on the PCB when positioni ng for installation. Then
presolder the four cor ners of the fl at pack-IC. (See
Fig. S-1-8.)
(3)Solder all pins of the flat pack-IC. Be sure that none
of the pins have solder bridges.
Example :
Pin 1 of the Flat Pack-IC
is indicated by a " " mark.
Fig. S-1-7
Instructions for Handling
Semi-conductors
Electrostatic breakdown of the semi-conductors may
occur due to a potential di fference caused by electrostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a groun ding band (1M Ω) that is properly grounded to re move any static electr ici ty that may
be charged on the body.
2. Ground for Workbench
(1) Be sure to place a conductive sheet or copper plate
with proper grounding (1MΩ) on the workbench or
other surface, where the semi-conductors are to be
placed. Because the static electricity charge on
clothing will not escape thr ough the body grounding band, be careful t o avoid contacting semi-conductors with your clothing.
< Incorrect >
CBA
Presolder
Flat Pack-IC
Fig. S-1-8
CBA
< Correct >
Grounding Band
1MΩ
CBA
1MΩ
Conductive Sheet or
Copper Plate
1-4-3DVD_NOTE
Page 11
PREPARATION FOR SERVICING
How to Enter the Service Mode
AAbout Optical Sensors
Caution:
An optical sensor system is used for the Tape Start
and End Sensors on this equipment. Carefully read
and follow the instructions below. Otherwise the unit
may operate erratically.
What to do for preparation
Insert a tap e into the Deck Mechan ism Assembly and
press the PLAY button. The tape will be loaded into
the Deck Mechanism Assembly. Make sure the power
is on, connect TP501 (SENSOR INHIBITION) to
GND. This will stop the function of Tape Star t Sensor,
Tape End Senso r and Reel Se nsors. (If the se TPs are
connected before plugging in the unit, the funct ion of
the sensors will stay valid.) See Fig. 1.
Note: Because the Tape E nd Sensor s are in active, do
not run a tape all the way to the start or the en d of the
tape to avoid tape damage.
Q503
Q504
TP501
S-INH
Fig. 1
1-5-1H9500PFS
Page 12
CABINET DISASSEMBLY INSTRUCTIONS
1. Disassembly Flowchart
This flowchart indicates the disassembly steps to gain
access to item(s) to be ser vic ed. When reasse mbling,
follow the steps in reverse order. Bend, route, and
dress the cables as they were originally.
[1] Top Cover
[2] Front
Assembly
[17] Side
Bracket
[5] DVD Main
CBA
[13] DVD OPEN/
CLOSE CBA
[12] Main CBA
[14] Function
CBA
[3] Top Bracket
[4] DVD Mecha
Assembly
[6] Rear Unit
[10] VCR
Chassis Unit
[15] Jack CBA
[9] Rear Panel
[8] PCB Bracket
[7] Power
Supply CBA
[11] Deck
Assembly
[16] Deck
Pedestal
ID/
LOC.
No.
[8]
[9]
[10]
[11]
PART
PCB
Bracket
Rear Panel
VCR
Chassis
Unit
Deck
Assembly
REMOVE/*UNHOOK/
Fig.
UNLOCK/RELEASE/
No.
UNPLUG/DESOLDER
D63(S-9)D6-----------
5(S-10), 2(S-11),
D7
2(S-11A)
Desolder , (S-12),
D8
(S-12A)
[12]Main CBA D8-----------
DVD
REMOVAL
OPEN/
[13]
CLOSE
D8Desolder-
CBA
Function
[14]
CBA
D8Desolder-
[15]Jack CBAD8Desolder-
Deck
[16]
[17]
Pedestal
Side
Bracket
D97(S-13)-
D9(S-14)-
Note
-
4,5
2. Disassembly Method
ID/
LOC.
No.
PART
Fig.
No.
[1]Top Cover D17(S-1)-
Front
[2]
[3]
Assembly
Top
Bracket
D2(S-2), *7(L-1)
D22(S-3), 2(S-3A)-
DVD
[4]
Mecha
D3
Assembly
DVD Main
[5]
CBA
D4
[6]Rear UnitD5
Power
[7]
Supply
D62(S-8), 2(S-8A)-
CBA
REMOVAL
REMOVE/*UNHOOK/
UNLOCK/RELEASE/
UNPLUG/DESOLDER
3(S-4), *CN302,
*CN401, *CN601
2(S-5), *CN201,
*CN301
5(S-6), 4(S-7),
CN1005
Note
1
1-1
1-2
-
2
2-1
2-2
2-3
3
-
↓
(1)
↓
(2)
↓
(3)
↓
(4)
↓
(5)
Note:
(1): Identification (location) No. of parts in the figures
(2):Name of the part
(3):Figure Number for reference
(4): Identification of parts to be removed, unhooked,
unlocked, released, unplugged, unclamped, or
desoldered.
P=Spring, L=Locking Tab, S=Screw,
CN=Connector
*=Unhook, Unlock, Release, Unplug, or Desolder
e.g. 2(S-2) = two Screws (S-2),
2(L-2) = two Locking Tabs (L-2)
(5): Refer to “Reference Notes.”
1-6-1H9500DC
Page 13
Reference Notes
CAUTION 1: Locking Tabs (L-1) are fragil e. Be caref ul
not to break them.
first release five Locking Tabs (A) at the side and
top, and then release two Locking Tabs (B) at the
bottom.)
CAUTION 2: Electrostatic breakdown of the laser
diode in the optical system block may occur as a
potential difference caused by electrostatic charge
accumulated on cloth, human body etc., during
unpacking or repair work.
To avoid damage of pickup follow next procedures.
2-1. Slide the pickup unit as shown in Fig. D4.
2-2. Short the three short lands of FPC cable with sol-
der before removing the FFC cable (CN301) from
it. If you disconnect the FFC ca ble (CN301), the
laser diode of pickup will be destroyed. (Fig. D4)
2-3. Disconnect Connector (CN201). Remove two
Screws (S-5) and lift the DVD Main CBA. (Fig.
D4)
CAUTION 3: When reassembling, confirm the FFC
cable (CN301) is conne cted compl etely. Then remove
the solder from the three short lands of FPC cable.
(Fig. D4)
CAUTION 4: When reassembling, solder wire jump ers
as shown in Fig. D8.
CAUTION 5: Before installing the Deck Assembly, be
sure to place the pin of LD-SW on Main CBA as shown
in Fig. D8. Then, install the Deck Assembly while
aligning the hole of Cam Gear with the pin of LD-SW,
the shaft of Cam Gear with the hole of LD-SW as
shown in Fig. D8.
(L-1)
(A)
(L-1)
(S-2)
(B)
[2] Front Assembly
CN601
CN302
(S-4)
CN401
(S-3)
(S-3A)
[3] T op Bracket
(S-3A)
(A)
(L-1)
(A)
Fig. D2
(S-4)
(S-4)
[4] DVD Mecha Assembly
[1] T op Cover
(S-1)
(S-1)
Fig. D1
Fig. D3
(S-1)
1-6-2H9500DC
Page 14
(S-5)
CN301
CN201
(S-5)
[5] DVD Main
CBA
DVD Mecha
(S-8)
(S-8)
(S-8A)
[8] PCB Bracket
[7] Power Supply CBA
(S-8A)
(S-9)
[9] Rear Panel
Fig. D6
A
Slide
[6] Rear Unit
B
Pickup Unit
View for A
Short the three short
lands by soldering
View for B
Fig. D4
(S-7)
(S-6)
(S-7)
CN003
(S-10)
(S-11A)
[10] VCR Chassis Unit
(S-11A)
(S-11)
(S-10)
(S-11)
(S-10)
Fig. D7
(S-7)
Fig. D5
1-6-3H9500DC
Page 15
[11] Deck
Assembly
FE Head
Cylinder Assembly
ACE Head
Assembly
Pin
SW507
LD-SW
Desolder
Lead with
blue stripe
[13] DVD OPEN/
CLOSE CBA
[12] Main CBA
(S-12)
[14] Function CBA
From
ACE Head
Assembly
[15] Jack CBA
(S-12A)
Lead with
blue stripe
[11] Deck Assembly
Shaft
Hole
LD-SW
Lead with blue stripe
Desolder from bottom
Desolder
Lead with
blue stripe
From
Cylinder
Assembly
[12] Main CBA
Cam Gear
Hole
Pin
[12] Main CBA
From
FE Head
From
Capstan
Motor
Assembly
Desolder
Lead connections of Deck Assembly and Main CBA
Lead with
white stripe
Printing side
Desolder
BOTT OM VIEW
Fig. D8
1-6-4H9500DC
Page 16
[16] Deck Pedestal
(S-13)
(S-14)
[17] Side
Bracket
(S-13)
To Remove the Disc Manually
Fig. D9
1. Remove the Top Cover.
2. Rotate this roulette in the direction of the arrow as
shown below.
Top Cover
1
DVD Mecha
Tray
Deck Assembly
3
2
Rotate this roulette in
the direction of the arrow
2
1-6-5H9500DC
Page 17
ELECTRICAL ADJUSTMENT INSTRUCTIONS
General Note: "CBA" is an abbreviation for
"Circuit Board Assembly."
NOTE:
1.Electric al adjust ments are required a fter repla cing
circuit components and ce rtain mechanical par ts.
It is impor tant to do these adjustments only afte r
all repairs and replacements have been completed. Also, do not attempt these adjustments
unless the proper equipment is available.
2.To perform th ese alignment / confirmation proce dures, make sure that the tracking control is set in
the center position: P ress ei ther "CHA NNEL L5??" or
"CHANNEL K" button on th e front panel first , then
the "PLAY" button on the front panel.
CH1
CH2
Figure 1
EXT. Syncronize Trigger Point
1.0H
6.5H±1H (412.7µs±60µs)
Switching Pulse
0.5H
V-Sync
Test Equipment Required
1.Oscilloscope: Dual-trace with 10:1 probe,
V-Range: 0.001~50V/Div.,
F-Range: DC~AC-20MHz
2.Alignment Tape (FL6A)
Head Switching Position Adjustment
Purpose:
To determine the Head Switching point during
playback.
Symptom of Mi sadjustm e n t:
May cause Head Switching noise or ver tical jitter
in the picture.
Test pointAdj.PointModeInput
TP751(V-OUT)
TP504(RF-SW)
GND
Tape
FL6AOscilloscope
VR501
(Switching Point)
(MAIN CBA)
Measurement
Equipment
PLAY
(SP)
6.5H±1H
(412.7µs±60µs)
-----
Spec.
Reference Notes:
Playback the Alignment tape and adjust VR501 so that
the V-sync front edge of the CH1 video output waveform is at the 6.5H(412 .7µs) del ayed position from the
rising edge of the CH2 head switching pulse waveform.
Connections of Measurement Equipment
TP751
Main CBA
GND
TP504
Oscilloscope
CH1 CH2
Trig. (+)
1-7-1H9500EA
Page 18
FIRMWARE RENEWAL MODE
1. Turn the power on and remove the disc on the tray.
2. To put the DVD player into version up mode, press
[9], [8], [7], [6], and [SEARCH MO DE] but tons on
the remote control unit in that order. The tray will
open automatically.
Fig. a appears on the screen and Fig. b appears on
the VFD.
F/W Version Up Mode
Please insert a DISC
for F/W Version Up.
EXIT: POWER
Fig. a Version Up Mode Screen
Fig. b VFD in Version Up Mode
The DVD player can also enter the version up
mode with the tray open. In this case, Fig. a will be
shown on the screen while the tray is open.
3. Load the disc for version up.
4. The DVD player enters the F/W version up mode
automatically. Fig. c appears on the screen and
Fig. d appears on the VFD.
F/W Version Up Mode
VERSION : ********
Reading...(*2)
5. A fter programming is fini shed, the tray opens au tomatically. Fig. e appears on the screen and the
checksum in (*3) of Fig. e appears on the VFD.
(Fig. f)
F/W Version Up Mode
VERSION : ********
Completed
SUM : 7abc (*3)
Fig. e Completed Program Mode Screen
Fig. f VFD upon Finishing the Programming Mode (Example)
At this time, no buttons are available.
6. Unplug the AC cord from the AC outlet. Then plug it
again.
7. Turn the power on by pressing the power button
and the tray will close.
8. Press [1], [2], [3], [4], and [DISPLAY] buttons on the
remote control unit in that order.
Fig. g appears on the screen.
The appearance shown in (*2) of Fig. c is
described as follows:
AppearanceNo.State
Reading...Sending files into the memory
1
Erasing...Erasing previous version data
2
Programming...
3Writing new version data
Fig. g
9. Press [3] button on the remote control unit.
Fig. h appears on the screen.
model: ******Ver: ****Region: **
TEST 3: EEPROM CLEAR
EEPROM CLEAR: OK
EXIT: POWERRETURN: -----
Fig. h
10.To finish this mode, press [POWER] button.
1-8-1H9500TEST
Page 19
1-9-11-9-2H9510BLS
Servo/System Control Block Diagram
MLOADING
MOTOR
CYLINDER ASSEMBLYCAPSTAN MOTOR
DRUM
MOTOR
PG
SENSOR
CONTROL
HEAD
CL287
55CTL(+)
66CTL(-)
CL504
AC HEAD ASSEMBLY
MAIN CBA
KEY- 1
POWER-LED
DVD-LED
REC-LED
VCR-LED
TIMER-LED
ST-S
T-REEL
REMOTE-VIDEO
CTL(+)
RESET
REC-SAF-SW
PG-DELAY
CTL(-)
D-V-SYNC
D-REC-H
INPUT-SELECT
RF-SW
H-A-SW
C-ROTA
END-S
14
94
95
10
4
80
34
2
13
15
18
33
41
16
31
7
(DECK ASSEMBLY)
T-REEL
Q515
RESET
Q506
S-REEL79
SW-POINT
AL+5V
VR501
TIMER+5V
S-REEL
PS502
TP502
KEY- 2
8
IIC-BUS SDA
IIC-BUS SDA
IIC-BUS SCL
A-MUTE-H
IIC-BUS SDA
IIC-BUS SCL
Hi-Fi-H-SW
A-MODE
OUTPUT-SELECT
A-MUTE-H
Hi-Fi-H-SW
A-MODE
H-A-COMP
17
V-ENV
6
P-ON-H
C-POW
-SW
P-ON-H
C-POW-SW
P-DOWN-L
67
66
86 P-DOWN-L
P-OFF-H
73 P-OFF-H
OUTPUT-SELECT
SW506
TO
VIDEO BLOCK
TO
Hi-Fi AUDIO
BLOCK
TO
AUDIO BLOCK
22KEY-1
44
POWER-LED
KEY SWITCH
CL505
D591
CL591
AL+5V
FUNCTION CBA
SDA
SCL
IC502 (MEMORY)
72
32
19
83
IIC-BUS SCL
D-V-SYNC
D-REC-H
INPUT
-SELECT
RF-SW
H-A-SW
C-ROTA
IIC-BUS SDA
H-A-COMP
V-ENV
58
C-SYNC
C-SYNC
OUTPUT-SELECT
IIC-BUS SCL
71
LD-SW
REMOTE-VIDEO
9
AL+5V
AL+5V
SW507
LD-SW
AL+5V
D555
S-LED
TO
POWER
SUPPLY
BLOCK
TP501
Q507
Q502
Q508
D504
Q509
Q511
S-INH
M
CAPSTAN
MOTOR
IC501
(SERVO/SYSTEM CONTROL)
LINE-MUTE
LINE-MUTE
82
5
6
SENSOR CBA
SENSOR CBA
END-S
ST-S
Q504
Q503
REC-SAFETY
END-S
CTL97
FF/REW-L84
Q510
TP503
CTL
74
23
25
29
30
26
POWER
REC
D503
VCR
D502
DVD
TO DVD SYSTEM
CONTROL BLOCK
<DVD SECTION>
TO DVD SYSTEM
CONTROL BLOCK
<DVD SECTION>
KEY
SWITCH
AL+5V
D501
TIMER
CL502
C-FG
C-CONT
D-PFG
C-F/R
90
76
87
78
LM-FWD/REV
81
D-CONT77
AL+20.5V/+12V
AL+12V(2)
P-ON+15V
P-ON+5V
1
AL+20.5V/+12V
2 P-ON+5V
3 C-FG
4
C-F/R
5
C-CONT
6
GND
7
LM-FWD/REV
8
D-CONT
9
D-PFG
10
GND
11
AL+12V(2)
12
P-ON+15V
M
DRV-DATA
DRV-STB
DRV-CLK
68
69
70
DVD-POWER
DRV-DATA
DRV-STB
DRV-CLK
DVD-POWER
21
Page 20
IIC-BUS SDA
IIC-BUS SCL
CYLINDER ASSEMBLY
V(R)-1
V-COM
V(L)-1
CL251
1
2
3
Video Block Diagram
1-9-31-9-4H9510BLV
(DECK ASSEMBLY)
VIDEO (R)-1
HEAD
SP
HEAD
AMP
EP
HEAD
AMP
REC FM
AGC
TO SERVO/SYSTEM
CONTROL BLOCK
TO SERVO/SYSTEM
CONTROL BLOCK
RF-SW
D-REC-H
C-ROTA
D-V-SYNC
H-A-SW
H-A-COMP
V-ENV
LUMINANCE
SIGNAL
PROCESS
CHROMINANCE
SIGNAL
PROCESS
V-ENV
H-A-COMP
H-A-SW
D-V-SYNC
RF-SW/C-ROTA
VIDEO (L)-1
HEAD
VIDEO (L)-2
HEAD
VIDEO (R)-2
HEAD
V(L)-2
V-COM
V(R)-2
4
5
6
TU701
IC301
(Y/C SIGNAL PROCESS)
IC501 (OSD)
REC-VIDEO SIGNAL
SERIAL
DECORDER
48
50
52
56
24
6
50
52
19
20
JK101
V-OUT1
V-IN1
61
63
96
95
94
93
90
89
88
87
CHARA.
INS.
CCD 1H DELAY
SP
BYPASS
MUTE
PB/EE
IN1
TUNER
IN1
TUNER
MUTE
PB/EE
FRT
IN2
FRT
IN2
AGC
PR
R
Y
C
P
R P R P
EP
Y. DELAY
Y/C
MIX
+
21
7978
AGCVXO
OSD
CHARACTER
MIX
FBC
1/2
5859
65
2928
6968
4643
84
83
71
62
70
D-REC-H
80
BUFFER
Q104
DVD
VCR
TP751
V-OUT
WF3
TP301
C-PB
WF2
TU-VIDEO
VIDEO
BUFFER
Q301
MAIN CBA
54
TP504
RF-SW
WF1
OUTPUT-SELECT
DVD-VIDEO
TO SERVO
/SYSTEM
CONTROL
BLOCK
TO SERVO/SYSTEM
CONTROL BLOCK
X301
4.43MHz
C-SYNC
C-SYNC 67
IC751 (SW)
4
5
3
11109
SW CTL
Q752
MODE: SP/RECPB-VIDEO SIGNAL DVD VIDEO SIGNAL
INPUT SELECT
V-OUT2
8
V-IN281010
JACK CBA
19
20
JK1402
V-OUT2
V-IN2
CL2017
CL2018
BUFFER
Q103
JK752
V-IN-F
3
IC1404 (SW)
5
4
TO DVD
VIDEO BLOCK
<DVD SECTION>
9
SW CTL
Page 21
1-9-51-9-6H9510BLA
Audio Block Diagram
REC
AMP
100
3
AUTO
BIAS
2
1
+5V
+5V
Q404
Q406
BIAS
OSC
Q403
N-A-PB
TO Hi-Fi
AUDIO BLOCK
N-A-REC
Q401
(PB=ON)
Q405
SWITCHING
D-REC-OFF
5
EQ
AMP
98
7
LINE
AMP
REC-ON
AUDIO HD-SW
CONTROL
MUTE
11
6
PB-ON
SP/LP-ON
P
TUNERIN2
IN1
R
ALC
DET
ALC
IC301
(AUDIO SIGNAL PROCESS)151317
4 A-PB/REC
CL504
3 A-COM
1 AE-H
2 AE-H/FE-H
A-PB/REC 4
A-COM 3
AE-H 1
AE-H/FE-H 2
CL287
AUDIO
HEAD
AUDIO
ERASE
HEAD
ACE HEAD ASSEMBLY
FE HEAD
2 FE-H
1 FE-H-GND
CL501
MAIN CBA
PB-AUDIO SIGNALREC-AUDIO SIGNALMode : SP/REC
71
A-MUTE-H
IIC-BUS SCL
IIC-BUS SDATO SERVO/SYSTEM
CONTROL BLOCK
FULL
ERASE
HEAD
68 69
SERIAL
DECODER
(DECK ASSEMBLY)
12
16
INV
ATT
Page 22
1-9-71-9-8H9510BLH
Hi-Fi Audio Block Diagram
48
47
61 71
62 70
14
15
78
R-CH
INSEL
L-CH
INSEL
IF SINAL
PROCESS
NOR
SW
SERIAL
DATA
DECODER
OUTPUT
SELECT
VCO
LPF
L-CH
BPF
R-CH
PNR
L-CH
PNR
LIMDEV
COMP
SW
NOISE
VCO
LPF
LIMDEV
COMP
COMP
SW
NOISE
ENV
DET
DO
DET
MIX
R-CH
BPF
P
R
R
L
P
R
HOLD
PULSE
NOISE
DET
34 33
21
76
77
74
37
38
39
75
73
26
53
24
27
N-A-REC
LIM
80
N-A-PB
Hi-Fi-H-SW
LINE-MUTE
A-MODE
TO AUDIO BLOCK
IIC-BUS SDA
IIC-BUS SCL
TO
SERVO/ SYSTEM
CONTROL BLOCK
Hi-Fi
AUDIO
(R)
HEAD
Hi-Fi
AUDIO
(L)
HEAD
CYLINDER
ASSEMBLY
MAIN CBA
Hi-Fi-A(R) 7
Hi-Fi-COM 8
Hi-Fi-A(L) 9
CL251
IC451 (MTS/ SAP/ Hi-Fi AUDIO PROCESS/ Hi-Fi HEAD AMP)
REC-AUDIO SIGNALPB-AUDIO SIGNALMode : SP/REC
DVD AUDIO SIGNAL
AFV CBA
JK101
A-OUT1(R)
A-OUT1(L)
2
6
2
6
1
3
1
3
JK1402
A-IN2(R)
A-IN2(L)
A-IN1(R)
A-IN1(L)
A-OUT2(R)
A-OUT2(L)
TU-AUDIO(R)
4
TU-AUDIO(L)
5
4
5
CN701CN1CN701CN1
TU701
SIF
AUDIO
22
2
ALC
SW
SW
ALC
67
65
Q451
MUTE-ON
MUTE-ON
REAR
JK751
A-OUT(R)
A-OUT(L)
JK754
A-IN(R)-F
JK753
A-IN(L)-F
IC751 (SW)
13
12
14
15
1
2
11109
SW CTL
BUFFER
BUFFER
Q107
Q108
Q752
VCR
DVD
VCR
DVD
OUTPUT-SELECT
DVD-A(R)
DVD-A(L)
TO DVD AUDIO
BLOCK
<DVD SECTION>
TO SERVO
/SYSTEM
CONTROL
BLOCK
50
60
58
2
52
56
6
10
4
12
54
8
JACK CBA
A-IN2(R)
4
A-IN2(L)
5
4
5
A-OUT2(R)
1
A-OUT2(L)
2
1
2
CL2017CL2018
(DECK ASSEMBLY)
SIF
2
2
Page 23
1-9-91-9-10H9510BLP
Power Supply Block Diagram
CAUTION
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,
REPLACE ONLY WITH THE SAME TYPE T1.6AL/250V FUSE.
NOTE :
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
CAUTION !
Fixed voltage (or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
TO SERVO/SYSTEM
CONTROL BLOCK
DIAGRAM
<VCR SECTION>
DVD-POWER
FROM SERVO/SYSTEM
CONTROL BLOCK
DIAGRAM
<VCR SECTION>
CN302CN2014
PLAY1
1
STOP2
2
POWER3
3
OPEN/CLOSE
PLAY
STOP
POWER
OPEN/CLOSE
4
4
Q1505
SW2020
CL2015CL2016
OPEN/CLOSE
2 GND
2
1
OPEN/CLOSE
1
DVD OPEN/CLOSE CBA
SW2021
STOP
SW2022
PLAY
48
47
61
94
FS(+) 18
FS(-) 19
TS(+) 20
TS(-) 17
CN201
FSTS
PICK-UP
UNIT
EV+3.3V
Page 25
1-9-131-9-14H9510BLD
Digital Signal Process Block Diagram
C 6
D 7
A 8
B 5
F 10
E 2
DVD-LD 14
CD-LD 12
PD-MONI 13
CN201
CN201
IC201
(SW)
IC105 (LATCH)
IC102 (SDRAM)IC101 (MICRO CONTROLLER)
CD/DVD
PICK-UP
UNIT
DETECTOR
CD/DVD 9
Q251,Q252
CDDVD
AMP
Q253,Q254
AMP
4
1 3
6
GND(DVD-PD)
15
GND(CD-PD)
16
GND(LD)
11
RF
SIGNAL
PROCESS
CIRCUIT
DVD/CD
FORMATTER
AUDIO
I/F
VIDEO
I/F
NTSC/PAL
ENCODER
DMA
BCU
INST.
ROM
32BIT
CPU
DATA
ROM
INTERRUPT
CONTROLLER
WATCH DOG
TIMER
CPU
I/F
TIMER
DECODER
I/F
CPU
I/F
READ
MEMORY
DATA
ROM
DSP
DECODER
PIXEL
OPERATION
I/O
PROCESSOR
INST.
ROM
DATA
ROM
INST.
ROM
DATA
ROM
INST.
ROM
SERIAL
D/A
GENERAL
I/O
INTERRUPT
CONTROLLER
TIMER
WATCH DOG
TIMER
32BIT CPU
STREAM
I/F
EXTERNAL
MEMORY
I/F
SDRAM
ECC
UMAC
124
125
122
123
128
129
126
127
131
130
135
133
132
134
78
DEBUG
BCU
INST
CACHE
D TYPE
LATCH
DATA
CACHE
D/A
D/A
D/A
TO DVD
VIDEO
/AUDIO
BLOCK
DIAGRAM
163
164
Y
C
R
G
VIDEO-Y
VIDEO-C
VIDEO-R
VIDEO-G
TO DVD
VIDEO
/AUDIO
BLOCK
DIAGRAM
181
SPDIF
175
PCM-BCK
176
PCM-DATA0
174
PCM-LRCLK
161
158
EXT ADT (0-15), EXT ADR (16-19)
EXT ADT (0-15), EXT ADR (16-19)
EXT ADT (0-7)
EXT ADT (8-15)
EXT ADR (0-7)
EXT ADR (0-15)
EXT ADR (8-15)
SDRAM DATA(0-31)SDRAM DATA(0-31)
SDRAM ADDRESS(0-10)SDRAM ADDRESS(0-10)
2
9
~
12
19
~
210
235
~
IC104 (LATCH)
D TYPE
LATCH
2
9
~
12
19
~
2
13
184
205
247
256
~~~
2
13
31
56
74
85
~~~
IC103 (FLASH ROM)
FLASH
ROM
29
36
38
45
~~
DVD MAIN CBA UNIT
DATA(VIDEO/AUDIO) SIGNALDVD VIDEO SIGNAL
DATA(AUDIO) SIGNAL
24
27
60
66
~~
EXT ADT (0-15)
EXT ADR (16-19)
~
1
9
16
25
48
~
D/A
B
VIDEO-B
160
Page 26
1-9-151-9-16H9510BLVD
DVD Video / Audio Block Diagram
IC601 (AUDIO DAC)
7
8
12
11
DIGITAL
AUDIO OUT
JK1202
BUFFER
Q1351
IC1201
Q1203
Q1201
Q1202
VREF
+3.3V
(AMP)
CN601CN1601
1313DVD-A(L)
1515DVD-A(R)
1414
DVD-A(L)-MUTE
1616
DVD-A(R)-MUTE
1212
DVD-A-MUTE
1
2
3
13
14
15
16
FROM
DVD
SYSTEM
CONTROL
/SERVO
BLOCK
DIAGRAM
FROM
DIGITAL
SIGNAL
PROCESS
BLOCK
DIAGRAM
SERIAL
PORT
SERIAL
CONTROL
4X/8X
OVERSAMPLING
DIGITAL FILTER
/FUNCTION
CONTROLLER
ENPHANCED
MULTI-LEVEL
DELTA-SIGMA
MODULATOR
DAC
LPF+AMP
L-CH
R-CH
LPF+AMP
DAC
ZERO DETECT
SYSTEM CLOCK
1
2
6
7
5
DVD-A(L)
DVD-A(R)
PCM-BCK
SPDIF
PCM-DATA0
PCM-LRCLK
ADAC-MD
ADAC-MC
ADAC-ML
PCM-SCLK
MAIN CBADVD MAIN CBA UNIT
DVD AUDIO SIGNALDATA(AUDIO) SIGNAL
1818SPDIF
A-MUTE
+3.3V
Q1204
WF9
3
WF7
WF8
CN601
11VIDEO-Y
99VIDEO-C
33VIDEO-R
77VIDEO-G
55VIDEO-B
VIDEO-Y
VIDEO-C
VIDEO-R
VIDEO-G
JK1401
S-VIDEO OUT
CN1601
34
2
1
IC1402 (VIDEO DRIVER)
28
4dB
AMP
2dB
AMP
LPFDRIVER
Y
C
31
2dB
AMP
DRIVER
4dB
AMP
2dB
AMP
LPFDRIVER
22
4dB
AMP
2dB
AMP
LPFDRIVER
14
19
4dB
AMP
2dB
AMP
LPFDRIVER
16
6
2
33
FROM DIGITAL
SIGNAL PROCESS
BLOCK DIAGRAM
DVD VIDEO SIGNAL
WF4
WF5
WF6
25
4dB
AMP
2dB
AMP
LPFDRIVER
12
VIDEO-B
TO
AUDIO
BLOCK
DIAGRAM
<VCR
SECTION>
DVD-VIDEO
TO VIDEO
BLOCK DIAGRAM
<VCR SECTION>
11
15
7
JK101
DVD-G
DVD-R
DVD-B
FIBER OPTIC
TRANS MODULE
3
IC1204
Page 27
SCHEMATIC DIAGRAMS / CBA’S AND TEST POINTS
Standard Notes
WARNING
Many electrical and m echanical parts in this chassis
have special characteristics. These characteristics
often pass unnoticed and the protection afforded by
them cannot necessarily be obtained by using replacement components rated for higher voltage, wattage,
etc. Replacement par ts that have these specia l safety
characteristics are identified in this manual and its
supplements; electr ical components having such features are identified by the mark " ! " in the schematic
diagram and the parts list. Before replacing any of
these components, read the par ts list in this manual
carefully. The use of substitut e replacem ent par t s that
do not have the same safety characteristics as specified in the parts list may create shock, fire, or other
hazards.
Notes:
1. Do not use the part number shown on these drawings for ordering. The correct part number is shown
in the parts list, and may be slightly different or
amended since these drawings were prepared.
2. All resistance values are indicated in ohms
3
(K=10
3. Re sistor wattages are 1/4W or 1/6W unless otherwise specified.
4. All capacitance values are indicated in µF
(P=10
5. All voltages are DC voltages unless otherwise
specified.
6. Electrical parts such as capacitors, connectors,
diodes, IC’s, transistors, resistors, switches, and
fuses are identified by four digits. The first two digits are not shown for each component. In each
block of the diagram, there is a note such as shown
below to indicate these abbreviated two digits.
, M=106).
-6
µF).
1-10-1SCPA1
Page 28
LIST OF CAUTION, NOTES, AND SYMBOLS U SED IN THE SCHEMATIC DIAGRAMS ON THE FOLLOWING
PAGES:
1. CAUTION:
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH THE SAME TYPE FUSE.
2. CAUTION:
Fixed Voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown, first check to see th at all compon ents in the power supply circ uit are not defective before you connect the AC plug to the AC power supply. Otherw ise it m ay cause some co mpo nents in the
power supply circuit to fail.
3. Note:
(1) Do not use the part number shown on the drawings for ordering. The correct part number is shown in the parts
list, and may be slightly different or amended since the drawings were prepared.
(2) To maintain original function and reliability of repaired units, use only original replacement parts which are listed
with their part numbers in the parts list section of the service manual.
4. Wire Connectors
(1) Prefix symbol "CN" means "connector" (can disconnect and reconnect).
(2) Prefix symbol "CL" means "wire-solder holes of the PCB" (wire is soldered directly).
5. Voltage indications for PLAY and REC modes on the schematics are as shown below:
< DVD Section >
231
5.0
The same voltage for
both PLAY & STOP modes
Indicates that the voltage
is not consistent here.
6. How to read converged lines
1-D3
Distinction Area
Line Number
(1 to 3 digits)
Examples:
1. "1-D3" means that line number "1" goes to area "D3".
2. "1-B1" means that line number "1" goes to area "B1".
7. Test Point Information
: Indicates a test point with a jumper wire across a hole in the PCB.
: Used to indicate a test point with a component lead on foil side.
: Used to indicate a test point with no test pin.
5.0
(2.5)
PLAY mode
STOP mode
< VCR Section >
5.0
The same voltage for
both PLAY, REC & DVD
modes
5.0
(2.5)
< >
PLAY mode
REC mode
DVD mode
231
Indicates that the voltage
is not consistent here.
3
2
1
ABCD
Unit: Volts
1-B1
AREA D3
AREA B1
1-D3
: Used to indicate a test point with a test pin.
1-10-2SCRK05
Page 29
Main 1/9 Schematic Diagram < VCR Section >
1-10-3
1-10-4
H9510SCM1
Page 30
Main 2/9 & Sensor Schematic Diagram < VCR Section >
1-10-5
1-10-6
H9510SCM2
Note:
When it is necessary to replace one or more of the following Diodes,
all one should be replaced: D501, D502, D503, D504.
*
1
Page 31
1-10-7
1-10-8
H9510SCM3
Main 3/9 Schematic Diagram < VCR Section >
Page 32
Main 4/9 Schematic Diagram < VCR Section >
1-10-9
1-10-10
H9510SCM4
Page 33
Main 5/9 Schematic Diagram < VCR Section >
1-10-11
1-10-12
H9510SCM5
Page 34
Main 6/9 Schematic Diagram < VCR Section >
1-10-13
1-10-14
H9510SCM6
Page 35
Main 7/9 Schematic Diagram < VCR Section >
1-10-15
1-10-16
H9510SCM7
Page 36
Main 8/9 & DVD Open/ Close Schematic Diagram < VCR Section >
1-10-17
1-10-18
H9510SCM8
Page 37
1-10-191-10-20
Main 9/9 Schematic Diagram < VCR Section >
H9510SCM9
Page 38
Power Supply & Junction Schematic Diagram < VCR Section >
1-10-21
1-10-22
H9510SCP
NOTE :
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
CAUTION !
Fixed voltage ( or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
Page 39
1-10-231-10-24
Jack Schematic Diagram < VCR Section >
H9510SCJ
Page 40
1-10-25
1-10-26
Function Schematic Diagram < VCR Section >
H9510SCF
Page 41
1-10-27
1-10-28
AFV Schematic Diagram < VCR Section >
H9510SCAFV
Page 42
SW-P
VR501
CTL
TP503
V-OUT
TP751
WF3
C-PB
TP301
WF2
RF-SW
TP504
WF1
S-INH
TP501
Main CBA Top View & Sensor CBA Top View
1-10-29
BH9510F01011A
BHB300F01014-A
BHB300F01014-B
1-10-30
Sensor CBA Top View
NOTE :
Either BH9510F01011, BH9510F01012
is used for the Main CBA in this S/M.
Page 43
1-10-31
Main CBA Bottom View
BH9510F01011A
1-10-32
NOTE :
Either BH9510F01011, BH9510F01012
is used for the Main CBA in this S/M.
Page 44
SW-P
VR501
CTL
TP503
V-OUT
TP751
WF3
C-PB
TP301
WF2
RF-SW
TP504
WF1
S-INH
TP501
Main CBA Top View & Sensor CBA Top View
1-10-33
BH9510F01012A
BHB300F01014-A
BHB300F01014-B
1-10-34
Sensor CBA Top View
NOTE :
Either BH9510F01011, BH9510F01012
is used for the Main CBA in this S/M.
Page 45
1-10-35
Main CBA Bottom View
BH9510F01012A
1-10-36
NOTE :
Either BH9510F01011, BH9510F01012
is used for the Main CBA in this S/M.
Page 46
1-10-37
Function CBA Top View
BH9510F01011B
1-10-38
Function CBA Bottom View
BH9510F01011C
DVD OPEN/CLOSE CBA Top ViewDVD OPEN /CLOSE CBA Bottom View
NOTE :
Either BH9510F01011, BH9510F01012
is used for the Function CBA in this S/M.
NOTE :
Either BH9510F01011, BH9510F01012
is used for the DVD Open/ Close CBA in this S/M.
Page 47
1-10-39
BH9510F01012A
1-10-40
Function CBA Top View
BH9510F01012B
Function CBA Bottom View
BH9510F01012C
DVD OPEN/CLOSE CBA Top ViewDVD OPEN /CLOSE CBA Bottom View
NOTE :
Either BH9510F01011, BH9510F01012
is used for the Function CBA in this S/M.
NOTE :
Either BH9510F01011, BH9510F01012
is used for the DVD Open/ Close CBA in this S/M.
Page 48
1-10-411-10-42
Power Supply CBA Top View
BH9510F01021A
Power Supply CBA Bottom View
BH9510F01021B
BECAUSE A HOT CHASSIS GROUND IS PRESENT IN THE POWER
SUPPLY CIRCUIT , AN ISOLATION TRANSFORMER MUST BE USED.
ALSO , IN ORDER TO HAVE THE ABILITY TO INCREASE THE INPUT
SLOWLY , WHEN TROUBLESHOOTING THIS TYPE POWER SUPPLY
CIRCUIT , A VARIABLE ISOLATION TRANSFORMER IS REQUIRED.
CAUTION !
Fixed voltage ( or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
NOTE :
The voltage for parts in hot circuit is measured
using hot GND as a common terminal.
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
Junction CBA Top ViewJunction CBA Bottom View
NOTE :
Either BH9510F01021, BH9510F01022
is used for the Power Supply CBA in this S/M.
NOTE :
Either BH9510F01021, BH9510F01022
is used for the Junction CBA in this S/M.
Page 49
1-10-43
1-10-44
Power Supply CBA Top View
BH9510F01022A
Power Supply CBA Bottom View
BH9510F01022B
BECAUSE A HOT CHASSIS GROUND IS PRESENT IN THE POWER
SUPPLY CIRCUIT , AN ISOLATION TRANSFORMER MUST BE USED.
ALSO , IN ORDER TO HAVE THE ABILITY TO INCREASE THE INPUT
SLOWLY , WHEN TROUBLESHOOTING THIS TYPE POWER SUPPLY
CIRCUIT , A VARIABLE ISOLATION TRANSFORMER IS REQUIRED.
CAUTION !
Fixed voltage ( or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
NOTE :
The voltage for parts in hot circuit is measured
using hot GND as a common terminal.
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
Junction CBA Top ViewJunction CBA Bottom View
NOTE :
Either BH9510F01021, BH9510F01022
is used for the Power Supply CBA in this S/M.
NOTE :
Either BH9510F01021, BH9510F01022
is used for the Junction CBA in this S/M.
Page 50
1-10-45
1-10-46
Jack CBA Top ViewJack CBA Bottom View
BH9510F01021C
Jack CBA Top View
Jack CBA Bottom View
BH9510F01022C
NOTE :
Either BH9510F01021, BH9510F01022
is used for the Jack CBA in this S/M.
Page 51
1-10-471-10-48
AFV CBA Top ViewAFV CBA Bottom View
BHC400F01091
Page 52
DVD Main 1/3 Schematic Diagram < DVD Section >
H9510SCD1
1-10-491-10-50
Page 53
1-10-511-10-52
DVD Main 2/3 Schematic Diagram < DVD Section >
H9510SCD2
Page 54
1-10-531-10-54
IC101 VOLTAGE CHART
PIN.NO PLAY STOP PIN.NO PLAY STOP PIN.NO P LAY STOP PIN.NO PLAY STOP PIN.NO PLAY STOP
1.Clean all par ts for the tape transpor t (Up per Drum with V ideo Head / Pinch Rol ler / Audio Control Head / Full
Erase Head) using 90% lsopropyl Alcohol.
2.After cleaning the parts, do all DECK ADJUSTMENTS.
3.For the reference numbers listed above, refer to Deck Exploded Views.
* B73 ------ Recording Model only
M Brake (TU) Assembly (HI)
LDG Belt
II
II
2-1-1U27MENHS
Page 66
Cleaning
Cleaning of Video Head
Clean the head with a head clea ning stick or chamois
cloth.
Procedure
1.Remove the top cabinet.
2.Put on a glove (thin type) to avoid touching the
upper and lower drum with your bare hand.
3.Put a few drops of 90% Isopro pyl al cohol on the
head cleaning stick or on the chamois cloth and,
by slightly pressing it against the head tip, turn the
upper drum to the right and to the left.
Notes:
1.The video head surface is made of very hard
material, but since it is very thin, avoid cleaning it
vertically.
2.Wait for the cleaned par t to dry thoroughly before
operating the unit.
3.Do not reuse a stained head cleaning stick or a
stained chamois cloth.
Cleaning of Audio Control Head
Clean the head with a cotton swab.
Procedure
1.Remove the top cabinet.
2.Dip the cotton swab in 90% is opropyl alcohol and
clean the audio control head. Be careful not to
damage the upper drum and other tape running
parts.
Notes:
1.Avoid cleaning the audio control head vertically.
2.Wait for the cleaned part to dr y thoroughly before
operating the unit or damage may occur.
ACE Head
Upper
Cylinder
Do Not !
Video Head
Cleaning Stick
2-1-2U27MENHS
Page 67
SERVICE FIXTURE AND TOOLS
J-1-1, J-1-2
J-3
J-2
J-4
J-5
Ref. No. NamePart No.Adjustment
J-1-1Alignment TapeFL6AHead Adjustment of Audio Control Head
J-1-2Alignm ent TapeFL6N8
J-2Guide Roller Adj.Screwdr iverAvailable
J-3M irrorAvailable
J-4Azimuth Adj.Screwdriver +Available
J-5X Value Adj.Screwdriver -Available
(1 speed only)
FL6NS8
(2 speed only)
Locally
Locally
Locally
Locally
2-2-1U25PFIX
Azimuth and X Value Adjustment of Audio Control
Head / Adjustment of Envelope Waveform
Guide Roller
Tape Transportation Check
A/C Head Height
X Value
Page 68
MECHANICAL ALIGNMENT PROCEDURES
Explanation of alignment for the tape to correctly run
starts on the next page. Refer to the information below
on this page i f a tape gets stuck, for example, in the
mechanism due to some electrical trouble of the unit.
4-4-1 Service Information
A. Method for Manual Tape Loading/Unloading
To load a cassette tape manually:
1. Disconnect the AC plug.
2. Remove the Top Case and Front Assembly.
3. Insert a ca ss et te t ape. T ho ugh the ta pe will not be
automatically loaded, m ake sure that the cassette
tape is all the way in at the inlet of the Cassette
Holder. To confirm th is, lightly push the cassette
tape furt her in and see if the tape come s back out,
by a spring motion, just as much as you have
pushed in.
4. Turn the LDG Belt in the appropriate direction
shown in Fig. M1 for a minute or two to compl ete
this task.
To unload a cassette tape manually:
1. Disconnect the AC plug.
2. Remove the Top Case and Front Assembly.
3. Make sure that the Moving guide preparations are
in the Eject Position.
4. Turn the LDG Belt in the appropriate direction
shown in Fig. M1 un til the Moving guide preparations come to the Eject Position. Stop turning when
the preparations begin clicking or can not be
moved further. However, the tape will be left
wound around the cylinder.
5. Turn the LDG Belt in the appropria te direct ion continuously, and the cassette tape will be ejected.
Allow a minute or two to complete this task.
B. Method to place t he Cassette Holder in the tape-
loaded position without a cassette tape
1. Disconnect the AC Plug.
2. Remove the Top Case and Front Assembly.
3. Turn the LDG Belt in the appropriate direction
shown in Fig. M1. Release the lo cking tabs shown
in Fig. M1 and continue tur ning the LDG Belt until
the Cassette Holder comes to the tape-loaded
position. Allow a minute or two to complete this
task.
Top View
Moving guide T preparation
(Eject Position)
Moving guide S preparation
(Eject Position)
Push the tape
to load it.
Push the locking tab gently to unlock
when loading without a cassette.
UNLOAD
/EJECT
LOAD
Side View
LDG Belt
Fig. M1
Bottom View
LDG Belt (B)
UNLOAD
/EJECT
Cam Gear
Fig. M2
2-3-1H9500MA
Page 69
1.Tape Interchangeability Alignment
Note:
To do these alignment pr ocedur es, make sure that the
Tracking Control Circuit is set to the center position
every time a tape is loaded or unloaded. (Refer to
page 2-3-4, procedure 1-C, step 2.)
Note: Before starting this Mechanical Alignment, do all
Electrical Adjustment procedures.
Flowchart of Alignment for tape traveling
Loading (Use a blank tape.)
Adjust the height of the Guide Rollers
(Supply side and take-up side).
(Use a blank tape.) (pg. 2-3-3)
1-A
Not good
Check to see that the tape is not creasing
and that there is no slack on the supply
and take-up side Guide Rollers.
(Use a blank tape.)
1-A
Adjust the X Value for maximum envelope.
(pg. 2-3-3) (Use Alignment Tape.)
Adjust the envelope. (pg. 2-3-4)
Check the envelope.
1-B
1-C
1-C
OK
Adjust the Audio Section.
(Azimuth Alignment) (pg. 2-3-4)
Check the audio output.
1-D
1-D
OK
Not good
Not good
Do the final tape-traveling test to see that
the tape runs normally in play mode without creasing or slacking.
1-A
OK
Completion
Check the following:
1. X Value (pg. 2-3-3)
2. Envelope (pg. 2-3-4)
OK
1-B, 1-C
Not good
2-3-2H9500MA
Adjust the X value and envelope.
1-B, 1-C
Page 70
1-A. Preliminary/Final Checking and
Alignment of Tape Path
Purpose:
To make sure that the tape path is well stabilized.
Symptom of Misalignment:
If the tape path is unstable, the tape will be damaged.
Note: Do not use an Alignment Tape for this proce-
dure. If the unit is not correctly ali gned, the tape may
be damaged.
1. Playback a blank cass ette tape and check to see
that the tape runs without creasing at Guide Rollers
[2] and [3], and at points A and B on the lead s urface. (Refer to Fig M3 and M4.)
2. If creasing is apparent, align the height of the guide
rollers by turning the t op of Guide Rollers [2] and
[3] with a Guide Roller Adj . Screwdriver. (R efer to
Fig. M3 and M5.)
Guide Roller [2]
A
Take-up Guide Post [4]
Lead Surface of Cylinder
Correct
Guide Roller
Tape
Guide Roller [3]
B
Tape
Incorrect
AC Head
Fig. M3
Fig. M4
3. Check to see that the tape run s withou t cr ea si ng a t
Take-up Guide Post [4] or witho ut s na king bet ween
Guide Roller [3] and AC Head. (Fig. M3 and M5)
4. If creasing or snaking is apparent, adjust the Tilt
Adj. Screw of the AC Head. (Fig. M6)
Azimuth Adj. Screw
AC Head
X-Value Adj.
Screwdriver
Tilt Adj. Screw
Fig. M6
1-B. X Value Alignment
Purpose:
To align the Horizontal Position of the Audio/Control/
Erase Head.
Symptom of Misalignment:
If the Horizontal Position of the Audio/Control/Erase
Head is not proper ly aligne d, maxi mum envelope cannot be obtained at the Neutral position of the Track ing
Control Circuit.
1. Connect the oscilloscope to TP301 (C-PB) and
TP503 (CTL) on the Main CBA. Use TP504 (RFSW) as a trigger.
2. Playback the Gray Scale of the Alignment Tape
(FL6NS8) and confirm that the PB FM signal is
present.
3. S et the Tracking Control Circui t to the center position by pressing CH UP button then “ PLAY ” button
on the unit. (Refer to note on bottom of page
2-3-4.)
4. Use the X-Value Adj. Screwdriver so that the PB
FM signal at TP301 (C-PB) is maximum. (Fig. M6)
5. Press CH UP button on the unit until the CTL waveform has shifted by approx. +2msec. Make sure
that the envelope is simply attenuated (shrinks in
height) during this process so that you will know
the envelope has been at its peak.
Take-up Guide
Post
Tape
Fig. M5
2-3-3H9500MA
Page 71
6. Press CH DOWN button on the unit until the CTL
waveform has sh ifted from its or iginal positio n (not
the position achi eved in step 5, but the position of
CTL waveform in step 4) by approximately -2m sec.
Make sure that the envelope is simply atte nuated
(shrinks in height ) once CTL waveform passes its
original position and is further brought in the minus
direction.
7. Set the Tracking Control Circui t to the center position by pressing CH UP button and then “ PLAY ”
button.
1-C. Checking/Adjustment of Envelope
Waveform
Purpose:
To achieve a satisfactory picture and precise tracking.
Symptom of Misalignment:
If the envelope output is poor, noise will appear in the
picture. The tracking will then lose precision and the
playback picture will be distor ted by any slight variation of the Tracking Control Circuit.
1. Connec t the oscilloscope to TP301 (C-P B) on the
Main CBA. Use TP504 (RF-SW) as a trigger.
2. Playback the Gray Scale on the Alignment Tape
(FL6NS8). Set the Tracking Control Cir cuit to the
center position by pressi ng CH UP button an d t hen
“ PLAY ” button on the unit. Adjust the height of
Guide Rollers [2] and [3] (Fig. M3, Page 2-3-3)
watching the oscillosco pe display so that the envelope becomes as flat as poss ible. To do this adj us tment, turn the top of the Guide Roller with the
Guide Roller Adj. Screwdriver.
3. If the envelope is as shown in Fig. M7, adjus t the
height of Guide Rol le r [2] ( Refer to Fig . M 3) s o that
the waveform looks like the one shown in Fig. M9.
4. If the envelope is as shown in Fig. M8, adjus t the
height of Guide Rol le r [3] ( Refer to Fig . M 3) s o that
the waveform looks like the one shown in Fig. M9.
5. When Guide Rollers [2] and [3] (Refer to Fig.M3)
are aligned properly, there is no envelope drop
either at the beginn ing or end of track as shown in
Fig. M9.
Dropping envelope level at the beginning of track.
Dropping envelope level at the end of track.
Fig. M8
Envelope is adjusted properly. (No envelope drop)
Fig. M9
Note: Upon completion of the adjustment of Guide
Rollers [2] and [3] (Refer to Fig. M3), check the X
Value by pushing the CH UP or DOWN buttons alternately, to check the sym metry of the envelope. Check
the number of pushe s to ensure cente r position. T he
number of pushes CH UP button to achi eve 1 /2 level
of envelope should match the number of pushes CH
DOWN button from center. If required, redo the “X
Value Alignment.”
1-D. Azimuth Alignment of Audio/Control/
Erase Head
Purpose:
To correct the Azimuth alignment so that the Audio/
Control/Erase Head meets tape tracks properly.
Symptom of Misalignment:
If the position of the Audio/Con trol/Erase Head is not
properly aligned, the Audio S/N Ratio or Frequency
Response will be poor.
1. C onnect the oscilloscope to th e audio output jack
on the rear side of the deck.
2. Playback the alignment tape (FL6NS8) and confirm
that the audio signal output level is 8kHz.
3. Adjust Azimuth Adj. Screw so that the output level
on the AC Vol tmeter or the waveform on the oscilloscope is at maximum. (Fig. M6)
Fig. M7
2-3-4H9500MA
Page 72
DISASSEMBLY/ASSEMBLY PROCEDURES
OF DECK MECHANISM
Before following the procedures described below, be sure to remove the deck assembly from the cabinet. (Refer to
CABINET DISASSEMBLY INSTRUCTIONS on page 1-6-1.)
All the following procedures, includi ng those for adjustment and replacement of par ts, should be done in Eject
mode; see the positions of [44] and [45] in Fig. DM1 on page 2-4-3. When reassembling, follow the steps in reverse
order.
[9][9]AC Head AssemblyTDM1,DM7(S-4)
[10][2]Tape Guide Arm Assembly TDM1,DM8*(P-2)
[11][10]C Door Opener TDM1,DM8*(L-4)
[12][11]Pinch Arm (B)TDM1,DM8*(P-3)
[13][12]Pinch Arm AssemblyTDM1,DM8
[14][14]FE Head AssemblyTDM1,DM9(S-5)
[15][15]PrismTDM1,DM9(S-6)
[16][2]Slider ShaftTDM10*(L-5)
[17][16]C Drive Lever (SP)TDM10
[18][16]C Drive Lever (TU)TDM10(S-7),*(P-4)
[19][19]Capstan MotorBDM2,DM11 3(S-8), Cap Belt
[20]
(1): Follow steps in sequence. When reassembling, follow the steps in reverse order.
These numbers are also used as identification (location) No. of parts in the figures.
(2): Indicates the part to start disassembling with in order to disassemble the part in column (1).
(3): Nam e of the part
(4): Location of the part: T=Top B=Bottom R=Right L=Left
(5): Figure Number
(6): Identification of parts to be removed, unhooked, unlocked, released, unplugged, unclamped, or desoldered.
e.g., 2(L-2) = two Locking Tabs (L-2).
(7): Adjustment Information for Installation
(+):Refer to Deck Exploded Views for lubrication.
.
2-4-2H9500DA
Page 74
T op View
[14]
[38]
[37]
[45][44][46][9]
[7][49][8]
[32][43][41][40][31][42]
[13]
[11]
[15]
[10]
[12]
[36]
Bottom View
[23]
[24]
[27]
Fig. DM1
[19]
[35]
[34]
[25]
[26]
[33][20][28][22]
Fig. DM2
2-4-3H9500DA
Page 75
(S-1)
[1]
(S-1)
Fig. DM3
[7]
(L-1)
[3]
[6]
(L-2)
(P-1)
[49]
[4]
(L-3)
[5]
Fig. DM5
Pin D
Pin C
Slots B
First, while pushing the locking tab as
shown in the right, slide and pull up the right
side on [2] to release Pin A and Pin B from
the slots A.
Then, remove Pin C and Pin D on [2] from
the slots B as shown.
[2]
Pin A
Locking tab
2
Pull up
A
1
Slide
Pin B
Slot A
Slot A
View for A
Fig. DM4
Desolder
from bottom
(S-2)
View for A
[50]
(L-12)
A
Lead with
Red Stripe
Fig. DM6
2-4-4H9500DA
Page 76
[9]
A
(S-4)
[8]
[14]
(S-5)
(S-6)
[15]
(S-3)
Adj. Screw
[13]
LDG
Belt
Desolder
from bottom
Lead with White Stripe
View for A
[8]
Fig. DM7
[11]
(L-4)
(P-3)
[12]
[10]
Fig. DM9
[17]
(L-5)
[16]
[18]
(P-4)
(P-2)
Pin of [12]
View for A
Pin of [10]
Groove of [27]
[27]
A
(S-7)
Fig. DM10
When reassembling [10] and
[12], confirm that pin of [10]
and pin of [12] are in the
groove of [27] as shown.
Fig. DM8
2-4-5H9500DA
Page 77
Cap Belt
[19]
(S-8)
Fig. DM11
[24]
[27]
(S-9)
(L-8)
(C-4)
[26]
(C-5)
[28]
[29]
[30]
(C-3)
[23]
(L-7)
(C-2)
[25]
[22]
turn
(L-6)
(C-1)
[21]
Pin on [22]
[20]
[31]
Position of Mode Lever when installed
Pin of [36]
Bottom View
[27]
Pin of [33]
Align [26] and [27] as shown.
First groove on [27]
Pin of [37]
First tooth on [44]
[26]
Position of pin on [22]
[27]
Fig. DM12
[27]
When reassembling [27],
meet the first groove on
[27] to the first tooth on
T op Vie w
[44] as shown.
Fig. DM13
2-4-6H9500DA
Page 78
[33]
(P-5)
[32]
(L-9)
Refer to the Alignment
Section, Page 2-4-8.
[35]
[34]
Fig. DM14
[44]
[45]
[46]
(L-11)
Fig. DM16
(P-6)
[37]
(C-7)
[41]
[39]
turn
(C-6)
[40]
turn
[43]
(L-10)
[38]
[42]
[36]
turn
[48]
[47]
Slide
Fig. DM17
Fig. DM15
2-4-7H9500DA
Page 79
ALIGNMENT PROCEDURES OF MECHANISM
The following procedures describe how to align the
individual gears and levers that make up the tape loading/unloading mechanism. Since information about the
state of the mechanism is provided to the System
Control Circuit only through the Mode Switch, it is
essential that the co rrect re lationsh ip between ind ividual gears and levers be maintained.
All alignments are t o be p erformed with the mechanism in Eject mode, in the sequence given. Each
procedure assumes th at all previous procedur es have
been completed.
IMPORTANT:
If any one of these alig nments is not per formed properly, even if off by only one tooth , the unit will unload
or stop and it may result in damage to the mechanic al
or electrical parts.
Alignment points in Eject Position
T op View
Alignment 3
Alignment 1
Loading Arm (SP) and (TU) Assembly
Install Loading A rm (SP) and (TU) Assembly so that
their triangle marks point to each other as shown in
Fig. AL2.
Alignment 2
Mode Gear
Keeping the two triangles pointing at each other, install
the Loading Arm ( TU) Assembly so that the last tooth
of the gear meets the most ins ide teeth of the Mode
Gear. See Fig. AL2.
Alignment 1
Triangle Marks
Loading Arm
(SP) Assembly
Last T ooth
Alignment 2
Loading Arm
(TU) Assembly
Most inside teeth
of Mode Gear
Mode Gear
Fig. AL2
Bottom View
Alignment 1
Alignment 2
Fig. AL1
Alignment 3
Cam Gear (A) (HI), Rack Assembly
Install the Rack Assembly so that the firs t tooth on the
gear of the Rack Assembly meets the first groove on
the Cam Gear (A) (HI) as shown in Fig. AL3.
See Electrical Parts List
for parts with this mark.
Some Ref. Numbers are
not in sequence.
2B15
2B15
2B46
JW001
JW002
JW003
JW009
JW007
2B13
1B1
2L071
2L071
2L071
2L071
2L071
C'
A'
B'
A1X
2L034
2B9
JW008
Sensor CBA
AFV CBA
Sensor CBA
DVD OPEN/
CLOSE CBA
2B6
RM2001
F1001
Power Supply CBA
Junction CBA
2L052
2L031
2L031
2L052
2B40
JW006
JW005
2B33
2L053
2L053
2B33
Jack CBA
2L035
2B53
2B54
EXPLODED VIEWS
Cabinet
3-1-13-1-2H9510CEX
Page 82
Packing
[ DPVR-4800 ]
X20BX20A
X5
[ DPVR-4600 ][ DPVR-4600 ][ DPVR-4800 ]
X20
X26
X47
S7
S2
X22
[ DPVR-4600 ]
X42
X1
X4
X3
X2
S2
S3
Unit
Some Ref. Numbers
are not in sequence.
A14
S1
3-1-3H9510PEX
Page 83
DECK EXPLODED VIEWS
Deck Mechanism View 1
B2
B9
L1191
B73
B10
L1053
B411
B567
L1467
B494
MarkDescription
Floil G-684G or Multemp MH-D
SLIDUS OIL #150
B35
B553
(Blue grease)
B11
B12
B571
L1450
B492
B74
L1051
B37
B410
L1450
B121
B8
Chassis Assembly
Top View (Lubricating Point)
B501
L1466
B126
B86
Some Ref. Numbers are not in sequence.
Chassis Assembly
Bottom View (Lubricating Point)
3-1-4H9500DEX
Page 84
Deck Mechanism View 2
B487
B587
B416
B521
B591
MarkDescription
Floil G-684G or Multemp MH-D
SLIDUS OIL #150
SANKOUL FG84M
(Yellow grease)
(Blue grease)
B508
B414
B572
B565
B499
B417
B568
B573
B585
B574
B518
B564
B584
B590
B148
B592
B31
B522
L1151
L1406
B3
B558
B557
B525
B578
B579
B582
B580
B583
B579
View
for A
Some Ref. Numbers are not in sequence.
A
B581
B559
B516
B133
B52
B551
B507
B488
B491
B513
Bottom Side (Grease point)
Bottom Side
(Grease point)
3-1-5H9500DEX
Page 85
Deck Mechanism View 3
L1321
B355
B347
MarkDescription
Floil G-684G or Multemp MH-D
SLIDUS OIL #150
L1321
B354
B483
(Blue grease)
B562
B482
B563
B425
B300
B313
B529
B360
B359
B361
Some Ref. Numbers are not in sequence.
B555
B303
B514
3-1-6H9500DEX
Page 86
MECHANICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a
! have special characteristics important to safety.
Before replacing any of these comp onents, read carefully the product safety notice in this service manual.
Don't degrade the safety of the product through
improper servicing.
NOTE:
Parts that are not assigned par t numbers (---------) ar e
not available.
S1AGIFT BOX CAR T ON H9510ED0VM306161
S1BGIFT BOX CAR T ON H9514ED0VM306294
S2STYROFOAM(2) H9100UD0VM203377C
S3UNIT, BAG E5500UD0VM411683
S721P PAD HC463FD0VM413384
ACCESSORIES
X1REMOTE CONTROL UNIT 364/CRC007NA214ED
X2DRY BA TTER Y R6P/2S orXB0M451T0001
DRY BATTERY ES-GR6M-CXB0M571GLP01
X3RF CORD P AL 1.2M o rWPZ0 122LG0 01
RF CABLE CC1001020012010WPZ0122LW001
X4ACCESSORY BAG K8092BA0VM404632
X521P CABLE(BYR SUPPLY) H9300ED0VMN03276
X20!AOWNER'S MANUAL H9510ED0VMN03502
X20A!BOWNER'S MANUAL(SPANISH) H9514ED0VMN03641
X20B!BOWNER' S MANU AL(P OR TUGESE )H9514ED 0VMN03642
X22ASER VICE CENTER LIST HC2C0ED0VMN03071
X26BWARRANTY CARD(SPANISH) HE245ED0VMN03636
X42AADDENDUM SHEET H9500ED0VMN03760
X47BLABEL, SERIAL NO. H9500ED----------
200304083-2-1H9510CA
Page 87
ELECTRICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a
! have special characteristics important to safety.
Before replacing any of these comp onents, read carefully the product safety notice in this service manual.
Don't degrade the safety of the product through
improper servicing.
NOTES:
1.Par ts that are not assigned par t numbers (-------- -)
are not available.
2.Tolerance of Capacitors and Resistors are noted
with the following symbols.
C.....±0.25%D.....±0.5%F.....±1%
G.....±2%J......±5%K.....±10%
M.....±20%N.....±30%Z.....+80/-20%
3.LED Type:
When it is necessary to replace one or mo re of the
following diodes, all four should be replaced: D501,
D502, D503, and D504 on the Main CBA.
Comparison Chart of Models and Marks
ModelMark
DPVR-4600A
DPVR-4800B
DVD MAIN CBA UNIT
Ref. No. MarkDescriptionPart No.
ABDVD MAIN CBA UNIT
DVD MAIN CBA UNIT
N79GMGEP
N79GPGEP
MCV CBA
Ref. No. MarkDescriptionPart No.
ABMCV CBA
MCV CBA
Consists of the following
MAIN CBA (MCV-A)
FUNCTION CBA (MCV-B)
DVD OPEN/CLOSE CBA (MCV -C)
SENSOR CBA
MAIN CBA
Ref. No. MarkDescriptionPart No.
MAIN CBA (MCV-A)
Consists of the following
CAPACITORS
C056ELECTROLYTIC CAP. 47µF/25V M orCE1EMASDL470
ELECTROLYTIC CAP. 47µF/25V MCE1EMASTL470
C057ELECTROLYTIC CAP. 10µF/16V M orCE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTL100
C058ELECTRIC DOUBLE LA YER CAP0. 047F/
5.5V Z or
ELECTRIC DOUBLE LAYER CAP. 0.047F/
5.5V Z
0VSA14058
0VSA14078
--------------
--------------
-------------0VSA14057
----------
CA0J473NE003
CA0J473MS014
Ref. No. MarkDescriptionPart No.
C059ELECTROL YTIC CAP. 100µF/6.3V M orCE0KMASDL101
ELECTROLYTIC CAP . 100µF/6.3V MCE0KMASTL101
C060CHIP CERAMIC CAP . B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP. B K 0.047µF/25VCHD1EK30B473
C062CHIP CERAMIC CAP . F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C063ELECTROL YTIC CAP. 47µF/16V M orCE1CMASDL470
ELECTROLYTIC CAP . 47µF/16V MCE1CMASTL470
C068CHIP CERAMIC CAP . CH J 470pF/50V orCHD1JJ3CH471
CHIP CERAMIC CAP . CG J 470pF/50VCHD1JJ3CG471
C104ELECTROL YTIC CAP. 100µF/16V M orCE1CMASDL101
ELECTROLYTIC CAP . 100µF/16V MCE1CMASTL101
C107ELECTROL YTIC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP . 470µF/6.3V MCE0KMASTL471
C109CHIP CERAMIC CAP . CH J 470pF/50V orCHD1JJ3CH471
CHIP CERAMIC CAP . CG J 470pF/50VCHD1JJ3CG471
C112CHIP CERAMIC CAP . CH J 470pF/50V orCHD1JJ3CH471
CHIP CERAMIC CAP . CG J 470pF/50VCHD1JJ3CG471
C113CHIP CERAMIC CAP . F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C114CHIP CERAMIC CAP . B K 1000pF/50VCHD1JK30B102
C116CHIP CERAMIC CAP . B K 2200pF/50VCHD1JK30B222
C117ELECTROL YTIC CAP. 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP . 1µF/50V MCE1JMASTL1R0
C118CHIP CERAMIC CAP . B K 2200pF/50VCHD1JK30B222
C127ELECTROL YTIC CAP. 10µF/16V M orCE1CMASDL100
ELECTROLYTIC CAP . 10µF/16V MCE1CMASTL100
C129ELECTROL YTIC CAP. 100µF/16V M H7CE1CMAVSL101
C130ELECTROL YTIC CAP. 4.7µF/50V M H7CE1JMAVSL4R7
C131ELECTROL YTIC CAP. 4.7µF/50V M H7CE1JMAVSL4R7
C132ELECTROL YTIC CAP. 4.7µF/50V M H7CE1JMAVSL4R7
C251ELECTROL YTIC CAP. 10µF/16V M H7CE1CMAVSL100
C252CHIP CERAMIC CAP . F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C253CHIP CERAMIC CAP . B K 1000pF/50VCHD1JK30B102
C254ELECTROL YTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C301CHIP CERAMIC CAP . B K 0.022µF/50V orCHD1JK30B223
CHIP CERAMIC CAP. B K 0.022µF/25VCHD1EK30B223
C302ELECTROL YTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C303CHIP CERAMIC CAP . F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C305ELECTROL YTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C306CHIP CERAMIC CAP . B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP. B K 0.047µF/25VCHD1EK30B473
C307CHIP CERAMIC CAP . B K 0.022µF/50V orCHD1JK30B223
CHIP CERAMIC CAP. B K 0.022µF/25VCHD1EK30B223
C308CHIP CERAMIC CAP . F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C309CHIP CERAMIC CAP . CH J 68pF/50V orCHD1JJ3CH680
C311CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C312ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C313ELECTROLYTIC CAP. 1µF/50V M H7CE1JMASSL1R0
C314CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C315CHIP CERAMIC CAP . B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP. B K 0.047µF/25VCHD1EK30B473
C316ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C317CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C319CHIP CERAMIC CAP . CH J 68pF/50V orCHD1JJ3CH680
CHIP CERAMIC CAP. CG J 68pF/50VCHD1JJ3CG680
C320CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C321CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C322CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C323CHIP CERAMIC CAP . CH J 68pF/50V orCHD1JJ3CH680
CHIP CERAMIC CAP. CG J 68pF/50VCHD1JJ3CG680
C324CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C325CHIP CERAMIC CAP . B K 8200pF/50VCHD1JK30B822
C326CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C328ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C329CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C330ELECTROLYTIC CAP. 100µF/16V M H7CE1CMAVSL101
C331ELECTROLYTIC CAP. 220µF/6.3V M H7CE0KM A VSL 221
C333CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C334ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C335ELECTROLYTIC CAP. 100µF/6.3V H7CE0KMAVSL10 1
C336CHIP CERAMIC CAP . CH J 220pF/50V orCHD1JJ3CH221
CHIP CERAMIC CAP. CG J 220pF/50VCHD1JJ3CG221
C337CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C339CHIP CERAMIC CAP . CH J 120pF/50V orCHD1JJ3CH121
CHIP CERAMIC CAP. CG J 120pF/50VCHD1JJ3CG121
C340ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C341CHIP CERAMIC CAP. CH D 10pF/50V orCHD1JD3CH100
CHIP CERAMIC CAP. CG D 10pF/50VCHD1JD3CG100
C342CHIP CERAMIC CAP . B K 1000pF/50VCHD1JK30B102
C343ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C344ELECTROLYTIC CAP. 4.7µF/25V M NP H7 CP1EMAVSB4R7
C345ELECTROLYTIC CAP. 0.47µF/50V M H7CE1JMAVSLR47
C346CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C347CHIP CERAMIC CAP . CH J 68pF/50V orCHD1JJ3CH680
CHIP CERAMIC CAP. CG J 68pF/50VCHD1JJ3CG680
C348CERAMIC CAP.(AX) F Z 0.1µF/50VCCA1JZTFZ104
Ref. No. MarkDescriptionPart No.
C349ELECTROL YTIC CAP. 0.47µF/50V M H7CE1JMAVSLR47
C350CERAMIC CAP .(AX) F Z 0.1µF/50VCCA1JZTFZ104
C402FILM CAP .(P) 0.018µF/50V JCMA1JJP0018 3
C403CERAMIC CAP. B K 470pF/100VCCD2AKS0B471
C404ELECTROL YTIC CAP. 220µF/6.3V M H7CE0KMASSL221
C405ELECTROL YTIC CAP. 47µF/6.3V M H7CE0KMAVSL4 70
C407CHIP CERAMIC CAP . CH J 820pF/50V orCHD1JJ3CH821
CHIP CERAMIC CAP. CH J 820pF/25V orCHD1EJ3CH821
CHIP CERAMIC CAP . CG J 820pF/50VCHD1JJ3CG821
C408CHIP CERAMIC CAP . B K 1800pF/50VCHD1JK30B182
C409CHIP CERAMIC CAP . CH J 33pF/50V orCHD1JJ3CH330
CHIP CERAMIC CAP. CG J 33pF/50VCHD1JJ3CG330
C410ELECTROL YTIC CAP. 10µF/16V M H7CE1CMAVSL100
C411CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C412ELECTROL YTIC CAP. 33µF/6.3V M H7CE0KMAVSL3 30
C413CHIP CERAMIC CAP . F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C414CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C415ELECTROL YTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C416CHIP CERAMIC CAP . B K 4700pF/50VCHD1JK30B472
C417ELECTROL YTIC CAP. 22µF/6.3V M H7CE0KMAVSL2 20
C418CHIP CERAMIC CAP . F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C419CHIP CERAMIC CAP . CH J 220pF/50V orCHD1JJ3CH221
CHIP CERAMIC CAP . CG J 220pF/50VCHD1JJ3CG221
C420CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C421ELECTROL YTIC CAP. 47µF/6.3V M H7CE0KMAVSL4 70
C451CHIP CERAMIC CAP . F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C452ELECTROL YTIC CAP. 10µF/16V M H7CE1CMAVSL100
C453ELECTROL YTIC CAP. 22µF/10V M H7CE1AMAVSL220
C454CHIP CERAMIC CAP . F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C455CHIP CERAMIC CAP . F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C456ELECTROL YTIC CAP. 10µF/16V M H7CE1CMAVSL100
C457ELECTROL YTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C458CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C461CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C462CHIP CERAMIC CAP . B K 4700pF/50VCHD1JK30B472
C463ELECTROL YTIC CAP. 22µF/10V M H7CE1AMAVSL220
C464CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C465ELECTROL YTIC CAP. 10µF/16V M H7CE1CMAVSL100
C466CHIP CERAMIC CAP . F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C467CHIP CERAMIC CAP . F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C468ELECTROL YTIC CAP. 220µF/6.3V M H7CE0KMAVSL221
C469ELECTROL YTIC CAP. 22µF/10V M H7CE1AMAVSL220
C470CHIP CERAMIC CAP . B K 4700pF/50VCHD1JK30B472
C471CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C472ELECTROL YTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C473ELECTROL YTIC CAP. 10µF/16V M H7CE1CMAVSL100
C474CHIP CERAMIC CAP . F Z 0.1µF/50V orCHD1JZ30F104
200304083-3-2H9510EL
Page 89
Ref. No. MarkDescriptionPart No.
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C475CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C476ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
C477CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C478CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C479ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C480ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R 7
C481ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R 7
C482CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C483ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R 7
C484ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R 7
C485ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C486CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C487ELECTROLYTIC CAP. 47µF/16V M H7CE1CMAVSL470
C488CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C505CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C506ELECTROLYTIC CAP. 220µF/6.3V M H7CE0KM A VSL 221
C508CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C509CHIP CERAMIC CAP . B K 1000pF/50VCHD1JK30B102
C510CHIP CERAMIC CAP . B K 4700pF/50VCHD1JK30B472
C511CHIP CERAMIC CAP . CH J 100pF/50V orCHD1JJ3CH101
CHIP CERAMIC CAP. CG J 100pF/50VCHD1JJ3CG101
C513CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C514CHIP CERAMIC CAP . CH J 330pF/50V orCHD1JJ3CH331
CHIP CERAMIC CAP. CG J 330pF/50VCHD1JJ3CG331
C515CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C516ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
C517CERAMIC CAP.(AX) F Z 0.022µF/25VCCA1EZTFZ223
C518ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
C519CHIP CERAMIC CAP . CH J 560pF/50V orCHD1JJ3CH561
CHIP CERAMIC CAP. CG J 560pF/50VCHD1JJ3CG561
C521ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
C522CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C524CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C527CERAMIC CAP.(AX) B K 100pF/50VCCA1JKT0B101
C531CHIP CERAMIC CAP . B K 4700pF/50VCHD1JK30B472
C533CHIP CERAMIC CAP . B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP. B K 0.047µF/25VCHD1EK30B473
C534ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C535CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C538CHIP CERAMIC CAP . CH J 180pF/50V orCHD1JJ3CH181
CHIP CERAMIC CAP. CG J 180pF/50VCHD1JJ3CG181
Ref. No. MarkDescriptionPart No.
C539CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C540CHIP CERAMIC CAP . B K 4700pF/50VCHD1JK30B472
C541CHIP CERAMIC CAP . CH J 18pF/50V orCHD1JJ3CH180
CHIP CERAMIC CAP. CG J 18pF/50VCHD1JJ3CG180
C542CHIP CERAMIC CAP . CH J 18pF/50V orCHD1JJ3CH180
CHIP CERAMIC CAP. CG J 18pF/50VCHD1JJ3CG180
C543CHIP CERAMIC CAP . CH J 22pF/50V orCHD1JJ3CH220
CHIP CERAMIC CAP. CG J 22pF/50VCHD1JJ3CG220
C544CHIP CERAMIC CAP . CH J 22pF/50V orCHD1JJ3CH220
CHIP CERAMIC CAP. CG J 22pF/50VCHD1JJ3CG220
C545CHIP CERAMIC CAP . CH J 22pF/50V orCHD1JJ3CH220
CHIP CERAMIC CAP. CG J 22pF/50VCHD1JJ3CG220
C546CHIP CERAMIC CAP . CH J 22pF/50V orCHD1JJ3CH220
CHIP CERAMIC CAP. CG J 22pF/50VCHD1JJ3CG220
C547CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C548CHIP CERAMIC CAP . F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C549ELECTROL YTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C550ELECTROL YTIC CAP. 100µF/6.3V H7CE0KMAVSL101
C553ELECTROL YTIC CAP. 22µF/10V M H7CE1AMAVSL220
C555CHIP CERAMIC CAP . F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C611ELECTROL YTIC CAP. 22µF/50V M orCE1JMASDL220
ELECTROLYTIC CAP . 22µF/50V MCE1JMASTL220
C612CHIP CERAMIC CAP . B K 4700pF/50VCHD1JK30B472
C614CHIP CERAMIC CAP . F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C701ELECTROL YTIC CAP. 100µF/6.3V H7CE0KMAVSL101
C703CHIP CERAMIC CAP . B K 1000pF/50VCHD1JK30B102
C706CHIP CERAMIC CAP . B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP. B K 0.047µF/25VCHD1EK30B473
C708ELECTROL YTIC CAP. 10µF/16V M H7CE1CMAVSL100
C709CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C711CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C712CHIP CERAMIC CAP . F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C714CHIP CERAMIC CAP . B K 1500pF/50VCHD1JK30B152
C715CHIP CERAMIC CAP . F Z 0.22µF/16V orCHD1CZ30F224
CHIP CERAMIC CAP. FZ Z 0.22µF/25VCHD1EZ3FZ224
C716CHIP CERAMIC CAP . F Z 0.22µF/16V orCHD1CZ30F224
CHIP CERAMIC CAP. FZ Z 0.22µF/25VCHD1EZ3FZ224
C751CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C752ELECTROL YTIC CAP. 47µF/10V M H7CE1AMAVSL470
C753ELECTROL YTIC CAP. 4.7µF/50V M H7CE1JMASSL4R7
C754ELECTROL YTIC CAP. 4.7µF/50V M H7CE1JMASSL4R7
C755CHIP CERAMIC CAP . B K 2200pF/50VCHD1JK30B222
C756CHIP CERAMIC CAP . B K 2200pF/50VCHD1JK30B222
C757ELECTROL YTIC CAP. 47µF/6.3V M orCE0KMASDL470
ELECTROLYTIC CAP . 47µF/6.3V MCE0KMASTL470
C758CERAMIC CAP .(AX) Y M 0.01µF/16VCCA1CMT0Y103
C783CHIP CERAMIC CAP . CH J 470pF/50V orCHD1JJ3CH471
CHIP CERAMIC CAP . CG J 470pF/50VCHD1JJ3CG471
C784CHIP CERAMIC CAP . CH J 470pF/50V orCHD1JJ3CH471
CHIP CERAMIC CAP . CG J 470pF/50VCHD1JJ3CG471
C1061ELECTROLYTIC CAP. 2200µF/6.3V MCE0KMASTL222
C1201ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C1202ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
CHIP CERAMIC CAP. CG J 100pF/50VCHD1JJ3CG101
C1355CHIP CERAMIC CAP. F Z 1µF/10VCHD1AZ30F105
C1359CHIP CERAMIC CAP. CH D 9pF/50VCHD1JD3CH9R0
C1393ELECTROLYTIC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C1394ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C1402PCB JUMPER D0.6-P5.0JW5.0T
C1421CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C1422CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1441CHIP CERAMIC CAP. B K 0.33µF/10VCHD1AK30B3 34
C1442ELECTROLYTIC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C1445ELECTROLYTIC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C1461ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C1462ELECTROLYTIC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C1471ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C1481ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C1482ELECTROLYTIC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C1486ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C1487CHIP CERAMIC CAP. B K 1000pF/50VCHD1JK30B102
C1523CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
Ref. No. MarkDescriptionPart No.
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1531CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C1532ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL2 20
C2002CHIP CERAMIC CAP. B K 1000pF/50VCHD1JK30B102
C2004ELECTROLYTIC CAP. 100µF/6.3V H7CE0KMAVSL101
C2012CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C2013CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C2016CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
POWER SUPPLY CBA (PSV-A)
JUNCTION CBA (PSV-B)
JACK CBA (PSV -C)
POWER SUPPLY CBA
Ref. No. DescriptionPart No.
POWER SUPPLY CBA (PSV-A)
Consists of the following
CAPACITORS
C013ELECTROLYTIC CAP . 10µF/50V M orCE1JMASDL100
ELECTROLYTIC CAP. 10µF/50V MCE1JMASTL100
C014ELECTROLYTIC CAP . 470 µF/25V M orCE1EMASDL471
ELECTROLYTIC CAP. 470µF/25V MCE1EMASTL471
C017ELECTROLYTIC CAP . 1000µF/16V MCE1CMZPTL102
C018ELECTROLYTIC CAP . 470 µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C020ELECTROLYTIC CAP . 22µF/50V M orCE1JMASDL220
ELECTROLYTIC CAP. 22µF/50V MCE1JMASTL220
C021CERAMIC CAP . (AX) F Z 0.1µF/50VCCA1JZTFZ104
C022ELECTROLYTIC CAP . 470 µF/35V M orCE1GMASDL471
ELECTROLYTIC CAP. 470µF/35V MCE1GMASTL471
C1001! METALLIZED FILM CAP. 0.068µF/275V K orCT2E683HJE 06
!META LLIZ ED FI LM C AP. 0.068µF/250V KCT2E683DC011
C1003CERAMIC CAP. B K 0.01µF/500VCCD2JKP0B103
C1004ELECTROL YTIC CAP. 100µF/400V MCA2H101S6016
C1005CERAMIC CAP. SL K 56pF/1KV orCCD3AKPSL560
CERAMIC CAP. SL J 56pF/1KVCCD3AJPSL560
C1006! SAFETY CAP. 2200pF/250V orCCN2EMP0E222
!SAFETY CAP . 2200pF/250VCA2E222MR049
C1007ELECTROL YTIC CAP. 1000µF/6.3V MCE0KMZPTL102
C1013CERAMIC CAP.(AX) X K 3300pF/16VCCA1CKT0X332
C1018ELECTROL YTIC CAP. 100µF/10V M orCE1AMASDL101
ELECTROLYTIC CAP. 100µF/10V MCE1AMASTL101
0VSA14040
--------------
--------------
--------------
----------
200304083-3-10H9510EL
Page 97
Ref. No. DescriptionPart No.
C1021CERAMIC CAP.(AX) Y M 0.01µF/16VCCA1CMT0Y103
C1022CERAMIC CAP.(AX) Y M 0.012µF/16VCCA1CMT0Y123
C1029CERAMIC CAP.(AX) X K 5600pF/16VCCA1CKT0X562
C1032ELECTROL YTIC CAP. 10µF/16V M orCE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTL100
C1033FILM CAP.(P) 0.022µF/50V J orCMA1JJS00223
FILM CAP .(P) 0.022µF/50V JCA1J223MS029
C1035ELECTROL YTIC CAP. 470µF/25V M orCE1EMASDL471
ELECTROLYTIC CAP. 470µF/25V MCE1EMASTL471
C1053CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C1054ELECTROL YTIC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C1055CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C1105ELECTROL YTIC CAP. 100µF/16V M orCE1CMASDL101
ELECTROLYTIC CAP. 100µF/16V MCE1CMASTL101
C1106ELECTROL YTIC CAP. 100µF/35V M orCE1GMASDL101
ELECTROLYTIC CAP. 100µF/35V MCE1GMASTL101
C1107ELECTROL YTIC CAP. 220µF/6.3V M orCE0KMASDL221
ELECTROLYTIC CAP. 220µF/6.3V MCE0KMASTL221
C1108ELECTROL YTIC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C1109ELECTROL YTIC CAP. 220µF/6.3V M orCE0KMASDL221
ELECTROLYTIC CAP. 220µF/6.3V MCE0KMASTL221
DIODES
D013RECTIFIER DIODE BA157 orNDQZ000BA157
FAST RECO VER Y DIODE ERA18-04QDPZ0ERA1804
D014SCHOTTKY BARRIER DIODE SB390NDQZ000SB390
D015ZENER DIODE DZ-5.6BSCT265 orNDTC0DZ5R6BS
METAL O XIDE FILM RES. 1W J 2.7 ΩRN01JZQZ02R7
R1051CHIP RES .(160 8) 1/10 W J 3.9k ΩRRXAJR5Z0392
R1052CHIP RES .(160 8) 1/10 W J 10k ΩRRXAJR5Z0103
R1059CARBON RES. 1/6W J 1k Ω orRCX6JATZ0102
CARBON RES. 1/4W J 1k ΩRCX4JA T Z0102
R1063CHIP RES .(160 8) 1/10 W J 8.2k ΩRRXAJR5Z0822
R1064CHIP RES .(160 8) 1/10 W J 4.7k ΩRRXAJR5Z0472
R2126CARBON RES. 1/4W J 6.8k ΩRCX4JA T Z0682
R2127CARBON RES. 1/4W J 6.8k ΩRCX4JA T Z0682
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C4CHIP CERAMIC CAP . CH J 56pF/50V orCHD1JJ3CH560
CHIP CERAMIC CAP. CG J 56pF/50VCHD1JJ3CG560
C5CHIP CERAMIC CAP . CH J 22pF/50V orCHD1JJ3CH220
CHIP CERAMIC CAP. CG J 22pF/50VCHD1JJ3CG220
C6CHIP CERAMIC CAP . CH J 56pF/50V orCHD1JJ3CH560
CHIP CERAMIC CAP. CG J 56pF/50VCHD1JJ3CG560
C7CHIP CERAMIC CAP. CH C 3pF/50V orCHD1JC3CH3R0
CHIP CERAMIC CAP. CJ C 3pF/50V orCHD1JC3CJ3R0
CHIP CERAMIC CAP. CH D 3pF/50VCHD1JD3CH3R0
C8CHIP CERAMIC CAP. CH C 3pF/50V orCHD1JC3CH3R0
CHIP CERAMIC CAP. CJ C 3pF/50V orCHD1JC3CJ3R0
CHIP CERAMIC CAP. CH D 3pF/50VCHD1JD3CH3R0
C11CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C12ELECTROLYTIC CAP . 10µF/16V M H7CE1CMASSL100
C13CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C14CHIP CERAMIC CAP . B K 0.01µF/50VCHD1JK30B103
C15ELECTROLYTIC CAP . 10µF/16V M H7CE1CMASSL100
C16ELECTROLYTIC CAP . 10µF/16V M H7CE1CMASSL100
C17CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C19CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C20ELECTROLYTIC CAP . 3. 3µF/50V M H7CE1JMASSL3R3
C21CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C22ELECTROLYTIC CAP . 10µF/16V M H7CE1CMASSL100
C24ELECTROLYTIC CAP . 0. 22µF/50V M H7CE1JMASSLR22
Four different, but interchangeable, types of B558
(LOADING MOTOR) may be installed in these models.
Please confirm B558 (LOADING MOTOR) type by a
part number on it. B558 (LOADING MOTOR) type varies in combin ation with L1151. Please see Table 1 for
details and combination.
Table 1 (B558 and L1151 Combination)
LOADING MOTOR (B558)SCREW (L1151)
DescriptionParts No.DescriptionParts No.
LOADING MOTOR
M31E-1 R-14 7376
LOADING MOTOR
M31E-1 R-14 7391
LOADING MOTOR
MDB2B80
LOADING MOTOR
MDB2B82
Ref.NoDescriptionP art No.
B2CYLINDER ASSEMBLY MK12 P AL 4HD HIFI orN1767CYL
CYLINDER ASSEMBL Y( V) MK12 PAL 4HD HIFIN1769CYL
B3LOADING MOTOR ASSEMBL Y MK1 1 TVCR0VSA13465
B8PULLEY ASSEMBLY(HI) MK120VSA13501
B9MOVING GUIDE S PREPARATION MK120VSA13560
B10MOVING GUIDE T PREP ARATION MK120VSA13562
B11LOADING ARM(TU) ASSEMBL Y MK120VSA13300
B12LOADING ARM(SP) ASSEMBL Y MK120VSA13299
B31AC HEAD ASSEMBL Y MK120VSA13275
B35T APE GUIDE ARM ASSEMBLY MK120VSA13277
B37CAPST AN MO T OR 288/VCCM012N9671CML
B52CAP BELT M K100VM411138
B73FE HEAD ASSEMBLY MK11 orN9742FEL
FE HEAD ASSEMBLY MK11 orN9743FEL
FE HEAD(MK11) MH-131SF11 orDHVEC01Z0005
FE HEAD(MK11) VTR-1X2ERS11-148 orDHVEC01TE004
FE HEAD(MK12) VTR-1X2ERS11-155 orDHVEC01TE005
FE HEAD(MK12) HVFHP0047ADHVEC01AL007
B74PRISM MK100VM202870
B86F BRAKE ASSEMBLY(HI) MK120VSA13447
B121WORM MK120VM414091
B126PULLEY MK120VM414330B
B133IDLER ASSEMBLY(HI) MK120VSA13451
B148TG CAP MK60VM407664C
B300C DRIVE LEVER(TU) MK120VM203773
B303F DOOR OPENER M K12 or0VM203751C
F DOOR OP ENER MK120VM203751
B313C DRIVE SPRING MK120VM414145
B347GUIDE HOLDER A MK100VM304920
B354SLIDER(TU) MK120VM101172F
B355SLIDER(SP) MK120VM101182
B359CLEANER LEVER MK100VM304413
B360CLEANER ROLLER MK90VM410032C
B361CL POST MK100VM411114
B410PINCH ARM(A) ASSEMBL Y(4) MK12 or0VSA13572
MMDZB12 MM0 0 3
MMDZB12 MM0 0 4
MMDZB12 SJ 00 8
MMDZB10 SJ 00 1
SCREW, SEMS
M2.6X4 PAN HEAD+
SCREW, SEMS
M3X4 PAN HEAD+
CPM39040
CPM33040
Ref.NoDescriptionPart No.
PINCH ARM(A) ASSEMBL Y(5) MK120VSA13788
B411PINCH SPRING MK120VM414644
B414M BRAKE(SP) ASSEMBLY(HI) MK120VSA13655
B416M BRAKE(TU) ASSEMBLY(HI) MK120VSA13449
B417TENSION SPG(3002654) MK120VM414221E
B425LOCK LEVER SPRING MK100VM411110
B482CASSETTE PLATE MK120VM203749
B483LOCK LEVER MK120VM414095
B487BAND BRAKE(SP) MK120VM305723
B488MODE LEVER(HI) MK120VM101175J
B491CAM GEAR(A)(HI) MK120VM101176
B492MODE GEAR(LM) MK120VM204236
B494C DOOR OPENER MK120VM305719
B499T LEVER HOLDER MK120VM305729
B501WORM HOLDER MK120VM203767
B507REEL WASHER MK9 5*2.1*0.50VM410058
B508S BRAKE SPRING(HI) MK120VM414899
B513P .S .W F 6* 2.55* 0.50VM402629A
B514SCREW RACK MK100VM411535
B516REEL WASHER MK9 5*2.1*0.50VM410058
B518P . S.W C UT 1.6X4 .0X0. 5T0VM408485A
B521REV BRAKE SPG(HI) MK120VM414943
B522TG POST ASSEMBLY MK100VSA11012
B525LDG BEL T MK110VM412804
B529CLEANER ASSEMBLY MK100VSA11161
B551FF ARM(HI) MK120VM306183
B553REV SPRING MK110VM412555
B555RACK ASSEMBL Y MK120VSA13289
B557MOTOR PULLEY U5 or0VM403205A
MOTOR PULLEY U50VM403205A
B558LOADING MOT O R MDB2B8 2 orMMDZB10 SJ001
LOADING MO T OR M DB2B80 orMMDZB12SJ008
LOADING MO T OR M 31E-1 R- 14 7376 orMMDZB12MM00 3
LOADING MOTOR M31E-1 R14 7391MMDZB12MM004
B559CLUTCH ASSEMBLY(HI) MK120VSA13450
B562C DRIVE LEVER(SP) MK120VM203772
B563SLIDER SHAFT MK120VM305762
B564M GEAR(HI) MK120VM305755
B565SENSOR GEAR(HI) MK120VM305756
B567PINCH ARM(B) MK120VM305718
B568BT ARM MK120VM305728
B571P . S.W C UT 1.6X4 .0X0. 5T0VM408485A
B572P . S.W C UT 1.6X4 .0X0. 5T0VM408485A
B573REEL S MK110VM203436
B574REEL T MK100VM202872C
B578TR GEAR A MK100VM304440
B579TR GEAR B MK120VM305900
B580TR GEAR C MK120VM305743A
B581CENTER GEAR MK110VM305081
B582TR GEAR SPRING MK100VM411187
B583CAM WASHER MK120VM414741
B584TR GEAR SHAFT MK100VM411186
B585PSW(317505) MK110VM413663
B587TENSION LEVER ASSEMBLY MK120VSA13279
B590BRAKE ARM(TU) MK120VM203752E
B591BAND BRAKE(TU) MK120VM305724C
B592TG POST MK100VM411108E
200304083-4-1H9510DPL
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.