Manufatured under license from Dolby Laboratories. "Dolby" and
the double-D symbol are trademarks of Dolby Laboratories.
"DTS" and "DTS Digital Out" are trademarks of Digital Theater Systems Inc.
SPECIFICATIONS
< VCR Section >
DescriptionUnitMinimumNominalMaximumRemark
1. Video
1-1. Video Output (PB)Vp-p0.81.01.2SP Mode
1-2. Video Output (R/P)Vp-p0.81.01.2
1-3. Video S/N Y (R/P)dB4045
1-4. Video Color S/N AM (R/P)dB3741SP Mode
1-5. Video Color S/N PM (R/P)dB3036SP Mode
1-6. Resolution (PB)Line230245SP Mode
2. Servo
2-1. Jitter Lowµsec0.070.12SP Mode
2-2. Wow & Flutter%0.30.5SP Mode
3. Normal Audio
3-1. Output (PB) dBV-9-6-3SP Mode
3-2. Output (R/P)dBV-9-6-1.5SP Mode
3-3. S/N (R/P)dB3641SP Mode
3-4. Distortion (R/P)%1.04.0SP Mode
3-5. Freq. resp (R/P) at 200HzdB-11-4SP Mode
(-20dB ref. 1kHz) at 8kHzdB-14-4SP Mode
SP Mode,
W/O Burst
4. Tuner
4-1. Video outputVp-p0.81.01.2E-E Mode
4-2. Video S/NdB3942E-E Mode
4-3. Audio outputdB-10-6-2E-E Mode
4-4. Audio S/NdB4046E-E Mode
5. Hi-Fi Audio
5-1. OutputdBV-12-8-4SP Mode
5-2. Dynamic RangedB7085SP Mode
5-3. Freq. resp (6dB B.W)Hz20 ~ 20K SP Mode
Note: Nominal specs represent the design specs. All units should be able to approximate these – some will exceed
and some may drop slightly below these specs. Limit specs represent the absolute worst condition that still might
be considered acceptable; In no case should a unit fail to meet limit specs.
1-1-1H9300SP
< DVD Section >
ITEMCONDITIONSUNITNOMINALLIMIT
1. Video Output75 ohm load Vpp1.0
2. Optical Digital OutdBm-18
3. Audio (PCM)
3-1. Output Level1kHz 0dBVrms2.0
3-2. S/NdB110
3-3. Freq. Response
DVDfs=48kHz 20~22kHzdB± 2
CDfs=44.1kHz 20~20 kHzdB± 2
3-4. THD+N1 kHz 0dB%0.005
NOTES:
1. All Items are measured without pre-emphasis unless otherwise specified.
2. Power supply : AC230 V 60 Hz
3. Load imp. : 100 K ohm
C
4. Room ambient : +25
°
1-1-2H9300SP
LASER BEAM SAFETY PRECAUTIONS
This DVD player uses a pickup that emits a laser beam.
Do not look directly at the laser beam coming
from the pickup or allow it to strike against
your skin.
The laser beam is emitted from the location shown in the figure. When checking the laser diode, be sure to keep
your eyes at least 30cm away from the pickup lens when the diode is turned on. Do not look directly at the laser
beam.
Caution: Use of controls and adjustments, or doing procedures other than those specified herein, may result in
hazardous radiation exposure.
Drive Mecha Assembly
Laser Beam Radiation
Laser Pickup
Turntable
CAUTION - VISIBLE LASER
RADIATION WHEN OPEN AND
INTERLOCK DEFEATED.
AVOID EXPOSURE TO BEAM.
Location: Inside Top of DVD mechanism.
1-2-1DVD_LASER
IMPORTANT SAFETY PRECAUTIONS
Product Safety Notice
Some electrical and mechanical parts have special
safety-related characteristics which are often not evident from visual inspection, nor can the protection
they give necessarily be obtained by replacing them
with components rated for higher voltage, wattage,
etc. Parts that have special safety characteristics are
identified by a ! on schematics and in parts lists. Use
of a substitute replacement that does not have the
same safety characteristics as the recommended
replacement part might create shock, fire, and/or other
hazards. The Product’s Safety is under review continuously and new instructions are issued whenever
appropriate. Prior to shipment from the factory, our
products are carefully inspected to confirm with the
recognized product safety and electrical codes of the
countries in which they are to be sold. However, in
order to maintain such compliance, it is equally important to implement the following precautions when a set
is being serviced.
Precautions during Servicing
A. Parts identified by the ! symbol are critical for
safety. Replace only with part number specified.
B. In addition to safety, other parts and assemblies
are specified for conformance with regulations
applying to spurious radiation. These must also be
replaced only with specified replacements.
Examples: RF converters, RF cables, noise blocking capacitors, and noise blocking filters, etc.
C. Use specified internal wiring. Note especially:
1)Wires covered with PVC tubing
2)Double insulated wires
3)High voltage leads
D. Use specified insulating materials for hazardous
live parts. Note especially:
1)Insulation tape
2)PVC tubing
3)Spacers
4)Insulators for transistors
E. When replacing AC primary side components
(transformers, power cord, etc.), wrap ends of
wires securely about the terminals before soldering.
F. Observe that the wires do not contact heat produc-
ing parts (heatsinks, oxide metal film resistors, fusible resistors, etc.).
G. Check that replaced wires do not contact sharp
edges or pointed parts.
H. When a power cord has been replaced, check that
5 - 6 kg of force in any direction will not loosen it.
I. Also check areas surrounding repaired locations.
J. Be careful that foreign objects (screws, solder
droplets, etc.) do not remain inside the set.
K. Crimp type wire connector
The power transformer uses crimp type connectors
which connect the power cord and the primary side
of the transformer. When replacing the transformer,
follow these steps carefully and precisely to prevent shock hazards.
Replacement procedure
1)Remove the old connector by cutting the wires at a
point close to the connector.
Important: Do not re-use a connector. (Discard it.)
2)Strip about 15 mm of the insulation from the ends
of the wires. If the wires are stranded, twist the
strands to avoid frayed conductors.
3)Align the lengths of the wires to be connected.
Insert the wires fully into the connector.
4)Use a crimping tool to crimp the metal sleeve at its
center. Be sure to crimp fully to the complete closure of the tool.
L. When connecting or disconnecting the internal con-
nectors, first, disconnect the AC plug from the AC
outlet.
1-3-1DVD_SFNP
Safety Check after Servicing
Examine the area surrounding the repaired location for
damage or deterioration. Observe that screws, parts,
and wires have been returned to their original positions. Afterwards, do the following tests and confirm
the specified values to verify compliance with safety
standards.
1. Clearance Distance
When replacing primary circuit components, confirm
specified clearance distance (d) and (d’) between soldered terminals, and between terminals and surrounding metallic parts. (See Fig. 1)
Table 1 : Ratings for selected area
AC Line VoltageClearance Distance (d) (d’)
Chassis or Secondary Conductor
Primary Circuit Terminals
dd'
230 V
Note: This table is unofficial and for reference only.
Be sure to confirm the precise values.
≥3mm(d)
≥6 mm(d’)
2. Leakage Current Test
Confirm the specified (or lower) leakage current
between B (earth ground, power cord plug prongs)
and externally exposed accessible parts (RF terminals, antenna terminals, video and audio input and
output terminals, microphone jacks, earphone jacks,
etc.) is lower than or equal to the specified value in the
table below.
Measuring Method (Power ON) :
Insert load Z between B (earth ground, power cord
plug prongs) and exposed accessible parts. Use an
AC voltmeter to measure across the terminals of load
Z. See Fig. 2 and the following table.
Table 2: Leakage current ratings for selected areas
AC Line VoltageLoad ZLeakage Current (i)
2kΩ RES.
Connected in
parallel
230 V
50kΩ RES.
Connected in
parallel
i≤0.7mA AC Peak
i≤2mA DC
i≤0.7mA AC Peak
i≤2mA DC
Exposed Accessible Part
Z
One side of
B
Power Cord Plug Prongs
One side of power cord plug
prongs (B) to:
Antenna terminals
A/V Input, Output
AC Voltmeter
(High Impedance)
RF or
Fig. 1
Fig. 2
Note: This table is unofficial and for reference only. Be sure to confirm the precise values.
1-3-2DVD_SFNP
STANDARD NOTES FOR SERVICING
Circuit Board Indications
a. The output pin of the 3 pin Regulator ICs is indi-
cated as shown.
Top View
Out
b. For other ICs, pin 1 and every fifth pin are indicated
as shown.
Input
In
Pin 1
c. The 1st pin of every male connector is indicated as
shown.
Pin 1
Bottom View
5
10
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:.
(1) Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
Fig. S-1-1
(2) Remove the flat pack-IC with tweezers while apply-
ing the hot air.
(3) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
(1) Release the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
Instructions for Connectors
1. When you connect or disconnect the FFC (Flexible
Foil Connector) cable, be sure to first disconnect
the AC cord.
2. FFC (Flexible Foil Connector) cable should be
inserted parallel into the connector, not at an angle.
FFC Cable
Connector
CBA
* Be careful to avoid a short circuit.
Caution:
1. Do not supply hot air to the chip parts around the
flat pack-IC for over 6 seconds because damage to
the chip parts may occur. Put masking tape around
the flat pack-IC to protect other parts from damage.
(Fig. S-1-2)
2. The flat pack-IC on the CBA is affixed with glue, so
be careful not to break or damage the foil of each
pin or the solder lands under the IC when removing
it.
Hot-air
Flat Pack-IC
Desoldering
CBA
Masking
Tape
Tweezers
Machine
Flat Pack-IC
Fig. S-1-2
1-4-1DVD_NOTE
With Soldering Iron:
(1) Using desoldering braid, remove the solder from all
pins of the flat pack-IC. When you use solder flux
which is applied to all pins of the flat pack-IC, you
can remove it easily. (Fig. S-1-3)
Flat Pack-IC
Desoldering Braid
(4) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
(5) Release the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
Note:
When using a soldering iron, care must be taken
to ensure that the flat pack-IC is not being held by
glue. When the flat pack-IC is removed from the
CBA, handle it gently because it may be damaged
if force is applied.
Soldering Iron
Fig. S-1-3
(2) Lift each lead of the flat pack-IC upward one by
one, using a sharp pin or wire to which solder will
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Sharp
Pin
Fine Tip
Soldering Iron
Fig. S-1-4
(3) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
(4) Release the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
With Iron Wire:
(1) Using desoldering braid, remove the solder from all
pins of the flat pack-IC. When you use solder flux
which is applied to all pins of the flat pack-IC, you
can remove it easily. (Fig. S-1-3)
(2) Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
(3) While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solder
melts so as to lift the IC leads from the CBA contact
pads as shown in Fig. S-1-5
To Solid
Mounting Point
CBA
Tweezers
Hot Air Blower
or
Iron Wire
Soldering Iron
Fig. S-1-5
Fine Tip
Soldering Iron
Flat Pack-IC
Fig. S-1-6
1-4-2DVD_NOTE
2. Installation
(1) Using desoldering braid, remove the solder from
the foil of each pin of the flat pack-IC on the CBA
so you can install a replacement flat pack-IC more
easily.
(2) The “I” mark on the flat pack-IC indicates pin 1.
(See Fig. S-1-7.) Be sure this mark matches the 1
on the PCB when positioning for installation. Then
presolder the four corners of the flat pack-IC. (See
Fig. S-1-8.)
(3) Solder all pins of the flat pack-IC. Be sure that none
of the pins have solder bridges.
Example :
Pin 1 of the Flat Pack-IC
is indicated by a " " mark.
Fig. S-1-7
Instructions for Handling
Semi-conductors
Electrostatic breakdown of the semi-conductors may
occur due to a potential difference caused by electrostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a grounding band (1MΩ) that is properly grounded to remove any static electricity that may
be charged on the body.
2. Ground for Workbench
(4) Be sure to place a conductive sheet or copper plate
with proper grounding (1MΩ) on the workbench or
other surface, where the semi-conductors are to be
placed. Because the static electricity charge on
clothing will not escape through the body grounding band, be careful to avoid contacting semi-conductors with your clothing.
< Incorrect >
CBA
Presolder
Flat Pack-IC
Fig. S-1-8
CBA
< Correct >
Grounding Band
1MΩ
CBA
1MΩ
Conductive Sheet or
Copper Plate
1-4-3DVD_NOTE
PREPARATION FOR SERVICING
How to Enter the Service Mode
About Optical Sensors
Caution:
An optical sensor system is used for the Tape Start
and End Sensors on this equipment. Carefully read
and follow the instructions below. Otherwise the unit
may operate erratically.
What to do for preparation
Insert a tape into the Deck Mechanism Assembly and
press the PLAY button. The tape will be loaded into
the Deck Mechanism Assembly. Make sure the power
is on, TP501 (SENSOR INHIBITION) to GND. This will
stop the function of Tape Start Sensor, Tape End Sensor and Reel Sensors. (If these TPs are connected
before plugging in the unit, the function of the sensors
will stay valid.) See Fig. 1.
Note: Because the Tape End Sensors are inactive, do
not run a tape all the way to the start or the end of the
tape to avoid tape damage.
About REC-Safety Switch
Caution:
The REC-Safety Switch is directly mounted on the
Main CBA. When the Deck Mechanism Assembly is
removed from the Main CBA for servicing, this switch
does not work automatically.
What to do for preparation
In order to record, press the Rec button while pushing
REC-SAFETY SW on the Main CBA. See Fig. 1.
Q503
TP501
S-INH
Q504
SW506
(REC-SAFETY SW)
Fig. 1
1-5-1H9300PFS
CABINET DISASSEMBLY INSTRUCTIONS
1. Disassembly Flowchart
This flowchart indicates the disassembly steps to gain
access to item(s) to be serviced. When reassembling,
follow the steps in reverse order. Bend, route, and
dress the cables as they were originally.
[1] Top Cover
[17] Insulator
[13] Power
Supply CBA
[12] AFV CBA
[10] Main CBA
[11] Function
CBA
[2] Front
Assembly
[3] Top Bracket
[5] DVD Mecha
Assembly
[7] Rear Panel
[8] VCR Chasis
Unit
[4] Jack CBA
[16] Side
Bracket
[6] DVD Main
CBA Unit
[15] Deck
Pedestal-2
[9] Deck
Assembly
[14] Deck
Pedestal-1
2. Disassembly Method
ID/
LOC.
No.
[1]Top CoverD18(S-1)-
[2]
[3]
[4]Jack CBAD33(S-3)-
[5]
PART
Front
Assembly
Top
Bracket
DVD
Mecha
Assembly
Fig.
No.
D2
D24(S-2)-
D4
REMOVAL
REMOVE/*UNHOOK/
UNLOCK/RELEASE/
UNPLUG/DESOLDER
*CN505, *2(L-1), Tray
Panel, *7(L-2)
3(S-4), *CN501,
*CN701
Note
1-1
1-2
1-3
1-4
1-5
1-6
1-7
1-8
-
ID/
LOC.
No.
[6]
[7]
[8]
[9]
[10]Main CBAD8-----------
[11]
[12]AFV CBAD8Desolder-
[13]
[14]
[15]
[16]
[17]InsulatorD9-----------
↓
(1)
Note:
(1): Identification (location) No. of parts in the figures
(2): Name of the part
(3): Figure Number for reference
(4): Identification of parts to be removed, unhooked,
(5): Refer to “Reference Notes.”
PART
DVD Main
CBA Unit
Rear
Panel
VCR
Chassis
Unit
Deck
Assembly
Function
CBA
Power
Supply
CBA
Deck
Pedestal-1
Deck
Pedestal-2
Side
Bracket
↓
(2)
unlocked, released, unplugged, unclamped, or
desoldered.
P=Spring, L=Locking Tab, S=Screw,
CN=Connector, W=Washer
*=Unhook, Unlock, Release, Unplug, or Desolder
e.g. 2(S-2) = two Screws (S-2),
2(L-2) = two Locking Tabs (L-2)
Fig.
No.
D5
D63(S-6), 3(S-7)-
D7
D8Desolder, 2(S-10)4,5
D8Desolder, *CN2002-
D9
D96(S-12), 3(W-1)-
D9(S-13)-
D9(S-14)-
↓
(3)
REMOVAL
REMOVE/*UNHOOK/
UNLOCK/RELEASE/
UNPLUG/DESOLDER
3(S-5), *CN101,
*CN401
*CN001, *CN002,
5(S-8), 5(S-9)
3(S-11), Bracket,
*(L-3)
↓
(4)
Note
2
2-1
2-2
2-3
3
-
-
↓
(5)
1-6-1H9300DC
Reference Notes
CAUTION 1: Locking Tabs (L-1) and (L-2) are fragile.
Be careful not to break them.
1-1. Connect the wall plug to an AC outlet and press
the OPEN/CLOSE button to open the Tray.
1-2. Remove the Tray Panel by releasing two Locking
Tabs (L-1).
1-3. Press the OPEN/CLOSE button again to close
the Tray.
1-4. Press the POWER button to turn the power off.
1-5. Unplug an AC cord.
1-6. Disconnect connector CN505.
1-7. Remove Screw (S-1A).
1-8. Release seven Locking Tabs (L-2) (to do this,
first release five Locking Tabs (A) at the side and
top, and then release two Locking Tabs (B) at the
bottom.)
CAUTION 2: Electrostatic breakdown of the laser
diode in the optical system block may occur as a
potential difference caused by electrostatic charge
accumulated on cloth, human body etc., during
unpacking or repair work.
To avoid damage of pickup follow next procedures.
2-1. Slide the pickup unit as shown in Fig. D5.
2-2. Short the three short lands of FPC cable with sol-
der before removing the FFC cable (CN101) from
it. If you disconnect the FFC cable (CN101), the
laser diode of pickup will be destroyed. (Fig. D5)
2-3. Disconnect Connector (CN401). Remove three
Screws (S-5) and lift the DVD Main CBA Unit.
(Fig. D5)
CAUTION 3: When reassembling, confirm the FFC
cable (CN101) is connected completely. Then remove
the solder from the three short lands of FPC cable.
(Fig. D5)
4. When reassembling, solder wire jumpers as shown
in Fig. D8.
5. Before installing the Deck Assembly, be sure to
place the pin of LD-SW on Main CBA as shown in
Fig. D8. Then, install the Deck Assembly while
aligning the hole of Cam Gear with the pin of LDSW, the shaft of Cam Gear with the hole of LD-SW
as shown in Fig. D8.
[1] Top Cover
(S-1)
(S-1)
Tray Panel
(L-1)
(A)
(L-2)
(B)
[2] Front Assembly
(S-2)
(L-2)
(A)
(S-2)
(L-2)
(S-1)
[3] Top Bracket
(A)
[4] Jack CBA
(S-1)
Fig. D1
(S-2)
CN505
Fig. D2
(S-3)
Fig. D3
1-6-2H9300DC
CN501
(S-4)
CN701
(S-4)
[5] DVD Mecha
Assembly
Fig. D4
[7] Rear Panel
(S-7)
(S-6)
(S-6)
(S-7)
Fig. D6
(S-5)
CN101
(S-5)
CN401
A
DVD Mecha
Assembly
B
Short the three short lands by soldering
View for A
(S-5)
[6] DVD Main
CBA Unit
(S-8)
(S-9)
[8] VCR Chassis
Unit
CN001
(S-8)
(S-9)
(S-8)
CN002
Fig. D7
Slide
Pickup Unit
View for B
OR
Short the three short
lands by soldering
C
View for C
Fig. D5
1-6-3H9300DC
[9] Deck
Assembly
FE Head
CN2002
Cylinder Assembly
AC Head
Assembly
[12] AFV CBA
Pin
SW507
LD-SW
[10] Main CBA
[9] Deck Assembly
Cam Gear
Desolder
[11] Function CBA
(S-10)
[10] Main CBA
From
AC Head
Assembly
Lead with
blue stripe
Desolder
from bottom
Desolder
From
Cylinder
Assembly
Desolder
LD-SW
Desolder
Lead with
blue stripe
Shaft
Hole
Hole
Pin
[10] Main CBA
From
FE Head
From
Capstan
Motor
Assembly
Desolder
BOTTOM VIEW
Lead connections of Deck Assembly and Main CBA
Fig. D8
1-6-4H9300DC
(S-11)
[13] Power Supply CBA
Bracket
(S-11)
(S-12)
[15] Deck Pedestal-2
[16] Side Bracket
(S-13)
(L-3)
[17] Insulator
(S-14)
HOW TO MANUAL EJECT
1. Remove the Top Case.
2. Make a tool from a paper clip, etc., (length = approximately 50 mm, maximum diameter = approximately 3
mm) as shown below.
3. Insert the tool into the manual eject hole on the DVD
Mecha. Then, push it until the tray is ejected.
(W-1)
(W-1)
(W-1)
[14] Deck Pedestal-1
Fig. D9
Top Cover
Tray
1
DVD Mecha
4
Eject Hole
Paper clip (Available Locally)
2
3
Straightened
portion = approximately 35mm
Deck Assembly
Length = approximately 50mm
1-6-5H9300DC
ELECTRICAL ADJUSTMENT INSTRUCTIONS
General Note: "CBA" is an abbreviation for
"Circuit Board Assembly."
NOTE:
1.Electrical adjustments are required after replacing
circuit components and certain mechanical parts.
It is important to do these adjustments only after
all repairs and replacements have been completed. Also, do not attempt these adjustments
unless the proper equipment is available.
2.To perform these alignment / confirmation procedures, make sure that the tracking control is set in
the center position: Press either "L5??" or "K" button
on the remote control unit first, then the "PLAY"
button (Front Panel only).
Test Equipment Required
1.Oscilloscope: Dual-trace with 10:1 probe,
V-Range: 0.001~50V/Div.,
F-Range: DC~AC-20MHz
2.Alignment Tape (FL6A)
Head Switching Position Adjustment
Purpose:
To determine the Head Switching point during
playback.
Symptom of Misadjustment:
May cause Head Switching noise or vertical jitter
in the picture.
Test pointAdj.PointModeInput
TP751(V-OUT)
TP504(RF-SW)
GND
Tape
FL6AOscilloscope
Connections of Measurement Equipment
Main CBA
VR501
(Switching Point)
(MAIN CBA)
Measurement
Equipment
TP751
GND
TP502
PLAY
(SP)
6.5H±1H
(412.7µs±60µs)
Oscilloscope
-----
Spec.
CH1 CH2
Trig. (+)
Figure 1
EXT. Syncronize Trigger Point
V-Sync
CH1
CH2
Reference Notes:
Playback the Alignment tape and adjust VR501 so that
the V-sync front edge of the CH1 video output waveform is at the 6.5H(412.7µs) delayed position from the
rising edge of the CH2 head switching pulse waveform.
1.0H
6.5H
Switching Pulse
0.5H
1-7-1H9300EA
FIRMWARE RENEWAL MODE
1. Turn the power on and remove the disc on the tray.
2. To put the DVD player into version up mode, press
[9], [8], [7], [6], and [SEARCH MODE] buttons on
the remote control unit in that order. The tray will
open automatically.
Fig. a appears on the screen and Fig. b appears on
the VFD.
BE F/W VERSION UP MODE
PLEASE INSERT A DISC
FOR BE F/W VERSION UP.
POWER
EXIT:
Fig. d VFD in Programming Mode (Example)
The appearance shown in (*2) of Fig. c is
described as follows:
AppearanceNo.State
Reading...Sending files into the memory
1
Erasing...Erasing previous version data
2
Programming...
3Writing new version data
5. After programming is finished, the tray opens automatically. Fig. e appears on the screen and the
checksum in (*3) of Fig. e appears on the VFD.
(Fig. f)
Fig. a Version Up Mode Screen
Fig. b VFD in Version Up Mode
The DVD player can also enter the version up
mode with the tray open. In this case, Fig. a will be
shown on the screen while the tray is open.
3. Load the disc for version up. (For closing the tray,
only the "OPEN/CLOSE" button is available.)
4. The DVD player enters the F/W version up mode
automatically. Fig. c appears on the screen and
Fig. d appears on the VFD.
BE F/W VERSION UP MODE
VERSION: ********
Reading...(*2)
BE F/W VERSION UP MODE
VERSION: ********
COMPLETED SUM:7abc(*3)
Fig. e Completed Program Mode Screen
Fig. f VFD upon Finishing the Programing Mode (Example)
At this time, no buttons are available.
6. For tray opening, plug the AC cord into the AC outlet.
7. Turn the power on by pressing the power button
and the tray will close.
Fig. c Programming Mode Screen
1-8-1H9300ROM
Servo/System Control Block Diagram
NOTE FOR WIRE CONNECTORS:
1. PREFIX SYMBOL "CN" MEANS CONNECTOR.
(CAN DISCONNECT AND RECONNECT.)
2. PREFIX SYMBOL "CL" MEANS WIRE-SOLDER
HOLES OF THE PCB.
(WIRE IS SOLDERED DIRECTLY.)
MAIN CBA
BLOCK DIAGRAMS <VCR Section>
IC501
(SERVO/SYSTEM CONTROL)
KEY- 2
POWER LED
CAS LED
TIMER LED
23
24
25
8
Q507
Q501
Q502
CN505
22KEY-2
66
POWER-LED
44CAS-LED
55TIMER-LED
CN651
FRONT JACK CBA
KEY SWITCH
D651
POWER
AL+5V
(DECK ASSEMBLY)
AC HEAD ASSEMBLY
CONTROL
HEAD
Q504
SENSOR CBA
Q503
END-S
SENSOR CBA
ST-S
CL287
55CTL(+)
66CTL(-)
CL504
SW507
LD-SW
TP502
END-S
AL+5V
Q506
T-REEL
PS502
D555
S-LED
S-REEL
AL+5V
TIMER+5V
TO DVD SYSTEM
CONTROL BLOCK
<DVD SECTION>
AL+5V
VR501
SW-POINT
Q515
RESET
REMOTE1
Q510
TP503
CTL
RESET
34
REMOCON-IN
14
LD-SW
9
95
CTL(+)
CTL(-)
94
10
ST-S
4
END-S
T-REEL
80
S-REEL79
CTL97
FF/REW-L84
PG-DELAY
2
KEY- 1
REC LED
DVD LED
VCR LED
A-MUTE-H
7
26
29
30
83
KEY
SWITCH
TP501
SENS-INH
Q511D508
Q508
Q509
D506
D507
REC
DVD
VCR
AL+5V
D653
D652
D654
IC502 (MEMORY)
SDA
5
SCL
6
IIC-BUS SDA
IIC-BUS SCL
A-MUTE-H
CAS
TIMER
STAND-BY
TO
AUDIO BLOCK
CYLINDER ASSEMBLYCAPSTAN MOTOR
PG
DRUM
MOTOR
SENSOR
M
LOADING
MOTOR
M
CAPSTAN
MOTOR
M
1-9-11-9-2H9300BLS
CL502
12 C-F/R
11
AL+15V/+12V
10 AL+12V(1)
P-ON+5V
9
GND
8
C-FG
7
C-CONT
6
GND
5
D-FG
4
LM-FWD/REV
3
D-CONT
2
D-PG
1
TO
POWER
SUPPLY
BLOCK
AL+5V
SW506
REC-SAFETY
AL+15V/+12V
AL+12V(1)
P-ON+5V
C-POW-SW
P-ON-H
P-DOWN-L
REC-SAF-SW
31
C-F/R
78
C-FG
87
C-CONT
76
D-FG
89
LM-FWD/REV
81
D-CONT77
D-PG
90
OUTPUT SELECT
C-POW-SW
66
P-ON-H
67
86 P-DOWN-L
Hi-Fi-H-SW
A-MODE
IIC-BUS SDA
IIC-BUS SCL
D-REC-H
RF-SW
C-ROTA
D-V SYNC
H-A-SW
H-A-COMP
V-ENV
19
61
72
71
65
18
15
13
16
17
74
IIC-BUS SDA
IIC-BUS SCL
Hi-Fi-H-SW
A-MODE
OUTPUT SELECT
IIC-BUS SDA
IIC-BUS SCL
D-REC-H
RF-SW
C-ROTA
D-V SYNC
H-A-SW
H-A-COMP
6
OUTPUT SELECT
V-ENV
TO
Hi-Fi AUDIO
BLOCK
TO
VIDEO BLOCK
Video Block Diagram
TU701
TU-VIDEO
FRONT JACK CBA
CN651CN505
JK653
V-IN-F
VIDEO BLOCK
JK101
V-OUT1
V-IN1
V-OUT2
V-IN2
19
20
JK102
19
20
VIDEO
V-IN-F77
DVD-VIDEOFROM DVD
Q104
BUFFER
Q103
BUFFER
24
REC-VIDEO SIGNAL
MODE: SP/RECPB-VIDEO SIGNAL DVD VIDEO SIGNAL
MAIN CBA
IIC-BUS SCL
IIC-BUS SDA
IC501 (OSD)
Q301
BUFFER
52
OSD
CHARACTER
MIX
50
6
IC301
(Y/C SIGNAL PROCESS)
65
6968
4643
SERIAL
DECORDER
TO SERVO/SYSTEM
CONTROL BLOCK
Y. DELAY
JK101
FROM DVD VIDEO BLOCK
<DVD SECTION>
DVD-R
DVD-G
DVD-B
15
11
R
G
B
7
7978
(DECK ASSEMBLY)
CYLINDER ASSEMBLY
CL251
WF1
TP751
V-OUT
IC751 (SW)
4
DVD
VCR
48
50
52
54
56
TUNER
PB/EE
TUNER
IN1
PB/EE
MUTE
IN1
IN2
FRT
FRT
MUTE
IN2
BYPASS
AGC
CHARA.
INS.
FBC
R
LUMINANCE
SIGNAL
PROCESS
P
SP
SP
HEAD
AMP
EP
EP
HEAD
AMP
D-REC-H
RF-SW/C-ROTA
D-V-SYNC
H-A-SW
1/2
CCD 1H DELAY
CHROMINANCE
SIGNAL
PROCESS
Y
+
C
RP RP
REC FM
AGC
H-A-COMP
PR
V-ENV
96
95
94
93
90
89
88
87
80
70
62
71
83
84
V-COM
V(L)-1
V(L)-2
V-COM
V(R)-2
WF2
TP504
RF-SW
D-REC-H
RF-SW
C-ROTA
D-V-SYNC
H-A-SW
H-A-COMP
V-ENV
Y/C
V(R)-1
61
63
3
AGCVXO
5859
MIX
2928
21
5
1
2
3
4
5
6
TO SERVO/SYSTEM
CONTROL BLOCK
VIDEO (R)-1
HEAD
VIDEO (L)-1
HEAD
VIDEO (L)-2
HEAD
VIDEO (R)-2
HEAD
SW CTL
11109
TP301
C-PB
WF3
Q752
OUTPUT SELECT
X301
4.43MHz
TO SERVO/SYSTEM
CONTROL BLOCK
1-9-31-9-4H9300BLV
Audio Block Diagram
PB-AUDIO SIGNALREC-AUDIO SIGNALMode : SP/REC
MAIN CBA
TO Hi-Fi
AUDIO BLOCK
(DECK ASSEMBLY)
ACE HEAD ASSEMBLY
AUDIO
HEAD
AUDIO
ERASE
HEAD
N-A-PB
N-A-REC
CL287
A-PB/REC 4
A-COM 3
AE-H 1
FE-H 2
CL504
4 A-PB/REC
3 A-COM
1 AE-H
2 FE-H
Q404
Q403
BIAS
OSC
+5V
Q406
IC301
(AUDIO SIGNAL PROCESS)151317
IN1
R
P
REC
AMP
5
6
1
2
PB-ON
EQ
AMP
SP/LP-ON
AUTO
BIAS
TUNERIN2
INV
98
7
3
100
ATT
ALC
DET
ALC
LINE
AMP
REC-ON
MUTE
12
11
FULL
ERASE
HEAD
FE HEAD
SERIAL
DECODER
68 69
71
A-MUTE-H
IIC-BUS-SDA
IIC-BUS-SCL
TO SERVO/SYSTEM
CONTROL BLOCK
CL501
2 FE-H
1 FE-H-GND
Q401 (PB=ON)
Q405
Q402
(PB=ON)
SWITCHING
D-REC-OFF
+5V
AUDIO HD-SW
CONTROL
16
1-9-51-9-6H9300BLA
Hi-Fi Audio Block Diagram
JK101
A-IN1(R)
A-IN1(L)
A-OUT1(R)
A-OUT1(L)
A-IN2(R)
A-IN2(L)
A-OUT2(R)
A-OUT2(L)
REAR
JK652
A-IN(L)-F
JK651
A-IN(R)-F
1
3
2
6
JK102
2
6
1
3
JK751
A-OUT(R)
A-OUT(L)
CN651
FRONT JACK CBA
TU701
AUDIO
2
REC-AUDIO SIGNALPB-AUDIO SIGNALMode : SP/REC
IC751 (SW)
MAIN CBA
14
Q101
BUFFER
Q102
BUFFER
IC451 (MTS/ SAP/ Hi-Fi AUDIO PROCESS/ Hi-Fi HEAD AMP)
76
75
SW
SW
ALC
ALC
D.C.
D.C.
CN505
A-IN(L)-F99
A-IN(R)-F 1010
69
73
71
51
65
67
7
11
9
53
R-CH
INSEL
L-CH
INSEL
48
13
R-CH
PNR
47
14
SW
NOISE
P
R
LIMDEV
15
COMP
VCO
OUTPUT
SELECT
HOLD
PULSE
NOISE
DET
SW CTL
R-CH
BPF
LPF
MIX
VCR
DVD
VCR
DVD
11109
12
13
2
1
Q752
OUTPUT SELECT
COMP
DVD-A(R)
DVD-A(L)
SERIAL
DATA
DECODER
DO
DET
MUTE-ON
MUTE-ON
TO SYSTEM
CONTROL
BLOCK
TO DVD AUDIO
BLOCK
<DVD SECTION>
ENV
DET
38
39
23
1
80
78
77
40
79
26
DVD AUDIO SIGNAL
IIC-BUS SDA
IIC-BUS SCL
Q451
A-MODE
TO
SERVO/ SYSTEM
CONTROL BLOCK
Hi-Fi-H-SW
SIF
22
CN701
SIF
TO AUDIO BLOCK
CN1
22
AFV CBA
IF SINAL
PROCESS
1-9-71-9-8
CN1
4
5
N-A-REC
N-A-PB
TU-AUDIO(R)
TU-AUDIO(L)
CN701
4
5
LIMDEV
NOR
SW
6
4
L-CH
PNR
R
P
SW
NOISE
VCO
COMP
LPF
L-CH
BPF
LIM
3130
R
L
24
27
CL251
Hi-Fi-A(R) 7
Hi-Fi-COM 8
Hi-Fi-A(L) 9
CYLINDER
ASSEMBLY
Hi-Fi
AUDIO
(R) HEAD
Hi-Fi
AUDIO
(L) HEAD
H9300BLH
Power Supply Block Diagram
NOTE :
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
CAUTION
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,
REPLACE ONLY WITH THE SAME TYPE T1.6AL/250V FUSE.
CAUTION !
Fixed voltage (or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
1. PREFIX SYMBOL "CN" MEANS CONNECTOR.
(CAN DISCONNECT AND RECONNECT.)
2. PREFIX SYMBOL "CL" MEANS WIRE-SOLDER
HOLES OF THE PCB.
(WIRE IS SOLDERED DIRECTLY.)
IC301
(FRONT END PROCESSOR)
FROM/TO
RF SIGNAL
PROCESS
/SERVO
BLOCK
DIAGRAM
FROM/TO
DVD SIGNAL
PROCESS
BLOCK
DIAGRAM
TFWD
TREV
TIN
TOUT
SCK
STDIO
SEN
MUTE
PS
CD/DVD
CFE
CAS
STANDBY
ADDRESS BUS
DATA BUS
NINT1
NINT2
WAIT
/RE
/WEL
CS1
RESET
TFWD
42
41
TREV
TIN
59
60
TOUT
SCK
70
STDIO
72
SEN
10
46 MUTE
47 PS
CD/DVD
71
CFE
62
CAS
63
STANDBY
64
13
~
16
26
CPUADR0
~
33
CPUADR17
35
40
CPUDT0
84
~~~
~
91
CPUDT7
76
NINT1
77
NINT2
WAIT
1
/RE
2
/WEL
3
CS1
6
RESET
11
KEY OUT
HANG
READY
/FERS
OSCI
OSCO2324
SDA
SDA
SCL
KEY IN
FG-IN
BLOCK DIAGRAMS < DVD Section >
IC601
(DVD HOST PROCESSOR)
TFWD
200
TREV
201
187
TIN
TOUT
188
+3.3V
IC605
RESET
+3.3V
124
208
186
120
20
21
127
READY
/FERS
CLOCK
SDA
SCL
IRQ2
RESET
54
48
49
82
X301
(16.9344MHz)
5322BUSCLRBUSCLR
52
51
50
79SCL
44
45
IC102 (OP AMP)
1480
Q701
IC606
(INVERTER)
24
X60127MHz
12
VFD-DOUT
VFD-CLK
REMOTE
CN501CN2001CN2002CN1001
3VFD-STB
1VFD-DIN
2
204
125
FP-STB21
21
FP-DIN22
22
FP-DOUT 23
23
FP-CLK24
24
REMOTE2 26
26
FP-STB2
2
FP-DIN5
5
FP-DOUT 1
1
FP-CLK3
3
KEY
MATRIX
IC2001
(FRONT PANEL CONTROL)
a/KEY-1
2
FP-STB
28
FP-DIN
27
FP-DOUT
1
FP-CLK
REMOTE1
8
REMOTE2 10
10
K16
6
K25
5
KEY-13
3
KEY-22
2
KEY-41
1
b/KEY-2
c/KEY-3
d/KEY-4
RM2001
REMOTE
SENSOR
CL2004CL2003
8
1G
7G
K2
K1
FL2001
23
~
~
17
7
8
9
10
11
e
f
12
g
13
h
14
i
16
4
3
GRID
FIP
SEGMENT
FG
SENSOR
FG CBA
RELAY
CBA
CN401
FG-IN10
1-9-11
TO SERVO/SYSTEM
CONTROL BLOCK
<VCR SECTION>
DVD MAIN CBA UNITFUNCTION CBAMAIN CBA
REMOTE1
1-9-12
H9300BLSD
RF Signal Process/Servo Block Diagram
PICK-UP UNIT
DETECTOR
A 6
B 9
C 10
D 7
F 4
E 5
CD/DVD 21
CD-LD 20
DVD-LD 12
PD-MONI 11
GND(DVD-PD) 14
GND(LD) 13
GND(CD-PD) 19
CN101
CN101
IC103
(SW)
AMP
Q102
1 3
AMP
Q101
DATA(VIDEO/AUDIO) SIGNALFOCUS SERVO SIGNALTRACKING SERVO SIGNAL
IC101 (RF SIGNAL PROCESS)
HOLD
47
57
58
59
60
62
63
4
2
3
1
6
INPUT
MATRIX
TRACKING
BALANCE
FOCUS
BALANCE
LPC
AMP
VGA
EQ
TRACKING
ERROR DET
FOCUS
ERROR DET
VEL
ADJ
BDO DET
OFTR DET
MIRROR DET
SERIAL
I/F
41
46
31
30
40
39
18
6
22
7
20
11
13
14
12
SLIDE SERVO SIGNALDISK SERVO SIGNAL
DVD MAIN CBA UNIT
TESTSG
ARF
NARF
STANDBY
SCK
STDIO
SEN
CD/DVD
FROM/TO DVD
SIGNAL PROCESS
BLOCK DIAGRAM
LOADING
MOTOR
SPINDLE
MOTOR
SLIDE
MOTOR
FSTS
CN101
FS(+) 17
FS(-) 16
TS(+) 15
TS(-) 18
RELAY CBA
M
M
M
TRAY
-IN
TRAY-OUT
TRAY-IN 3
TRAY-OUT 4
CN401
LM(+) 1
LM(-) 2
SP(-) 6
SP(+) 7
SL(+) 9
SL(-) 8
GND 5
4
+3.3V
IC401
(SERVO DRIVE)
126
11
14
13
10
9
18
17
15
16
FOCUS
MOTOR DRIVE
TRACKING
MOTOR DRIVE
MUTE
LOADING
MOTOR DRIVE
SPINDLE
MOTOR DRIVE
SLIDE
MOTOR DRIVE
+
-
+
-
POWER
SAVE
21
24
23
22
27
26
25
5
1
2
V-REF
4
IC201 (SERVO DSP)
DAC1
115
DAC0
114
68
SPDRV
67
TRSDRV
FBAL
TBAL
OFTR
BDO
AD1
AD0
TRCRS
AD2
AD3
66
65
51
52
118
117
90108
119
120
IC102
(OP AMP)
5
3
7
1
MUTE
TFWD
FROM/TO DVD
SYSTEM CONTROL
BLOCK DIAGRAM
CFE
CAS
TREV
TIN
PS
TOUT
SW CBA
1-9-14
H9300BLRF1-9-13
DVD Signal Process Block Diagram
DATA(VIDEO/AUDIO) SIGNAL
FROM/TO RF SIGNAL
PROCESS/SERVO
BLOCK DIAGRAM
FROM/TO
DVD SYSTEM
CONTROL
BLOCK
DIAGRAM
ARF
NARF
TESTSG
ADDRESS BUS
DATA BUS
NINT1
NINT2
WAIT
/RE
/WEL
CS1
RESET
IC201 (DVD SIGNAL PROCESS)
111
110
82
30
~
CPUADR0
22
~
17
CPUADR17
9
CPUDT0
44
~~
~
37
CPUDT7
2
NINT1
5
NINT2
WAIT
6
/RE
36
/WEL
35
CS1
34
RESET
47
PLL
VCO
DATA
SLICER
BCA
DVD
DEMODULATOR
CPU
INTERFACE
MEMORY
MANAGER
VIDEO/AUDIO
INTERFACE
PARA0
PARA1
PARA2
PARA3
PARA4
PARA5
PARA6
PARA7
172
168
166
164
160
158
151
149
PARA0-PARA7
DVD MAIN CBA UNIT
TO DVD VIDEO
BLOCK DIAGRAM
X201
(16.9344MHz)
79
80
OSCI1
OSCO1
1-9-16
H9300BLD1-9-15
DVD Video Block Diagram
DATA(VIDEO) SIGNALVIDEO SIGNALDATA(AUDIO) SIGNAL
FROM DVD
SIGNAL PROCESS
BLOCK DIAGRAM
TO DVD AUDIO
BLOCK DIAGRAM
IC602
(8Mbit FLASH MEMORY)
A0
~
A18
DQ0
~
DQ15
WE
CE
OE
PARA0-PARA7
25
~
16
ADDR1-ADDR20
8
~
1
48
29
~
45
11
26
28
A-MUTE
ADAC-MD
ADAC-MC
ADAC-ML
DATA0-DATA15
13
191
190
189
192
161
170
173
182
141
158
128
132
117
IC601 (DVD HOST PROCESSOR)
PARA0
6
~
PARA7
A-MUTE
ADAC-MD
ADAC-MC
ADAC-ML
~
INTERNAL
PERIPHERALS
PORTS
~
ADDR1
~
ADDR20
~
DATA0
~
DATA15
DQM0
CS3
OE
~
PROGRAMMABLE
CPU INTERFACE
SHARED SDRAM INTERFACE
~
AD0
AD13
58 63~66 73~74
I/F
VIDEO
DECODER
~
DQ0
DQ15
97
~84 93~
DATA(VIDEO/AUDIO) SIGNAL
DQML
DQMU
CACHE
SUBSYSTEM
WE
CPU
CENTRAL
COMMAND
PORT
ST20 ARBITER &
MEMORY CONTROLLER
CD FIFO
SDRAM ARBITER
VIDEO
FILTERING
RAS
CAS
79 80 78
7677
102
FRONT-END
& LINK
INTERFACE
SDRAM
BLOCK
MOVE
OSD, SP
DECODER
& MIXING
CS
AUDIO
DECODER
DENC
51
52
55
56
57
32
33
34
25
27
26
PCM-BCK
PCM-DATA0
PCM-SCLK
PCM-LRCLK
SPDIF
CN701
88DVD-VIDEO-Y
1212DVD-VIDEO-C
CN701
1010
DVD-VIDEO-CVBS
66DVD-VIDEO-B
44DVD-VIDEO-R
22DVD-VIDEO-G
TO DVD
AUDIO
BLOCK
DIAGRAM
CN1601
CN1601
WF3
IC1402 (VIDEO DRIVER)
WF1
4dB
627
AMP
2
4dB
14
16
AMP
4dB
AMP
4dB
AMP
4dB
AMP
WF2
2dB
AMP
2dB
AMP
2dB
AMP
2dB
AMP
2dB
AMP
DRIVER
LPF
LPFDRIVER
LPFDRIVER4
LPFDRIVER
LPFDRIVER
33
30
21
18
JK1401
S-VIDEO
OUT
YC
34
JK1404
DVD-VIDEO
DVD-B
DVD-R
21
TO VIDEO
BLOCK
<VCR SECTION>
20 26~213~29 35~42 53~
~
AD0
AD13
~
DQ0
IC604
(64Mbit SDRAM)
17 1839 16
DQ15
4dB
12
AMP
15
RAS
CAS
19
CS
WE
LDQM
UDQM
DVD MAIN CBA UNIT
2dB
LPFDRIVER
AMP
MAIN CBA
24
1-9-18
DVD-G
H9300BLVD1-9-17
DVD Audio Block Diagram
AUDIO SIGNALDATA(AUDIO) SIGNAL
IC1204
FIBER OPTIC
TRANS MODULE
3
WF6
FROM
DVD VIDEO
BLOCK
DIAGRAM
SPDIF
PCM-BCK
PCM-DATA0
PCM-LRCLK
ADAC-MD
ADAC-MC
ADAC-ML
IC801 (AUDIO DAC)
1
2
3
13
14
15
SERIAL
PORT
SERIAL
CONTROL
4X/8X
OVERSAMPLING
DIGITAL FILTER
/FUNCTION
CONTROLLER
ENPHANCED
MULTI-LEVEL
DELTA-SIGMA
MODULATOR
ZERO DETECT
SYSTEM CLOCK
16
DACLPF+AMP
DAC
LPF+AMP
L-CH
R-CH
12
11
CN701
2121SPDIF
CN701
7
8
1616
DVD-AUDIO-L
1818
DVD-AUDIO-R
1515
DVD-A-L-MUTE
1717
DVD-A-R-MUTE
1919
DVD-A-MUTE
CN1601
WF4
CN1601
WF5
VREF
Q1204
+3.3V
Q1203
IC1201
3
2
6
5
Q1351
BUFFER
(AMP)
Q1202
1
7
Q1201
JK1202
DVD-A(L)
DVD-A(R)
DIGITAL
AUDIO OUT
TO AUDIO
BLOCK DIAGRAM
<VCR SECTION>
PCM-SCLK
A-MUTE
DVD MAIN CBA UNIT
1-9-191-9-20
+3.3V
MAIN CBA
H9300BLAD
SCHEMATIC DIAGRAMS / CBA’S AND TEST POINTS
Standard Notes
WARNING
Many electrical and mechanical parts in this chassis
have special characteristics. These characteristics
often pass unnoticed and the protection afforded by
them cannot necessarily be obtained by using replacement components rated for higher voltage, wattage,
etc. Replacement parts that have these special safety
characteristics are identified in this manual and its
supplements; electrical components having such features are identified by the mark " ! " in the schematic
diagram and the parts list. Before replacing any of
these components, read the parts list in this manual
carefully. The use of substitute replacement parts that
do not have the same safety characteristics as specified in the parts list may create shock, fire, or other
hazards.
Capacitor Temperature Markings
Mark
Capacity
change rate
Standard
temperature
Temperature
range
Notes:
1. Do not use the part number shown on these drawings for ordering. The correct part number is shown
in the parts list, and may be slightly different or
amended since these drawings were prepared.
2. All resistance values are indicated in ohms
3
(K=10
3. Resistor wattages are 1/4W or 1/6W unless otherwise specified.
4. All capacitance values are indicated in µF
(P=10
5. All voltages are DC voltages unless otherwise
specified.
6. Electrical parts such as capacitors, connectors,
diodes, IC’s, transistors, resistors, switches, and
fuses are identified by four digits. The first two digits are not shown for each component. In each
block of the diagram, there is a note such as shown
below to indicate these abbreviated two digits.
, M=106).
-6
µF).
(B)
(F)+30 - 80%20°C-25~+85°C
(SR)
(Z)+30 - 80%20°C-10~+70°C
Capacitors and transistors are represented by the following symbols.
±
±
10%
15%
20°C-25~+85°C
20°C-25~+85°C
CBA Symbols
(Top View) (Bottom View)
+
Electrolytic Capacitor
(Bottom View)
Transistor or Digital Transistor
E C B
(Top View)
(Top View)
Schematic Diagram Symbols
Digital Transistor
E C B
(Top View)
E C B
NPN Transistor
NPN Digital Transistor
PNP Transistor
E C B
(Top View)
PNP Digital
Transistor
E C B
1-10-1SCPA1
LIST OF CAUTION, NOTES, AND SYMBOLS USED IN THE SCHEMATIC DIAGRAMS ON THE FOLLOWING
PAGES:
1. CAUTION:
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH THE SAME TYPE FUSE.
2. CAUTION:
Fixed Voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown, first check to see that all components in the power supply circuit are not defective before you connect the AC plug to the AC power supply. Otherwise it may cause some components in the
power supply circuit to fail.
3. Note:
(1) Do not use the part number shown on the drawings for ordering. The correct part number is shown in the parts
list, and may be slightly different or amended since the drawings were prepared.
(2) To maintain original function and reliability of repaired units, use only original replacement parts which are
listed with their part numbers in the parts list section of the service manual.
4. Wire Connectors
(1) Prefix symbol "CN" means "connector" (can disconnect and reconnect).
(2) Prefix symbol "CL" means "wire-solder holes of the PCB" (wire is soldered directly).
5. Mode: SP/REC
6. Voltage indications for PLAY and REC modes on the schematics are as shown below:
Unit: Volts
The same voltage for
both PLAY & REC modes
7. How to read converged lines
1-D3
Distinction Area
Line Number
(1 to 3 digits)
Examples:
1. "1-D3" means that line number "1" goes to area "D3".
2. "1-B1" means that line number "1" goes to area "B1".
8. Test Point Information
: Indicates a test point with a jumper wire across a hole in the PCB.
: Used to indicate a test point with a component lead on foil side.
5.0
231
5.0
PLAY mode
REC mode
(2.5)
Indicates that the voltage
is not consistent here.
3
AREA D3
2
1
AREA B1
1-D3
ABCD
1-B1
: Used to indicate a test point with no test pin.
: Used to indicate a test point with a test pin.
1-10-2SCRK05
Main 1/7 Schematic Diagram < VCR Section >
1
Note:
*
When it is necessary to replace one or more of the following Diodes,
all three should be replaced: D506, D507, D508.
1-10-31-10-4
1-10-5
H9300SCM1
Main 2/7 Schematic Diagram < VCR Section >
1-10-6
1-10-7
1-10-8H9300SCM2
Main 3/7 Schematic Diagram < VCR Section >
1-10-91-10-10
1-10-11
H9300SCM3
Main 4/7 Schematic Diagram < VCR Section >
1-10-121-10-131-10-14
H9300SCM4
Main 5/7 Schematic Diagram < VCR Section >
1-10-15
1-10-16
H9300SCM5
Main 6/7 Schematic Diagram < VCR Section >
1-10-17
1-10-18
H9300SCM6
Main 7/7 Schematic Diagram < VCR Section >
1-10-191-10-20
H9300SCM7
Power Supply Schematic Diagram < VCR Section >
CAUTION !
Fixed voltage (or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
NOTE :
THE VOLTAGE FOR PARTS IN HOT CIRCUIT IS MEASURED USING
HOT GND AS A COMMON TERMINAL.
CAUTION
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD ,
REPLACE ONL Y WITH THE SAME TYPE FUSE.
1-10-21
1-10-22
H9300SCP
Function Schematic Diagram < VCR Section >
7G6G5G4G3G2G1G
a
b
c
d
e
f
g
c
d
e
f
g
c
d
e
f
g
c
d
e
f
g
c
d
e
f
g
c
d
e
f
g
h
i
a
b
a
b
a
b
a
b
a
b
FL2001 MATRIX CHART
STANDBY
TITLECHP.TRK.CD
V
PBC
DVD
REPEAT
A
-B
1
3
2
4
5
1
3
2
4
5
DVD
VCD
PBC
STANDBY
A-B
REPEAT
TRK.CHP.TITLE
7G5G3G1G4G6G2G
cb
a
d
ef
g
1-10-23
1-10-24
H9300SCF
AFV Schematic Diagram < VCR Section >
Com pa r ison Cha r t of
Model s and Mar ks
MODELMARK
DPVR-2600A
DPVR-2700B
DPVR-2605C
1-10-25
1-10-26
H9300SCAFV
Front Jack Schematic Diagram < VCR Section >
2
Note:
*
When it is necessary to replace one or more of the following Diodes,
all four should be replaced: D652, D653, D654, D655.
H9300SCJ
Front Jack CBA Top ViewFront Jack CBA Bottom View
BH9311F01012-C
1-10-271-10-28
Power Supply CBA Top View
Power Supply CBA Bottom View
CAUTION !
Fixed voltage ( or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, check to see that all components in the power supply circuit are not
defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
NOTE :
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
BECAUSE A HO T CHASSIS GROUND IS PRESENT IN THE PO WER
SUPPL Y CIRCUIT , AN ISOLA TION TRANSFORMER MUST BE USED .
ALSO , IN ORDER TO HAVE THE ABILITY TO INCREASE THE INPUT
SLOWL Y , WHEN TROUBLESHOOTING THIS TYPE POWER SUPPL Y
CIRCUIT , A V ARIABLE ISOLA TION TRANSFORMER IS REQUIRED.
CAUTION
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD ,
REPLACE ONL Y WITH THE SAME TYPE FUSE.
1-10-291-10-30
BH9311F01022
Function CBA Top View
Function CBA Bottom View
BH9311F01012-B
1-10-311-10-32
AFV CBA Top ViewAFV CBA Bottom View
Junction-A CBA Top View
Junction-A CBA Bottom View
BH9311F01012-E
BHC400F01091
Junction-B CBA Bottom ViewJunction-B CBA Top View
BH9311F01012-F
1-10-33
1-10-34
Main CBA Top View
Sensor CBA Top View ( End Sensor )
BHB300F01011-B
BHB300F01011-A
WF1
TP751
V-OUT
TP502
END-S
WF3
TP301
C-PB
Sensor CBA Top View ( Start Sensor )
BHB300F01011-A
BHB300F01011-B
WF2
TP504
RF-SW
TP501
S-INH
VR501
SW-P
TP503
CTL
1-10-35
1-10-36
1-10-37
BH9311F01012-A
Main CBA Bottom View
1-10-381-10-391-10-40
BH9311F01012-A
DVD Main 1/4 Schematic Diagram < DVD Section >
1-10-41
1-10-42
1-10-43H9300SCD1
DVD Main 2/4 Schematic Diagram < DVD Section >
1-10-441-10-451-10-46
H9300SCD2
DVD Main 3/4 Schematic Diagram < DVD Section >
1-10-471-10-48
1-10-49H9300SCD3
DVD Main 4/4 Schematic Diagram < DVD Section >
1-10-50
1-10-51
1-10-52
H9300SCD4
WAVEFORMS
WF1
WF1
WF2
(TP751 of Main CBA)
V-OUT E-E
10usec 50mV x 10
UPPER
(TP751 of Main CBA)
LOWER
(TP302 of Main CBA)
V-OUT 0.1V x 10
RF-SW 0.5V x 10
50usec
WF5
UPPER
(TP301 of Main CBA)
WF2
LOWER
(TP302 of Main CBA)
C-PB 10mV x 10
RF-SW 0.5V x 10
5msec
1-11-1H9300WFP
Pin 5 of CN1601
WF1
WAVEFORMS
WF4
Pin 13 of CN1601
NOTE:
Input
CD: 1kHz PLAY
(WF4~WF6)
DVD: POWER ON (STOP) MODE
(WF1~WF3)
1.Clean all parts for the tape transport (Upper Drum with Video Head / Pinch Roller / Audio Control Head / Full
Erase Head) using 90% lsopropyl Alcohol.
2.After cleaning the parts, do all DECK ADJUSTMENTS.
3.For the reference numbers listed above, refer to Deck Exploded Views.
* B73 ------ Recording Model only
LDG Belt
II
2-1-1U25MEN
Cleaning
Cleaning of Video Head
Clean the head with a head cleaning stick or chamois
cloth.
Procedure
1.Remove the top cabinet.
2.Put on a glove (thin type) to avoid touching the
upper and lower drum with your bare hand.
3.Put a few drops of 90% Isopropyl alcohol on the
head cleaning stick or on the chamois cloth and,
by slightly pressing it against the head tip, turn the
upper drum to the right and to the left.
Notes:
1.The video head surface is made of very hard
material, but since it is very thin, avoid cleaning it
vertically.
2.Wait for the cleaned part to dry thoroughly before
operating the unit.
3.Do not reuse a stained head cleaning stick or a
stained chamois cloth.
Cleaning of Audio Control Head
Clean the head with a cotton swab.
Procedure
1.Remove the top cabinet.
2.Dip the cotton swab in 90% isopropyl alcohol and
clean the audio control head. Be careful not to
damage the upper drum and other tape running
parts.
Notes:
1.Avoid cleaning the audio control head vertically.
2.Wait for the cleaned part to dry thoroughly before
operating the unit or damage may occur.
A/C Head
Upper
Cylinder
Do Not !
Video Head
Cleaning Stick
2-1-2U25MEN
SERVICE FIXTURE AND TOOLS
J-1-1, J-1-2
J-3
J-2
J-4
J-5
Ref. No. NamePart No.Adjustment
J-1-1Alignment TapeFL6AHead Adjustment of Audio Control Head
J-1-2Alignment TapeFL6N8
(1 speed only)
FL6NS8
(2 speed only)
J-2Guide Roller Adj.ScrewdriverAvailable
Locally
J-3MirrorAvailable
Locally
J-4Azimuth Adj.Screwdriver +Available
Locally
J-5X Value Adj.Screwdriver -Available
Locally
2-2-1U25PFIX
Azimuth and X Value Adjustment of Audio Control
Head / Adjustment of Envelope Waveform
Guide Roller
Tape Transportation Check
A/C Head Height
X Value
MECHANICAL ALIGNMENT PROCEDURES
Explanation of alignment for the tape to correctly run
starts on the next page. Refer to the information below
on this page if a tape gets stuck, for example, in the
mechanism due to some electrical trouble of the unit.
Service Information
A. Method for Manual Tape Loading/Unloading
To load a cassette tape manually:
1. Disconnect the AC plug.
2. Remove the Top Case and Front Assembly.
3. Insert a cassette tape. Though the tape will not be
automatically loaded, make sure that the cassette
tape is all the way in at the inlet of the Cassette
Holder. To confirm this, lightly push the cassette
tape further in and see if the tape comes back out,
by a spring motion, just as much as you have
pushed in.
4. Turn the LDG Belt in the appropriate direction
shown in Fig. M1 for a minute or two to complete
this task.
To unload a cassette tape manually:
1. Disconnect the AC plug.
2. Remove the Top Case and Front Assembly.
3. Make sure that the Moving guide preparations are
in the Eject Position.
4. Turn the LDG Belt in the appropriate direction
shown in Fig. M1 until the Moving guide preparations come to the Eject Position. Stop turning
when the preparations begin clicking or can not be
moved further. However, the tape will be left
wound around the cylinder.
5. Turn the LDG Belt in the appropriate direction continuously, and the cassette tape will be ejected.
Allow a minute or two to complete this task.
B. Method to place the Cassette Holder in the tape-
loaded position without a cassette tape
1. Disconnect the AC Plug.
2. Remove the Top Case and Front Assembly.
3. Turn the LDG Belt in the appropriate direction
shown in Fig. M1. Release the locking tabs shown
in Fig. M1 and continue turning the LDG Belt until
the Cassette Holder comes to the tape-loaded
position. Allow a minute or two to complete this
task.
Top View
Moving guide T preparation
(Eject Position)
Moving guide S preparation
(Eject Position)
Push the tape
to load it.
Push the locking tab gently to unlock
when loading without a cassette.
UNLOAD
/EJECT
LOAD
Side View
LDG Belt
Fig. M1
Bottom View
LDG Belt (B)
UNLOAD
/EJECT
Cam Gear
Fig. M2
2-3-1DUALPALMA
1.Tape Interchangeability Alignment
Note:
To do these alignment procedures, make sure that the
Tracking Control Circuit is set to the center position
every time a tape is loaded or unloaded. (Refer to
page 2-3-4, procedure 1-C, step 2.)
Note: Before starting this Mechanical Alignment, do all
Electrical Adjustment procedures.
Flowchart of Alignment for tape traveling
Loading (Use a blank tape.)
Adjust the height of the Guide Rollers
(Supply side and take-up side).
(Use a blank tape.) (pg. 2-3-3)
1-A
Check to see that the tape is not creasing
and that there is no slack on the supply
and take-up side Guide Rollers.
(Use a blank tape.)
Adjust the X Value for maximum envelope.
(pg. 2-3-3) (Use Alignment Tape.)
Adjust the envelope. (pg. 2-3-4)
Check the envelope.
OK
Adjust the Audio Section.
(Azimuth Alignment) (pg. 2-3-4)
Check the audio output.
OK
1-A
1-B
1-C
1-C
1-D
1-D
Not good
Not good
Not good
Do the final tape-traveling test to see that
the tape runs normally in play mode without creasing or slacking.
OK
Completion
1-A
Check the following:
1. X Value (pg. 2-3-3)
2. Envelope (pg. 2-3-4)
OK
1-B, 1-C
Not good
2-3-2DUALPALMA
Adjust the X value and envelope.
1-B, 1-C
1-A. Preliminary/Final Checking and
Alignment of Tape Path
Purpose:
To make sure that the tape path is well stabilized.
Symptom of Misalignment:
If the tape path is unstable, the tape will be damaged.
Note: Do not use an Alignment Tape for this procedure. If the unit is not correctly aligned, the tape may
be damaged.
1. Playback a blank cassette tape and check to see
that the tape runs without creasing at Guide Rollers
[2] and [3], and at points A and B on the lead surface. (Refer to Fig M3 and M4.)
2. If creasing is apparent, align the height of the guide
rollers by turning the top of Guide Rollers [2] and
[3] with a Guide Roller Adj. Screwdriver. (Refer to
Fig. M3 and M5.)
Guide Roller [2]
A
Take-up Guide Post [4]
Lead Surface of Cylinder
Correct
Guide Roller
Tape
Guide Roller [3]
B
Tape
Incorrect
AC Head
Fig. M3
Fig. M4
3. Check to see that the tape runs without creasing at
Take-up Guide Post [4] or without snaking between
Guide Roller [3] and AC Head. (Fig. M3 and M5)
4. If creasing or snaking is apparent, adjust the Tilt
Adj. Screw of the AC Head. (Fig. M6)
Azimuth Adj. Screw
AC Head
X-Value Adj.
Screwdriver
Tilt Adj. Screw
Fig. M6
1-B. X Value Alignment
Purpose:
To align the Horizontal Position of the Audio/Control/
Erase Head.
Symptom of Misalignment:
If the Horizontal Position of the Audio/Control/Erase
Head is not properly aligned, maximum envelope cannot be obtained at the Neutral position of the Tracking
Control Circuit.
1. Connect the oscilloscope to TP301 (C-PB) and
TP503 (CTL) on the Main CBA. Use TP504 (RFSW) as a trigger.
2. Playback the Gray Scale of the Alignment Tape
(FL6NS8) and confirm that the PB FM signal is
present.
3. Set the Tracking Control Circuit to the center position by pressing CH UP button then “ PLAY ” button
on the unit. (Refer to note on bottom of page
2-3-4.)
4. Use the X-Value Adj. Screwdriver so that the PB
FM signal at TP301 (C-PB) is maximum. (Fig. M6)
5. Press CH UP button on the unit until the CTL waveform has shifted by approx. +2msec. Make sure
that the envelope is simply attenuated (shrinks in
height) during this process so that you will know
the envelope has been at its peak.
Tape
Take-up Guide
Post
Fig. M5
2-3-3DUALPALMA
6. Press CH DOWN button on the unit until the CTL
waveform has shifted from its original position (not
the position achieved in step 5, but the position of
CTL waveform in step 4) by approximately -2msec.
Make sure that the envelope is simply attenuated
(shrinks in height) once CTL waveform passes its
original position and is further brought in the minus
direction.
7. Set the Tracking Control Circuit to the center position by pressing CH UP button and then “ PLAY ”
button.
1-C. Checking/Adjustment of Envelope
Waveform
Purpose:
To achieve a satisfactory picture and precise tracking.
Symptom of Misalignment:
If the envelope output is poor, noise will appear in the
picture. The tracking will then lose precision and the
playback picture will be distorted by any slight variation of the Tracking Control Circuit.
1. Connect the oscilloscope to TP301 (C-PB) on the
Main CBA. Use TP504 (RF-SW) as a trigger.
2. Playback the Gray Scale on the Alignment Tape
(FL6NS8). Set the Tracking Control Circuit to the
center position by pressing CH UP button and then
“ PLAY ” button on the unit. Adjust the height of
Guide Rollers [2] and [3] (Fig. M3, Page 2-3-3)
watching the oscilloscope display so that the envelope becomes as flat as possible. To do this adjustment, turn the top of the Guide Roller with the
Guide Roller Adj. Screwdriver.
3. If the envelope is as shown in Fig. M7, adjust the
height of Guide Roller [2] (Refer to Fig. M3) so that
the waveform looks like the one shown in Fig. M9.
4. If the envelope is as shown in Fig. M8, adjust the
height of Guide Roller [3] (Refer to Fig. M3) so that
the waveform looks like the one shown in Fig. M9.
5. When Guide Rollers [2] and [3] (Refer to Fig.M3)
are aligned properly, there is no envelope drop
either at the beginning or end of track as shown in
Fig. M9.
Note: Upon completion of the adjustment of Guide
Rollers [2] and [3] (Refer to Fig. M3), check the X
Value by pushing the CH UP or DOWN buttons alternately, to check the symmetry of the envelope. Check
the number of pushes to ensure center position. The
number of pushes CH UP button to achieve 1/2 level
of envelope should match the number of pushes CH
DOWN button from center. If required, redo the “X
Value Alignment.”
1-D. Azimuth Alignment of Audio/Control/
Erase Head
Purpose:
To correct the Azimuth alignment so that the Audio/
Control/Erase Head meets tape tracks properly.
Symptom of Misalignment:
If the position of the Audio/Control/Erase Head is not
properly aligned, the Audio S/N Ratio or Frequency
Response will be poor.
1. Connect the oscilloscope to the audio output jack
on the rear side of the deck.
2. Playback the alignment tape (FL6NS8) and confirm
that the audio signal output level is 8kHz.
3. Adjust Azimuth Adj. Screw so that the output level
on the AC Voltmeter or the waveform on the oscilloscope is at maximum. (Fig. M6)
Dropping envelope level at the beginning of track.
Fig. M7
Dropping envelope level at the end of track.
Fig. M8
Envelope is adjusted properly. (No envelope drop)
Fig. M9
2-3-4DUALPALMA
DISASSEMBLY/ASSEMBLY PROCEDURES
OF DECK MECHANISM
Before following the procedures described below, be sure to remove the deck assembly from the cabinet. (Refer to
CABINET DISASSEMBLY INSTRUCTIONS on page 1-6-1.)
All the following procedures, including those for adjustment and replacement of parts, should be done in Eject
mode; see the positions of [45] and [46] in Fig.DM1 on page 2-4-3. When reassembling, follow the steps in reverse
order.
First, while pushing the locking tab as
shown in the right, slide and pull up the right
side on [2] to release Pin A and Pin B from
the slots A.
Then, remove Pin C and Pin D on [2] from
the slots B as shown.
Locking tab
Slot A
View for A
Fig. DM4
A
Desolder
from bottom
View for A
Lead with
Blue Stripe
Fig. DM6
2-4-4DUALPALDA
[9]
A
(S-7)
(S-6)
(L-2)
LDG
Belt
Adj. Screw
[8]
Desolder
from bottom
Lead with White Stripe
View for A
[8]
Fig. DM7
[11]
(L-1)
[14]
[17]
(L-3)
(S-9)
(S-10)
[15]
Fig. DM9
After removing the Screw (S-11),
while pressing the Locking Tab
(L-3), remove [16].
Pin of [12]
Pin of [10]
[13]
[10]
A
Grooves of [28]
(P-3)
[12]
[16]
[18]
(P-2)
(S-11)
Fig. DM10
View for A
When reassembling [10] and
[12], confirm that pin of [10]
and pin of [12] are in the
[28]
grooves of [28] as shown.
Fig. DM8
2-4-5DUALPALDA
Cap Belt
(C-1)
[20]
[19]
[21]
Fig. DM12
(S-12)
Fig. DM11
2-4-6DUALPALDA
[23]
(P-4)
(C-3)
(C-2)
(P-4)
[28]
[22]
[27]
[28]
[26]
(S-15)
[25]
(L-4)
(C-6)
[29]
[30]
[31]
(C-5)
(C-4)
[24]
Pin on
bottom
of [23]
Top View
When installing [23], install
the spring (P-4) to [28] as
shown in the left figure, and
then install [23] while
pressing the spring (P-4) to
the direction of the arrow in
the left figure and confirming
that the position of the
spring (P-4) is placed as
shown in the left figure.
[23]
Position of pin on [22]
Pin on [22]
[28]
Fig. DM13
[32]
Pin of [37]
Bottom View
Top View
Position of Mode Lever when installed
Pin of [34]
[28]
Align [25] and [28] as shown.
First groove on [28]
First tooth on [48]
[28]
When reassembling [28],
meet the first groove on
[28] to the first tooth on
[48] as shown.
Pin of [38]
[25]
Fig. DM14
2-4-7DUALPALDA
Refer to the Alignment Section, Page 2-4-9.
(P-5)
[45]
[46]
[47]
[34]
[38]
(P-7)
turn
[40]
[33]
(L-6)
turn
[44]
[42]
(L-5)
[39]
(C-8)
[36]
(C-7)
[41]
[35]
Fig. DM15
[43]
(P-6)
[37]
[49]
[48]
(L-7)
Fig. DM17
Slide
Fig. DM18
turn
Fig. DM16
2-4-8DUALPALDA
ALIGNMENT PROCEDURES OF MECHANISM
The following procedures describe how to align the
individual gears and levers that make up the tape
loading/unloading mechanism. Since information
about the state of the mechanism is provided to the
System Control Circuit only through the Mode Switch,
it is essential that the correct relationship between
individual gears and levers be maintained.
All alignments are to be performed with the mechanism in Eject mode, in the sequence given. Each
procedure assumes that all previous procedures have
been completed.
IMPORTANT:
If any one of these alignments is not performed
properly, even if off by only one tooth, the unit will
unload or stop and it may result in damage to the
mechanical or electrical parts.
Alignment points in Eject Position
Top View
Alignment [a]
Alignment 3
Alignment 1
Loading Arm, S and T Assembly
Install Loading Arm S and T Assembly so that their
triangle marks point to each other as shown in Fig.
AL2.
Alignment 2
Mode Gear
Keeping the two triangles pointing at each other,
install the Loading Arm T Assembly so that the last
tooth of the gear meets the most inside teeth of the
Mode Gear. See Fig. AL2.
Alignment 1
Triangle Marks
Loading Arm
T Assembly
Loading Arm
S Assembly
Last Tooth
Alignment 2
Most inside teeth
of Mode Gear
Mode Gear
Bottom View
Alignment [a] can be done independently of any
other alignment.
Alignment 1
Alignment 2
Fig. AL1
Fig. AL2
Alignment [a]
Tape Guide Assembly
Measurement of the screw must be as specified in
Fig. AL3.
Tape Guide
Assembly
Screw
3.25 – 0.1 mm
0.128 – 0.004 inch
This alignment can be
done independently of
any other alignment.
Fig. AL3
2-4-9U25NAPM
Alignment 3
Cam Gear (A), Rack Assembly
Install the Rack Assembly so that the first tooth on
the gear of the Rack Assembly meets the first
groove on the Cam Gear (A) as shown in Fig. AL4.
See Electrical Parts List
for parts with this mark.
Some Ref. Numbers are
not in sequence.
[ DPVR-2605 ]
A1X
2L041
2B48
2L041
L1-8
2L021
A2
2B9
DVD Main CBA Unit
A31
2L034
1B2
Power Supply
CBA
2L053
2B40
2B33
2B10
2B41
F1001
2L034
D
E
2L053
2B33
JW004
2L041
C
B
L1-6
2L021
A20
2L032
2L022
2B6
2L051
2B2
L1-7
2B4
2B16
2L041
AC1001
2L031
2L041
2L041
Function CBA
2L054
2B18
2L054
Junction B CBA
2L041
JW007
Junction A CBA
JW008
JW005
2B37
RM2001
Sensor CBA
2L035
2L071
D'
E'
B'
JW006
2L071
JW009
2B15
Sensor CBA
2B39
C'
2L022
2L071
2B11
2L071
2L036
2B39
2L071
1B1
2L034
AFV CBA
2L022
A
2L022
2L034
2L034
Main CBA
A1X
2L037
[ DPVR-2600/DPVR-2700 ]
2B13
2L032
2L052
2L051
2B3
2L052
2B20
Front Jack CBA
JW002
A'
A3
A11
A4
A10
2L062
2L022
2L031
2B1
2L031
2L022
2B39
3-1-13-1-2H9300CEX
Packing
Some Ref. Numbers
are not in sequence.
[ B ]
X20X6
X5
S2
X1
X3
X2
X4
S2
S3
Unit
A14
S1
3-1-3H9300PEX
DECK EXPLODED VIEWS
Deck Mechanism View 1
B2
B35
MarkDescription
Floil G-374G
SLIDUS OIL #150
(Blue grease)
B9
B73
L1191
B10
L1053
B74
L1051
L1467
B411
B567
B494
B553
B410
Chassis Assembly
Top View (Lubricating Point)
B501
B12
B11
B571
Some Ref. Numbers are not in sequence.
B492
B37
L1450
B560
B426
B121
B126
L1468
B8
L1466
Chassis Assembly
Bottom View (Lubricating Point)
3-1-4U25PALDEX
Deck Mechanism View 2
B587
B27
B508
B414
B417
B487
B499
Note: Both the TENSION
LEVER SUB ASSEMBLY
MK11(B27) and the TENSION
LEVER ASSEMBLY MK11
(B587) can be used.
B573
B518
B521
B585
B564
B572
B565
B574
B520
B416
MarkDescription
Floil G-374G
SANKOUL FG84M
B148
B522
B31
L1406
(Yellow grease)
B525
(Blue grease)
B3
B558
B557
B579
View
for A
B568
B559
B578
B579
B582
B580
B583
B133
B581
B551
A
B516
B584
B507
B569
B505
B488
B491
B570
B502
B513
Bottom Side (Grease point)
L1151
Bottom Side
(Grease point)
B52
Some Ref. Numbers are not in sequence.
3-1-5U25PALDEX
Deck Mechanism View 3
L1321
B355
L1341
B347
L1321
B354
MarkDescription
Floil G-374G
Note: There are two different, but interchangeable
types of CLEANER LEVER(B359) in this model,
and have different combination with B361. Please
see Table 1 for details and combination. (Refer to
DECK PARTS LIST section.)
Table 1 (B359 and B361 Combination)
TypePart No.Part No.
A0V M411114
B
B483
B425
L1461
0VM304413
0VM305090
B360
(Blue grease)
B361B359 CLEANER LEVER
Not used
B529
Type B
B359
B562
B482
B563
L1341
B300
B529
Type A
B360
B359
B361
B555
Some Ref. Numbers are not in sequence.
B303
B514
3-1-6U25PALDEX
MECHANICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a
have special characteristics important to safety.
!
Before replacing any of these components, read carefully the product safety notice in this service manual.
Don't degrade the safety of the product through
improper servicing.
NOTE:
Parts that are not assigned part numbers (---------) are
not available.
Comparison Chart of Models and Marks
ModelMark
DPVR-2600A
DPVR-2700B
DPVR-2605C
Ref. No. MarkDescriptionPart No.
A1XA,BFRONT ASSEMBLY H9300ED0VM203743
A1XCFRONT ASSEMBLY H9320ED0VM203747
A2TOP COVER H9200UD0VM101107
A3CHASSIS H9200UD0VM101106B
A4PANEL, REAR H9300ED0VM203725
A10!ALABEL, RATING H9300ED----------
A10!BLABEL, RATING H9306ED----------
A10!CLABEL, RATING H9320ED----------
A11LABEL, RESET H9300ED0VM414073
A14LABEL, SERIAL NO. H39H0JD(JPN)0VM409906
A14A,CLABEL, BAR CODE H9300ED0VM414079
A14BLABEL, BAR CODE H9306ED0VM414084
A20A,BTRAY ASSEMBLY H9300ED0VM414050
A20CPANEL, TRAY H9320ED0VM414061
A31LABEL, LASER CAUTION E5612BD0VM413744
1B1DECK ASSEMBLY CZD011/VM15E0N15E0FL
1B2DVD MECHAN79F1FVM
2B1DECK PEDESTAL-1 H9200UD0VM101108-1
2B2TOP BRACKET H9100UD0VM203252
2B3SIDE BRACKET H9100UD0VM305013
2B6DECK PEDESTAL-2 H9200UD0VM101108-2
2B9CUSHION HC460ED0VM413251
2B10SIDE CUSHION HC470ED0VM413392
2B16TAPE, HIMELON H9206JD0VM413956
2B18TOP PLATE H9100UD0VM412565
2B20EARTH PLATE H9100UD0VM305011
2B37WIRE TAPE K3220UA0VM404993
2B39WASHER(D8) H1600UD0VM408931
2B40INSULATOR H9311BD0VM203691
2B41BRACKET H9311BD0VM413935
2B48TOP PLATE(2) H9100UD0VM412699
2L021SCREW, S-TIGHT H9210UD0VM413231
2L022S-TIGHT SCREW 3X8 BIND + CHROMEGBMS3080
2L031SCREW, S-TIGHT M3X6 BIND HEAD+GBMS3060
2L032SCREW, S-TIGHT M3X6 BIND HEAD+GBMS3060
2L034SCREW, S-TIGHT M3X6 BIND HEAD+GBMS3060
2L035SCREW, B-TIGHT M3X8 BIND HEAD+GBMB3080
2L036SCREW, P-TIGHT M3X8 BIND HEAD+GBCP3080
Ref. No. MarkDescriptionPart No.
2L037SCREW, S-TIGHT M3X6 BIND HEAD+GBMS3060
2L041SCREW, C-TIGHT M3X5 BIND HEAD +GBCC3050
2L051P-TIGHT SCREW 3X8 BIND +GBMP3080
2L054P-TIGHT SCREW 3X8 BIND +GBMP3080
2L062SCREW, B-TIGHT M3X8 BIND HEAD +GBKB3080
2L071SCREW, P-TIGHT M3X10 WASHER HEAD+ GCMP3100
PACKING
S1A,BGIFT BOX CARTON H9300ED0VM305707
S1CGIFT BOX CARTON H9320ED0VM305711
S2STYROFOAM(2) H9100UD0VM203377A
S3SET BAG E7708UA0DM400731C
ACCESSORIES
X1REMOTE CONTROL UNIT 364/CRC006NA204ED
X2DRY BATTERY R6P/2S orXB0M451T0001
DRY BATTERY(SUNRISE) R6SSE/2S orXB0M451MS002
DRY BATTERY ES-GR6M-CXB0M571GLP01
X3RF CORD PAL 1.2MWPZ0122LG001
X4ACCESSORY BAG K8092BA0VM404632
X521P CABLE(BYR SUPPLY) H9300ED0VMN03276
X6!BOWNER'S MANUAL(SPANISH) H9306ED0VMN03250
X20!A,COWNER'S MANUAL H9300ED0VMN03224
X20!BOWNER'S MANUAL H9306ED0VMN03233
200207173-2-1H9300CA
ELECTRICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a
have special characteristics important to safety.
!
Before replacing any of these components, read carefully the product safety notice in this service manual.
Don't degrade the safety of the product through
improper servicing.
NOTES:
Parts that are not assigned part numbers (---------) are
not available.
Tolerance of Capacitors and Resistors are noted with
the following symbols.
C.....±0.25%D.....±0.5%F.....±1%
G.....±2%J......±5%K.....±10%
M.....±20%N.....±30%Z.....+80/-20%
Comparison Chart of Models and Marks
ModelMark
DPVR-2600A
DPVR-2700B
DPVR-2605C
DVD MAIN CBA UNIT
Ref. No.MarkDescriptionPart No.
DVD MAIN CBA UNITN7TG6FEP
MCV CBA
Ref. No. MarkDescriptionPart No.
A
MCV CBA
B
MCV CBA
C
MCV CBA
Consists of the following
MAIN CBA(MCV-A)
FUNCTION CBA(MCV-B)
FRONT JACK CBA(MCV-C)
JUNCTION A CBA(MCV-E)
JUNCTION B CBA (MCV-F)
SENSOR CBA
MAIN CBA
Ref. No. MarkDescriptionPart No.
Main CBA(MCV-A)----------
Consists of the following:
CAPACITORS
C055ELECTROLYTIC CAP. 100µF/25V M orCE1EMASDL101
ELECTROLYTIC CAP. 100µF/25V MCE1EMASTL101
C056ELECTROLYTIC CAP. 47µF/25V M orCE1EMASDL470
ELECTROLYTIC CAP. 47µF/25V MCE1EMASTL470
C057ELECTROLYTIC CAP. 10µF/16V M orCE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTL100
C058ELECTRIC DOUBLE LAYER CAP0.047F/
5.5V Z or
0VSA13125
0VSA13132
0VSA13137
----------
----------
----------
----------
---------0VSA13013
CA0J473NE003
Ref. No. MarkDescriptionPart No.
ELECTRIC DOUBLE LAYER CAP. 0.047F/
5.5V Z
C059ELECTROLYTIC CAP. 100µF/6.3V M orCE0KMASDL101
ELECTROLYTIC CAP. 100µF/ 6.3V MCE0KMASTL101
C060CHIP CERAMIC CAP. B K 0.047µF/50V or CHD1JK30B473
C113CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C114CHIP CERAMIC CAP. B K 1000pF/50VCHD1JK30B102
C116CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C117ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C118CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C119CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C121ELECTROLYTIC CAP. 100µF/16V M orCE1CMASDL101
ELECTROLYTIC CAP. 100µF/16V MCE1CMASTL101
C127ELECTROLYTIC CAP. 10µF/16V M orCE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTL100
C251ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C252CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C253CHIP CERAMIC CAP. B K 1000pF/50VCHD1JK30B102
C254ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C301CHIP CERAMIC CAP. B K 0.022µF/50V or CHD1JK30B223
CHIP CERAMIC CAP. B K 0.022µF/25VCHD1EK30B223
C302ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C303CERAMIC CAP.(AX) F Z 0.1µF/50VCCA1JZTFZ104
C305ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C306CHIP CERAMIC CAP. B K 0.047µF/50V or CHD1JK30B473
CHIP CERAMIC CAP. B K 0.047µF/25VCHD1EK30B473
C307CHIP CERAMIC CAP. B K 0.022µF/50V or CHD1JK30B223
CHIP CERAMIC CAP. B K 0.022µF/25VCHD1EK30B223
CA0J473MS014
200207173-3-1H9300EL
Ref. No. MarkDescriptionPart No.
C308CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C311CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C312ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C313ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C314CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C315CHIP CERAMIC CAP. B K 0.047µF/50V or CHD1JK30B473
CHIP CERAMIC CAP. B K 0.047µF/25VCHD1EK30B473
C316ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C317CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. CG J 68pF/50VCHD1JJ3CG680
C328ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C329CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C330ELECTROLYTIC CAP. 100µF/16V M H7CE1CMAVSL101
C331ELECTROLYTIC CAP. 220µF/6.3V M H7CE0KMAVSL221
C333CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C334ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C335ELECTROLYTIC CAP. 100µF/6.3V H7CE0KMAVSL101
C343ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C344ELECTROLYTIC CAP. 4.7µF/25V M NP H7 CP1EMAVSB4R7
C345ELECTROLYTIC CAP. 0.47µF/50V M H7CE1JMAVSLR47
C346CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
CHIP CERAMIC CAP. CG J 33pF/50VCHD1JJ3CG330
C410ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C411CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C412ELECTROLYTIC CAP. 33µF/6.3V M H7CE0KMAVSL330
C413CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C414CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C415ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C416CHIP CERAMIC CAP. B K 4700pF/50VCHD1JK30B472
C417ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
C418CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. CG J 220pF/50VCHD1JJ3CG221
C420CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C421ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C451ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C452CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C453CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C454ELECTROLYTIC CAP. 2.2µF/50V M H7CE1JMAVSL2R2
C455ELECTROLYTIC CAP. 2.2µF/50V M H7CE1JMAVSL2R2
C456ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C457ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C458ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C459ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C460ELECTROLYTIC CAP. 47µF/16V M H7CE1CMAVSL470
C461CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C462ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C463ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
200207173-3-2H9300EL
Ref. No. MarkDescriptionPart No.
C464CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C465CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C466CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C467CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C468ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C469ELECTROLYTIC CAP. 22µF/10V M H7CE1AMAVSL220
C470ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C471ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C472CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C473ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C474CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C475ELECTROLYTIC CAP. 22µF/10V M H7CE1AMAVSL220
C476CHIP CERAMIC CAP. B K 4700pF/50VCHD1JK30B472
C477CHIP CERAMIC CAP. B K 4700pF/50VCHD1JK30B472
C478ELECTROLYTIC CAP. 22µF/10V M H7CE1AMAVSL220
C479ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C480ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C481CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C482CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C483ELECTROLYTIC CAP. 330µF/6.3V M H7CE0KMASSL331
C484CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C487CHIP CERAMIC CAP. B K 0.1µF/25V orCHD1EK30B104
CHIP CERAMIC CAP. B K 0.1µF/16VCHD1CK30B104
C488CHIP CERAMIC CAP. B K 0.1µF/25V orCHD1EK30B104
CHIP CERAMIC CAP. B K 0.1µF/16VCHD1CK30B104
C505CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C506ELECTROLYTIC CAP. 220µF/6.3V M H7CE0KMAVSL221
C508CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C509CHIP CERAMIC CAP. B K 1000pF/50VCHD1JK30B102
C510CHIP CERAMIC CAP. B K 4700pF/50VCHD1JK30B472
C511CERAMIC CAP.(AX) B K 330pF/50V orCCA1JKT0B331
CERAMIC CAP.(AX) B J 330pF/50VCCA1JJT0B331
C513CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C514CERAMIC CAP.(AX) B K 330pF/50V orCCA1JKT0B331
CERAMIC CAP.(AX) B J 330pF/50VCCA1JJT0B331
C516ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
C517CERAMIC CAP.(AX) F Z 0.022µF/25VCCA1EZTFZ223
CHIP CERAMIC CAP. CG J 560pF/50VCHD1JJ3CG561
C521ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
C522CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C524CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C527CERAMIC CAP.(AX) B K 100pF/50V orCCA1JKT0B101
CERAMIC CAP.(AX) B J 100pF/50VCCA1JJT0B101
C531CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C533CHIP CERAMIC CAP. B K 0.047µF/50V or CHD1JK30B473
CHIP CERAMIC CAP. B K 0.047µF/25VCHD1EK30B473
C534ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C535CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
C547CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C548CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C549ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C550ELECTROLYTIC CAP. 100µF/6.3V H7CE0KMAVSL101
C553ELECTROLYTIC CAP. 22µF/10V M H7CE1AMAVSL220
C554CERAMIC CAP.(AX) F Z 0.1µF/50VCCA1JZTFZ104
C555CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C701ELECTROLYTIC CAP. 100µF/6.3V H7CE0KMAVSL101
C703CHIP CERAMIC CAP. B K 1000pF/50VCHD1JK30B102
C706CHIP CERAMIC CAP. B K 0.047µF/50V or CHD1JK30B473
CHIP CERAMIC CAP. B K 0.047µF/25VCHD1EK30B473
C708ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C709CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C711CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C712CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C714CHIP CERAMIC CAP. B K 1500pF/50VCHD1JK30B152
C751CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C752ELECTROLYTIC CAP. 47µF/10V M orCE1AMASDL470
ELECTROLYTIC CAP. 47µF/10V MCE1AMASTL470
C753ELECTROLYTIC CAP. 4.7µF/50V M orCE1JMASDL4R7
ELECTROLYTIC CAP. 4.7µF/50V MCE1JMASTL4R7
C754ELECTROLYTIC CAP. 4.7µF/50V M orCE1JMASDL4R7
ELECTROLYTIC CAP. 4.7µF/50V MCE1JMASTL4R7
C755CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C756CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1054CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1058CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1059CERAMIC CAP. YV Z 0.01µF/50V orCCD1JZSYV103
CERAMIC CAP. F Z 0.01µF/50VCCD1JZS0F103
C1060ELECTROLYTIC CAP. 100µF/6.3V M orCE0KMASDL101
ELECTROLYTIC CAP. 100µF/ 6.3V MCE0KMASTL101
C1061ELECTROLYTIC CAP. 220µF/6.3V M orCE0KMASDL221
ELECTROLYTIC CAP. 220µF/ 6.3V MCE0KMASTL221
C1062ELECTROLYTIC CAP. 100µF/6.3V M orCE0KMASDL101
ELECTROLYTIC CAP. 100µF/ 6.3V MCE0KMASTL101
200207173-3-3H9300EL
Ref. No. MarkDescriptionPart No.
C1067CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C1068CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C1201ELECTROLYTIC CAP. 10µF/16V M orCE1CMASDL100
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C4CHIP CERAMIC CAP. CH J 56pF/50V orCHD1JJ3CH560
CHIP CERAMIC CAP. CG J 56pF/50VCHD1JJ3CG560
C5CHIP CERAMIC CAP. CH J 22pF/50V orCHD1JJ3CH220
CHIP CERAMIC CAP. CG J 22pF/50VCHD1JJ3CG220
C6CHIP CERAMIC CAP. CH J 56pF/50V orCHD1JJ3CH560
CHIP CERAMIC CAP. CG J 56pF/50VCHD1JJ3CG560
C7CHIP CERAMIC CAP. CH C 3pF/50V orCHD1JC3CH3R0
CHIP CERAMIC CAP. CJ C 3pF/50V orCHD1JC3CJ3R0
CHIP CERAMIC CAP. CH D 3pF/50VCHD1JD3CH3R0
C8CHIP CERAMIC CAP. CH C 3pF/50V orCHD1JC3CH3R0
CHIP CERAMIC CAP. CJ C 3pF/50V orCHD1JC3CJ3R0
CHIP CERAMIC CAP. CH D 3pF/50VCHD1JD3CH3R0
C11CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C12ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSL100
C13CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C14CHIP CERAMIC CAP. B K 0.01µF/50VCHD1JK30B103
C15ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSL100
C16ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSL100
C17CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C19CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C20ELECTROLYTIC CAP. 3.3µF/50V M H7CE1JMASSL3R3
C21CHIP CERAMIC CAP. F Z 0.1µF/50V orCHD1JZ30F104
0VSA13129
0VSA13077
Ref. No.DescriptionPart No.
CHIP CERAMIC CAP. F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/ 50VCHD1JZ3FZ104
C22ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSL100
C24ELECTROLYTIC CAP. 0.22µF/50V M H7 CE1JMASSLR22
1. There are two different, but interchangeable types of
CLEANER LEVER(B359) in this model, and have
different combination with B361. Please see Table 1
for details and combination.
Table 1 (B359 and B361 Combination)
B359 CLEANER LEVERB361
TypePart No.Part No.
A0VM3044130VM411114
B0VM305090Not used
2. There are two different types of RACK
ASSEMBLY(B555), and have different combination
with B514. Please see Table 2 for details and
combination.
Table 2 (B555 and B514 Combination)
Carved Seal on
Chassis
(see below)
TypePart No.Part No.
“1xx” or “2xx”A0VSA120710VM412597
“3xx” or “4xx”B0VSA128870VM411535
B555
RACK ASSEMBLY
B514
Carved Seal on Chassis
Top View
Ref. No.DescriptionPart No.
B2CYLINDER ASSEMBLY MK11 PAL 4HD HIFI orN1567CYL
CYLINDER ASSEMBLY(V) MK11 PAL 4HD HIFIN1569CYL
B3LOADING MOTOR ASSEMBLY MK110VSA12093
B8PULLEY ASSEMBLY MK110VSA12078
B9MOVING GUIDE S PREPARATION MK100VSA11002
B10MOVING GUIDE T PREPARATION MK100VSA11004
B11LOADING ARM T(B) ASSEMBLY MK110VSA12110
B12LOADING ARM S(B) ASSEMBLY MK110VSA12109
B27TENSION LEVER SUB ASSEMBLY MK110VSA12076A
B31AC HEAD ASSEMBLY MK110VSA12074
B35TAPE GUIDE ASSEMBLY MK110VSA12069
B37CAPSTAN MOTOR 288/VCCM011N9661CML
B52CAP BELT MK100VM411138
Ref. No.DescriptionPart No.
B73FE HEAD ASSEMBLY MK11 orN9742FEL
FE HEAD(MK11) MH-131SF11 orDHVEC01Z0005
FE HEAD ASSEMBLY MK11 orN9743FEL
FE HEAD(MK11) VTR-1X2ERS11-148DHVEC01TE004
B74PRISM MK100VM202870
B121WORM MK110VM412544
B126PULLEY MK110VM412543
B133IDLER ASSEMBLY(2) MK100VSA11531
B148TG CAP MK60VM407664C
B300C DRIVE LEVER R MK110VM305068
B303F DOOR OPENER MK110VM203299
B347GUIDE HOLDER A MK100VM304920
B354SLIDER R MK110VM101040
B355SLIDER L MK110VM203296
B359CLEANER LEVER MK10 or0VM304413
CLEANER LEVER MK110VM305090
B360CLEANER ROLLER MK90VM410032C
B361CL POST MK100VM411114
B410PINCH ARM(A) ASSEMBLY(Y) MK11 or0VSA12807
PINCH ARM(A) ASSEMBLY(M) MK11 or0VSA12808
PINCH ARM(A) ASSEMBLY(F) MK110VSA12809
B411PINCH SPRING MK100VM411092
B414M BRAKE S(HI) ASSEMBLY MK110VSA12225
B416M BRAKE T(HI) ASSEMBLY MK110VSA12226
B417TENSION SPG(190256) MK110VM413624
B425LOCK LEVER SPRING MK100VM411110
B426KICK PULLEY MK100VM411095
B482C PLATE MK110VM203297
B483LOCK LEVER MK100VM411109D
B487BAND BRAKE MK100VM304416B
B488MODE LEVER(HI) MK110VM101042L
B491CAM GEAR(A) MK110VM101044
B492MODE GEAR MK110VM305074
B494DOOR OPENER B MK110VM305072
B499T LEVER HOLDER MK100VM304419
B501WORM HOLDER MK110VM305067
B502CAM GEAR(B) MK100VM304403
B505PSCW(625504) MK110VM413288
B507REEL WASHER MK9 5*2.1*0.50VM410058
B508S BRAKE SPRING(19T) MK110VM413581
B513PSCW(752605) MK100VM411516
B514SCREW RACK MK11 or0VM412597
SCREW RACK MK100VM411535
B516REEL WASHER MK9 5*2.1*0.50VM410058
B518P.S.W CUT 1.6X4.0X0.5T0VM408485A
B520T BRAKE SPRING HI(F) MK110VM412778
B521SOFT SPRING MK100VM411122
B522TG POST ASSEMBLY MK100VSA11012
B525LDG BELT MK110VM412804
B529CLEANER ASSEMBLY MK110VSA12086
B551FF ARM(HI) MK100VM304438L
B553REV SPRING MK110VM412555
B555RACK ASSEMBLY MK11 or0VSA12071
RACK(T1.2) ASSEMBLY MK110VSA12887
B557MOTOR PULLEY U50VM403205A
B558LOADING MOTOR M31E-1 R14 7351MMDZB12MM002
B559CLUTCH ASSEMBLY(HI)(2) MK110VSA12367
200207173-4-1H9300DPL
Ref. No.DescriptionPart No.
B560KICK SPRING MK100VM411475A
B562C DRIVE LEVER L MK100VM304408
B563SLIDER SHAFT MK100VM411112
B564M GEAR(HYT) N12G5F*0VM412378
B565SENSOR GEAR MK110VM305080
B567PINCH ARM(B) MK100VM304396
B568BT ARM MK100VM304417H
B569CAM HOLDER F MK110VM305075
B570CAM RACK SPRING(HI) MK110VM412923
B571P.S.W F 6*2.55*0.50VM402629A
B572P.S.W CUT 1.6X4.0X0.5T0VM408485A
B573REEL S MK110VM203436
B574REEL T MK100VM202872C
B578TR GEAR A MK100VM304440
B579TR GEAR B MK100VM304441C
B580TR GEAR C MK110VM305094
B581CENTER GEAR(HYT) N12G5F* or0VM412379
CENTER GEAR MK110VM305081
B582TR GEAR SPRING MK100VM411187
B583REEL WASHER MK9 5*2.1*0.50VM410058
B584TR GEAR SHAFT MK100VM411186
B585PSW(317505) MK110VM413663
B587TENSION LEVER ASSEMBLY MK110VSA12075A
L1051SCREW, B-TIGHT M2.6X6 PAN HEAD+GPMB9060
L1053SCREW, S-TIGHT M2.6X8 WASHER HEAD+GCMS9080
L1151SCREW, SEMS M2.6X4 PAN HEAD+CPM39040
L1191SCREW, S-TIGHT M2.6X8 WASHER HEAD+GCMS9080
L1321SCREW, S-TIGHT M3X6 BIND HEAD+GBMS3060
L1341SCREW, P-TIGHT M2.6X6 BIND HEAD+GBMP9060
L1406AC HEAD SCREW MK90VM410964
L1450SCREW, SEMS M2.6X5 PAN HEAD+CPM39050
L1461SCREW, P-TIGHT M2.6X6 WASHER HEAD+GCMP9060
L1466SCREW, S-TIGHT M2.6X6 BIND HEAD+GBMS9060
L1467SCREW, S-TIGHT M2.6X5 WASHER HEAD+GCMS9050
L1468SCREW, B-TIGHT M1.7X12GAMB7120
200207173-4-2H9300DPL
DPVR-2600/DPVR-2700/DPVR-2605
H9300/06/20ED
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