I Specifications
I Preparation for Servicing
I Adjustment Procedures
I Schematic Diagrams
I CBA’s
I Exploded views
I Parts List
Sec. 2: Deck Mechanism Section
I Standard Maintenance
I Alignment for Mechanism
I Disassembly/Assembly of Mechanism
I Alignment Procedures of Mechanism
I Deck Exploded Views
I Deck Parts List
DVD PLAYER &
VIDEO CASSETTE RECORDER
DDVR-5505V
DDVR-5805
PAL
Page 2
MAIN SECTION
DVD PLAYER &
VIDEO CASSETTE RECORDER
DDVR-5505V/DDVR-5805
Sec. 1: Main Section
I Specifications
I Preparation for Servicing
I Adjustment Procedures
I Schematic Diagrams
I CBA’s
I Exploded Views
I Par ts L ist
Note: Nominal specs represent the design specs. All units should be able to approximate these – some will exceed
and some may drop sli ghtly below these spec s. Limit spec s repre sent the absolute wors t conditio n that still m ight
be considered acceptable; In no case should a unit fail to meet limit specs.
1. All Items are measured without pre-emphasis unless otherwise specified.
2. Power supply : 220 - 240 V ~ 50 Hz
3. Load imp. : 100 k ohm
4. Ambient temperature : 5
°C ~ 40 °C
1-1-2H9779SP
Page 5
LASER BEAM SAFETY PRECAUTIONS
This DVD player uses a pickup that emits a laser beam.
Do not look directly at the l aser beam coming
from the pickup or allo w it t o str ike agai nst your
skin.
The laser beam i s emitted from t he location shown in th e figure. When checking th e laser diode, be s ure to keep
your eyes at least 30cm away from the pickup lens when the diode is t urned on. D o not look direct ly at the laser
beam.
Caution: Use of controls a nd adjustments, or doing proc edures other than thos e specified herein, m ay result in
hazardous radiation exposure.
Drive Mecha Assembly
Laser Beam Radiation
Laser Pickup
Turntable
1-2-1E5P_LASER
Page 6
IMPORTANT SAFETY PRECAUTIONS
Product Safe ty Notice
Some electrical and mechanical parts have special
safety-related characteristi cs which are often not evident from visual inspection, nor can the protection they
give necessarily be obtained by replacing them with
components rated for higher voltage, wattage, etc.
Parts that have special safety characteri stic s are ide ntified by a ! on schematics and in parts lists. Use of a
substitute replacement that does not have the same
safety characteristics as the recommended replacement part might create shock, fire, and/or other haz ards. The Product’s Safety is under review
continuously and new instructions are issued whenever appropriate. Prior to shipment from the factory,
our products are carefully inspected to confirm with
the recognized produ ct safety and electrical co des of
the countries in whi ch they are to be sold. H owever, in
order to maintain su ch com plian ce, it is eq ual ly im portant to implement the following precautions when a set
is being serviced.
Precautions during Servicing
A. Parts identified by the ! symbol are critical for
safety. Replace only with part number specified.
B. In addition to safety, other parts and assemblies
are specified for conformance with regulations
applying to sp uriou s radiation . These must al so be
replaced only with specified replacements.
Examples: RF converters, RF cables, noise blocking capacitors, and noise blocking filters, etc.
C. Use specified internal wiring. Note especially:
1)Wires covered with PVC tubing
2)Double insulated wires
3)High voltage leads
D. Use specified insulating materials for hazardous
live parts. Note especially:
1)Insulation tape
2)PVC tubing
3)Spacers
4)Insulators for transistors
E. When replacing AC primary side components
(transformers, power cord, etc.), wrap ends of
wires securely about the terminals before soldering.
F. Observe that the wi res do no t c ont act he at p ro duc-
ing par ts (heat sink s, oxide metal film resi stors, fusible resistors, etc.).
G. Check that replaced wires do not contact sharp
edges or pointed parts.
H. When a power cord has b een replac ed, che ck that
5 - 6 kg of force in an y direction will not loosen it.
I. Also check areas surroundin g repa ired loc at ion s.
J. Be careful that foreign objects (screws, solder
droplets, etc.) do not remain inside the set.
K. Crimp type wire connector
The power transformer uses crimp type connectors
which connect the power cord and the primary side
of the transformer. When replacing the transformer,
follow these steps carefully and precisely to prevent
shock hazards.
Replacement procedure
1)Remove the old connector by cutting the wires at a
point close to the connector.
Important: Do not re-use a connector. (Discard it.)
2)Strip about 15 mm of the insulat ion from the ends
of the wires. If the wires are stranded, twist the
strands to avoid frayed conductors.
3)Align the lengths of the wires to be connected.
Insert the wires fully into the connector.
4)Use a crimping tool to crimp the metal sleeve at its
center. Be sure to crimp fully to the complete closure of the tool.
L. When connecting or disconnecting the internal
connectors, first, di sconnect the AC plug from the
AC outlet.
1-3-1DVD_SFNP
Page 7
Safety Check after Servicing
Examine the area surrounding the repaired location for
damage or deter ioration. Observe that screws, par ts,
and wires have been returned to their original positions. Afterwards, do the following tests and confirm
the specified values to verify compliance with safety
standards.
1. Clearance Distance
When replacing primary circuit components, confirm
specified clearanc e distance (d) and (d’) between soldered terminals, and between terminals and surrounding metallic parts. (See Fig. 1)
Table 1 : Ratings for selected area
AC Line VoltageClearance Distance (d), (d’)
220 to 240 V
Note: This table is unofficial and for reference only.
Be sure to confirm the precise values.
≥3 mm(d)
≥6 mm(d’)
2. Leakage Current Test
Confirm the specified (or lower) leakage current
between B (earth ground, power cord plug prongs)
and externally exposed accessible parts (RF terminals, antenna terminals, video and audio input and
output terminals, microphone jacks, earphone jacks,
etc.) is lower than or equal to the specified value in the
table below.
Measuring Method (Power ON) :
Insert load Z between B (earth ground, power cord
plug prongs) and exposed accessible parts. Use an
AC voltmeter to measure across the ter minals of load
Z. See Fig. 2 and the following table.
Chassis or Secondary Conductor
Primary Circuit Terminals
dd'
Exposed Accessible Part
Z
One side of
B
Power Cord Plug Prongs
AC Voltmeter
(High Impedance)
Fig. 1
Fig. 2
Table 2: Leakage current ratings for selected areas
AC Line VoltageLoad ZLeakage Current (i)
2kΩ RES.
Connected in
220 to 240 V
Note: This table is unofficial and for reference only. Be sure to confirm the precise values.
parallel
50kΩ RES.
Connected in
parallel
i≤0.7mA AC Peak
i≤2mA DC
i≤0.7mA AC Peak
i≤2mA DC
1-3-2DVD_SFNP
One side of power cord plug
prongs (B) to:
RF or
Antenna terminals
A/V Input, Output
Page 8
STANDARD NOTES FOR SERVICING
Circuit Board Indications
1. The output pin of th e 3 pin Regulator ICs is indicated as sho wn.
Top View
Input
Out
2. For other ICs, pin 1 and every fifth pin are indicated
as shown.
In
Pin 1
3. The 1st pin of every male connector is i nd icated as
shown.
Bottom View
5
10
Pb (Lead) Free Solder
When soldering, be sure to use the Pb free solder.
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:.
(1)Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
Fig. S-1-1
Pin 1
Instructions for Connectors
1. When you con nect or discon nect the FF C (Flexible
Foil Connector) cable, be sure to first disconnect
the AC cord.
2. FFC (Flexible Foil Connector) cable should be
inserted parallel into the connector, not at an angle.
FFC Cable
Connector
CBA
(2) Remove the flat pack-IC with tweezers while apply-
ing the hot air.
(3) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iro n to c ent er of the fla t pa ck-IC and he at
up. Then remove (glue will be melted). (Fig. S-1-6)
(4) Release the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
Caution:
1. The Flat Pack-IC shape may differ by models. Use
an appropriate hot-air flat pack-IC desoldering
machine, whose shape matches that of the Flat
Pack-IC.
2. Do not supply hot air to the chip parts a round the
flat pack-IC for over 6 seconds because damage to
the chip parts may occur. Put masking tape around
the flat pack-IC to protect other parts from damage.
(Fig. S-1-2)
* Be careful to avoid a short circuit.
1-4-1DVD_NOTE
Page 9
3. The flat pack-IC on the CBA is affixed with glue, so
be careful not to brea k or damage the foil of each
pin or the solder lands under the IC when removing
it.
Hot-air
Flat Pack-IC
Desoldering
Machine
CBA
With Soldering Iron:
(1) Using desoldering braid, remove the solder from all
pins of the flat pack-IC. When you use solder flux
which is applied to all pins of the flat pack-IC, you
can remove it easily. (Fig. S-1-3)
Flat Pack-IC
Desoldering Braid
Masking
Tape
Tweezers
Flat Pack-IC
Fig. S-1-2
Soldering Iron
Fig. S-1-3
(2) Lift each lead of the flat pack-IC upward one by
one, using a shar p pin or wire to which solde r will
not adhere (iron wire). When heatin g the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Sharp
Pin
Fine Tip
Soldering Iron
Fig. S-1-4
(3) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iro n to c ent er of the fla t pa ck-IC and he at
up. Then remove (glue will be melted). (Fig. S-1-6)
(4) Release the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
With Iron Wire:
(1) Using desoldering braid, remove the solder from all
pins of the flat pack-IC. When you use solder flux
which is applied to all pins of the flat pack-IC, you
can remove it easily. (Fig. S-1-3)
(2) Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
(3) While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the sol der
melts so as to lift the IC leads from the CBA contact
pads as shown in Fig. S-1-5
1-4-2DVD_NOTE
Page 10
(4)B ottom of the flat pack-IC is fixed with glue to the
P
CBA; when removing entire flat pack-IC, first apply
soldering iron to ce nter of the flat pack-IC and hea t
up. Then remove (glue will be melted). (Fig. S-1-6)
(5)R elease the flat pack-IC from the CB A using twee-
zers. (Fig. S-1-6)
Note:
When using a solder ing iron, care must be taken
to ensure that the flat pack-IC is not bei ng held by
glue. When the flat pack-IC is removed from the
CBA, handle it gently beca use it may be damaged
if force is applied.
2. Installation
(1) Using desoldering braid, remove the solder from
the foil of each pin of the flat pack-IC on the CBA so
you can install a replacement flat pack-IC more
easily.
(2) The “I” mark on the flat pack-IC in dicates pin 1.
(See Fig. S-1-7.) Be sure this ma rk matche s the 1
on the PCB when positio ning for installation. Then
presolder the four cor ners of t he flat pack-IC. (See
Fig. S-1-8.)
(3) Solder all pins of the flat pack-IC. Be sure that none
of the pins have solder bridges.
To Solid
Mounting Point
CBA
Hot Air Blower
Iron Wire
Soldering Iron
Fig. S-1-5
Fine Tip
Soldering Iron
Example :
or
in 1 of the Flat Pack-IC
s indicated by a " " mark.
Fig. S-1-7
Presolder
Flat Pack-IC
CBA
Fig. S-1-8
Flat Pack-IC
Tweezers
Fig. S-1-6
1-4-3DVD_NOTE
Page 11
Instructions for Handling
Semi-conductors
Electrostatic breakdown of the semi-conductors may
occur due to a potential di fference caused by electrostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a groun ding band (1M Ω) that is properly grounded to re move any static electr ici ty that may
be charged on the body.
2. Ground for Workbench
(1)Be sure to place a conductive sheet or copper plate
with proper grounding (1MΩ) on the workbench or
other surface, where the semi-conductors are to be
placed. Because the static electricity charge on
clothing will not escape thr ough the body grounding band, be careful t o avoid contacting semi-conductors with your clothing.
< Incorrect >
< Correct >
1MΩ
CBA
Grounding Band
1MΩ
CBA
Conductive Sheet or
Copper Plate
1-4-4DVD_NOTE
Page 12
PREPARATION FOR SERVICING
How to Enter the Service Mode
About Optical Sensors
Caution:
An optical sensor system is used for the Tape Start
and End Sensors on this equip ment. Carefully read
and follow the instructions below. Otherwise the unit
may operate erratically.
What to do for preparation
Insert a ta pe into the Deck Mecha nism Assembly and
press the PLAY button. The tape will be loaded into
the Deck Mechanism Asse mbly. Make sure the power
is on, connect TP501 (S -INH) to GND. This will stop
the function of Tape Start Sensor, Tape End Sensor
and Reel Sensors. (If these TPs are conn ected before
plugging in the unit, the function of the sensors will
stay valid.) See Fig. 1.
Note: Because the Tape En d S ensor s a re inac ti ve, do
not run a tape all the way to the star t or the end of the
tape to avoid tape damage.
Q503
TP501 S-INH
Q504
Fig. 1
1-5-1H9700PFS
Page 13
CABINET DISASSEMBLY INSTRUCTIONS
1. Disassembly Flowchart
This flowchar t i ndica tes th e dis assembly steps to g ain
access to item(s) to be serviced. When reassembling,
follow the steps in reverse order. Bend, route, and
dress the cables as they were originally.
[1] T op Case
[2] Front Assembly
[3] T op Bracket
[4] DVD Mecha Assembly[8] DVD Main CBA
[5] Partition Plate
[6] Power Supply CBA
[7] Loader Holder
[9] VCR Chassis Unit
[10] Deck Assembly
[11] DVD Open/Close CBA
[12] Power SW CBA
[13] Main CBA
[14] Jack-A CBA
REMOVAL
ID/
LOC.
No.
[7]
[8]
[9]
[10]
[11]
[12]
[13]Main CBA D6-----------
[14]
PART
Loader
Holder
DVD Main
CBA
VCR
Chassis
Unit
Deck
Assembly
DVD
Open/
Close
CBA
Power SW
CBA
Jack-A
CBA
REMOVE/*UNHOOK/
Fig.
UNLOCK/RELEASE/
No.
UNPLUG/DESOLDER
D32(S-6)-
2(S-7), *CN201,
D4
*CN301
5(S-8), 2(S-9),
D5
2(S-10), (L-3)
Desolder,
D6
2(S-11), (S-12)
D6Desolder-
D6Desolder-
D6Desolder, 2(S-13)-
Note
2
2-1
2-2
3
-
4,5
2. Disassembly Method
REMOVAL
ID/
LOC.
No.
[1]Top CaseD18(S-1)-
[2]
[3]
[4]
[5]
[6]
PART
Front
Assembly
Top
Bracket
DVD
Mecha
Assembly
Partition
Plate
Power
Suppy
CBA
REMOVE/*UNHOOK/
Fig.
UNLOCK/RELEASE/
No.
UNPLUG/DESOLDER
D2*3(L-1), *3(L-2)
D23(S-2)-
4(S-3), *CN401,
D3
*CN601
D3(S-4)-
D32(S-5), CN501-
Note
1
1-1
1-2
-
↓
(1)
Note:
(1): Identification (location) No. of parts in the figures
(2): Name of the part
(3): Figure Number for reference
(4): Identification of parts to be removed, unhooked,
unlocked, released, unplugged, unclamped, or
desoldered.
P=Spring, L=Locking Tab, S=Screw,
CN=Connector
*=Unhook, Unlock, Release, Unplug, or Desolder
e.g. 2(S-2) = two Screws (S-2),
2(L-2) = two Locking Tabs (L-2)
(5): Refer to “Reference Notes.”
↓
(2)
↓
(3)
↓
(4)
↓
(5)
1-6-1H9773DC
Page 14
Reference Notes
CAUTION 1: Locking Tabs (L-1) and (L-2) are fragil e.
Be careful not to break them.
1-1. Release three Locking Tabs (L-1).
1-2. Release three Locking Tabs (L-2), then remove
the Front Assembly.
CAUTION 2: Electrostatic breakdown of the laser
diode in the optical system block may occur as a
potential difference caused by electrostatic charge
accumulated on cloth, human body etc, during
unpacking or repair work.
To avoid damage of pickup follow next procedures.
2-1. Disconnect Connector (CN301). Remove two
Screws (S-7) and lift the DVD Main CBA Unit.
(Fig. D4)
2-2. Short the three short lands of FPC cable with sol-
der before removing the FFC cable (CN201) from
it. If you disconnect the FFC cable (CN201), the
laser diode of pickup will be destroyed. (Fig. D4)
CAUTION 3: When reassembling, confirm the FFC
cable (CN201) is conn ected compl etely. Then remove
the solder from the three short lands of FPC cable.
(Fig. D4)
4. When reas se mbling, solder wi re jum per s as shown
in Fig. D6.
5. Before installing the Deck Assembly, be sure to
place the pin of LD-S W on Main CBA as shown in
Fig. D6. Then, install the Deck Assembly while
aligning the hole of C am Gear with the pin of LDSW, the shaft of Cam Gear with the hole of LD-SW
as shown in Fig. D6.
(S-1)
(L-1)
(S-1)
[1] T op Case
(S-1)
(S-1)
Fig. D1
(S-2)
[3] T op Blacket
(S-2)
(L-2)
(L-1)
[2] Front
Assembly
Fig. D2
1-6-2H9773DC
Page 15
[4] DVD Mecha
Assembly
[5] Partition Plate
(S-6)
[7] Loader
Holder
(S-3)
CN501
CN401
CN601
(S-4)
[6] Power
Supply CBA
(S-3)
(S-5)
(S-3)
(S-10)
(S-8)
(S-8)
(S-10)
(S-9)
(S-8)
(S-9)
[9] VCR Chassis Unit
(L-3)
(S-7)
[8] DVD Main CBA
CN301
DVD Mecha
Short the three short lands by soldering.
(Either of two places.)
Fig. D5
Fig. D3
(S-7)
A
CN201
Connector
View for A
Fig. D4
1-6-3H9773DC
Page 16
[10] Deck
Assembly
FE Head
Cylinder
Assembly
ACE Head
Assembly
Pin
Lead with blue stripe
Desolder
[12] Power
SW CBA
[13] Main CBA
[11] DVD
Open/Close CBA
(S-11)
Lead with blue stripe
[14] Jack-A CBA
(S-11)
(S-13)
Desolder
from bottom
(S-12)
Desolder
Lead with
blue stripe
From
ACE Head
Assembly
Lead with
blue stripe
[13] Main CBA
[10] Deck Assembly
Shaft
Hole
LD-SW
From
Cylinder
Lead with
blue stripe
Assembly
Desolder
From
FE Head
SW507
LD-SW
Cam Gear
Hole
Pin
[13] Main CBA
Lead with
red stripe
Desolder
Printing side
From
Capstan
Motor
Assembly
Desolder
BOTT OM VIEW
Lead connections of Deck Assembly and Main CBA
Fig. D6
1-6-4H9773DC
Page 17
HO W TO EJECT MANUALLY
1. Remove the Top Case.
2. Rotate the roulette in the direction of the arrow as
shown below.
3. Pull the tray slowly with a hand.
View for A
Rotate this roulette in
the direction of the arrow
DVD Mecha
A
1-6-5H9773DC
Page 18
ELECTRICAL ADJUSTMENT INSTRUCTIONS
General Note: "CBA" is an abbreviation for
"Circuit Board Assembly."
NOTE:
1.Electrica l adjustments are requi red after repl acing
circuit componen ts and certain me chanical parts.
It is impor tant to do these adjustments on ly after
all repairs and replacements have been completed. Also, do not attempt these adjustments
unless the proper equipment is available.
2.To pe rfor m these alignment / confir mation proce-
dures, make sure that the tracking contro l is set in
the center position: P res s e ithe r "CHANNE L L5??" or
"CHANNEL K" button on the front panel first, then
the "PLAY" b utton on the front panel.
Test Equipment Required
1.Oscilloscope: Dual-trace with 10:1 probe,
V-Range: 0.001~50V/Div.,
F-Range: DC~AC-20MHz
2.Alignment Tape (FL6A)
Head Switching Position Adjustment
Figure 1
EXT. Syncronize Trigger Point
CH1
CH2
Reference Notes:
Playback the Alignment tape and adjust VR501 so that
the V-sync front edge of the CH1 vi deo output waveform is at the 6.5H ±1H (416µs±64µs) delayed position
from the rising ed ge of the CH2 h ead switching pulse
waveform.
1.0H
6.5H±1H (416µs±64µs)
Switching Pulse
0.5H
V-Sync
Purpose:
To deter mine the Head Switching posit ion during
playback.
Symptom of Misadjustment:
May cause Head Switching nois e or vertic al jitter
in the picture.
Test pointAdj.PointModeInput
TP751(V-OUT)
TP504(RF-SW)
GND
Tape
FL6AOscilloscope
Connections of Measurement Equipment
Main CBA
VR501
(Switching Point)
(MAIN CBA)
Measurement
Equipment
TP751
GND
TP504
PLAY
(SP)
Spec.
6.5H±1H
(416µs±64µs)
Oscilloscope
-----
CH1 CH2
Trig. (+)
1-7-1H9700EA
Page 19
FIRMWARE RENEWAL MODE
1. Turn the power on and remove the disc on the tray.
2. To put the DVD player into version up mode, press
[9], [8], [7], [6], and [SEARCH MODE] buttons on
the remote contro l unit in that order. The tray will
open automatically.
Fig. a appears on the screen and Fig. b appears on
the VFD.
"
" differ depending on the models.
*******
F/W Version Up ModeModel No : *******
Please insert a DISC
for F/W Version Up.
VERSION : *.**
EXIT: POWER
Fig. a Version Up Mode Screen
Fig. b VFD in Version Up Mode
The DVD player can also enter the version up
mode with the tray open. In this case, Fig. a wil l be
shown on the screen while the tray is open.
3. Load the disc for version up.
4. The DVD player enters the F/W version up m ode
automatically. Fig. c appears on the screen and
Fig. d appears on the VFD. If you enter the F/W for
different models, “Disc Error” will appear on the
screen, then the tray will open automatically.
"
" differ depending on the models.
*******
F/W Version Up ModeModel No : *******
VERSION : D5****_****.ab5
Reading...(*1)
VERSION : *.**
5. After programm ing is finis hed, th e tray opens automatically. Fig. e appears on the screen and the
checksum in (*2) of Fig. e appears on the VFD.
(Fig. f)
"
" differ depending on the models.
*******
F/W Version Up Mode
VERSION : D5****_****.ab5
Completed
SUM : 7ABC (*2)
Model No : *******
VERSION : *.**
Fig. e Completed Program Mode Screen
Fig. f VFD upon Finishing the Programming Mode (Example)
At this time, no buttons are available.
6. Remove the disc on the tray.
7. Unplug the AC cord from the AC outlet. Then plug it
again.
8. Turn the power on by pressing the [FUNCTION]
button and the tray will close.
9. Press [1], [2], [3], [4], and [DISPLAY] buttons on the
remote control unit in that order.
Fig. g appears on the screen.
"
" differ depending on the models.
*******
MODEL : *******
Version
Region
: *.**
: *
Fig. c Programming Mode Screen
Fig. d VFD in Programming Mode (Example)
The appearance shown in (*1) of Fig. c is
described as follows:
AppearanceNo.State
Reading...Sending files into the memory
1
Erasing...Erasing previous version data
2
Programming...
3Writing new version data
EXIT: POWEREEPROM CLEAR : CLEAR
Fig. g
10.Press [CLEAR] button on the remote control unit.
Fig. h appears on the screen.
"
" differ depending on the models.
*******
MODEL : *******
Version
Region
: *.**
: *
EXIT: POWEREEPROM CLEAR : CLEAR
EEPROM CLEAR : OK
Fig. h
When “OK” appears on the screen, the factory
default will be set. Then the firmware renewal mode
is complete.
11.To exit this mode, press [FUNCTION] button.
1-8-1H9700TEST
Page 20
BLOCK DIAGRAMS <VCR SECTION>
Servo/System Control Block Diagram
A
B
AL+5V
ModelMark
DDVR-5505V
Comparison Chart of
DDVR-5805
Models & Marks
POWER
D651
POWER
SW651
POWER SW CBA
CN508
POWER-LED
11KEY-1
33
CN509
KEY SWITCH
KEY SWITCH
7
8
KEY- 1
KEY- 2
A
CTL(+)
CTL(-)
LD-SW
9
949510480
TIMER
D501
Q502
25
TIMER-LED
ST-S
TP501
SENS-INH
IC501
(SERVO/SYSTEM CONTROL)
D504 REC
Q511
END-S
26
REC-LED
T-REEL
S-REEL
79
IC502 (MEMORY)
DVD
D502
Q508
Q507
23
POWER-LED
RESET
34
SDA
SCL
5
6
VCR
D503
Q509
29
DVD-LED
TO AUDIO
BLOCK DIAGRAM
A-MUTE-H
IIC-BUS SCL
IIC-BUS SDA
AL+5V
30
VCR-LED
B
REMOTE-VIDEO
DRV-DATA
DRV-CLK
14
68
70
IIC-BUS SCL
IIC-BUS SDA
83
A-MUTE-H
DRV-STB
69
TO Hi-Fi AUDIO
BLOCK DIAGRAM
A-MODE
Hi-Fi-H-SW
LINE-MUTE
OUTPUT SELECT
32
19
28
A-MODE
Hi-Fi-H-SW
LINE-MUTE
B
TO AUDIO
BLOCK DIAGRAM
FRONT-AV
AUDIO-SW1
AUDIO-SW2
OUTPUT SELECT
62
63
AUDIO-SW1
AUDIO-SW2
A
CTL
PG-DELAY
2
97
IIC-BUS SDA
20
72
FRONT-AV
IIC-BUS SDA
REC-SAF-SW
31
RF-SW
C-ROTA
D-REC-H
IIC-BUS SCL
71
18
33
RF-SW
D-REC-H
IIC-BUS SCL
TO VIDEO
BLOCK DIAGRAM
H-A-SW
D-V-SYNC
H-A-COMP
13
15
16
H-A-SW
C-ROTA
D-V-SYNC
H-A-COMP
C-FG
87
V-ENV
C-SYNC
OUTPUT-SELECT
6
58
17
82
V-ENV
C-SYNC
OUTPUT-SELECT
LM-FWD/REV
C-CONT
C-F/R
76
81
78
TO DVD SYSTEM
CONTROL BLOCK
B
INPUT-SELECT
OUTPUT-SELECT
41
INPUT-SELECT
D-CONT
D-PFG
77
90
DIAGRAM
<DVD SECTION>
DVD-POWER
21
DVD-POWER
P-ON-H
C-POW-SW
67
66
P-DOWN-L
86
MAIN CBA
AL+5V
LD-SW
SW507
CN504
CL504
5 CTL(+)
AC HEAD
ASSEMBLY
CONTROL
(DECK ASSEMBLY)
6 CTL(-)
HEAD
AL+5V
TP502
Q515
PS502
Q506
END-S
RESET
TIMER+5V
S-REEL
T-REEL
S-LED
D555
REMOTE-VIDEO
ST-S
Q504
DISPLAY-DATA
DISPLAY-STB
DISPLAY-CLK
TO DVD SYSTEM
CONTROL BLOCK
DIAGRAM
<DVD SECTION>
Q503
SENSOR CBA
END-S
CTL
TP503
AL+5V
VR501
SENSOR CBA
AL+5V
SW-POINT
SW506
REC-SAFETY
P-ON+5V
AL+20.5V/+12V
CN502
AL+20.5V/+12V
P-ON+5V3C-FG4C-F/R5C-CONT6GND7LM-FWD/REV
1
2
M
CAPSTAN MOTOR
CAPSTAN
PG
SENSOR
CYLINDER ASSEMBLY
MOTOR
M
DRUM
MOTOR
AL+12V(2)
P-ON+15V
C-POW-SW
D-CONT9D-PFG10GND11AL+12V(2)12P-ON+15V
8
M
LOADING
MOTOR
P-ON-H
P-DOWN-L
TO POWER
SUPPLY BLOCK
DIAGRAM
1-9-1
H9779BLS
Page 21
Video Block Diagram
A
B
ModelMark
DDVR-5505V
Comparison Chart of
DDVR-5805
Models & Marks
MODE: SP/RECPB-VIDEO SIGNAL DVD VIDEO SIGNAL
MAIN CBA
VIDEO (L)-1
HEAD
VIDEO (R)-1
HEAD
CYLINDER ASSEMBLY
(DECK ASSEMBLY)
123
456
V(L)-1
V(L)-2
CN251
V(R)-1
V-COM
VIDEO (R)-2
VIDEO (L)-2
HEAD
V(R)-2
V-COM
HEAD
WF1
TP504
RF-SW
RF-SW
D-REC-H
C-ROTA
TO SERVO/SYSTEM
CONTROL BLOCK
DIAGRAM
V-ENV
H-A-SW
C-SYNC
D-V-SYNC
H-A-COMP
REC-VIDEO SIGNAL
TO SERVO/SYSTEM
CONTROL BLOCK
DIAGRAM
IIC-BUS SCL
IIC-BUS SDA
IC501 (OSD)
55
50
COLOR
-IN
OSD
CHARACTER
MIX
52
7978
Y. DELAY
4643
6968
SERIAL
DECORDER
65
IC301
(Y/C SIGNAL PROCESS)
969594
SP
HEAD
AMP
EP
SP
P
R
LUMINANCE
SIGNAL
PROCESS
AGC
BYPASS
IN1
IN2
TUNER
485052
93
FRT
908988
87
EP
HEAD
AMP
REC FM
+
Y
CCD 1H DELAY
CHARA.
INS.
IN2
FRT
MUTE
PB/EE
TUNER
56
54
AGC
C
1/2
IN1
80
D-REC-H
PB/EE
62
70
D-V-SYNC
RF-SW/C-ROTA
CHROMINANCE
SIGNAL
FBC
MUTE
83
71
H-A-SW
H-A-COMP
RPRP
PROCESS
67
84
V-ENV
C-SYNC
Y/C
PR
MIX
21
2928
AGCVXO
5859
61
63
WF2
C-PB
TP301
X301
4.43MHz
3
5
DVD
VCR
IC751
(OUTPUT SELECT)
4
TO SERVO/SYSTEM
CONTROL BLOCK DIAGRAM
OUTPUT-SELECT
11109
SW CTL
6
24
VIDEO
TU-VIDEO
(TUNER UNIT)
TU701
A
J901
4
5
3
(INPUT SELECT)
IC1404
JK752
V-IN
FRONT
SW CTL
B
9
TO
1-9-2
INPUT-SELECT
DVD-VIDEO
SERVO/SYSTEM
CONTROL BLOCK
DIAGRAM
TO DVD
VIDEO/AUDIO
BLOCK DIAGRAM
JK101
19
20
V-OUT1
V-IN1
<DVD SECTION>
8
CN2017
V-OUT2
8
CN2018
BUFFER
JK1402
19
V-OUT2
V-I N2
1010
Q103
20
V-IN2
BUFFER
Q104
JACK-A CBA
WF3
V-OUT
TP751
H9779BLV
Page 22
Audio Block Diagram ( A )
A
B
TO SERVO/ SYSTEM
CONTROL BLOCK
SW
AUDIO-SW-1
9
CTL
DIAGRAM
AUDIO-SW-2
OUTPUT-SELECT
ModelMark
DDVR-5505V
Comparison Chart of
DDVR-5805
Models & Marks
Mode : SP/REC
DVD AUDIO SIGNAL
152
PB/EE
PB/EE
PB/EEPBTUNER
AUDIO IN
AUDIO OUT
TU701(TUNER UNIT)
2
21
4
1214151110
IN2
IN1
IN1
ALC
TO SERVO/SYSTEM
CONTROL BLOCK
11
12
SERIAL
DECODER
AUDIO HD-SW
CONTROL
71
68 69
16
DET
MUTE
LINE
ALC
R
AMP
ATT
REC-ON
P
REC
AMP
DIAGRAM
A-MUTE-H
IIC-BUS SCL
IIC-BUS SDA
IC151 (SWITCHING)
3
PB-AUDIO SIGNALREC-AUDIO SIGNAL
BUFFER
Q156
JK1-A-
OUT(L)
TP401
MAIN CBA
55
11
CN2017CN2018
13
BUFFER
Q157
12
13
VCR
DVD
IC751
(OUTPUT SELECT)
14
TO DVD VIDEO/AUDIO
BLOCK DIAGRAM
<DVD SECTION>
DVD-A-OUT(L)
DVD-A-OUT(R)
9
2
1
11
10
VCR
DVD
SW
CTL
15
Q107Q108
BUFFER
IC301
(AUDIO SIGNAL PROCESS)
TUNER
IN1
15
13
(INPUT SELECT)
IC1404
INV
98
7
EQ
AMP
SP/LP-ON
PB-ON
IN2
5
6
17
Q754
Q753
14
11
SW CTL
12
13
+5V
AUTO
1
Q404
CN504
100
3
BIAS
2
Q406
BIAS
Q403
4 A-PB/REC
3 A-COM
1 AE-H
OSC
2 AE-H/FE-H
+5V
SWITCHING
D-REC-OFF
Q405
CN501
2 FE-H
1 FE-H-GND
Q401
(PB=ON)
A-IN2
JACK-A CBA
JK1402
261
A-IN2(R)
A-IN2(L)
A-OUT2
3
A-OUT2(R)
A-OUT2(L)
JK101
261
3
A-IN1(R)
A-OUT1(R)
A-OUT1(L)
A-IN1(L)
BUFFER
JK751
A-OUT(R)
REAR
A-OUT(L)
1-9-3
JK754
A-IN
FRONT
FRONT-AV
A-MUTE(L)
A-MUTE(R)
TO SERVO/SYSTEM
CONTROL BLOCK
DIAGRAM
TO DVD VIDEO/AUDIO
BLOCK DIAGRAM
<DVD SECTION>
AC HEAD ASSEMBLY
AUDIO
HEAD
AUDIO
(DECK ASSEMBLY)
ERASE
HEAD
FE HEAD
FULL
ERASE
HEAD
H9779BLA
Page 23
Audio Block Diagram ( B )
A
B
ModelMark
DDVR-5505V
Comparison Chart of
DDVR-5805
Models & Marks
Mode : SP/REC
PB-AUDIO SIGNALREC-AUDIO SIGNAL
TO SERVO/SYSTEM
CONTROL BLOCK
11
12
SERIAL
DECODER
AUDIO HD-SW
CONTROL
71
68 69
16
MUTE
LINE
AMP
ALC
ALC
DET
IN1
151317
TUNERIN2
INV
P
R
ATT
98
REC-ON
REC
AMP
100
7
3
DIAGRAM
A-MUTE-H
IIC-BUS SCL
IIC-BUS SDA
MAIN CBA
IC301
(AUDIO SIGNAL PROCESS)
N-A-PB
N-A-REC
TO Hi-Fi AUDIO
BLOCK DIGRAM
EQ
PB-ON
5
AMP
6
SP/LP-ON
+5V
AUTO
BIAS
2
Q404
CN504
BIAS
Q403
4 A-PB/REC
3 A-COM
1 AE-H
1
Q406
OSC
2 AE-H/FE-H
+5V
SWITCHING
D-REC-OFF
Q405
CN501
2 FE-H
Q401
(PB=ON)
1 FE-H-GND
FE HEAD
AC HEAD ASSEMBLY
AUDI O
HEAD
AUDI O
ERASE
HEAD
FULL
ERASE
HEAD
1-9-4
(DECK ASSEMBLY)
H97H0BLA
Page 24
Hi-Fi Audio Block Diagram ( B )
A
B
TO
SERVO/ SYSTEM
CONTROL BLOCK
DIAGRAM
TO DVD AUDIO
BLOCK DIAGRAM
ModelMark
DDVR-5505V
Comparison Chart of
DDVR-5805
Models & Marks
OUTPUT-SELECT
<DVD SECTION>
DVD-A-OUT(L)
DVD-A-OUT(R)
IIC-BUS SDA
IIC-BUS SCL
A-MODE
TO
SERVO/ SYSTEM
CONTROL BLOCK
DIAGRAM
Hi-Fi-H-SW
LINE-MUTE
Hi-Fi
AUDIO
(R)
HEAD
CYLINDER
ASSEMBLY
(DECK ASSEMBLY)
A(L) 9
A(R) 7
-COM 8
CN251
Hi-Fi-
Hi-Fi-
Hi-Fi
Hi-Fi
AUDIO
(L)
HEAD
TP401
JK1-A-OUT(L)
12
13
VCR
DVD
DVD AUDIO SIGNAL
IC751
(OUTPUT SELECT)
14
REC-AUDIO SIGNALPB-AUDIO SIGNALMode : SP/REC
MAIN CBA
VCR
2
1
DVD
15
Q107
11109
SW CTL
Q108
BUFFER
BUFFER
TO DVD VIDEO/AUDIO
BLOCK DIAGRAM
<DVD SECTION>
A-MUTE(L)
A-MUTE(R)
Q451
37
SERIAL
DATA
R-CH
BPF
COMP
SW
NOISE
SW
ALC
ALC
SW
IC451 (MTS/ SAP/ Hi-Fi AUDIO PROCESS/ Hi-Fi HEAD AMP)
67
65
38
DECODER
P
R
R-CH
PNR
6270
6171
ENV
DO
21
DET
MUTE-ON
DET
LPF
VCO
LIMDEV
47
48
R-CH
52
56
767774
OUTPUT
INSEL
50
54
MUTE-ON
SELECT
60
58
73
39
75
HOLD
PULSE
2
6104
53
L-CH
26
COMP
MIX
NOISE
14
INSEL
8
DET
15
24
27
R
L
34 33
LIM
L-CH
R
L-CH
P
PNR
NOR
SW
SW
BPF
COMP
NOISE
78
80
LPF
VCO
LIMDEV
12
5
4
CN2017CN2018
A-IN2(R)
A-IN2(L)
5
4
JACK-A CBA
JK1402
2
6
A-IN2(R)
A-IN2(L)
2
1
A-OUT2(R)
A-OUT2(L)
2
1
1
3
A-OUT2(R)
A-OUT2(L)
JK101
2
1
3
A-IN1(R)
A-OUT1(R)
A-OUT1(L)
6
A-IN1(L)
JK751
A-OUT(R)
REAR
A-OUT(L)
1-9-5
Q753Q754
JK753
A-IN(L)
FRONT
JK754
A-IN(R)
2
AUDIO
TU701
(TUNER UNIT)
4
CN701CN1
TU-AUDIO(R)
4
AFV CBA
IF SINAL
2
SIF
2
CN701CN1
22
SIF OUT
5
TU-AUDIO(L)
5
PROCESS
N-A-REC
N-A-PB
TO AUDIO
BLOCK DIAGRAM
H97H0BLH
Page 25
Power Supply Block Diagram
A
B
ModelMark
DDVR-5505V
Comparison Chart of
DDVR-5805
Models & Marks
1 EV+1.2V
CL1051
2 EV+1.2V
3 EV+3.3V
4 EV+3.3V
5 EV+3.3V
7 P-ON+5V
8 EV+11V
9 EV+11V
6 P-ON+3.3V
17 PWRCON
P-ON-H
P-ON+44V
SW+44V
Q053,Q054
CAUTION
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,
REPLACE ONLY WITH THE SAME TYPE T1.6AL/250V FUSE.
P-ON+15V
<FROM PIN 67 OF IC501>
13568
13568
CN051A
1 AL+44V13 AL+12V35
CL051ACL051BCN051
AL+12V
5
AL+5V(P-DOWN)
B
6
AL+5V
6
Q055
AL+9V
SW+9V
101214
1012141817
8
AL+20.5V
8
AL+5V
Q056
P-ON+5V
SW+5V
18
17
TIMER+5V
SW+5V
Q058
B
Q057
Q059
C-POW-SW
P-DOWN-L
AL+20.5V/+12V
<TO PIN 86 OF IC501>
<FROM PIN 66 OF IC501>
SW+20.5V
Q051,Q052
AL-30V
1
1 AL-30V
CL052ACL052B
IC1002
+1.2V REG.
359
3 AL+2.8V
5 AL+4V
9F18
IC1003
+3.3V REG.
8
F2
B
SW+5V
Q1055
JUNCTION
Q1052
CBA
SW+3.3V
DVD P-ON+5V
-FL
DVD P-ON+3.3V
Q1053,
DVD P-ON+12V
EV+3.3V
F1
SW+12V
Q1054
F2
B
MAIN CBAPOWER SUPPLY CBA
NOTE :
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
20
19
18
17
T0011
2
BRIDGE
RECTIFIER
D001 - D004
LINE
FILTER
L1003
CAUTION !
Fixed voltage (or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
HOT CIRCUIT. BE CAREFUL.
F1001
T1.6AL/250V
AC1001
4
Q1001
COLD
B
Q1004
16
15
14
13
12
Q1003
11
7
8
IC1001
ERROR
VOLTAGE DET
1
4
23
Q1008
HOT
1-9-6H9779BLP
Page 26
BLOCK DIAGRAMS <DVD SECTION>
DVD System Control / Servo Block Diagram
A
B
ModelMark
DDVR-5505V
Comparison Chart of
DDVR-5805
Models & Marks
B
FP-DIN
FP-STB
FP-CLK
A
SKIP-DOWN
DISC-IN
PLAY
MODEL
MARK
FP-DOUT
SKIP-UP
PIN NAME MAY DIFFER BY MODELS.
DVD OPEN/CLOSE CBA
2
DVD-OPEN/CLOSE
1 EV+3.3V12
CN2015CN2016
EV+3.3V
SW2020
DVD OPEN/CLOSE
EV+3.3V
B
IC611
SW2005 SKIP-UP
EV+3.3V
PLAY
D2002
Q2012
DISC IN
D2001
Q2002
A
SW2021 STOP
SW2006 SKIP-DOWN
SW2022 PLAY
CL1051
DVD-STOP2626DVD-POWER 2323DVD-OPEN/CLOSE
DVD-PLAY25
25
CN401
535465
24
24
68
DVD-POWER
21
2020191918
21
826067
68
FROM SERVO/SYSTEM
CONTROL BLOCK DIAGRAM
<VCR SECTION>
OUTPUT-SELECT
OUTPUT-SELECT 27
REMOTE-DVD22
27
18
22
55
59
23
1G
IC612
(FIP DRIVER)
GRIDFIP
~
SEGMENT
789
17
~
a
7G
bcd
12
10
11
131416
f
g
h
e
FP-STB
FP-DIN
FP-CLK
2281
TO SERVO/SYSTEM
CONTROL BLOCK
DIAGRAM
<VCR SECTION>
i
DISPLAY-CLK
DISPLAY-DATA
REMOTE-VIDEO
DISPLAY-STB
MAIN CBA
RM2001
SENSOR
REMOTE
SLED SERVO SIGNALSPINDLE SERVO SIGNAL
FOCUS SERVO SIGNALTRACKING SERVO SIGNAL
IC101
PCM-SCLK
(MICRO CONTROLLER)
163
PCM-SCLK
ADAC-MD
A-MUTE
57
88
A-MUTE
ADAC-MD
56 ADAC-MC
ADAC-MC
86 ADAC-ML
ADAC-ML
ASPECT21
IC462
+3.3V
ASPECT
RESET73
RESET
13
VREF
IC301
(SERVO DRIVE)
FD-OFST
FOCUS DRIVE
148
146
25
27
26
-
+
-
+
FOCUS
ACTUATOR
DRIVE
15
16
FS(+)
FS(-)
TS(+)
24
TS(-)
DVD-PLAY
DVD-STOP
DVD-POWER
OPEN/CLOSE
TRACKING
DRIVE
TD-OFST
147
139
-
+
-
+
TRACKING
ACTUATOR
DRIVE
14
13
312
REMOTE
SPDL
76
-
+
-
+
SPINDLE
MOTOR
DRIVE
12
11
OUTPUT-SELECT
B
645
+
SLED
MOTOR
17
SLD
75
23
-
DRIVE
18
IC202
(OP AMP)
13
6GND
7SL(-)
TRAY-IN
66
DVD MAIN CBA UNITDRIVE CBA
8SL(+)
7
5
CN301
6
3SP(+)
+3.3V
4SP(-)
SL-AMP
81
14
12
5TRAY-IN
SP-ROT
143
1
2
3
TRAY-IN
TO DVD
VIDEO/ AUDIO
BLOCK DIAGRAM
TO DIGITAL SIGNAL
PROCESS BLOCK
DIAGRAM
1-9-7
SPINDLE
MOTOR
M
SLED
MOTOR
M
H9779BLSD
Page 27
Digital Signal Process Block Diagram
TO DVD
VIDEO
/AUDIO
BLOCK
DIAGRAM
TO DVD
VIDEO
/AUDIO
BLOCK
DIAGRAM
FLASH
ROM
DATA(AUDIO) SIGNAL
DATA(VIDEO/AUDIO) SIGNALDVD VIDEO SIGNAL
DATA
RAM
DSP
INST.
ROM
DECODER
STREAM
I/F
DATA
RAM
I/O
INST.
ROM
PROCESSOR
SPDIF
PCM-BCK
177
PCM-DATA
170
AUDIO
UMAC
171
I/F
PCM-LRCLK
169
SERIAL
GENERAL
I/O
CPU
I/F
READ
MEMORY
VIDEO-Y
156
Y
D/A
INTERRUPT
CONTROLLER
VIDEO-C
158
C
D/A
TIMER
WATCH DOG
VIDEO-R
152
R
D/A
NTSC/PAL
ENCODER
VIDEO
I/F
TIMER
REMOTE
VIDEO-B
151
B
D/A
CONTROL
VIDEO-G
149
G
D/A
32BIT CPU
BCU
DATA
INST
DEBUG
RAM
RAM
IC103 (FLASH ROM)
23~51
~
~
1
9
162548
FADR (0-19)
~
293638
FDQ (0-15)
~
45
SDRAM ADDRESS(0-10)
~
217
238
SDRAM ADDRESS(0-11)
~~
222629
IC503 (SDRAM)IC101 (MICRO CONTROLLER)
EXTERNAL
MEMORY
I/F
1
2
35
SDRAM
DECODER
I/F
ECC
SDRAM DATA(0-15)
~~
18
252
256
SDRAM DATA(0-15)
~~
134253
114
115
116
DMA
DVD/CD
RF
SIGNAL
117
132
CN201
C16
FORMATTER
PROCESS
CIRCUIT
131
134
A17
D18
192~212
CPU
I/F
BCU
WATCH DOG
5
9
GND(LD)
GND(CD-PD)
INTERRUPT
TIMER
TIMER
CONTROLLER
CD/DVD
83
TO DVD SYSTEM
CONTROL/SERVO
BLOCK DIAGRAM
6
IC201
(SW)
4
1 3
CDDVD
FS
TS
FS(+)
CN201
FS(+) 2
FS(-)
FS(-) 3
TS(+)
TS(+) 1
TS(-)
DVD MAIN CBA UNIT
TS(-) 4
PICK-UP
UNIT
32BIT
CPU
INST.
ROM
DATA
RAM
126
124
125
AMP
Q251,Q252
Q253,Q254
AMP
CN201
CD-LD 10
DVD-LD 8
PD-MONI 7
123
6
GND(DVD-PD)
133
129
130
F12
B15
E14
CD/DVD 19
DETECTOR
1-9-8
H9779BLD
Page 28
DVD Video / Audio Block Diagram
DVD-G
DVD-R
DVD-B
7
11
15
JK101
2
DVD AUDIO SIGNALDATA(AUDIO) SIGNAL
1
34
YC
JK1401
S-VIDEO OUT
FIBER OPTIC
TRANS MODULE
IC1204
DIGITAL
AUDIO OUT
TO Hi-Fi AUDIO
BLOCK DIAGRAM
DVD-
A-OUT(R)
<VCR SECTION>
A-MUTE(L)
A-MUTE(R)
JK1202
3
DVD-
A-OUT(L)
7
(AMP)
DVD VIDEO SIGNAL
TO VIDEO
BLOCK DIAGRAM
DVD-VIDEO
5
6
DRIVER
8dB AMP
-6dB
LPFDRIVER
4dB AMP2dB AMP
IC1403 (VIDEO DRIVER)
3
<VCR SECTION>
WF6
LPFDRIVER
4dB AMP2dB AMP
17
11
10
LPFDRIVER
LPFDRIVER
4dB AMP2dB AMP
4dB AMP2dB AMP
IC102 (VIDEO DRIVER)
8
6
15
LPFDRIVER
4dB AMP2dB AMP
1
Q1351
BUFFER
IC1201
WF7
WF9
7
L-CH
LPF+AMP
DAC
5
19
SPDIF
19
CN601CN1601
R-CH
6
1414DVD-A(L)
1616DVD-A(R)
8
LPF+AMP
DAC
213
WF8
DVD-A(R)-MUTE
DVD-A-MUTE
1515
1313
11
AUDIO+5V
Q1204
MAIN CBA
+3.3V
WF4
CN601CN1601
11VIDEO-Y
1010VIDEO-C
VIDEO-Y
VIDEO-C
WF5
44VIDEO-R
VIDEO-R
VIDEO-G
FROM DIGITAL
SIGNAL PROCESS
BLOCK DIAGRAM
66VIDEO-B
88VIDEO-G
VIDEO-B
1-9-9
IC601 (AUDIO DAC)
ENPHANCED
4X/8X
OVERSAMPLING
123
PCM-BCK
SPDIF
FROM
DIGITAL
SIGNAL
MODULATOR
MULTI-LEVEL
DELTA-SIGMA
/FUNCTION
CONTROLLER
DIGITAL FILTER
PORT
SERIAL
PCM-DATA0
PCM-LRCLK
PROCESS
BLOCK
DIAGRAM
ZERO DETECT
SERIAL
131415
ADAC-MD
ADAC-MC
SYSTEM CLOCK
CONTROL
ADAC-ML
FROM
DVD
SYSTEM
CONTROL
/SERVO
16
BLOCK
DIAGRAM
DVD MAIN CBA UNIT
PCM-SCLK
A-MUTE
H9779BLVD
Page 29
FUNCTION INDICATOR SYMBOLS
Note:
If a mechanical malfun ction occurs, the power is turned off. When the power comes on again after that by
pressing [FUNCTION] button, an error message is displayed on the TV screen for 5 seconds.
MODEINDICATOR ACTIVE
When reel or capstan mechanism is not
functioning correctly
When tape loading mechanism is not functioning correctly
When cassette loading mechanism is not
functioning correctly
When the drum is not working properly
P-ON Power safe ty detection
“A R” is displayed on a TV screen. (Refer to Fig. 1.)
“A T” is displayed on a TV screen. (Refer to Fig. 2.)
“A C” is displayed on a TV screen. (Refer to Fig. 3.)
“A D” is displayed on a TV screen. (Refer to Fig. 4.)
“A P” is displayed on a TV screen. (R efer to Fig. 5.)
TV screen
When reel or capstan mechanism is not functioning
correctly
A
R
Fig. 1
When the drum is not working properly
A
D
Fig. 4
When tape loading m echanism is not functioni ng correctly
A
T
Fig. 2
When cassette lo ading mechanism is not functioning
correctly
A
C
Fig. 3
P-ON Power safety detection
A
P
Fig. 5
1-9-10H9700FIS
Page 30
SCHEMATIC DIAGRAMS / CBA’S AND TEST POINTS
Standard Notes
WARNING
Many electrical and mechanical pa rts in this chassis
have special characteristics. These characteristics
often pass unnoticed and the protection afforded by
them cannot necessarily be obtained by using replacement components rated for higher voltage, wattage,
etc. Replacement par ts that have these special safety
characteristics are identified in this manual and its
supplements; electrical components having such features are identified by the mark " ! " in the schematic
diagram and the parts list. Before replacing any of
these components, read the parts list in this manual
carefully. The use of substitute replacemen t par ts that
do not have the same safety characteristi cs as specified in the par ts list may create shock, fire, or other
hazards.
Notes:
1. Do not use the par t number sh own on these drawings for ordering. The correct part number is shown
in the parts list, and may be slightly different or
amended since these drawings were prepared.
2. All resistance values are indicated in ohms
3
(K=10
3. Resistor wattages are 1/4W or 1/6W unless o therwise specified.
4. All capacitance values are indicated in µF
(P=10
5. All voltages are DC voltages unless otherwise
specified.
6. Electrical parts such as capacitors, connectors,
diodes, IC’s, transistors, resistors, switches, and
fuses are identified by four digits. The first two digits are not shown for each component. In each
block of the diagram, there is a note such as shown
below to indicate these abbreviated two digits.
, M=106).
-6
µF).
1-10-1SCPA1
Page 31
LIST OF CAUTION, NOTE S, AND SYMBOLS USED IN THE SCHEMATIC DIAGRAMS ON THE FOLLOWING
PAGES:
1. CAUTION:
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH THE SAME TYPE FUSE.
2. CAUTION:
Fixed Voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown, first check to see that all components in the power supply circuit are not defective
before you connect the AC plug to the AC power supply. O therwise it may cause some components in the
power supply circuit to fail.
3. Note:
(1) Do not use the pa rt numb er shown on t h e dr awings for orde rin g. T he co rr e ct part nu mbe r is shown in the p a rts
list, and may be slightly different or amended since the drawings were prepared.
(2) To maintain original function and reliability of repaired units, use only original replacement par ts which are
listed with their part numbers in the parts list section of the service manual.
4. Voltage indications for PLAY and REC modes on the schematics are as shown below:
< DVD Section >
231
5.0
The same voltage for
both PLAY & STOP modes
Indicates that the voltage
is not consistent here.
5. How to read converged lines
1-D3
Distinction Area
Line Number
(1 to 3 digits)
Examples:
1. "1-D3" means that line number "1" goes to area "D3".
2. "1-B1" means that line number "1" goes to area "B1".
6. Test Point Information
: Indicates a test point with a jumper wire across a hole in the PCB.
: Used to indicate a test point with a component lead on foil side.
: Used to indicate a test point with no test pin.
5.0
(2.5)
PLAY mode
STOP mode
< VCR Section >
5.0
The same voltage for
both PLAY, REC & DVD
modes
5.0
(2.5)
< >
PLAY mode
REC mode
DVD mode
231
Indicates that the voltage
is not consistent here.
3
2
1
ABCD
Unit: Volts
1-B1
AREA D3
AREA B1
1-D3
: Used to indicate a test point with a test pin.
1-10-2SCRK05
Page 32
Main 1/8 Schematic Diagram < VCR Section >
Comparison Chart of
Models and Marks
MODELMARK
DDVR-5505VA
DDVR-5805B
1-10-3
1-10-4
H9779SCM1
Page 33
Main 2/8, Sensor & Power SW Schematic Diagrams < VCR Section >
5G4G 3G2G1G
7G
6G
a
d
g
c
b
ef
f
i
i
REPEAT
TITLE
GROUP
VCR
CHP
REC
SACD
TRK
A
ALL
B
PSCAN
DVD
PM
HDVCD
A
7G6G5G4G3G2G1G
a
b
c
d
e
f
g
c
d
e
ff
g
c
d
e
f
g
c
d
e
f
g
c
d
e
f
g
c
d
e
f
g
h
ii
ababababa
b
IC611 MATRIX CHART
REPEAT
TITLE
GROUP
VCR
CHP
REC
SACD
TRK
ALL
B
PSCAN
DVD
P
M
HD
V
CD
A
A
Comparison Chart of
Models and Marks
MODELMARK
DDVR-5505VA
DDVR-5805B
1-10-5
1-10-6
H9779SCM2
Page 34
Main 3/8 Schematic Diagram < VCR Section >
Comparison Chart of
Models and Marks
MODELMARK
DDVR-5505VA
DDVR-5805B
1-10-7
1-10-8
H9779SCM3
Page 35
Main 4/8 Schematic Diagram < VCR Section >
1-10-9
1-10-10
H9779SCM4
Page 36
Main 5/8 Schematic Diagram < VCR Section >
Comparison Chart of
Models and Marks
MODELMARK
DDVR-5505VA
DDVR-5805B
1-10-11
1-10-12H9779SCM5
Page 37
Main 6/8 Schematic Diagram < VCR Section >
Comparison Chart of
Models and Marks
MODELMARK
DDVR-5505VA
DDVR-5805B
1-10-131-10-14H9779SCM6
Page 38
Main 7/8 & DVD Open/Close Schematic Diagrams < VCR Section >
Comparison Chart of
Models and Marks
MODELMARK
DDVR-5505VA
DDVR-5805B
PIN NAME (*1~*4) CHART
MODEL
MARK
PLAYFP-CLK
SKIP-DOWNFP-DIN
DISC-INFP-STB
SKIP-UPFP-DOUT
PIN NAM E M AY DIF FE R BY MODELS .
*2
*3
*4
BA
*1
1-10-151-10-16H9779SCM7
Page 39
Main 8/8 Schematic Diagram ( B ) < VCR Section >
Comparison Chart of
Models and Marks
MODELMARK
DDVR-5505VA
DDVR-5805B
1-10-171-10-18H97H0SCM8
Page 40
Power Supply & Junction Schematic Diagram < VCR Section >
Comparison Chart of
Models and Marks
MODELMARK
DDVR-5505VA
DDVR-5805B
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE :
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
CAUTION !
Fixed voltage ( or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
1-10-191-10-20H9779SCP
Page 41
Jack-A Schematic Diagram < VCR Section >
Comparison Chart of
Models and Marks
MODELMARK
DDVR-5505VA
DDVR-5805B
1-10-211-10-22H9779SCJ
Page 42
AFV Schematic Diagram ( B ) < VCR Section >
Comparison Chart of
Models and Marks
MODELMARK
DDVR-5505VA
DDVR-5805B
1-10-231-10-24H97H0SCAFV
Page 43
Main CBA & Sensor CBA Top View
Sensor CBA Top View
BHF300F01011A
BHF300F01011B
WF3
TP751
V-OUT
WF2
TP301
C-PB
VR501
SW-P
WF1
TP504
RF-SW
TP501
S-INH
TP503
CTL
1-10-25
1-10-26
BH9700F01016A
Page 44
Main CBA Bottom View
WF6
PIN 6 OF
IC1403
WF9
PIN 19 OF
CN1601
WF8
PIN 16 OF
CN1601
WF7
PIN 14 OF
CN1601
WF5
PIN 10 OF
CN1601
WF4
PIN 1 OF
CN1601
1-10-271-10-28
BH9700F01016A
Page 45
Power SW CBA Top View
Power SW CBA Bottom View
BH9700F01016B
DVD Open/Close
CBA Top View
DVD Open /Close
CBA Bottom View
BH9700F01016C
1-10-29
1-10-30
Page 46
Jack-A CBA Top View
Comparison Chart of
Models and Marks
MODELMARK
DDVR-5505VA
DDVR-5805B
Jack-A CBA Bottom View
BH9700F01022C
AFV CBA Top View ( B )
AFV CBA Bottom View ( B )
1-10-31
BHC400F01093
1-10-32
Page 47
Power Supply CBA Top View
Power Supply CBA Bottom View
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE :
The voltage for parts in hot circuit is measured
using hot GND as a common terminal.
CAUTION !
Fixed voltage ( or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
Note:
L1004 is positioned on the Cathode
side of D1011 as shown below.
D1011
L1004
BECAUSE A HOT CHASSIS GROUND IS PRESENT IN THE POWER
SUPPLY CIRCUIT , AN ISOLATION TRANSFORMER MUST BE USED.
ALSO , IN ORDER TO HAVE THE ABILITY TO INCREASE THE INPUT
SLOWLY , WHEN TROUBLESHOOTING THIS TYPE POWER SUPPLY
CIRCUIT , A VARIABLE ISOLATION TRANSFORMER IS REQUIRED.
See Electrical Parts List
for parts with this mark.
Some Ref. Numbers are
not in sequence.
Jack-A CBA
2L012
JW008
2B15
[ DDVR-5505V ]
2B40
2B55
2B54
2L022
A5
2L020
2L082
JW007
A
B
Junction CBA
JW006
AC1001
2L021
JW002
2L021
2L062
2L020
JW001
2L021
2L053
2L041
2L020
F1001
2L021
1B2
A
CN3002
2B33
Power Supply CBA
2L041
L0-9
2L041
L0-9
B
DVD Main
CBA Unit
CN3001
2L041
2L041
2B9
A10
A3
2B18
A22
A1X
A7
A2
2L041
2L041
2L041
1-15-11-15-2H9779CEX
Page 60
Packing
Some Ref. Numbers are not in sequence.
X5
S7
X20DX20CX20BX20A
S2
X20E
X1
X3
X2
X4
S3
S2
S1
Unit
A14
1-15-3H9779PEX
Page 61
MECHANICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a !
have special characteristics important to safety. B efore
replacing any of these comp onents, read carefully the
product safety notice in this service manual. Don't
degrade the safety of the product through improper servicing.
have special characteristics important to safety. B efore
replacing any of these comp onents, read carefully the
product safety notice in this service manual. Don't
degrade the safety of the product through improper servicing.
NOTES:
1.Parts that are not assigned par t numbers (---------)
are not available.
2.Tolerance of Capacitors and Resistors are noted
with the following symbols.
C.....±0.25%D .....±0.5%F.....±1%
G.....±2%J......±5%K.....±10%
M.....±20%N.....±30%Z.....+80/-20%
Comparison Chart of Models and Marks
ModelMark
DDV R-550 5VA
DDVR-5805 B
DVD MAIN CBA UNIT
Ref. No. MarkDescriptionPart No.
ABDVD MAIN CBA UNIT
DVD MAIN CBA UNIT
N79GQHEP
N79GNHBP
MCV CBA
Ref. No. MarkDescriptionPart No.
A
MCV CBA
B
MCV CBA
Consists of the following
MAIN CBA(MCV-A)
POWER SW CBA (MCV- B)
DVD OPEN/CLOSE CBA(MCV-C)
SENSOR CBA
MAIN CBA
Ref. No. M arkDescripti onPart No.
MAIN CBA (MCV-A)--------- Consists of the following:
CAPACITORS
C056ELECTROLYTIC CAP. 47µF/25V M orCE1EMASDL470
ELECTROLYTIC CAP. 47µF/25V MCE1EMASTL470
C057BELECTROLYTIC CAP. 10µF/16V M orCE1CMAS DL100
BELECTROL YTIC CAP. 10µF/16V MCE1CMASTL100
C058ELECTROLYTIC CAP. 220µF/6.3V M H7CE0KMASSL221
C059ELECTROLYTIC CAP. 100µF/6.3V M orCE0KMASDL101
ELECTROLYTIC CAP. 100µF/6.3V MCE0KMASTL101
C060CHIP CERAMIC CAP .(1608) B K 0.047µF/
C062CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
50V or
CHIP CERAMIC CAP.(1608) B K 0.047µF/
25V
CHIP CERAMIC CAP . (1608) F Z 0.1µF/25V orCHD1EZ30F104
1VSA10713
1VSA10706
----------
----------
---------1VSA10047
CHD1JK30B473
CHD1EK30B473
Ref. No. MarkDescriptionPart No.
C063ELECTROLYTIC CAP . 47µF/16V M orCE1CMASDL470
ELECTROLYTIC CAP . 47µF/16V MCE1CMASTL470
C068CHIP CERAMIC CAP .(1608) CH J 470pF/50V orCHD1JJ3CH471
CHIP CERAMIC CAP . CG J 470pF/50VCHD1JJ3CG471
C104ELECTROLYTIC CAP . 100µF/16V M orCE1CMASDL101
ELECTROLYTIC CAP . 100 µF/16V MCE1CMASTL101
C107ELECTROLYTIC CAP . 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP . 470 µF/6.3V MCE0KMASTL471
C109BCHIP CERAMIC CAP .(1608) CH J 470pF/50V orCHD1JJ3CH471
BCHIP CERAMIC CAP . CG J 470pF/50VCHD1JJ3CG471
C112CHIP CERAMIC CAP .(1608) CH J 470pF/50V orCHD1JJ3CH471
CHIP CERAMIC CAP . CG J 470pF/50VCHD1JJ3CG471
C113CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C114CHIP CERAMIC CAP .(1608) B K 1000pF/50V CHD1JK30B102
C116CHIP CERAMIC CAP . B K 2200pF/50VCHD1JK30B222
C117ELECTROLYTIC CAP . 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP . 1 µF/50V MCE1JMASTL1R0
C118CHIP CERAMIC CAP . B K 2200pF/50VCHD1JK30B222
C121ELECTROLYTIC CAP . 1µF/50V M H7CE1JMAVSL1R0
C122ELECTROLYTIC CAP . 1µF/50V M H7CE1JMAVSL1R0
C123ELECTROLYTIC CAP . 1µF/50V M H7CE1JMAVSL1R0
C124ELECTROLYTIC CAP . 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP . 470 µF/6.3V MCE0KMASTL471
C125ELECTROLYTIC CAP . 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP . 470 µF/6.3V MCE0KMASTL471
C126ELECTROLYTIC CAP . 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP . 470 µF/6.3V MCE0KMASTL471
C127ELECTROLYTIC CAP . 10µF/16V M orCE1CMASDL100
ELECTROLYTIC CAP . 10µF/16V MCE1CMASTL100
C128ELECTROLYTIC CAP . 22µF/6.3V M H7CE0KMAVSL220
C129ELECTROLYTIC CAP . 100µF/16V M H7CE1CMAVSL101
C130ELECTROLYTIC CAP . 4.7µF/50V M H7CE1JMAVSL4R7
C131ELECTROLYTIC CAP . 4.7µF/50V M H7CE1JMAVSL4R7
C132ELECTROLYTIC CAP . 4.7µF/50V M H7CE1JMAVSL4R7
C133CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C134ELECTROLYTIC CAP . 10µF/16V M H7CE1CMAVSL100
C135CHIP CERAMIC CAP .(1608) B K 0.01µF/50V CHD1JK30B103
C136ELECTROLYTIC CAP . 100µF/6.3V H7CE0KMAVSL101
C151ACHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
ACHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
ACHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C152ACHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
ACHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
ACHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C153ACHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3 FZ104
200408171-17-1H9779EL
Page 63
Ref. No. M arkDescripti onPart No.
ACHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
ACHIP CERAMIC CAP . FZ Z 0.1µF/50VC HD1JZ3 FZ104
C154ACHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
ACHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
Ref. No. MarkDescriptionPart No.
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C318CHIP CERAMIC CAP .(1608) B K 0.022µF/
C319CHIP CERAMIC CAP .(1608) CH J 68pF/50V orCHD1JJ3CH680
50V or
CHIP CERAMIC CAP.(1608) B K 0.022µF/
25V
CHD1JK30B223
CHD1EK30B223
ACHIP CERAMIC CAP . FZ Z 0.1µF/50VC HD1JZ3 FZ104
C155AELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C156AELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C159ACHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
ACHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
ACHIP CERAMIC CAP . FZ Z 0.1µF/50VC HD1JZ3 FZ104
C251ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C252CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3 FZ104
C253CHIP CERAMIC CAP .(1608) B K 1000pF/50V CHD1JK30B102
C254ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C301CHIP CERAMIC CAP .(1608) B K 0.022µF/
C302ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C303CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
C305ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C306CHIP CERAMIC CAP .(1608) B K 0.047µF/
C307CHIP CERAMIC CAP .(1608) B K 0.022µF/
C308CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
50V or
CHIP CERAMIC CAP.(1608) B K 0.022µF/
25V
CHIP CERAMIC CAP . (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3 FZ104
50V or
CHIP CERAMIC CAP.(1608) B K 0.047µF/
25V
50V or
CHIP CERAMIC CAP.(1608) B K 0.022µF/
25V
CHD1JK30B223
CHD1EK30B223
CHD1JK30B473
CHD1EK30B473
CHD1JK30B223
CHD1EK30B223
CHIP CERAMIC CAP . CG J 68pF/50VCHD1JJ3CG680
C320CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C321CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C322CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C323CHIP CERAMIC CAP .(1608) CH J 68pF/50V orCHD1JJ3CH680
CHIP CERAMIC CAP . CG J 68pF/50VCHD1JJ3CG680
C324CHIP CERAMIC CAP .(1608) B K 0.01µF/50V CHD1JK30B103
C325CHIP CERAMIC CAP . B K 8200pF/50VCHD1JK30B822
C326CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C328ELECTROLYTIC CAP . 47µF/6.3V M H7CE0KMAVSL470
C329CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C331ELECTROLYTIC CAP . 47µF/6.3V M H7CE0KMAVSL470
C333CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3 FZ104
C309CHIP CERAMIC CAP .(1608) CH J 68pF/50V orCHD1JJ3CH680
CHIP CERAMIC CAP . CG J 68pF/50VCHD1JJ3CG680
C310CHIP CERAMIC CAP .(1608) CH J 68pF/50V orCHD1JJ3CH680
CHIP CERAMIC CAP . CG J 68pF/50VCHD1JJ3CG680
C311CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3 FZ104
C312ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C313ELECTROLYTIC CAP. 1µF/50V M H7CE1JMASSL1R0
C314CHIP CERAMIC CAP .(1608) B K 0.01µF/50V CHD1JK30B103
C315CHIP CERAMIC CAP .(1608) B K 0.047µF/
C316ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C317CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
50V or
CHIP CERAMIC CAP.(1608) B K 0.047µF/
25V
CHIP CERAMIC CAP . (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHD1JK30B473
CHD1EK30B473
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C334ELECTROLYTIC CAP . 1µF/50V M H7CE1JMAVSL1R0
C335ELECTROLYTIC CAP . 100µF/6.3V H7CE0KMAVSL101
C336CHIP CERAMIC CAP . CH J 220pF/50V orCHD1JJ3CH221
CHIP CERAMIC CAP . CG J 220pF/50VCHD1JJ3CG221
C337CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C339CHIP CERAMIC CAP . CH J 120pF/50V orCHD1JJ3CH121
CHIP CERAMIC CAP . CG J 120pF/50VCHD1JJ3CG121
C340ELECTROLYTIC CAP . 1µF/50V M H7CE1JMAVSL1R0
C341CHIP CERAMIC CAP .(1608) CH D 10pF/50V orCHD1JD3CH100
CHIP CERAMIC CAP . (1608) CG D 10pF/50V CHD1JD3CG100
C342CHIP CERAMIC CAP .(1608) B K 1000pF/50V CHD1JK30B102
C343ELECTROLYTIC CAP . 10µF/16V M H7CE1CMAVSL100
C344ELECTROLYTIC CAP . 4.7µF/25V M NP H7 CP1EMAVSB4R7
C345ELECTROLYTIC CAP . 0.47µF/50V M H7CE1JMA VSLR47
C346CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
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CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3 FZ104
C347CHIP CERAMIC CAP .(1608) B K 0.1µF/25V orCHD1EK30B104
CHIP CERAMIC CAP.(1608) B K 0.1µF/16V CHD1CK30B104
C349ELECTROLYTIC CAP. 0.47µF/50V M H7CE1JMAVSLR47
C350CERAM IC CA P.(A X) F Z 0 .1µF/50VCCA1JZTFZ104
C402FILM CAP.(P) 0.018µF/100V J orCMA2AJP00183
FILM CAP .(P) 0.018µF/50V J orCMA1JJP00183
FILM CAP .(P) 0.018µF/50V JCA1J183MS029
C403CERAMIC CAP. B K 470pF/100VCCD2AKS0B471
C404ELECTROLYTIC CAP. 220µF/6.3V M H7CE0KMASSL221
C405ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C407CHIP CERAMIC CAP .(1608) B K 1000pF/50V CHD1JK30B102
C408CHIP CERAMIC CAP . B K 1800pF/50VCHD1JK30B182
C409CHIP CERAMIC CAP .(1608) CH J 33pF/50V orCHD1JJ3CH330
CHIP CERAMIC CAP . CG J 33pF/50VCHD1JJ3CG330
C410ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C411CHIP CERAMIC CAP .(1608) B K 0.01µF/50V CHD1JK30B103
C412ELECTROLYTIC CAP. 33µF/6.3V M H7CE0KMAVSL330
C413CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
Ref. No. MarkDescriptionPart No.
BCHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
BCHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C455BCHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
BCHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
BCHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C456BELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL 100
C457BELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMA VS L4R7
C458BCHIP CERAMIC CAP.(1608) B K 0.01µF/50V CHD1JK30B103
C461BCHIP CERAMIC CAP.(1608) B K 0.01µF/50V CHD1JK30B103
C462BCHIP CERAMIC CAP.(1608) B K 4700pF/50V CHD1JK30B472
C463BELECTROLYTIC CAP. 22µF/10V M H7CE1AMAVS L220
C464BCHIP CERAMIC CAP.(1608) B K 0.01µF/50V CHD1JK30B103
C465BELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL 100
C466BCHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
BCHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
BCHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C467BCHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3 FZ104
C414CHIP CERAMIC CAP .(1608) B K 0.022µF/
C415ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C416BCHIP CERAMIC CAP .(1608) B K 4700pF/50V CHD1JK30B472
C417ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
C418CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
C451BCHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
C452BELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C453BELECTROLYTIC CAP. 22µF/10V M H7CE1AMAVSL220
C454BCHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
50V or
CHIP CERAMIC CAP.(1608) B K 0.022µF/
25V
CHIP CERAMIC CAP . (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3 FZ104
ACHIP CERAMIC CAP . CG J 68pF/50VCHD1JJ3CG680
BCHIP CERAMIC CAP . CG J 220pF/50VCHD1JJ3CG221
ACHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
ACHIP CERAMIC CAP . FZ Z 0.1µF/50VC HD1JZ3 FZ104
ACHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
ACHIP CERAMIC CAP . FZ Z 0.1µF/50VC HD1JZ3 FZ104
ACHIP CERAMIC CAP . CG J 220pF/50VCHD1JJ3CG221
ACHIP CERAMIC CAP . CG J 68pF/50VCHD1JJ3CG680
BCHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
BCHIP CERAMIC CAP . FZ Z 0.1µF/50VC HD1JZ3 FZ104
CHD1JK30B223
CHD1EK30B223
BCHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
BCHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C468BELECTROLYTIC CAP. 220µF/6.3V M H7CE0KMAVSL221
C469BELECTROLYTIC CAP. 22µF/10V M H7CE1AMAVS L220
C470BCHIP CERAMIC CAP.(1608) B K 4700pF/50V CHD1JK30B472
C471BCHIP CERAMIC CAP.(1608) B K 0.01µF/50V CHD1JK30B103
C472BELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMA VS L4R7
C473BELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL 100
C474BCHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
BCHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
BCHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C475BCHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
BCHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
BCHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C476BELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVS L220
C477BCHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
BCHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
BCHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C478BCHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
BCHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
BCHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C479BELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL 100
C480BELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMA VS L4R7
C481BELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMA VS L4R7
C482BCHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
BCHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
BCHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C483BELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMA VS L4R7
C484BELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMA VS L4R7
C485BELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL 100
C486BCHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
BCHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
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BCHIP CERAMIC CAP . FZ Z 0.1µF/50VC HD1JZ3 FZ104
C487BELECTROLYTIC CAP. 47µF/16V M H7CE1CMAVSL470
C488BCHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
BCHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
BCHIP CERAMIC CAP . FZ Z 0.1µF/50VC HD1JZ3 FZ104
C502CHIP CERAMIC CAP .(1608) B K 0.022µF/
C505CHIP CERAMIC CAP .(1608) B K 0.01µF/50V CHD1JK30B103
C506ELECTROLYTIC CAP. 220µF/6.3V M H7CE0KMA VSL221
C507CHIP CERAMIC CAP .(1608) B K 1000pF/50V CHD1JK30B102
C508CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
C509CHIP CERAMIC CAP .(1608) B K 1000pF/50V CHD1JK30B102
C510CHIP CERAMIC CAP .(1608) B K 4700pF/50V CHD1JK30B472
C511CHIP CERAMIC CAP .(1608) CH J 100pF/50V orCHD1JJ3CH101
C512CHIP CERAMIC CAP .(1608) B K 0.01µF/50V CHD1JK30B103
C514CHIP CERAMIC CAP. CH J 330pF/50V orCHD1JJ3CH331
C515CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
C516ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
C517CERAM IC CA P.(A X) F Z 0 .02 2µF/25VCCA1EZTFZ22 3
C518ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
C519CHIP CERAMIC CAP. CH J 560pF/50V orCHD1JJ3CH561
C521ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
C522CHIP CERAMIC CAP .(1608) B K 0.01µF/50V CHD1JK30B103
C524CHIP CERAMIC CAP .(1608) B K 0.01µF/50V CHD1JK30B103
C527CERAMIC CAP.(AX) B K 100pF/50VCCA1JKT0B101
C531CHIP CERAMIC CAP .(1608) B K 4700pF/50V CHD1JK30B472
C533CHIP CERAMIC CAP .(1608) B K 0.047µF/
C534ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C535CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
C539CHIP CERAMIC CAP .(1608) B K 0.01µF/50V CHD1JK30B103
C540CHIP CERAMIC CAP .(1608) B K 4700pF/50V CHD1JK30B472
C541CHIP CERAMIC CAP. CH J 18pF/50V orCHD1JJ3CH180
C543CHIP CERAMIC CAP .(1608) CH J 22pF/50V orCHD1JJ3CH220
50V or
CHIP CERAMIC CAP.(1608) B K 0.022µF/
25V
CHIP CERAMIC CAP . (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3 FZ104
CHIP CERAMIC CAP .(1608) CG J 100pF/
50V
CHIP CERAMIC CAP . CG J 330pF/50VCHD1JJ3CG331
CHIP CERAMIC CAP . (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3 FZ104
CHIP CERAMIC CAP . CG J 560pF/50VCHD1JJ3CG561
50V or
CHIP CERAMIC CAP.(1608) B K 0.047µF/
25V
CHIP CERAMIC CAP . (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3 FZ104
CHIP CERAMIC CAP . CG J 560pF/50VCHD1JJ3CG561
CHIP CERAMIC CAP . CG J 180pF/50VCHD1JJ3CG181
CHIP CERAMIC CAP . CG J 18pF/50VCHD1JJ3CG180
CHIP CERAMIC CAP . CG J 18pF/50VCHD1JJ3CG180
CHD1JK30B223
CHD1EK30B223
CHD1JJ3CG101
CHD1JK30B473
CHD1EK30B473
Ref. No. MarkDescriptionPart No.
C544CHIP CERAMIC CAP .(1608) CH J 22pF/50V orCHD1JJ3CH220
CHIP CERAMIC CAP . CG J 22pF/50VCHD1JJ3CG220
C545CHIP CERAMIC CAP .(1608) CH J 22pF/50V orCHD1JJ3CH220
CHIP CERAMIC CAP . CG J 22pF/50VCHD1JJ3CG220
C546CHIP CERAMIC CAP .(1608) CH J 22pF/50V orCHD1JJ3CH220
CHIP CERAMIC CAP . CG J 22pF/50VCHD1JJ3CG220
C547CHIP CERAMIC CAP .(1608) B K 0.01µF/50V CHD1JK30B103
C548CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C549ELECTROLYTIC CAP . 1µF/50V M H7CE1JMAVSL1R0
C550ELECTROLYTIC CAP . 100µF/6.3V H7CE0KMAVSL101
C553ELECTROLYTIC CAP . 22µF/10V M H7CE1AMAVSL220
C555CHIP CERAMIC CAP .(1608) B K 0.1µF/25V orCHD1EK30B104
CHIP CERAMIC CAP.(1608) B K 0.1µF/16V CHD1CK30B104
C612BCHIP CERAMIC CAP.(1608) B K 4700pF/50V CHD1JK30B472
C614BCHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
BCHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
BCHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
C615BELECTROLYTIC CAP. 100µF/6.3V H7CE0KMAVSL101
C616BCHIP CERAMIC CAP.(1608) B K 1000pF/50V CHD1JK30B102
C702ACHIP CERAMIC CAP.(1608) B K 0.01µF/50V CHD1JK30B103
C703CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C704CERAMIC CAP .(AX) SL J 39pF/50VCCA1JJTSL390
C706CHIP CERAMIC CAP .(1608) B K 0.047µF/
C707ACHIP CERAMIC CAP.(1608) B K 0.01µF/50V CHD1JK30B103
C709CHIP CERAMIC CAP .(1608) B K 0.01µF/50V CHD1JK30B103
C710ACHIP CERAMIC CAP.(1608) B K 1000pF/50V CHD1JK30B102
C711CHIP CERAMIC CAP .(1608) B K 0.01µF/50V CHD1JK30B103
C712CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
C714CHIP CERAMIC CAP . B K 1500pF/50VCHD1JK30B152
C715BCHIP CERAMIC CAP. F Z 0.22µF/16V orCHD1CZ30F224
C716BCHIP CERAMIC CAP. F Z 0.22µF/16V orCHD1CZ30F224
C751CHIP CERAMIC CAP .(1608) B K 0.01µF/50V CHD1JK30B103
C752ELECTROLYTIC CAP . 47µF/10V M H7CE1AMAVSL470
C753ELECTROLYTIC CAP . 4.7µF/50V M orCE1JMASDL4R7
C754ELECTROLYTIC CAP . 4.7µF/50V M H7CE1JMASSL4R7
C755CHIP CERAMIC CAP . B K 2200pF/50VCHD1JK30B222
C756CHIP CERAMIC CAP . B K 2200pF/50VCHD1JK30B222
C757ELECTROLYTIC CAP . 47µF/6.3V M H7CE0KMASSL470
C758CERAMIC CAP .(AX ) Y M 0.01µF/16VCCA1CMT0Y103
C783BCHIP CERAMIC CAP .(1608) CH J 470pF/50V orCHD1JJ3CH471
50V or
CHIP CERAMIC CAP.(1608) B K 0.047µF/
25V
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
BCHIP CERAMIC CAP . FZ Z 0.22µF/25VCHD1EZ3FZ224
BCHIP CERAMIC CAP . FZ Z 0.22µF/25VCHD1EZ3FZ224
ELECTROLYTIC CAP . 4.7 µF/50V MCE1JMASTL4R7
CHD1JK30B473
CHD1EK30B473
CHIP CERAMIC CAP . CG J 22pF/50VCHD1JJ3CG220
BCHIP CERAMIC CAP . CG J 470pF/50VCHD1JJ3CG471
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C784CHIP CERAMIC CAP .(1608) CH J 470pF/50V orCHD1JJ3CH471
CHIP CERAMIC CAP . CG J 470pF/50VCHD1JJ3CG471
C1039CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP . (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3 FZ104
C1040ELECTROLYTIC CAP . 1 00µF/6.3V M orCE0KMASDL101
ELECTROLYTIC CAP. 100µF/6.3V MCE0KMASTL101
C1042ELECTROLYTIC CAP . 4 70µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C1056CHIP CERAMIC CAP .(1608) B K 1000pF/50V CHD1JK30B102
C1201ELECTROLYTIC CAP . 1 0µF/16V M H7CE1CMASSL100
C1202ELECTROLYTIC CAP . 1 0µF/16V M H7CE1CMASSL100
C1205CHIP CERAMIC CAP. CH J 220pF/50V orCHD1JJ3CH221
C1224CHIP CERAMIC CAP .(1608) B K 1000pF/50V CHD1JK30B102
C1245CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
C1246CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
C1247ELECTROLYTIC CAP . 4 70µF/16V M orCE1CMASDL4 71
C1249ELECTROLYTIC CAP . 4 7µF/16V M orCE1CMASDL470
C1351ELECTROLYTIC CAP . 2 2µF/6.3V M H7CE0KMAVSL220
C1352CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
C1353CHIP CERAMIC CAP.(1608) B K 0.1µF/25V orCHD1EK30B104
C1354CHIP CERAMIC CAP .(1608) CH J 100pF/50V orCHD1JJ3CH101
C1355CHIP CERAMIC CAP. F Z 1µF/10V orCHD1AZB0F105
C1359CHIP CERAMIC CAP. CH D 9pF/50VCHD1JD3CH9R0
C1393ELECTROLYTIC CAP . 4 70µF/6.3V M orCE0KMASDL471
C1394ELECTROLYTIC CAP . 4 7µF/6.3V M orCE0KMAS DL470
50V or
CHIP CERAMIC CAP . CG J 1000pF/50VCHD1JJ3CG102
CHIP CERAMIC CAP . (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3 FZ104
CHIP CERAMIC CAP . (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3 FZ104
ELECTROLYTIC CAP. 470µF/16V MCE1CMASTL471
ELECTROLYTIC CAP. 47µF/16V MCE1CMASTL470
CHIP CERAMIC CAP . (1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3 FZ104
CHIP CERAMIC CAP.(1608) B K 0.1µF/16V CHD1CK30B104
CHIP CERAMIC CAP .(1608) CG J 100pF/
50V
CHIP CERAMIC CAP. F Z 1µF/10VCHD1AZ30F 105
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
ELECTROLYTIC CAP. 47µF/6.3V MCE0KMASTL470
CHD1JJ3CH102
CHD1JJ3CG101
Ref. No. MarkDescriptionPart No.
C1421CHIP CERAMIC CAP.(1608) B K 0.01µF/50V CHD1JK30B103
C1422CHIP CERAMIC CAP.(1608) B K 0.1µF/25V orCHD1EK30B104
CHIP CERAMIC CAP.(1608) B K 0.1µF/16V CHD1CK30B104
C1441CHIP CERAMIC CAP.(1608) B K 0.33µF/10V CHD1AK30B334
C1442ELECTROL YT IC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP . 470 µF/6.3V MCE0KMASTL471
C1522ELECTROL YT IC CAP. 10µF/16V M H7CE1CMAVSL100
C1523CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1524ELECTROL YT IC CAP. 100µF/6.3V H7CE0KMAVSL101
C1535CHIP CERAMIC CAP.(1608) B K 0.01µF/50V CHD1JK30B103
C1536ELECTROL YT IC CAP. 22µF/6.3V M H7CE0KMAVS L220
C2002CHIP CERAMIC CAP.(1608) B K 1000pF/50V CHD1JK30B102
C2004ELECTROL YT IC CAP. 100µF/6.3V H7CE0KMAVSL101
C2012CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C2013AELECTROL YTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
IC1001!PHOTOCOUPLER EL817A orNPEA000EL817
!PHOTOCOUPLER EL 817B orNPEB000EL817
!PHOTOCOUPLER LTV-817B-F orNPEB0LTV817 F
!PHOTOCOUPL ER PS2561A-1(Q) o rQPEQPS2561A1
!PHOTOCOUPLER PS2 561A-1(W)QPEWPS2561A1
JK1402RGB CONNECTOR MRC-021V-03JXGL210LY003
JW003FLA T CABLE , 10P A WG 26#26 51/P2. 0/190 WX3810S6FF 19
AFV CBA
Ref. No. MarkDescriptionPart No.
BAFV CBA
Consists on the following:
CAPACITORS
C1BCHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
BCHIP CERAMIC CAP .(1608) F Z 0.1µF/25V orCHD1EZ30F104
1VSA10062
Ref. No. MarkDescriptionPart No.
BCHIP CERAMIC CAP . CG J 56pF/50VCHD1JJ3CG560
C5BCHIP CERAMIC CAP.(1608) CH J 22pF/
C6BCHIP CERAMIC CAP. CH J 56pF/50V orCHD1JJ3CH560
C7BCHIP CERAMIC CAP. CH C 3pF/50V orCHD1JC3CH3R0
C8BCHIP CERAMIC CAP. CH C 3pF/50V orCHD1JC3CH3R0
C11BCHIP CERAMIC CAP.( 1608) B K 0.01µF/
C12BELECTROL YTIC CAP. 10µF/16V M H7CE1CMASSL100
C13BCHIP CERAMIC CAP.( 1608) B K 0.01µF/
C14BCHIP CERAMIC CAP.( 1608) B K 0.01µF/
C15BELECTROL YTIC CAP. 10µF/16V M H7CE1CMASSL100
C16BELECTROL YTIC CAP. 10µF/16V M H7CE1CMASSL100
C17BCHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
C19BCHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
C20BELECTROL YTIC CAP. 3.3µF/50V M H7CE1JMASSL3R3
C21BCHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
C22BELECTROL YTIC CAP. 10µF/16V M H7CE1CMASSL100
C24BELECTROL YTIC CAP. 0.22µF/50V M H7CE1JMASSLR22
50V or
BCHIP CERAMIC CAP . CG J 22pF/50VCHD1JJ3CG220
BCHIP CERAMIC CAP . CG J 56pF/50VCHD1JJ3CG560
BCHIP CERAMIC CAP . CJ C 3pF/50V orCHD1JC3CJ3R0
BCHIP CERAMIC CAP . CH D 3pF/50VCHD1JD3CH3R0
BCHIP CERAMIC CAP . CJ C 3pF/50V orCHD1JC3CJ3R0
BCHIP CERAMIC CAP . CH D 3pF/50VCHD1JD3CH3R0
50V
50V
50V
BCHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
BCHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
BCHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
BCHIP CERAMIC CAP . FZ Z 0.1µF/50VCHD1JZ3FZ104
BCHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
This maintenance chart shows you the standard of replacement and cleaning time for each part.
Because those may replace depending on environment and purpose for use, use the chart for reference.
h: Hours : Cleaning I: Replac e
DeckPeriodic Service Schedule
Ref.No.Part Name1,000 h2,000 h3,000 h4,000 h
B2Cy li nde r As sembly
B3
B8
B587Tension Leve r Assembly
B31
B573, B574
B37Capstan Motor
B52
*B73
*B86F Brake Assembly (HI)II
B133
B410
B414M Brake (SP) Assembly (HI)II
B416
Loading Motor Assembly
Pulley Assembly
ACE Head Assembly
Reel S, Reel T
Cap Belt
FE Head
Idler Assembly (HI)
Pinch Arm Asse mbly
M Brake (TU) Assembly (HI)
II
I
II
II
I
I
II
II
I
II
II
II
B525
Notes:
1.Clean all parts for the tape transport (Upper Drum with Video Head / Pinch Roller / ACE Head / FE Head) using
90% lsopropyl Alcohol.
2.After cleaning the parts, do all DECK ADJUSTMENTS.
3.For the reference numbers listed above, refer to Deck Exploded Views.
* B73 ------ Recording model only
* B86 ------ Not used in 2 head model.
LDG Belt
II
2-1-1U29PHSMEN
Page 78
Cleaning
Cleaning of Video Head
Clean the head with a head cle aning stick or chamois
cloth.
Procedure
1.Remove the top cabinet.
2.Put on a glove (thin type) to avoid touching the
upper and lower drum with your bare hand.
3.Put a few drops of 90% Isopropyl alcohol on the
head cleaning stick or o n the chamois cloth and,
by slightly pressing i t a gai ns t th e h ead ti p, tur n the
upper drum to the right and to the left.
Notes:
1.The video head surface is made of very hard
material, but sin ce it is very t hin, avoid cleaning it
vertically.
2.Wait for the cleaned part to dr y thoroughly before
operating the unit.
3.Do not reuse a stained head cleaning stick or a
stained chamois cloth.
Cleaning of ACE Head
Clean the head with a cotton swab.
Procedure
1.Remove the top cabinet.
2.Dip the cotton swab in 90% isopr opyl alcohol and
clean the ACE Head. Be careful not to damage the
upper drum and other tape running parts.
Notes:
1.Avoid cleaning the ACE Head vertically.
2.Wait for the cleaned par t to dry thoroughly before
operating the unit or damage may occur.
ACE Head
Upper
Cylinder
Do Not !
Video Head
Do Not touch
with your bare
hand!
Cleaning Stick
2-1-2U29PHSMEN
Page 79
SERVICE FIXTURE AND TOOLS
J-1-1, J-1-2
J-3
J-5
J-2
J-4
Ref. No. NamePart No.Adjustment
J-1-1Alignment TapeFL6AHead Adjustment of ACE Head
J-1-2Alignment TapeFL6N8
(2 Head model)
FL6NS8
(4 Head model)
J-2Guide Roller Adj. Screwdriver Available
Locally
J-3MirrorAvailable
Locally
J-4Azimuth Adj. Screwdriver +Available
Locally
J-5Flat Screwdriver -Available
Locally
2-2-1U29PFIX
Azimuth and X Value Adjustment of ACE Head /
Adjustment of Envelope Waveform
Guide Roller
Tape Transportation Check
ACE Head Height
X Value
Page 80
MECHANICAL ALIGNMENT PROCEDURES
Explanation of alignm ent for the tape to correctly run
starts on the next page. Refer to the information below
on this page if a tape gets stuck, for example, in the
mechanism due to some electrical trouble of the unit.
Service Information
A. Method for Manual Tape Loading/Unloading
To load a cassette tape manually:
1. Disconnect the AC plug.
2. Remove the Top Case and Front Assembly.
3. Inser t a cas sette tape. Though t he tape will n ot be
automatically l oaded, make sure that the cass ette
tape is all the way in at the inlet of the Cassette
Holder. To confirm this, lightly push the cassette
tape fur ther in and se e if the tape co mes back out,
by a spring motion, just as much as you have
pushed in.
4. Turn the LDG Belt in the appropriate direction
shown in Fig. M1 for a minute or t wo to complete
this task.
To unload a cassette tape manually:
1. Disconnect the AC plug.
2. Remove the Top Case and Front Assembly.
3. Make sure that the Movi ng guide preparations are
in the Eject Position.
4. Turn the LDG Belt in the appropriate direction
shown in Fig. M1 until the Moving guide preparations come to the Eject Position. Stop turning when
the preparations begin clicking or can not be
moved further. However, the tape will be left wound
around the cylinder.
5. Tu rn the LDG Bel t in the appro priate di rection co ntinuously, and the cassette tape will be ejected.
Allow a minute or two to complete this task.
B. Method to place the Cassette Holder in the tape-
loaded position without a cassette tape
1. Disconnect the AC Plug.
2. Remove the Top Case and Front Assembly.
3. Turn the LDG Belt in the appropriate direction
shown in Fig. M1. Release the locking tabs shown
in Fig. M1 and continue tur ning the LDG Belt unti l
the Cassette Holder comes to the tape-loaded
position. Allow a minute or two to complete this
task.
T op View
Moving guide T preparation
(Eject Position)
Moving guide S preparation
(Eject Position)
Push the tape
to load it.
Push the locking tab gently to unlock
when loading without a cassette.
UNLOAD
/EJECT
LOAD
Side View
LDG Belt
Fig. M1
Bottom View
LDG Belt (B)
UNLOAD
/EJECT
Cam Gear
Fig. M2
2-3-1D5P4HSMA
Page 81
1. Tape Interchangeability Alignment
Note:
To do th es e alignm ent procedures, make sure that the
Tracking Control Circuit is set to the preset position
every time a tape is loaded or unloaded. (Refer to
page 2-3-4, procedure 1-C, step 2.)
Note: Before starting this Mechanical Alignment, do all
Electrical Adjustment procedures.
Flowchart of Alignment for tape traveling
Loading (Use a blank tape.)
Adjust the height of the Guide Rollers
(Supply side and take-up side).
(Use a blank tape.) (Page 2-3-3)
1-A
No good
Check to see that the tape is not creasing
and that there is no slack on the supply
and take-up side Guide Rollers.
(Use a blank tape.)
Adjust the X Value for maximum envelope.
(Page 2-3-3) (Use Alignment Tape.)
Adjust the envelope. (Page 2-3-4)
Check the envelope.
OK
Adjust the Audio Section.
(Azimuth Alignment) (Page 2-3-4)
Check the audio output.
OK
Check the following:
1. X Value (Page 2-3-3)
2. Envelope (Page 2-3-4)
OK
1-A
1-B
1-C
1-C
1-D
1-D
1-B, 1-C
No good
No good
No good
Do the final tape-traveling test to see that
the tape runs normally in play mode without creasing or slacking.
OK
Check to see that the tape is not creasing
and that there is no slack on the REV Post.
(Use a blank tape.)
OK
Completion
Adjust the X value and envelope.
1-A
1-E
1-B, 1-C
2-3-2D5P4HSMA
Page 82
1-A. Preliminary/Final Checking and
Alignment of Tape Path
Purpose:
To make sure that the tape path is well stabilized.
Symptom of Misalignment:
If the tape path is unstable, the tape will be damaged.
Note: Do not use an Alignment Tape for this proce-
dure. If the unit is not correctly aligned, the tape may
be damaged.
1. Playback a blank cassette tape an d check to see
that the tape runs without creasing at Guide Rollers
[2] and [3], and at points A and B on the lead surface. (Refer to Fig. M3 and M4.)
2. If creasing is apparent, align the height of the guide
rollers by turnin g the top of Guide Rollers [2] and
[3] with a Guide Roller Adj. Screwdriver. (Refer to
Fig. M3 and M5.)
Guide Roller [2]
Guide Roller [3]
ACE Head
4. If creasing or snaking is apparent, adjust the Tilt
Adj. Screw of the ACE Head. (Fig. M6)
Azimuth Adj. Screw
ACE Head
Flat
Screwdriver
Tilt Adj. Screw
Fig. M6
1-B. X Value Alignment
Purpose:
To obtain maximum PB FM envelope signal at the preset position of the Tracking Control Circuit, align the
Horizontal Position of the ACE Head.
Symptom of Misalignment:
If the Horizontal Position of the ACE Head is not properly aligned, maximum PB FM envelope cannot be
obtained at the preset positi on of the Tracking Control
Circuit.
A
Take-up Guide Post [4]
Lead Surface of Cylinder
Correct
Guide Roller
Tape
Take-up Guide
Post
Tape
B
Tape
Incorrect
Fig. M3
Fig. M4
1. Connect the oscilloscope to TP301 (C-PB) and
TP503 (CTL) on the Main CBA. Use TP504 (RFSW) as a trigger.
2. Playback the Gray Scale of the Alignment Tape
(FL6NS8) and confirm that the PB FM signal is
present.
3. Set the Tracking Control Circuit to the p reset position by pressing CH UP button on the remote control unit then “PLAY” button on the unit. (Refer to
note on bottom of page 2-3-4.)
4. Use the Fla t Screwdriver so that the PB FM signa l
at TP301 (C-PB) is maximum. (Fig. M6)
Fig. M5
3. Check to see that the ta pe runs without creasi ng at
Take-up Guide Post [4] or witho ut s na king bet ween
Guide Roller [3] and ACE Head. (Fig. M3 and M5)
2-3-3D5P4HSMA
Page 83
5. To shift the CTL waveform, press CH UP or CH
DOWN button on the remote control unit. Then
make sure that the m aximum outp ut pos ition of PB
FM envelope signal become withi n
set position.
±2ms from pre-
Good
FM envelope signal
2ms
Center Position
5. When Gui de Rollers [2] and [3] (Refer to Fig. M3)
are aligned properly, there is no envelope drop
either at the beginni ng or end of track as shown in
Fig. M9.
Dropping envelope level at the beginning of track.
Fig. M8
FM envelope output signal
is adjusted at maximum.
CTL signal
No Good
FM envelope output signal is low.
Fig. M7
6. Set the Tracking Control Circuit to the pres et position by pressing CH UP button on the remote co ntrol unit. and then “PLAY” button.
1-C. Checking/Adjustment of Envelope
Waveform
Purpose:
To achieve a satisfactory picture, adjust the PB FM
envelope becomes as flat as possible.
Symptom of Misalignment:
If the envelope output is poor, noise will appear in the
picture. The tracking will then lose precision and the
playback picture will be distor ted by any slight variation of the Tracking Control Circuit.
1. Connect the oscilloscope to TP301 (C-PB) on the
Main CBA. Use TP504 (RF-SW) as a trigger.
2. Playback the Gray Scale on the Alignment Tape
(FL6NS8). Set the Tracking Control Circuit to the
preset position by pres sing CH UP button and then
“PLAY” button on the unit. Adjust the height of
Guide Rollers [2] and [3] (Fig. M3, Page 2-3-3)
watching the oscillosc ope display so that the envelope becomes as flat as poss ible. To do this adjustment, turn the top of the Guide Roller with the
Guide Roller Adj. Screwdriver.
3. If the envelope is as shown in Fi g. M7, adjust the
height of Guide Ro ller [2 ] ( Refer to Fi g. M3) s o tha t
the waveform looks like the one shown in Fig. M9.
4. If the envelope is as shown in Fi g. M8, adjust the
height of Guide Ro ller [3 ] ( Refer to Fi g. M3) s o tha t
the waveform looks like the one shown in Fig. M9.
Dropping envelope level at the end of track.
Fig. M9
Envelope is adjusted properly. (No envelope drop)
Fig. M10
Note: Upon completion of the adjustment of Guide
Rollers [2] and [3] (Refer to Fig. M3), check the X
Value by pushing the CH UP or DOWN buttons alternately, to check the s ymmetr y of the envelope. Check
the number of pushes to ensure preset position. The
number of pushes CH UP button to achieve 1/2 level of
envelope should match the number of pushes CH
DOWN button from center. If required, redo the “X
Value Alignment.”
2-3-4D5P4HSMA
Page 84
1-D. Azimuth Alignment of Audio/Con-
trol/ Erase Head
Purpose:
To correct the Azimuth alignment so that the Audio/
Control/Erase Head meets tape tracks properly.
Symptom of Misalignment:
If the position of the Audio/Con trol/Erase Head is not
properly aligned, the Audio S/N Ratio or Frequency
Response will be poor.
1. Connect the oscilloscope to the audio outpu t jack
on the rear side of the deck.
2. Playback the alignment tape (FL6NS8) and confirm
that the audio signal output level is 8kHz.
3. Adjust Azimuth Adj. Screw so that the output level
on the AC Voltmeter or the waveform on the oscilloscope is at maximum. (Fig. M6)
Note: Upon completion of the adj ustment of Azimuth
Adj. Screw, check the X Value by pushing the C H UP
or DOWN buttons alternately, to check the symmetry
of the envelope. Check the number of pushes to
ensure preset posi tion. The number of p ushes C H UP
button to achieve 1/2 level of envelope should match
the number of pushes CH DOWN button from center. If
required, redo the “X Value Alignment.”
2. When the tape has been curled up or bent, turn the
alignment screw to adjust the height of REV Post.
(Refer to Fig. M11 and M13.)
REV Post [5]
Take-up Guide Post [4]
Fig. M11
Correct
REV Post
Tape
Take-up Guide
Post
Tape
Incorrect
1-E. Checking and Alignment of Tape
Path during reversing
Purpose:
To make sure tha t the tape path is well stabi lized during reversing.
Symptom of Misalignment:
If the tape path is unstable dur ing reversing, the tape
will be damaged.
Note: Do not use an Alignment Tape for this procedure. If the unit is not correctly aligned, the tape may
be damaged.
1. Inser t a black cassette tape into the tray and set
the unit to REV. Then confirm if the tape ha s been
curled up or bent at the Take-up Guide Post[4] or
REV Post[5]. (Refer to Fig. M11 and M12.)
Fig. M12
Alignment
Screw
Tape Guide
Assembly
Fig. M13
2-3-5D5P4HSMA
Page 85
DISASSEMBLY/ASSEMBLY PROCEDURES
OF DECK MECHANISM
Before following the procedures described below, be sure to remove the deck assembly from the cabinet. (Refer to
CABINET DISASSEMBLY INSTRUCTIONS.)
All the following procedures, in cluding those for adjustment and replaceme nt of parts, should be done in Eject
mode; see the positions of [44] and [45] in Fig. DM1H on page 2-4-3. When reas sembling, follow the steps in
reverse order.
[9][9]ACE Head Asse mblyTDM1H, DM7H(S-4)
[10][2]
[11][10]C Door Opener TDM1H, DM8H-1(S-4A), *(L-4)
[12][11]Pinch Arm (B)T
[13][12]
[14][14]FE HeadTDM1H, DM9H(S-5)
[15][15]PrismTDM1H, DM9H(S-6)
[16][2]Slider ShaftTDM10H*(L-5)
[17][16]C Drive Lever (SP)TDM10H
[18][16]C Drive Lever (TU)TDM10H(S-7), *(P-4)
[19][19]Capstan MotorBDM2H, DM11H3(S-8), Cap Belt
[20]
M Gear (HI)TDM1H, DM15H(C-6)
Sensor Gear (HI)TDM1H, DM15H(C-7)
Moving Guide S
Preparation
Moving Guide T
Preparation
↓
(2)
PART
↓
(3)
Fig. No.
BDM2H, DM14H
BDM2H, DM14H
TDM1H, DM15H
TDM1H, DM15H*(P-6)
TDM1H, DM15H
TDM1H, DM16H(S-11), Slide Plate
TDM1H, DM16H
↓
(4)
↓
(5)
REMOVALINSTALLATION
REMOVE/*UNHOOK/
UNLOCK/RELEASE/
UNPLUG/DESOLDER
↓
(6)
ADJUSTMENT
CONDITION
(+)Refer to Alignment
Sec.Page 2-5-1
(+)Refer to Alignment
Sec.Page 2-5-1
(+)Refer to Alignment
Sec.Page 2-5-1
↓
(7)
(1): Follow steps in sequence. When reassembling, follow the steps in reverse order.
These numbers are also used as identification (location) No. of parts in the figures.
(2): Indicates the part to start disassembling with in order to disassemble the part in column (1).
(3):Name of the part
(4): Location of the part: T=Top B=Bottom R=Right L=Left
(5):Figure Number
(6): Identification of parts to be removed, unhooked, unlocked, released, unplugged, unclamped, or desoldered.
e.g., 2(L-2) = two Locking Tabs (L-2).
(7): Adjustment Information for Installation
(+):Refer to Deck Exploded Views for lubrication.
.
* [ 22 ] F Brake Assembly (HI) is not used in 2 head model.
2-4-2U29PHSDA
Page 87
T op View
[14]
[38]
[37]
[7][49][8]
[45][44][46][9]
[32][43][41][40][31][42]
[13]
[11]
[15]
[10]
[12]
[36]
Bottom View
[23]
[24]
[27]
Fig. DM1H
[19]
[35]
[34]
[25]
[26]
[33][20][28][22]
Fig. DM2H
2-4-3U29PHSDA
Page 88
(S-1)
[1]
(S-1)
Fig. DM3H
A
(S-1A)
[3]
[4]
(L-1)
(L-3)
[5]
B
(L-2)
[6]
(P-1)
Installation of [3] and [6]
First, insert [6] diagonally in [3] as shown below. Then,
install [6] in [3] while pushing (L-1) in a direction of
arrow. After installing [6] in [3], confirm that pin A of [3]
enters hole A of [6] properly.
[3]
Pin D
Pin C
Slots B
First, while pushing the locking tab as
shown in the right, slide and pull up the right
side on [2] to release Pin A and Pin B from
the slots A.
Then, remove Pin C and Pin D on [2] from
the slots B as shown.
[2]
2
Pull up
Pin A
A
1
Slide
Pin B
Slot A
Slot A
1
Hole A
[6]
2
Pin A
View for A
(L-1)
Installation of [4] and [6]
Install [6] in [4] while pulling (L-2) in a direction of
arrow. After installing [6] in [4], confirm that pin B of [4]
enters hole B of [6] properly.
[4]
View for B
Hole B
Pin B
[6]
(L-2)
Fig. DM5H
Locking tab
View for A
Fig. DM4H
2-4-4U29PHSDA
Page 89
[7]
[49]
(S-4A)
[11]
(L-4)
(P-3)
Desolder
from bottom
(S-2)
View for A
Lead with
Red Stripe
A
Fig. DM6H
[50]
(L-12)
[13]
Removal of [11]
1) Remove screw (S-4A).
2) Unhook spring (P-2).
3) Release (L-4) while
holding [12] with a
finger.
4) Loosen a finger
holding [12] and
remove [11].
Pin of [12]
Pin of [10]
View for A
[10]
A
Groove of [27]
When reassembling [10] and
[12], confirm that pin of [10]
and pin of [12] are in the
[27]
groove of [27] as shown.
Fig. DM8H-1
[12]
(P-2)
[9]
A
(S-4)
(S-3)
Desolder
from bottom
Lead with White Stripe
LDG
Belt
[8]
[8]
View for A
Fig. DM7H
2-4-5U29PHSDA
Page 90
Installation of [13] and [12]
Hook spring (P-3) up to [12]
and [13], then install then to
the specified position so that
[12] will be floated slightly
while holding [12] and [13].
(Refer to Fig. A.)
Install pin of [12] in groove of [27].
(Refer to Fig. B.)
(P-3)
[13]
Fig. A
Pin of [12]
[27]
[12]
[14]
(S-5)
(S-6)
[15]
Fig. DM9H
Groove of [27]
Fig. B (Top view)
Notch of
Hold [12] and [13] till groove of
pin of chassis looks and fit [13]
in notch of chassis. Then, turn
a few [13] while holding [12].
(Refer to Fig. C.)
Install [11] and [10] while holding [12].
(Refer to Fig. DM8H-1.)
chassis
Groove of
pin of chassis
[13]
turn
[12]
Fig. C
Fig. DM8H-2
[17]
(L-5)
[16]
[18]
(P-4)
(S-7)
Fig. DM10H
2-4-6U29PHSDA
Page 91
Cap Belt
A
[19]
(S-8)
[22]
turn
(C-1)
[20]
(L-6)
[21]
Installation position of Cap Belt
[20]Cap Belt
View for A
Pin on [22]
[27]
Position of pin on [22]
Fig. DM12H
[19]
Fig. DM11H
2-4-7U29PHSDA
Page 92
[24]
(S-9)
(L-8)
(C-4)
(C-5)
[28]
[29]
[30]
[26]
(L-7)
[23]
(C-3)
(C-2)
[25]
Position of Mode Lever when installed
Pin of [36]
Bottom View
[27]
Installation of [26]
Pin of [33]
Align [26] and [27] as shown.
Pin of [37]
[26]
[27]
[31]
Fig. DM13H-1
[33]
T op Vie w
(P-5)
[32]
First groove on [27]
First tooth on [47]
[27]
When reassembling [27],
meet the first groove on
[27] to the first tooth on
[47] as shown.
Refer to the Alignment
Section, Page 2-5-1.
[35]
(L-9)
Fig. DM13H-2
[34]
Fig. DM14H
2-4-8U29PHSDA
Page 93
[38]
(P-6)
[37]
(C-7)
[41]
[39]
turn
(C-6)
[40]
turn
[43]
(L-10)
[42]
[36]
turn
Fig. DM15H
[48]
[47]
Slide
Fig. DM17H
[44]
Slide Plate
(S-11)
[45]
[46]
(L-11)
Fig. DM16H
2-4-9U29PHSDA
Page 94
ALIGNMENT PROCEDURES OF MECHANISM
The following procedures describe how to align the
individual gears and levers that make up the tape loading/unloading mechanism. Since information about the
state of the mechanism is provided to the System
Control Circuit only through the Mode Switch, it is
essential that th e correct relatio nship bet ween indi vidual gears and levers be maintained.
All alignments are to be performed with the mechanism in Eject mode, in the sequence given. Each
procedure assumes that all previous procedur es have
been completed.
IMPORTANT:
If any one of these ali gnments is not pe rformed properly , e ven if off by only one tooth, the unit will unload or
stop and it may result in damage to the mech anical or
electrical parts.
Alignment points in Eject Position
T op View
Alignment 3
Alignment 1
Loading Arm (SP) and (TU) Assembly
Install Loading Ar m (SP) and (TU) Assembly so that
their triangle marks point to each other as shown in
Fig. AL2.
Alignment 2
Mode Gear
Keeping the two triangles pointing at each other, install
the Loading Ar m (SP) A ssembly so tha t the last tooth
of the gear meets the most in side teeth of the Mode
Gear. See Fig. AL2.
Triangle Marks
Loading Arm
(SP) Assembly
Last T ooth
Alignment 2
Loading Arm
(TU) Assembly
Most inside teeth
of Mode Gear
Alignment 1
Mode Gear
Bottom View
Alignment 1
Alignment 2
Fig. AL1
Fig. AL2
Alignment 3
Cam Gear (A) (HI), Rack Assembly
Install the Rack Assembly so that the first tooth on the
gear of the Rack Assembly meets the first groove on
the Cam Gear (A) (HI) as shown in Fig. AL3.
T op Vie w
Cam Gear (A)(HI)
Alignment 3
First tooth
First groove
on the Cam Gear (A)(HI)
Gear on Rack Assembly
Fig. AL3
2-5-1U29PHSAPM
Page 95
DECK EXPLODED VIEWS
Deck Mechanism View 1
B2
B9
L1191
B73
B10
L1053
B411
B567
L1467
B494
MarkDescription
Floil G-684G or Multemp MH-D
SLIDUS OIL #150
B35
B553
(Blue grease)
B5
L1322
B12
B11
B571
L1450
B492
B74
L1051
B37
B410
L1450
B121
B8
Chassis Assembly
Top View (Lubricating Point)
B501
L1466
B126
B86
Some Ref. Numbers are not in sequence.
Chassis Assembly
Bottom View (Lubricating Point)
2-6-1U29P4HSDEX
Page 96
Deck Mechanism View 2
B487
B587
B416
B521
B591
MarkDescription
Floil G-684G or Multemp MH-D
(Blue grease)
SLIDUS OIL #150
SANKOUL FG84M (Yellow grease)
B508
B414
B572
B565
B499
B417
B568
B573
B585
B574
B518
B564
B590
B148
B592
B31
B522
L1151
L1406
B3
B558
B557
B525
B578
B579
B582
B580
B583
B579
View
for A
Some Ref. Numbers are not in sequence.
A
B581
B559
B516
B133
B52
B551
B507
B488
B491
B513
Bottom Side (Grease point)
Bottom Side
(Grease point)
2-6-2U29P4HSDEX
Page 97
Deck Mechanism View 3
L1321
B355
L1341
B347
B482
L1321
B354
MarkDescription
Floil G-684G or Multemp MH-D
SLIDUS OIL #150
B483
B425
(Blue grease)
B562
B563
B300
B313
B529
B360
B359
B361
B555
Some Ref. Numbers are not in sequence.
B303
B514
2-6-3U29P4HSDEX
Page 98
DECK PARTS LIST
Comparison Chart of Models and Marks
ModelMark
DDV R-550 5VA
DDVR-5805 B
Ref. No. MarkDescriptionPart No.
B2ACYLINDER ASSEMBLY MK12.5 PAL 4HDN2347CYL
B2BCYLINDER ASSEMBLY MK12.5 PAL 6HD orN236ACYL
BCYLINDER ASSEMBLY MK12.5 PAL 6HD(V) N236BCYL
B3LOADING MO TOR ASSEMBLY MK12.50 VSA14636
B5SLIDE PLATE MK12.50VM416429
B8PULLEY ASSEMBLY(HI) MK120VSA13501
B9MOVING GUIDE S P.P MK12.50VSA14717
B10MOVIN G GUIDE T P.P MK12.50 VSA14639
B11LOADING ARM(TU) ASSEMBLY MK120VSA13300
B12LOADING ARM(SP) ASSEMBLY MK120VSA13299
B31AC HEAD ASSEMBLY MK12.50VSA14841
B35TAPE GUIDE ARM ASSEMBLY MK12.50VSA15014
B37CAPSTAN MOTOR 288/VCZC1301N9681CML
B52CAP BEL T MK 100VM4111 38
B73FE HEAD(MK11) MH-131SF11 orDHVEC01Z0005
FE HEAD(MK12) VTR-1X2ERS11-155 orDHVEC01TE005
FE HEAD(MK12) HVFHP0047ADHVEC01AL007
B74PRISM MK100VM202870
B86F BRAKE ASSEMBLY(HI) MK120VSA13447
B121WORM MK120VM414091
B126PULLEY MK120VM414330B
B133IDLER ASSEMBLY(HI ) MK120VSA13451
B148TG CAP MK60VM407664C
B300C DRIVE LEVER(TU) MK120VM203773
B303F DOOR OPENER MK120VM203751C
B313C DRIVE SPRING MK120VM414145
B347GUIDE HOLDER A MK100VM304920
B354SLIDER(TU) MK120VM101172F
B355SLIDER(SP) MK120VM101182H
B359CLEANER LEVER MK100VM304413
B360CLEANER ROLLER MK90VM410032C
B361CL POST MK100VM411114
B410PINCH ARM(A) ASSEMBL Y(6) M K12.5 or0VSA14935
PINCH ARM(A) ASSEMBLY(5) MK120VSA13788
B411PINCH SPRING MK120VM414644
B414M BRAKE(SP) ASSEMBL Y(HI) MK120VSA13655
B416M BRAKE(TU) ASSEMBL Y(HI) MK120VSA13449
B417TENSION SPG(3002645) MK12.50VM414221G
B425LOCK LEVER SPRING MK100VM411110
B482CASSETTE PLATE MK120VM203749
B483LOCK LEVER MK120VM414095
B487BAND BRAKE(SP) MK120VM305723
B488MODE LEVER(HI) MK12 or0VM101175J