Fujitsu D2860 Technical Manual

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System Board D2860 for BX920

Technical Manual

Edition January 2010

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Comments… Suggestions… Corrections…

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manuals@ts.fujtsu.com.

Certified documentation according to DIN EN ISO 9001:2000

To ensure a consistently high quality standard and user-friendliness, this documentation was created to meet the regulations of a quality management system which complies with the requirements of the standard DIN EN ISO 9001:2000.

cognitas. Gesellschaft für Technik-Dokumentation mbH

www.cognitas.de

All hardware and software names used are trademarks of their respective manufacturers.

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Contents

1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2 Important notes . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.1 Notes on safety . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.2 CE Certificate . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.3 Environmental Protection . . . . . . . . . . . . . . . . . . . 11

3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

3.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

3.2 Main memory . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.3 Screen resolution . . . . . . . . . . . . . . . . . . . . . . . 23

3.4 Temperature/system monitoring . . . . . . . . . . . . . . . 23

3.5 LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

3.6 Interfaces and connectors . . . . . . . . . . . . . . . . . . . 26

3.6.1 External ports . . . . . . . . . . . . . . . . . . . . . . . . . . 27

3.7 Settings with switches and jumpers . . . . . . . . . . . . . 28

4 Replacing the lithium battery . . . . . . . . . . . . . . . . . 31

D2860 (BX920) Technical Manual

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1 Introduction

This technical manual describes the system board D2860, which is equipped

with one Intel Further information about drivers is provided in the readme files on the hard

disk, on the supplied “ServerStart“ or “Update“ CDs. You will find further information in the BIOS description.

Notational conventions

The meanings of the symbols and fonts used in this manual are as follows:

italics indicates commands, menu items, file and path

fixed font indicate system output on the monitor.

processor.

names or software programs.

semi-bold fixed font

[Key symbol] indicates keys according to their representation on the

“quotation marks” indicates names and terms that are being empha-

Ê indicates an operation that to be performed.

indicates values to be entered through the keyboard.

keyboard. If capital letters are to be entered explicitly, then the

Shift key is shown, e.g. [SHIFT] - [A] for A. If two keys need to be pressed at the same time, then

this is shown by placing a hyphen between the two key symbols.

sized.

V CAUTION! indicates warnings, which, if ignored, will endanger

your health, destroy the system or lead to the loss of data.

I indicates additional information, notes and tips.

Table 1: Notational conventions

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2 Important notes

In this chapter you will find essential information regarding safety when working with your server.

V CAUTION!

With the system board installed you must open the system to access the system board. How to access the system board of your system is described in the appropriate service supplement.

When handling the system board, refer to the specific notes on safety in the operating manual and/or service supplement for the respective server.

2.1 Notes on safety

V CAUTION!

● The actions described in these instructions should only be performed

by authorized, qualified personnel. Equipment repairs should only be performed by qualified staff. Any failure to observe the guidelines in this manual, and any unauthorized openings and improper repairs could expose the user to risks (electric shock, fire hazards) and could also damage the equipment. Please note that any unauthorized openings of the device will result in the invalidation of the warranty and exclusion from all liability.

● Transport the device only in the antistatic original packaging or in

packaging that protects it from knocks and jolts.

● Only install expansions that are allowed for the system board. If you

install other expansions, you may damage the requirements and rules governing safety and electromagnetic compatibility or your system. Information on which system expansions are suitable can be obtained from the customer service centre or your sales outlet.

● The warranty expires if the device is damaged during the installation

or replacement of system expansions.

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Notes on safety Important notes

V ● Components can become very hot during operation. Ensure you do

not touch components when making extensions to the system board. There is a danger of burns!

● Transmission lines to peripheral devices must be adequately

shielded.

● To the LAN wiring the requirements apply in accordance with the

standards EN 50173 and EN 50174-1/2. As minimum requirement the use of a protected LAN line of category 5 for 10/100 MBit/s Ethernet, and/or of category 5e for Gigabit Ethernet is considered. The requirements of the specification ISO/IEC 11801 are to be considered.

● Never connect or disconnect data transmission lines during a storm

(lightning hazard).

Batteries

V CAUTION!

● Incorrect replacement of lithium battery may lead to a risk of

explosion. The batteries may only be replaced with identical batteries or with a type recommended by the manufacturer.

It is essential to observe the instructions in chapter “Replacing the

lithium battery”.

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Important notes Notes on safety

Modules with electrostatic-sensitive components

Systems and components that might be damaged by electrostatic discharge (ESD) are marked with the following label:

Figure 1: ESD label

When you handle components fitted with ESDs, you must observe the following points under all circumstances:

● You must always discharge yourself of static charges (e.g. by touching a

grounded object) before working.

● The equipment and tools you use must be free of static charges.

● Remove the power plug from the power socket before inserting or removing

boards containing ESDs.

● Always hold boards with ESDs by their edges.

● Never touch pins or conductors on boards fitted with ESDs.

● Use a grounding cable designed for this purpose to connect yourself to the

system unit as you install/deinstall the board.

● Place all components on a static-safe base.

I You will find a detailed description for handling ESD components in the

relevant European or international standards (EN 61340-5-1, ANSI/ESD S20.20).

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CE Certificate Important notes

Notes about boards

● During installation/deinstallation of the system board, observe the specific

instructions described in the service manual for the server.

● Remove the plug from the mains outlet so that system and system board are

totally disconnected from the mains voltage.

● To prevent damage to the system board, the components and conductors on

it, please take great care when you insert or remove boards. Take great care to ensure that extension boards are slotted in straight, without damaging components or conductors on the system board, or any other components, for example EMI spring contacts.

● Be careful with the locking mechanisms (catches, centring pins etc.) when

you replace the system board or components on it, for example memory modules or processors.

● Never use sharp objects (screwdrivers) for leverage.

2.2 CE Certificate

The board complies with the requirements of the EC directives 2004/108/EC regarding “Electromagnetic Compatibility” and 2006/95/EC “Low Voltage Directive”. This is indicated by the CE marking (CE = Communauté Européenne).

Compliance was tested in a typical PRIMERGY configuration.

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Important notes Environmental Protection

2.3 Environmental Protection

Environmentally friendly product design and development

This product has been designed in accordance with standards for ”environmentally friendly product design and development“. This means that the designers have taken into account important criteria such as durability, selection of materials and coding, emissions, packaging, the ease with which the product can be dismantled and the extent to which it can be recycled.

This saves resources and thus reduces the harm done to the environment.

Notes on saving energy

Devices that do not have to be on permanently should not be switched on until they need to be used and should be switched off during long breaks and on completion of work.

I The ON/OFF switch does not separate the server from the line voltage.

For the complete separation from the line voltage you must pull the power supply plugs.

Notes on packaging

Please do not throw away the packaging. We recommend that you do not throw away the original packaging in case you need it later for transporting.

Notes on dealing with consumables

Please dispose batteries in accordance with local government regulations. Do not throw batteries and accumulators into the household waste. They must

be disposed of in accordance with local regulations concerning special waste. All batteries containing pollutants are marked with a symbol (a crossed-out

rubbish bin on wheels). In addition, the marking is provided with the chemical symbol of the heavy metal decisive for the classification as a pollutant:

Cd Cadmium Hg Mercury Pb Lead

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Environmental Protection Important notes

Notes on labeling plastic housing parts

Please avoid attaching your own labels to plastic housing parts wherever possible, since this makes it difficult to recycle them.

Returning, recycling and disposal

The device may not be disposed of with household rubbish. This appliance is labelled in accordance with European Directive 2002/96/EC concerning used electrical and electronic appliances (waste electrical and electronic equipment - WEEE). The guideline determines the framework for the return and recycling of used appliances as applicable throughout the EU. To return your used device, please use the return and collection systems available to you. You will find further information on this at

www.ts.fujitsu.com/recycling.

For details on returning and reuse of devices and consumables within Europe, refer to the “Returning used devices” manual, or contact your Fujitsu

Technology Solutions branch office/subsidiary or our recycling centre in Paderborn:

Fujitsu Technology Solutions Recycling Center D-33106 Paderborn

Tel. +49 5251 8 18010 Fax +49 5251 8 18015

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3 Features

3.1 Overview

Processors

– 1 or 2 Intel – 2 processor sockets LGA1366 for Intel

Xeon™ processors of the 5500 series

Xeon™ processors – integrated memory controller (DDR3) – 32 KB L1 cache (on-die data cache per core) – 32 KB L1 cache (on-die instruction cache per core) – 256 KB L2 cache (mid-level per core) – up to 8 MB on chip shared L3 cache (among all cores) – 2x Intel® QuickPath Interconnect with up to 6,4 GT/s in each direction

Main memory

– 9 slots for main memory DDR3 800 / 1066 / 1333 single-, dual- or quad-

ranked DIMM memory modules with 2 GB, 4 GB and 8 GB

– buffered and unbuffered DIMMs with ECC are supported, no mixed

equipping allowed – maximum 72 GB of memory – minimum 2 GB (1 memory module) – maximum 32 Gbit/s band width (DDR3) – CPU0 has 2 DIMM slots for memory rows per channel, CPU1 has 1 DIMM

slot for memory row per channel – ECC multiple-bit error detection and single-bit error correction – memory scrubbing functionality – Single Device Data Correction (SDDC) function (Chipkill™) –Mirroring – Sparing – Locking

Chips on the system board

– Intel – Intel – 2x Intel

5500 chipset

ICH10 Base

dual-channel Gigabit Ethernet controller Intel® 82575X2 – Hard disk controller LSI1064E SAS for 2 SAS hard disks – TPM 1.2 Infineon SLB9635 TT1.2 card (option) – Board Management controller iRMC S2 with integrated graphic controller

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Overview Features

– 2 MB Flash ROM – 32Mx16-667 DDR2 SRAM for iRMC S2 – ADT7462 temperature/system monitoring controller

Graphic

– integrated VGA controller with PCIe x1 interface (PILOT-II) – 8 MB graphic memory available via driver

LAN – Ethernet controller

– 2x Intel

82575X2 dual-port 10/100/1000 MBit/s Base-T Ethernet controller

– 1x BCM5221 for iRMC S2

Storage devices

– 2x SAS (1.5 Gbit/s) or 2x SATA – 2.5“ drive slide-in modules are supported – UFD (USB Flash Disk)

External connectors

– 4x USB 2.0 interfaces with 480 Mbit/s at the front side – 1x serial interface at the front side –1x VGA

Internal connectors

– 1x VGA port at the front side – 1x universal USB port for 4 USB connectors at the front side – 1x UFD port (USB Flash Disk connection) for USB Flash ROM – 9x slots for DDR3 memory modules – power supply (12 V and 5 V auxiliary supply) – combined connector for HDD power supply and fan – 2x power supply connectors

iRMC S2 Server Management controller

– basic functionalities: fan control, voltage supervision for onboard voltages,

temperature monitoring, System Event Log and ASR&R (Automatic Server

Reconfiguration and Restart) –PDA – Global Error/CSS/ID LED – pre-failure warranty for memory

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Features Overview

– HD LED support (SAS, IDE, SATA, SCSI) – Inventory Identification Control – CSS functionality – power consumption control – text console redirection – Advanced Video Redirection - AVR – remote storage

Security features

– system and BIOS password – recovery BIOS support – flash write protection against virus

Power management

– ACPI (states S0, S1, S4, S5) – on/off/sleep/wake by power button – on/off by software – wake on by RTC, external serial ports, LAN, PCI Express controller and

iRMC S2

– power on by power button, external serial ports, LAN, PCI Express controller

and iRMC S2

BIOS features

–AMI – SMBIOS 2.5 (DMI) – MultiProcessor specification – Server Hardware Design Guide –WfM – ACPI support – LSI SAS/RAID BIOS – USB keyboard/mouse – boot possible from:

– hard disk (SATA, SAS, SCSI, USB) – USB stick – CD/DVD (SATA, SAS)

–LAN – console redirection support – OEM logo – CPU, memory disable – Mirroring and Spare memory support

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Overview Features

Environmental protection

Battery in holder for recycling

Form factor, slot compatibility list

– 491 x 200mm – ACPI 2.0, OnNow, PCI Express 2.0, LPC 1.1, WfM 2.0, SHDG 3.0, MPS 1.4,

IPMI 1.5, PCI SHPC 1.0 and PCI Express card electromechanical specification rev. 1.0, USB2.0, SATAII 2.0

CSS (Customer Self Service)

This system board supports the CSS functionality. You will find a description of CSS functionality in the operating manual of your server.

UFD (option)

By the manufacturer the system board is equipped with a slot for an UFD (USB Flash Disk).

TPM (option)

The system board can be equipped with a TPM (Trusted Platform Module) by the manufacturer or by an add-on kit. This module enables programs from third party manufacturers to store key information (e.g. drive encryption using Windows Bitlocker Drive Encryption).

The TPM is activated via the BIOS system (for more information, refer to the BIOS manual).

V CAUTION!

– When using the TPM, note the program descriptions provided by the

third party manufacturers. – You must also create a backup of the TPM content. To do this, follow

the third party manufacturer's instructions. Without this backup, if the

TPM or the system board is faulty you will not be able to access your

data. – If a failure occurs, please inform your service about the TPM

activation before it takes any action, and be prepared to provide them

with your backup copies of the TPM content.

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Features Main memory

3.2 Main memory

The system board supports up to 72 GB main memory. 9 slots for main memory are available. Each slot can be populated with 2 GB, 4 GB or 8 GB single-, dualor quad-ranked DIMM memory modules.The minimum population in the independent channel mode is 1 DIMM.

ECC with memory scrubbing and with the Single Device Data Correction (SDDC) function is supported.

I You will find the descriptions how to install memory modules in the

Options Guide of your server.

Module population

DIMM 1F

DIMM 1E

DIMM 1D

CPU 2

DIMM 2A

DIMM 1A

DIMM 2B

DIMM 1B

Figure 2: Assembly of the main memory in channels and slots

Channel F Channel E Channel D

CPU 1

DIMM 2C

DIMM 1C

Channel A

Channel B

Channel C

The arrows in figure 2 show the direction of the population of the memory slots. This direction is only valid for the Independent Channel Modus. For Mirrored and Spare Channel Modus other directions of the population are valid.

● The memory modules are organized in 3 channels (A - F) per CPU. CPU1

has 3 channels with 2 slots each (1-2) and CPU2 has 3 channels with 1 slot

each (1).

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Main memory Features

● The channels A - C are controlled by CPU 1 and the channels D - F are

controlled by CPU 2.

● x4 or 8 x organized registered DIMMs with ECC are supported.

There are four operational modes for the main memory: – Independent channel mode (maximum population)

The populated memory of the six channels (A - F) can be used completely (max. 72 GB).

– Mirrored channel mode (maximum security)

Only the populated memory of the two channels A and D can be used (max. 24 GB). The channels B and E serve as safeguarding against failure. The memory belonging to the channels B and E contain the mirrored data of the memory belonging to channel A and D. The channels C and F are not used.

– Performance channel mode (maximum performance)

The populated memory of the six channels (A - F) can be used completely

(max. 72 GB).

– Spare channel mode (large population and large security)

Only the populated memory of the four channels A, B, D and E can be used (max. 48 GB). The channels C and F serve as safeguarding against failure.

Depending on the mode of operation there are different population requirements for the main memory.

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Features Main memory

Independent channel mode

Minimum Memory Configuration (Independent Mode)

1. Upgrade

2. Upgrade

DIMM 1D

CPU 2

DIMM 1D

CPU 2

DIMM 1D

CPU 2

DIMM 1E

DIMM 2A

DIMM 1A

DIMM 1E

DIMM 2A

DIMM 1A

DIMM 1E

DIMM 1F

DIMM 2B

DIMM 1B

DIMM 1F

DIMM 2B

DIMM 1B

DIMM 1F

CPU 1

DIMM 2C

DIMM 1C

CPU 1

DIMM 2C

DIMM 1C

CPU 1

Channel F Channel E Channel D

Channel A

Channel B

Channel C

Channel F Channel E Channel D

Channel A

Channel B

Channel C

Channel F Channel E Channel D

3. Upgrade

DIMM 1D

CPU 2

DIMM 2A

DIMM 1A

DIMM 1E

DIMM 2A

DIMM 1A

DIMM 2B

DIMM 1B

DIMM 1F

DIMM 2B

DIMM 1B

DIMM 2C

DIMM 1C

Channel F Channel E Channel D

CPU 1

DIMM 2C

DIMM 1C

Channel A

Channel B

Channel C

Channel A

Channel B

Channel C

Figure 3: Independent channel mode

In figure 3 you can see the slots that must be populated for a minimum configuration and for the first three upgrades.

Independent channel mode allows for channels to be populated in any order and no matching between channels is required.

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Main memory Features

● All channels in a system will run at the fastest common frequency.

● Can run with differently rated DIMMs and use the settings of the slowest

DIMM within a channel.

● Timings other than frequency can vary between channels.

Mirrored channel mode

Memory Configuration (Mirrored Mode)

CPU 1

DIMM 2C

DIMM 1C

CPU 1

DIMM 2C

DIMM 1C

Channel F Channel E Channel D

Channel A

Channel B

Channel C

Channel F Channel E Channel D

Channel A

Channel B

Channel C

DIMM 1D

1. Upgrade

DIMM 1D

DIMM 1E

CPU 2

DIMM 2A

DIMM 1E

CPU 2

DIMM 2A

DIMM 1F

DIMM 1A

DIMM 2B

DIMM 1B

DIMM 1F

DIMM 1A

DIMM 2B

DIMM 1B

Figure 4: Mirrored channel mode

In figure 4 you can see the slots that must be populated for a minimum configuration and for the first upgrade.

In this mode channel A and channel B are exact copies of each other.

● Channel A and channel B must be populated identically (channel C is not

usable in this mode).

● Memory slot populations within a channel do not have to be identical but the

same memory slot location across channel A and B must be populated the same way.

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Features Main memory

● Can run with differently rated memory modules and use the settings of the

slowest memory module on both channels.

● The total physical memory available to the system is half of what is

populated.

Performance channel mode

Memory Configuration (Spare Mode)

DIMM 1D

CPU 2

1. Upgrade

DIMM 1D

CPU 2

Figure 5: Performance channel mode

DIMM 1E

DIMM 2A

DIMM 1A

DIMM 1E

DIMM 2A

DIMM 1A

DIMM 1F

DIMM 2B

DIMM 1B

DIMM 1F

DIMM 2B

DIMM 1B

Channel F Channel E Channel D

CPU 1

DIMM 2C

DIMM 1C

Channel F Channel E Channel D

CPU 1

DIMM 2C

DIMM 1C

Channel A

Channel B

Channel C

Channel A

Channel B

Channel C

In figure 5 you can see the slots that must be populated for a minimum configuration and for the first upgrade.

In this mode the maximum performance and capacity is available.

● All three channels must be populated identically with regards to size and

organization.

● Memory slot populations within a channel do not have to be identical but the

same memory slot location across three channels must be populated the

same way.

● Can run with differently rated memory modules and use the settings of the

slowest memory module within a channel.

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Main memory Features

Spare channel mode

In this mode, the channel C is a spare of the two active channels A and B. The channel C is not available as system memory. The equipping is identical with the performance channel mode.

● All three channels must be populated identically with regards to size and

organization.

● Memory slot populations within a channel do not have to be identical but the

same memory slot location across three channels must be populated the same way.

● Can run with differently rated memory modules and use the settings of the

slowest memory module within a channel.

● Timings in the active channels (A and B) and the spare channel (C) can be

set to different values.

● Only 2/3 of the maximum memory bandwidth is achievable.

● The total physical memory available to the system is 2/3 of what is

populated.

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Features Screen resolution

3.3 Screen resolution

Depending on the operating system used the screen resolutions in the following table refer to the graphic controller on the system board. The graphic controller is integrated in the iRMC (integrated Remote Management Controller).

Screen resolution Max. color depth Max. frequency

640 x 480 Hz 32 Bit 85 Hz 800 x 600 Hz 32 Bit 85 Hz 1024 x 768 Hz 32 Bit 75 Hz 1152 x 864 Hz 16 Bit 60 Hz 1280 x 1024 Hz 24 Bit 60 Hz 1600 x 1200 Hz 16 Bit 60 Hz

If you are using an external graphic controller, you will find details of supported screen resolutions in the documentation supplied with the graphic controller.

3.4 Temperature/system monitoring

Temperature and system monitoring aim to reliably protect the computer hardware against damage caused by overheating. In addition, any unnecessary noise is also prevented by reducing the fan speed, and information is provided about the system status.

The temperature and system monitoring are controlled by the iRMC S2 (integrated Remote Management Controller).

The following functions are supported:

Temperature monitoring

Measurement of the processor and the system internal temperature by an onboard temperature sensor, measurement of the ambient temperature by a

C temperature sensor.

Fan control

The fans are regulated according to temperature.

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Temperature/system monitoring Features

Sensor monitoring

The removal of, or a fault in, a temperature sensor is detected. Should this happen all fans monitored by this sensor run at maximum speed, to achieve the greatest possible protection of the hardware.

Voltage monitoring

When voltage exceeds warning level high or falls below warning level low an alert will be generated.

System Event Log (SEL)

All monitored events of the system board are signalized via the Global Error LED and recorded in the System Event Log. They could be retrieved in the BIOS Setup or via ServerView.

Diagnostic LEDs

For signalisation of failures LEDs are situated on the system board.

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Features LEDs

3.5 LEDs

12 3

DIMM 1F

CPU 1

DIMM 1A

DIMM 2B

DIMM 1B

DIMM 2C

DIMM 1C

DIMM 1D

CPU 2

DIMM 1E

DIMM 2A

Figure 6: LEDs

All LEDs are only visible if the cover has been opened. The LEDs have the following meaning:

LED Indicator Meaning

4567

1 Mezzanine board 1 yellow Error on Mezzanine board 1 2 DIMMs 1D - 1F yellow Faulty memory module 3 CPU 1 yellow CPU faulty 4 DIMMs 1A - 1C, 2A - 2C yellow Faulty memory module 5CSS button 6 CPU 2 yellow CPU faulty 7 Mezzanine board 2 yellow Error on Mezzanine board 2

By pressing the Indicate CSS button (INDICATE CSS BUTTON near the DIMM slots for CPU2) the defective component can also be indicated in the power-off condition (power supply plug disconnected).

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Interfaces and connectors Features

3.6 Interfaces and connectors

123

DIMM 1A

DIMM 2B

DIMM 1F

DIMM 1B

CPU 1

DIMM 2C

DIMM 1C

HDD 1

HDD 2

uSSD

Mezzanine Card 1

Mezzanine Card 2

DIMM 1D

CPU 2

DIMM 1E

DIMM 2A

Figure 7: Schematic view of the system board D2860

1 slot 1 for Mezzanine board 1 8 memory slots1A - 1C, 2A - 2C 2 memory slots 1D - 1F 9 slot 2 for Mezzanine board 2 3 DIP switch 10 Mezzanine board 2 4 slot hard disk 1 11 Mezzanine board 1 5 slot hard disk 2 12 TPM 6 UFD drive 13 battery 7slot for UFD

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Features Interfaces and connectors

3.6.1 External ports

12 34567 8

Figure 8: External ports of the system board D2860

Power (green) 5 Connection LED Fabric 1

Identification LED (blue) 6 Connection LED Fabric 2

Global Error LED (red) 7 Connection LED Fabric 3

and 4

CSS LED (yellow) 8 Connectors 4x USB, VGA,

serial

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Settings with switches and jumpers Features

3.7 Settings with switches and jumpers

DIP switch

1 2 34

Figure 9: DIP switch

I Default setting switch 1 to 4 = Off.

Switch 1 - NVRAM Clear

Switch 1 specifies whether the BIOS default settings are to be loaded or not.

on The BIOS default settings are loaded; the user-defined settings are

deleted.

off The user-defined settings are retained (default setting).

Switch 2 - Clear Password

Switch 2 specifies whether the BIOS password should be requested at system boot if password protection is activated in the BIOS setup (the Password on boot field is set to enabled in the SECURITY menu).

on The password prompt is skipped. The user-defined BIOS passwords are

deleted.

off The password prompt is active (default setting).

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Features Settings with switches and jumpers

Switch 3 - BIOS Recovery

Switch 3 allows the system BIOS to be restored after an erroneous update. To restore the system BIOS you need a "BIOS flashing medium" (for more information, refer to the BIOS manual or contact the customer service team).

on The system starts from the "BIOS flashing medium" (ODD, USB stick)

and reprograms the system BIOS on the board.

off The system starts with the system BIOS of the system board (default

setting)

Switch 4 - TBS Override

This switch currently has no function.

TPM jumper

TPM enable

TPM CON

Figure 10: Position of the TPM jumper (TPM enable)

Pin Signal Description

1 TPM RESET L Reset of the TPM module 2 ICH TMP DIS L Reset of ICH10

I As default the jumper (1-2) is set. Without jumper the TPM function is

disabled.

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Settings with switches and jumpers Features

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4 Replacing the lithium battery

In order to save the system information permanently, a lithium battery is installed to provide the CMOS-memory with a current. When the charge is too low or the battery is empty, a corresponding error message is provided. The lithium battery must then be replaced.

V CAUTION!

The lithium battery must be replaced with an identical battery or a battery type recommended by the manufacturer (CR2032).

Do not throw lithium batteries into the trash can. It must be disposed of in accordance with local regulations concerning special waste.

Make sure that you insert the battery the right way round. The plus pole must be on the top!

Figure 11: Replacing the lithium battery

Ê Press the locking spring into direction of the arrow (1), so that the lithium

battery jumps out of its socket.

Ê Remove the battery (2). Ê Insert a new lithium battery of the same type into the socket (3) and (4).

D2860 (BX920) Technical Manual 31

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Fujitsu D2860 Technical Manual

Specifications and Main Features

Frequently Asked Questions

User Manual