BECAUSE THIS PRODUCTIS RoHS LEAD-FREE COMPLIANT, USE THE DESIG-
NATED AFTER-SELES PARTS AND THE DESIGNATED LEAD-FREE SOLDER WHEN
PERFORMING REPAIRS. (Refer to page 3 to page 5)
WARNING
THE COMPONENTS IDENTIFIED WITH THE MARK “ ” ON THE SCHEMATIC
DIAGRAM AND IN THE PARTS LIST ARE CRITICAL FOR SAFETY.
PLEASE REPLACE ONLY WITH THE COMPONENTS SPECIFIED ON THE SCHEMATIC
DIAGRAM AND IN THE PARTS LIST.
IF YOU USE PARTS NOT SPECIFIED, IT MAY RESULT IN A FIRE AND AN
ELECTRICAL SHOCK.
FUJI PHOTO FILM CO., LTD.
Ref.No.:ZM00638-100
Printed in Japan 2006.05
FinePix A600 Service Manual
SAFETY CHECK-OUT
After correcting the original problem, perform the following
safety check before return the product to the customer.
1. Check the area of your repair for unsoldered or poorly
soldered connections. Check the entire board surface
for solder splasher and bridges.
2. Check the interboard wiring to ensure that no wires are
“pinched” or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly
transistors, that were installed during a previous repair.
Point them out to the customer and recommend their
replacement.
4. Look for parts which, though functioning, show obvious
signs of deterioration. Point them out to the customer
and recommend their replacement.
5. Check the B + voltage to see it is at the values
specified.
6. Make leakage - current measurements to determine
that exposed parts are acceptably insulated from the
supply circuit before returning the product to the
customer.
7.CAUTION: FOR CONTINUED
PROTECTION AGAINST FIRE
HAZARD, REPLACE ONLY WITH
SAME TYPE 2.5 AMPERES 125V
FUSE.
2.5A 125V
2.5A 125V
8.WARNING:
RISK OF FIREREPLACE FUSE
AS MARKED
ATTENTION: AFIN D'ASSURER
UNE PROTECTION
PERMANENTE CONTRE LES
RISQUES D'INCENDIE,
REMPLACER UNIQUEMENT
PAR UN FUSIBLE DE MEME,
TYPE 2.5 AMPERES, 125 VOLTS.
TO REDUCE THE ELECTRIC
SHOCK, BE CAREFUL TO
TOUCH THE PARTS.
WARNING!
HIGH VOLTAGE
2
FinePix A600 Service Manual
RoHS lead-free compliance
Because this product is RoHS lead-free compliant, use the designated after-sales parts and the designated lead-free solder
when performing repairs.
<Background & Overview>
With the exception of parts and materials expressly excluded from the RoHS directive (*1), all the internal connections and
component parts and materials used in this product are lead-free compliant (*2) under the European RoHS directive.
*1: Excluded items (list of the main lead-related items)
• Lead included in glass used in fluorescent tubes, electronic components and cathode-ray tubes
• Lead in high-melting-point solder (i.e. tin-lead solder alloys that contain 85% lead or more)
• Lead in ceramic electronic parts (piezo-electronic devices)
• Mercury contained in fluorescent tubes is also excluded.
*2: Definition of lead-free
A lead content ratio of 0.1 wt% or less in the applicable locations (solder, terminals, electronic components, etc.)
<Reference>
RoHS:The name of a directive issued by the European Parliament aimed at restricting the use of
certain designated hazardous substances included in electrical and electronic equipment.
When carrying out repairs, use a designated lead-free solder, bearing in mind the differing work practices for conventional
solder (eutectic) and lead-free solder.
Differences in the soldering work for lead-free and eutectic solder
When the soldering work practices for eutectic solder and lead-free solder are compared, the main differences are as shown
below. In particular, when lead-free solder is used, the solder tends to be less workable than when eutectic solder is used.
Accordingly, the soldering techniques used must take that into account.
Difference
The solder starts melting later.
1
Poor wetting
2
Solder feed rate is difficult to control.
3
Wetting the insides of through holes is especially
4
difficult.
5
During repairs (or modifications) removing solder
from inside through holes is difficult.
6
There is serious carbonization of the soldering iron.
The surface is not glossy.
7
The initial melting point of lead-free solder is high, so you
have to get used to it.
Move the tip of the soldering iron around to heat the entire
connection to the melting temperature and assist wetting.
Use the solder (wire) diameter and soldering iron that are
best suited to connection being soldered.
First apply solder to the area immediately around the
through hold and then feed the solder into the hole.
Use a suitable wicking wire (with a suitable method and
heating) and a suction tool.
Either put solder onto the soldering iron tip after completing
the work, or turn the iron off frequently.
Learn to recognize the appearance of the surface.
Countermeasure
3
FinePix A600 Service Manual
Setting temperature during lead-free soldering
• Lead-free solder melting temperature
The melting point of eutectic (Sn-Pb) solder is 183°C, while the melting point of lead-free solder (Sn-Ag-Cu) is 30°C higher
at 220°C.
• Soldering iron tip temperature
The temperature setting for the soldering iron used should be such that the tip of the soldering iron is at the correct
bonding temperature for the connection. This temperature is normally set at around 100°C higher than the melting point of
the solder.
However, the actual temperature should take into account the shape and size of the soldering iron tip, the heat tolerance
of the connection and the workability of that temperature.
• Correct bonding temperature
The correct bonding temperature refers not to the temperature of the heat source, but to the bonding temperature that will
give the best bond strength.
Precautions when soldering with lead-free solder
• Soldering iron maintenance
Because of the high soldering iron temperature in lead-free soldering, there is rapid carbonization of the flux adhering to
the tip of the soldering iron.
(1) Always cover the tip of the soldering iron with solder when it is not being used.
(2) If the tip is black from carbonization, wipe it gently with a paper towel soaked in alcohol until the solder will wet.
• Uniform heating of the board and components
To ensure that the lead-free solder wets the entire surface of the pattern and the lands despite its poor wetting
characteristics, you must move the tip of the soldering iron over a wide area to raise the temperature of the entire
connection.
Soldering iron
A soldering iron with a temperature control is best.
4
FinePix A600 Service Manual
Solder wire (thread)
Use the lead-free solders specified below.
Solder type: Sn96.5Ag3Cu0.5 (Displayed symbol: SnAgCu)
Wire diameter: 0.6, 0.8 or 1.0 mm
MOTOR BLOCKShutter/Iris/AF/Zoom drive (IC501)
AUDIO BLOCKAudio IN/OUT (IC361)
VIDEO BLOCKVideo output (IC207)
KEY BLOCKKey switch
FLASH BLOCKFlash charge, Flash firing
MEDIA BLOCKMedia data IN/OUT
LCD BLOCKLCD output CN, Back light control
DCDC BLOCKPower supply generation (IC303), Flash charge control,
Power control
PROCESS BLOCKImage signal processing, USB communications,
system control (IC203)
SUB PWB ASSYSUB PWB BLOCKRelease SW, Power SW
23
3. Schematics
FinePix A600 Service Manual
3-3.Functions of Primary Blocks
3-3-1.Technical Outline
Equipped with a 1/1.7-inch Super CCD HR (with 6.3 effective megapixels) and a Fujinon 3x optical zoom lens.
Features a image signal processing LSI chip, called the XCS2R_IC (IC203, CSP_IC), built into the MAIN PWB ASSY.
This CPU incorporates the standard peripheral I/O functions as well as the peripheral functions required for still image
processing into a single chip. Standard peripheral I/O consists of the interrupt controller, DMA controller, clock controller,
SDRAM controller, block selection controller, serial I/O, multifunction timer, monitoring timer, programmable I/O ports,
USB 2.0 (Full Speed), microprocessor ADC, microprocessor DAC, image processing circuit, JPEG compression/
expansion circuit, display control circuit, still image processing and card interface circuit.
In the white balance procedure, an algorithm has been installed that provides an estimation of the light source used for
shooting based on the brightness and light source color detected when the shot was taken, and a white balance (WB)
compensation function based on that estimation. The new algorithm is designed to prevent “hunting” due to field-of-view
slippage by providing more accurate brightness and color detection, and to allow the installation of a powerful algorithm
for distinguishing between the light source and the original subject colors.
Flash brightness is adjusted using the CCD-TTL method in which the flash brightness is calculated from the CCD
feedback data generated by the pre-flash.
Explanation of the imaging circuit functions
Analog video signals output from the CCD (1/1.7-inch with 6.3 effective megapixels) undergo pseudo-color correction
processing, adaptive interpolation processing, amplification and signal mixing in the BCS-R_IC (IC103; CSP_IC). The
converted digital signals are then sent to the single-chip image signal processing LSI chip, known as XCS2R_IC (IC203,
CSP_IC).
Input data from the CCD
* The 10-bit digital image data (corresponding to 1H) sent from the imaging circuit (BCS-R) is sent to XCS2R_IC, buffered
in the chip’s IBFC and replaced by 16-bit (96 MHz) data. The replaced 16-bit (96 MHz) image data is then stored in the
XCS2R_IC [SDRAM] via the XCS2R_IC [I/O BUFFER]. The image data for each frame is temporarily stored in the
XCS2R_IC [SDRAM].
* At the same time, the AE for [AUTO] is calculated using the 10-bit image data input to XCS2R_IC and the data required
for AE, AWB and AF is sent to the XCS2R_IC [SDRAM]. In the XCS2R_IC [SDRAM], the data is sent serially to AFE_CS
to obtain the correct AE, AWB and AF.
Recording onto an xD-Picture card
The image data stored in SDRAM is converted to 16-bit (96-MHz) data by [IBFC] in XCS2R_IC one line at a time and
then sent to [YC PRO]. In [IBFC], the 32-bit Y and C signals are each converted to 8-bit Y, Y, Cb and Cr signals and sent
to the XCS2R_IC [SDRAM]. The image data stored in the XCS2R_IC [SDRAM] is compressed using [JPEG] in
XCS2R_IC and then recorded sequentially onto the xD-Picture card via [MEDIA] in XCS2R_IC.
Playing back images from an xD-Picture card
The compressed image data from the xD-Picture card is sent to XCS2R_IC and stored in the XCS2R_IC [SDRAM] via
[MEDIA]. The compressed image data stored in the XCS2R_IC [SDRAM] is expanded using [JPEG] and again stored in
the XCS2R_IC [SDRAM]. The expanded image data is sent to [YC PRO] via [IBFC]. In [YC PRO], gain control and
aperture processing is applied for the brightness signals and color difference signals, after which the data is again stored
in the XCS2R_IC [SDRAM]. The image data is then displayed via [ENCD] and [D/A].
In movie shooting mode
The 10-bit digital image data output from the imaging unit is converted to 8-bit Y and C signals by the XCS2R_IC [YC
PRO] and sent to the XCS2R_IC [SDRAM]. The image data is compressed using [JPEG] in XCS2R_IC and again stored
in the XCS2R_IC [SDRAM]. The compressed data is then recorded sequentially onto the xD-Picture card via [MEDIA] in
XCS2R_IC.
The imaging system adjustment data is stored in FLASH_ROM (IC202).
Explanation of the LCD controller functions
The R, G and B signals processed in the XCS2R_IC image signal processor are output to the LCD panel via [LCD
CONST].
LCD Unit
The LCD monitor (1.8-inch 77,000 pixels) used in the camera uses a low-temperature polysilicon TFT color LCD screen.
Power Supply Section
Power supply circuits constructed in the core of the HPS_IC (IC303) create the following power supplies, which are