This addendum describes corrections to the
MPC5604B/C Microcontr oller Refer ence Manual, order
number MPC5604BCRM. For convenience, the addenda
items are grouped by revision. Please check our website
at http://www.freescale.com/powerarchitecture for the
latest updates.
The current version available of the MPC5604B/C Microcontroller Reference Manual is Revision 8.1.
Table of Contents
1Addendum List for Revision 8.1 . . . . . . . . . . . . . . 2
Add a note below Table 27-4, “CFlash TestFlash Structure”.
NOTE
Unique Device ID – Memory location. This device now includes a 128-bit Unique
Identification number (UID) which is programmed during device fabrication.
Start – Stop Address Size (Bytes) Content:
•0x00403C10 0x00403C17 8 UID 1
•0x00403C18 0x00403C1F 8 UID 2
2Addendum List for Revision 8
Table 2. MPC5604BCRM Rev 8 Addenda
LocationDescription
Chapter 4, Signal description,
page 60
Chapter 6, Clock Description,
page 113
Chapter 9, Reset Generation
Module (MC_RGM), page
209
In Table 4-3, Functional port pin descriptions, row PH[9], change the pin numbers for
MPC560xB 64 LQFP and MPC560xC 64 LQFP from “—” to 60.
In row PH[10], change the pin numbers for MPC560xB 64 LQFP and MPC560xC 64 LQFP
from “—” to 53.
Add Note: to Section 6.8.4.1, Crystal clock monitor:
Note: Functional FXOSC monitoring can only be guaranteed when the FXOSC frequency is
greater than (FIRC / 2
Add Note: to Section 6.8.4.2, FMPLL clock monitor:
Note: Functional FMPLL monitoring can only be guaranteed when the FMPLL frequency is
greater than (FIRC / 4) + 0.5 MHz.
Replace Section 9.4.7, Boot Mode Capturing, with the following:
The MC_RGM samples P A[9:8] whenev er RESET is asserted until five FIRC (16 MHz internal
RC oscillator) clock cycles before its deassertion edge. The result of the sampling is used at
the beginning of reset PHASE3 for boot mode selection and is retained after RESET has been
deasserted for subsequent boots after reset sequences during which RESET is not asserted.
RCDIV
)+0.5MHz.
Chapter 13, Real Time Clock /
Autonomous Periodic
Interrupt (RTC/API), page
262
Note: In order to ensure that the boot mode is correctly captured, the application needs to
apply the valid boot mode value the entire time that RESET is asserted.
RESET can be asserted as a consequence of the internal reset generation. This will force
re-sampling of the boot mode pins. (See Table 9-12 for details.)
In Table 13-3 (RTCC field descriptions), update Note in RTCC[APIVAL] field description:
Note: API functionality starts only when APIVAL is nonzero. The first API interrupt takes two
more cycles because of synchronization of APIVAL to the RTC cloc k, and APIVAL + 1 cycles
for subsequent occurrences. After that, interrupts are periodic in nature. Because of
synchronization issues, the minimum supported value of APIVAL is 4.
MPC5604BRMAD, Rev. 2
Freescale Semiconductor2
Table 2. MPC5604BCRM Rev 8 Addenda
LocationDescription
Chapter 21, LINFlex, p. 412Insert the following section:
21.8.2.1.6Overrun
Once the message buffer is full, the next valid message reception leads to an
overrun and a message is lost. The hardware sets the BOF bit in the LINSR to
signal the overrun condition. Which message is lost depends on the
configuration of the RX message buffer:
•If the buffer lock function is disabled (LINCR1[RBLM] = 0) the last
message stored in the buffer is overwritten by the new incoming
message. In this case the latest message is always available to the
application.
•If the buffer lock function is enabled (LINCR1[RBLM] = 0) the most
recent message is discarded and the previous message is available in the
buffer.
Chapter 22, FlexCAN,
throughout chapter
Chapter 22, FlexCAN, page
429
Chapter 22, FlexCAN, page
461
Chapter 22, FlexCAN, page
462
Chapter 22, FlexCAN, page
463
Chapter 25, Analog-to-Digital
Converter (ADC), page
Chapter 25, Analog-to-Digital
Converter (ADC), page 597
Remove references throughout the chapter to “low-cost MCUs.”
Add this Note in the RTR field description of Table 22-4 (Message Buffer Structure field
description):
Note: Do not configure the last Message Buffer to be the RTR frame.
In Section 22.4.9.4, Protocol timing, update the Note following Figure 22-16 (CAN engine
clocking scheme) to read: “This clock selection feature may not be available in all MCUs. A
particular MCU may not have a PLL, in which case it would have only the oscillator clock, or
it may use only the PLL clock feeding the FlexCAN module. In these cases, the CLK_SRC bit
in the CTRL Register has no effect on the module operation.”
Update the table title of Table 22-20 from “CAN Standard Compliant Bit Time Segment Settings”
to “Bosch CAN 2.0B standard compliant bit time segment settings.”
In Section 22.4.9.4, Protocol timing, update the Note following Table 22-20 to read: “Other
combinations of Time Segment 1 and Time Segment 2 can be valid. It is the user’s
responsibility to ensure the bit time settings are in compliance with the CAN standard. For bit
time calculations, use an IPT (Information Processing Time) of 2, which is the value
implemented in the FlexCAN module.”
In Section 28.3.5.2, Presampling channel enable signals, in Table 28-7, Presampling voltage
selection based on PREVALx fields, in the 01 row, change the “Presampling voltage” field to:
V1 = V
DD_HV_ADC0
In Section 25.3.2, Analog clock generator and conversion timings, remove the paragraph:
The direct clock should basically be used only in low power mode when the device is using
only the 16 MHz fast internal RC oscillator, but the conversion still requires a 16 MHz clock
(an 8 MHz clock is not fast enough). In all other cases, the ADC should use the clock divided
by two internally.
or V
DD_HV_ADC1
.
MPC5604BRMAD, Rev. 2
Freescale Semiconductor 3
Table 2. MPC5604BCRM Rev 8 Addenda
LocationDescription
Chapter 25, Analog-to-Digital
Converter (ADC), p. 600
Chapter 25, Analog-to-Digital
Converter (ADC), page 603
Chapter 25, Analog-to-Digital
Converter (ADC), page 610
Chapter 26, Cross Triggering
Unit (CTU), page 633
In Section 25.3.4.2, CTU in trigger mode, replace the sentence:
If another CTU conversion is triggered before the end of the conversion, that request is
discarded.
with:
If another CTU conversion is triggered before the end of the conversion, that request is
discarded. However, if the CTU has triggered a conversion that is still ongoing on a channel,
it will buffer a second request fo r the channel and wait for the end of the first conv ersion before
requesting another conversion. Thus, two conversion requests close together will both be
serviced.
Add Note to Section 25.3.10, Auto-clock-off mode:
Note: The auto-clock-off feature cannot operate when the digital interface runs at the same
rate as the analog interface. This means that when MCR.ADCCLKSEL = 1, the analog clock
will not shut down in IDLE mode.
In Section 25.4.6.2, Main Status Register (MSR), replace the ADCST ATUS field description with
the following:
The value of this parameter depends on ADC status:
000 IDLE — The ADC is powered up but idle.
001 Power-down — The ADC is powered down.
010 Wait state — The ADC is waiting for an external multiplexer . This occurs only when the
DSDR register is nonzero.
011 Reserved
100 Sample — The ADC is sampling the analog signal.
101 Reserved
110 Conversion — The ADC is converting the sampled signal.
111 Reserved
At the end of Section 26.4.1, Event Configuration Registers (CTU_EVTCFGRx) (x = 0...63), add
the following Note:
NOTE
The CTU tracks issued conversion requests to the ADC. When the ADC
is being triggered by the CTU and there is a need to shut down the ADC,
the ADC must be allowed to complete conversions before being shut
down. This ensures that the CTU is notified of completion; if the ADC
is shut down while performing a CTU-triggered conversion, the CTU is
not notified and will not be able to trigger further conversions until the
device is reset.
3Revision History
Table 3 provides a revision history for this reference manual addendum document.
Table 3. Revision History Table
Rev. NumberSubstantive ChangesDate of Release
2.0Add a note below Table 27-4, “CFlash TestFlash Structure”09/2013
1.0Initial release.05/2012
MPC5604BRMAD, Rev. 2
Freescale Semiconductor4
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use, even if such claim alleges that Freescale Semiconductor was negligent
regarding the design or manufacture of the part.
This addendum document describes corrections to the
MPC5604B/C Microcontr oller Refer ence Manual, order
number MPC5604BCRM. For convenience, the addenda
items are grouped by revision. Please check our website
at http://www.freescale.com/powerarchitecture for the
latest updates.
The current version available of the MPC5604B/C Microcontroller Reference Manual is Revision 8.
Chapter 21, LINFlex, p. 412Insert the following section:
In Table 4-3, Functional port pin descriptions, row PH[9], change the pin numbers for
MPC560xB 64 LQFP and MPC560xC 64 LQFP from “—” to 60.
In row PH[10], change the pin numbers for MPC560xB 64 LQFP and MPC560xC 64 LQFP
from “—” to 53.
Add Note: to Section 6.8.4.1, Crystal clock monitor:
Note: Functional FXOSC monitoring can only be guaranteed when the FXOSC frequency is
greater than (FIRC / 2
Add Note: to Section 6.8.4.2, FMPLL clock monitor:
Note: Functional FMPLL monitoring can only be guaranteed when the FMPLL frequency is
greater than (FIRC / 4) + 0.5 MHz.
Replaced Section 9.4.7, Boot Mode Capturing, with the following:
The MC_RGM samples P A[9:8] whenev er RESET is asserted until five FIRC (16 MHz internal
RC oscillator) clock cycles before its deassertion edge. The result of the sampling is used at
the beginning of reset PHASE3 for boot mode selection and is retained after RESET has been
deasserted for subsequent boots after reset sequences during which RESET is not asserted.
Note: In order to ensure that the boot mode is correctly captured, the application needs to
apply the valid boot mode value the entire time that RESET is asserted.
RESET can be asserted as a consequence of the internal reset generation. This will force
re-sampling of the boot mode pins. (See Table 9-12 for details.)
In Table 13-3 (RTCC field descriptions), update Note in RTCC[APIVAL] field description:
Note: API functionality starts only when APIVAL is nonzero. The first API interrupt takes two
more cycles because of synchronization of APIVAL to the RTC cloc k, and APIVAL + 1 cycles
for subsequent occurrences. After that, interrupts are periodic in nature. Because of
synchronization issues, the minimum supported value of APIVAL is 4.
RCDIV
)+0.5MHz.
21.8.2.1.6Overrun
Once the message buffer is full, the next valid message reception leads to an
overrun and a message is lost. The hardware sets the BOF bit in the LINSR to
signal the overrun condition. Which message is lost depends on the
configuration of the RX message buffer:
•If the buffer lock function is disabled (LINCR1[RBLM] = 0) the last
message stored in the buffer is overwritten by the new incoming
message. In this case the latest message is always available to the
application.
•If the buffer lock function is enabled (LINCR1[RBLM] = 0) the most
recent message is discarded and the previous message is available in the
buffer.
MPC5604B Reference Manual Errata, Rev. 1
Freescale Semiconductor2
Table 1. MPC5604BCRM Rev 8 Addenda
LocationDescription
Addendum List for Revision 8
Chapter 22, FlexCAN,
throughout chapter
Chapter 22, FlexCAN, page
429
Chapter 22, FlexCAN, page
461
Chapter 22, FlexCAN, page
462
Chapter 22, FlexCAN, page
463
Chapter 25, Analog-to-Digital
Converter (ADC), page
Chapter 25, Analog-to-Digital
Converter (ADC), page 597
Remove references throughout the chapter to “low-cost MCUs.”
Added this Note in the RTR field description of Table 22-4 (Message Buffer Structure field
description):
Note: Do not configure the last Message Buffer to be the RTR frame.
In Section 22.4.9.4, Protocol timing, updated the Note following Figure 22-16 (CAN engine
clocking scheme) to read: “This clock selection feature may not be available in all MCUs. A
particular MCU may not have a PLL, in which case it would have only the oscillator clock, or
it may use only the PLL clock feeding the FlexCAN module. In these cases, the CLK_SRC bit
in the CTRL Register has no effect on the module operation.”
Updated the table title of Table 22-20 from “CAN Standard Compliant Bit Time Segment
Settings” to “Bosch CAN 2.0B standard compliant bit time segment settings.”
In Section 22.4.9.4, Protocol timing, updated the Note following Table 22-20 to read: “Other
combinations of Time Segment 1 and Time Segment 2 can be valid. It is the user’s
responsibility to ensure the bit time settings are in compliance with the CAN standard. For bit
time calculations, use an IPT (Information Processing Time) of 2, which is the value
implemented in the FlexCAN module.”
In Section 28.3.5.2, Presampling channel enable signals, in Table 28-7, Presampling voltage
selection based on PREVALx fields, in the 01 row, change the “Presampling voltage” field to:
V1 = V
DD_HV_ADC0
or V
DD_HV_ADC1
.
In Section 25.3.2, Analog clock generator and conversion timings, remove the paragraph:
The direct clock should basically be used only in low power mode when the device is using
only the 16 MHz fast internal RC oscillator, but the conversion still requires a 16 MHz clock
(an 8 MHz clock is not fast enough). In all other cases, the ADC should use the clock divided
by two internally.
Chapter 25, Analog-to-Digital
Converter (ADC), p. 600
In Section 25.3.4.2, CTU in trigger mode, replace the sentence:
If another CTU conversion is triggered before the end of the conversion, that request is
discarded.
with:
If another CTU conversion is triggered before the end of the conversion, that request is
discarded. However, if the CTU has triggered a conversion that is still ongoing on a channel,
it will buffer a second request fo r the channel and wait for the end of the first conv ersion before
requesting another conversion. Thus, two conversion requests close together will both be
serviced.
Chapter 25, Analog-to-Digital
Converter (ADC), page 603
Add Note to Section 25.3.10, Auto-clock-off mode:
Note: The auto-clock-off feature cannot operate when the digital interface runs at the same
rate as the analog interface. This means that when MCR.ADCCLKSEL = 1, the analog clock
will not shut down in IDLE mode.
MPC5604B Reference Manual Errata, Rev. 1
Freescale Semiconductor 3
Revision History
LocationDescription
Table 1. MPC5604BCRM Rev 8 Addenda
Chapter 25, Analog-to-Digital
Converter (ADC), page 610
Chapter 26, Cross Triggering
Unit (CTU), page 633
In Section 25.4.6.2, Main Status Register (MSR), replace the ADCSTATUS field description with
the following:
The value of this parameter depends on ADC status:
000 IDLE — The ADC is powered up but idle.
001 Power-down — The ADC is powered down.
010 Wait state — The ADC is waiting for an external multiplexer . This occurs only when the
DSDR register is nonzero.
011 Reserved
100 Sample — The ADC is sampling the analog signal.
101 Reserved
110 Conversion — The ADC is converting the sampled signal.
111 Reserved
At the end of Section 26.4.1, Event Configuration Registers (CTU_EVTCFGRx) (x = 0...63), add
the following Note:
NOTE
The CTU tracks issued conversion requests to the ADC. When the ADC
is being triggered by the CTU and there is a need to shut down the ADC,
the ADC must be allowed to complete conversions before being shut
down. This ensures that the CTU is notified of completion; if the ADC
is shut down while performing a CTU-triggered conversion, the CTU is
not notified and will not be able to trigger further conversions until the
device is reset.
2Revision History
Table 2 provides a revision history for this reference manual addendum document.
12.2 Features .........................................................................................................................................231
12.3 External signal description ............................................................................................................231
12.4 Memory map and register description ...........................................................................................231
13.2 Features .........................................................................................................................................243
13.3 Device-specific information ..........................................................................................................245
13.4 Modes of operation ........................................................................................................................245
14.2 Main features .................................................................................................................................253
15.4 Features .........................................................................................................................................263
15.4.1Instruction unit features ................................................................................................264
15.4.2Integer unit features ......................................................................................................264
15.4.3Load/Store unit features ...............................................................................................265
15.4.4e200z0h system bus features ........................................................................................265
15.4.5Nexus 2+ features .........................................................................................................265
15.5 Core registers and programmer’s model .......................................................................................266
16.2 Features .........................................................................................................................................269
17.4 Features .........................................................................................................................................302
17.5 Modes of operation ........................................................................................................................302
18.2 Features .........................................................................................................................................308
18.3 Modes of operation ........................................................................................................................309
18.4 External signal description ............................................................................................................309
18.5 Memory map and register description ...........................................................................................309
19.3 Features .........................................................................................................................................329
19.4 External signal description ............................................................................................................329
19.4.1Detailed signal descriptions ..........................................................................................330
19.5 Memory map and register description ...........................................................................................331
21.2 Main features .................................................................................................................................377
21.2.1LIN mode features ........................................................................................................377
21.2.2UART mode features ....................................................................................................377
21.2.3Features common to LIN and UART ...........................................................................377
21.3 General description .......................................................................................................................378
21.5.3Low power mode (Sleep) .............................................................................................382
21.6 Test modes .....................................................................................................................................382
21.6.1Loop Back mode ...........................................................................................................382
21.6.2Self Test mode ..............................................................................................................383
21.7 Memory map and registers description .........................................................................................383
23.2 Features .........................................................................................................................................470
23.3 Modes of operation ........................................................................................................................471
26.2 Main features .................................................................................................................................631
27.2 Main features .................................................................................................................................640
29.2 Features .........................................................................................................................................741
30.2 Features .........................................................................................................................................755
30.3 Modes of operation ........................................................................................................................755
30.4 External signal description ............................................................................................................756
30.5 Memory map and register description ...........................................................................................756
31.3 Features .........................................................................................................................................763
31.4 Memory map and register description ...........................................................................................763
32.4 Features .........................................................................................................................................788
32.5 Modes of operation ........................................................................................................................788
33.3 Features .........................................................................................................................................802
33.4 Modes of Operation .......................................................................................................................803
The primary objective of this document is to define the functionality of the MPC5604B microcontroller
for use by software and hardware developers. The MPC5604B is built on Power Architecture® technology
and integrates technologies that are important for today’s automotive vehicle body applications.
The information in this book is subject to change without notice, as described in the disclaimers on the title
page. As with any technical documentation, it is the reader’s responsibility to be sure he or she is using the
most recent version of the documentation.
To locate any published errata or updates for this document, visit the Freescale Web site at
http://www.freescale.com/.
1.2Audience
This manual is intended for system software and hardware developers and applications programmers who
want to develop products with the MPC5604B device. It is assumed that the reader understands operating
systems, microprocessor system design, basic principles of software and hardware, and basic details of the
Power Architecture.
1.3Guide to this reference manual
Table 1-1. Guide to this reference manual
Chapter
#Title
2IntroductionGeneral overview, family description, feature list and
information on how to use the reference manual in
conjunction with other available documents.
3Memory MapMemory map of all peripherals and memory.Memory map
4Signal descriptionPinout diagrams and descriptions of all pads.Signals
5Microcontroller BootBoot
• Boot mechanism • Describes what configuration is required by the
user and what processes are involved when the
microcontroller boots from flash memory or serial
boot modes.
• Describes censorship.
• Boot Assist Module (BAM)Features of BAM code and when it's used.
• System Status and
Configuration Module
(SSCM)
Reports information about current state and
configuration of the microcontroller.