Advanced Power MOSFET
SSS70N10A
FEATURES
Avalanche Rugged Technology
Rugged Gate Oxide Technology
Lower Input Capacitance
Improved Gate Charge
Extended Safe Operating Area
Ο
C
175 Operating Temperature
Lower Leakage Current : 10 A (Max.) @ VDS = 100V
Lower R
: 0.018 (Typ.)
DS(ON)
Ω
µ
Absolute Maximum Ratings
Characteristic Value UnitsSymbol
T
V
V
DSS
I
I
DM
V
E
I
AR
E
dv/dt
P
, T
J
T
D
GS
AS
AR
D
STG
L
Drain-to-Source Voltage
Continuous Drain Current (T
Continuous Drain Current (T
=25 )
C
=100 )
C
Ο
C
Ο
C
Drain Current-Pulsed
Gate-to-Source Voltage
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Total Power Dissipation (T
=25 )
C
Ο
C
Linear Derating Factor
Operating Junction and
Storage Temperature Range
Maximum Lead Temp. for Soldering
Purposes, 1/8” from case for 5-seconds
O
O
O
O
O
BV
R
I
= 100 V
DSS
DS(on)
= 28 A
D
= 0.023
Ω
TO-220F
1
2
3
1.Gate 2. Drain 3. Source
100
28
19.8
1
2
1
1
3
220
+
_
20
1568
28
4.9
6.5
49
0.32
- 55 to +175
300
V
A
A
V
mJ
A
mJ
V/ns
W
W/
Ο
C
Ο
C
Thermal Resistance
Symbol Typ.
R
JC
θ
R
JA
θ
©1999 Fairchi ld Semiconduc tor Corpor ation
Characteristic Max.
Junction-to-Case
Junction-to-Ambient
Units
--
--
3.09
62.5
Ο
/W
C
Rev. B
SSS70N10A
Electrical Characteristics (T
Ο
=25 unless otherwise specified)
C
C
N-CHANNEL
POWER MOSFET
BV
∆ ∆
BV/ T
V
GS(th)
I
I
R
DS(on)
C
C
C
t
d(on)
t
d(off)
Q
Q
DSS
GSS
DSS
g
iss
oss
rss
t
t
Q
CharacteristicSymbol
Drain-Source Breakdown Voltage
Breakdown Voltage Temp. Coeff.
J
Gate Threshold Voltage
Gate-Source Leakage , Forward
Gate-Source Leakage , Reverse
Drain-to-Source Leakage Current
Static Drain-Source
On-State Resistance
Forward Transconductance
fs
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-On Delay Time
Rise Time
r
Turn-Off Delay Time
Fall Time
f
Total Gate Charge
g
Gate-Source Charge
gs
Gate-Drain(“Miller”) Charge
gd
100
--
2.0
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
Max. UnitsTyp.Min. Test Condition
=0V,ID=250 A
V
--
--
4.0
100
10
100
--
980
430
60
60
240
180
195
--
--
V
GS
Ο
I
V/
µ
=250 A See Fig 7
C
D
V
V
nA
A
Ω
Ω
pF
ns
=5V,ID=250 A
DS
V
=20V
GS
V
=-20V
GS
V
=100V
DS
V
=80V,TC=150
DS
=10V,ID=14A
V
GS
=40V,ID=14A
V
DS
=0V,VDS=25V,f =1MHz
V
GS
See Fig 5
V
=50V,ID=70A,
DD
=5.3
R
G
See Fig 13
V
=80V,VGS=10V,
DS
nC
I
=70A
D
See Fig 6 & Fig 12
µ
--
0.12
--
--
--
--
--
--
34.51
3750
850
375
22
24
112
84
151
31
66
-100
0.023
4870
µ
µ
Ο
C
4
O
4
O
Ω
4
5
O
O
4
5
O
O
Source-Drain Diode Ratings and Characteristics
CharacteristicSymbol Max. UnitsTyp.Min. Test Condition
I
I
SM
V
t
Q
Notes ;
Repetitive Rating : Pulse Width Limited by Maximum Junction Temperature
1
O
2
L=3mH, I
O
3
I
O
SD
Pulse Test : Pulse Width = 250 s, Duty Cycle 2%
4
O
Essentially Independent of Operating Temperature
5
O
Continuous Source Current
S
Pulsed-Source Current
Diode Forward Voltage
SD
Reverse Recovery Time
rr
Reverse Recovery Charge
rr
=28A, VDD=25V, RG=27 , Starting TJ =25
AS
_
µ
70A, di/dt 530A/ s, VDD BV
_
<
<
--
--
28
1
--
--
--
143
0.72
220
1.6
--
--
O
4
--
O
--
--
Ω
DSS
µ
, Starting TJ =25
_
<
o
C
o
_
<
C
Integral reverse pn-diode
A
in the MOSFET
Ο
C
T
=25 ,IS=28A,VGS=0V
J
Ο
C
T
=25 ,IF=70A
J
/dt=100A/ s
di
F
ns
µ
V
C
µ
O
4
N-CHANNEL
POWER MOSFET
Fig 1. Output Characteristics Fig 2. Transfer Characteristics
V
GS
Top : 1 5 V
1 0 V
2
10
8.0 V
7.0 V
6.0 V
5.5 V
5.0 V
Bottom : 4.5 V
SSS70N10A
2
10
o
C
175
1
10
, Drain Current [A]
D
I
0
10
-1
10
@ Notes :
1. 250
s Pulse Test
µ
2. T
= 25 oC
C
0
10
VDS , Drain-Source Voltage [V]
0.03
VGS = 10 V
]
0.02
Ω
, [
DS(on)
R
0.01
VGS = 20 V
Drain-Source On-Resistance
0.00
0 50 100 150 200 250 300
ID , Drain Current [A]
8000
6000
C
iss
C
= Cgs+ Cgd ( Cds= shorted )
iss
C
= Cds+ C
oss
gd
C
= C
rss
gd
1
10
@ Note : TJ = 25 oC
1
10
o
25
C
, Drain Current [A]
D
I
0
10
2 4 6 8 10
- 55
o
C
@ Notes :
1. V
2. V
3. 250
= 0 V
GS
= 40 V
DS
s Pulse Test
µ
VGS , Gate-Source Voltage [V]
Fig 4. Source-Drain Diode Forward VoltageFig 3. On-Resistance vs. Drain Current
2
10
1
10
, Reverse Drain Current [A]
o
175
C
DR
I
0
10
o
25
C
0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6
@ Notes :
1. V
= 0 V
GS
2. 250 µs Pulse Test
VSD , Source-Drain Voltage [V]
Fig 6. Gate Charge vs. Gate-Source VoltageFig 5. Capacitance vs. Drain-Source Voltage
V
= 20 V
10
= 50 V
V
DS
VDS = 80 V
DS
4000
Capacitance [pF]
2000
C
oss
C
rss
0
0
10
VDS , Drain-Source Voltage [V]
@ Notes :
1. VGS = 0 V
2. f = 1 MHz
5
, Gate-Source Voltage [V]
GS
V
1
10
0
0 20 40 60 80 100 120 140 160
QG , Total Gate Charge [nC]
@ Notes : ID =70.0 A