Fairchild Semiconductor SSS6N70A Datasheet

Advanced Power MOSFET
SSS6N70A
FEATURES
Avalanche Rugged Technology Rugged Gate Oxide Technology Lower Input Capacitance Improved Gate Charge Extended Safe Operating Area Lower Leakage Current : 25 µA (Max.) @ VDS = 700V Low R
: 1.552 (Typ.)
DS(ON)
Absolute Maximum Ratings
Characteristic Value UnitsSymbol
Drain-to-Source Voltage Continuous Drain Current (T Continuous Drain Current (T
=25
C
=100
C
Ο
C)
Ο
C)
Drain Current-Pulsed Gate-to-Source Voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt
Total Power Dissipation (T
C
=25
Ο
C )
Linear Derating Factor Operating Junction and Storage Temperature Range Maximum Lead Temp. for Soldering Purposes, 1/8“ from case for 5-seconds
T
V
DSS
I
I
DM
V E
I
AR
E
dv/dt
P
, T
J
T
D
GS
AS
AR
D
STG
L
O
O O O
O
BV R I
DSS
DS(on)
= 4 A
D
= 700 V
= 1.8
TO-220F
1
2
3
1.Gate 2. Drain 3. Source
700
4
2.5 24
+
_
1
2
1 1
3
30
560
4 4
2.5 40
0.32
- 55 to +150
300
V
A
A V
mJ
A
mJ
V/ns
W
W/
Ο
C
Ο
C
Thermal Resistance
Symbol Typ.
R
θ
JC
R
θ
JA
©1999 Fairchi ld Semiconduc tor Corpor ation
Characteristic Max.
Junction-to-Case
Junction-to-Ambient
Units
--
--
3.13
62.5
Ο
C/W
Rev. B
SSS6N70A
Electrical Characteristics (T
Ο
=25
C unless otherwise specified)
C
N-CHANNEL
POWER MOSFET
BV
DSS
BV/∆T V
GS(th)
I
GSS
I
DSS
R
DS(on)
g
fs
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Q
g
Q
gs
Q
gd
CharacteristicSymbol
Drain-Source Breakdown Voltage Breakdown Voltage Temp. Coeff.
J
Gate Threshold Voltage Gate-Source Leakage , Forward Gate-Source Leakage , Reverse
Drain-to-Source Leakage Current
Static Drain-Source On-State Resistance Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate-Source Charge Gate-Drain(“Miller”) Charge
700
--
2.0
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
Max. UnitsTyp.Min. Test Condition
=0V,ID=250µA
V
--
--
4.0
100
25
250
1.8
--
115
55 45 55
160
60 67
--
--
V
GS
Ο
I
V/
nA
µA
=250µA See Fig 7
C
D
V
V
pF
ns
=5V,ID=250µA
DS
V
=30V
GS
V
=-30V
GS
V
=700V
DS
V
=560V,TC=125
DS
VGS=10V,ID=2A * VDS=50V,ID=2A
=0V,VDS=25V,f =1MHz
V
GS
See Fig 5
V
=350V,ID=6A,
DD
=11.5§Ù
R
G
See Fig 13
V
=560V,VGS=10V,
DS
nC
I
=6A
D
See Fig 6 & Fig 12
--
0.79
--
--
--
--
--
--
3.22 920 100
45 18 23 76 26 51
8.3
23.1
-100
1200
Ο
O
C
4
O
4
O
4
5
O
4
O5O
Source-Drain Diode Ratings and Characteristics
CharacteristicSymbol Max. UnitsTyp.Min. Test Condition
I
I
SM
V
t
Q
Notes ;
Repetitive Rating : Pulse Width Limited by Maximum Junction Temperature
1
O
2
L=65mH, I
O
3
I
O
Pulse Test : Pulse Width = 250µs, Duty Cycle 2%
4
O
Essentially Independent of Operating Temperature
5
O
Continuous Source Current
S
Pulsed-Source Current Diode Forward Voltage
SD
Reverse Recovery Time
rr
Reverse Recovery Charge
rr
=4A, VDD=50V, RG=27, Starting TJ =25ΟC
AS
_
<
6A, di/dt 140A/µs, VDD BV
SD
_
<
, Starting TJ =25ΟC
_
<
DSS
O O
--
--
--
440
4
24
1.4
--
--
A
V ns µC
--
--
1
4
--
--
4.05
--
_
<
Integral reverse pn-diode in the MOSFET
Ο
T
=25
C ,I
J
T
=25
J
/dt=100A/µs
di
F
=4A,VGS=0V
S
Ο
C ,I
=6A
F
O
4
N-CHANNEL
POWER MOSFET
Fig 1. Output Characteristics Fig 2. Transfer Characteristics
V
GS
Top : 1 5 V
1
10
1 0 V
8.0 V
7.0 V
6.0 V
5.5 V
5.0 V Bottom : 4.5 V
0
10
, Drain Current [A]
D
-1
10
I
-1
10
0
10
VDS , Drain-Source Voltage [V]
@ Notes :
1. 250
2. T
s Pulse Test
µ
= 25 oC
C
SSS6N70A
1
10
o
C
150
0
10
25 oC
, Drain Current [A]
D
I
-1
1
10
10
2 4 6 8 10
- 55
o
C
VGS , Gate-Source Voltage [V]
@ Notes :
1. V
2. V
3. 250
= 0 V
GS
= 50 V
DS
s Pulse Test
µ
6
= 10 V
V
]
4
GS
, [
DS(on)
R
2
VGS = 20 V
Drain-Source On-Resistance
@ Note : TJ = 25 oC
0
0 5 10 15 20
ID , Drain Current [A]
1500
C
iss
1000
500
Capacitance [pF]
C
oss
C
rss
0
0
10
C
= Cgs+ Cgd ( Cds= shorted )
iss
C
= Cds+ C
oss
gd
C
= C
rss
gd
1
10
@ Notes :
1. VGS = 0 V
2. f = 1 MHz
VDS , Drain-Source Voltage [V]
Fig 4. Source-Drain Diode Forward VoltageFig 3. On-Resistance vs. Drain Current
1
10
0
10
@ Notes :
1. V
, Reverse Drain Current [A]
DR
I
-1
10
0.2 0.4 0.6 0.8 1.0 1.2
150 oC
o
25
C
2. 250
= 0 V
GS
s Pulse Test
µ
VSD , Source-Drain Voltage [V]
Fig 6. Gate Charge vs. Gate-Source VoltageFig 5. Capacitance vs. Drain-Source Voltage
10
5
, Gate-Source Voltage [V]
GS
V
0
0 10 20 30 40 50 60
VDS = 140 V
= 350 V
V
DS
VDS = 560 V
@ Notes : ID = 6.0 A
QG , Total Gate Charge [nC]
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