Fairchild Semiconductor ISL9R860S3S, ISL9R860P2 Datasheet

ISL9R860P2, ISL9R860S2, ISL9R860S3S
8A, 600V Stealth™ Dio de
ISL9R860P2, ISL9R860S2, ISL9R860S3S
April 2002
General Description
The ISL9R860P2, ISL9R860S2 and ISL9R860S3S are Stealth™ diodes optimized for low loss perform ance in high frequency hard switched appli cations. The Stealth™ family exhibits low reverse recovery current
) and exceptionally soft recovery u nde r t ypical
(I
RRM
operating conditions. This device is intended for use as a free wheeling or
boost diode in power supplies and other power switching applications. The low I reduce loss in switching transistor s. The so f t recover y minimizes ringing, expanding the rang e of con di tions under which the diode may be operated without the use of additional snubber circuitry. Consider using the Stealth™ diode with an SMPS IGBT to provide the most efficient and highest power density design at lower cost.
Formerly developmental type TA49409.
and short ta phase
RRM
Features
• Soft Recovery. . . . . . . . . . . . . . . . . . . .tb / ta > 2.5
• Fast Recovery . . . . . . . . . . . . . . . . . . . . t
< 25ns
rr
• Operating Temperature . . . . . . . . . . . . . . . 175
• Reverse Voltage. . . . . . . . . . . . . . . . . . . . . . 600V
• Avalanche Energy Rated
Applications
• Switch Mode Power Supplies
• Hard Switched PFC Boost Diode
• UPS Free Wheeling Diode
• Motor Drive FWD
• SMPS FWD
• Snubber Diode
Package Symbol
JEDEC TO-263AB
N/C
ANODE
K
CATHODE (FLANGE)
A
CATHODE (FLANGE)
ANODE
CATHODE
CATHODE (FLANGE)
JEDEC STYLE TO-262JEDEC TO-220AC
ANODE
CATHODE
o
C
Device Maximum Ratings T
Symbol Parameter Ratings Units
V
RRM
V
RWM
V
I
F(AV)
I
FRM
I
FSM
P
E
AVL
, T
T
J
T
T
PKG
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and
operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
©2002 Fairchild Semiconductor Corporation
Peak Repetitive Reverse Voltage 600 V Working Peak Reverse Voltage 600 V DC Blocking Voltage 600 V
R
Average Rectified Forw ard Current (TC = 147oC) 8 A Repetitive Peak Surge Current (20kHz Square Wave) 16 A Nonrepetitive Peak Surge Current (Halfwave 1 Phase 60Hz) 100 A Power Dissipation 85 W
D
Avalanche Energy (1A, 40mH) 20 mJ Operating and Storage Temperature Range -55 to 175 °C
STG
Maximum Te m perature for Soldering
L
Leads at 0.063in (1.6mm) from Case for 10s Package Body for 10s, See Techbrief TB334
= 25°C unless otherwise noted
C
300 260
ISL9R860P2, ISL9R860S2, ISL9R860S3S Rev. C
°C °C
Package Marking and Ordering Information
Device Marking Device Package Tape Width Quantity
R860P2 ISL9R860P2 TO-220AC - ­R860S2 ISL9R860S2 TO-262 - -
R860S3S ISL9R860S3S TO-263AB 24mm 800
ISL9R860P2, ISL9R860S2, ISL9R860S3S
Electrical Characteristics
TC = 25°C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Off State Characteristics
Instantaneous Reverse Current VR = 600V TC = 25°C - - 100 µA
I
R
= 125°C--1.0mA
T
C
On State Characteristics
Instantaneous Forward Voltage IF = 8A TC = 25°C-2.02.4V
V
F
= 125°C-1.62.0V
T
C
Dynamic Characteristics
C
Junction Capacitance VR = 10V, IF = 0A - 30 - pF
J
Switching Characteristics
t
Reverse Recovery Time IF = 1A, dIF/dt = 100A/µs, VR = 30V - 18 25 ns
rr
t
Reverse Recovery Time IF = 8A,
rr
I
RRM
Q
Maximum Reverse Recovery Current - 3.2 - A Reverse Recovery Charge - 50 - nC
RR
Reverse Recovery Time IF = 8A,
t
rr
S Softness Factor (t
I
RRM
Q
Maximum Reverse Recovery Current - 3.4 - A Reverse Recovery Charge - 150 - nC
RR
Reverse Recovery Time IF = 8A,
t
rr
S Softness Factor (t
I
Q
dI
RRM
Maximum Reverse Recovery Current - 6.5 - A Reverse Recovery Charge 195 - nC
RR
/dt Maximum di/dt during t
M
)-3.7-
b/ta
)-2.5-
b/ta
b
= 8A, dIF/dt = 100A/µs, VR = 30V - 21 30 ns
I
F
-28-ns
/dt = 200A/µs,
dI
F
V
= 390V, TC = 25°C
R
-77-ns
/dt = 200A/µs,
dI
F
V
= 390V,
R
= 125°C
T
C
-53-ns
/dt = 600A/µs,
dI
F
V
= 390V,
R
= 125°C
T
C
- 500 - A/µs
Thermal Characteristics
R R R R
©2002 Fairchild Semiconductor Corporation ISL9R860P2, ISL9R860S2, ISL9R860S3S Rev. C
Thermal Resistance Junction to Case - - 1.75 °C/W
θJC
Thermal Resistance Junction to Ambient TO-220 - - 62 °C/W
θJA
Thermal Resistance Junction to Ambient TO-262 - - 62 °C/W
θJA
Thermal Resistance Junction to Ambient TO-263 62 °C/W
θJA
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