Fairchild Semiconductor HGTP5N120BND, HGTG5N120BND Datasheet

HGTG5N120BND, HGTP5N120BND
Data Sheet May 2003
21A, 1200V, NPT Series N-Channel IGBTs with Anti-Parallel Hyperfast Diodes
The HGTG5N120BND and HGTP5N120BND are Non- Punch Through (NPT) IGBT designs. They are new
members of the MOS gated high voltage switching IGBT family. IGBTs combine the best features of MOSFETs and bipolar transistors . This de vice h as the hi gh input i mpedance of a MOSFET and the low on-state conduction loss of a bipolar transistor. The IGBT used is the development type TA49308. The D io de u se d i s the developmen t ty pe TA49058 (Part number RHRD6120).
The IGBT is ideal for many high voltage switching applications operating at moderate frequencies where low conduction losses are essential, such as: AC and DC motor controls, pow er su ppl ies and drivers for solenoids, relays and contactors.
Formerly Developmental Type TA49306.
Ordering Information
PART NUMBER PACKAGE BRAND
HGTG5N120BND TO-247 5N120BND HGTP5N120BND TO-220AB 5N120BND
NOTE: When ordering, use the entire part number. i.e., HGTG5N120BND.
Features
• 21A, 1200V, TC = 25oC
• 1200V Switching SOA Capability
• Typical Fall Time . . . . . . . . . . . . . . . .175ns at T
• Short Circuit Rating
• Low Conduction Loss
Thermal Impedance SPICE Model Temperature Compensating SABER™ Model www.fairchildsemi.com
• Related Literature
- TB334 “Guidelines for Soldering Surface Mount
Components to PC Boards”
Packaging
JEDEC STYLE TO-247
E
COLLECTOR
(FLANGE)
= 150oC
J
C
G
Symbol
C
COLLECTOR
G
E
FAIRCHILD SEMICONDUCTOR IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS
4,364,073 4,417,385 4,430,792 4,443,931 4,466,176 4,516,143 4,532,534 4,587,713 4,598,461 4,605,948 4,620,211 4,631,564 4,639,754 4,639,762 4,641,162 4,644,637 4,682,195 4,684,413 4,694,313 4,717,679 4,743,952 4,783,690 4,794,432 4,801,986 4,803,533 4,809,045 4,809,047 4,810,665 4,823,176 4,837,606 4,860,080 4,883,767 4,888,627 4,890,143 4,901,127 4,904,609 4,933,740 4,963,951 4,969,027
JEDEC TO-220AB (ALTERNATE VERSION)
(FLANGE)
E
C
G
©2003 Fairchild Semiconductor Corporation HGTG5N120BND, HGTP5N120BND, Rev. B1
HGTG5N120BND, HGTP5N120BND
Absolute Maximum Ratings T
= 25oC, Unless Otherwise Specified
C
HGTG5N120BND HGTP5N120BND UNITS
Collector to Emitter Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .BV
CES
1200 V
Collector Current Continuous
= 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
At T
C
= 110oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
At T
C
Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Gate to Emitter Voltage Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
Gate to Emitter Voltage Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
Switching Safe Operating Area at T Powe r Dissipation Total at T
C
Power Dissipation Derating T
Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . T
= 150oC (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . SSOA 30A at 1200V
J
= 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
> 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.33 W/oC
C
, T
J
C25
C110
CM
GES
GEM
D
STG
21 A 10 A 40 A
±20 V ±30 V
167 W
-55 to 150
o
C Maximum Lead T emperature for Soldering
Leads at 0.063in (1.6mm) from case for 10s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
Package Body for 10s, see Tech Brief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
Short Circuit Withstand Time (Note 2) at V Short Circuit Withstand Time (Note 2) at V
CAUTION: Stresses above those listed in “A bsolute Maximu m Rating s” may cause per manent d amage to t he device. This is a str ess on ly rating and operation o f the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
= 15V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .t
GE
= 12V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .t
GE
L
pkg
SC SC
300 260
8 µs
15 µs
o
C
o
C
NOTES:
1. Pulse width limited by maximum junction temperature.
2. V
= 840V, TJ = 125oC, RG = 25Ω.
CE(PK)
Electrical Specifications T
= 25oC, Unless Otherwise Specified
C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Collector to Emitter Breakdown Voltage BV Collector to Emitter Leakage Current I
Collector to Emitter Saturation Voltage V
Gate to Emitter Threshold Voltage V Gate to Emitter Leakage Current I
CES
CES
CE(SAT)IC
GE(TH)
GES
Switching SOA SSOA T
Gate to Emitter Plateau Voltage V On-State Gate Charge Q
Current Turn-On Delay Time t Current Rise Time t Current Turn-Off Delay Time t Current Fall Time t Turn-On Energy E Turn-Off Energy (Note 3) E
GEP
G(ON)
d(ON)I
rI
d(OFF)I
fI
ON
OFF
IC = 250µA, VGE = 0V 1200 - - V VCE = 1200V TC = 25oC - - 250 µA
= 125oC - 100 - µA
T
C
T
= 150oC--1.5mA
C
= 5A,
= 15V
V
GE
IC = 45µA, VCE = V
T
= 25oC - 2.45 2.7 V
C
T
= 150oC-3.74.2V
C
GE
6.0 6.8 - V
VGE = ±20V - - ±250 nA
= 150oC, RG = 25Ω, VGE = 15V,
J
L = 5mH, V
CE(PK)
= 1200V
30 - - A
IC = 5A, VCE = 600V - 10.5 - V IC = 5A,
= 600V
V
CE
IGBT and Diode at TJ = 25oC,
= 5A,
I
CE
V
= 960V,
CE
= 15V,
V
GE
= 25Ω,
R
G
L = 5mH, Test Circuit (Figure 20)
V
= 15V - 53 65 nC
GE
= 20V - 60 72 nC
V
GE
-2225ns
-1520ns
- 160 180 ns
- 130 160 ns
- 450 600 µJ
- 390 450 µJ
©2003 Fairchild Semiconductor Corporation HGTG5N120BND, HGTP5N120BND, Rev. B1
HGTG5N120BND, HGTP5N120BND
Electrical Specifications T
= 25oC, Unless Otherwise Specified (Continued)
C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Current Turn-On Delay Time t
d(ON)I
Current Rise Time t Current Turn-Off Delay Time t
d(OFF)I
Current Fall Time t Turn-On Energy E Turn-Off Energy (Note 3) E Diode Forward Voltage V Diode Reverse Recovery Time t
Thermal Resistance Junction To Case R
rI
fI
ON
OFF
EC
rr
θJC
IGBT and Diode at TJ = 150oC,
= 5A,
I
CE
= 960V,
V
CE
V
= 15V,
GE
= 25Ω,
R
G
L = 5mH, Test Circuit (Figure 20)
IEC = 10A - 2.70 3.50 V IEC = 7A, dlEC/dt = 200A/µs - 50 65 ns
= 1A, dlEC/dt = 200A/µs - 30 40 ns
I
EC
IGBT - - 0.75
-2025ns
-1520ns
- 182 280 ns
- 175 200 ns
- 1000 1300 µJ
- 560 800 µJ
Diode - - 1.75
NOTE:
3. Turn-Off Energy Loss (E ending at the point where the collector current equals zero (I Measurement of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss.
) is defined as the integral of the inst antaneous power loss starting at the trailing edge of the input pulse and
OFF
= 0A). All devices were tested per JEDEC Standard No. 24-1 Method for
CE
Typical Performance Curves Unless Otherwise Specified
o o
C/W C/W
25
V
= 15V
GE
20
15
10
5
, DC COLLECTOR CURRENT (A)
CE
I
0
25 75 100 125 150
50
TC, CASE TEMPERATURE (oC)
FIGURE 1. DC COLLECTOR CURRENT vs CASE
TEMPERATURE
35
TJ = 150oC, RG = 25Ω, V
30
25
20
15
10
5
, COLLECTOR TO EMITTER CURRENT (A)
CE
0
I
V
, COLLECTOR TO EMITTER VOLTAGE (V)
CE
= 15V, L = 5mH
GE
600 800400200 1000 1200
14000
FIGURE 2. MINIMUM SWITCHING SAFE OPERATING AREA
©2003 Fairchild Semiconductor Corporation HGTG5N120BND, HGTP5N120BND, Rev. B1
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