HGTG10N120BN, HGTP10N120BN,
HGT1S10N120BNS
Data Sheet August 2002
35A, 1200V, NPT Series N-Channel IGBT
The HGTG10N120BN, HGTP10N120BN and
HGT1S10N120BNS are Non-P unch T hrough (NPT) IGBT
designs. They are new members of the MOS gated high
voltage switching IGBT family. IGBTs combine the best
features of MOSFETs and bipolar transistors. This device
has the high input impedance of a MOSFET and the low onstate conduction loss of a bipolar transistor.
The IGBT is ideal for many high voltage switching
applications operating at moderate frequencies where low
conduction losses are essential, such as: AC and DC motor
controls, pow er su ppl ies and drivers for solenoids, relays
and contactors.
Formerly Developmental Type TA49290.
Ordering Information
PART NUMBER PACKAGE BRAND
HGTG10N120BN TO-247 G10N120BN
HGTP10N120BN TO-220AB 10N120BN
HGT1S10N120BNS TO-263AB 10N120BN
NOTE: When ordering, use the entire part number. Add the suffix T
to obtain the TO-263AB variant in tape and reel, e.g.
HGT1S10N120BNST.
Features
• 35A, 1200V, TC = 25oC
• 1200V Switching SOA Capability
• Typical Fall Time. . . . . . . . . . . . . . . . 140ns at T
• Short Circuit Rating
• Low Conduction Loss
• Avalanche Rated
• Thermal Impedance SPICE Model
Temperature Compensating SABER™ Model
www.fairchildsemi.com
• Related Literature
- TB334 “Guidelines for Soldering Surface Mount
Components to PC Boards
Packaging
JEDEC STYLE TO-247
E
COLLECTOR
(FLANGE)
C
= 150oC
J
G
Symbol
C
JEDEC TO-220AB (ALTERNATE VERSION)
G
E
FAIRCHILD SEMICONDUCTOR IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS
4,364,073 4,417,385 4,430,792 4,443,931 4,466,176 4,516,143 4,532,534 4,587,713
4,598,461 4,605,948 4,620,211 4,631,564 4,639,754 4,639,762 4,641,162 4,644,637
4,682,195 4,684,413 4,694,313 4,717,679 4,743,952 4,783,690 4,794,432 4,801,986
4,803,533 4,809,045 4,809,047 4,810,665 4,823,176 4,837,606 4,860,080 4,883,767
4,888,627 4,890,143 4,901,127 4,904,609 4,933,740 4,963,951 4,969,027
COLLECTOR
(FLANGE)
G
E
C
G
JEDEC TO-263AB
COLLECTOR
(FLANGE)
E
©2002 Fairchild Semiconductor Corporation HGTG10N120BN, HGTP10N120BN, HGT1S10N120BNS Rev. B1
HGTG10N120BN, HGTP10N120BN, HGT1S10N120BNS
Absolute Maximum Ratings T
= 25oC, Unless Otherwise Specified
C
HGTG10N120BN
HGTP10N120BN
HGT1S10N120BNS UNITS
Collector to Emitter Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .BV
CES
1200 V
Collector Current Continuous
= 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
At T
C
= 110oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
At T
C
Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Gate to Emitter Voltage Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
Gate to Emitter Voltage Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
Switching Safe Operating Area at T
Powe r Dissipation Total at T
C
Power Dissipation Derating T
= 150oC (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . SSOA 55A at 1200V
J
= 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
> 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.38 W/oC
C
Forward Voltage Avalanche Energy (Note 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E
Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . T
C25
C110
CM
GES
GEM
D
AV
, T
J
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
Package Body for 10s, see Tech Brief 334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
Short Circuit Withstand Time (Note 3) at V
Short Circuit Withstand Time (Note 3) at V
CAUTION: Stresses above those listed in “A bsolute Maximu m Rating s” may cause per manent d amage to t he device. This is a str ess on ly rating and operation o f the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
= 15V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .t
GE
= 12V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .t
GE
L
pkg
SC
SC
35 A
17 A
80 A
±20 V
±30 V
298 W
80 mJ
-55 to 150
300
260
8 µ s
15 µs
o
C
o
C
o
C
NOTES:
1. Pulse width limited by maximum junction temperature.
= 20A, L = 400µ H, TJ = 25oC.
2. I
CE
3. V
= 840V, TJ = 125oC, RG = 10Ω.
CE(PK)
Electrical Specifications T
= 25oC, Unless Otherwise Specified
C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Collector to Emitter Breakdown Voltage BV
Emitter to Collector Breakdown Voltage BV
Collector to Emitter Leakage Current I
Collector to Emitter Saturation Voltage V
Gate to Emitter Threshold Voltage V
Gate to Emitter Leakage Current I
CES
ECS
CES
CE(SAT)IC
GE(TH)
GES
Switching SOA SSOA T
Gate to Emitter Plateau Voltage V
On-State Gate Charge Q
GEP
G(ON)
IC = 250µ A, VGE = 0V 1200 - - V
IC = 10mA, V
= 0V 15 - - V
GE
VCE = 1200V TC = 25oC - - 250 µA
T
= 125oC - 150 - µA
C
T
= 150oC--2 m A
C
= 10A,
V
= 15V
GE
IC = 90µ A, VCE = V
= 25oC - 2.45 2.7 V
T
C
T
= 150oC- 3 . 7 4 . 2 V
C
GE
6.0 6.8 - V
VGE = ±20V - - ±250 nA
= 150oC, RG = 10Ω, V GE = 15V,
J
L = 400µ H, V
CE(PK)
= 1200V
55 - - A
IC = 10A, VCE = 600V - 10.4 - V
IC = 10A,
= 600V
V
CE
V
= 15V - 100 120 nC
GE
V
= 20V - 130 150 nC
GE
©2002 Fairchild Semiconductor Corporation HGTG10N120BN, HGTP10N120BN, HGT1S10N120BNS Rev. B1
HGTG10N120BN, HGTP10N120BN, HGT1S10N120BNS
Electrical Specifications T
= 25oC, Unless Otherwise Specified (Continued)
C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Current Turn-On Delay Time t
d(ON)I
Current Rise Time t
Current Turn-Off Delay Time t
d(OFF)I
Current Fall Time t
Turn-On Energy (Note 5) E
Turn-On Energy (Note 5) E
Turn-Off Energy (Note 4) E
Current Turn-On Delay Time t
d(ON)I
Current Rise Time t
Current Turn-Off Delay Time t
d(OFF)I
Current Fall Time t
Turn-On Energy (Note 5) E
Turn-On Energy (Note 5) E
Turn-Off Energy (Note 4) E
Thermal Resistance Junction To Case R
rI
fI
ON1
ON2
OFF
rI
fI
ON1
ON2
OFF
θ JC
IGBT and Diode at TJ = 25oC
10A
I
CE =
= 960V
V
CE
V
= 15V
GE
= 10Ω
R
G
L = 2mH
Test Circuit (Figure 18)
IGBT and Diode at TJ = 150oC
= 10A
I
CE
= 960V
V
CE
V
= 15V
GE
= 10Ω
R
G
L = 2mH
Test Circuit (Figure 18)
NOTES:
4. Turn-Off Energy Loss (E
at the point where the collector current equals zero (I
) is defined as the integral of the instantaneous power loss starting at the trailing edge of the input pulse and ending
OFF
= 0A). All devices were tested per JEDEC Standard No. 24-1 Method for Measurement
CE
of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss.
5. Values for two Turn-On loss conditions are shown for the convenience of the circuit designer. E
is the turn-on loss when a typical diode is used in the test circuit and the diode is at the same T
Figure 18.
-2 32 6n s
-1 11 5n s
- 165 210 ns
- 100 140 ns
-0 . 3 20 . 4m J
-0 . 8 51 . 1m J
-0 . 81 . 0m J
-2 12 5n s
-1 11 5n s
- 190 250 ns
- 140 200 ns
-0 . 40 . 5m J
-1 . 7 52 . 3m J
-1 . 11 . 4m J
- - 0.42
is the turn-on loss of the IGBT only. E
ON1
as the IGBT. The diode type is specified in
J
o
C/W
ON2
Typical Performance Curves Unless Otherwise Specified
35
30
25
20
15
10
, DC COLLECTOR CURRENT (A)
5
CE
I
0
25 75 100 125 150
50
TC, CASE TEMPERATURE (oC)
= 15V
V
GE
FIGURE 1. DC COLLECTOR CURRENT vs CASE
TEMPERATURE
©2002 Fairchild Semiconductor Corporation HGTG10N120BN, HGTP10N120BN, HGT1S10N120BNS Rev. B1
60
50
TJ = 150oC, RG = 10Ω, V
40
30
20
10
, COLLECTOR TO EMITTER CURRENT (A)
0
CE
I
0
V
, COLLECTOR TO EMITTER VOLTAGE (V)
CE
= 15V, L = 400µH
GE
600 800 400 200 1000 1200
1400
FIGURE 2. MINIMUM SWITCHING SAFE OPERATING AREA