The HGTG30N60A4 is a MOS gated high voltage switching
device com binin g the b est f e atures of MO SFETs a nd bip olar
transistors. This device has the high input impedance of a
MOSFET and the low on-state conduction loss of a bipolar
transistor. The much lower on-state voltage drop varies only
moderately between 25
o
C and 150oC.
This IGBT is ideal for many high voltage switching
applications operating at high frequencies where low
conduction losses are essential. This device has been
optimized for high frequency switch mode power supplies.
Formerly Developmental Type TA49343.
Ordering Information
PART NUMBERPACKAGEBRAND
HGTG30N60A4TO-247G30N60A4
NOTE: When ordering, use the entire part number.
Symbol
C
File Number4829
Features
• >100kHz Operation at 390V, 30A
• 200kHz Operation at 390V, 18A
• 600V Switching SOA Capability
• Typical Fall Time. . . . . . . . . . . . . . . . . 60ns at T
• Low Conduction Loss
Packaging
JEDEC STYLE TO-247
E
C
G
= 125oC
J
G
E
FAIRCHILD CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS
Operating and Storage Junction Temperature Range . . . . .T
C25
C110
CM
GES
GEM
D
, T
J
STG
Maximum Lead T emperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . T
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . T
CAUTION: Stresses above those listed in “A bsolute Maximu m Rating s” may cause per manent d amage to t he device. This is a str ess on ly rating and operation o f the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
L
PKG
75A
60A
240A
±20V
±30V
463W
-55 to 150
300
260
o
C
o
C
o
C
NOTE:
1. Pulse width limited by maximum junction temperature.
Electrical SpecificationsT
= 25oC, Unless Otherwise Specified
J
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Collector to Emitter Breakdown VoltageBV
Emitter to Collector Breakdown VoltageBV
Collector to Emitter Leakage CurrentI
Collector to Emitter Saturation VoltageV
Gate to Emitter Threshold VoltageV
Gate to Emitter Leakage CurrentI
CES
ECS
CES
CE(SAT)IC
GE(TH)
GES
Switching SOASSOAT
Gate to Emitter Plateau VoltageV
On-State Gate ChargeQ
Current Turn-On Delay Timet
Current Rise Timet
Current Turn-Off Delay Timet
Current Fall Timet
Turn-On Energy (Note 2)E
Turn-On Energy (Note 2)E
Turn-Off Energy (Note 3)E
GEP
g(ON)
d(ON)I
rI
d(OFF)I
fI
ON1
ON2
OFF
IC = 250µA, VGE = 0V600--V
IC = -10mA, V
= 0V20--V
GE
VCE = 600VTJ = 25oC--250µA
T
= 125oC--4.0mA
J
= 30A,
V
GE
= 15V
T
= 25oC-1.82.6V
J
T
= 125oC-1.62.0V
J
IC = 250µA, VCE = 600V4.55.27.0V
VGE = ±20V--±250nA
Current Fall Timet
Turn-On Energy (Note 2)E
Turn-On Energy (Note 2)E
Turn-Off Energy (Note 3)E
Thermal Resistance Junction To CaseR
rI
fI
ON1
ON2
OFF
θJC
IGBT and Diode at TJ = 125oC
I
= 30A
CE
= 390V
V
CE
= 15V
V
GE
R
= 3Ω
G
L = 200µH
Test Circuit - (Figure 20)
NOTES:
2. Values for two Turn-On loss conditions are shown for the convenience of the circuit designer. E
is the turn-on loss when a typical diode is used in the test circuit and the diode is at the same T
Figure 20.
3. Turn-Off Energy Loss (E
at the point where the collector current equals zero (I
) is defined as the integral of the instantaneous power loss starting at the trailing edge of the input pulse and ending
OFF
= 0A). All devices were tested per JEDEC Standard No. 24-1 Method for Measurement
CE
of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss.