Fairchild Semiconductor FDS4470 Datasheet

February 2002
G
FDS4470
FDS4470
40V N-Channel PowerTrench MOSFET
General Description
This N-Channel MOSFET has been designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers. It has been optimized for low gate charge, low R
and fast switching speed.
DS(ON)
Applications
DC/DC converter
D
D
D
D
D
D
D
D
SO-8
Pin 1
SO-8
S
Absolute Maximum Ratings T
G
S
S
S
S
S
o
=25
A
C unless otherwise noted
Features
12.5 A, 40 V. R
Low gate charge (45 nC)
High performance trench technology for extremely
low R
High power and current handling capability
DS(ON)
5 6 7 8
= 9 m @ VGS = 10 V
DS(ON)
4 3 2 1
Symbol Parameter Ratings Units
V
Drain-Source Voltage 40 V
DSS
V
Gate-Source Voltage +30/–20 V
GSS
ID Drain Current – Continuous (Note 1a) 12.5 A – Pulsed 50 PD
TJ, T
STG
Power Dissipation for Single Operation (Note 1a) 2.5 (Note 1b) (Note 1c)
Operating and Storage Junction Temperature Range –55 to +175 °C
1.4
1.2
W
Thermal Characteristics
R
Thermal Resistance, Junction-to-Ambient (Note 1a) 50 °C/W
θJA
R
Thermal Resistance, Junction-to-Ambient (Note 1c) 125 °C/W
θJA
R
Thermal Resistance, Junction-to-Case (Note 1) 25 °C/W
θJC
Package Marking and Ordering Information
Device Marking Device Reel Size Tape width Quantity
2002 Fairchild Semiconductor Corporation
FDS4470 FDS4470 13’’ 12mm 2500 units
FDS4470 Rev D (W)
FDS4470
Electrical Characteristics T
Symbol
Drain-Source Avalanche Ratings (Note 2)
Parameter Test Conditions Min Typ Max Units
= 25°C unless otherwise noted
A
EAS Drain-Source Avalanche Energy Single Pulse, VDD=40V, ID=12.5A 370 mJ IAS Drain-Source Avalanche Current 12.5 A
Off Characteristics
BV
Drain–Source Breakdown Voltage VGS = 0 V, ID = 250 µA 40 V
DSS
BVDSS TJ
I
Zero Gate Voltage Drain Current VDS = 32 V, VGS = 0 V 1 µA
DSS
I
GSSF
I
GSSR
Breakdown Voltage Temperature Coefficient
ID = 250 µA, Referenced to 25°C
42
mV/°C
Gate–Body Leakage, Forward VGS = 30 V, VDS = 0 V 100 nA
Gate–Body Leakage, Reverse VGS = –20 V, VDS = 0 V –100 nA
On Characteristics (Note 2)
V
Gate Threshold Voltage VDS = VGS, ID = 250 µA 2 3.9 5 V
GS(th)
VGS(th)TJ
R
DS(on)
I
D(on)
Gate Threshold Voltage Temperature Coefficient
ID = 250 µA, Referenced to 25°C
Static Drain–Source On–Resistance VGS = 10 V, ID = 12.5 A
VGS = 10 V, ID = 12.5 A,TJ=125°C
–8
6 9 9
14
mV/°C
m
On–State Drain Current VGS = 10 V, VDS = 5 V 25 A
gFS Forward Transconductance VDS = 10 V, ID = 12.5 A 45 S
Dynamic Characteristics
C
Input Capacitance 2659 pF
iss
C
Output Capacitance 605 pF
oss
C
Reverse Transfer Capacitance
rss
VDS = 20 V, V f = 1.0 MHz
= 0 V,
GS
298 pF
Switching Characteristics (Note 2)
t
Turn–On Delay Time 14 25 ns
d(on)
tr Turn–On Rise Time 12 22 ns t
Turn–Off Delay Time 37 59 ns
d(off)
tf Turn–Off Fall Time Qg Total Gate Charge 45 63 nC Qgs Gate–Source Charge 27 nC Qgd Gate–Drain Charge
VDD = 20 V, ID = 1 A, VGS = 10 V, R
GEN
= 6
VDS = 20 V, ID = 12.5 A, VGS = 10 V
29 46 ns
5 nC
FDS4470 Rev D (W)
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