Fairchild Semiconductor 74ABT543CSPC, 74ABT543CSCX, 74ABT543CSC, 74ABT543CMTCX, 74ABT543CMTC Datasheet

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November 1992 Revised January 1999
74ABT543 Octal Registered Transceiver with 3-STATE Outputs
© 1999 Fairchild Semiconductor Corporation DS011508.prf www.fairchildsemi.com
74ABT543 Octal Registered Transceiver with 3-STATE Outputs
General Description
The ABT543 octal transceiver conta ins two sets of D-type latches for temporary storage of data flowing in either direction. Separate Latch Enable and Output Enabl e inputs are provided for each register to permit indep endent con­trol of inputting and outputt ing in either direction of data flow.
Features
Back-to-back registers for storage
Bidirectional data path
A and B outputs have current sourcing capability of 32
mA and current sinking capability of 64 mA
Separate controls for data flow in each direction
Guaranteed output skew
Guaranteed multiple output switching specifications
Output switching specified for both 5 0 pF and 250 pF
loads
Guaranteed simultaneous switching noise level and dynamic threshold performance
Guaranteed latchup protection
High impedance glitch free bus loading during entire
power up and power down cycle
Nondestructive hot insertion capability
Ordering Code:
Device also available in Tape and Reel. Specify by appendin g s uf f ix let t er “X” to the ordering co de.
Connection Diagram
Pin Assignment for
SOIC, SSOP and TSSOP
Pin Descriptions
Order Number Package Number Package Description
74ABT543CSC M24B 24-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide Body 74ABT543CMSA MSA24 24-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide 74ABT543CMTC MTC24 24-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Pin Names Description
OEAB
, OEBA Output Enable Inputs
LEAB
, LEBA Latch Enable Inputs
CEAB
, CEBA Chip Enable Inputs
A
0–A7
Side A Inputs or 3-STATE Outputs
B
0–B7
Side B Inputs or 3-STATE Outputs
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74ABT543
Functional Description
The ABT543 contains two sets of D-type latches, with sep­arate input and output co ntr ols for each. For data flow fro m A to B, for example, the A to B Enable (CEAB
) input must be low in order to enter data from the A Port or take da ta from the B Port as i ndicated in the Da ta I/O Contr ol Table. With CEAB
low, a low signal on (LEAB) input makes the A to B latches transparent; a subse quent low to high transi­tion of the LEAB
line puts the A latches in the storage mode and their outputs no longer change with the A inputs. With CEAB
and OEAB both low, the B output buffers are active and reflect the data present on the output of the A latches. Control of data flow from B to A is similar, but using the CEBA
, LEBA and OEBA.
Data I/O Control Table
H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial
Logic Diagram
Inputs Latch Status Output Buffers
CEAB
LEAB OEAB
H X X Latched HIGH Z X H X Latched
L L X Transparent — X X H HIGH Z L X L Driving
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74ABT543
Absolute Maximum Ratings(Note 1)
Recommended Operating Conditions
Note 1: Absolute maximum ratings are values beyond which the device
may be damaged or have its useful life impaired. Functional operation under these condit ions is not implied.
Note 2: Either voltage limit or current limi t is s uf f ic ient to protect inputs.
DC Electrical Characteristics
Note 3: Guaranteed but not tested. Note 4: For 8-bit toggling. I
CCD
< 1.4 mA/MHz.
Note 5: Guaranteed, but not tested.
Storage Temperature 65°C to +150°C Ambient Temperature under Bias −55°C to +125°C Junction Tem perature under Bias 55°C to +150°C V
CC
Pin Potential to
Ground Pin 0.5V to +7.0V Input Voltage (Note 2) 0.5V to +7.0V Input Current (Note 2) 30 mA to +5.0 mA Voltage Applied to Any Output
in the Disable or Power-Off State 0.5V to +5.5V
in the HIGH State 0.5V to V
CC
Current Applied to Output
in LOW State (Max)
twice the rated I
OL
(mA)
DC Latchup Source Current 500 mA Over Voltage Latchup (I/O) 10V
Free Air Ambient Temperature −40°C to +85°C Supply Voltage +4.5V to +5.5V Minimum Input Edge Rate (∆V/∆t)
Data Input 50 mV/ns Enable Input 20 mV/ns Clock Input 100 mV/ns
Symbol Parameter Min Typ Max Units
V
CC
Conditions
V
IH
Input HIGH Voltage 2.0 V Recognized HIGH Signal
V
IL
Input LOW Voltage 0.8 V Recognized LOW Signal
V
CD
Input Clamp Diode Voltage −1.2 V IIN = 18 mA (Non I/O Pins)
V
OH
Output HIGH Voltage 2.5 IOH = 3 mA, (An, Bn)
2.0 IOH = 32 mA, (An, Bn)
V
OL
Output LOW Voltage 0.55 V Min IOL = 64 mA, (An, Bn)
V
ID
Input Leakage Test 4.75 V 0.0 IID = 1.9 µA, (Non-I/O Pins)
All Other Pins Grounded
I
IH
Input HIGH Current 1 µAMaxVIN = 2.7V (Non-I/O Pins) (Note 3)
1V
IN
= VCC (Non-I/O Pins)
I
BVI
Input HIGH Current Breakdown Test 7 µAMaxVIN = 7.0V (Non-I/O Pins)
I
BVIT
Input HIGH Current 100 µAMaxVIN = 5.5V (An, Bn) Breakdown Test (I/O)
I
IL
Input LOW Current −1 µAMaxVIN = 0.5V (Non-I/O Pins) (Note 3)
1V
IN
= 0.0V (Non-I/O Pins)
IIH+ I
OZH
Output Leakage Current 10 µA 0V–5.5V V
OUT
= 2.7V (An, Bn);
OEAB or CEAB = 2V
IIL + I
OZL
Output Leakage Current −10 µA 0V–5.5V V
OUT
= 0.5V (An, Bn);
OEAB or CEAB = 2V
I
OS
Output Short-Circuit Current 100 275 mA Max V
OUT
= 0V (An, Bn)
I
CEX
Output HIGH Leakage Current 50 µAMaxV
OUT
= VCC (An, Bn)
I
ZZ
Bus Drainage Test 100 µA0.0VV
OUT
= 5.5V (An, Bn);
All Others GND
I
CCLH
Power Supply Current 50 µA Max All Outputs HIGH
I
CCL
Power Supply Current 30 mA Max All Outputs LOW
I
CCZ
Power Supply Current 50 µA Max Outputs 3-STATE
All Others at VCC or GND
I
CCT
Additional ICC/Input 2.5 mA Max VI = VCC 2.1V
All Others at VCC or GND
I
CCD
Dynamic I
CC
No Load
Outputs Open, CEAB
(Note 5) 0.18 mA/MHz Max
and OEAB = GND, CEBA = VCC, One Bit Toggling, 50% Duty Cycle, (Note 4)
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