Fairchild H11F1M service manual

H11F1M, H11F2M, H11F3M — Photo FET Optocouplers
May 2012
Features
As a remote variable resistor:
100 Ω to 300M Ω
15pF shunt capacitance
100G Ω I/O isolation resistance
As an analog switch:
Extremely low offset voltage 60 V
No charge injection or latch-up UL recognized (File #E90700)
signal capability
pk-pk
Applications
As a remote variable resistor:
Isolated variable attenuator Automatic gain control
Active filter fine tuning/band switching
As an analog switch:
Isolated sample and hold circuit Multiplexed, optically isolated A/D conversion
General Description
The H11FXM series consists of a Gallium-Aluminum­Arsenide IRED emitting diode coupled to a symmetrical bilateral silicon photo-detector. The detector is electri­cally isolated from the input and performs like an ideal isolated FET designed for distortion-free control of low level AC and DC analog signals. The H11FXM series devices are mounted in dual in-line packages.
Schematic Package Outlines
ANODE
CATHODE
©2007 Fairchild Semiconductor Corporation www.fairchildsemi.com H11F1M, H11F2M, H11F3M Rev. 1.0.5
1
2
3
OUTPUT
6
TERM.
5
OUTPUT
4
TERM.
°C
°C
°C
mA
V
A
mW
mW
H11F1M, H11F2M, H11F3M — Photo FET Optocouplers
Absolute Maximum Ratings
(T
= 25°C unless otherwise specified)
A
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only.
Symbol Parameter Device Value
Units
TOTAL DEVICE
T
T
T
STG
OPR
SOL
Storage Temperature All -40 to +150
Operating Temperature All -40 to +100
Lead Solder Temperature All 260 for 10 sec
EMITTER
I
V
I
F(pk)
P
F
R
D
Continuous Forward Current All 60
Reverse Voltage All 5
Forward Current – Peak (10µs pulse, 1% duty cycle) All 1
LED Power Dissipation 25°C Ambient All 100
Derate Linearly from 25°C 1.33
mW/°C
DETECTOR
BV
P
D
4-6
Detector Power Dissipation @ 25°C All 300
Derate linearly from 25°C 4.0
Breakdown Voltage (either polarity) H11F1M,
±30 V
mW/°C
H11F2M
H11F3M ±15 V
I
4-6
Continuous Detector Current (either polarity) All ±100 mA
©2007 Fairchild Semiconductor Corporation www.fairchildsemi.com H11F1M, H11F2M, H11F3M Rev. 1.0.5 2
Ω
Ω
Ω
(T
Electrical Characteristics
= 25°C unless otherwise specified.)
A
Individual Component Characteristics
Symbol Parameter Test Conditions Device Min. Typ.* Max. Unit
EMITTER
V
Input Forward Voltage I
F
I
Reverse Leakage Current V
R
C
Capacitance V = 0 V, f = 1.0MHz All 50 pF
J
OUTPUT DETECTOR
BV
Breakdown Voltage
4-6
Either Polarity
I
R
C
Off-State Dark Current V
4-6
Off-State Resistance V
4-6
Capacitance V
4-6
= 16mA All 1.3 1.75 V
F
= 5V All 10 µA
R
I
= 10µA, I
4-6
= 0 H11F1M, H11F2M 30 V
F
H11F3M 15
= 15 V, I
4-6
V
= 15 V, I
4-6
T
= 100°C
A
= 15 V, I
4-6
= 15 V, I
4-6
= 0 All 50 nA
F
= 0,
F
= 0 All 300 M Ω
F
= 0,
F
All 50 µA
All 15 pF
f = 1MHz
H11F1M, H11F2M, H11F3M — Photo FET Optocouplers
Transfer Characteristics
Symbol Characteristics Test Conditions Device Min Typ* Max Units
DC CHARACTERISTICS
R
On-State Resistance I
4-6
= 16mA,
F
I
= 100µA
4-6
H11F1M 200
H11F2M 330
H11F3M 470
R
On-State Resistance I
6-4
= 16mA,
F
I
= 100µA
6-4
H11F1M 200
H11F2M 330
H11F3M 470
Resistance, non-linearity and assymetry
= 16mA,
I
F
I
= 25µA RMS,
4-6
All 2 %
f = 1kHz
AC CHARACTERISTICS
t
t
Turn-On Time R
on
Turn-Off Time R
off
= 50 Ω , I
L
V
= 5V
4-6
= 50 Ω , I
L
V
= 5V
4-6
= 16mA,
F
= 16mA,
F
All 45 µs
All 45 µs
Isolation Characteristics
Symbol Characteristic Test Conditions Device Min. Typ.* Max. Units
V
ISO
R
ISO
C
ISO
*All Typical values at T
Isolation Voltage f = 60Hz, t = 1 sec. All 7500 V
Isolation Resistance V
= 500 VDC All 10
I-O
11
AC
PEAK
Isolation Capacitance f = 1MHz All 0.2 pF
= 25°C
A
©2007 Fairchild Semiconductor Corporation www.fairchildsemi.com H11F1M, H11F2M, H11F3M Rev. 1.0.5 3
Safety and Insulation Ratings
As per IEC 60747-5-2, this optocoupler is suitable for “safe electrical insulation” only within the safety limit data. Compliance with the safety ratings shall be ensured by means of protective circuits.
Symbol Parameter Min. Typ. Max. Unit
Installation Classifications per DIN VDE 0110/1.89 Table 1
For Rated Main Voltage < 150Vrms I-IV
For Rated Main voltage < 300Vrms I-IV
Climatic Classification 55/100/21
Pollution Degree (DIN VDE 0110/1.89) 2
CTI Comparative Tracking Index 175
V
PR
Input to Output Test Voltage, Method b, V = V
, 100% Production Test with tm = 1 sec, Partial
PR
Discharge < 5pC
Input to Output Test Voltage, Method a, V V
, Type and Sample Test with tm = 60 sec, Partial
PR
Discharge < 5pC
V
IORM
V
IOTM
Max. Working Insulation Voltage 850 V
Highest Allowable Over Voltage 6000 V
External Creepage 7 mm
External Clearance 7 mm
Insulation Thickness 0.5 mm
RIO Insulation Resistance at Ts, V
x 1.875
IORM
x 1.5 =
IORM
= 500V 10
IO
1594 V
1275 V
9
peak
peak
peak
peak
Ω
H11F1M, H11F2M, H11F3M — Photo FET Optocouplers
©2007 Fairchild Semiconductor Corporation www.fairchildsemi.com H11F1M, H11F2M, H11F3M Rev. 1.0.5 4
Typical Performance Curves
H11F1M, H11F2M, H11F3M — Photo FET Optocouplers
Figure 1. Resistance vs. Input Current
10
1
r(on) – NORMALIZED RESISTANCE
Normalized to:
= 16mA
I
F
= 5μA RMS
I
46
0.1 1 1 0 100
– INPUT CURRENT (mA)
I
F
Figure 3. LED Forward Voltage vs. Forward Current
2.0
1.8
1.6
Figure 2. Output Characteristics
800
600
400
200
I
= 2mA
F
0
= 6mA
I
-200
– OUTPUT CURRENT (μA)
-400
46
I
-600
-800
F
= 10mA
I
F
= 14mA
I
F
= 18mA
I
F
-0.2 -0.1 0.0
– OUTPUT VOLTAGE (V)
V
46
I
= 18mA
F
I
= 14mA
F
I
= 10mA
F
I
= 6mA
F
I
= 2mA
F
0.1 0.2
Figure 4. Off-state Current vs. Ambient Temperature
10000
NORMALIZED TO: V
= 15V
46
I
= 0mA
F
= 25°C
T
A
1000
1.4
1.2
– FOR WARD VOLTAGE (V)
F
V
1.0
0.8
0.1 101 100
T
= -40°C
A
= 25°C
T
A
= 100°°C
T
A
– LED FOR WARD CURRENT (mA)
I
F
r(on) – CHANGE IN RESISTANCE (%)
100
10
– NORMALIZED DARK CURRENT
46
I
1
0204060
T
A
Figure 5. Resistive Non-Linearity vs. D.C. Bias
5
4
3
2
I
= 10μA RMS
4-6
r(on) = 200Ω
1
80 100
– AMBIENT TEMPERATURE (°C)
0
1 50 100 150 200 250 300 350
– D.C. BIAS VOLTAGE (mV)
V
4-6
©2007 Fairchild Semiconductor Corporation www.fairchildsemi.com H11F1M, H11F2M, H11F3M Rev. 1.0.5 5
Typical Applications
As a Variable Resistor As an Analog Signal Switch
ISOLATED VARIABLE ATTENUATORS
500K
500K
H11F1M
30mA
F
V
OUT
V
IN
I
F
LOW FREQUENCY HIGH FREQUENCY
DYNAMIC RANGE 70db
@10KHz
FOR 0 I
V
IN
@1MHz
I
F
H11F1M
DYNAMIC RANGE 50db FOR 0 IF 30mA
V
50
OUT
Distortion free attenuation of low level A.C. signals is accom­plished by varying the IRED current, I range and absence of coupling capacitors; D.C. level shifting or
Note the wide dynamic
F
parasitic feedback to the controlling function.
Accuracy and range are improved over conventional FET switches because the H11FXM has no charge injection from the control signal. The H11FXM also provides switching of either polarity input signal up to 30V magnitude..
ISOLATED SAMPLE AND HOLD CIRCUIT
+
V
IN
H11F1M
I
F
-
C
H11F1M, H11F2M, H11F3M — Photo FET Optocouplers
V
IN
I
V
F
OUT
V
OUT
t
AUTOMATIC GAIN CONTROL
V
H11F1M
IN
+
-
500K
I
F
AGC
SIGNAL
V
OUT
This simple circuit provides over 70db of stable gain control for an AGC signal range of from 0 to 30mA. This basic circuit can be used to provide programmable fade and attack for electronic music.
ACTIVE FILTER FINE TUNING/BAND SWITCHING
I
F1
A1
I
ADJUSTS f1, IF2 ADJUSTS f
F1
H11F1M
2
I
F2
H11F1M
A2
A3
The linearity of resistance and the low offset voltage of the H11FXM allows the remote tuning or band-switching of active filters without switching glitches or distortion. This schematic illustrates the concept, with current to the H11F1M IRED’s controlling the filter’s transfer characteristic.
MULTIPLEXED, OPTICALLY-ISOLATED A/D CONVERSION
H74A1
H74A1
CALL V1
MSB
DATA
LSB
INPUT
DATA
ACQUISITION
PROCESS CONTROL
LOGIC
SYSTEM
CALL
V
n
H11F1M
V
1
V
2
V
n
H11F1M
A/D
CONVERTER
MSB
LSB
The optical isolation, linearity and low offset voltage of the H11FXM allows the remote multiplexing of low level analog signals from such transducers as thermocouplers, Hall effect devices, strain gauges, etc. to a single A/D converter.
TEST EQUIPMENT - KELVIN CONTACT POLARITY
I
TEST
DEVICE UNDER
TEST
H11F1M
I
F
I
F
H11F1M
H11F1M
I
F
AC
PARAMETER
SENSING
BOARD
B
D
I
F
H11F1M
I
TO
F
A & B FOR
POLARITY 1
C & D FOR
POLARITY 2
In many test equipment designs the auto polarity function uses reed relay contacts to switch the Kelvin Contact polarity. These reeds are normally one of the highest maintenance cost items due to sticking contacts and mechanical problems. The totally solid-State H11FXM eliminates these troubles while providing faster switching.
©2007 Fairchild Semiconductor Corporation www.fairchildsemi.com H11F1M, H11F2M, H11F3M Rev. 1.0.5 6
Package Dimensions
Through Hole 0.4" Lead Spacing
8.13–8.89
64
8.13–8.89
64
H11F1M, H11F2M, H11F3M — Photo FET Optocouplers
6.10–6.60
5.08 (Max.)
3.28–3.53
0.38 (Min.)
(0.86)
1.02–1.78
Pin 1
13
0.41–0.51
0.25–0.36
0.76–1.14
2.54–3.81
2.54 (Bsc)
7.62 (Typ.)
15° (Typ.)
Surface Mount
64
8.13–8.89
0.20–0.30
6.10–6.60
5.08 (Max.)
3.28–3.53
0.38 (Min.)
(0.86)
1.02–1.78
Pin 1
13
0.41–0.51
(1.78)
0.25–0.36
0.76–1.14
2.54–3.81
2.54 (Bsc)
(1.52)
0.20–0.30
10.16–10.80
(2.54)
(0.76)
8.43–9.90
6.10–6.60
Pin 1
(7.49)
(10.54)
13
Rcommended Pad Layout
0.25–0.36
3.28–3.53
5.08
(Max.)
0.38 (Min.)
(0.86)
1.02–1.78
0.41–0.51
0.76–1.14
2.54 (Bsc)
0.16–0.88
(8.13)
0.20–0.30
Note:
All dimensions in mm.
©2007 Fairchild Semiconductor Corporation www.fairchildsemi.com H11F1M, H11F2M, H11F3M Rev. 1.0.5 7
Ordering Information
Option
No option H11F1M Standard Through Hole Device
S H11F1SM Surface Mount Lead Bend
SR2 H11F1SR2M Surface Mount; Tape and Reel
V H11F1VM IEC60747-5-2 approval
TV H11F1TVM IEC60747-5-2 approval, 0.4" Lead Spacing
SV H11F1SVM IEC60747-5-2 approval, Surface Mount
SR2V H11F1SR2VM IEC60747-5-2 approval, Surface Mount, Tape and Reel
Marking Information
Order Entry Identifier
(Example) Description
H11F1M, H11F2M, H11F3M — Photo FET Optocouplers
H11F1
V X YY Q
43
Definitions
1 Fairchild logo
2 Device number
VDE mark (Note: Only appears on parts ordered with VDE
3
option – See order entry table)
4 One digit year code, e.g., ‘7’
5 Two digit work week ranging from ‘01’ to ‘53’
6 Assembly package code
5
1
2
6
©2007 Fairchild Semiconductor Corporation www.fairchildsemi.com H11F1M, H11F2M, H11F3M Rev. 1.0.5 8
Carrier Tape Specification
4.5 ± 0.20
0.30 ± 0.05
21.0 ± 0.1
0.1 MAX
User Direction of Feed
4.0 ± 0.1
10.1 ± 0.20
12.0 ± 0.1
2.0 ± 0.05
1.5 MIN
Ø
11.5 ± 1.0
9.1 ± 0.20
1.5 ± 0.1/-0
Ø
H11F1M, H11F2M, H11F3M — Photo FET Optocouplers
1.75 ± 0.10
24.0 ± 0.3
©2007 Fairchild Semiconductor Corporation www.fairchildsemi.com H11F1M, H11F2M, H11F3M Rev. 1.0.5 9
Reflow Profile
H11F1M, H11F2M, H11F3M — Photo FET Optocouplers
Max. Ramp-up Rate = 3°C/S
Max. Ramp-down Rate = 6°C/S
Ts ma x
Preheat Area
Ts mi n
t
L
t
s
260
240
220
200
180
160
140
120
T
P
T
L
100
80
60
Temperature (°C)
40
20
0
120
240 360
Time 25°C to Peak
Time (seconds)
Profile Freature Pb-Free Assembly Profile
Temperature Min. (Tsmin) 150°C
Temperature Max. (Tsmax) 200°C
Time (t
Ramp-up Rate (t
Liquidous Temperature (T
Time (t
Peak Body Package Temperature 260°C +0°C / –5°C
Time (t
Ramp-down Rate (T
Time 25°C to Peak Temperature 8 minutes max.
) from (Tsmin to Tsmax) 60–120 seconds
S
to tP) 3°C/second max.
L
) 217°C
L
) Maintained Above (TL) 60–150 seconds
L
) within 5°C of 260°C 30 seconds
P
to TL) 6°C/second max.
P
t
P
©2007 Fairchild Semiconductor Corporation www.fairchildsemi.com H11F1M, H11F2M, H11F3M Rev. 1.0.5 10
H11F1M, H11F2M, H11F3M — Photo FET Optocouplers
©2007 Fairchild Semiconductor Corporation www.fairchildsemi.com H11F1M, H11F2M, H11F3M Rev. 1.0.5 11
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