FSUSB31
Low-Power 1-Port Hi-Speed USB 2.0 (480Mbps) Switch
FSUSB31 — Low-Power 1-Port Hi-Speed USB 2.0 (480 Mbps) Switch
Features
■ Low On Capacitance: 3.7pF (Typical)
■ Low On Resistance: 6.5Ω (Typical)
■ Low Power Consumption: 1µA (Maximum)
– 10µA Maximum I
Volt age Range: V
■ Wide -3dB Bandwidth: > 720MHz
■ 8kV I/O to GND ESD Protection
■ Power-off Protection W hen V
Over an Expanded Control
CCT
=
IN
2.6V, V
=
4.3V
CC
= 0V , D+ / D- Pins Can
CC
Tolerate up to 4.3V
■ Packaged in:
– 8-lead MicroPak™ (1.6 x 1.6mm)
– 8-lead US8
– 8-lead Ultrathin MLP (1.2 x 1.4mm)
Applications
■ Cell Phone, PDA, Digital Camera, an d Notebook
■ LCD Monitor, TV, and Set-top Box
Related Resources
■ AN-6022 Using the FSUSB30/31 to Comply with
USB 2.0 Fault Condition Requirements
Description
The FSUSB31 is a low-power, single-port, high-speed
USB 2.0 switch. This p a rt is con figu red as a d oub le-pole,
single-throw switch and is optimized for switching or isolating a high-speed (480Mbps) source or a high-speed
and full-sp eed (12Mb ps) source. T he FSUSB3 1 is compatible with t he r eq uirem ents o f USB 2. 0 and f eat ures an
extremely low on capacitance (C
bandwidth of th is device (>720 MHz) exceeds the bandwidth needed to pass the third harmonic, resulting in signals with minimum edge and phase distortion. Superior
channel-to-channel crosstalk minimizes interference.
The FSUSB31 contains special circuitry on the D+
pins that allows the device to withstand an over-voltage
condition. This device is also designed to minimize current consumption even when the control voltage applied
to the OE
pin is lower than the supply voltage (VCC). This
feature is especially valuable for mobile applications,
such as cell phones, allowing direct interface with the
general-purpose I/Os of the baseband processor. Other
applications include port isolation and switching in portable cell phones, PDAs, digital cameras, printers, and
notebook computers.
) of 3.7pF. The wide
ON
/D-
Ordering Information
Part NumberPackagePackage Description
FSUSB31K8XMAB08A8-Lead US8, JEDEC MO-187, Variat ion CA 3.1mm Wide
FSUSB31L8X MAC08A8-Lead MicroPak, 1.6mm Wide
FSUSB31UMX (Preliminary )UMLP08A8-Lead, Ultrathin Mold ed Leadless Package (UMLP), 1.2 x 1.4mm
All packages are lead free per JEDEC: J-STD-020B standard.
Application Diagram
V
CC
Base Band
Processor
or FS USB
Controller
HS USB
Controller
Figure 1. Typical Application Diagram
MicroPak™ is a trademark of Fairchild Semiconductor Corporation.
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommend ed op erati ng cond iti ons and stres si ng the p arts to these levels is not reco mm en ded. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only.
Symbol Parameter MinimumMaximumUnit
V
CC
V
S
V
IN
I
IK
I
OUT
T
STG
ESDHuman Body Model
Note:
1.The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are
observed. DC swit ch vo ltage may never exce ed 4.6 V.
Supply Voltage-0.54.6 V
DC Input Voltage
DC Switch Voltage
(1)
(1)
-0.54.6 V
HSD-0.5VCC+0.3V
D+, D−-0.5+4.6V
DC Input Diode Current-50mA
DC Output Current50mA
Storage Temperature-65+150°C
All Pins7.5kV
I/O to GND8kV
FSUSB31 — Low-Power 1-Port Hi-Speed USB 2.0 (480 Mbps) Switch
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol Parameter Minimum MaximumUnit
V
CC
V
IN
T
A
Note:
2. Control input must be held HIGH or LOW and it must not float.
Supply V oltage3.04.3 V
Control Input Voltage
Switch Input Voltage0 V
All typical values are at 25°C unless otherwise specified.
T
= −40°C to +85°C
V
SymbolParameterConditions
V
IK
V
IH
V
IL
I
IN
I
OZ
I
OFF
R
ON
ΔR
ON
Flatness RON Flatness
R
ON
I
CC
Clamp Diode VoltageIIN = −18mA3.0-1.2V
Input Voltage HIGH
Input Voltage LOW
Control Input LeakageVIN = 0V to V
OFF State Leakage0 ≤ HSD ≤ V
Power OFF Leakage
Current (D+, D–)
Switch On Resistance
ON
(4)
(3)
Delta R
Quiescent Supply Current
VIN = 0.0V to 4.3V,
= 0V
V
CC
(3)
VIN = 0.4V, ION = −8mA3.06.510.0Ω
VIN = 0.4V, ION = −8mA3.00.35Ω
VIN = 0.0V −1.0V,
= −8mA
I
ON
= 0.0V or VCC,
V
IN
= 0
I
OUT
CC
CC
(V)
CC
3.0 to 3.61.3V
4.31.7
3.0 to 3.60.5V
4.30.7
4.3-1.01.0μA
4.3-2.02.0μA
0-2.02.0μA
3.02.0Ω
4.31.0μA
Increase in ICC Current
I
CCT
per Control Voltage and
Levels
V
CC
V
= 2.6V, VCC = 4.3V4.310.0μA
IN
Notes:
3. Measured by the voltage drop between Dn, HSD, and Dn pins at the indicated current through the switch.
On resistance is determined by the lower of the voltage on the two ports.
4. Guaranteed by characterization.
A
Min.Typ.Max.
FSUSB31 — Low-Power 1-Port Hi-Speed USB 2.0 (480 Mbps) Switch
Unit
AC Electrical Characteristics
All typical values are for VCC = 3.3V are at 25°C unless otherwise specified.