Fairchild FDC6324L service manual
FDC6324L
Integrated Load Switch
General Description Features
These Integrated Load Switches are produced using Fairchild's
proprietary, high cell density, DMOS technology. This very high
density process is especially tailored to minimize on-state
resistance and provide superior switching performance. These
devices are particularly suited for low voltage high side load
switch application where low conduction loss and ease of driving
are needed.
V
DROP
V
DROP
High density cell design for extremely low on-resistance.
V
ON/OFF
Body Model.
SuperSOTTM-6 package design using copper lead frame for superior
thermal and electrical capabilities.
March 1999
=0.2V @ VIN=12V, IL=1A, V
=0.3V @ VIN=5V, IL=1A, V
Zener protection for ESD ruggedness. >6KV Human
=1.5 to 8V
ON/OFF
=1.5 to 8V.
ON/OFF
SOT-23
SuperSOT -6
pin
1
TM
SuperSOTTM-6
Absolute Operating Range T
SuperSOTTM-8
4
Vin,R1
5
ON/OFF
6
R1,C1
= 25°C unless otherwise noted
A
SO-8
Q2
Q1
See Application Circuit
3
2
1
Vout,C1
Vout,C1
R2
SOT-223
EQUIVALENT CIRCUIT
IN
ON/OFF
SOIC-16
V
DROP
+
-
Symbol Parameter FDC6324L Units
V
IN
V
ON/OFF
I
L
P
D
TJ,T
ESD Electrostatic Discharge Rating MIL-STD-883D Human Body
Input Voltage Range 3 - 20 V
ON/OFF Voltage Range 1.5 - 8 V
Load Current @ V
=0.5V - Continuous (Note 1)
DROP
1.5 A
- Pulsed (Note 1 & 3) 2.5
Maximum Power Dissipation (Note 2a) 0.7 W
Operating and Storage Temperature Range -55 to 150 °C
STG
6 kV
Model (100pf/1500Ohm)
THERMAL CHARACTERISTICS
R
θJA
R
θJC
Thermal Resistance, Junction-to-Ambient (Note 2a) 180 °C/W
Thermal Resistance, Junction-to-Case (Note 2) 60 °C/W
OUT
© 1999 Fairchild Semiconductor Corporation
FDC6324L Rev. D
Electrical Characteristics (T
= 25°C unless otherwise noted)
A
Symbol Parameter Conditions Min Typ Max Units
OFF CHARACTERISTICS
I
FL
I
RL
Forward Leakage Current
Reverse Leakage Current
VIN = 20 V, V
VIN = -20 V, V
ON/OFF
ON/OFF
= 0 V
= 0 V
1 µA
-1 µA
ON CHARACTERISTICS (Note 3)
V
IN
V
ON/OFF
V
DROP
I
L
Notes:
1. VIN=20V, V
2. R
guaranteed by design while R
P
D
Typical R
Input Voltage 3 20 V
On/Off Voltage 1.5 8 V
Conduction Voltage Drop @ 1A
Load Current
=8V, V
ON/OFF
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R
θJA
TJ−T
(t) =
R
θJ A
θJA
a. 180oC/W when mounted on a 2oz minimum copper pad.
=0.5V, TA=25oC
DROP
is determined by the user's board design.
θCA
TJ−T
A
=
(t)
R
θJ C+RθCA
for single device operation using the board layouts shown below on FR-4 PCB in a still air environment:
2
A
= I
(t)× R
DS(ON)@T
D
(t)
VIN = 10 V, V
VIN = 5 V, V
V
= 0.2 V, VIN = 10 V, V
DROP
V
= 0.3 V, VIN = 5 V, V
DROP
J
ON/OFF
ON/OFF
= 3.3V
= 3.3 V
ON/OFF
ON/OFF
= 3.3 V
= 3.3 V
0.135 0.2 V
0.215 0.3
1 A
1
is
θJC
2a
Scale 1 : 1 on letter size paper
3. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
FDC6324L Rev. D
Typical Electrical Characteristics (T
= 25 OC unless otherwise noted )
A
0.5
T = 125°C
J
0.4
T = 25°C
0.3
DROP
0.2
V , (V)
0.1
0
0 1 2 3 4
Figure 1. V
1
0.8
0.6
0.4
DROP
V (V)
0.2
0
1 2 3 4 5
DROP
I ,(A)
L
Versus IL at V
T = 125°C
J
T = 25°C
J
V (V)
IN
J
V = 12V
IN
V = 1.5 - 8V
ON/OFF
PW =300us, D≤ 2%
=12V. Figure 2. V
IN
I = 1A
L
V = 1.5 - 8V
ON/OFF
PW =300us, D≤ 2%
0.5
T = 125°C
0.4
J
T = 25°C
J
0.3
DROP
0.2
V , (V)
V = 5V
IN
V = 1.5 - 8V
0.1
0
0 1 2 3 4
DROP
0.45
0.4
0.35
0.3
RDS(ON), (Ohm)
0.25
0.2
0.15
0 1 2 3 4 5
I (A)
L
Versus IL at VIN=5.0V.
T = 125°C
J
T = 25°C
J
I , (A)
L
ON/OFF
PW =300us, D≤ 2%
I = 1A
L
V = 5V
IN
PW =300us, D≤ 2%
Figure 3. V
1
0.8
0.6
0.4
R ,(Ohm)(ON)
0.2
0
1 2 3 4 5
Versus V
DROP
T = 25°C
J
T = 125°C
J
V , (V)
IN
at IL=1A.
IN
I = 1A
L
V = 1.5 - 8V
ON/OFF
PW =300us, D≤ 2%
Figure 5. On Resistance Variation with
Input Voltage.
Figure 4. R
Versus IL at V
(ON)
=5.0V.
IN
FDC6324L Rev.D
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