Fairchild FAN6300, FAN6300A, FAN6300H service manual

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AN-6300
FAN6300 / FA N6300A / FAN6300H Highly Integrated Quasi-Resona nt PWM Controller
This application note describes a detailed design strategy for higher-power conversion efficiency and better EMI using a Quasi-Resonant PWM controller compared to the conventional, hard-switched converter with a fixed switching frequency. Based on the proposed design guideline, a design example with detailed parameters demonstrates the performance of the controller.
Introduction
The highly integrated FAN6300/A/H PWM controller provides several features to enhance the performance of flyback converters. FAN6300/A are applied on Quasi­Resonant flyback converter where maximum operating frequency is below 100kHz and FAN6300H is suitable for high frequency operation that is around 190kHz. A built-in High Voltage (HV) startup circuit can provide more startup current to reduce the startup time of the controller. Once the VDD voltage exceeds the turn-on threshold voltage, the HV startup function is disabled immediately to reduce power consumption. An internal valley voltage detector ensures power system operates in quasi-resonant operation in wide-
range line voltage and reduces switching loss to minimize switching voltage on drain of the power MOSFET.
To minimize standby power consumption and improve light­load efficiency, a proprietary green-mode function provides off-time modulation to decrease switching frequency and perform extended valley voltage switching to keep to a minimum switching voltage.
FAN6300/A/H controller provides many protection functions. Pulse-by-pulse current limiting ensures the fixed peak current limit level, even when short-circuit occurs. Once an open-circuit failure occurs in the feedback loop, the internal protection circuit disables PWM output immediately. As long as V threshold voltage, the controller also disables the PWM output. The gate output is clamped at 18V to protect the power MOS from high gate-source voltage conditions. The minimum t being too high. If the DET pin reaches OVP level, internal OTP is triggered, and the power system enters latch-mode until AC power is removed.
time limit prevents the system frequency from
OFF
drops below the turn-off
DD
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com Rev. 1.0.2 • 5/21/10
AN-6300 APPLICATION NOTE
Figure 1. Basic Quasi-Resonant Converter
FB
CS
DET
2
3
1
Soft-Start
5ms
Blanking
Circuit
Over-Power
Compensation
(3µs/13µs)
for H version
t
OFF
Blanking
(4µs)
(1.5µs) for H version
5V
t
OFF-MIN
(8µs/38µs)
I
DET
S/H
V
4.2V
V
DET
2.5V
2R
I
DET
DET
0.3V
0.3V
R
PWM
Current Limit
DET OVP
Latched
2ms 30µs
Valley
Detector
HV
8
I
HV
Timer 55ms
Starter
1st
Valley
27V
FB OLP
t
OFF-MIN
+9µs
Internal
OTP
OVP
t
OFF-MIN
for H version
Latched
+5µs
Latched
VDD
6
Two Steps
UVLO
16V/10V/8V
Latched
Internal
Bias
SET
S
CLR
R
DRV
Q
Q
18V
5
GATE
4
GND
7
NC
Figure 2. Functional Block Diagram
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com Rev. 1.0.2 • 5/21/10 2
AN-6300 APPLICATION NOTE
Design Procedure for the Primary-Side Inductance of Transformer
In this section, a design procedure is described using the schematic of Figure 1 as a reference.
[a] Define the System Specifications
Line voltage range (VMaximum output power (POutput voltage (V
o
in,min
and V
).
o
in,max
)
) and maximum output current (Io)
Estimated efficiency (η)
The power conversion efficiency must be estimated to calculate the maximum input power. In the case of NB adaptor applications, the typical efficiency is 85%~90%.
With the estimated efficiency, the maximum input power is given by:
P
P=
in
o
η
(1)
designed to turn on the MOSFET when V minimum voltage V
-n(Vo+Vd).
in
n:1
+
V
in
-
n(Vo+Vd)
C
oss
-
+
+-
+
V
ds
-
V
d
reaches its
ds
+
V
o
-
[b] Estimate Reflected Output Voltage
Figure 3 shows the typical waveforms of the drain voltage of quasi-resonant flyback converter. When the MOSFET is turned off, the DC link voltage (V output voltage (V Schottky diode (V
) and the forward voltage drop of the
o
) reflected to the primary, are imposed
d
on the MOSFET. The maximum nominal voltage across the MOSFET (V
VV+nV+V=()
ds,max in,max o d
ds
) is:
where the turns ratio of primary to secondary side of transformer is defined as n and V
), together with the
o
is as specified in
ds
(2)
V
ds
V
in,max
0V
n(Vo+Vd)
n(Vo+Vd)
n(V
)
n(V
o+Vd
o+Vd
)
V
ds
Figure 3. Typical Waveform of MOSFET Drain Voltage
for QR Operation
I
ds
Equation 2.
pk
I
By increasing n, the capacitive switching loss and
I
in
ds
conduction loss of the MOSFET is reduced. However, this increases the voltage stress on the MOSFET as shown in Figure 3. Therefore, determine n by a trade-off between
I
DT
d
s
the voltage margin of the MOSFET and the efficiency. Typically, a turn-off voltage spike of V 100V, thus V
is designed around 490~550V
ds,max
is considered as
ds
(75~85% of MOSFET rated voltage).
V
[c] Determine the Transformer Primary-side Inductance (L
)
P
ds
Vin+n(Vo+Vd)
n(Vo+Vd)
Figure 4 shows the typical waveforms of MOSFET drain current (I MOSFET drain voltage (V
t
, the current flows through the secondary side rectifier
OFF
diode. When I resonance between the effective output capacitor of the MOSFET and the primary-side inductance (L minimize the switching loss, the FAN6300/A/H is
), secondary diode current (Id), and the
ds
) of a QR converter. During
ds
reduces to zero, Vds begins to drop by the
d
). To
P
n(Vo+Vd)
V
in
t
t
ON
OFF
T
S
t
F
Vin-n(Vo+Vd)
Figure 4. Typical Waveform of QR Operation
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com Rev. 1.0.2 • 5/21/10 3
AN-6300 APPLICATION NOTE
p
To determine the primary-side inductance (LP), the following variables should be determined beforehand:
The minimum switching frequency (f
s,min
): The
maximum average input current occurs at the minimum input voltage and full-load condition. Meanwhile, the switching frequency is at minimum value during QR operation.
The falling time of the MOSFET drain voltage (t
):
f
As shown in Figure 4, the falling time of MOSFET drain voltage is half of the resonant period of the MOSFET effective output capacitance and primary­side inductance. If a resonant capacitor is added to be paralleled with C
, tf can be increased and EMI can
oss
be reduced. However, this forces a switching loss increase. application is about 0.5~1μs.
After determining f
The typical value of t
and t
s,min
, the maximum duty cycle is
f
for NB adaptor
f
calculated as:
nV+V
()
D(1-ft)
=
max s,min f
where V
od
n V +V +V
()
od in
is specified at low-line and full-load.
in,min
××
(3)
According to Equation 1, the maximum average input current I
I
in,max
According to Figure 3, I
IDI
in,max max d s,max
I
ds,max
I
ds,max
In Equation 5, replace I combine Equations 4 and 5 to obtain L
L
=
P
where P respectively, and f
is determined as
in,max
VI
oo
=
V η
in,min
in,max
1
=
k
(5)
2
pk
can be determined as:
VD
pk
in,min max
=
Lf
(V D
in,min max
2P f
in s, min
, and D
in
ms,min
2
)
are specified in Equations 1 and 3,
max
s,min
(4)
can be obtained as:
(6)
pk
by Equation 6, then
ds,max
P:
(7)
is the minimum switching
frequency.
Once L
is determined, the RMS current of the MOSFET
P
in normal operation are obtained as:
D
rms peak
II
ds,max ds,max
max
=
3
(8)
[d] Determine the Proper Core and the Minimum Primary Turns
When designing the transformer, consider the maximum flux density swing in normal operation (B
). The
max
maximum flux density swing in normal operation is related to the hysteresis loss in the core, while the maximum flux density in transient is related to the core saturation.
From Faraday’s law, the minimum number of turns for the transformer primary side is given by:
pk
LI
N10
P,min
Pds,max
=
BA
max e
6
×
(9)
where:
L
is specified in Equation 7;
P
pk
I
is the peak drain current specified in Equation 6;
ds,max
A
is the cross-sectional area of the core in mm2; and
e
B
is the maximum flux density swing in tesla.
max
Generally, it is possible to use B
=0.25~0.30 T.
max
Determine the Number of Turns for Auxiliary Winding
The number of turns for auxiliary winding (Na) can be obtained by:
V+V
DD D1
N=
a
V+V
od
(10)
where:
V
is the operating voltage for VDD pin;
DD
V
is the forward voltage drop of D1 in Figure 5; and
D1
V
and Vd as determined in Equation 2.
o
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com Rev. 1.0.2 • 5/21/10 4
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