This device is designed for applications requiring extremely
high current gain at collector currents to 1.0 A. Sourced from
Process 05. See MPSA14 for characteristics.
TO-92
C
SOT-23
Mark: 1V
2N6427 / MMBT6427
E
B
Absolute Maximum Ratings* TA = 25°C unless otherwise noted
SymbolParameterValueUnits
V
CEO
V
CBO
V
EBO
I
C
TJ, T
stg
Collector-Emit t er Vol t age40V
Collector-Base Voltage40V
Emitter-Base Voltage12V
Collector Current - Continuous1.2A
Operating and Stora ge Junction Temperature Range-55 to +150
C
°
*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
NOTES:
1) These ratings are based on a maximum junction temperature of 150 degrees C.
2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.
Thermal Characteristics TA = 25°C unless otherwise noted
SymbolCharacteristicMaxUnits
2N6427*MMBT6427
P
D
R
θ
JC
R
θ
JA
*Device mounted on FR-4 PCB 1.6" X 1.6" X 0.06."
Total Dev ice Dissipation
Derate above 25°C
Ther mal Resistance, Junct ion to Case83.3
Thermal Resistance, Junction to Ambient200357
625
5.0
350
2.8
mW
mW/°C
C/W
°
C/W
°
1997 Fairchild Semiconductor Corporation
µ
NPN Darlington Transistor
(continued)
Electrical Characteristics TA = 25°C unless otherwise noted
SymbolParameterTest ConditionsMinMaxUnits
OFF CHARACTERISTICS
V
(BR)CEO
V
(BR)CBO
V
(BR)EBO
I
CEO
I
CBO
I
EBO
ON CHARACTERISTICS
h
FE
V
sat
CE(
V
sat
BE(
V
BE(on)
Collector-Emitt er Breakdown Voltage*IC = 10 mA, IB = 040V
Collector-Base Breakdown Voltage
Emitter-Base Breakdown Voltage
I
= 100 µA, IE = 0
C
I
= 10 µA, IC = 0
E
Collector Cu t off CurrentVCE = 25 V, IB = 01.0
40V
12V
A
Collector Cu t off CurrentVCB = 30 V, IE = 050nA
Emitter Cutoff CurrentVEB = 10 V, IC = 050nA
DC Current Gain*IC = 10 mA, VCE = 5.0 V
I
= 100 mA, VCE = 5.0 V
C
I
= 500 mA, VCE = 5.0 V
Collector-Emitter Saturation VoltageIC = 50 mA, IB = 0.5 mA
*Pulse T est: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%
f = 1.0 MHz
f = 1.0 MHz
7.0pF
15pF
3
TO-92 Tape and Reel Data
TO-92 Packaging
Configuration: Figure 1.0
FSCINT Label sample
FAIRCHILD SEMICONDUCTOR CORPORATION
LOT:
CBVK741B019
NSID:
PN2222N
D/C1:
SPEC REV:
D9842
QA REV:
HTB:B
QTY:
10000
SPEC:
B2
(FSCINT)
F63TNR Label sample
LOT: CBVK741B019
FSID: PN222N
D/C1: D9842 QTY1: SPEC REV:
D/C2: QTY2: CPN:
QTY: 2000
SPEC:
N/F: F (F63TNR)3
TO-92 TNR/AMMO PACKING INFROMATION
PackingStyleQuantityEOL co d e
ReelA2,000D26Z
AmmoM2,000D74Z
Unit w eight = 0.22 gm
Reel weight with compo nents = 1 .0 4 kg
Amm o weig ht with components = 1.02 kg
Max q uantity p er interme d iate box = 10,000 units
TO-92 Radial Ammo Packaging
Configuration: Figure 3.0
FIRST WIRE OFF IS COLLECTOR
ADHESIVE TAPE IS ON THE TOP SIDE
FLAT OF TRANSISTOR IS ON TOP
ORDER STYLE
D74Z (M)
Machine Option “E” (J)
Style “E”, D27 Z, D71 Z (s/ h)
FIRST WIRE OFF IS EMITTER
ADHESIVE TAPE IS ON THE TOP SIDE
FLAT OF TRANSISTOR IS ON BOTTOM
ORDER STYLE
D75Z (P)
FIRST WIRE OFF IS EMITTER (ON PKG. 92)
ADHESIVE TAPE IS ON BOTTOM SIDE
FLAT OF TRANSISTOR IS ON BOTTOM
FIRST WIRE OFF IS COLLECTOR (ON PKG. 92)
ADHESIVE TAPE IS ON BOTTOM SIDE
FLAT OF TRANSISTOR IS ON TOP
September 1999, Rev. B
TO-92 Tape and Reel Data, continued
TO-92 Tape and Reel Taping
Dimension Configuration: Figure 4.0
PPd
Ha
H1
HO
P1 F1
User Direc tion of Feed
TO-92 Reel
Configuration: Figure 5.0
Hd
b
d
L1
P2
PO
DO
S
L
W1
WO
ITEM DESCRIPTION
Base of Package to Lead Bend
Compon en t He ig ht
Lead Clinch Height
Compon en t Ba s e Heig ht
Compon en t Al ig nm e nt ( sid e/s id e )
Compon en t Al ig nm e nt ( fron t /b ac k )
Compon en t Pi tc h
Feed Hole Pitch
Hole Center to First Lead
Hole Center to Component Center
Lead Spread
Lead Thickness
Cut Lead Length
Taped Lead Length
Taped Lead Thickn es s
Carrier Tape Thickness
Carrier Tape Widt h
Hold - down Tape Width
Hold - down Tape position
Feed Hole Position
Sprocket Hole Diameter
Lead Spring Out
t
W2
W
t1
SYMBOL
b
Ha
HO
H1
Pd
Hd
P
PO
P1
P2
F1/F2
d
L
L1
t
t1
W
WO
W1
W2
DO
S
DIMENSION
0.098 (m ax )
0.928 (+ /- 0.025)
0.630 (+ /- 0.020)
0.748 (+ /- 0.020)
0.040 (m ax )
0.031 (m ax )
0.500 (+ /- 0.020)
0.500 (+ /- 0.008)
0.150 (+ 0 .00 9, -0.010 )
0.247 (+ /- 0.007)
0.104 (+ /- 0 .010)
0.018 (+ 0 .00 2, -0.003 )
0.429 (m ax )
0.209 (+ 0 .05 1, -0.052 )
0.032 (+ /- 0.006)
0.021 (+ /- 0.006)
0.708 (+ 0 .02 0, -0.019 )
0.236 (+ /- 0.012)
0.035 (m ax )
0.360 (+ /- 0.025)
0.157 (+ 0 .00 8, -0.007 )
0.004 (m ax )
F63TNR Label
Customized Label
W2
ELECTROSTATIC
SENSITIVE DEVICES
D3
Note : All dimensions are in inches.
D4
D1
ITEM DESCRIPTIONSYSMBOL MINIMUM MAXIMUM
D2
W1
W3
Reel Diame t erD113.97514.025
Arbor Hol e Di am et er ( Standar d)D21.1601.200
Core DiameterD33.1003.300
Hub Recess Inner DiameterD42.7003.100
Hub Recess DepthW10.3700.570
Flange to Flange Inner WidthW21.6301.690
Hub to Hub Center WidthW32.090
SOT-23
made from a dissi pative (carbon filled) polycarbonate
resin. The cover tape is a multilayer film (Heat Activated
Adhesive in nature) primarily composed of polyester film,
adhesive layer, sealant, and anti-static sprayed agent.
These reeled parts in standard option are shipped with
3,000 uni ts per 7" or 177cm diameter reel. The reels are
dark blue in color and is made of polystyrene plastic (antistatic coated). Other option comes in 10,000 units per 13"
or 330cm diameter reel. This and some other options are
described in the Packaging Information table.
These full reels are individually labeled and placed inside
a standard inter mediate made of recyclable corrugat ed
brown paper with a Fairchil d l ogo printing. One pizza box
contains eight reels maximum. And these intermediate
boxes are placed inside a label ed shipping box which
comes i n diff erent sizes depending on the number of parts
shipped.
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
Quiet Series™
SILENT SWITCHER
SMART ST ART™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic™
UHC™
VCX™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN T O IMPROVE RELIABILITY , FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICA TION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PA TENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORA TION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STA TUS DEFINITIONS
Definition of Terms
Datasheet IdentificationProduct StatusDefinition
Advance Information
Preliminary
No Identification Needed
Obsolete
Formative or
In Design
First Production
Full Production
Not In Production
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. G
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