Epson S1S65010 Technical Manual

Page 1
Network Camera Controller with JPEG Encorder
S1S65010
Evaluation Board Technical Manual
(S5U1S65K01H0100/S5U1S65K01H1100)
Page 2
No part of this material may be reproduced or duplicated in a ny form or by any means without the written perm ission of Seiko Epson. Seiko Epson reserves the right to m ake changes to this m aterial without notice . Seiko Epson do es not assume any liability of any kind arising out of any inaccuracies contained in this material or due to its application or use in any product or circuit and, further, there is no representation that this material is applicable to products requiring high level reliability, such as medical products. Moreover, no license to any intellectual property rights is granted by implication or otherwise, and there is no repres entation or warranty that anything made in accordance with this material will be free from any pat ent or copyright infringement of a third party. This material or portions t he r eof may contain technology or the subject relating to strategic products under the control of the Foreign Exchange and Foreign Trade Law of Japan and m ay require an export li cense from the Min istry of Internat ional Trade and Industry or other approval from another government agency.
All product names mentioned herein are trademarks and/or registered trademarks of their respective owners.
SEIKO EPSON CORPORATION 2005 All rights reserved.
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Configuration of product number
Device
S1 S 65010 F 00A1 00
Evaluation Board
S5U 1S 65K01 H 1 00
x
Packing Specification Specification
Package
[F: QFP]
Model Code Product Classification 2
[S: Communication]
Product Classification 1
[S1: Semiconductor IC]
Packing Specification Board Revision
Board Code
[0: Main Board, 1: Camera Board]
Category
[H: Hardware, S: Software]
Corresponding Device Model Code
[65K01: S1S65010]
Product Classification 2
[1S : Semiconductor IC for Communication]
Product Classification 1
[S5U: Development Tools for Semiconductor]
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Contents
Contents
1. OVERVIEW.......................................................................................................................1
2. COMPONENTS.................................................................................................................1
2.1. Main Board (Product Number S5U1S65K01H0100)..............................................................1
2.2. Camera Board (Product Number S5U1S65K01H1100).........................................................1
2.3. Block Diagram........................................................................................................................2
3. MECHANICAL SPECIFICATIONS....................................................................................3
3.1. Main Board (Product Number S5U1S65K01H0100) Layout and Dimensions
3.2. Camera Board (Product Number S5U1S65K01H1100) Layout and Dimensions
...................................3
...............................4
4. EXTERNAL PINS..............................................................................................................5
4.1. Main Board Interface Connectors ..........................................................................................5
4.1.1. Camera Interface and Expansion Connectors...................................................................... 6
4.1.2. Ethernet Interface (CN7: TM11R-5M2-88-LP) ...................................................................... 7
4.1.3. JTAG In-Circuit Emulator Interface (CN1: XG8W-2031)....................................................... 7
4.1.4. Serial (RS232-C) Interface (CN13: XG8W-1031) ................................................................. 7
4.1.5. Power Supply Connector (CN10: MJ-179P) ......................................................................... 7
4.1.6. CF Card Interface (CN8: M21A-50PD-SF) ........................................................................... 8
4.2. Camera Board Interface Connectors .....................................................................................9
4.2.1. Main Board Interfaces .......................................................................................................... 9
4.2.2. Serial (RS232-C) Interface (CN6: XG8W-1031) ................................................................. 10
4.2.3. Audio Interface Connectors (CN7 to CN10: A2PA-3PGG).................................................. 11
4.2.4. Camera Module Connectors (CN2, CN4, and CN5) ........................................................... 11
5. FUNCTIONAL DESCRIPTION........................................................................................12
5.1. Mode Select DIP Switches (SW6) .......................................................................................13
5.2. GPIOB DIP Switches (SW10) .............................................................................................. 13
5.3. Hardware Reset Switch (SW3) ............................................................................................14
5.4. CF Card CFOE#/CFRST Select Switch (SW8)....................................................................14
5.5. Memory Chip Select Switch (SW5)......................................................................................14
5.6. Connection Switch for nSRST from JTAG In-Circuit Emulator (SW2) .................................14
5.7. External Memory Control Signal Monitor Connector (CN9) .................................................15
5.8. External Memory Expansion SOLDER_JP (JP1-JP3) .........................................................15
5.9. CF Card Interface SOLDER_JP (JP6, JP7).........................................................................15
6. SPECIFICATIONS...........................................................................................................16
6.1. Power Supplies....................................................................................................................16
6.2. Current Consumption........................................................................................................... 17
6.3. Debugging Environment ......................................................................................................18
7. IMPORTANT USAGE NOTES ........................................................................................26
S1S65010 Evaluation Board Technical Manual (Rev. 1.1e)
EPSON
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Contents
8. PARTS LISTS..................................................................................................................27
8.1. Main Board Parts................................................................................................................. 27
8.2. Camera Board Parts............................................................................................................ 28
9. MISCELLANEOUS..........................................................................................................29
ii
Evaluation Board Technical Manual (Rev. 1.1e)
EPSON
S1S65010
Page 8
1. OVERVIEW

1. OVERVIEW

This product, the S1S65010 Evaluation Board Kit, is for quickly building a network-accessible camera based on the Seiko Epson S1S65010 network camera chip. It consists of two main components: a main board (Product Number S5U1S65K01H0100) containing the S1S65010 and other major ICs and a camera board (Product Number S5U1S65K01H1100) for mounting a camera module.

2. COMPONENTS

2.1. Main Board (Product Number S5U1S65K01H0100)

Network camera IC: S1S65010 Flash EEPROM: 4 MB (Toshiba TC58FVM5B2ATG65) SRAM: 2 MB (Toshiba TC55VBM416AFTN) SDRAM: 16 MB (Micron MT48LC8M16A2TG-75) Ethernet interface: Support 10/100BaseT via MII
RJ45 connector TG110-LC55NC ICS1893BF JTAG debugging interface: 20-pin connector for in-circuit emulator or other debugger Camera board interface: 16/40-pin connector for camera board
2
C: Part of the camera board interface connector is used for camera control.
I
It is also connected to a serial EEPROM (BR24L56RFVM-W).
2
S: Part of the camera board interface connector is used for connecting a
I
monaural codec IC. GPIO: Part of the camera board interface connector is used for evaluating
GPIO operation. Serial interface: 10-pin RS232-C connector
Power supply voltage: 5 V ± 10%

2.2. Camera Board (Product Number S5U1S65K01H1100)

This board provides connectors for the following three CMOS camera modules.
OmniVision OV7640 EAA (or OV7648 EAA)
Hynix HV7131GP (HYCA3-L01)
Fuji Film Microdevices SA2101A
Note: This board does not support simultaneous connection of multiple camera modules. The
developer must pick one of the above three.
This board includes a monaural codec IC, an AK4536 with built-in microphone and speaker amplifiers.
S1S65010 Evaluation Board Technical Manual (Rev. 1.1e)
EPSON
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Page 9
2. COMPONENTS
2.3. Block Diagram
The following figure gives block diagram for both the main and camera boards in this evaluation kit.

MINI JACK
MINI JACK
MINI JACK
MINI JACK
232
Port
Camera Board
Monoural
Codec
Serial
EEPROM
DIP-SW
232
Driver
S1S65010
JTAG I/F
32KH
OSC
CMOS
Camera Module
CMOS
Camera Module
CMOS
Camera Module
10/100 PHY
25MKH
OSC
Note: The developer must pick one of the three supported camera modules.
Main Board
Pulse Trans
RJ-45
Connector
Data
Bus
Flash ROM
Max 4 MB )
SDRAM (16 MB)
SRAM
Max 2 MB)
Buffer
CF Card
Connector
Figure 2.1. Block Diagram
  
2
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S1S65010
Evaluation Board Technical Manual (Rev. 1.1e)
Page 10
3. MECHANICAL SPECIFICATIONS

3. MECHANICAL SPECIFICATIONS

The next two Figures show the layout and dimensions of the main and camera boards, respectively.

3.1. Main Board (Product Number S5U1S65K01H0100) Layout and Dimensions

Main Board Layout
and
Dimensions
Top View
C
88
L
759568
33
22
2
1
CN10
12345
SW1
9
10
CN13
1
2
Bottom View
U8
6
CN6
2
16V4716V
2
SW9
1
SRAM
TC58FVM5
B2AFT65
15161
10 16V1016V
CN9
CN11
47
1
U8
S1S65K/61K
NetworkBorad2
U7
DiskOnChip
(OPTION)
U7
SW3
LED3 LED4
SW5
12
11
SW8
U9
CN2
U9
MT48LC8M16A2TG- 75
1234567
SW10MODE INIT SW6
6
8
1228.64
CN4
U4
1234567
S1S65010
30.5
Screw hole
4-φ3.5
40
39
CN12
1
2
CN5CN3
U4
U12
SW4 SW7
1
34.4
CN7
8
CN1
1
ICS1893BF U12
19
1
T1
TG110-LC55N2 HALO
T1
CN7
20
SW2
12
Space for applying seal with serial number
U10
TC7MH574
U11
JP5
TC4S71F
FK
JP4
SP3232
U18
ECY
U3
PST600
U2
JP7
TC7W14
JP6
BR24L
16
FVM-W
U1
GND
uPC2933T
INOUT
Figure 3.1. Main Board (Product Number S5U1S65K01H0100) Layout and Dimensions
S1S65010 Evaluation Board Technical Manual (Rev. 1.1e)
TC58FVM5B2AF
T65
50
JP2
U15
MM1572H
U17
U6
CN8
U14
TC4S30F
JP3
U16
2
LT196
EPSON
TC74VCX16245FT
U13
U13
1
JP1
157F
TC74VHC
U5
32.768KHz
SG-3030JF
X1
K-624-01
X2
25MHz
SG-645SCG
3
Page 11
3. MECHANICAL SPECIFICATIONS
65
0

3.2. Camera Board (Product Number S5U1S65K01H1100) Layout and Dimensions

Camera Board
Layout and
Dimensions
C
Top View
L
95.0
56.0
CN5
1
23
CN7
CN8
.
58.0
CN9
12.0 12.0 12.018.5
CN10
CN3
16V
10
1
SA2101A
16V
16V
10
16V
10
2.2
16V
16V
10
16V
10
16V
U9
16V 10
1234567
16V 10
SW5
15
1
CF CTRL
16
10
MM1572H
U3
X1
25MHz
SG-645SCG
TC7W14
U1
8
10
16V
10
LT1962
U7
16V 10
MM1572H MM1572H
U6
16V
10
CN1
U5
1234567
SW3 SW4
CAMERAEXT
12.0
22 44
9.8
TC74VHC
SW2
05FT
U2
1
SW1
1
8
10.5
18.85
CN2
1
19
MM1572H
U4
20
LED1
1
2
SP3232EC Y
HYCA3-L01RS232C
2
10
38.0
CN6
39
40
20.0
5.2
12.028.64
Bottom View
88.0
for c onnec tin g an O mniV isi on camera module
Screw hole
4-φ3.5
1
CN4
2
31
32
MIC
LINE-IN
NetworkBorad
S1S65K/61K
LINE-OUT
52.0
SP-OUT
K−625−01
Figure 3.2. Camera Board (Product Number S5U1S65K01H1100) Layout and Dimensions
4
EPSON
Evaluation Board Technical Manual (Rev. 1.1e)
S1S65010
Page 12
4. EXTERNAL PINS

4. EXTERNAL PINS

4.1. Main Board Interface Connectors

The following Figure shows the locations of the exter nal interface connectors on the main board. The Tables in the following six subsections list their pin assignments.
1
2
CN10
12345
SW1
2
1
CN11
47
16V4716V
2
SW9
1
U8
U8
TC58FVM5
B2AFT6 5
1
SRAM
6
6
S1S65K/61K
NetworkBorad2
9
10
U7
CN13
1
2
DiskOnChip (OPTION)
U7
5
SW3
CN6
2
15161
10 16V1016V
CN9
LED3 LED4
12
11
SW8
SW5
U9
1234567
CN2
U9
MT48LC8M16A2TG-75
8
SW10MODE INIT SW6
CN4
U4
1234567
S1S65010
40
39
CN12
1
2
CN5CN3
U4
8
U12
SW4 SW7
1
CN7
CN1
1
ICS1893BF
U12
19
20
SW2
1
T1
TG110-LC55N2
T1
HALO
CN7
4
3
7
Figure 4.1. Main Board Layout
S1S65010 Evaluation Board Technical Manual (Rev. 1.1e)
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EPSON
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4. EXTERNAL PINS

4.1.1. Camera Interface and Expansion Connectors

(1) GPIOD and GPIOE or CF control/monitor (CN11: XG8W-1631)
(1) in Figure 4.1
Pin
Number
Function
Pin
Number
Function
1 VDD (5 V) 2 VDD (5 V)
3 CFCE2# (GPIOD2) 4 CFCE1# (GPIOD3)
5 CFIORD# (GPIOE0) 6 CFIOWR# (GPIOE1)
7 CFIREQ (GPIOE4) 8 CFRST# (GPIOE3)
9 CFWAIT# (GPIOE2) 10 CFSTSCHG# (GPIOE5)
11 CFDEN# (GPIOE6) 12 CFDIR# (GPIOE7)
13 RESET# 14 GND
15 GND 16 GND
If the user application system does not use CF cards, the CF card interface lines are available for use as GPIOD[3:2] and GPIOE[7:0], as indicated with parentheses in the above Table.
(2) Camera interface and expansion connector (CN12: XG8W-4031)
(2) in Figure 4.1
Pin
Number
Function
Pin
Number
Function
1 GND 2 GND
3 CAMDATA0 4 CAMDATA1
5 CAMDATA2 6 CAMDATA3
7 CAMDATA4 8 CAMDATA5
9 CAMDATA6 10 CAMDATA7
11 CMCLKOUT 12 CMCLKIN
13 CMVREF 14 CMHREF
15 CAMVDD 16 CAMVDD
17 I2C_SDA 18 I2C_SCL
19 3.3V 20 3.3V
21 GPIOA0 22 GPIOA1
23
25
GPIOA2 (TXD1/SPI_SS)
GPIOA4 (SPI_MISO)
24
26
GPIOA3 (RXD1/SPI_SCLK)
GPIOA5 (SPI_MOSI)
27 GPIOA6 28 GPIOA7
29
31
33
GPIOB0 (I2S0_WS)
GPIOB2 (I2S0_SD)
GPIOB4 (Timer 1 out)
30
32
34 GPIOB5
GPIOB1 (I2S0_SCK)
GPIOB3 (I2S1_SD)
35 GPIOB6 36 GPIOB7
37 GPIOD0 38 GPIOD1
39 GND 40 GND
6
Evaluation Board Technical Manual (Rev. 1.1e)
EPSON
S1S65010
Page 14
4. EXTERNAL PINS

4.1.2. Ethernet Interface (CN7: TM11R-5M2-88-LP)

(3) in Figure 4.1
Pin Number Function Pin Number Function
1 TPTXDP 2 TPTXDN
3 TPRXDP 4 NC
5 NC 6 TPRXDN
7 NC 8 NC

4.1.3. JTAG In-Circuit Emulator Interface (CN1: XG8W-2031)

(4) in Figure 4.1
Pin Number Function Pin Number Function
1 3.3 V 2 3.3 V
3 nTRST 4 GND
5 TDI 6 GND
7 TMS 8 GND
9 TCK 10 GND
11 GND 12 GND
13 TDO 14 GND
15 nSRST 16 GND
17 NC 18 GND
19 NC 20 GND

4.1.4. Serial (RS232-C) Interface (CN13: XG8W-1031)

Pin Number Function Pin Number Function
1 NC 2 RXD
3 TXD 4 NC
5 GND 6 NC
7 RTS 8 CTS
9 NC 10 NC
This layout matches that used by such PC motherboard manufacturers as ASUS and GIGABYTE.

4.1.5. Power Supply Connector (CN10: MJ-179P)

This is for connecting the AC power supply adapter included with the kit.
(5) in Figure 4.1
(6) in Figure 4.1
S1S65010 Evaluation Board Technical Manual (Rev. 1.1e)
EPSON
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Page 15
4. EXTERNAL PINS

4.1.6. CF Card Interface (CN8: M21A-50PD-SF)

Pin Number Function Pin Number Function
1 GND 2 D3 (CF_D3)
3 D4 (CF_D4) 4 D5 (CF_D5)
5 D6 (CF_D6) 6 D7 (CF_D7)
7 CE1# (CFCE1#) 8 A10 (MA10)
9 OE# (CFOE#) 10 A9 (MA9)
11 A8 (MA8) 12 A7 (MA7)
13 VCC1 (3.3V) 14 A6 (MA6)
15 A5 (MA5) 16 A4 (MA4)
17 A3 (MA3) 18 A2 (MA2)
19 A1 (MA1) 20 A0 (MA0)
21 D0 (CF_D0) 22 D1 (CF_D1)
23 D2 (CF_D2) 24 WP (NC)
25 CD2# (NC) 26 CD1# (NC)
27 D11 (CF_D11) 28 D12 (CF_D12)
29 D13 (CF_D13) 30 D14 (CF_D14)
31 D15 (CF_D15) 32 CE2# (CFCE2#)
33 VS1# (NC) 34
35
37
39 CSEL# (CSEL#) 40 VS2# (NC)
41
43 INPACK# (NC) 44 REG# (REG#)
45
47 D8 (CF_D8) 48 D9 (CF_D9)
49 D10 (CD_D10) 50 GND
IOWR#
(CFIOWR#)
RDY/BSY (CFIREQ)
RESET
(CFRST_CN)
BVD2
(BVD2/DASP)
(7) in Figure 4.1
IORD#
(CFIORD#)
36 WE# (MWE0#)
38 VCC1 (3.3V)
42
46
WAIT#
(CFWAIT#)
BVD1
(CFSTSCHG#)
The following pins are nonfunc tiona l on this eval uat ion boar d bec ause t he S1S6 5010 does n ot su pport them: VS1#, VS2#, WP, CD1#, CD2#, INPACK#, and BVD2.
8
Evaluation Board Technical Manual (Rev. 1.1e)
EPSON
S1S65010
Page 16
4. EXTERNAL PINS

4.2. Camera Board Interface Connectors

The following Figure shows the locations of the exter nal interface connectors on the cam era board. The Tables in the following four subsections list their pin assignments.
10
4
CN5
1
23
CN 7
SA2101A
5
10
2. 2
16 V
CN8
10
16 V
CN9
6
CN10
7
CN3
10
16 V
1
16V
10
16V
U9
16V 10
16V 10
15
1234567
SW5
1
X1
25MHz
SG-645SCG
8
9
22 44
TC74VHC
SW2
05FT
16V1016V
MM1572H MM1572H
U6
16V1016V 10
1234567
CN1
10
U5
SW3 SW4
CAMER A EXT
16V 10
10
16 V
MM1572H
U3
2
LT196
U7
TC7W14
U1
U2
1
SW1
1
8
CN2
MM1572H
U4
LED1
1
2
119
20
SP3232 ECY
HYCA3- L 01RS232C
2
10
CN 6
39
8
3
1

4.2.1. Main Board Interfaces

(1) CF control/monitor (CN3: HIF3H-16DB-2.54S)
Pin Number Function Pin Number Function
1 5 V 2 5 V
3 NC 4 NC
5 NC 6 NC
7 NC 8 NC
9 NC 10 NC
11 NC 12 NC
13 RESET# 14 GND
15 GND 16 GND
CF CTRL
16 2
2
Figure 4.2. Camera Board Layout
40
(1) in Figure 4.2
S1S65010 Evaluation Board Technical Manual (Rev. 1.1e)
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Page 17
4. EXTERNAL PINS
(2) Camera interface and expansion connector (CN1: HIF3H-40DB-2.54DS)
(2) in Figure 4.2
Pin Number Function Pin Number Function
1 GND 2 GND
3 CAMDATA0 4 CAMDATA1
5 CAMDATA2 6 CAMDATA3
7 CAMDATA4 8 CAMDATA5
9 CAMDATA6 10 CAMDATA7
11 CMCLKOUT 12 CMCLKIN
13 CMVREF 14 CMHREF
15 CAMVDD 16 CAMVDD
17 I2C_SDA 18 I2C_SCL
19 3.3V 20 3.3V
21 GPIOA0 22 GPIOA1
23
25
GPIOA2
(TXD1/SPI_SS)
GPIOA4
(SPI_MISO)
24
26
GPIOA3
(RXD1/SPI_SCLK)
GPIOA5
(SPI_MOSI)
27 GPIOA6 28 GPIOA7
29
31
33
GPIOB0
(I2S0_WS)
GPIOB2
(I2S0_SD)
GPIOB4
(Timer 1 out)
30
32
34 GPIOB5
GPIOB1
(I2S0_SCK)
GPIOB3
(I2S1_SD)
35 GPIOB6 36 GPIOB7
37 GPIOD0 38 GPIOD1
39 GND 40 GND

4.2.2. Serial (RS232-C) Interface (CN6: XG8W-1031)

(3) in Figure 4.2
Pin Number Function Pin Number Function
1 NC 2 RXD
3 TXD 4 NC
5 GND 6 NC
7 RTS 8 CTS
9 NC 10 NC
This layout matches that used by such PC motherboard manufacturers as ASUS and GIGABYTE.
10
Evaluation Board Technical Manual (Rev. 1.1e)
EPSON
S1S65010
Page 18
4. EXTERNAL PINS

4.2.3. Audio Interface Connectors (CN7 to CN10: A2PA-3PGG)

These are for a microphone, a speaker, and line I/O.
(4) to (7) in Figure 4.2
Connector Function Note
CN7 Microphone input
CN8 Line input
CN9 Line output
CN10 Speaker output

4.2.4. Camera Module Connectors (CN2, CN4, and CN5)

This board provides three (mutually exclusive) connectors for connecting a CMOS camera module.
(8) to (10) in Figure 4.2
Location Function Product Number
CN2 HV7131GP (HYCA3-L01) 245602-020-000-829
CN4 OV7640 EAA (or OV7648 EAA) 803-93-032-10-001
CN5 SA2101A A5-44DA-2DS
     
S1S65010 Evaluation Board Technical Manual (Rev. 1.1e)
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Page 19

5. FUNCTIONAL DESCRIPTION

5. FUNCTIONAL DESCRIPTION
Figures 5.1 and 5.2 show component locations on both sides of the main board. The following nine subsections describe their functions.
7
4
5
2
1
CN10
U8
12345
6
SW1
NetworkBorad2
9
10
CN13
1
2
CN6
2
2
SW9
1
SRAM
TC58FVM5
B2AF T6 5
15161
10 16V1016V
CN9
CN4
CN2
SW5
12
11
SW8
U4
S1S65010
U4
CN11
47
16V4716V
1
U8
S1S65K/61K
U9
U9
U7
Disk OnChip
(OPTION)
U7
SW3
LED3 LED4
MT48LC8M16A2TG-75
1234567
SW10MODE INIT SW6
8
1234567
8
3 2 1
Figure 5.1. Main Board (Top View)
U12
CN5CN3
SW4 SW7
1
CN7
40
39
CN12
1
2
CN1
1
ICS1893BF U12
19
20
SW2
1
T1
TG110-LC55N2 HALO
T1
CN7
6
U10
JP5
TC7MH574
U11
FK
TC4S71F
JP4
TC58FVM5B2AF
U18
SP3232 ECY
U3
PST600
U2
TC7W14
JP7
BR24L
16
FVM-W
U1
GND
uPC2933T
INOUT
T65
50
JP6
JP2
U15
MM1572H
U17
12 11 10 9 8
Figure 5.2. Main Board (Bottom View)
U6U13
CN8
U14
TC4S30F
JP3
JP1
U16
2
LT196
TC74VCX16245FT
U13
K-624-01
1
157F
TC74VHC
U5
SG- 3030JF
32.768KHz
X1
X2
25MHz
SG-645SCG
12
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S1S65010
Evaluation Board Technical Manual (Rev. 1.1e)
Page 20
5. FUNCTIONAL DESCRIPTION

5.1. Mode Select DIP Switches (SW6)

(1) in Figure 5.1
These switches (SW6) on the main board specify the system configuration i nputs MODESEL[7: 0] described in Section 4.1 of the S1S65010 Technical Manual. The following Table summarizes their function.
Table 5.1
Pin
Number
SW6
1-16
SW6
2-15
SW6
3-14
SW6
4-13
SW6
5-12
SW6
6-11
SW6
7-10
SW6
8-9
Symbol Abbreviation
SW6 1
SW6 2
SW6 3
SW6 4
SW6 5
SW6 6
SW6 7
SW6 8
MD0
(MODESEL0)
MD1
(MODESEL1)
MD2
(MODESEL2)
MD3
(MODESEL3)
MD4
(MODESEL4)
MD5
(MODESEL5)
MD6
(MODESEL6)
MD7
(MODESEL7)
32 kHz mode Reserved (for testing)
Insert crystal oscillator stabilization interval (3 seconds)
Normal operation Reserved (for testing)
Reserved (must be 0)
SW normal operation
Application mode Monitor mode
Wired LAN connection
User setting User setting
Note: This evaluation board appropriates this S1S65010 user setting input for use in returning switches to
their factory default settings.

5.2. GPIOB DIP Switches (SW10)

Function
0 (OFF) 1 (ON)
Skip stabilization interval (10 ms)
Return switches to factory defaults
Wireless LAN connection
Note
See Note.
(2) in Figure 5.1
These switches (SW10) specify input to the corresponding GPIOB port pins: “1” for the OFF position and “0” for ON.
Table 5.2
Pin
Number
SW10
1-16
SW10
2-15
SW10
3-14
SW10
4-13
SW10
5-12
SW10
6-11
SW10
7-10
SW10
8-9
Symbol Abbreviation
0 (OFF) 1 (ON)
SW10 1 GPIOB0 Logical “1” input Logical “0” input
SW10 2 GPIOB1 Logical “1” input Logical “0” input
SW10 3 GPIOB2 Logical “1” input Logical “0” input
SW10 4 GPIOB3 Logical “1” input Logical “0” input
SW10 5 GPIOB4 Logical “1” input Logical “0” input
SW10 6 GPIOB5 Logical “1” input Logical “0” input
SW10 7 GPIOB6 Logical “1” input Logical “0” input
SW10 8 GPIOB7 Logical “1” input Logical “0” input
Function
Note
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5. FUNCTIONAL DESCRIPTION

5.3. Hardware Reset Switch (SW3)

(3) in Figure 5.1
This switch (SW3) is available for user application systems using hardware resets.
 

5.4. CF Card CFOE#/CFRST Select Switch (SW8)

(4) in Figure 5.1
The (SW8) switch on this board configures the CFOE# and CFRST outputs to the CF card interface. The following Table describes the three configurations available.
If the user application system does n ot use CF car ds, set this to the OFF positi on. Otherwise, set as C =
c.
The default setting is OFF.
Display
Position
c
OFF NC NC
d
CFOE# (CF card input)
MOE# (S1S65010 output) CFRST (S1S65010 output)
GND RESET# (HW-RESET)
C
C
CFRST_CN (CF card input)

5.5. Memory Chip Select Switch (SW5)

(5) in Figure 5.1
c, C =
Notes
This board includes Flash ROM and SRAM for use as external memory. The (SW5) switch on this board configures their chip select signals. The following Table describes the three configurations available.
The default setting is
Display
Position
c
OFF NC NC
d
The following is a close-up view of the switches used in Sections 5.4 and 5.5 above. They each offer three settings:
c, d, and OFF.
c.
C
MCSB# (SRAM CS#)
MCS1# (S1S65010 output) MCS0# (S1S65010 output)
MCS0# (S1S65010 output) MCS1# (S1S65010 output)
MCSA# (Flash ROM CS#)
C
Notes
SW8
12

5.6. Connection Switch for nSRST from JTAG In-Circuit Emulator (SW2)

(6) in Figure 5.1
The (SW2) switch on this board controls the use of the nSRST signal from the JTAG in-circuit emulator as a system hardware reset signal. The default setting is ON. Change this to OFF as necessary.
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5. FUNCTIONAL DESCRIPTION

5.7. External Memory Control Signal Monitor Connector (CN9)

(7) in Figure 5.1
The 12-pin connector (CN9) on this board is for monitoring control signals for external memory mounted on this evaluation board. The following Table lists the pin assignments.
Pin Number Function Pin Number Function
1 MCS0# 2 MDQML
3 MCS1# 4 MDQMH
5 MCS2# 6 MCAS#
7 MOE# 8 MRAS#
9 MWE0# 10 MCLKEN
11 MWE1# 12 MCLK

5.8. External Memory Expansion SOLDER_JP (JP1-JP3)

(8) to (10) in Figure 5.2
This evaluation board has JP2 and JP3 soldered together because it ships with 4 MB of Flash ROM in the external memory space. JP1 permits expansion to 8 MB. The default JP1 is no connection.
Connection
Source
Connection
Target
Function
JP1 GPIOB6 MA22 GPIOB6 functions as MA22
JP2 GPIOD1 MA21 GPIOD1 functions as MA21
JP3 GPIOD0 MA20 GPIOD0 functions as MA20
Note: The firmware must configure the S1S65010 pins GPIOD0, GPIOD1, and GPIOB6 to match.

5.9. CF Card Interface SOLDER_JP (JP6, JP7)

(11) to (12) in Figure 5.2
The JP6 and JP7 SOLDER_JP on this board control the connectio n of pull-up and pull-down resistances to t his evaluation board’s CF card interface BVD2/DASP signal.
Connection
Source
JP6 BVD2/DASP Pull_Up Forces logic level “1” input for BVD2/DASP
JP7 BVD2/DASP Pull_Down Forces logic level “0” input for BVD2/DASP
Connection
Target
Function
S1S65010 Evaluation Board Technical Manual (Rev. 1.1e)
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6. SPECIFICATIONS

6. SPECIFICATIONS

6.1. Power Supplies

The main board uses three regulators to generate internal 3.3 V, 2.7 V, 1.8 V power supplies from the 5 V ± 10% power supply connected to CN10. The following Table lists their applications.
Table 6.1. Main Board Power Supplies
Location Part No. Application Notes
3.3 V U15 UPC2933T S1S65010 I/O circuits and other chips on board
2.7 V U17 MM1572H S1S65010 camera interface
1.8 V U16 LT1962EMS8-1.8 S1S65010 core and analog PLL
The developer must match the parts used to camera module used.
The camera board uses three regulators to generate internal power supplies for the three camera modules supported from the 5 V ±10% power supply connected to CN3 pins 1 and 2. The following Table lists their applications.
Table 6.2. Camera Board Power Supplies
Location Part No. Application Notes
2.9 V U6 MM1572KN
1.8 V U7 LT1962EMS8-1.8
2.5 V U5 MM1572FN OmniVision OV7640 EAA or OV7648 EAA
2.8 V U6 MM1572JN Hynix HV7131GP (HYCA3-L01)
Fuji Film Microdevices SA2101A
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6. SPECIFICATIONS

6.2. Current Consumption

TBD
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6. SPECIFICATIONS

6.3. Debugging Environment

The debugging interface (CN1) is for connecting PALMiCE or other debugger. Figure 6.1 shows the results of connecting PALMiCE; Figure 6.2, a PALMiCE system controller register readout.
Figure 6.1
Figure 6.2
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Notes on Debuggers
This kit supports the following two debuggers.
Multi-ICE
PALMiCE
The debugging interface (CN1) on this evaluation board is com patible with b oth. The basic load m odule is webcam.axf (ELF format) generated with the armcc (ARM compiler ADS 1.2 [Build 805]).
Table 6.3. Debugger Connections
Debugger
Connections
Evaluation
Board
PC
Load
Module
Notes
Multi-ICE JTAG Parallel port *.axf Flash ROM updates not allowed.
PALMiCE JTAG USB *.ctx Convert with dw22ctx.
For further details on basic debugger setup, Flash ROM support, etc., refer to the debugger manual, the Flash ROM data sheets, and any updates on the manufacturers’ websites.
(1) Important Notes on Using Multi-ICE
Multi-ICE cannot be used to write to the load modules to the Flash ROM on this evaluation board (Toshiba TC58FV5B2AFX65) because it supports only the following types of Flash ROM. Note that PALMiCE does not have this restriction.
Table 6.4. Flash ROM Update Support
Debugger
Sector
Format
Capacity Sample Supported Devices
128K × 32 4M DT28F320 (Intel)
Multi-ICE
256 × 2048 512K AT29C040A (ATMEL)
256 × 512 128K AT29C1024 (ATMEL)
PALMiCE Configurable Configurable Configure to match device
The Compact Flash interface (CFI) supports Intel and Fujitsu Flash ROMs. Using Multi-ICE to download to ATMEL Flash ROMs requires ch anging downloaders. In its sta ndard configuration, this debugger supports only the Intel DT28F320 and equivalents. Using Multi-ICE to debug code executed from ROM (as in this kit) requires at least one watch point unit available. Use the following procedure to modify the standard AXD settings.
(1) Boot the Multi-ICE server. (2) Boot the AXD. (3) Choose the AXD menu command “Options”|“Configure Processor” to open the configuration
panel. (4) Deselect all Vector catch check boxes. (5) Deselect the Semihosting check box. (6) Press the “OK” button to apply the new settings. Failure to modify the above settings causes writing the load module to abort with the following
message.
Error: Too many breakpoints
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6. SPECIFICATIONS
(2) Important Notes on Using PALMiCE
Use the following procedure to set up the evaluation board and PALMiCE. (1) Boot the newest version of CSIDE and specify ARM720T Rev.4 as the CPU core. (2) Choose the menu command “Target System Settings” and specify 5 MHz as the JTAG clock.
(3) Choose the menu command “Target System Settings|Initial Settings” and specify the m acro
file. (4) Under “Initial Settings”, specify 3500 ms as the interval to wait after leaving the reset state. (5) Under “Initial Settings”, select the “Use low-speed clock” check box and then specify 5 MHz. (6) Under “Initial Settings”, select “Port access method” and specify the judging criteria. (7) Specify Toshiba TC58FV5B2AFX65 for the Flash memory.
Note that changing the CPU core specification requires loading the PALMiCE program directly. Double-clicking on the parameter file cside.cpf provides no menu command for doing so. The following shows the screen for specifying the JTAG clock speed.
(See Figure 6.3)
Figure 6.3. Specifying 5 MHz for JTAG Clock
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The following shows the dialog box for specifying the macro file and wait interval.
Figure 6.4. Initial Settings Tab
The following shows the dialog box for specifying the low-speed clock and port access method.
S1S65010 Evaluation Board Technical Manual (Rev. 1.1e)
Figure 6.5. Low-Speed Clock Settings
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6. SPECIFICATIONS
Macro files contain the following types of commands.
SelectJtagClock(0) // Set JTAG clock frequency to 2 kHz Outport(3,0xFFFFD014,0x000000FF) Outport(3,0xFFFFD00C,0x00000001) // Access I/O port Outport(3,0xFFFFD018,0x00000001) // boost clock from 32 kHz to 52 MHz SelectJtagClock(5) // Set JTAG clock frequency to 5 kHz Outport(3,0xFFFF101C,0x00000005) // Initialize GPIOD0/1 as MA20/21
After the above steps, the code in the Flash ROM turns on th e PLL and starts operation with a CPU clock frequency of 50 MHz. If necessary, use the menu command “Add Flash memory” to add the a bove Flash memory to the list. The following shows the dialog box for adding Flash memory.
Figure 6.6. Initializing Evaluation Board Settings
Figure 6.7. Adding Flash Memory
Serial Debugging
Debugging is also possible over a serial cable connected to the serial port (CN16). Set the terminal emulator's baud rate to 9600. Figures 6.8 and 6.9 respectively show the serial port configuration dialog box and sample console output for Tera Term; Figures 6.10 and 6.11, the same for HyperTerminal.
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6. SPECIFICATIONS
Figure 6.8. Specifying Baud Rate (Tera Term)
S1S65010 Evaluation Board Technical Manual (Rev. 1.1e)
Figure 6.9. Using Tera Term
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6. SPECIFICATIONS
Figure 6.10. Specifying Baud Rate (HyperTerminal)
Figure 6.11. Using Hy perTerminal
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6. SPECIFICATIONS
<LAN debugging>
Debugging of the reference code is a lso possible over a L AN cable connected t o a PC. Not e, however, that a direct connection to a PC requires a cross cable.
The following is the procedure.
1. Connect the two boards (main and camera).
2. Connect the power supply to the power supply connector.
3. Turn on the green power supply LED on the board to light.
4. Connect the kit to the PC with an Ethernet cross cable or to a hub with a straight cable.
5. Change the PC’s IP address to match the target. This evaluation board set the default IP address 192.168.1.253, so make sure that there are no
duplications of IP addresses.
We recommend the following Japanese free software for changing the PC’s IP address.
Win95 Series: KemaNet
http://www.vector.co.jp/soft/win95/net/se060975.html
Win2K Series: valhell IP config http://www.vector.co.jp/soft/winnt/net/se132582.html
6. Test the cable connection and IP address setting with the following console command.
ping 192.168.1.253
If everything is functioning correctly, there should be a response similar to the following.
-----------------------------------------------­ Pinging 192.168.1.253 with 32 bytes of data:
Reply from 192.168.1.253: bytes=32 time<10ms TTL=128 Reply from 192.168.1.253: bytes=32 time<10ms TTL=128 Reply from 192.168.1.253: bytes=32 time<10ms TTL=128 Reply from 192.168.1.253: bytes=32 time<10ms TTL=128
Ping statistics for 192.168.1.253: Packets: Sent = 4, Received = 4, Lost = 0 (0% loss), Approximate round trip times in milli-seconds: Minimum = 0ms, Maximum = 0ms, Average = 0ms
------------------------------------------------
7. Boot the PC’s Web browser (Internet Explorer, Netscape, etc.) If the Java plug-in has not been installed, download it from the following URL.
http://java.sun.com/getjava/ja/install-windows.html
8. Access the following address with the Web browser.
http://192.168.1.253/
9. Click on “Continuous image” on the menu screen that appears.
10. Input the user name and password, then star t capturing/monitori ng. This board shi ps with only on e user and the following default password.
User name: root
password:
S1S65010 Evaluation Board Technical Manual (Rev. 1.1e)
administrator
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7. IMPORTANT USAGE NOTES

7. IMPORTANT USAGE NOTES
(1) This kit does not support hot-plugging of CF cards. The CF card must be in place when the power
is first applied. The firmware assumes that it is always in place.
              
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8. PARTS LISTS

8. PARTS LISTS

8.1. Main Board Parts

The following Table lists the major parts on the main board—that is, all parts except resistors and capacitors.
Table 8.1. Main Board Parts
Unit
PART NO. PART NAME STANDARD Q'TY
PCB K-624-01 MINICOM 1 U4 NETCAM CHIP S1S65010 (144pinQFP) EPSON 1 U6 FROM TC58FVM5B2AFT65(48pinTSOP) Toshiba 1 U8 SRAM TC55VBM416AFTN (48pinTSOP) Toshiba 1
5 U9 SDRAM MT48LC8M16A2TG-75 (54pinTSOP) MICRON 1 U12 10/100 PHYSICAL ICS1893BF (48pinTSOP) ICS 1 U1 SERIAL ROM BR24L16RFVM-W (MSOP8) Rohm 1 U3 Reset IC PST600K (2.5V MMP3A) Mitsumi 1 U13 Bus driver TC74VCX16245FT (48pinTTSOP) Toshiba 1 10 U15 Regulator uPC2933T (3.3V) NEC 1 U16 LT1962EMS8-1.8 (MS8) Linear Technology 1 U17 MM1572H(2.7V 5pin SOT-25A) Mitsumi 1 U18 RS232C driver SP3232ECY (16pinTSSOP) SIPEX 1 U2 Logic IC TC7W14F Toshiba 1 15 U5 TC74VCX157FT Toshiba 1 U10 TC7MH574FK Toshiba 1 U11 TC4S71F Toshiba 1 U14 TC4S30F Toshiba 1
20 X1 OSC SG-3030JF(32.768KHz) EPSON 1 X2 OSC
T1 Puls transformer TG110-LC55N2 HALO 1 CN7 RJ45 connector TM11R-5M2-88-LP Hirose 1 CN10 Power supply connector MJ-179P Marushin Musen 1 25 CN2,CN3,CN4,CN5 Pin header HW-2P-G Mac Eight 4 CN6 HWW-4PW-G (No positioning pin) Mac Eight 1 CN9 HWW-6PW-G (No positioning pin) Mac eight 1 CN13 XG8W-1031 OMRON 1 CN11 XG8W-1631 OMRON 1 30 CN1 XG8W-2031 OMRON 1 CN12 XG8W-4031 OMRON 1 CN11 CF card connector MI21A-50PD-SF Hirose 1 SW1 Tactile switch B3FS-1000 OMRON 1 SW2,SW3,SW6 DIP switches CHS-08B COPAL 2 35 CHS-06B COPAL 1 CHS-01A1 COPAL 4 CS-4-22YA COPAL 2 Created DWG.G 2004.6.16 Approved by APP CHK DWG
Corrections
SG-645SCG (25MH)
EPSON 1
price
PARTS LIST
NOTES
S1S65010 Evaluation Board Technical Manual (Rev. 1.1e)
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8. PARTS LISTS

8.2. Camera Board Parts

The following Table lists the major parts on the camera board—t hat is, all parts except resistors and capacitors.
Table 8.2. Camera Board Parts
PART NO.
Bare board K-625-01 MINICOM 1
U1 IC U2 TC74VHC05FT Toshiba 1
U4 TC4S30F Toshiba 1
U8 U3 MM1572FN(2.5V 5pin SOT-25A) Mitsumi 1 U5 MM1572JN(2.8V 5pin SOT-25A) Mitsumi 1 U6 MM1572KN(2.9V 5pin SOT-25A) Mitsumi 1
U7
U9
SW2, SW1 Switch CHS-01A1 Copal 2 SW3, SW5 CHS-08B Copal 2 SW4 CHS-02B Copal 1
CN1 Connector HIF3H-40DB-2.54DS Hirose 1 CN3 HIF3H-16DB-2.54DS Hirose 1 CN6 XG8W-1031 OMRON 1 CN4 803-93-032-10-001 Presidip 1 CN5 A3-44DA-2DS Hirose 1 CN2 245602-020-000-829 Kyosera 1 CN7, CN8, CN9, CN10 Mini jack A2PA-3PGG Sengoku Densho 4 FL1 Filter BNX002-01 Murata 1 LED1, LED2, LED3, LED4,
LED5, LED6, LED7, LED8 LED PG1101W(Green) Stanley 8 X1 OSC SG-645SCG(12.288MHz) EPSON 1 R24 Chip resistor RK73Z1JTD0(0) KOA 1
created DWG.G 2004.7.1 Approved by APP CHK DWG
Corrections
PART
NAME
STANDARD Q'TY
TC7W14F(SOP8-P1.27)
SP3232ECY(16pinTSSOP)
LT1962EMS8-1.8(MS8) AK4536VN(28pinQFN)
Toshiba 1
SIPEX 1
Linear Technology 1
Akai 1
Unit
price
NOTES
PARTSLIST
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9. MISCELLANEOUS

9. MISCELLANEOUS

The following Figure shows this kit with a camera module.
Figure9.1.Camera Board with OV7640 Module
 
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9. MISCELLANEOUS
   
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AMERICA
EPSON ELECTRONICS AMERICA, INC. HEADQUARTERS
150 River Oaks Parkway San Jose, CA 95134, U.S.A. Phone: +1-800-228-3964 FAX: +1-408-922-0238
SALES OFFICES West
1960 E.Grand Avenue Flr 2 El Segundo, CA 90245, U.S.A. Phone: +1-800-249-7730 FAX: +1-310-955-5400
Central
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Northeast
301 Edgewater Place, Suite 210 Wakefield, MA 01880, U.S.A. Phone: +1-800-922-7667 FAX: +1-781-246-5443
Southeast
3010 Royal Blvd. South, Suite 170 Alpharetta, GA 30005, U.S.A. Phone: +1-877-332-0020 FAX: +1-770-777-2637
EUROPE
EPSON EUROPE ELECTRONICS GmbH HEADQUARTERS
Riesstrasse 15 80992 Munich, GERMANY Phone: +49-89-14005-0 FAX: +49-89-14005-110
DÜSSELDORF BRANCH OFFICE
Altstadtstrasse 176 51379 Leverkusen, GERMANY Phone: +49-2171-5045-0 FAX: +49-2171-5045-10
FRENCH BRANCH OFFICE
1 Avenue de l Atlantique, LP 915 Les Conquerants Z.A. de Courtaboeuf 2, F-91976 Les Ulis Cedex, FRANCE Phone: +33-1-64862350 FAX: +33-1-64862355
BARCELONA BRANCH OFFICE Barcelona Design Center
Edificio Testa, C/Alcalde Barnils 64-68, Modulo C 2a planta E-08190 Sant Cugat del Vallès, SPAIN Phone: +34-93-544-2490 FAX: +34-93-544-2491
UK & IRELAND BRANCH OFFICE
8 The Square, Stockley Park, Uxbridge Middx UB11 1FW, UNITED KINGDOM Phone: +44-1295-750-216/+44-1342-824451 FAX: +44-89-14005 446/447
Scotland Design Center
Integration House, The Alba Campus Livingston West Lothian, EH54 7EG, SCOTLAND Phone: +44-1506-605040 FAX: +44-1506-605041
International Sales Operations
ASIA
EPSON (CHINA) CO., LTD.
23F, Beijing Silver Tower 2# North RD DongSanHuan ChaoYang District, Beijing, CHINA Phone: +86-10-6410-6655 FAX: +86-10-6410-7320
SHANGHAI BRANCH
7F, High-Tech Bldg., 900, Yishan Road, Shanghai 200233, CHINA Phone: +86-21-5423-5522 FAX: +86-21-5423-5512
EPSON HONG KONG LTD.
20/F., Harbour Centre, 25 Harbour Road Wanchai, Hong Kong Phone: +852-2585-4600 FAX: +852-2827-4346 Telex: 65542 EPSCO HX
EPSON TAIWAN TECHNOLOGY & TRADING LTD.
14F, No. 7, Song Ren Road, Taipei 110 Phone: +886-2-8786-6688 FAX: +886-2-8786-6677
HSINCHU OFFICE
No. 99, Jiangong Road, Hsinchu City 300 Phone: +886-3-573-9900 FAX: +886-3-573-9169
EPSON SINGAPORE PTE., LTD.
401 Commonwealth Drive, #07-01 Haw Par Technocentre, SINGAPORE 149598 Phone: +65-6586-3100 FAX: +65-6472-4291
SEIKO EPSON CORPORATION KOREA OFFICE
50F, KLI 63 Bldg., 60 Yoido-dong Youngdeungpo-Ku, Seoul, 150-763, KOREA Phone: +82-2-784-6027 FAX: +82-2-767-3677
GUMI OFFICE
6F, Good Morning Securities Bldg., 56 Songjeong-Dong, Gumi-City, Seoul, 730-090, KOREA Phone: +82-54-454-6027 FAX: +82-54-454-6093
- JAPAN -
SEIKO EPSON CORPORATION SEMICONDUCTOR OPERATIONS DIVISION
IC Sales Dept. IC International Sales Group
421-8, Hino, Hino-shi, Tokyo 191-8501, JAPAN Phone: +81-42-587-5814 FAX: +81-42-587-5117
Page 39
In pursuit of Saving Technology, Epson electronic devices.
Our lineup of semiconductors, displays and quartz devices
assists in creating the products of our customers dreams.
Epson IS energy savings.
Page 40
S1S65010
Evaluation Board Technical Manual
SEIKO EPSON CORPORATION
SEMICONDUCTOR OPERATIONS DIVISION
EPSON Electronic Devices Website
http://www.epsondevice.com/
Document code: 410080300
First issue February, 2005
Printed in Japan
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