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2002 All rights reserved.
S1C33210 Technical Manual
This manual describes the hardware specifications of the Seiko Epson original 32-bit microcomputer S1C33210.
S1C33210 PRODUCT PART
Describes the hardware specifications of the S1C33210 except for details of the peripheral circuits.
S1C33210 FUNCTION PART
Describes details of all the peripheral circuit blocks for the S1C33 Family microcomputers.
R e f e r t o t he " S 1C 33 000 C or e C P U M a nua l " f or de t a i l s of t he S 1C 330 00 32- bi t R I S C C P U .
New configuration of product number
Starting April 1, 2001, the configuration of product number descriptions will be changed as listed
below. To order from April 1, 2001 please use these product numbers. For further information, please
contact Epson sales representative.
Devices
S1
C33104F0A01
Development tools
S5U1
C33L01D11
00
Packing specification
Specification
Package (D: die form; F: QFP)
Model number
Model name (C: microcomputer, digital products)
Product classification (S1: semiconductor)
00
Packing specification
Version (1: Version 1)
Tool type (D1: Development Tool)
Corresponding model number (33L01: for S1C33L01)
Tool classification (C: microcomputer use)
Product classification
(S5U1: development tool for semiconductor products)
1. 2 Bl o c k D iag r a m ...................................................................................................................................................A-3
1. 3 . 2 P i n F u nct i o n s ...................................................................................................................................A-5
2 Power Supply ........................................................................................................ A-11
2.1 Power Supply Pins.........................................................................................................................................A-11
3.1 ROM and Boot Address...............................................................................................................................A-13
4.1 List of Peripheral Circuits............................................................................................................................A-14
5 Po we r -D o w n C o n tr o l.............................................................................................A-62
6 Ba si c E xt er na l Wi ri ng Diagr am..............................................................................A-65
7 Precautions on Mounting......................................................................................A-66
8 El ec t r i c a l C h a r a c t e r i s t i c s......................................................................................A-6 8
8.1 Absolute Maximum Rating..........................................................................................................................A-68
8.3 DC Characteristics..........................................................................................................................................A-70
8.4 Current Consumption....................................................................................................................................A-71
8.6 AC Characteristics..........................................................................................................................................A-74
8.6.1 Symbol Description.....................................................................................................................A-74
8.6.2 AC Characteristics Measurement Condition......................................................................A-74
8.6.3 C3 3 Block AC Characteristic Tables....................................................................................A-75
8.6.4 C33 Block AC Characteristic Timing Charts.......................................................................A-78
10 Pad Layout............................................................................................................A-88
10.1 Pad Layout Diagram.....................................................................................................................................A-88
10.2 Pad Co ordinate ...............................................................................................................................................A-89
EPSONi
TABLE OF CONTENTS
Appendix A <Reference> External Device Interface Timings......................................A-92
A.1 DRAM (70ns)....................................................................................................................................................A-93
A.2 DRAM (60ns)....................................................................................................................................................A-96
A.3 ROM and Burst ROM.................................................................................................................................A-100
I-3 LIST O F PINS................................................................................................... B-I-3-1
List of External I/O Pins.....................................................................................................................................B-I-3-1
HALT Mode............................................................................................................................................B-II-2-2
Notes on Standby Mode...................................................................................................................B-II-2-3
Test Mode.............................................................................................................................................................B-II-2-3
Pins for Initial Reset...........................................................................................................................................B-II-3-1
Cold Start and Hot Start..................................................................................................................................B-II-3-1
Notes Related to Initial Reset........................................................................................................................B-II-3-3
II-4 BCU (BUS CONTROL UNIT) ............................................................................B-II-4-1
Pin Assignment for External System Interface.......................................................................................B-II-4-1
I/ O P i n L i s t ..............................................................................................................................................B-II-4-1
Combination of System Bus Control Signals............................................................................B-II-4-3
External Memory Map and Chip Enable .....................................................................................B-II-4-5
Using Internal Memory on External Memory Area..................................................................B-II-4-7
Exclusive Signals for Areas .............................................................................................................B-II-4-7
Ar e a 1 0 ....................................................................................................................................................B-II-4-8
Ar e a 3 ......................................................................................................................................................B-II-4-8
Setting External Bus Conditions...................................................................................................................B-II-4-9
Setting Device Type and Size ........................................................................................................B-II-4-9
Setting Timing Conditions of Burst ROM ..................................................................................B-II-4-11
Bus Operation....................................................................................................................................................B-II-4-12
Data Arrangement in Memory.......................................................................................................B-II-4-12
Bus Operation of External Memory.............................................................................................B-II-4-12
Bus Clock.............................................................................................................................................................B-II-4-16
EPSONiii
TABLE OF CONTENTS
Bus Speed Mode ...............................................................................................................................B-II-4-17
Bus Clock Output...............................................................................................................................B-II-4-17
Bus Cycles in External System Interface................................................................................................B-II-4-18
Bus Timing............................................................................................................................................B-II-4-19
Burst ROM Read Cycles .................................................................................................................B-II-4-22
DRAM Direct Interface....................................................................................................................................B-II-4-23
Outline of DRAM Interface .............................................................................................................B-II-4-23
DRAM Setting Conditions...............................................................................................................B-II-4-24
DRAM Read/Write Cycles...............................................................................................................B-II-4-27
DRAM Refresh Cycles.....................................................................................................................B-II-4-30
Re l e a s ing E x t ern a l Bus .................................................................................................................................B-II-4-31
Power-down Control by External Device ................................................................................................B-II-4-32
I/O Memory of BCU.........................................................................................................................................B-II-4-33
Outline of Interrupt Functions.........................................................................................................................B-II-5-1
Control of Maskable Interrupts......................................................................................................................B-II-5-5
Structure of the Interrupt Controller...............................................................................................B-II-5-5
Processor Status Register (PSR)...................................................................................................B-II-5-5
Interrupt Factor Flag and Interrupt Enable Register...............................................................B-II-5-6
Interrupt Priority Register and Interrupt Levels.........................................................................B-II-5-8
Configuration of Clock Generator.................................................................................................................B-II-6-1
I/O Pins of Clock Generator...........................................................................................................................B-II-6-2
Operation in Standby Mode...........................................................................................................................B-II-6-5
I/O Memory of Clock Generator....................................................................................................................B-II-6-6
I/O Pins of Debug Circuit.................................................................................................................................B-II-7-1
Configuration of Prescaler..............................................................................................................................B-III-2-1
Selecting Division Ratio and Output Control for Prescaler...............................................................B-III-2-2
Source Clock Output to 8-Bit Programmable Timer.............................................................................B-III-2-2
I/O Memory of Prescaler.................................................................................................................................B-III-2-3
Configuration of 8-Bit Programmable Timer............................................................................................B-III-3-1
Output Pins of 8-Bit Programmable Timers.............................................................................................B-III-3-1
Uses of 8-Bit Programmable Timers...........................................................................................................B-III-3-2
Control and Operation of 8-Bit Programmable Timer ..........................................................................B-III-3-4
Co n t r o l o f Clo c k Ou tpu t ...................................................................................................................................B-III-3-7
8-Bit Programmable Timer Interrupts and DMA.....................................................................................B-III-3-8
I/O Memory of 8-Bit Programmable Timers...........................................................................................B-III-3-10
Configuration of 16-Bit Programmable Timer..........................................................................................B-III-4-1
I/O Pins of 16-Bit Programmable Timers..................................................................................................B-III-4-2
Uses of 16-Bit Programmable Timers........................................................................................................B-III-4-3
Control and Operation of 16-Bit Programmable Timer........................................................................B-III-4-4
Co n t r o lli n g C loc k Ou tpu t .................................................................................................................................B-III-4-7
16-Bit Programmable Timer Interrupts and DMA..................................................................................B-III-4-9
I/O Memory of 16-Bit Programmable Timers.........................................................................................B-III-4-12
Configuration of Watchdog Timer................................................................................................................B-III-5-1
Control of Watchdog Timer............................................................................................................................B-III-5-1
Operation in Standby Modes........................................................................................................................B-III-5-2
I/O Memory of Watchdog Timer...................................................................................................................B-III-5-3
Operation in Standby Mode..........................................................................................................................B-III-6-4
OSC1 Clock Output to External Devices..................................................................................................B-III-6-4
I/O Memory of Clock Generator...................................................................................................................B-III-6-5
Configuration of Clock Timer.........................................................................................................................B-III-7-1
Control and Operation of the Clock Timer...............................................................................................B-III-7-2
Examples of Use of Clock Timer.................................................................................................................B-III-7-6
I/O Memory of Clock Timer............................................................................................................................B-III-7-7
III-8 SERIAL INTERFACE......................................................................................B-III-8-1
Configuration of Serial Interfaces ................................................................................................................B-III-8-1
Features of Serial Interfaces...........................................................................................................B-III-8-1
I/ O P i n s of Se r i al Int e r f a c e .............................................................................................................................B-III-8-2
Setting Transfer Mode ......................................................................................................................B-III-8-3
Outline of IrDA Interface.................................................................................................................B-III-8-21
Se t t i n g Ir D A In t e r f a c e......................................................................................................................B-III-8-21
Control and Operation of IrDA Interface...................................................................................B-III-8-23
Serial Interface Interrupts and DMA.........................................................................................................B-III-8-24
I/O Memory of Serial Interface....................................................................................................................B-III-8-28
Structure of Input Port.......................................................................................................................B-III-9-1
Notes on Use........................................................................................................................................B-III-9-2
I/O Memory of Input Ports...............................................................................................................B-III-9-3
Structure of I/O Port...........................................................................................................................B-III-9-4
I/ O P o r t Pi n s .........................................................................................................................................B-III-9-4
I/O Control Register and I/O Modes............................................................................................B-III-9-5
I/O Memory of I/O Ports...................................................................................................................B-III-9-6
Port Input Interrupt ...........................................................................................................................B-III-9-11
III-10 Mobile Access Interfaces ............................................................................B-III-10-1
Configuration of Mobile Access Interfaces............................................................................................B-III-10-1
I/ O P i n s fo r M o b i l e Ac c e s s I n t e r f a c e s.......................................................................................B - I II-10-2
Basic Settings for Mobile Access Interfaces..........................................................................B-III-10-4
Functional Outline of HSDMA........................................................................................................................B-V-2-1
I/O Pins of HSDMA ............................................................................................................................................B-V-2-2
Programming Control Information................................................................................................................B-V-2-3
Setting the Registers in Dual-Address Mode ............................................................................B-V-2-3
Setting the Registers in Single-Address Mode ........................................................................B-V-2-6
Operation of HSDMA.........................................................................................................................................B-V-2-9
Operation in Dual-Address Mode ..................................................................................................B-V-2-9
Operation in Single-Address Mode............................................................................................B-V-2-12
Interrupt Function of HSDMA......................................................................................................................B-V-2-15
I/O Memory of HSDMA..................................................................................................................................B-V-2-17
Functional Outline of IDMA.............................................................................................................................B-V-3-1
Programming Control Information................................................................................................................B-V-3-1
Operation of IDMA..............................................................................................................................................B-V-3-8
The S1C33210 is a Seiko Epson original 32-bit microcomputer. It features high speed, low power consumption,
and low-voltage operation, and is ideal for portable products that require high-speed data processing.
The S1C33210 consists of an S1C33000 32-bit RISC type CPU as its core, peripheral circuits including a bus control
unit, DMA controller, interrupt controller, timers, serial interface, and A/D converter, and also mobile access
interface and RAM. A high-speed oscillation circuit and PLL, and a low-speed clock input circuit, are also included,
supporting advanced operation, power-saving operation, and high-speed realtime clock functions. Use of the internal
MAC (multiplication and accumulation) function in combination with the A/D converter also facilitates the design of
systems requiring DSP functions, such as speech recognition and synthesis applications.
Table 1.1 shows the various models. The package and data bus interface vary according to the model.
Table 1.1 Model Lineup
PackageInternal RAMInternal ROMData bus I/F
QFP15-128pin8K bytesNoneCMOS/LVTTL
Notes: • The end of the S1C33210 subcode is not related to model identification.
1.1 Features
Core CPU
Seiko Epson original 32-bit RISC CPU S1C33000 built-in
Operating temperature:-40 to 85°C
Power consumption:During SLEEP4 µW typ.
During HALT122 mW typ.
(3.3 V, 50 MHz)
During execution238 mW typ.
(3.3 V, 50 MHz)
Supply form
QFP15-128 pin plastic package.
Note: • The values of power consumption during execution were measured when a test
program that consisted of 55% load instructions, 23% arithmetic operation
instructions, 1% mac instruction, 12% branch instructions and 9% ext
instruction was being continuously executed.
SIN3
CNT199O–Mobile access control output #1
CNT298O–Mobile access control output #2
MSEL109IPull-up Serial I/O interface Ch. 3 configuration input. Normally drive this at High level.
GOUT110O–NMI interrupt request output
100O–TXD:TXD output*1 when MSEL pin input is at High level
SOUT3:SOUT3 output when MSEL pin input is at Low level
107I–RXD:RXD input when MSEL pin input is at High level
SIN3:SIN3 input when MSEL pin input is at Low level
Note: *1 The communications macro select (MCRS) register (D[1:0]/0x200000) configures the I/O
The core CPU, internal peripheral circuits, and external signal interfaces operate on the voltage difference between
the V
DD and VSS pins. The following operating voltage can be used:
DD = 2.7 V to 3.6 V (VSS = GND)
V
Note: The S1C33210 has 6 V
pins. Do not open any of them.
The operating clock frequency range (OSC3) is 5 MHz to 50 MHz with this voltage.
DD pins and 8 VSS pins. Be sure to supply the operating voltage to all the
S1C33210 PRODUCT PARTEPSONA-11
2 POWER SUPPLY
2.3 Power Supply for Analog Circuits (AVDD)
The analog power supply pin (AVDD) is provided separately from the V DD and VDD pins in order that the digital
circuits do not affect the analog circuit (A/D converter). The AV
the V
SS pin is used as the analog ground.
Supply the same voltage level as the V
DD = V DD, V SS = GND
AV
Note: Be sure to supply V
DD to the AVDD pin even if the analog circuit is not used.
DD to the AVDD pin.
Noise on the analog power lines decrease the A/D converting precision, so use a stabilized power supply and make
the board pattern with consideration given to that.
DD pin is used to supply an analog power voltage and
A-12EPSONS1C33210 PRODUCT PART
3 INTERNAL MEMORY
3 Internal Memory
This chapter explains the internal memory configuration.
Figure 3.1 shows the S1C33210 memory map.
AreaAddress
Areas 18–11
Area 10
Areas 9
Area 6
Area 5
Area 40x01FFFFF
Area 3
Area 2
Area 1
Area 0
–7
0xFFFFFFF
0x1000000
0x0FFFFFF
0x0C00000
0x0BFFFFF
0x0400000
0x03FFFFF
0x0380000
0x037FFFF
0x0300000
0x02FFFFF
0x0200000
0x0100000
0x00FFFFF
0x0080000
0x007FFFF
0x0060000
0x005FFFF
0x0050000
0x004FFFF
0x0040000
0x003FFFF
0x0030000
0x002FFFF
0x0002000
0x0001FFF
0x0000000
Figure 3.1 Memory Map
Area 2 is used in debug mode only and it cannot be accessed in user mode (normal program execution status).
S1C33210
External Memory
External Memory
External Memory
External I/O (16-bit device)
External I/O (8-bit device)
Internal peripheral circuits
External Memory
(Reserved)
For middleware use
(Reserved)
For CPU, debug mode
(Mirror of internal
peripheral circuits)
Internal peripheral circuits
(Mirror of internal
peripheral circuits)
(Mirror of internal RAM)
Internal RAM (8KB)
3.1 ROM and Boot Address
The S1C33210 does not have a built-in ROM. The boot address is fixed at 0x0C00000, and so external ROM/Flash
should be used in Area 10.
For setting up Area 10, refer to the "BCU (Bus Controller Unit)" in "S1C33210 FUNCTION PART" in this manual.
3.2 RAM
The S1C33210 has a built-in 8KB RAM. The RAM is allocated to Area 0, address 0x0000000 to address
0x0001FFF.
The internal RAM is a 32-bit sized device and data can be read/written in 1 cycle regardless of data size (byte, halfword or word).
S1C33210 PRODUCT PARTEPSONA-13
4 PERIPHERAL CIRCUITS
4 Peripheral Circuits
This chapter lists the built-in peripheral circuits and the I/O memory map. For details of the circuits, refer to the
"S1C33210 FUNCTION PART".
4.1 List of Peripheral Circuits
The S1C33210 consists of the C33 Core Block, C33 Peripheral Block, C33 DMA Block and C33 Analog Block.
C33 Core Block
CPUS1C33000 32-bit RISC type CPU
BCU (Bus Control Unit)24-bit external address bus and 16-bit data bus
All the BCU functions can be used.
ITC (Interrupt Controller)39 types of interrupts are available.
CLG (Clock Generator)OSC3 oscillation circuit (33 MHz Max.), PLL and OSC1 oscillation circuit
(32.768 kHz Typ.) built-in
DBG (Debug Unit)Functional block for debugging with the S5U1C33000H (In-Circuit Debugger
for S1C33 Family)
C33 Peripheral Block
PrescalerProgrammable clock generator for peripheral circuits
8-bit programmable timer6 channels with clock output function
16-bit programmable timer6 channels with event counter, clock output and watchdog timer functions
Serial interface4 channels (asynchronous mode, clock synchronous mode and IrDA are
selectable. Interfaces 1 and 3 support only asynchronous operation.)
Input and I/O ports7 bits of input ports and 27 bits of I/O ports (used for peripheral I/O)
Clock timer1 channel with alarm function
Mobile access interfacesOne PHS, PDC, and HDLC interface each
C33 DMA Block
HSDMA (High-Speed DMA) 4 channels (Only two interfaces support external requests.)
IDMA (Intelligent DMA)128 channels
C33 Analog Block
A/D converter10-bit A/D converter with 4 input channels
8-bit timer 5 can
generate the clock for
the serial I/F Ch.3.
0
R/W
θ: selected by
0
R/W
Prescaler clock select
0
R/W
register (0x40181)
0
R/W
8-bit timer 4 can
generate the clock for
the serial I/F Ch.2.
–
–
0 when being read.
0
R/W
θ: selected by
0
R/W
Prescaler clock select
0
R/W
register (0x40181)
0
R/W
–
–
0 when being read.
0
R/W
θ: selected by
0
R/W
Prescaler clock select
0
register (0x40181)
0
16-bit timer 0 can be
used as a watchdog
timer.
–
–
0 when being read.
0
R/W
θ: selected by
0
R/W
Prescaler clock select
0
register (0x40181)
0
–
–
0 when being read.
0
R/W
θ: selected by
0
R/W
Prescaler clock select
0
register (0x40181)
0
(B) in [Address] indicates an 8-bit register and (HW) indicates a 16-bit register.
The meaning of the symbols described in [Init.] are listed below:
0, 1: Initial values that are set at initial reset.
(However, the registers for the bus and input/output ports are not initialized at hot start.)
X:Not initialized at initial reset.
–:Not set in the circuit.
8-bit timer 3 clock control
8-bit timer 3
clock division ratio selection
8-bit timer 2 clock control
8-bit timer 2
clock division ratio selection
reserved
A/D converter clock control
A/D converter clock division ratio
selection
reserved
Clock timer reset
Clock timer Run/Stop control
Clock timer interrupt factor
selection
Clock timer alarm factor selection
Interrupt factor generation flag
Alarm factor generation flag
Clock timer data 1 Hz
Clock timer data 2 Hz
Clock timer data 4 Hz
Clock timer data 8 Hz
Clock timer data 16 Hz
Clock timer data 32 Hz
Clock timer data 64 Hz
Clock timer data 128 Hz
reserved
Clock timer second counter data
TCMD5 = MSB
TCMD0 = LSB
Prescaler On/Off control
reserved
CPU operating clock switch
High-speed (OSC3) oscillation On/Off
Low-speed (OSC1) oscillation On/Off
reserved
Prescaler clock selection
–
HALT clock option
OSC3-stabilize waiting function
reserved
OSC1 external output control
Power control register protect flag0
CLKDT[1:0]Division ratio
1
1
1
0
0
1
0
0
1 On0 Off
1 OSC30 OSC1
1 On0 Off
1 On0 Off
1 OSC10 OSC3/PLL
1/8
1/4
1/2
1/1
–
–Prescaler clock
–
1 On0 Off
1 Off0 On
–
1 On0 Off
Writing 10010110 (0x96)
removes the write protection of
the power control register
(0x40180) and the clock option
register (0x40190).
Writing another value set the
write protection.
Serial I/F Ch.0 transmit data
TXD07(06) = MSB
TXD00 = LSB
Serial I/F Ch.0 receive data
RXD07(06) = MSB
RXD00 = LSB
–
Ch.0 transmit-completion flag
Ch.0 flaming error flag
Ch.0 parity error flag
Ch.0 overrun error flag
Ch.0 transmit data buffer empty
Ch.0 receive data buffer full
Serial I/F Ch.1 transmit data
TXD17(16) = MSB
TXD10 = LSB
Serial I/F Ch.1 receive data
RXD17(16) = MSB
RXD10 = LSB
–
Ch.1 transmit-completion flag
Ch.1 flaming error flag
Ch.1 parity error flag
Ch.1 overrun error flag
Ch.1 transmit data buffer empty
Ch.1 receive data buffer full
Serial I/F Ch.2 transmit data
TXD27(26) = MSB
TXD20 = LSB
Serial I/F Ch.2 receive data
RXD27(26) = MSB
RXD20 = LSB
reserved
Ch.2 transmit-completion flag
Ch.2 flaming error flag
Ch.2 parity error flag
Ch.2 overrun error flag
Ch.2 transmit data buffer empty
Ch.2 receive data buffer full
0x0 to 0xFF(0x7F)TXD17
0x0 to 0xFF(0x7F)RXD17
1
Transmitting
1 Error0 Normal
1 Error0 Normal
1 Error0 Normal
1 Empty0 Buffer full
1 Buffer full0 Empty
–
0 End
1 Enabled0 Disabled
1 Enabled0 Disabled
1 With parity 0 No parity
1 Odd0 Even
1 2 bits0 1 bit
1 –0
Internal clock
SMD1[1:0] Transfer mode
111
8-bit asynchronous
0
7-bit asynchronous
1 1/80 1/16
1 Inverted0 Direct
1 Inverted0 Direct
IRMD1[1:0]–I/F mode
1
1
0
1
0
reserved
IrDA 1.0
reserved
General I/F
–
0 End
1
0
0
0x0 to 0xFF(0x7F)TXD27
0x0 to 0xFF(0x7F)RXD27
1
Transmitting
1 Error0 Normal
1 Error0 Normal
1 Error0 Normal
1 Empty0 Buffer full
1 Buffer full0 Empty
Serial I/F Ch.3 transmit data
TXD37(36) = MSB
TXD30 = LSB
Serial I/F Ch.3 receive data
RXD37(36) = MSB
RXD30 = LSB
reserved
Ch.3 transmit-completion flag
Ch.3 flaming error flag
Ch.3 parity error flag
Ch.3 overrun error flag
Ch.3 transmit data buffer empty
Ch.3 receive data buffer full
16-bit timer 0 comparison A
16-bit timer 0 comparison B
High-speed DMA Ch.1
High-speed DMA Ch.0
Port input 3
Port input 2
Port input 1
Port input 0
16-bit timer 4 comparison A
16-bit timer 4 comparison B
16-bit timer 3 comparison A
16-bit timer 3 comparison B
16-bit timer 2 comparison A
16-bit timer 2 comparison B
16-bit timer 1 comparison A
16-bit timer 1 comparison B
Port input 7
Port input 6
Port input 5
Port input 4
reserved
A/D converter
SIF Ch.1 transmit buffer empty
SIF Ch.1 receive buffer full
16-bit timer 0 comparison A
16-bit timer 0 comparison B
High-speed DMA Ch.1
High-speed DMA Ch.0
Port input 3
Port input 2
Port input 1
Port input 0
16-bit timer 4 comparison A
16-bit timer 4 comparison B
16-bit timer 3 comparison A
16-bit timer 3 comparison B
16-bit timer 2 comparison A
16-bit timer 2 comparison B
16-bit timer 1 comparison A
16-bit timer 1 comparison B
reserved
P16 I/O control
P15 I/O control
P14 I/O control
P13 I/O control
P12 I/O control
P11 I/O control
P10 I/O control
reserved
P32 function selection 2
1 Output0 Input
–P1 I/O control
––
1–0
P32/
–
0
0
0
0
0
0
0
0
–
0 when being read.00402D6
R/W
R/W
R/W
R/W
R/W
R/W
R/W
–
00402D7Port SIO
Always set to 0.
R/W
#DMAACK0
CFP152
P15 function selection 2
1–0
P15/EXCL4/
0
Always set to 0.
R/W
#DMAEND0
CFP162
P16 function selection 2
1–0
P16/EXCL5/
0
Always set to 0.
R/W
#DMAEND1
CFP332
P33 function selection 2
1–0
P33/
0
Always set to 0.
R/W
#DMAACK1
CFP27
CFP26
CFP25
CFP24
CFP23
CFP22
CFP21
CFP20
P27D
P26D
P25D
P24D
P23D
P22D
P21D
P20D
IOC27
IOC26
IOC25
IOC24
IOC23
IOC22
IOC21
IOC20
–
SSRDY2
SSCLK2
SSOUT2
SSIN2
–
CFP35
CFP34
P27 function selection
P26 function selection
P25 function selection
P24 function selection
P23 function selection
P22 function selection
P21 function selection
P20 function selection
P27 I/O port data
P26 I/O port data
P25 I/O port data
P24 I/O port data
P23 I/O port data
P22 I/O port data
P21 I/O port data
P20 I/O port data
P27 I/O control
P26 I/O control
P25 I/O control
P24 I/O control
P23 I/O control
P22 I/O control
P21 I/O control
P20 I/O control
reserved
Serial I/F Ch.2 SRDY selection
Serial I/F Ch.2 SCLK selection
Serial I/F Ch.2 SOUT selection
Serial I/F Ch.2 SIN selection
reserved
P35 function selection
P34 function selection
reserved
P05 port extended function
P04 port extended function
P31 port extended function
P21 port extended function
P10, P11, P13 port extended
function
P12, P14 port extended function
reserved
Areas 18–17 device size selection
Areas 18–17
output disable delay time
reserved
Areas 18–17 wait control
reserved
Areas 16–15 device size selection
Areas 16–15
output disable delay time
reserved
Areas 16–15 wait control
reserved
Area 14 DRAM selection
Area 13 DRAM selection
Areas 14–13 device size selection
Areas 14–13
output disable delay time
reserved
Areas 14–13 wait control
1
1
1
1 #GARD0 P31, etc.
1 #GAAS0 P21, etc.
1 DST0
DST1
DPC0
1 DST2
DCLK
1 8 bits0 16 bits
A18DF[1:0] Number of cycles
1
1
0
0
A18WT[2:0]Wait cycles
1
1
1
1
0
0
0
0
1 8 bits0 16 bits
A16DF[1:0] Number of cycles
1
1
0
0
A16WT[2:0]Wait cycles
1
1
1
1
0
0
0
0
1 Used0 Not used
1 Used0 Not used
1 8 bits0 16 bits
Successive RAS mode setup
DRAM
RAS precharge cycles selection
reserved
DRAM
CAS cycles selection
reserved
DRAM
RAS cycles selection
Area 18, 17 internal/external access
Area 16, 15 internal/external access
Area 14, 13 internal/external access
Area 12, 11 internal/external access
reserved
Area 8, 7 internal/external
Area 6 internal/external
Area 5, 4 internal/external
access
access
access
Area 18, 17 endian control
Area 16, 15 endian control
Area 14, 13 endian control
Area 12, 11 endian control
Area 10, 9 endian control
Area 8, 7 endian control
Area 6 endian control
Area 5, 4 endian control
Area 18, 17 address strobe signal
Area 16, 15 address strobe signal
Area 14, 13 address strobe signal
Area 12, 11 address strobe signal
reserved
Area 8, 7 address strobe signal
Area 6 address strobe signal
Area 5, 4 address strobe signal
Area 18, 17 read signal
Area 16, 15 read signal
Area 14, 13 read signal
Area 12, 11 read signal
reserved
Area 8, 7 read signal
Area 6 read signal
Area 5, 4 read signal
reserved
Area 1 access-speed
reserved
BCLK output clock selection
RI
CTS
DCD
DSR
SDRI
SURI
SDCTS
SUCTS
SDDCD
SUDCD
SDDSR
SUDSR
–
EDRI
EURI
EDCTS
EUCTS
EDDCD
EUDCD
EDDSR
EUDSR
–
DTR
RTS
–
STOP
–
INTE
PDCINT
–
TXBS
TXEN
RXEN
–
CRCER1
CRCER2
–
RXBB
RXBA
–
TXINTE
–
TXBS
TXEN
–
TXINT
–
–
RXINTE
–
RXEN
–
RXINT
–
CRCER
RXBS
–
–
Map UINT4 interrupt requests to CP4
Map UINT3 interrupt requests to CP4
Map UINT2 interrupt requests to CP4
Map UINT1 interrupt requests to CP4
Map UINT0 interrupt requests to CP4
–
RI input status
CTS input status
DCD input status
DSR input status
RI input status 1 → 0
RI input status 0 → 1
CTS input status 1 → 0
CTS input status 0 → 1
DCD input status 1 → 0
DCD input status 0 → 1
DSR input status 1 → 0
DSR input status 0 → 1
This chapter describes the controls used to reduce power consumption of the device.
Points on power saving
The current consumption of the device varies greatly with the CPU's operation mode, the system clocks used,
and the peripheral circuits operated.
Current consumptionlow←→high
CPU/BCUSLEEPHALT2OperatingHALT2HALT(basic) Operating
System clock–OSC1OSC1OSC3OSC3OSC3
OSC3 oscillation circuitOFFOFFOFFONONON
Prescaler/peripheral circuitSTOPRUN
To reduce power consumption of the device, it is important that as many unnecessary circuits as possible be
turned off. In particular, peripheral circuits operating at a fast-clock rate consume a large amount of current, so
design the program so that these circuits are turned off whenever unnecessary.
Power-saving in standby modes
When CPU processing is unnecessary, such as when waiting for an interrupt from key entries or peripheral
circuits, place the device in standby mode to reduce current consumption.
Standby modeMethod to enter the modeCircuits/functions stopped
Basic HALT mode Execute the halt instruction after setting
HLT2OP (D3)/Clock option register
(0x40190) to "0".
When the #BUSREQ signal is asserted from
an external bus master while SEPD (D1)/Bus
control register (0x4812E) = "1".
HALT2 modeExecute the halt instruction after setting
HLT2OP to "1".
SLEEP modeExecute the slp instruction.CPU, BCU, bus clock, DMA, high-speed
CPU and DMA
CPU, BCU, bus clock, and DMA
(OSC3) oscillation circuit, prescaler, and
peripheral circuits that use the prescaler
output clocks
HLT2OP (D3)/Clock option register (0x40190) that is used to select a HALT mode is set to "0" (basic HALT
mode) at initial reset.
Notes: • In systems in which DRAM is connected directly to the device, the refresh function is turned off
during HALT2 and SLEEP modes.
• The standby mode is cleared by interrupt generation (except for the basic HALT mode, which is
set using an external bus master). Therefore, before entering standby mode, set the related
registers to allow an interrupt to be used to clear the standby mode to be generated.
• When clearing the standby mode with an interrupt from port input, the interrupt operates as a
level interrupt regardless of the interrupt trigger setting. When edge trigger is set for the interrupt
trigger, attention must be paid to the port level during standby mode.
The low-speed (OSC1) oscillation circuit and clock timer continue operating even during SLEEP mode. If they
are unnecessary, these circuits can also be turned off.
Normally, the system is clocked by the high-speed (OSC3) oscillation clock. If high-speed operation is
unnecessary, switch the system clock to the low-speed (OSC1) oscillation clock and turn off the high-speed
(OSC3) oscillation circuit. This helps to reduce current consumption. However, if DRAM is connected directly
to the device, note that the refresh function is also turned off.
Even during operation using the high-speed (OSC3) oscillation clock, power reduction can also be achieved
through the use of a system clock derived from the OSC3 clock by dividing it (1/1, 1/2, 1/4, or 1/8).
System clock division ratio selectionCLKDT(D[7:6])/
Power control register(0x40180)
OSC3 OSC1 OSC3
ONOFFON
"11" = 1/8
"10" = 1/4
"01" = 1/2
"00" = 1/1
Turning off the prescaler and peripheral circuits
Current consumption can be reduced by turning off the peripheral circuits operating at high speed as much as
possible. This applies to the following peripheral circuits.
1) Blocks that use an operating clock generated by the prescaler
• 16-bit programmable timers 0 to 5 (watchdog timer)
• 8-bit programmable timers 0 to 5 (DRAM refresh, serial interface)
• A/D converter
2) Blocks that use the clock supplied to the prescaler (the prescaler source clock)
• 16-bit programmable timers 0 to 5 (watchdog timer)
• 8-bit programmable timers 0 to 5 (DRAM refresh)
• A/D converter
• Serial interface
• Ports
If none of the blocks in groups 1 and 2 above are used, turn off the prescaler. If any of the blocks in groups 1 and
2 above are used, do not turn off the prescaler. Turning off the prescaler turns off the clock signal supplied to the
blocks in group 2 above. Also, if only some of the circuits in group 1 above are used, turn off all the other
circuits and stop clock supply from the prescaler to those circuits.
The table below shows prescaler operation control and control of clock supply to these blocks from the
prescaler.
1/1
S1C33210 PRODUCT PARTEPSONA-63
5 POWER-DOWN CONTROL
FunctionControl bit"1""0"Default
Prescaler ON/OFFPSCON(D5)/Power control register(0x40180)ONOFFON
16-bit timer 0 clock controlP16TON0(D3)/16-bit timer 0 clock control register(0x40147)ONOFFOFF
16-bit timer 0 Run/StopPRUN0(D0)/16-bit timer 0 control register(0x48186)RUNSTOPSTOP
16-bit timer 1 clock controlP16TON1(D3)/16-bit timer 1 clock control register(0x40148)ONOFFOFF
16-bit timer 1 Run/StopPRUN1(D0)/16-bit timer 1 control register(0x4818E)RUNSTOPSTOP
16-bit timer 2 clock controlP16TON2(D3)/16-bit timer 2 clock control register(0x40149)ONOFFOFF
16-bit timer 2 Run/StopPRUN2(D0)/16-bit timer 2 control register(0x48196)RUNSTOPSTOP
16-bit timer 3 clock controlP16TON3(D3)/16-bit timer 3 clock control register(0x4014A)ONOFFOFF
16-bit timer 3 Run/StopPRUN3(D0)/16-bit timer 3 control register(0x4819E)RUNSTOPSTOP
16-bit timer 4 clock controlP16TON4(D3)/16-bit timer 4 clock control register(0x4014B)ONOFFOFF
16-bit timer 4 Run/StopPRUN4(D0)/16-bit timer 4 control register(0x481A6)RUNSTOPSTOP
16-bit timer 5 clock controlP16TON5(D3)/16-bit timer 5 clock control register(0x4014C)ONOFFOFF
16-bit timer 5 Run/StopPRUN5(D0)/16-bit timer 5 control register(0x481AE)RUNSTOPSTOP
8-bit timer 0 clock controlP8TON0(D3)/8-bit timer 0/1 clock control register(0x4014D)ONOFFOFF
8-bit timer 0 Run/StopPTRUN0(D0)/8-bit timer 0 control register(0x40160)RUNSTOPSTOP
8-bit timer 1 clock controlP8TON1(D7)/8-bit timer 0/1 clock control register(0x4014D)ONOFFOFF
8-bit timer 1 Run/StopPTRUN1(D0)/8-bit timer 1 control register(0x40164)RUNSTOPSTOP
8-bit timer 2 clock controlP8TON2(D3)/8-bit timer 2/3 clock control register(0x4014E)ONOFFOFF
8-bit timer 2 Run/StopPTRUN2(D0)/8-bit timer 2 control register(0x40168)RUNSTOPSTOP
8-bit timer 3 clock controlP8TON3(D7)/8-bit timer 2/3 clock control register(0x4014E)ONOFFOFF
8-bit timer 3 Run/StopPTRUN3(D0)/8-bit timer 3 control register(0x4016C)RUNSTOPSTOP
8-bit timer 4 clock controlP8TON4(D3)/8-bit timer 4/5 clock control register(0x40145)ONOFFOFF
8-bit timer 4 Run/StopPTRUN4(D0)/8-bit timer 4 control register(0x40174)RUNSTOPSTOP
8-bit timer 5 clock controlP8TON5(D7)/8-bit timer 4/5 clock control register(0x40145)ONOFFOFF
8-bit timer 5 Run/StopPTRUN5(D0)/8-bit timer 5 control register(0x40178)RUNSTOPSTOP
A/D converter clock controlPSONAD(D3)/A/D clock control register(0x4014F)ONOFFOFF
A/D conversion enableADE(D2)/A/D enable register(0x40244)RUNSTOPSTOP
The same clock source must be used for the prescaler operating clock and the CPU operating clock. Therefore,
when operating the CPU in low-speed with the OSC1 clock, the prescaler input clock must be switched
according to the CPU operating clock. In this case, in order to prevent a malfunction in the peripheral circuit,
the prescaler should be turned off before switching the CPU operating clock. After the CPU operating clock
has been switched, switch the prescaler operating clock and then turn the prescaler on.
Note: The above table is simply an example, and is not guaranteed to work.
S1C33210 PRODUCT PARTEPSONA-65
7 PRECAUTIONS ON MOUNTING
7 Precautions on Mounting
The following shows the precautions when designing the board and mounting the IC.
Oscillation Circuit
• Oscillation characteristics change depending on conditions (board pattern, components used, etc.).
In particular, when a ceramic oscillator or crystal oscillator is used, use the oscillator manufacturer's
recommended values for constants such as capacitance and resistance.
• Disturbances of the oscillation clock due to noise may cause a malfunction. Consider the following points to
prevent this:
(1) Components which are connected to the OSC3 (OSC1), OSC4 (OSC2) and PLLC pins, such as oscillators,
resistors and capacitors, should be connected in the shortest line.
(2) As shown in the figure below, make a V
SS pattern as large as possible at circumscription of the OSC3
(OSC1) and OSC4 (OSC2) pins and the components connected to these pins. The same applies to the
PLLC pin.
Furthermore, do not use this V
SS pattern to connect other components than the oscillation system.
Sample VSS pattern
OSC3 and OSC4
OSC4
OSC3
SS
V
PLLC
V
SS
PLLC
SS
V
(3) When supplying an external clock to the OSC3 (OSC1) pin, the clock source should be connected to the
OSC3 (OSC1) pin in the shortest line.
Furthermore, do not connect anything else to the OSC4 (OSC2) pin.
• In order to prevent unstable operation of the oscillation circuit due to current leak between OSC3 (OSC1) and
V
DD, please keep enough distance between OSC3 (OSC1) and VDD or other signals on the board pattern.
Reset Circuit
• The power-on reset signal which is input to the #RESET pin changes depending on conditions (power rise time,
components used, board pattern, etc.). Decide the time constant of the capacitor and resistor after enough tests
have been completed with the application product.
• In order to prevent any occurrences of unnecessary resetting caused by noise during operating, components
such as capacitors and resistors should be connected to the #RESET pin in the shortest line.
Power Supply Circuit
• Sudden power supply variation due to noise may cause malfunction. Consider the following points to prevent
this:
(1) The power supply should be connected to the V
possible.
In particular, the power supply for AV
A-66EPSONS1C33210 PRODUCT PART
DD affects A/D conversion precision.
DD, VSS and AVDD pins with patterns as short and large as
7 PRECAUTIONS ON MOUNTING
(2) When connecting between the VDD and VSS pins with a bypass capacitor, the pins should be connected as
short as possible.
Bypass capacitor connection example
V
DD
VDD
VSS
VSS
A/D Converter
• When the A/D converter is not used, the power supply pin AVDD for the analog system should be connected to
V
DDE.
Arrangement of Signal Lines
• In order to prevent generation of electromagnetic induction noise caused by mutual inductance, do not arrange
a large current signal line near the circuits that are sensitive to noise such as the oscillation unit and analog input
unit.
• When a signal line is parallel with a high-speed line in long distance or intersects a high-speed line, noise may
generated by mutual interference between the signals and it may cause a malfunction.
Do not arrange a high-speed signal line especially near circuits that are sensitive to noise such as the oscillation
unit and analog input unit.
Prohibited pattern
K60 (AD0)
Large current signal line
High-speed signal line
OSC4
OSC3
V
SS
Large current signal line
High-speed signal line
S1C33210 PRODUCT PARTEPSONA-67
8 ELECTRICAL CHARACTERISTICS
8 Electrical Characteristics
8.1 Absolute Maximum Rating
(VSS=0V)
ItemSymbolConditionRated valueUnit ∗
Supply voltageVDD-0.3 to +4.0V
Input voltageVI-0.3 to VDDE+0.5V
High-level output currentIOH1 pin-10mA
Total of all pins-40mA
Low-level output currentIOL1 pin10mA
Total of all pins40mA
Analog power voltageAVDDE-0.3 to +7.0V
Analog input voltageAVIN-0.3 to AVDDE+0.3V
Storage temperatureTSTG-65 to +150°C
A-68EPSONS1C33210 PRODUCT PART
8 ELECTRICAL CHARACTERISTICS
8.2 Recommended Operating Conditions
(VSS=0V)
ItemSymbolConditionM in.Typ.Max.Unit ∗
Supply voltageVDD2.70–3.60V
Input voltageVIVSS–VDDV
CPU operating clock frequencyfCPU––50MHz
Low-speed oscillation frequencyfOSC1–32.768–kHz
Operating temperatureTa-402585°C
Input rise time (normal input)tri––50ns
Input fall time (normal input)tfi––50ns
Input rise time (schmitt input)tri––5ms
Input fall time (schmitt input)tfi––5ms
S1C33210 PRODUCT PARTEPSONA-69
8 ELECTRICAL CHARACTERISTICS
8.3 DC Characteristics
(Unless otherwise specified: VDD=2.7V to 3.6V, Ta=-40°C to +85°C)
(Unless otherwise specified: VDD=2.7V to 3.6V, VSS=0V, Ta=-40°C to +85°C)
ItemSymbolConditionMin.Typ.Max.Unit ∗
Operating currentIDD1When CPU is operating20MHz–2737mA1
33MHz–4864
50MHz–6490
IDD2HALT mode20MHz–1620mA2
33MHz–2837
50MHz–3755
IDD3HALT2 mode20MHz–610mA 3
33MHz–915
50MHz–1320
IDD4SLEEP mode–130µA4
Clock timer operating currentIDDCTWhen clock timer only is operating
OSC1 oscillation: 32kHz
Analog power current
(Unless otherwise specified: VSS=0V, Ta=-40°C to +85°C)
ItemSymbolConditionMin.Typ.Max.Unit ∗
A/D converter operating current AI DD1VDD=AVDD=2.7V to 3.6V–500800µA6
Current consumption measurement condition: VIH=VDD, VIL=0V, output pins are open.∗ note) No.OSC3OSC1CPUClock timerOther peripheral circuits
∗1:The values of current consumption while the CPU is operating were measured when a test program that
consists of 55% load instructions, 23% arithmetic operation instructions, 1% mac instruction, 12% branch
instructions and 9% ext instruction is being executed in the built-in ROM continuously.
–7–µA5
conversion clock frequency=2MHz
S1C33210 PRODUCT PARTEPSONA-71
8 ELECTRICAL CHARACTERISTICS
8.5 A/D Converter Characteristics
(Unless otherwise specified: AVDD=VDD=2.7V to 3.6V, VSS=0V, Ta=-40°C to +85°C, ST[1:0]=11)
ItemSymbolConditionMin.Typ.Max.Unit ∗
Resolution––10–bit
Conversion time–10–625µs1
Zero scale errorEZS024LSB
Full scale errorEFS-2–2LSB
Integral linearity errorEL-3–3LSB
Differential linearity errorED-3–3LSB
Permissible signal source impedance–––5kΩ
Analog input capacitance–––45pF
∗ note 1) Indicates the minimum value when A/D clock = 2MHz (maximum clock frequency in 3V system).
Indicates the maximum value when A/D clock = 32 kHz (minimum clock frequency in 3V system).
Note: • Be sure to use as VDD = AVDD.
• The A/D converter cannot be used when the S1C33210 is used with a 2V power source.
A/D conversion error
V[000]h = Ideal voltage at zero-scale point (=0.5LSB)
V'[000]h = Actual voltage at zero-scale point
V[3FF]h = Ideal voltage at full-scale point (=1022.5LSB)
V'[3FF]h = Actual voltage at full-scale point
1LSB =
1LSB' =
AVDD - V
SS
210 - 1
V'[3FF]h - V'[000]h
10
- 2
2
Zero scale error
004
003
V[000]h
(=0.5LSB)
002
001
Digital output (hex)
000
V
SS
Full scale error
3FF
3FE
3FD
3FC
Digital output (hex)
3FB
V'[3FF]h
Ideal conversion characteristic
Actual conversion characteristic
V'[000]h
Analog input
V[3FF]h (=1022.5LSB)
Actual conversion characteristic
Ideal conversion characteristic
AV
Analog input
DD
Zero scale error EZS =[LSB]
Full scale error EFS =[LSB]
(V'[000]h - 0.5LSB') - (V[000]h - 0.5LSB)
1LSB
(V'[3FF]h + 0.5LSB') - (V[3FF]h + 0.5LSB)
1LSB
A-72EPSONS1C33210 PRODUCT PART
Integral linearity error
3FF
3FE
3FD
003
002
Digital output (hex)
001
V'[000]h
000
SS
V
Analog input
Differential linearity error
N+1
N
N-1
N-2
Digital output (hex)
V'[N]h
V'[N-1]h
V'[3FF]h
Integral linearity error EL =[LSB]
VN'V
N
Actual conversion characteristic
Ideal conversion characteristic
AV
DD
Ideal conversion characteristic
Actual conversion characteristic
Differential linearity error ED =- 1 [LSB]
8 ELECTRICAL CHARACTERISTICS
V
N
' - V
N
1LSB'
V'[N]h - V'[N-1]h
1LSB'
Analog input
S1C33210 PRODUCT PARTEPSONA-73
8 ELECTRICAL CHARACTERISTICS
8.6 AC Characteristics
8.6.1 Symbol Description
tCYC: Bus-clock cycle time
• In x1 mode,
• In x2 mode,
WC: Number of wait cycles
Up to 7 cycles can be set for the number of cycles using the BCU control register. Furthermore, it can be
extended to a desired number of cycles by setting the #WAIT pin from outside of the IC.
The minimum number of read cycles with no wait (0) inserted is 1 cycle.
The minimum number of write cycles with no wait cycle (0) inserted is 2 cycles. It does not change even if
1-wait cycle is set. The write cycle is actually extended when 2 or more wait cycles are set.
When inserting wait cycles by controlling the #WAIT pin from outside of the IC, pay attention to the timing
of the #WAIT signal sampling. Read cycles are terminated at the cycle in which the #WAIT signal is negated.
Write cycles are terminated at the following cycle after the #WAIT signal is negated.
C1, C2, C3, Cn: Cycle number
C1 indicates the first cycle when the BCU transfers data from/to an external memory or another device.
Similarly, C2 and Cn indicate the second cycle and nth cycle, respectively.
tCYC= 50 ns (20 MHz) when the CPU is operated with a 20-MHz clock
tCYC= 30 ns (33 MHz) when the CPU is operated with a 33-MHz clock
tCYC= 50 ns (20 MHz) when the CPU is operated with a 40-MHz clock
tCYC= 40 ns (25 MHz) when the CPU is operated with a 50-MHz clock
Cw: Wait cycle
Indicates that the cycle is wait cycle inserted.
8.6.2 AC Characteristics Measurement Condition
Signal detection level: Input signalHigh level VIH = VDD - 0.4 V
Low levelV
Output signal High level V
Low levelVOL = 1/2 VDD
The following applies when OSC3 is external clock input:
Input signalHigh level V
Low levelVIL = 1/2 V DD
Input signal waveform: Rise time (10% → 90% VDD)5 ns
Fall time (90% → 10% V
Output load capacitance:C
L = 50 pF
IL = 0.4 V
OH = 1/2 V DD
IH = 1/2 VDD
DD)5 ns
A-74EPSONS1C33210 PRODUCT PART
8 ELECTRICAL CHARACTERISTICS
8.6.3 C33 Block AC Characteristic Tables
External clock input characteristics
(Note) These AC characteristics apply to input signals from outside the IC.
The OSC3 input clock must be within V
(Unless otherwise specified: VDD=2.7V to 3.6V, VSS=0V, Ta=-40°C to +85°C)
(Note) These AC characteristic values are applied only when the high-speed oscillation circuit is used.
(Unless otherwise specified: VDD=2.7V to 3.6V, VSS=0V, Ta=-40°C to +85°C)
ItemSymbolMin.Max.Unit ∗
BCLK clock output dutytCBD4060%
DD to VSS voltage range.
S1C33210 PRODUCT PARTEPSONA-75
8 ELECTRICAL CHARACTERISTICS
Common characteristics
(Unless otherwise specified: VDD=2.7V to 3.6V, VSS=0V, Ta=-40°C to +85°C)
ItemSymbolMin.Max.Unit ∗
Address delay timetAD–10ns1
#CEx delay time (1)tCE1–10ns
#CEx delay time (2)tCE2–10ns
Wait setup timetWTS17–ns
Wait hold timetWTH0–ns
Read signal delay time (1)tRDD110ns2
Read data setup timetRDS15ns
Read data hold timetRDH0ns
Write signal delay time (1)tWRD110ns3
Write data delay time (1)tWDD110ns
Write data delay time (2)tWDD2010ns
Write data hold timetWDH0ns
∗ note1) This applies to the #BSH and #BSL timings.
2) This applies to the #GAAS and #GARD timings.
3) This applies to the #GAAS timing.
SRAM read cycle
(Unless otherwise specified: VDD=2.7V to 3.6V, VSS=0V, Ta=-40°C to +85°C)
ItemSymbolMin.Max.Unit ∗
Read signal delay time (2)tRDD210ns
Read signal pulse widthtRDWtCYC(0.5+WC)-10ns
Read address access time (1)tACC1tCYC(1+WC)-25ns
Chip enable access time (1)tCEAC1tCYC(1+WC)-25ns
Read signal access time (1)tRDAC1tCYC(0.5+WC)-25ns
SRAM write cycle
(Unless otherwise specified: VDD=2.7V to 3.6V, VSS=0V, Ta=-40°C to +85°C)
ItemSymbolMin.Max.Unit ∗
Write signal delay time (2)tWRD210ns
Write signal pulse widthtWRWtCYC(1+WC)-10ns
A-76EPSONS1C33210 PRODUCT PART
8 ELECTRICAL CHARACTERISTICS
DRAM access cycle common characteristics
(Unless otherwise specified: VDD=2.7V to 3.6V, VSS=0V, Ta=-40°C to +85°C)
ItemSymbolMin.Max.Unit ∗
#RAS signal delay time (1)tRASD110ns
#RAS signal delay time (2)tRASD210ns
#RAS signal pulse widthtRASWtCYC(2+WC)-10ns
#CAS signal delay time (1)tCASD110ns
#CAS signal delay time (2)tCASD210ns
#CAS signal pulse widthtCASWtCYC(0.5+WC)-10ns
Read signal delay time (3)tRDD310ns
Read signal pulse width (2)tRDW2tCYC(2+WC)-10ns
Write signal delay time (3)tWRD310ns
Write signal pulse width (2)tWRW2tCYC(2+WC)-10ns
DRAM random access cycle and DRAM fast-page cycle
(Unless otherwise specified: VDD=2.7V to 3.6V, VSS=0V, Ta=-40°C to +85°C)
(Unless otherwise specified: VDD=2.7V to 3.6V, VSS=0V, Ta=-40°C to +85°C)
ItemSymbolMin.Max.Unit ∗
Read address access time (2)tACC2tCYC(1+WC)-25ns
Chip enable access time (2)tCEAC2tCYC(1+WC)-25ns
Read signal access time (2)tRDAC2tCYC(0.5+WC)-25ns
Burst address access timetACCBtCYC(1+WC)-25ns
External bus master and NMI
(Unless otherwise specified: VDD=2.7V to 3.6V, VSS=0V, Ta=-40°C to +85°C)
ItemSymbolMin.Max.Unit ∗
#BUSREQ signal setup timetBRQS16ns
#BUSREQ signal hold timetBRQH0ns
#BUSACK signal output delay timetBAKD10ns
High-impedance → output delay timetZ2E10ns
Output → high-impedance delay timetB2Z10ns
#NMI pulse widthtNMIW30ns
Input, Output and I/O port
(Unless otherwise specified: VDD=2.7V to 3.6V, VSS=0V, Ta=-40°C to +85°C)
ItemSymbolMin.Max.Unit ∗
Input data setup timetINPS20ns
Input data hold timetINPH10ns
Output data delay timetOUTD20ns
K-port interruptSLEEP, HALT2 modetKINW30ns
input pulse width Others2 × tCYCns
S1C33210 PRODUCT PARTEPSONA-77
8 ELECTRICAL CHARACTERISTICS
8.6.4 C33 Block AC Characteristic Timing Charts
Clock
(1) When an external clock is input (in x1 speed mode):
tC3
tC3H
OSC3
(High-speed clock)
tIFtIR
tC3ED
=
tC3H/tC3
tCD1tCD2
tC3
BCLK
(Clock output)
(2) When the high-speed oscillation circuit is used for the operating clock:
tC3
tCBH
BCLK
(Clock output)
tCBD
=
tCBH/tC3
A-78EPSONS1C33210 PRODUCT PART
8 ELECTRICAL CHARACTERISTICS
SRAM read cycle (basic cycle: 1 cycle)
tC3
BCLK
tAD
A[23:0]
tCE1tCE2
#CEx
tRDW
#RD
tCEAC1
tACC1
tRDAC1
D[15:0]
tRDS
tWTStWTH
#WAIT
*1 tRDH is measured with respect to the first signal change (negation) from among the #RD, #CEx and A[23:0]
signals.
tAD
tRDD2tRDD1
tRDH
∗1
SRAM read cycle (when a wait cycle is inserted)
C1Cw
BCLK
t
AD
A[23:0]
t
CE1
#CEx
t
RDD1
(C1 only)
#RD
D[15:0]
t
WTStWTH
#WAIT
*1 tRDH is measured with respect to the first signal change (negation) from among the #RD, #CEx and A[23:0]
signals.
(wait cycle)
t
t
t
WTStWTH
CEAC1
t
ACC1
RDAC1
t
RDW
Cn
(last cycle)
t
WTStWTH
t
RDS
t
AD
t
CE2
t
RDD2
t
RDH
∗1
S1C33210 PRODUCT PARTEPSONA-79
8 ELECTRICAL CHARACTERISTICS
;;;;;;;;;;;;;;
;;;;;
;;;;;
SRAM write cycle (basic cycle: 2 cycles)
C1C2
BCLK
tAD
A[23:0]
tCE1tCE2
#CEx
tWRW
#WR
tWDD1tWDH
D[15:0]
tWTStWTH
#WAIT
SRAM write cycle (when wait cycles are inserted)
C1Cw(wait cycle)Cw(wait cycle)Cn(last cycle)
Wait cycle followsLast cycle follows
BCLK
tAD
A[23:0]
tCE1tCE2
#CEx
tWRW
#WR
tWDD1tWDH
D[15:0]
tWTStWTH tWTStWTStWTHtWTH
#WAIT
tAD
tWRD2tWRD1
tAD
tWRD2tWRD1
A-80EPSONS1C33210 PRODUCT PART
DRAM random access cycle (basic cycle)
Data transfer #1
RAS1
BCLK
tADtADtAD
A[23:0]
#RAS
#HCAS/
#LCAS
#RD
D[15:0]
#WE
tWDD1tWDD2
D[15:0]
CAS1PRE1(precharge)RAS1'CAS1'
tRASW
tRDW2
tRACF
tACCF
tWRW2
tRDS
tCASW
tCACF
tCASD2tCASD1
tRDH
8 ELECTRICAL CHARACTERISTICS
Next data transfer
tRASD2tRASD1
tRDD3tRDD1
∗1
tWRD3tWRD1
∗1 tRDH is measured with respect to the first signal change (negation) of either the #RD or the A[23:0] signals.
DRAM fast-page access cycle
Data transfer #1Data transfer #2Next data transfer
RAS1
BCLK
tADtADtAD
A[23:0]
#RAS
#HCAS/
#LCAS
#RD
D[15:0]
#WE
tWDD1tWDD2tWDD2
D[15:0]
CAS1CAS2PRE1
tRASW
tCASD2tCASD1
tCASW
tRDW2
tCACFtACCF
tRACF
tACCF
tRDS
tRDH
tRDStRDH
tWRW2
(precharge)
tRASD2tRASD1
tRDD3tRDD1
∗1∗1
tWRD3tWRD1
RAS1'
∗1 tRDH is measured with respect to the first signal change (negation) of either the #RD or the A[23:0] signals.
S1C33210 PRODUCT PARTEPSONA-81
8 ELECTRICAL CHARACTERISTICS
EDO DRAM random access cycle (basic cycle)
Data transfer #1
RAS1
BCLK
tADtADtAD
A[23:0]
#RAS
#HCAS/
#LCAS
#RD
D[15:0]
#WE
tWDD1tWDD2
D[15:0]
CAS1PRE1(precharge)RAS1'CAS1'
tRASW
tCASW
tRDW2
tRACE
tACCE
tWRW2
tRDS2
tCASD2tCASD1
tCACE
Next data transfer
tRASD2tRASD1
tRDD3tRDD1
∗1
tRDH
tWRD3tWRD1
∗1 tRDH is measured with respect to the first signal change (negation) of either the #RD or the #RASx signals.
EDO DRAM page access cycle
Data transfer #1Data transfer #2Next data transfer
BCLK
A[23:0]
#RAS
#HCAS/
#LCAS
#RD
D[15:0]
#WE
D[15:0]
RAS1
t
AD
t
RASD1
t
RDD1
t
WRD1
t
WDD1
CAS1CAS2PRE1
t
AD
t
CASD1
t
RACE
t
ACCE
t
CASW
t
CACE
t
RASW
t
RDW2
t
WRW2
t
AD
t
CASD2
t
WDD2
t
RDS
t
ACCE
t
RDH
t
WDD2
t
(precharge)
t
RASD2
t
RDD3
RDStRDH
t
WRD3
RAS1'
∗1
∗1 tRDH is measured with respect to the first signal change from among the #RD (negation), #RASx (negation)
and #CAS (fall) signals.
A-82EPSONS1C33210 PRODUCT PART
DRAM CAS-before-RAS refresh cycle
CCBR1CCBR2CCBR3
BCLK
#RAS
#HCAS/
#LCAS
#WE
DRAM self-refresh cycle
Self-refresh mode setupSelf-refresh mode
BCLK
#RAS
t
#HCAS/
#LCAS
CASD1
CBR refresh cycle
t
RASD1
8 ELECTRICAL CHARACTERISTICS
tRASD2tRASD1
tCASD2tCASD1
Self-refresh mode canceration
6-cycle precharge
(Fixed)
t
RASD2
t
CASD2
Burst ROM read cycle
SRAM read cycleBurst cycleBurst cycleBurst cycle
BCLK
t
AD
A[23:2]
t
AD
A[1:0]
t
CE1
#CEx
t
RDD1
#RD
t
ACC2
t
CEAC
t
RDAC2
t
RDS
D[15:0]
∗1 tRDH is measured with respect to the first signal change (negation) from among the #RD, #CEx and A[23:0]
Oscillation characteristics change depending on conditions (board pattern, components used, etc.). Use the following
characteristics as reference values. In particular, when a ceramic or crystal oscillator is used, use the oscillator
manufacturer recommended values for constants such as capacitance and resistance.
including board capacitance
Frequency/IC deviation∆f/∆IC-1010ppm
Frequency/power voltage deviation ∆f/∆V-1010ppm/V
Frequency adjustment range∆f/∆CGCG=CD1= 5 to 25pF50ppm
#1 Q11C02RX: Crystal resonator made by Seiko Epson
#2 "CG1=CD1=15pF" includes board capacitance.
525pF
OSC3 crystal oscillation
Note:A "crystal resonator that uses a fundamental" should be used for the OSC3 crystal oscillation circuit.