Emerson ROC364 Instruction Manual

Download

Page 1

Form A4193

Part Number D301060X012 June 2005

ROC364 REMOTE OPERATIONS CONTROLLER

Instruction Manual

Flow Computer Division

Website: www.EmersonProcess.com/flow

Page 2

ROC364 Instruction Manual

Revision Tracking Sheet

June 2005

This manual is revised periodically to incorporate new or updated information. The date revision level of each page is indicated at the bottom of the page opposite the page number. A major change in the content of the manual also changes the date of the manual, which appears on the front cover. Listed below is the date revision level of each page.

Page Revision

All Pages Jun/05 All Pages May/02

FloBoss and ROCLINK are marks of one of the Emerson Process Management companies. The Emerson logo is a trademark and service mark of Emerson Electric Co. All other marks are the property of their respective owners.

Printed in the U.S.A.

While this information is presented in good faith and believed to be accurate, Fisher Controls does not guarantee satisfactory results from reliance upon such information. Nothing contained herein is to be construed as a warranty or gu arantee, express or implied, regarding the performance, merchantability, fitness or any other matter with respect to the products, nor as a recommendation to use any product or process in conflict with any patent. Fisher Controls reserves the right, without notice, to alter or improve the designs or specifications of the products described herein.

ii Rev Jun/05

Page 3

ROC364 Instruction Manual

TABLE OF CONTENTS

Table of Contents ............................................................................................................. iii

Section 1 – General Information................................................................................... 1-1

1.1 Scope of Manual.............................................................................................................................1-1

1.2 Manual Contents.............................................................................................................................1-1

1.3 Product Overview ...........................................................................................................................1-2

1.4 Installation Guidelines....................................................................................................................1-3

1.5 Power Supply Requirements........................................................................................................... 1-6

1.6 Startup and Operation...................................................................................................................1-10

Section 2 – Master Controller Unit, I/O Module Rack, and Wiring......................... 2-1

2.1 Scope...............................................................................................................................................2-1

2.2 Product Description ........................................................................................................................2-1

2.3 Installation.......................................................................................................................................2-7

2.4 Connecting the MCU to Wiring...................................................................................................... 2-9

2.5 Troubleshooting and Repair.......................................................................................................... 2-12

2.6 ROC364 Specifications................................................................................................................. 2-20

Section 3 – Input and Output Modules........................................................................ 3-1

3.1 Scope...............................................................................................................................................3-1

3.2 Product Descriptions....................................................................................................................... 3-1

3.3 Initial Installation and Setup...........................................................................................................3-5

3.4 Connecting the I/O Modules to Wiring .......................................................................................... 3-5

3.5 Troubleshooting and Repair.......................................................................................................... 3-21

3.6 Removal, Addition, and Replacement Procedures .......................................................................3-28

3.7 I/O Module Specifications............................................................................................................3-30

Section 4 – Communications Cards.............................................................................. 4-1

4.1 Scope...............................................................................................................................................4-1

4.2 Product Descriptions....................................................................................................................... 4-1

4.3 Installing Communications Cards................................................................................................... 4-8

4.4 Connecting Communications Cards to Wiring............................................................................. 4-12

4.5 Troubleshooting and Repair.......................................................................................................... 4-19

4.6 Communication Card Specifications ............................................................................................4-21

iii Table of Contents Rev Jun/05

Page 4

ROC364 Instruction Manual

Section 5 – I/O Converter Card.................................................................................... 5-1

5.1 Scope...............................................................................................................................................5-1

5.2 Product Description ........................................................................................................................5-1

5.3 Initial Installation and Setup...........................................................................................................5-2

5.4 Troubleshooting and Repair............................................................................................................ 5-3

5.5 I/O Converter Card Specification ................................................................................................... 5-4

Appendix A – Lightning Protection Module...............................................................A-1

A.1 Product Description ....................................................................................................................... A-1

A.2 Connecting the LPM to Wiring...................................................................................................... A-2

A.3 Troubleshooting and Repair........................................................................................................... A-2

A.4 Lightning Protection Module Specifications................................................................................. A-3

Appendix B – Local Display Panel ...............................................................................B-1

B.1 Product Description........................................................................................................................B-1

B.2 Installation.......................................................................................................................................B-2

B.3 Operation.........................................................................................................................................B-4

B.4 Troubleshooting and Repair..........................................................................................................B-22

B.5 Local Display Panel Specifications ..............................................................................................B-23

Appendix C – I/O Simulation........................................................................................C-1

C.1 Analog Outputs to Analog Inputs ...................................................................................................C-1

C.2 Analog Outputs to Ammeter or Voltmeter .....................................................................................C-2

C.3 Discrete Outputs to Discrete Inputs ................................................................................................C-3

C.4 Discrete Outputs to Pulse Inputs.....................................................................................................C-3

C.5 Potentiometer to Analog Inputs ......................................................................................................C-4

C.6 Switch to Discrete Inputs................................................................................................................C-5

C.7 Switch to Pulse Inputs.....................................................................................................................C-5

Glossary.......................................................................................................................... G-1

Index.................................................................................................................................I-1

iv Table of Contents Rev Jun/05

Page 5

ROC364 Instruction Manual

SECTION 1 – GENERAL INFORMATION

1.1 Scope of Manual

This manual focuses on the hardware aspects of the ROC364 Remote Operations Controller (ROC) manufactured by Flow Computer Division of Emerson Process Management. For software aspects, such as configuration, refer to the respective ROCLINK configuration user manual.



NOTE: Certain hardware versions and functionality may require higher revisions of ROCLINK

configuration software. Verify the version of ROCLINK configuration software.

This section contains the following information:

Section

1.1 Scope of Manual 1-1

1.2 Manual Contents 1-1

1.3 Product Overview 1-2

1.4 Installation Guidelines 1-3

1.5 Power Supply Requirements 1-6

1.6 Startup and Operation 1-9

Page

1.2 Manual Contents

This manual contains the following sections: Section 2 details the Master Controller Unit (MCU), I/O Module Rack, wiring, troubleshooting, and

specifications.

Section 3 provides information and specifications for the I/O modules. Section 4 provides details and specifications for the communications cards. Appendix A describes the optional Lightning Protection Module (LPM) and specifications. Appendix B describes specifications and how to use the optional Local Display Panel (LDP) to access

operational data and change configuration.

Appendix C shows various ways to set up I/O simulation for troubleshooting components and

configurations.

For more information on software or accessories, please refer to the following manuals.

♦ ROCLINK for Windows Configuration Software User Manual (Form A6091). ♦ ROCLINK 800 Configuration Software User Manual (Form A6121). ♦ ROC/ROC Accessories Instruction Manual (Form A4637).

1-1 General Information Rev Jun/05

Page 6

ROC364 Instruction Manual

1.1.1 FCC Information

This equipment complies with Part 68 of the Federal Communications Commission (FCC) rules. On the modem assembly is a label that contains, among other information, the FCC certification number and Ringer Equivalence Number (REN) for this equipment. If requested, this information must be provided to the telephone company.

A FCC compliant telephone modular plug is provided with this equipment. This equipment is designed to be connected to the telephone network or premises’ wiring, using a compatible modular jack that is Part 68 compliant. See Installation Instructions for details.

The REN is used to determine the quantity of devices that may be connected to the telephone line. Excessive RENs on the telephone line may result in the devices not ringing in response to an incoming call. Typically, the sum of the RENs should not exceed five (5.0). To be certain of the number of devices that may be connected to a line (as determined by the total RENs), contact the local telephone company.

If this equipment, dial-up modem, causes harm to the telephone network, the telephone company will notify you in advance that temporary discontinuance of service may be required. But if advance notice is not practical, the telephone company will notify the customer as soon as possible. Also, you will be advised of your right to file a complaint with the FCC if you believe it necessary.

The telephone company may make changes to its facilities, equipment, operations, or procedures that could affect the operation of the equipment. If this happens the telephone company will provide advance notice so you can make the necessary modifications to maintain uninterrupted service.

If trouble is experienced with this equipment, dial-up modem, for repair or warranty information, please contact Emerson Process Management, Flow Computer Division (641) 754-2578. If the equipment is causing harm to the telephone network, the telephone company may request that you disconnect the equipment until the problem is resolved.

1.3 Product Overview

The ROC364 is a microprocessor-based controller that provides the functions required for a variety of field automation applications. The ROC364 is used primarily where there is a need for remote monitoring, measurement, data archival, and control. You can configure the ROC364 for specific applications including those requiring calculations, PID (Proportional, Integral, and Derivative) Loop Control, and Function Sequence Tables (FSTs) logic/sequencing control.

The ROC364 features modularized field inputs and outputs (I/O), which provide the flexibility to meet the requirements of a specific application. Up to 64 I/O modules can be used in any combination of Discrete Inputs, Discrete Outputs, Analog Inputs, Analog Outputs, and Pulse Inputs.

The modular design of the ROC364 makes it cost-effective for both small and large applications. You can select from a variety of communications and operator interface options to customize the installation for a given system. The ROC is approved for use in Class I – Division 2 hazardous area locations.

The FlashPAC includes additional features contained in the firmware, such as 1992 American Gas Association (AGA) flow calculations, Spontaneous-Report-by-Exception (SRBX or RBX) alarm messaging, Local Display Panel configuring, and radio power control.

Figure 1-1 shows the major components that make up the ROC Master Controller Unit (MCU). Figure 2-6 shows the outline and mounting dimensions for the ROC364 controller. Refer to Section 2, Master Controller Unit, I/O Module Rack, and Wiring, for further hardware and firmware details.

1-2 General Information Rev Jun/05

Page 7

ROC364 Instruction Manual

1.4 Installation Guidelines

The design of the ROC makes it highly adaptable to a wide variety of installations; therefore, not all possibilities can be covered in this manual. If additional information is required concerning a specific installation, contact your local sales representative.

Planning is essential to a good installation. Because installation requirements depend on many factors such as the application, location, ground conditions, climate, and accessibility, only generalized guidelines can be provided in this document.

Backplate

C A P H S A

L F

ROC

REMOTE OPERATIONS CONTROLLER

MCU

POWER

2A S.B., 32 VDC

AUX OUT 1

5A, 32 VDC

AUX OUT 2

5A, 32 VDC

SYSTEM STATUS

DC PWR IN

AUX PWR OUT 1

ABC CBACBACBACBACBACBACBAABCABCABCABC CBACBACBACBA

GND

MEMORY EXPANSION

POWER AUX OUT 1 AUX OUT 2

AUX PWR

OUT 2

321

OPERATOR INTERFACE

RAM

COM2 COM1

DISPLAY

I/O Modules

I/O Module Wiring / Termination

GNDGND

I/O Rack

Figure 1-1. ROC364 Controller Components Mounted on Backplate

1-3 General Information Rev Jun/05

ROC364

Page 8

ROC364 Instruction Manual

1.4.1 Environmental Requirements

The ROC364 requires protection from direct exposure to rain, snow, ice, blowing dust or debris, and corrosive atmospheres. If the ROC is installed outside of a building, it must be placed in a NEMA 3 or higher rated enclosure to ensure the necessary level of protection.



NOTE: In salt spray environments, it is especially important to ensure that the enclosure is sealed

properly, including all entry and exit points. If salt is allowed to enter, it can shorten the life of the lithium battery in the ROC and cause the battery to leak corrosive chemicals.

The ROC units are designed to operate over a wide range of temperatures. However, in extreme climates it may be necessary to provide temperature-controlling devices to maintain stable operating conditions. In extremely hot climates, a filtered ventilation system or air conditioning may be required. In extremely cold climates, it may be necessary to provide a thermostatically controlled heater in the same enclosure as the ROC364. To maintain a non-condensing atmosphere inside the ROC enclosure in areas of high humidity, it may be necessary to add heat or dehumidification.

1.4.2 Site Requirements

Careful consideration when locating the ROC on the site can help reduce future operational problems. The following items should be considered when choosing a location:

♦ Local, state, and federal codes often place restrictions on ROC locations and dictate site

requirements. Examples of these restrictions are fall distance from a meter run, distance from pipe flanges, and hazardous area classifications. Ensure that all code requirements are met.

♦ Locate the ROC to minimize the length of signal and power wiring. By code, line power wiring

must not cross meter runs.

♦ Solar panels must face due South (not magnetic South) in the northern hemisphere and due North

(not magnetic North) in the southern hemisphere. Make sure nothing blocks the sunlight during any part of the day.

♦ ROC units equipped for radio communications should be located so the antenna has an

unobstructed signal path. Antennas should not be aimed into storage tanks, buildings, or other tall structures. If possible, ROC units should be located at the highest point on the site. Overhead clearance should be sufficient to allow the antenna to be raised to a height of at least twenty feet.

♦ To minimize interference with radio communications, locate the ROC away from electrical noise

sources, such as engines, large electric motors, and utility line transformers.

♦ Locate ROC units away from heavy traffic areas to reduce the risk of being damaged by

vehicles. However, provide adequate vehicle access to aid monitoring and maintenance.

1.4.3 Compliance with Hazardous Area Standards

The ROC364 hazardous location approval is for Class I, Division 2, Groups A, B, C, and D. The class, division, and group terms are defined as follows:

1. Class defines the general nature of the hazardous material in the surrounding atmosphere. Class I

is for locations where flammable gases or vapors may be present in the air in quantities sufficient to produce explosive or ignitable mixtures.

2. Division defines the probability of hazardous material being present in an ignitable concentration

in the surrounding atmosphere. Division 2 locations are locations that are presumed to be hazardous only in an abnormal situation.

1-4 General Information Rev Jun/05

Page 9

ROC364 Instruction Manual

3. Group defines the hazardous material in the surrounding atmosphere and include:

♦ Group A – Atmosphere containing acetylene. ♦ Group B – Atmosphere containing hydrogen, gases, or vapors of equivalent nature. ♦ Group C – Atmosphere containing ethylene, gases, or vapors of equivalent nature. ♦ Group D – Atmosphere containing propane, gases, or vapors of equivalent nature.

For the ROC to be approved for hazardous locations, it must be installed in accordance with the National Electrical Code (NEC) guidelines or other applicable codes.

When working on units located in a hazardous area (where explosive gases may be present), make sure the area is in a non-hazardous state before performing procedures. Performing procedures in a hazardous area could result in personal injury or property damage.

1.4.4 Power Installation Requirements

Typical sources of primary power for ROC installations are line power and solar power. Be sure to route line power away from hazardous areas, as well as sensitive monitoring and radio equipment. Local and company codes generally provide guidelines for line power installations. Adhere rigorously to all local and National Electrical Code (NEC) requirements for line power installations.

Solar power allows installation of the ROC in locations where line power is not available. The solar panels and batteries must be properly sized for the application and geographic location to ensure continuous reliable operation. Information contained in the ROC/ROC Accessories Instruction Manual (Form 4637) can assist in determining the solar panel and battery requirements.

A site may have additional power requirements for radios, repeaters, and other monitoring devices. Power supply and converter accessories can minimize the number of separate power sources required for an installation.

The ROC364 can operate from either a 12-volt or a 24-volt nominal power source. If 24-volt transmitter power is required when operating on 12-volt power, the ROC364 requires an I/O Converter Card to be installed. Refer to Section 5. The ROC364 has a low-voltage cut-off circuit built in to guard against draining down power supply batteries.

1.4.5 Grounding Installation Requirements

Ground wiring requirements for line-powered equipment are governed by the National Electrical Code (NEC). When the equipment uses line power, the grounding system must terminate at the service disconnect. All equipment grounding conductors must provide an uninterrupted electrical path to the service disconnect. This includes wire or conduit carrying the power supply conductors.

The National Electrical Code Article 250-83 (1993), paragraph c, defines the material and installation requirements for grounding electrodes.

The National Electrical Code Article 250-91 (1993), paragraph a, defines the material requirements for grounding electrode conductors.

The National Electrical Code Article 250-92 (1993), paragraph a, provides installation requirements for grounding electrode conductors.

The National Electrical Code Article 250-95 (1993) defines the size requirements for equipment grounding conductors.

1-5 General Information Rev Jun/05

Page 10

ROC364 Instruction Manual

Proper grounding of the ROC helps to reduce the effects of electrical noise on unit operation and helps protect against lightning. Lightning Protection Modules are available to provide additional lightning protection for field wiring inputs and outputs. Refer to Appendix A for information about lightning protection. A surge protection device installed at the service disconnect on line-powered systems also offers lightning and power surge protection for the installed equipment.

Telephone surge protectors should be installed for ROC units using modem communications cards. All earth grounds must have an earth-to-ground rod or grid impedance of 25 ohms or less as measured

with a ground system tester. The grounding conductor should have a resistance of 1 ohm or less between the ROC enclosure ground lug and the earth ground rod or grid.

1.4.6 I/O Wiring Requirements

I/O wiring requirements are site and application dependent. Local, state, and NEC requirements determine the I/O wiring installation methods. Direct buried cable, conduit and cable, or overhead cable are options for I/O wiring installations. Refer to Section 2, Master Controller Unit, I/O Module Rack, and Wiring, and Section 3, Input/Output Modules.

1.5 Power Supply Requirements

The power consumption of a ROC and related devices determines the requirements for either line or solar power supplies. Table 1-1 and Table 1-2 provide information to assist in determining power supply requirements.

Table 1-1 lists the power consumption of the ROC364 and the optional devices available for it. Include in the power consumption calculations of all device relays, meters, solenoids, radios, and other devices that receive DC power from the ROC (excluding those connected to the I/O modules). Table 1-2 lists the power consumption of the various I/O modules available.

A ROC systems power consumption determines power supply and battery size for both line and solar power supplies. Use the information in Table 1-1 and Table 1-2 to determine power requirements.

For non-analog I/O, size the I/O module scaling resistors for optimal current to minimize current drain on the power supply. Refer to Section 3.

1.5.1 Determining I/O Channel Power Consumption

To determine the I/O Channel Power:

1. Calculate the Duty Cycle of each I/O channel and enter the values in Table 1-1.

In estimating total I/O power requirements, the Duty Cycle of each I/O channel (built-in I/O or modular I/O) must be estimated.

For a non-analog I/O channel, the Duty Cycle is the percentage of time that the I/O channel is active (maximum power consumption). For example, if a Discrete Output is active for 15 seconds out of every 60 seconds, the Duty Cycle is:

Duty Cycle = Active time ÷ (Active time + Inactive time) = 15 sec ÷ 60 sec = 0.25



NOTE: For non-analog I/O, size the I/O module scaling resistors for optimal current to

minimize current drain on the power supply.

1-6 General Information Rev Jun/05

Page 11

ROC364 Instruction Manual

For an analog I/O channel, the Duty Cycle is approximated by estimating the percentage of time the channel spends in the upper half of its range (span) of operation. For example, if an Analog Input wired as a current loop (4 to 20 milliamps) device operates in the upper half of its range 75% of the time, then 0.75 would be used as the Duty Cycle. If the analog channel generally operates around the midpoint of its span, use 0.5 as the Duty Cycle.

2. To calculate the total power consumed by an I/O channel, first select either the 12 Volt or 24

Volt column in Table 1-1 or Table 1-2 and read the minimum (P

consumption value from the table for the desired I/O channel.

3. Calculate the power consumption for a channel with the Duty Cycle using the following equation

taken into account:

) and maximum (P

min

max

) power

Power = (P

x Duty Cycle) + [P

max

(1 – Duty Cycle)]

min

4. Multiply this value by the quantity (QTY) of I/O channels with the same Duty Cycle and enter

the calculated value in the Sub-Total column.

5. Repeat the procedure for all other I/O channels used.

6. Total the values in the I/O Modules Sub-Total column in Table 1-2.

7. Enter the I/O Modules Total value in Table 1-1.

8. Calculate the Radio Power Consumption total. Refer to Section 1.5.2, Determining Radio

Power Consumption, on page 1-8.

9. Enter the Radio Power Consumption Total value in Table 1-1.

10. Calculate Total power consumption in Table 1-1.

11. Add the power consumption (in mW) of any other devices used with the ROC in the same

power system, but not accounted for in the tables to the Total power consumption value in Table 1-1. Refer to Section 1.5.3, Totaling Power Requirements, on page 1-9.

Table 1-1. Power Consumption of the ROC364 and Powered Devices

Power Consumption (mW)

Device

MCU and I/O Module Rack 915 1705 1 N/A I/O Converter Card1 230 N/A N/A Local Display Panel 25 25 N/A Serial Communications Card 135 135 N/A Dial-up Modem Card 395 395 N/A Leased Line Modem Card 110 110 N/A Radio Modem Card 110 110 N/A I/O Modules Total from Table 1-2 N/A N/A N/A Radio (Section 1.5.2) N/A N/A N/A

NOTE: 1. The power drawn by field devices connected to I/O modules is included in the P

1-2.

12 Volt 24 Volt

min

max

min

max

TOTAL

QTY

Duty

Cycle

figures in Table

max

SubTotal (mW)

1-7 General Information Rev Jun/05

Page 12

ROC364 Instruction Manual

Table 1-2. Power Consumption of the I/O Modules

Power Consumption (mW)

I/O Module

12 Volt 24 Volt

min

max

min

max

QTY

Duty

Cycle

AI Loop 170 495 170 495 AI Differential 75 75 75 75 AI Source 110 305 130 470 AO Source 145 585 145 585 RTD Input: P

(–58°F); P

is at –50°C

min

is at 100°C (212°F)

max

240 475 475 930

DI Isolated 1 10 1 10 DI Source 1 55 1 205 PI Isolated 1 30 1 30 PI Source 1 70 1 230 Low Level PI 1 45 1 45 SPI Isolated 1 10 1 10 SPI Source 1 55 1 205 DO Isolated 1 25 1 25 DO Source (P

is at 57 mA) 30 815 30 1585

max

DO Relay 12 Volts 20 420 N/A N/A DO Relay 24 Volts N/A N/A 20 470 HART Interface Module 85 685 85 1285

I/O MODULES TOTAL

NOTES: 1. For analog I/O channels, the Duty Cycle is the percent of time spent in the upper half of the

operating range.

2. The P

amount includes any power drawn by a ROC-powered field device such as a

max

transmitter.

Sub-

Total

(mW)

1.5.2 Determining Radio Power Consumption

In determining power requirements for radios:

1. Estimate the Duty Cycle for the radio.

The Duty Cycle is the percentage of time the radio is transmitting (TX). For example, if a radio is transmitting 1 second out of every 60 seconds, and for the remaining 59 seconds the radio is drawing receive (RX) power, the Duty Cycle is:

Duty Cycle = TX time ÷ (TX time + RX time) = 1 sec ÷ 60 sec = 0.0167

2. Calculate the total power consumed by a radio, obtain the power (P) consumption values for

transmit and receive from the radio manufacturer’s literature, then use the following equation to calculate the power consumption for a particular Duty Cycle:

Power = (P

3. Determine the power consumption for all radios that use power from the ROC, and enter the total

calculated value in the Sub-Total column in Table 1-1.

1-8 General Information Rev Jun/05

x Duty Cycle) + [PRX (1 – Duty Cycle)]

Page 13

ROC364 Instruction Manual

1.5.3 Totaling Power Requirements

To adequately meet the needs of the ROC system, it is important to determine the total power consumption to size the solar panel and battery backup requirements accordingly. For total power consumption, add the device values in Table 1-1.

Although Table 1-1 and Table 1-2 take into account the power supplied by the ROC to its connected devices, be sure to add the power consumption (in mW) of any other devices used with the ROC in the same power system, but not accounted for in the tables.

Convert the total value (in mW) to Watts by dividing it by 1000. mW ÷ 1000 = Watts For selecting an adequate power supply, use a safety factor (SF) of 1.25 to account for losses and other

variables not factored into the power consumption calculations. To incorporate the safety factor, multiply the total power consumption (P) by 1.25.

P To convert P

= P x 1.25 = _____ Watts

to current consumption in amps (ISF), divide PSF by the system voltage (V), either 12

volts or 24 volts. I

= PSF / V = _____ Amps

1.6 Startup and Operation

Before starting up the ROC, perform the following checks to ensure the unit is properly installed.

♦ Make sure the enclosure has a good earth ground. ♦ Make sure the MCU is grounded at the power input connector. ♦ Make sure all I/O module racks are grounded at the GND screw. ♦ Make sure the MCU and I/O module racks are secured to the factory backplate. ♦ Ensure FlashPAC modules are seated in their connectors. ♦ Seat and secure all I/O modules in their sockets. ♦ Check the field wiring for proper installation. ♦ Make sure the input power has the correct polarity. ♦ Make sure the input power is fused at the power source.

Check the input power polarity before turning on the power switch. Incorrect polarity can damage the ROC.

When installing units in a hazardous area, ensure that the components selected are labeled for use in such areas. Change components only in an area known to be non-hazardous. Performing these procedures in a hazardous area could result in personal injury or property damage.

1-9 General Information Rev Jun/05

Page 14

ROC364 Instruction Manual

 NOTE: For proper startup, the minimum input voltage level must be 12.5 volts or more for a 12-

volt unit, and 25 volts or more for a 24-volt unit. Once the ROC364 has been successfully started, the ROC continues to operate normally over the specified input voltage range. If you are unsure of the input voltage setting for your ROC, refer to the paragraphs on setting the input voltage jumpers in Section 2.

1.6.1 Startup

Apply power to the ROC364 by plugging in the power terminal block. The Power indicator should light to indicate that the applied voltage is correct. Then, the System Status indicator should light, and stay lit, to indicate a valid reset sequence has been completed. After internal checks have been completed, both AUX PWR indicators should light. The startup sequence may take up to 5 seconds. If any of the indicators do not light, refer to the Troubleshooting details in Section 2 for possible causes.

1.6.2 Operation

Once startup is successful, configure the ROC to meet the requirements of the application. The appropriate ROCLINK configuration software user manual describes in detail the procedure for configuring the ROC. Once the ROC is configured and I/O is calibrated, it can be placed into operation.

Local configuration or monitoring of the ROC through its Operator Interface must be performed only in an area known to be non-hazardous. Performance of these procedures in a hazardous area could result in personal injury or property damage.

The ROC can be operated from a host system using ROCLINK configuration software. Consult with your local sales representative for more information on host system compatibility.

1.6.2.1 Local Display Panel

The Local Display Panel (LDP) is an ASCII terminal with a 4-line by 20-character Liquid Crystal Display (LCD) and a 4-key keypad. Refer to Appendix B, Liquid Crystal Display (LCD).

1-10 General Information Rev Jun/05

Page 15

ROC364 Instruction Manual

SECTION 2 – MASTER CONTROLLER UNIT, I/O MODULE

RACK, AND WIRING

2.1 Scope

This section describes the core of the ROC364 components, including the Master Controller Unit (MCU), the FlashPAC module, wiring, the I/O Module rack, the backplate, and the front panel. Topics covered include:

Section

2.2 Product Description 2-1

2.3 Installation 2-7

2.4 Connecting the MCU to Wiring 2-9

2.5 Troubleshooting and Repair 2-12

2.6 ROC364 Specifications 2-20

Page

2.2 Product Description

The following subsections describe components of the ROC364 including the Master Controller Unit, FlashPACs, Diagnostic Analog Inputs, Auxiliary Discrete Outputs, I/O Module Rack, and Backplate.

2.2.1 Master Controller Unit

The Master Controller Unit (MCU) is the “brain” of the ROC. Figure 2-1 displays MCU. The MCU consists of:

♦ NEC V25+ microprocessor. ♦ I/O converter card connector. ♦ On-board memory. ♦ I/O module rack connector. ♦ FlashPAC module sockets. ♦ Diagnostic Analog Inputs. ♦ Operator Interface port. ♦ Auxiliary Discrete Outputs. ♦ Local Display port. ♦ Status indicators. ♦ Communications ports. ♦ Metal housing. ♦ Power fusing and terminations.

2-1 Master Controller Unit, I/O Module Rack, and Wiring Rev Jun/05

Page 16

ROC364 Instruction Manual

C A P H S A

L F

ROC

REMOTE OPERATIONS CONTROLLER

C A P H S A L F

SYSTEM STATUS

DC PWR IN

AUX PWR OUT 1

POWER 2A S.B., 32 VDC

AUX OUT 1 5A, 32 VDC

AUX OUT 2 5A, 32 VDC

GND

MEMORY EXPANSION

POWER AUX OUT 1 AUX OUT 2

AUX PWR

OUT 2

321

OPERATOR INTERFACE

RAM

COM2 COM1

DISPLAY

DOC0119A

Figure 2-1. Master Controller Unit

The NEC V25+ is a 16-bit Complementary Metal Oxide Semiconductor (CMOS) microprocessor featuring dual 16-bit internal data buses and a single 8-bit external data bus. The ROC364 can address up to one megabyte of memory and features high-speed direct memory access.

The on-board memory on the MCU includes 128 kilobytes of battery-backed, random access memory (RAM) for storing data and 32 kilobytes of electrically erasable programmable read only memory (EEPROM) for storing configuration parameters. Plug-in sockets are provided for the FlashPAC module. The ROC requires a FlashPAC to operate.

The Operator Interface connector provides direct communications between the ROC and the serial port of an operator interface, such as a laptop, to provide access to the functionality of the ROC.

The Display connector links the MCU to an optional Local Display Panel (LDP), also called a Liquid Crystal Display (LCD) panel. The LDP provides local monitoring of I/O and database parameters using ROCLINK configuration software. Limited editing of parameter values can be performed with the LDP, including a reset of the ROC. Refer to Appendix B, Resetting the ROC Using the LDP.

The communications connectors labeled COM1 and COM2 allow access to two optional communications cards installed on the MCU board. The cards can provide serial data communications, modem, radio modem, or leased-line modem communications.

The I/O Converter Card connector accommodates the optional I/O Converter Card, which provides 24volt transmitter power in 12-volt systems. The connector uses a jumper when the converter card is not installed. Refer to Section 5.

The I/O module rack connector provides the connection point for the first I/O module rack. Up to three additional I/O module racks are installed by plugging into a connector on the previous I/O rack.

2-2 Master Controller Unit, I/O Module Rack, and Wiring Rev Jun/05

Page 17

ROC364 Instruction Manual

Power fusing is accessible from the front of the MCU. Fuses are used for the input power and auxiliary power outputs. Terminal blocks provide terminations for the input and auxiliary output power. The source of auxiliary power is the input power, which can be a nominal 12 or 24 volts, depending on the setting of jumpers located on the MCU. Refer to Section 2.3.3, Setting Voltage Jumpers in the MCU, on page 2-8.

Indicators are provided for System Status, ROC Power, and auxiliary power (AUX OUT 1 and AUX OUT 2). Refer to Section 2.5.1, LED Indicators, on page 2-12.

The MCU is housed in a metal case that protects the electronics from physical damage. For protection from outdoor environments, the unit must be housed in an approved enclosure.

2.2.2 FlashPAC Module

The FlashPAC module contains the operating system, the applications firmware, and communications protocol, as well as memory storage for history logs and user programs. A FlashPAC module contains 512 kilobytes of flash read-only memory (ROM) and 512 kilobytes of battery-backed Static Random Access Memory (SRAM). A FlashPAC module is required for the ROC to operate. Back-up power for the RAM is provided by a self-contained lithium battery. Figure 2-2 shows a FlashPAC module.

The applications firmware consists of functions contained in flash ROM such as:

♦ AGA3 (1985 and 1992 algorithms) and AGA7 Flow Calculations, with metric conversion. ♦ PID (Proportional, Integral, and Derivative) Loop Control. ♦ Support for Function Sequence Tables (FSTs). ♦ Communications Enhancement (dial-up Spontaneous-Report-by-Exception (SRBX) alarming). ♦ Local Display Panel Enhancement (database point monitoring along with configuration access). ♦ Radio Power Control (FlashPAC Version 2.1 or greater).

FLASHPAC

W20217X0012 ROC300 SERIES

------------VER: 2.10 PATENT 5339425

DOC0292A

Figure 2-2. Typical FlashPAC Module

2-3 Master Controller Unit, I/O Module Rack, and Wiring Rev Jun/05

Page 18

ROC364 Instruction Manual

The firmware is programmed into flash memory at the factory, but can be reprogrammed in the field. The application programs are configured by using ROCLINK configuration software including user programs, such as the Modbus communications protocol.

When used with ROCLINK configuration software, a FlashPAC module can save a configuration to disk as an .FCF file and later restore these configuration files into a ROC.

The RAM in a FlashPAC can store 87 history points, each holding 35 days of hourly values. Besides storing history data, the RAM in a FlashPAC stores user program data. The flash ROM portion of the FlashPAC is programmed with firmware at the factory and can store user programs downloaded through a communications port.

Table 2-1, ROC Memory Map, on page 2-4 shows how the ROC memory is allocated. Each memory location range (for example, 00000 to 1FFFF) represents 128 kilobytes of memory.

Determining FlashPAC Version

To determine the version of a FlashPAC, use ROCLINK configuration software. Select ROC > Information > Other Information > Version Name, which contains the part and version numbers.



NOTE: The version may have been updated by a download of upgrade firmware into the module,

so the label on the actual FlashPAC module might not be accurate.

Table 2-1. ROC Memory Map

Memory Location FlashPAC Usage

00000 to 1FFFF Base RAM Alarm Log, Event Log, and such. 20000 to 3FFFF RAM in FlashPAC History Data Area, part is for scratch-pa d memory in FlashPAC 40000 to 5FFFF RAM in FlashPAC History Data Area 60000 to 7FFFF RAM in FlashPAC History Data in FlashPAC 80000 to 81FFF EEPROM (on-board) User Configuration Data 88000 to 9FFFF Flash ROM Operating System and Applications A0000 to BFFFF RAM in FlashPAC User Program Data in FlashPAC C0000 to DFFFF Flash ROM User Program Code in FlashPAC E0000 to FFFFF Flash ROM Operating System Firmware

2.2.3 Diagnostic Inputs and Auxiliary Outputs

The ROC364 MCU monitors the power input voltages, transmitter output volt age, and the board temperature with diagnostic Analog Inputs designated as “E” points by the configur ation software. The in puts can b e calibrated by using ROCLINK configuration software. Two auxiliary Discrete Outputs are also available.

The diagnostic Analog Inputs and auxiliary Discrete Outputs are:

♦ Transmitter supply output voltage – Point Number E1. ♦ Power input voltage – Point Number E2. ♦ Auxiliary Discrete Output #1 – Point Number E3. ♦ Auxiliary Discrete Output #2 – Point Number E4. ♦ MCU board temperature – Point Number E5.

2-4 Master Controller Unit, I/O Module Rack, and Wiring Rev Jun/05

Page 19

ROC364 Instruction Manual

2.2.4 I/O Module Rack

The I/O module rack provides sockets for up to 16 I/O modules. Refer to Figure 2-3. Up to 64 I/O modules can be used in any combination of Discrete Inputs, Discrete Outputs, Analog Inputs, Analog Outputs, and Pulse Inputs. A minimum of one rack is required for any ROC connected to field I/O, and a maximum of four racks can be accommodated. The first rack plugs directly into the I/O module rack connector on the bottom edge of the MCU. Additional racks plug into each other.

MODULE RACK

ABC CBACBACBACBACBACBACBAABCABCABCABC CBACBACBACBA

914

Figure 2-3. I/O Module Rack

GNDGND

DOC0030C

2-5 Master Controller Unit, I/O Module Rack, and Wiring Rev Jun/05

Page 20

ROC364 Instruction Manual

2.2.5 Backplate

The ROC364 backplate is a mounting panel for an MCU and one or more I/O module racks. Backplates are available in three sizes to accommodate the indicated number of I/O racks: one rack, two racks, and three or four racks. Refer to Figure 2-4 for dimensions of the various backplates.

DIM D

DIM B

DIM C

DIM A

DIM E

DIM F

DIM

A 12.40 11.60 11.25 B 11.34 21.46 28.58 C 13.34 13.00 12.25 D 13.12 22.26 29.38 E 3.94 3.94 4.06 F .38 .38 .50 G NO.10 5/16 5/16

DIM = Dimensions in inches

Maximum I/O Points

16 32 64

DOC0243A

Figure 2-4. Backplate and Mounting Dimensions

2-6 Master Controller Unit, I/O Module Rack, and Wiring Rev Jun/05

DIM G MOUNTING STUD SIZE

Page 21

ROC364 Instruction Manual

2.3 Installation

Component installation is normally performed at the factory when the ROC is ordered. However, the modular design of the ROC makes it easy to install and to change hardware configurations in the field as required. The following procedures describe installation of a ROC.

If you are installing the ROC364 into a ROC enclosure, fasten the backplate to the mounting studs or tapped mounting holes provided in the enclosure. If you installing the ROC364 on a wall panel or in some other enclosure, refer to Figure 2-4 for the recommended size and location of mounting studs.

For ROC364 units that are currently in service, you must take certain precautions to ensure data is not lost, equipment is not damaged, and personnel are not exposed to electrical hazards. Refer to Section

2.5, Troubleshooting and Repair, on page 2-12.

To add I/O modules, refer to Section 3. To add a communications card, refer to Section 4. To install accessories for use with the ROC, refer to the ROC/ROC Accessories Instruction Manual (Form A4637).

2.3.1 Mounting the Master Controller Unit to a Backplate

The Master Controller Unit (MCU) and I/O module rack(s) mount to a factory-supplied backplate, which can be mounted inside an enclosure. The backplates are pre-drilled and tapped to accept the MCU and one to four I/O module racks. Refer to Figure 2-4.

Equipment and Tools Required: Flat-blade (1/8-inch wide) screwdriver To mount the MCU to a backplate:

1. Make sure the proper size backplate is being used for the number of I/O module racks

to be installed.

2. Locate the alignment screws on the backplate and place the keyhole slots, located on the base of

the MCU, over the screw heads.

3. Slide the MCU over the alignment screws and secure in place with two 8-32 × 1 inch and

two 8-32 × 2.25 inch screws.

2-7 Master Controller Unit, I/O Module Rack, and Wiring Rev Jun/05

Page 22

ROC364 Instruction Manual

2.3.2 Mounting an I/O Module Rack to a Backplate

Each I/O module rack has a male and female connector on opposite sides of the rack. The first I/O module rack plugs directly into the MCU I/O module rack connector. Additional racks plug into each other.

Equipment and Tools Required: Flat-blade (1/8-inch wide) screwdriver To mount one or more I/O module racks to a backplate:

1. Insert the connector located on the edge of the first rack into the mating connector of the MCU.

2. Align the rack with the mounting holes in the backplate and secure in place with five 6-32 × 0.75

inch machine screws. Refer to Figure 2-4.

3. If a second rack is required, insert the edge connector of the second rack into the edge connector

of the first rack.

4. Align the rack with the mounting holes in the backplate and secure in place with five 6-32 × 0.75

inch machine screws.

2.3.3 Setting Voltage Jumpers in the MCU

The MCU board contains a set of three jumpers to select the nominal input voltage of either 12 or 24 volts. The factory default setting is for 12-volt operation.

Equipment and Tools Required: None To access the jumpers, proceed as follows:

1. Remove the screws holding the upper MCU cover in place, and lift off the cover.

2. Unplug any terminal blocks, connectors, and FlashPACs.

3. Remove the two screws securing the lower MCU cover, and lift off this cover as well.

4. Position ALL jumpers P1, P2, and P3 in either the 12-volt or 24-volt position, depending on the

nominal value of the ROC input voltage. The jumpers are located just to the right of the Power Status indicators.



NOTE: The 12 and 24 volt designations indicate nominal voltage values only. When

connected for 12-volt operation, the actual input voltage required for the ROC to start up is

12.5 volts dc. Once powered up, the minimum voltage required to sustain operation (lowvoltage cut-off) is 10.8 volts dc. Likewise, when connected for 24-volt operation, the start-up voltage required is 25 volts dc, and the low-voltage cut-off is 21.4 volts dc.

5. Replace the covers, screws, connectors, and FlashPAC.

2-8 Master Controller Unit, I/O Module Rack, and Wiring Rev Jun/05

Page 23

ROC364 Instruction Manual

2.3.4 Installing a FlashPAC Module

Use the following procedure to add a FlashPAC module. This procedure assumes the first-time installation of a FlashPAC module in an out-of-service ROC. For an in-service ROC, refer to the Section

2.5.10, Replacing a FlashPAC, on page 2-16.

Equipment and Tools Required: None

When working on units located in a hazardous area (where explosive gases may be present), make sure the area is in a non-hazardous state before performing these procedures. Performing these procedures in a hazardous area could result in personal injury or property damage.

1. Remove the FlashPAC module retainer by unscrewing the two thumbscrews and sliding the

retainer straight out.

2. Remove and discard the foam insert that blocks the unused slot in the retainer.

Before installing a FlashPAC module, make sure the module connector pins are not bent. Bent pins can damage the mating connector. Do not attempt to straighten bent pins; instead, replace the module.

3. Align the key on the module socket with the key of the MCU socket; in this position, the “F” of

“FlashPAC” on the label should be closest to the I/O terminals.

4. Carefully insert the module in the socket and press it in firmly, but gently to seat the module. The

module should move inward slightly. Verify that the module is seated in the connector by gently lifting up on the module. If it comes out easily, repeat the process.

5. Carefully position the retainer over the FlashPAC, and tighten the thumbscrews. Make sure that

the sloped surface of the retainer is down.

2.4 Connecting the MCU to Wiring

The following paragraphs describe how to connect the ROC to power, ground, and communications wiring. For connections to I/O modules, refer to Section 3. To wire a communications card, refer to Section 4.

The power and I/O wiring terminal blocks accept up to 12-gauge AWG solid or stranded copper wire.

 NOTE: Use a standard screwdriver with a slotted (flat bladed) 1/8-inch width tip when wiring all

terminal blocks.

2.4.1 Connecting Ground Wiring

Equipment Required: Flat-blade (1/8-inch wide) screwdriver The ROC and related components must be connected to earth ground. These include the MCU,

I/O module racks, system I/O devices, and the system power source. Each component connects to earth ground (typically an enclosure ground bar) using the grounding screw provided. The components should be linked using an 18 AWG or greater conductor. The earth ground wire from the ROC enclosure ground bar to ground should be at least 12 AWG.

2-9 Master Controller Unit, I/O Module Rack, and Wiring Rev Jun/05

Page 24

ROC364 Instruction Manual

Ground wiring requirements are governed by the National Electrical Code (NEC) code or other applicable codes. Excerpts from the NEC code are contained in Section 1, General Information.

For the ROC, connect the GND terminal on the power connector (Figure 2-5) to the enclosure ground with 12 AWG wire. The enclosure ground must be connected to an appropriate ground rod or grid.

2.4.2 Connecting Main Power Wiring

Equipment Required: Flat-blade (1/8-inch wide) screwdriver Power connections to the ROC are made at the Master Controller Unit (MCU) through plug-in terminal

blocks. Refer to Figure 2-5. It is important good wiring practice be used when sizing, routing, and connecting power wiring. All wiring must conform to state, local, and NEC codes.

The power terminal blocks can accommodate a wide range of wire gauges up to 12 AWG. Use 18 AWG

wire or larger for all power wiring. Use the DC PWR IN +/– terminals to connect the ROC to a DC power source. Before making

connections, make sure the voltage selection jumpers are in the proper position for the voltage being used, and the hook-up polarity is correct. Refer to Section 2.3.3, Setting Voltage Jumpers in the

MCU, on page 2-8. The input power (DC PWR IN +/–) is fused at 2 amps by slow-blow fuse (F1), which is accessible

through the front panel and by a 3-amp fuse located on the MCU board. Refer to Section 2.5.3, Replacing Fuses, on page 2-14.

GND

AUX PWR OUT 2

DOC0123A

DC PWR IN

AUX PWR OUT 1

Figure 2-5. Power Wiring Connections

2.4.3 Connecting Auxiliary Power Wiring

The AUX PWR OUT 1 and AUX PWR OUT 2 terminals provide switched power from the DC PWR IN terminals to an external device, such as a radio. The AUX PWR OUT 1 and 2 terminals are switched independently of each other under software control. Both sets of terminals are disabled if the watchdog timer times out. The watchdog timer resets the system when power voltage is not met or exceeds the limitations of the ROC. The two sets of AUX PWR OUT 2 terminals are internally connected in parallel. The output voltage and current supplied by these terminals is specified in Section 2.6, ROC364 Specifications, on page 2-20.

2-10 Master Controller Unit, I/O Module Rack, and Wiring Rev Jun/05

Page 25

ROC364 Instruction Manual

The switches employed in the auxiliary outputs are solid-state relays and exhibit a voltage drop proportional to the current load, typically in the range of 0 to 2 volts dc. The relays can be controlled automatically using an FST that has been set up to determine the switching conditions. If a FlashPAC is installed, the auxiliary outputs are switched by using the Status parameter of Discrete Output Point Number E3 or E4. An LED indicator for each output is activated when the respective output is energized.

The AUX PWR OUT 1 and AUX PWR OUT 2 terminals are fused at 5 amps by fuses F2 and F3, which are accessible on the front panel. Refer to Section 2.5.3, Replacing Fuses, on page 2-14.

2.4.4 Connecting Communications Wiring

The ROC has the flexibility to communicate to external devices using several different formats and protocols. Connectors located on the front panel of the ROC provide both Operator Interface and data communications.

The Local Operator Interface (LOI) connector is a serial EIA-232 (RS-232) port for communications to a configuration and monitoring device. This device is typically a personal computer. A null modem cable (wires to pins 2, 3, and 5, with the wires between pins 2 and 3 cross-connected) is normally used between the Operator Interface connector and the PC. Figure 2-6 shows the wiring for this port.

Figure 2-6. Operator Interface Connector Wiring Schematic

The Display connector is a parallel port for dedicated communications to an optional Local Display Panel. The cable supplied with the Local Display Panel plugs into this connector. Refer to Appendix B.

Two data communications ports, labeled COM1 and COM2 on the front of the MCU, are activated through optional plug-in communications cards. Section 4 details the types of communications cards available and has information on connecting wiring to the COM1 and COM2 connectors.

2-11 Master Controller Unit, I/O Module Rack, and Wiring Rev Jun/05

Page 26

ROC364 Instruction Manual

2.5 Troubleshooting and Repair

The troubleshooting and repair procedures help identify and replace faulty boards, fuses, and FlashPACs. Refer to Section 3 for troubleshooting I/O modules or Section 4 for troubleshooting and replacing a communications card. Return faulty boards and FlashPACs to your local sales representative for repair or replacement.

The following tools are required for troubleshooting:

♦ IBM-compatible personal computer. ♦ ROCLINK configuration software. ♦ Digital multimeter, Fluke 8060A or equivalent.

2.5.1 LED Indicators

The Light-emitting diode (LED) indicators, located on the front panel of the MCU, give a first-level indication of the operation of the ROC. Figure 2-7 shows the location of the indicators and Table 2-2 describes them.

The primary indicator that the MCU is operating normally is the System Status indicator. This indicator should light within a few seconds after power is applied, and then remain lit. If the System Status indicator does not remain lit, refer to Table 2-2 for possible causes.

SYSTEM STATUS

POWER

UX OUT 1 UX OUT 2

Figure 2-7. MCU Status Indicators

DOC0122A

2-12 Master Controller Unit, I/O Module Rack, and Wiring Rev Jun/05

Page 27

ROC364 Instruction Manual

Table 2-2. MCU LED Indicators

Indicator LED Meaning

On Power is applied to the MCU.

MCU does not have power. Possible causes are:

♦ Power not present at power terminals.

POWER

SYSTEM

STATUS

AUX OUT 1

AUX OUT 2

Off

On Successful startup and the processor is running.

Blinking

Off On System voltage is present at the AUX PWR OUT 1 terminals.

Off Fuse F2 is open or the output has been disabled by the software. On System voltage is present at the AUX PWR OUT 2 terminals. Off Fuse F3 is open or the output has been disabled by the software.

♦ Power switch is off if so equipped (older units only). ♦ Defective power switch (older unit s only). ♦ Fuse F1 is open. ♦ Fuse F4 is open. ♦ Polarity reversed.

♦ Processor is not running and the controller is attempting to restart. ♦ Possible low battery or bad FlashPAC.

If the POWER indicator is on, indicates insufficient voltage is available to power up the MCU.

2.5.2 RAM Backup Procedure using ROCLINK Configuration Software

Before removing power to the ROC, perform the following procedure to avoid losing the ROC configuration and other data stored in RAM.

User programs cannot be saved out of the ROC. Reload user programs from their original disk files as instructed in the ROCLINK for Windows Configuration Software User Manual (Form A6091) or the ROCLINK 800 Configuration Software User Manual (Form A6121).

When installing devices in a hazardous area, make sure each device is labeled for use in such areas. Procedures involving switching power on or off, or procedures for installing or removing any wiring or components, must be performed only when the area is known to be non-hazardous. Performance of these procedures in a hazardous area could result in personal injury or property damage.

To avoid circuit damage when working with the ROC, use appropriate electrostatic discharge precautions, such as wearing a grounded wrist strap.

1. Save the current configuration data by selecting ROC > Flags > Write to EEPROM or Flash

Memory Save Configuration. This action saves most of the ROC configuration (but not logs or

FST programs) into the permanent memory accessed when a Cold Start is performed.

2. Save the current configuration data to disk by using the Download > Save ROC Configuration

To Disk function. When replacing or upgrading a FlashPAC, the only way to preserve

configuration data is to save the data to disk and then retrieve the information after the FlashPAC is installed.

2-13 Master Controller Unit, I/O Module Rack, and Wiring Rev Jun/05

Page 28

ROC364 Instruction Manual

3. Save all historical database logs (Minute, Hourly, and Daily), Event Log, and Alarm Log to disk

using ROC > Collect Data “All” function as explained in the applicable ROCLINK configuration software user manual.

4. Save the FSTs to disk using Utilities > FST Editor > FST > Write function in the FST Editor.

Refer to the FST Editor in the applicable configuration software user manual.

2.5.3 Replacing Fuses

The types of fuses used for the ROC364 and their rating values are listed in Table 2-3.

Table 2-3. ROC Fuses

Fuse Rating Use

F1 2 A, 32 Volt Slow Blow Main Power Input F2 5 A, 32 Volt Fast Acting Auxiliary Power Output 1 F3 5 A, 32 Volt Fast Acting Auxiliary Power Output 2 F4 3 A, Bussman GFA 3 Main Power Input (Safety)

Fuses F1, F2, and F3 are accessible from the MCU front panel. Fuse F4 is lo cated o n the MCU board and is accessible only by removing the upper MCU cover. In most cases, a visual inspection of the fuses indicate if they are open (blown). If in doubt, use a digital multimeter to check for continuity.

To remove fuses F1, F2, or F3 for inspection or replacement, proceed as follows:

1. Disconnect the ROC from its power source.

2. Insert a screwdriver into the slot in the fuse holder cap and rotate counterclockwise 1/4 turn.

3. Remove the screwdriver. The cap and fuse will spring out. Remove the fuse from the cap.

Reverse steps 1, 2, and 3 to install the fuse. Fuse F4 is soldered to the MCU board. Removal and replacement of fuse F4 is normally performed at

the factory, since it requires removal of the MCU board from its housing. Refer to Section 2.5.12, Removing and Replacing the MCU Assembly, on page 2-19.

2.5.4 Verifying Battery Voltage

Equipment Required: Voltmeter The on-board RAM and the real-time clock receive backup power from Battery B1. Battery B1 is a 3.6-

volts lithium battery, with an expected life of 5 to 10 years. If the ROC is powered down for extended periods, this may shorten the life of the battery. In older ROC units, Battery B1 is soldered onto the main circuit board.

A blinking Status LED may be an indication of a bad battery. To check the battery voltage:

1. Remove power from the ROC.

2. Remove the FlashPAC module as described in Section 2.5.10 on page 2-16.

3. Remove the cover.

4. Remove the communications cards if necessary.

2-14 Master Controller Unit, I/O Module Rack, and Wiring Rev Jun/05

Page 29

ROC364 Instruction Manual

5. Remove the battery located at B1 on the top right of the MCU.

6. Measure the voltage of the terminals of the removed battery.

7. If the voltage reading is less than 3.6 volts, the battery must be replaced. Refer to Section 2.5.11,

Replacing the Battery, on page 2-18.

If the battery in soldered-in, replacement requires the removal of the MCU board from the housing, and then the MCU assembly should be returned to your local sales representative for this action. Refer to Section 2.5.12, Removing and Replacing the MCU Assembly, on page 2-19.

2.5.5 Verifying the ROC can Communicate with the PC

Equipment Required: Personal computer with ROCLINK configuration software installed To verify that the ROC is communicating with the PC running ROCLINK configuration software:

1. Connect the ROC to the PC and launch ROCLINK configuration software.

2. If the ROC is communicating with ROCLINK configuration software, COM1, COM2, COM3,

or COM4 displays in the lower right corner of the screen.

2.5.6 Verifying RAM

Equipment Required: Personal computer with ROCLINK configuration software installed. To detect bad RAM:

1. Connect the ROC to ROCLINK configuration software.

2. Select ROC > Information > Other Information tab and verify that RAM Installed is labeled

PRESENT.

The problem could be a bad backup battery or a bad solder joint of the RAM chip.

2.5.7 Performing a Warm Start

A Warm Start temporarily suspends all input/output (I/O) scanning. I/O processes are restarted from their last calculated values. A Warm Start clears and restarts all user-enabled flags. A Warm Start also starts all FSTs to the first instruction.



NOTE: If your ROC is semi-functional, refer to Section 2.5.2, RAM Backup Procedure, on page

2-13 before removing power from your ROC.

To perform a Warm Start using the configuration software:

1. Connect the ROC to the PC running ROCLINK configuration software.

2. Click ROC > Flags > Warm Start and click Apply.

To perform a Warm Start using the power option:

1. Remove power from your ROC.

2. Reapply power to the ROC.

2-15 Master Controller Unit, I/O Module Rack, and Wiring Rev Jun/05

Page 30

ROC364 Instruction Manual

2.5.8 Performing a Cold Start

A Cold Start allows you to reset your ROC based on the selected option.

 NOTE: If your ROC is semi-functional, refer to Section 2.5.2, RAM Backup Procedure, on page

2-13 before removing power from your ROC.

To perform a Cold Start:

1. Connect the ROC to ROCLINK configuration software.

2. Select ROC > Flags.

3. Select the Cold Start checkbox.

4. Click the Cold Start Options button.

5. Select the appropriate option and click OK.

2.5.9 Performing a Reset

When you have tried the previous methods for convincing your ROC to cooperate and all other troubleshooting procedures have failed, perform a reset before returning your ROC to the factory.

A reset returns the ROC’s configuration of I/O points, PID, AGA points, communication parameters, system variables, Opcode tables, ROC Displays, and LCD displays to their default values. This reset sets the FST run flags to zero, clears all Alarm and Event Logs, and clears all User Programs.



NOTE: If your ROC is semi-functional, refer to Section 2.5.2, RAM Backup Procedure, on page

2-13 before removing power from your ROC.

1. Connect your ROC to a computer running ROCLINK configuration software.

2. Select Utilities > Download User Programs or User Program Administrator.

3. Clear all user programs (Clear All) and click OK or Update.

4. Select ROC > Flags.

5. Select the Clear EEPROM checkbox or click Flash Memory Clear and click Apply.

6. Select the Cold Start checkbox.

7. Click the Cold Start Options button.

8. Select the Restore Config & Clear All of the Above (Cold Start & Clear All) radio button and

click OK.



NOTE: Refer to Appendix B, Resetting the ROC Using the LDP.

2.5.10 Replacing a FlashPAC

Equipment Required: Personal computer with ROCLINK configuration software installed A faulty FlashPAC module can be suspected if the:

♦ Status LED is blinking. ♦ Data is being corrupted.

2-16 Master Controller Unit, I/O Module Rack, and Wiring Rev Jun/05

♦ ROC is not communicating. ♦ RAM fails to show up in ROCLINK configuration software as

being installed.

Page 31

ROC364 Instruction Manual

To replace a FlashPAC module:

When repairing units in a hazardous area, change components only in an area known to be nonhazardous.

There is a possibility of losing the ROC configuration and historical data held in RAM while performing the following procedure. As a precaution, save the current configuration and historical data to permanent memory as instructed in Section 2.5.2, RAM Backup Procedure, on page 2-13.

During this procedure, all power is removed from the ROC and devices powered by the ROC. Ensure all connected input devices, output devices, and processes remain in a safe state when power is removed from the ROC and when power is restored to the ROC.

1. Back up your RAM to avoid losing data. Refer to Section 2.5.2, RAM Backup Procedure, on

page 2-13.

2. Remove power by unplugging the block on the power terminal block.

3. Lift up on the FlashPAC to be replaced and remove it from the socket.

Before installing a new FlashPAC module, make sure the FlashPAC connector pins are straight. Bent pins can damage the mating connector. Do not attempt to straighten bent pins; instead, replace the FlashPAC.

4. Align the key on the FlashPAC socket with the key of the MCU socket. Carefully insert the

FlashPAC module in the socket and press it in firmly, but gently to seat the FlashPAC. The FlashPAC should move inward slightly. Verify that the FlashPAC is seated into the connector by gently lifting up on the FlashPAC. If it comes out easily, repeat the process.

5. Slide the retainer over the FlashPAC module and tighten the thumbscrews. Make sure that the

sloped surface of the retainer is down.

6. Plug in the five-terminal connector to restore power. A Cold Start using EEPROM, Internal

Config Memory, or Flash Memory values automatically occurs and may take a few seconds.

7. Using ROCLINK configuration software, check the configuration data including ROC Displays

and FSTs, and load or modify them as required. In addition, load and start any user programs as needed.

8. Verify that the ROC performs as required.

9. If you changed the configuration, save the current configuration data to memory by selecting

ROC > Flags > Write to EEPROM or Flash Memory Save Configuration as instructed in the applicable ROCLINK configuration software user manual.

10. If you changed the configuration including the history database, ROC Displays, or FSTs, save

them to disk.

2-17 Master Controller Unit, I/O Module Rack, and Wiring Rev Jun/05

Page 32

ROC364 Instruction Manual

2.5.11 Replacing the Battery

This section details how to replace the ROC battery.

When repairing units in a hazardous area, change components only in an area known to be nonhazardous.

1. Back up your RAM to avoid losing data. Refer to Section 2.5.2, RAM Backup Procedure, on

page 2-13.

2. Remove power from the ROC at the power terminal plug in.

3. Remove the screws from the front cover of the ROC.

4. Remove the screw from the communications cards if necessary.

5. Remove the communications cards.

6. Remove the old battery from the other battery socket (B1) by sliding the hold-down clip to one

side and lifting the battery from the MCU board. If the clip does not readily rotate, you may need to loosen the screw that secures the hold-down clip.

7. Install the new battery and tighten the clip.

8. Replace the communications card.

9. Replace the communications card’s screw.

10. Replace the second communications card if necessary.

11. Replace the front cover and screws.

12. Reconnect power to the ROC by plugging in the power terminal connector.

13. Using ROCLINK configuration software, check the configuration data including ROC Displays

and FSTs, and load or modify them as required. In addition, load and start any user programs as needed.

14. Verify that the ROC performs as required.

15. If you changed the configuration, save the current configuration data to memory by selecting

ROC > Flags > Write to EEPROM or Flash Memory Save Configuration as instructed in the applicable ROCLINK configuration software user manual.

2-18 Master Controller Unit, I/O Module Rack, and Wiring Rev Jun/05

Page 33

ROC364 Instruction Manual

2.5.12 Removing and Replacing the MCU Assembly

Remove and replace the MCU assembly as instructed in the following procedure.

When repairing units in a hazardous area, change components only in an area known to be nonhazardous.

1. Unplug the power connector from the ROC.

2. Unplug all connectors and terminal blocks from the MCU.

3. Loosen the screws that secure the MCU case to the ROC backplate.

4. Move the MCU up to disengage it from the I/O module rack and to slide two keyhole slots in the

case backplate into position to fit over the heads of concealed alignment screws. Then lift the MCU away from the ROC backplate.

5. If you are reasonably sure the FlashPAC modules are functioning (keep in mind all RAM is

normally cleared during factory servicing), you can remove them by unscrewing the two thumbscrews of their retainer and gently pulling each one from its socket.

6. The MCU must be returned as an assembly (the MCU board must remain in the metal case) to

your local sales representative for repair. If the ROC is equipped with one or two communications cards, the cards can be removed if desired before returning the MCU assembly. Follow the applicable procedure in Section 4 for removing these cards.

7. To install a new or repaired MCU assembly, reverse the procedure used for removal in the

previous steps.

8. Reconnect power to the ROC by plugging in the power terminal block.

9. Using ROCLINK configuration software, check the configuration data including ROC Displays

and FSTs, and load or modify them as required. In addition, load and start any user programs as needed.

10. Verify that the ROC performs as required.

11. If you changed the configuration, save the current configuration data to memory by selecting

ROC > Flags > Write to EEPROM or Flash Memory Save Configuration as instructed in the applicable ROCLINK configuration software user manual. Also, if you changed the configuration including the history database, ROC Displays, or FSTs, save them to disk.

2-19 Master Controller Unit, I/O Module Rack, and Wiring Rev Jun/05

Page 34

ROC364 Instruction Manual

2.6 ROC364 Specifications

ROC364 Specifications

PROCESSOR MEMORY

NEC V25+ running at 8 MHz. On-Board: 128 KB battery-backed SRAM for data.

32 KB EEPROM for configuration. FlashPAC: Plug-in module with 512 KB Flash readonly memory (ROM) and 512 KB of battery-backed static RAM (SRAM). Memory Reset: Optional LDP permits a cold start initialization when used during power-up.

I/O CAPACITY

Up to 16 I/O channels per Module Rack. Up to 4 Module Racks (64 I/O channels) per MCU.

OPERATOR INTERFACE PORT

EIA-232D (RS-232D) serial format for use with portable operator interface. Baud is selectable from 300 to 19,200 bps. Asynchronous format, 7 or 8-bit (software selectable). Parity can be odd, even, or none (software selectable). 9-pin, female D-shell connector provided.

TIME FUNCTIONS

Clock Type: 32 kHz crystal oscillator with regulated

supply, battery-backed. Year/Month/Day and Hour/Minute/Second.

Clock Accuracy: 0.01%. Watchdog Timer: Hardware monitor expires after

1.2 seconds and resets the processor. Processor restart is automatic.

I/O POWER CONVERTER (OPTIONAL)

Input: 11 to 16 V dc, 15 mA with no load or shorted

output. Output: 22 to 24 V dc, up to 0.6 A for transmitter power.

ENVIRONMENTAL

Operating Temperature: –40° to 70°C (–40° to

158°F). Storage Temperature: –50° to 85°C (–58° to 185°F).

Operating Humidity: To 95%, non-condensing. Transient Protection: Meets IEEE C37.90.1-1989. EMI Immunity: Meets EN61000-4-5 Performance

Criterion B for Industrial Locations. EMI Emissions: Meets FCC 47 CFR, Part 15, Subpart J, Class A verified.

DIMENSIONS

MCU: 51 mm D by 203 mm H by 305 mm W (2 in.

D by 8 in. H by 12 in. W). Add 38 mm (1.5 in.) to depth dimension for memory modules. Module Rack: 13 mm D by 127 mm H by 305 mm D (0.5 in. D by 5 in. H by 12 in. W). MCU w/one Module Rack: 311 mm W by 356 mm H (12.25 in. W by 14 in. H). MCU w/two Module Racks: 311 mm W by 565 mm H (12.25 in. W by 22.25 in. H). MCU w/three or four Module Racks: 311 mm W by 743 mm H (12.25 in. W by 29.25 in. H).

DIAGNOSTICS

These values are monitored: real-time clock/system clock compare, AI module mid-scale voltage, DI module default status, AO module D/A voltage, DO module latch value, I/O transmitter voltage, power input voltage, MCU board temperature.

POWER REQUIREMENTS

11 to 16 V dc (12.5 V to start up) or 22 to 30 V dc (25 V to start up), jumper selectable. 1 Watt typical, excluding I/O power.

AUXILIARY OUTPUT POWER

Input power is software switched to two sets of auxiliary output power terminals. Each output fused for 5 A maximum. Output voltage is 0 to 2 V dc less than input voltage, depending on load.

2-20 Master Controller Unit, I/O Module Rack, and Wiring Rev Jun/05

WEIGHT

MCU: 2.3 kg (5 lbs) nominal. Module Rack: 0.5 kg (1 lb) nominal. Backplate: 1.4 to 3 kg (3 to 6.5 lbs).

ENCLOSURE

MCU metal chassis with 2-piece cover and Module Rack case meet NEMA 1 rating.

BACKPLATE

16 gauge steel.

APPROVALS

Approved by CSA for hazardous locations Class I, Division 2, Groups A, B, C, and D.

Page 35

ROC364 Instruction Manual

SECTION 3 – INPUT AND OUTPUT MODULES

3.1 Scope

This section describes the Input/Output (I/O) Modules used with the ROC364 Remote Operations Controller (ROC).

This section contains the following information:

Section

3.1 Scope 3-1

3.2 Product Descriptions 3-1

3.3 Initial Installation and Setup 3-5

3.4 Connecting the I/O Modules to Wiring 3-5

3.5 Troubleshooting and Repair 3-21

3.6 Removal, Addition, and Replacement Procedures 3-28

3.7 I/O Module Specifications 3-30

Page

3.2 Product Descriptions

The I/O modules plug into the ROC364 I/O module rack sockets and accommodate a wide range of process inputs and outputs. The I/O module rack provides sockets for up to 16 I/O modules. Up to 64 I/O modules can be used in any combination of Discrete Inputs, Discrete Outputs, Analog Inputs, Analog Outputs, and Pulse Inputs. A minimum of one rack is required for any ROC connected to field I/O, and a maximum of four racks can be accommodated. The first rack plugs directly into the I/O module rack connector on the bottom edge of the MCU. Additional racks plug into each other.

The following modules are available:

♦ Analog Input (AI) Loop ♦ Discrete Output (DO) Relay ♦ Analog Input (AI) Differential ♦ Pulse Input (PI) Source ♦ Analog Input (AI) Source ♦ Pulse Input (PI) Isolated ♦ Analog Output (AO) Source ♦ Slow Pulse Input (SPI) Source ♦ Discrete Input (DI) Source ♦ Slow Pulse Input (SPI) Isolated ♦ Discrete Input (DI) Isolated ♦ Low-Level Pulse Input (LLPI) ♦ Discrete Output (DO) Source ♦ Resistance Temperature Detector (RTD) Input ♦ Discrete Output (DO) Isolated ♦ Highway Addressable Remote Transducer (HART

Interface

®)

Below each I/O module socket is a plug-in terminal block for field wiring connections. The plug-in terminal blocks permit removal and replacement of the modules without the need to disconnect field wiring. I/O wiring terminal blocks accept up to 12-gauge American Wire Gauge (AWG) solid or stranded copper wire. Figure 3-1 shows a typical I/O module.



NOTE: Use a standard screwdriver with a slotted (flat bladed) 1/8-inch width tip when wiring all

terminal blocks.

3-1 Input and Output Modules Rev Jun/05

Page 36

ROC364 Instruction Manual

SENSITIVE

STATIC

DOC0034C

Figure 3-1. Typical I/O Module

3.2.1 Analog Input Loop and Differential Modules

The Analog Input Loop (AI Loop) and Analog Input Differential (AI Differential) modules are used for monitoring current loop and voltage output devices. Each AI module uses a scaling resistor for scaling loop current to achieve the proper input voltage.

The AI Loop module provides a source voltage for powering current loop devices and can be used as a single-ended voltage output. The AI Differential module monitors loop current or voltage input from externally-powered devices and provides electrical isolation from the ROC power supplies.

3.2.2 Analog Input Source Module

The Analog Input Source (AI Source) module monitors current loop or voltage output devices. The Analog Input Source module provides a regulated 10-volts source for powering a device, usually a low power transmitter, and uses a scaling resistor for converting loop current to input voltage.

3.2.3 Analog Output Source Module

The Analog Output Source (AO Source) module provides both a current and a voltage output for powering analog devices. These outputs are isolated from each other and can be used simultaneously. A scaling resistor provides a way to set the minimum loop resistance of the current loop to 0 ohms (installed) or 220 ohms (removed).

3-2 Input and Output Modules Rev Jun/05

Page 37

ROC364 Instruction Manual

3.2.4 Discrete Input Source and Isolated Modules

The Discrete Input Source (DI Source) and Discrete Input Isolated (DI Isolated) modules monitor the status of relays, solid-state switches, or other two-state devices. Each module can accommodate one DI.

Both types of modules provide an LED that lights when the input is active. Both types of modules use a scaling resistor for scaling the input range. Functions supported by both modules are: Latched Discrete Input, Standard Discrete Input, and Time-Duration Input (TDI).

The DI Source module provides a source voltage for dry relay contacts or for an open-collector solidstate switch. The DI Isolated module accepts an external voltage from a powered two-state device and provides electrical isolation from the ROC power supplies.

3.2.5 Discrete Output Source and Isolated Modules

The Discrete Output Source (DO Source) and Discrete Output Isolated (DO Isolated) modules provide two-state outputs to energize relays and power small electrical loads. Each module provides one DO.

Both types of modules provide an LED that lights when the input is active. Both modules are fused for protection against excessive current. Functions supported by both modules are: Latched Discrete Output, Toggle Discrete Output, Timed Duration Output (TDO), and TDO Toggle.

The DO Source module supplies switched current-limited power to small loads. The DO Isolated module acts as a solid-state normally-open switch for activating externally powered devices. The solidstate switch is optically isolated from the power supplies in the ROC.

3.2.6 Discrete Output Relay Module

The Discrete Output Relay (DO Relay) module provides two sets of “dry” relay contacts to switch voltages of up to 250 volts ac. One set of contacts is normally open and the other set is normally closed. Two types of relay modules are available, one with a 12 volts dc energizing coil and the other with a 24 volts dc energizing coil.

The DO Relay provides an LED that lights when the input is active and functions supported by the module include: Latched Discrete Output, Toggle Discrete Output, Timed Duration Output (TDO), and TDO Toggle.

3.2.7 Pulse Input Source and Isolated Modules

The Pulse Input Source (PI Source) and Pulse Input Isolated (PI Isolated) modules count pulses from pulse-generating devices. Each module can accommodate one Pulse Input.

Both types of modules provide an LED that lights when the input is active. Both types of modules use a scaling resistor for scaling the input range. Input pulses are counted by a 16-bit counter capable of storing up to 6.5 seconds of pulse counts for a 10 kilohertz input signal. Functions supported by both modules include slow-counter input, slow rate input, fast counter input, and fast rate input.



NOTE: At the maximum input frequency of 10 kilohertz, the input pulses must not exceed 6.5

seconds of pulse counts. The PI module limit is 20 seconds of pulse counts at 3 kilohertz maximum input frequency.

The PI Source module provides a source voltage for dry relay contacts or for an open-collector solidstate switch. The PI Isolated module accepts an external voltage from a powered device and provides electrical isolation from the ROC power supplies.

3-3 Input and Output Modules Rev Jun/05

Page 38

ROC364 Instruction Manual

3.2.8 Slow Pulse Input Source and Isolated Modules

The Slow Pulse Input Source (SPI Source) and Slow Pulse Input Isolated (SPI Isolated) modules count the changes in the status of relays, solid-state switches, or other two-state devices. Each module can accommodate one Pulse Input.

The modules provide an LED that lights when the input is active. Both types of modules use a scaling resistor for scaling the input range. Functions supported are controlled by the ROC firmware. For example: Raw Pulse Accumulation, Running Total (Entered Rollover) in engineering units (EUs), Rate (Max Rollover) in EUs, Today’s Total (Max Rollover) in EUs, or Rate Alarm.

The SPI Source module provides a source voltage for dry relay contacts or for an open-collector solidstate switch. The SPI Isolated module accepts an external voltage from a powered two-state device and provides electrical isolation from the ROC power supplies.

3.2.9 Low-Level Pulse Input Module

The Low-Level Pulse Input module counts pulses from pulse-generating devices having a voltage range of 30 millivolts to 3 volts peak-to-peak. The module can accommodate one Pulse Input.

Input pulses are counted by a 16-bit counter that is capable of storing up to 22 seconds of pulse counts for a 3 kilohertz input signal. The module provides electrical isolation between the input pulses and the ROC power supplies.

3.2.10 RTD Input Module

The Resistance Temperature Detector (RTD) module monitors the temperature signal from an RTD source. The module can accommodate one input from a two-, three-, or four-wire RTD source.

The active element of an RTD probe is a precision, temperature-dependent resistor, made from a platinum alloy. It has a predictable positive temperature coefficient, meaning its resistance increases with temperature. The RTD input module works by supplying a small current to the RTD probe and measuring the voltage drop across it. Based on the voltage curve of the RTD, the signal is converted to temperature by the ROC firmware.

3.2.11 HART Interface Module

The HART Interface Module provides communications between a ROC and other devices using the Highway Addressable Remote Transducer (HART) protocol. The module has its own microprocessor and mounts in the I/O module sockets.

The HART Interface Module communicates digitally to HART devices through the I/O termination blocks associated with the module position. Each HART module contains two separate channels. Each channel polls all HART devices connected to it before the other channel is polled. Each channel can be configured to operate in either the point-to-point mode or the multi-drop mode. In the point-to-point mode, each module channel supports one HART device.

In the multi-drop mode, each channel can support up to five HART devices for a total of ten devices for each module. By using the multi-drop mode with multiple HART modules, up to 32 HART devices (limited by ROCLINK configuration software) can be supported by a single ROC.

3-4 Input and Output Modules Rev Jun/05

Page 39

ROC364 Instruction Manual

3.3 Initial Installation and Setup

Each I/O module installs in the ROC in the same manner. Any I/O module can be installed into any I/O module socket. To install a module on a ROC that is not in service, perform the following steps. For an in-service ROC, refer to Section 3.5, Troubleshooting and Repair, on page 3-21.

Failure to exercise proper electrostatic discharge precautions (such as wearing a grounded wrist strap) may reset the processor or damage electronic components, resulting in interrupted operations.

When preparing a unit for installation into a hazardous area, change components in an area known to be non-hazardous.

1. Install the I/O module by aligning the pins with the desired I/O module socket and pressing

gently, but straight down.

2. Tighten the module retaining screw.

3. Make sure a field wiring terminal block is installed in the socket adjacent to where the I/O

module was installed. If a Lightning Protection Module is to be installed for this I/O channel, refer to Appendix A.

3.3.1 Calibrating an I/O Module

After an I/O module is installed, configure, and calibrate the associated I/O channel using ROCLINK configuration software.

3.4 Connecting the I/O Modules to Wiring

Each I/O module electrically connects to field wiring by a separate plug-in terminal block. In addition, the ROC enclosures provide a ground bus bar for terminating the sheath on shielded wiring. The following paragraphs provide information on wiring field devices to each type of I/O module. I/O wiring terminal blocks accept up to 12-gauge AWG solid or stranded copper wire.

The sheath surrounding shielded wiring should never be connected to a signal ground terminal or to the common terminal of an I/O module. Doing so makes the I/O module susceptible to static discharge, which can permanently damage the module. Connect the shielded wiring sheath to a suitable earth ground only.

3-5 Input and Output Modules Rev Jun/05

Page 40

ROC364 Instruction Manual

3.4.1 Analog Input Loop Module

The Analog Input Loop module monitors either loop current or output voltage from field devices. The module provides source power at terminal A for the loop. The AI Loop module operates by measuring the voltage at terminals B and C. For current loop monitoring, scaling resistor R1 generates a voltage across terminals B and C that is proportional to the loop current (I). A 250-ohms scaling resistor (R1) is supplied by the factory (0.1%, 1/8 watts) to accommodate either 0 to 20 milliamps or 4 to 20 milliamps current loop transmitters. This translates to a maximum operating input voltage of 5 volts dc, which is the upper limit of the module.

When using a transmitter with a maximum current requirement different from 20 milliamps, R1 should be scaled to achieve full-scale deflection at 5 volts dc. The formula for determining a new value of R1 is given in Figure 3-2, where “I Maximum” is the upper end of the operating current range, such as 0.025 amps for a 0 to 25 milliamps device.

ROC-POWERED CURRENT LOOP DEVICE

TO SELECT PROPER VALUE OF R1:

= SOURCE VOLTAGE FROM MODULE = 11 TO 30 VDC, 25 mA MAX

5 VOLTS

R1 =

I MAXIMUM

R1=250

I LOOP

I LIMIT

DOC0153J

Figure 3-2. AI Loop Module Field Wiring for Current Loop Devices

Figure 3-3 shows a typical voltage signal input. Terminal B is the “+” signal input and terminal C is the “–” signal input. These terminals accept a voltage signal in the 0 to 5 volts range. Since terminal C connects to a signal ground (non-isolated logic ground), the Analog Input must be a single-ended. Ensure that no scaling resistor (R1) is installed when the module is used to sense a voltage signal.

Figure 3-3. AI Loop Module Field Wiring for Voltage Devices

3-6 Input and Output Modules Rev Jun/05

Page 41

ROC364 Instruction Manual

(

)

3.4.2 Analog Input Differential Module

A schematic representation of the field wiring connections to the input circuit of the Analog Input Differential module is shown in Figure 3-4, Figure 3-5, and Figure 3-6.

The Analog Input Differential module measures either output voltage (V

) or loop current (I) from

externally-powered devices only. The module operates by measuring the voltage between field wiring terminals B and C. The module input is semi-isolated from the ROC power supply and signal commons.

When connecting voltage devices, the 5-volts input voltage limit of the module must not be exceeded. If the output of the field device is in the range of 0 to 5 volts dc, do not use a scaling resistor; ensure that the supplied 250-ohms scaling resistor is removed. Refer to Figure 3-4 for connecting field devices with outputs of 5 volts dc or less.

The voltage cannot be negative. The A to D converter divides the 0 to 5 volts signal into 4095 counts and the last 95 counts (being 4001 to 4095) represent overvoltage. If you use a 0 to 1 volt input to the converter, the resolution is reduced, as there are only 800 counts with which to work.

For field devices with output voltages that exceed 5 volts dc, two scaling resistors, R1 and R2, are required (not supplied). Figure 3-5 shows how to connect field devices with outputs exceeding 5 volts dc and where to install scaling resistors (at least 1%, 1/8 watts). The equation for determining values of scaling resistors R1 and R2 is given in Figure 3-5. For example, if V

= 10 volts, and

R1 = 250 ohms, then R2 = 250 ohms. Note that R1 must be less than 4.5 kilohms.

SELF-POWERED

NALOG VOLTAGE

DEVICE

R1 = OPEN

N/C

V = VOLTAGE FROM ANALOG DEVICE = 0 TO 5 VDC

I DIFF

200K

DOC0155A

Figure 3-4. AI Differential Module Field Wiring for Low Voltage Devices

SELF-POWERED

NALOG VOLTAGE

DEVICE

Figure 3-5. AI Differential Module Field Wiring for Higher Voltage Devices

3-7 Input and Output Modules Rev Jun/05

TO SCALE R1 AND R2 FOR:

V = VOLTAGE FROM ANALOG DEVICE = 5 TO 100 VDC

R1 MUST BE LESS THAN 4.5K OHM (1.0K OHM TYPICAL)

V - 5

R2 =

N/C

I DIFF

200K

DOC0156

Page 42

ROC364 Instruction Manual

–

For current loop devices, scaling resistor R1 generates a voltage across terminals B and C that is proportional to the loop current. When connecting current loop devices, the value of R1 must be selected such that the 5-volts input limit of the module is not exceeded under maximum operating current conditions. For 0 to 20 milliamps or 4 to 20 milliamps devices, the value of R1 would be 250 ohms. In this case, you can use the 250-ohms (0.1%, 1/8 watt) scaling resistor supplied by the factory. The formula for determining the value of R1 is given in Figure 3-6, where “I Maximum” is the upper end of the operating current range, such as 0.025 amps for a 0 to 25 milliamps device.

SELF-POWERED CURRENT LOOP DEVICE

TO SELECT PROPER VALUE FOR R1:

V = VOLTAGE FROM ANALOG DEVICE = 0 TO 5 VDC

5 VOLTS

R1 =

N/C

I DIFF

200K

DOC0154A

Figure 3-6. AI Differential Module Field Wiring for Current Loop Devices

3.4.3 Analog Input Source Module

A schematic representation of the field wiring connections to the input circuit of the Analog Input Source module displays in Figure 3-7 and Figure 3-8. The AI Source module normally monitors the voltage output of low-voltage transmitters, but it can be used for monitoring loop current. The module provides source power at terminal A for the loop. The Analog Input Source module operates by measuring the voltage across terminals B and C. The module accepts a maximum input voltage of 5 volts dc, which is the upper operating limit of the module.

Figure 3-7 shows a typical voltage signal input. Terminal B is the positive (+) signal input and terminal C is the negative (–) signal input. These terminals accept a voltage signal in the 0 to 5 volts range. Since terminal C connects to common, the Analog Input can only be a single-ended input. Make sure no scaling resistor is installed when wiring the module for a voltage signal.

+10Vdc

ROC-POWERED

VOLTAGE DEVICE

Figure 3-7. AI Source Module Field Wiring for Voltage Devices

The AI Source module can be used for monitoring loop current as shown in Figure 3-8. For current loop monitoring, scaling resistor R1 generates a voltage across terminals B and C that is proportional to the loop current (I).

3-8 Input and Output Modules Rev Jun/05

SIGNAL = 0 TO 5

+10Vdc

V SRC

I SRC

Page 43

ROC364 Instruction Manual

–

(

For example, a 250-ohms scaling resistor would accommodate either 0 to 20 milliamps, or 4 to 20 milliamps current loop transmitters (the transmitter must be able to operate on 10 volts dc or be powered from another source). This translates to a maximum operating input voltage of 5 volts dc, which is the upper limit of the module. When using a transmitter with a maximum operating current requirement different from 20 milliamps, R1 should be sized to achieve full-scale deflection at 5 volts. The formula for determining a new value of R1 displays in Figure 3-8.

ROC-POWERED CURRENT LOOP DEVICE

–

TO SELECT PROPER VALUE OF R1: Vs = SOURCE VOLTAGE FROM MODULE = 10 Vdc, 20 mA MAX

5 VOLTS

R1 =

I MAXIMUM

+10 Vdc

V SRC

I SRC

Figure 3-8. AI Source Module Field Wiring for Current Loop Devices

3.4.4 Analog Output Source Module

A schematic representation of the field wiring connections to the output circuit of the Analog Output Source module displays in Figure 3-9 and Figure 3-10. The AO Source module can provide either loop current or output voltage to non-powered field devices. The Analog Output Source module provides a 0 to 5.5 volts output at terminal A, and a 0 to 30 milliamps current source output at terminal B. Terminal C is referenced to the ROC common.

Resistor R1 (0-ohm resistor supplied) helps keep the loop resistance within the operating range of the module. Remove the 0-ohm resistor when the loop resistance between terminals B and C is less than 100 ohms.

Terminals A and B are both active at the same time. Figure 3-9 shows wiring for a ROC-powered current loop device, and Figure 3-10 shows wiring for an output voltage to non-powered field devices.

LEVEL

DOC0158A

Modified)

O SRC

R1=0

220

Figure 3-9. Analog Output Source Module Field Wiring for Current Loop Devices

3-9 Input and Output Modules Rev Jun/05

COM

REMOVE RESISTOR R1 WHEN LOOP RESISTANCE IS LESS THAN 100 OHMS

I = 30 mA MA

ROC-POWERED LOOP DEVICE

Page 44

ROC364 Instruction Manual

LEVEL

DOC0159A

O SRC

R1=0

220

COM

V = OUTPUT VOLTAGE FROM MODULE = 0 TO 5 VDC, 5 mA

ROC-POWERED VOLTAGE DEVICE

Figure 3-10. Analog Output Source Module Field Wiring for Voltage Devices

3.4.5 Discrete Input Source Module

A schematic representation of the field wiring connections to the input circuit of the Discrete Input Source module displays in Figure 3-11.

The Discrete Input Source module is designed to operate only with non-powered discrete devices, such as “dry” relay contacts or isolated solid-state switches. Use of the module with powered devices may cause improper operation or damage.

The Discrete Input Source module operates by providing a voltage across terminals B and C that is derived from internal voltage source V

. When a field device, such as a set of relay contacts, is connected

across terminals B and C, the closing of the contacts completes a circuit, which causes a flow of current between V

and ground at terminal C. This current flow is sensed by the DI module, which signals the

ROC electronics that the relay contacts have closed. When the contacts open, current flow is interrupted and the DI module signals the ROC electronics that the relay contacts have opened.

A 10-ohms scaling resistor (R1) is supplied by the factory and accommodates a source voltage (V

) of

11 to 30 volts dc. The source voltage is the input voltage to the ROC. However, it is desirable to optimize the value of R1 to reduce the current drain from the source or reduce the heat generated in the module due to high source voltage. The formula for determining the value of R1 is given in Figure 3-11. For optimum efficiency, R1 should be scaled for a loop current (I) of 3 milliamps.

R1=10

DI SRC

ROC-POWERED PULSE DEVICE

TO OPTIMIZE SCALING RESISTOR R1:

VS – 1

R1 =

R1 + R I = LOOP CURRENT = 3 mA TYPICAL R

VS = SOURCE VOLTAGE FROM MODULE = 11 TO 30 VDC

+ 3.3K = LOOP RESISTANCE = 4.5K OHMS MAX

= RESISTANCE OF FIELD WIRING

– R

– 3.3K

N/C

–

3.3K

DOC0143A Modified

Figure 3-11. Discrete Input Source Module Field Wiring

3-10 Input and Output Modules Rev Jun/05

Page 45

ROC364 Instruction Manual

3.4.6 Discrete Input Isolated Module

A schematic representation of the field wiring connections to the input circuit of the Discrete Input Isolated module displays in Figure 3-12.



NOTE: The Discrete Input Isolated module is designed to operate only with discrete devices

having their own power source, such as “wet” relay contacts or two-state devices providing an output voltage. The module is inoperative with non-powered devices.

The Discrete Input Isolated module operates when a field device provides a voltage across terminals B and C of the module. The voltage sets up a flow of current sensed by the module that, in turn, signals the ROC electronics that the field device is active. When the field device no longer provides a voltage, current stops flowing and the DI module signals the ROC electronics that the device is inactive.

A 10-ohms scaling resistor (R1) is supplied by the factory and accommodates an external voltage (V

) of

11 to 30 volts dc. However, it is desirable to optimize the value of R1 to reduce the current drain from the source or reduce the heat generated in the module due to high source voltage. The formula for determining the optimum value of R1 displays in Figure 3-12. For best efficiency, R1 should be scaled for a loop current (I) of 3 milliamps.

SELF-POWERED DISCRETE DEVICE

VO – 1

– R

–

TO OPTIMIZE SCALING RESISTOR R1:

R1 =

R1 + RW + 3.3K = LOOP RESISTANCE = 4.5K OHMS MAX

I = LOOP CURRENT = 3 mA TYPICAL

= RESISTANCE OF FIELD WIRING

= VOLTAGE FROM DISCRETE DEVICE = 11 TO 30 VDC

– 3.3K

R1=10

N/C

–

DI ISO

3.3K

DOC0144A

Figure 3-12. Discrete Input Isolated Module Field Wiring

3.4.7 Discrete Output Source Module

A schematic representation of the field wiring connections to the output circuit of the Discrete Output Source module displays in Figure 3-13.

The Discrete Output Source module is designed to operate only with non-powered discrete devices, such as relay coils or solid-state switch inputs. Using the module with powered devices may cause improper operation or damage to occur.

The Discrete Output Source module provides a switched voltage across terminals B and C that is derived from internal voltage source V electronics provides a voltage at terminals B and C. When V field device is no longer energized.

3-11 Input and Output Modules Rev Jun/05

. A field device, such as a relay coil, is energized when the ROC

is switched off by the ROC electronics, the

Page 46

ROC364 Instruction Manual

When using the Discrete Output Source module to drive an inductive load, such as a relay coil, a suppression diode should be placed across the input terminals to the load. This protects the module from the reverse Electro-Motive Force (EMF) spike generated when the inductive load is switched off.

1 Amp

N/C

–

ROC-POWERED

DISCRETE DEVICE

–

DO SRC

+5V

CONTROL

I LIMIT

DOC0145A

Figure 3-13. Discrete Output Source Module Field Wiring

3.4.8 Discrete Output Isolated Module

A schematic representation of the field wiring connections to the output circuit of the Discrete Output Isolated module is shown in Figure 3-14.



NOTE: The Discrete Output Isolated module is designed to operate only with discrete devices

having their own power source. The module is inoperative with non-powered devices.

The Discrete Output Isolated module operates by providing a low or high-output resistance to a field device. When the field device provides a voltage across terminals A and B of the module, current either flows or is switched off by the DO Isolated module. The switching is controlled by the ROC electronics.

DO ISO

+5V

CONTROL

DOC0146A (Modified)

1 Amp

COM

N/C

TERMINAL A CONNECTION IS COMMON TERMINAL B CONNECTION TO BE MADE FOR NORMALLY OPEN APPLICATIONS TERMINAL C CONNECTION IS NO CONNECT V

= VOLTAGE FROM DISCRETE DEVICE = 11 TO 30 VDC, 1.0 A MAX

SELF-POWERED DISCRETE DEVICE

–

Figure 3-14. Discrete Output Isolated Module Field Wiring

3-12 Input and Output Modules Rev Jun/05

Page 47

ROC364 Instruction Manual

3.4.9 Discrete Output Relay Module

A schematic representation of the field wiring connections to the output circuit of the Discrete Output Relay module displays in Figure 3-15.



NOTE: The Discrete Output Relay module is designed to operate only with discrete devices

having their own power source. The module will be inoperative with non-powered devices.

The Discrete Output Relay module operates by providing both normally-closed and normally-open contacts to a field device. Normally-closed contacts use terminals B and C, and normally-open contacts use terminals A and B. ROCLINK configuration software controls the status of the contacts (open or closed).

There are two versions of the DO Relay module. The 12 volts version (which has a 12 volts energizing coil) must be used when the ROC input voltage is a nominal 12 volts dc, and the 24 volts version (which has a 24 volts energizing coil) must be used when the ROC input voltage is a nominal 24 volts dc.

DO RLY

CONTROL

COM

SELF-POWERED

–

DISCRETE DEVICE

DOC0147A

TERMINAL A CONNECTION TO BE MADE FOR NORMALLY OPEN APPLICATIONS TERMINAL B IS COMMON TERMINAL C CONNECTION TO BE MADE FOR NORMALLY CLOSED APPLICATIONS

= VOLTAGE FROM DISCRETE DEVICE = 0 TO 30 VDC OR 0 TO 115 VAC, 5 A MAX

Figure 3-15. Discrete Output Relay Module Field Wiring

3.4.10 Pulse Input Source Module

A schematic representation of the field wiring connections to the input circuit of the Pulse Input Source module is shown in Figure 3-16.

The Pulse Input Source module is designed to operate only with non-powered discrete devices, such as “dry” relay contacts or isolated solid-state switches. Use of the module with powered devices may cause improper operation or damage to occur.

The Pulse Input Source module provides a voltage across terminals B and C that is derived from internal voltage source V and C, the opening and closing of the contacts causes current to either flow or not flow between V ground at terminal C.

. When a field device, such as a set of relay contacts, is connected across terminals B

and

This interrupted, or pulsed current flow is counted and accumulated by the PI Source module, which provides the accumulated count to the ROC electronics upon request.

3-13 Input and Output Modules Rev Jun/05

Page 48

ROC364 Instruction Manual

A 10-ohms scaling resistor (R1) is supplied by the factory and accommodates a source voltage (Vs) of 11 to 30 volts dc and a pulse source with a 50% Duty Cycle. The source voltage is the input voltage to the ROC. However, it is desirable to optimize the value of R1 to reduce the current drain from the source or reduce the heat generated in the module due to high source voltage. The formula for determining the value of R1 is given in Figure 3-16. For optimum efficiency, R1 should be scaled for a loop current (I) of 5 milliamps.

R1=10

PI SRC

ROC-POWERED PULSE DEVICE

TO OPTIMIZE SCALING RESISTOR R1:

VS – 1

R1 =

R1 + R I = LOOP CURRENT = 5 mA TYPICAL R

VS = SOURCE VOLTAGE FROM MODULE = 11 TO 30 VDC

+ 2.2K = LOOP RESISTANCE = 3.4K OHMS MAX

= RESISTANCE OF FIELD WIRING

– R

– 2.2K

N/C

–

Figure 3-16. Pulse Input Source Module Field Wiring

2.2K

3.4.11 Pulse Input Isolated Module

A schematic representation of the field wiring connections to the input circuit of the Pulse Input Isolated module is shown in Figure 3-17.



NOTE: The Pulse Input Isolated module is designed to operate only with devices having their

own power source, such as “wet” relay contacts or two-state devices providing an output voltage. The module is inoperative with non-powered devices.

The Pulse Input Isolated module operates when a field device provides a voltage across terminals B and C of the module. The voltage sets up a flow of current sensed by the module. When the field device no longer provides a voltage, current stops flowing.

This interrupted, or pulsed current flow is counted and accumulated by the PI module, which provides the accumulated count to the ROC electronics upon request.

A 10-ohms scaling resistor (R1) is supplied by the factory, which accommodates a field device with pulse amplitude (V the value of R1 to reduce the current drain from the source or reduce the heat generated in the module due to amplitudes greater than 30 volts dc. The formula for determining the value of R1 displays in Figure 3-17. For optimum efficiency, R1 should be scaled for a loop current (I) of 5 milliamps.

) of 11 to 30 volts dc and a Duty Cycle of 50%. However, it is desirable to optimize

3-14 Input and Output Modules Rev Jun/05

Page 49

ROC364 Instruction Manual

–

SELF-POWERED PULSE DEVICE

TO OPTIMIZE SCALING RESISTOR R1:

R1 =

R1 + R I = LOOP CURRENT = 5 mA TYPICAL

RW = RESISTANCE OF FIELD WIRING

= VOLTAGE FROM PULSE DEVICE = 11 TO 30 VDC

VO – 1

+ 2.2K = LOOP RESISTANCE = 3.4K OHMS

– R

– 2.2K

R1=10

N/C

–

PI ISO

2.2

DOC0149A

Figure 3-17. Pulse Input Isolated Module Field Wiring

3.4.12 Slow Pulse Input Source Module

A schematic representation of the field wiring connections to the input circuit of the Slow Pulse Input Source (SPI) module is shown in Figure 3-18.

The Slow Pulse Input source module is designed to operate only with non-powered devices, such as “dry” relay contacts or isolated solid-state switches. Use of the module with powered devices may cause improper operation or damage to occur.

The Slow Pulse Input Source module operates by providing a voltage across terminals B and C that is derived from internal voltage source V

. When a field device, such as a set of relay contacts,

is connected across terminals B and C, the closing of the contacts completes a circuit, which causes a flow of current between V

and ground at terminal C.

This current flow is sensed by the SPI module, which signals the ROC electronics that the relay contacts have closed. When the contacts open, current flow is interrupted and the SPI module signals the ROC electronics that the relay contacts have opened. The ROC counts the number of times the contacts switch from open to closed, and stores the count. The ROC checks for the input transition every 50 milliseconds.

A 10-ohms scaling resistor (R1) is supplied and accommodates a source voltage (V

) of 11 to 30 volts

dc. The source voltage is either the input voltage to the ROC. However, it is desirable to optimize the value of R1 to reduce the current drain from the source or reduce the heat generated in the module due to high source voltage. The formula for determining the value of R1 is given in Figure 3-18. For optimum efficiency, R1 should be scaled for a loop current (I) of 3 milliamps.

3-15 Input and Output Modules Rev Jun/05

Page 50

ROC364 Instruction Manual

R1=10

SPI SRC

ROC-POWERED DISCRETE DEVICE

TO OPTIMIZE SCALING RESISTOR R1:

V - 1

R1 + Rw + 3.3K = LOOP RESISTANCE = 4.5K OHMS

I = LOOP CURRENT = 3 mA

R = RESISTANCE OF FIELD

V = SOURCE VOLTAGE FROM MODULE = 11 TO 30

- R - 3.3K

N/C

3.3K

DOC0151 Modified

Figure 3-18. Slow Pulse Input Source Module Field Wiring

3.4.13 Slow Pulse Input Isolated Module

A schematic representation of the field wiring connections to the input circuit of the Slow Pulse Input Isolated module is shown in Figure 3-19.



NOTE: The Slow Pulse Input isolated module is designed to operate only with devices having

their own power source, such as “wet” relay contacts or two-state devices providing an output voltage. The module is inoperative with non-powered devices.

The Slow Pulse Input Isolated (SPI) module operates when a field device provides a voltage across terminals B and C of the module. The voltage sets up a flow of current sensed by the module, which signals the ROC electronics that the field device is active. When the field device no longer provides a voltage, current stops flowing and the SPI module signals the ROC electronics that the device is inactive. The ROC counts the number of times the current starts flowing, and stores the count. The ROC checks for the input transition every 50 milliseconds.

A 10-ohms scaling resistor (R1) is supplied by the factory, which accommodates an external voltage (V

) of 11 to 30 volts dc. However, it is desirable to optimize the value of R1 to reduce the current drain

from the source or reduce the heat generated in the module due to high source voltage. The formula for determining the value of R1 displays in Figure 3-19. For optimum efficiency, R1 should be scaled for a loop current (I) of 3 milliamps.

SELF-POWERED DISCRETE

DEVICE

TO OPTIMIZE SCALING RESISTOR R1:

V - 1

R1 + R + 3.3K = LOOP RESISTANCE = 4.5K OHMS

I = LOOP CURRENT = 3 mA

R = RESISTANCE OF FIELD

V = VOLTAGE FROM DISCRETE DEVICE = 11 TO 30 VDC

R1=10

- R - 3.3K

N/C

SPI ISO

3.3K

DOC0152A

Figure 3-19. Slow Pulse Input Isolated Module Field Wiring

3-16 Input and Output Modules Rev Jun/05

Page 51

ROC364 Instruction Manual

–

3.4.14 Low-Level Pulse Input Module

A schematic representation of the field wiring connections to the input circuit of the Low-Level Pulse Input module is shown in Figure 3-20. The field wiring connects through a separate terminal block that plugs in next to the module allowing replacement of the module without disconnecting field wiring.



NOTE: The Low-Level Pulse Input module is designed to operate only with pulse-generating

devices having their own power source. The module does not work with non-powered devices.

The Low-Level Pulse Input module operates when a field device provides a pulsed voltage between 30 millivolts and 3 volts peak-to-peak across terminals B and C of the module. The pulsed voltage is counted and accumulated by the module, which provides the accumulated count to the ROC electronics on request.

PI LL

N/C

SELF-POWERED PULSE DEVICE

200K

DOC0150

Figure 3-20. Low-Level Pulse Input Module Field Wiring Schematic

3.4.15 RTD Input Module

The RTD input module monitors the temperature signal from a Resistance Temperature Detector (RTD) sensor or probe. The RTD module is isolated, reducing the possibility of lightning damage. A Lightning Protection Module (LPM) will not protect the RTD, but it helps protect the rack in which the module is installed.

The RTD module must to be calibrated while disconnected from the RTD probe; therefore, it may be more convenient to perform calibration before connecting the field wiring. However, if the field wiring between the ROC and the RTD probe is long enough to add a significant resistance, then calibration should be performed in a manner that takes this into account.

For a three- or four-wire RTD with the wires used to connect up each leg are of the same length and size, the error generated will be zero or at least no different for any given length. This is because the RTD input uses the resistance of the wire loop(s) not passing through the RTD to correct for the wire resistance of the loop with the RTD.

3.4.15.1 Calibrating the RTD Module

The following instructions describe how to calibrate an RTD input channel for use with an RTD probe having an alpha value of either 0.00385 or 0.00392 ohms/degree C. This procedure requires a resistance decade box with 0.01-ohm steps and an accuracy of ±1%. You also need a personal computer running ROCLINK configuration software.



NOTE: In ROCLINK configuration software, use the Calibrate button associated with the

Analog Input configuration.

3-17 Input and Output Modules Rev Jun/05

Page 52

ROC364 Instruction Manual

 NOTE: The RTD module input can be calibrated before installing it in the field when short wire

runs will be used, but if the RTD module is used as a temperature input to a flow calculation, then the RTD should be calibrated at the same time as the pressure inputs.

WHTC

WHT

RTD

RED

DECADE BOX

ABC

A4464821

Figure 3-21. Calibration Setup

Table 3-1. Calibration Resistance Values

ALPHA –50ºC (58ºF) 100ºC (212ºF)

0.00385 80.31 Ohms 138.50 Ohms

0.00392 79.96 Ohms 139.16 Ohms

NOTE: Resistance values for RTD probes with other alpha

values can be found in the temperature-to-resistance conversion table for that probe.

1. Connect the decade box as shown in Figure 3-21.

2. Set the decade box to the –50°C (–58°F) resistance value corresponding to the RTD alpha value

in Table 3-1.

3. Enter the value displayed for “Raw A/D Input” as the value for “Adjusted A/D 0%” using the

Analog Inputs configuration screen for the RTD input. Refer to ROCLINK > Configure > I/O > AI Points Advanced tab.

4. Set the decade box to the 100°C (212°F) resistance value given in Table 3-1.

5. Enter the value displayed for “Raw A/D Input” as the value for “Adjusted A/D 100%” using the

Analog Inputs Advanced configuration screen for the RTD input.

6. Enter –50°C (–58°F) for “Low Reading EU” using the Analog Inputs configuration screen. Refer

to ROCLINK > Configure > I/O > AI Points General tab.

7. Enter 100°C (212°F) for the “High Reading EU” using the Analog Inputs configuration screen.

8. Click Apply to save the changes.

3-18 Input and Output Modules Rev Jun/05

Page 53

ROC364 Instruction Manual

3.4.15.2 Connecting RTD Module Field Wiring

The RTD sensor connects to the RTD module with ordinary copper wire. To avoid a loss in accuracy, sensor wires should be equal in length, of the same material, and the same gauge. To avoid possible damage to the RTD module from induced voltages, sensor wires should be kept as short as possible. This is typically 3.35 meters (100 feet) or less. A schematic representation of the field wiring connections to the input circuit of the RTD input module displays in Figure 3-22, Figure 3-23, Figure 3-24, and Figure 3-25.

Two-wire RTDs are connected to module terminals A and B. Terminal B must be connected to terminal C, as shown in Figure 3-22.

RTD

ROC-POWERED 2-WIRE, 100 OHM RTD PROBE

RED

WHT

Figure 3-22. RTD Input Module Field Wiring for Two-Wire RTDs

RED

WHT

I SRC

DOC4007A Modified

Three-wire RTDs have an active element loop and a compensation loop. The active element loop connects across terminals A and B. The compensation loop connects across B and C. The compensation loop helps increase the accuracy of the temperature measurement by allowing the RTD module to compensate for the resistance of hookup wire used between the probe and RTD module.

In operation, the RTD module subtracts the resistance between terminals B and C from the resistance between terminals A and B. The remainder is the resistance of only the active element of the probe. This compensation becomes more important as the resistance of the hookup wire increases with distance between the probe and the ROC. Of course, in order to perform properly, the compensation loop must use the same type, size, and length of hookup wire as the active element loop.

The RTD module is designed for only one compensation loop, and this loop is not isolated from the active element loop because terminal B is common to both loops. In the 3-wire RTD, the wires connect to module terminals A, B, and C, as shown in Figure 3-23.

It is important to match the color-coding of the RTD probe wires to the proper module terminal, because the probe wire colors vary between manufacturers. To determine which leads are for the compensation loop and which are for the active element, read the resistance across the probe wires with an ohmmeter. The compensation loop reads 0 ohms, and the RTD element reads a resistance value matching the temperature curve of the RTD.

3-WIRE,100-OHM, RTD PROBE

RED

WHT

RED

WHT

I SRC

RTD

Figure 3-23. RTD Input Module Field Wiring for Three-Wire RTDs

3-19 Input and Output Modules Rev Jun/05

DOC0161A Modified

Page 54

ROC364 Instruction Manual

RTDs with four wires normally have the compensation loop separate from the active element loop to increase the accuracy of the probe. Various colors are used for the probe wires. For example, some probes have wire colors of red and white for the RTD element loop and black leads for the compensation loop, while other probes use two red leads for the active element loop and two white leads for the compensation loop.

The connections in Figure 3-24 connect a 4-wire RTD with compensation loop to the 3-wire RTD module. The RTD module designed for 3-wire use does not permit a 4-wire RTD to provide any additional accuracy over a 3-wire RTD.

RTD

RED

4-WIRE RTD WITH COMPEN-SATION LOOP

RED

WHT

Figure 3-24. RTD Input Module Field Wiring for Four-Wire RTD With Compensation Loop

Figure 3-25 shows the connections for a single-element, 4-wire RTD. The two leads for one side of the RTD are both red, and for the other side, they are both white.

RED

4-WIRE RTD WITH SINGLE ELEMENT

RED

WHT

RED

WHT

RED

WHT

I SRC

DOC4008A

RTD

DOC4009A

Figure 3-25. Field Wiring for Four-Wire, Single Element RTD

3.4.16 HART Interface Module

The HART Interface module allows the ROC to interface with up to ten Highway Addressable Remote Transducer (HART) devices per I/O slot. The HART module provides “loop source” power (+T) on terminal A and two channels for communications on terminals B and C. The +T power is regulated by a current limit. If the power required by all connected HART devices exceeds 40 milliamps (more than an average of 4 milliamps each), the total number of HART devices must be reduced.

The HART module polls one channel at a time. If more than one device is connected to a channel in a multi-drop configuration, the module polls all devices on that channel before it polls the second channel. The HART protocol allows one second per poll for each device, so with five devices per channel the entire poll time for the module would be ten seconds.

In a point-to-point configuration, only one HART device wires to each HART module channel. In a multi-drop configuration, two to five HART devices can connect to a channel. In either case, terminal A (+T) is wired in parallel to the positive (+) terminal on all of the HART devices, regardless of the channel to which they are connected. Channel 1 (terminal B) is wired to the negative (–) terminal of a single HART device, or in parallel to the negative terminals of two to five devices. Likewise, channel 2 (terminal C) is wired to the negative (–) terminal of a single HART device, or in parallel to the negative terminals of a second group of two to five devices. Refer to Figure 3-26.

3-20 Input and Output Modules Rev Jun/05

Page 55

ROC364 Instruction Manual

HART MODULE

ROC-POWERED HART DEVICE 1

ROC-POWERED

HART DEVICE 2

ROC-POWERED HART DEVICE 5

CHANNEL 1, MULTI-DROP MODE CHANNEL 2, POINT-TO-POINT MODE

ROC-POWERED

HART DEVICE

MUX

LIMIT

MODEM

DOC0295A

Figure 3-26. Field Wiring for a HART Interface Module

3.5 Troubleshooting and Repair

Use troubleshooting and repair to identify and replace faulty modules. Faulty modules must be returned to your local sales representative for repair or replacement.

If an I/O point does not function correctly, first determine if the problem is with the field device or the I/O module as follows:

Failure to exercise proper electrostatic discharge precautions (such as wearing a grounded wrist strap) may reset the processor or damage electronic components, resulting in interrupted operations.

1. Isolate the field device from the ROC by disconnecting it at the I/O module terminal block.

2. Connect the ROC to a computer running ROCLINK configuration software.

3. Perform the appropriate test procedure described in the following sections.

A module suspected of being faulty should be checked for a short circuit between its input or output terminals and the ground screw. If a terminal not directly connected to ground reads zero (0) when measured with an ohmmeter, the module is defective and must be replaced.

3-21 Input and Output Modules Rev Jun/05

Page 56

ROC364 Instruction Manual

3.5.1 Analog Input Modules

Equipment Required: Multimeter To determine if an Analog Input module is operating properly, its configuration must first be known.

Table 3-2 shows typical configuration values for an Analog Input:

Table 3-2. Analog Input Module Typical Configuration Values

Parameter Value Corresponds To

Adjusted A/D 0 % 800 1 volt dc across scaling resistor Rs

Adjusted A/D 100 % 4000 5 volts dc across Rs

Low Reading EU 0.0000 EU value with 1 volt dc across Rs

High Reading EU 100.0 EU value with 5 volts dc across Rs

Filter EUs xxxxx Value read by AI module

When the value of Filtered Engineering Units (EU) is –25% of span as configured above, it is an indication of no current flow (0 milliamps), which can result from open field wiring or a faulty field device.

When the value of Filtered EUs is in excess of 100% of span as configured above, it is an indication of maximum current flow, which can result from shorted field wiring or a faulty field device.

When the value of Filtered EUs is between the low and high readings, you can verify the accuracy of the reading by measuring the voltage across scaling resistor R

(Vrs) with the multimeter. To convert this

reading to the filtered EUs value, perform the following:

Filtered EUs = [((Vrs – 1) ÷ 4) × Span] + Low Reading EU,

where Span = High Reading EU – Low Reading EU

This calculated value should be within one-tenth of one percent of the Filtered EUs value measured by the ROC. To verify an accuracy of 0.1 percent, read the loop current with a multimeter connected in series with current loop. Be sure to take into account that input values can change rapidly, which can cause a greater error between the measured value and the calculated value.

If the calculated value and the measured value are the same, the AI module is operating correctly.

3.5.2 Analog Output Modules

The Analog Output module is a source for current loop or voltage devices. Two test procedures are provided to verify correct operation.

♦ Check AO Current Loop Source Installations on page 3-23. ♦ Check AO Voltage Source Installations on page 3-23.

3-22 Input and Output Modules Rev Jun/05

Page 57

ROC364 Instruction Manual

3.5.2.1 Check AO Current Loop Source Installations

Equipment Required: Multimeter Personal Computer running ROCLINK configuration software

1. Taking appropriate precautions, disconnect the field wiring going to the AO module

terminations.

2. Connect a multimeter between the B and C terminals of the module and set the multimeter to

measure current in milliamps.

3. Using ROCLINK configuration software, put the AO point associated with the module under test

in Manual mode (Scanning Disabled).

4. Set the output to the High Reading EU value.

5. Verify a 20-milliamps reading on the multimeter.

6. Calibrate the Analog Output High Reading EU value by increasing or decreasing the “Adjusted

D/A 100%” value.

7. Set the output to the Low Reading EU value.

8. Verify a 4-milliamps reading on the multimeter.

9. Calibrate the Analog Output Low Reading EU value by increasing or decreasing the “Adjusted

D/A 0%” value.

10. Enable scanning (Scanning Enabled or Auto) for the AO point, remove the test equipment, and

reconnect the field device.

11. If possible, verify the correct operation of the AO module by setting the High Reading EU and

Low Reading EU values as before (Scanning Disabled) and observing the field device.

3.5.2.2 Check AO Voltage Source Installations

Equipment Required: Multimeter Personal Computer running ROCLINK configuration software

To check operation of the Analog Output module powering a voltage device:

1. If the resistance value (R) of the field device is known, measure the voltage drop (V)

across the device and calculate the output EU value using the following formula.

EU value = [((1000V/R – 4) ÷ 16) × Span] + Low Reading EU,

where Span = High Reading EU – Low Reading EU

2. Compare the computed value to the output EU value measured by the ROC with ROCLINK

configuration software. It is normal for the reading to be several percent off, depending on the accuracy tolerance of the device and how rapidly changes occur in the output value.

3. Calibrate the Analog Output EU values by increasing or decreasing the “Adjusted D/A % Units.”

4. If the Analog Output is unable to drive the field device to the 100% value, confirm the +V

(1 to 5 volts) voltage is present at the field device.

♦ If the voltage is present and the device is not at the 100% position, the resistance value of the

device is too large for the +V voltage. Use a field device with a lower internal resistance.

♦ If the voltage is not present at the field device, but it is present at field wiring terminal B,

there is excessive resistance or a break in the field wiring.

3-23 Input and Output Modules Rev Jun/05

Page 58

ROC364 Instruction Manual

3.5.3 Discrete Input Source Module

Equipment Required: Jumper wire

1. Place a jumper across terminals B and C.

2. The LED on the module should light and the Status as read by ROCLINK configuration software

should change to “On.”

3. With no jumper on terminals B and C, the LED should not be lit and the Status should be “Off.”

4. If the unit fails to operate, make sure a correct value for the module resistor is being used.

3.5.4 Discrete Input Isolated Module

Equipment Required: Voltage generator capable of generating 11 to 30 volts dc Personal Computer running ROCLINK configuration software

1. Supply an input voltage across terminals B and C.

2. The LED on the module should light and the Status as read by ROCLINK configuration software

should change to “On.”

3. With no input on terminals B and C, the LED should not be lit and the Status should be “Off.”

4. If the unit fails to operate, make sure a correct value for the module resistor is being used.

3.5.5 Discrete Output Source Module

Equipment Required: Multimeter Personal Computer running ROCLINK configuration software

1. Place the Discrete Output in manual mode (Scanning Disabled) using ROCLINK configuration

software.

2. With the output Status set to “Off,” less than 0.5 volts dc should be measured across pins B and

pin C.

3. With the output Status set to “On,” approximately 1.5 volts dc less than the system voltage

–1.5) should be measured across terminals A and B.

4. If these values are not measured, check to see if the module fuse is open, verify the module is

wired correctly, and verify the load current requirement does not exceed the 57-milliamps current limit value of the module.

3.5.6 Discrete Output Isolated Module

Equipment Required: Multimeter Personal Computer running ROCLINK configuration software

1. Place the Discrete Output in manual mode (Scanning Disabled) using ROCLINK configuration

software.

2. Set the output Status to “Off” and measure the resistance across terminals A and B. No

continuity should be indicated.

3. Set the output Status to “On” and measure the resistance across terminals A and B. A reading of

15 kilohms or less should be obtained.

3-24 Input and Output Modules Rev Jun/05

Page 59

ROC364 Instruction Manual

3.5.7 Discrete Output Relay Module

Equipment Required: Multimeter Personal Computer running ROCLINK configuration software

1. Place the Discrete Output in manual mode (Scanning Disabled) using ROCLINK configuration

software.

2. Set the output Status to “Off” and measure the resistance across terminals B and C. A reading of

0 ohms should be obtained.

3. Measure the resistance across terminals A and B. No continuity should be indicated.

4. Set the output Status to “On” and measure the resistance across terminals B and C. No continuity

should be indicated.

5. Measure the resistance across terminals A and B. A reading of 0 ohms should be obtained.

3.5.8 Pulse Input Source and Isolated Modules

Equipment Required: Pulse Generator Voltage Generator Frequency Counter Jumper wire

For both types of modules, there are two methods of testing.

♦ Testing Pulse Input High-Speed Operation on page 3-25. ♦ Testing Pulse Input Low-Speed Operation on page 3-25.



NOTE: When checking the operation of the Pulse Input Source and Isolated modules, ensure

the scan rate for the Pulse Input is once every 6.5 seconds or less as set by ROCLINK configuration software.

3.5.8.1 Testing Pulse Input High-Speed Operation

To verify high-speed operation:

1. Connect a pulse generator having sufficient output to drive the module to terminals B and C.

2. Connect a frequency counter across terminals B and C.

3. Set the pulse generator to a value equal to, or less than 10 kilohertz.

4. Set the frequency counter to count pulses.

5. Verify the count read by the counter and the total accumulated count (Accumulated Pulses) read

by the ROC are the same using ROCLINK configuration software.

3.5.8.2 Testing Pulse Input Low-Speed Operation

To verify low-speed operation of the PI Source module:

1. Alternately jumper across terminals B and C.

2. The module LED should cycle on and off, and the total accumulated count (Accumulated Pulses)

should increase.

3-25 Input and Output Modules Rev Jun/05

Page 60

ROC364 Instruction Manual

To verify low-speed operation of the PI Isolated module:

1. Alternately supply and remove an input voltage across terminals B and C.

2. The module LED should cycle on and off, and the total accumulated count (Accumulated Pulses)

should increase.

3.5.9 Slow Pulse Input Source Module

Equipment Required: Jumper wire To verify low-speed operation of the PI Source module:

1. Connect and remove a jumper across terminals B and C several times to simulate slow switching.

2. The module LED should cycle on and off and the total accumulated count (Accumulated Pulses)

should increase.

3.5.10 Slow Pulse Input Isolated Module

Equipment Required: Jumper wire To verify low-speed operation of the PI Isolated module:

1. Alternately supply and remove an input voltage across terminals B and C.

2. The module LED should cycle on and off and the total accumulated count (Accumulated Pulses)

should increase.

3.5.11 Low-Level Pulse Input Module

Equipment Required: Pulse Generator Frequency Counter Personal Computer running ROCLINK configuration software



NOTE: When checking the operation of the Low-Level Pulse Input module, ensure that the Scan

Period for the Pulse Input is once every 22 seconds or less as set by ROCLINK configuration software.

To verify operation:

1. Connect a pulse generator, with the pulse amplitude set at less than 3 volts, to terminals B and C.

2. Connect a frequency counter across terminals B and C. Set the pulse generator to a value equal to

or less than 3 kilohertz.

3. Set the frequency counter to count pulses.

4. Verify that the count read by the counter and in the total accumulated count (Accumulated

Pulses) read by the ROC are the same using ROCLINK configuration software.

3-26 Input and Output Modules Rev Jun/05

Page 61

ROC364 Instruction Manual

3.5.12 RTD Input Module

The RTD module is similar in operation to an AI module and uses the same troubleshooting and repair procedures. The RTD module can accommodate two-wire, three-wire, or four-wire RTDs. If two-wire RTDs are used, terminals B and C must be connected together. If any of the input wires are broken or not connected, ROCLINK configuration software indicates the “Raw A/D Input” value is either at minimum (less than 800) or maximum (greater than 4000) as follows:

♦ An open at terminal A gives a maximum reading. ♦ An open at terminal B gives a minimum reading. ♦ An open at terminal C gives a minimum reading.

To verify the operation of the RTD module:

1. Disconnect the RTD and connect a jumper between terminals B and C of the RTD module.

2. Connect an accurate resistor or decade resistance box with a value to give a low end reading

across terminals A and B. The resistance value required can be determined by the temperatureto-resistance conversion chart for the type of RTD being used.

3. Use ROCLINK configuration software to verify that the Raw A/D Input value changed and

reflects the Adjusted A/D 0% value.

4. Change the resistance to reflect a high temperature as determined by the temperature-to-

resistance conversion chart.

5. Verify that the Raw A/D Input value changed and reflects the Adjusted A/D 100% value.

3.5.13 HART Interface Module

The HART Interface Module provides the source for the HART devices and uses two test procedures to verify correct operation.

♦ Verify HART Integrity of Loop Power on page 3-27. ♦ Verify HART Communications on page 3-28.

3.5.13.1 Verify HART Integrity of Loop Power

Equipment Required: Multimeter

1. Measure voltage between terminals A and B to verify channel 1.

2. Measure voltage between terminals A and C to verify channel 2.

3. The voltage read in both measurements should reflect the value of +T less the voltage drop of the

HART devices. Zero voltage indicates an open circuit in the I/O wiring, a defective HART device, or a defective module.

3-27 Input and Output Modules Rev Jun/05

Page 62

ROC364 Instruction Manual

3.5.13.2 Verify HART Communications

Equipment Required: Dual-trace Oscilloscope In this test, the HART module and the ROC act as the host and transmit a polling request to each HART

device. When polled, the HART device responds. Use the oscilloscope to observe the activity on the two HART communication channels. There is normally one second from the start of one request to the start of the next request.

1. Attach one input probe to terminal B of the HART module and examine the signal for a polling

request and response for each HART device connected to this channel.

2. Attach the other input probe to terminal C and examine the signal for a polling request and

response for each HART device connected.

3. Compare the two traces. Signal bursts should not appear on both channels simultaneously.

Each device on one channel is polled before the devices on the other channel are polled. If a channel indicates no response, this could be caused by faulty I/O wiring or a faulty device. If the HART module tries to poll both channels simultaneously, this could be caused by a defective module, in which case the module must be replaced.

3.6 Removal, Addition, and Replacement Procedures

Use the following when removing, adding, or replacing I/O modules.

3.6.1 Impact on I/O Point Configuration

When an I/O module is replaced with the same type of I/O module, it is not necessary to reconfigure the ROC. Modules that are treated as the same type include:

♦ Discrete Input Isolated and DI Source Modules. ♦ Discrete Output Isolated, DO Source, and DO Relay Modules. ♦ Analog Input Loop, AI Differential, AI Source Modules, and RTD Input Modules. ♦ Pulse Input Isolated and PI Source Modules. ♦ Slow Pulse Input Isolated and SPI Source Modules.

If a module is to be replaced with one of the same type, but configuration parameters need to be changed, use ROCLINK configuration software to make the changes off-line or on-line. To minimize “down time” before you replace the module, perform changes (except for ROC Display and FST changes) off-line by first saving the ROC configuration to disk. Modify the disk configuration, replace the module, and then load the configuration file into the ROC.

To make changes on-line, replace the module, proceed directly to the configuration display for the affected point, and modify parameters as needed. Remember to consider the impact on FSTs and other points that reference the affected point.

Any added modules (new I/O points) start up with default configurations. Even though adding a module, removing a module, or moving a module to a new position in the ROC does not directly affect the configuration of other I/O points, it can affect the numbering of I/O points of the same type. This, in turn, can impact an FST or higher-level point because the referencing of I/O points is done by a sequence-based point number.

3-28 Input and Output Modules Rev Jun/05

Page 63

ROC364 Instruction Manual

For example, if you have AI modules installed in slots A7, A10, and A11, adding another AI module in slot A8 changes the point numbers of the Analog Inputs for modules in slots A10 and A11.

If one or more FSTs, or higher level points, such as a PID loop or AGA Flow, have been configured in the ROC, be sure to reconfigure them according to the changes in I/O modules. Operational problems will occur if you do not reconfigure the ROC.

3.6.2 Removing and Installing an I/O Module

Use the following procedure to remove/install an I/O module with the ROC power off. The procedure is performed using ROCLINK configuration software.

Change components only in an area known to be non-hazardous.

Failure to exercise proper electrostatic discharge precautions (such as wearing a grounded wrist strap) may reset the processor or damage electronic components, resulting in interrupted operations.

During this procedure all power will be removed from the ROC and devices powered by the ROC. Ensure that all connected input devices, output devices, and processes remain in a safe state when power is removed from the ROC and when power is restored to the ROC.

1. Perform a RAM backup as in Section 2, Troubleshooting and Repair.

2. Disconnect the input power by unplugging the 5-terminal connector.

3. Perform one of the following steps, depending on whether the module is to be removed or

installed: ♦ If removing the module, loosen the module retaining screw and remove the module by lifting

straight up. It may be necessary to rock the module gently while lifting.

♦ If installing the module, insert the module pins into the module socket. Press the module

firmly in place. Tighten the module retaining screw. Refer to Section 3.6.1, Impact on I/O Point Configuration, on page 3-28.

4. After the module is removed/installed, reconnect the input power.

5. Check the configuration data, ROC Displays, and FSTs, and load or modify them as required.

Load and start any user programs as needed.

6. If you changed the configuration, save the current configuration data to memory by selecting

ROC > Flags > Write to EEPROM or Flash Memory Save Configuration as instructed in the applicable ROCLINK configuration software user manual.

3-29 Input and Output Modules Rev Jun/05

Page 64

ROC364 Instruction Manual

7. If you changed the configuration, including the history database, FSTs, and ROC Displays, save

them to disk. Refer to Section 2, Troubleshooting and Repair, for more information on performing saves.

3.7 I/O Module Specifications

The specifications for the various I/O modules are given in this section.

3.7.1 Analog Input Modules—Loop and Differential

Analog Input Loop Module Specifications

FIELD WIRING TERMINALS

A: Loop Power (+T). B: Analog Input (+). C: Common (–).

INPUT

Type: Single-ended, voltage sense. Current loop

with scaling resistor (R1).

Loop Current: 0 to 25 mA maximum range. Actual

range depends on scaling resistor used.

Voltage Sensing: 0 to 5 V dc, software configured. Accuracy: 0.1% of full scale at 20 to 30°C (68 to

86°F). 0.5% of full scale at –40 to 70°C (–40 to 158°F).

Analog Input Differential Module Specifications

FIELD WIRING TERMINALS

A: Not used. B: Positive Analog Input (+). C: Negative Analog Input (–).

INPUT

Type: Voltage sense. Externally-powered current

loop sensing with scaling resistor (R1).

Voltage: 0 to 5 V dc, software configured. Accuracy: 0.1% of full scale at 20 to 30°C (68 to

86°F). 0.5% of full scale at –40 to 70°C (–40 to 158°F).

INPUT (CONTINUED)

Impedance: Greater than 400 kΩ (without scaling

resistor).

Normal Mode Rejection: 50 dB @ 60 Hz.

POWER REQUIREMENTS

Loop Source: 25 mA maximum, from ROC power

supply (V

Module: 4.9 to 5.1 V dc, 6 mA maximum; –4.5 to –

5.5 V dc, 2 mA maximum (supplied by ROC).

ISOLATION

Not isolated. Terminal C tied to power supply common.

INPUT (CONTINUED)

Normal Mode Rejection: 50 dB @ 60 Hz. Impedance: Greater than 400 kΩ (without scaling

resistor).

POWER REQUIREMENTS

4.9 to 5.1 V dc, 6 mA maximum; –4.5 to –5.5 V dc,

2 mA maximum (supplied by ROC).

INPUT ISOLATION

Greater than 400 kΩ input to power supply common.

= 11 to 30 V dc).

3-30 Input and Output Modules Rev Jun/05

Page 65

ROC364 Instruction Manual

Analog Input Modules—Loop and Differential Common Specifications

SCALING RESISTOR

250 Ω (supplied) for 0 to 20 mA full scale. 100 Ω for 0 to 50 mA (externally-powered only).

RESOLUTION

12 bits.

FILTER

Single pole, low-pass, 40-ms time constant.

CONVERSION TIME

30 µs typical.

VIBRATION

20 Gs peak or 0.06 in. double amplitude, 10 to 2,000 Hz, per MIL-STD-202 method 204 condition F.

MECHANICAL SHOCK

1500 Gs 0.5 ms half sine per MIL-STD-202 method 213, condition F.

CASE

Solvent-resistant thermoplastic polyester, meets UL94V-0. Dimensions are 15 mm D by 32 mm H by 43 mm W (0.60 in. D by 1.265 in. H by 1.69 in. W), not including pins.

ENVIRONMENTAL

Meets the Environmental specifications of the ROC, in which the module is installed, including Temperature, Humidity, and Transient Protection specifications.

WEIGHT

37 g (1.3 oz).

APPROVALS

Approved by CSA for hazardous locations Class I, Division 2, Groups A, B, C, and D.

3-31 Input and Output Modules Rev Jun/05

Page 66

ROC364 Instruction Manual

3.7.2 Analog Input Source Module

Analog Input Source Specifications

FIELD WIRING TERMINALS

A: 10 V dc. B: Analog Input. C: Common.

INPUT

Type: Single-ended, voltage sense; can be current

loop if scaling resistor (not supplied) is used.

Voltage: 0 to 5 V dc, software configurable. Resolution: 12 bits. Accuracy: 0.1% of full scale at 20 to 30°C (68 to

86°F). 0.5% of full scale at –40 to 65°C (–40 to

149°F). Impedance: Greater than 400 kΩ (without scaling

resistor).

Normal Mode Rejection: 50 db @ 60 Hz.

SOURCE POWER

9.99 to 10.01 V dc, 20 mA maximum.

POWER REQUIREMENTS

4.9 to 5.1 V dc, 6 mA maximum; –4.5 to –5.5 V dc, 2 mA maximum (all supplied by ROC).

INPUT ISOLATION

Not isolated. Terminal C is tied to power supply ground.

SURGE WITHSTAND

Meets IEEE 472 / ANSI C37.90a.

FILTER

Single pole, low-pass, 40 ms time constant.

CONVERSION TIME

30 µs typical.

VIBRATION

20 Gs peak or 0.06 in. double amplitude, 10 to 2,000 Hz, per MIL-STD-202 method 204 condition F.

MECHANICAL SHOCK

1500 Gs 0.5 ms half sine per MIL-STD-202,

method 213, condition F.

CASE

Solvent-resistant thermoplastic polyester, meets UL94V-0. Dimensions 15 mm D by 32 mm H by 43 mm W (0.6 in. D by 1.265 in. H by 1.690 in. W), not including pins.

ENVIRONMENTAL

Meets the Environmental specifications of the ROC, in which the module is installed, including

Temperature, Humidity, and Transient Protection.

WEIGHT

37 g (1.3 oz).

APPROVALS

Approved by CSA for hazardous locations Class I, Division 2, Groups A, B, C, and D.

3.7.3 Analog Output Source Module

FIELD WIRING TERMINALS

A: Voltage Output. B: Current Output. C: Common.

VOLTAGE OUTPUT

Type: Voltage source. Range: 1 to 5 V dc with 0 to 5.25 V dc

overranging. 25 mA maximum.

Resolution: 12 bits.

3-32 Input and Output Modules Rev Jun/05

Analog Output Source Specifications

VOLTAGE OUTPUT (CONTINUED)

Accuracy: 0.1% of full-scale output from 20 to

30°C (68 to 86°F). 0.5% of full-scale output for –40 to 65°C (–40 to 149°F).

Settling Time: 100 µs maximum. Reset Action: Output returns to zero percent

output or last value (software configurable) on power-up (Warm Start) or on watchdog timeout.

Page 67

ROC364 Instruction Manual

Analog Output Source Specifications (Continued)

CURRENT OUTPUT

Type: Current loop. Range: 4 to 20 mA with 0 to 22 mA overranging,

adjusted by scaling resistor. A 0 Ω resistor is supplied.

Loop Source: 11 to 30 V dc, as supplied by ROC

for “+T” power (typically 24 V dc).

Loop Resistance at 12 V dc: 0 Ω minimum,

250 Ω maximum.

Loop Resistance at 24 V dc: 200 Ω minimum,

750 Ω maximum.

Resolution: 12 bits. Accuracy: 0.1% of full-scale output at 20 to 30°C

(68 to 86°F). 0.5% of full-scale at –40 to 65°C (–40 to 149°F).

Settling Time: 100 µs maximum. Reset Action: Output returns to zero percent

output or last value (software configurable) on power-up (Warm Start) or on watchdog timeout.

POWER REQUIREMENTS

Module Alone: 24 mW typical. Module w/Current Loop: 400 mW @ 4 mA output

to 590 mW @ 20 mA output.

OUTPUT ISOLATION

Not isolated. Terminal C tied to power supply common.

VIBRATION

20 Gs peak or 0.06 in. double amplitude, 10 to 2,000 Hz, per MIL-STD-202 method 204 condition F.

MECHANICAL SHOCK

1500 Gs 0.5 ms half sine per MIL-STD-202, method 213, condition F.

WEIGHT

37 g (1.3 oz) typical.

CASE

Solvent-resistant thermoplastic polyester, meets UL94V-0. Dimensions are 15 mm by 32 mm by 43 mm (0.6 in. D by 1.265 in. H by 1.69 in. W), not including pins.

ENVIRONMENTAL

Meets the Environmental specifications of the ROC in which the module is installed, including Temperature, Humidity, and Transient Protection.

APPROVALS

Approved by CSA for hazardous locations Class I, Division 2, Groups A, B, C, and D.

3.7.4 Discrete Input Modules—Source and Isolated

Discrete Input Source Module Specifications

FIELD WIRING TERMINALS

A: Not used. B: Discrete device source/signal. C: Common.

INPUT

Type: Contact sense. Range: Inactive: 0 to 0.5 mA. Active: 2 to 9 mA. Source Voltage: 11 to 30 V dc. Source Current: Determined by source voltage

(Vs), loop resistance (Rl), and scaling resistor (Rs, 10 Ω supplied): I = (Vs – 1)/(3.3K + Rl + Rs)

POWER REQUIREMENTS

Source Input: 9 mA maximum from ROC power

supply.

Module: 4.9 to 5.1 V dc, 1 mA maximum (supplied

by ROC).

INPUT ISOLATION

Not isolated. Terminal C tied to power supply common.

3-33 Input and Output Modules Rev Jun/05

Page 68

ROC364 Instruction Manual

Discrete Input Isolated Module Specifications

FIELD WIRING TERMINALS

A: Not used. B: Positive Discrete Input. C: Negative Discrete Input.

INPUT

Type: Two-state current sense. Range: Inactive: 0 to 0.5 mA. Active: 2 to 9 mA. Current: Determined by input voltage (Vi), loop

resistance (Rl), and scaling resistor (Rs), 10 Ω supplied): I = (Vi – 1)/(3.3K + Rl + Rs)

Maximum Voltage: 30 V dc forward, 5 V dc

reverse.

Discrete Input Modules—Source and Isolated Common Specifications

INPUT

Loop Resistance (Rl): 4.5 kΩ maximum. Frequency Response: 0 to 10 Hz maximum, 50%

Duty Cycle.

Input Filter (Debounce): Software filter is

configured as the amount of time that the input must remain in the active state to be recognized.

VIBRATION

20 Gs peak or 0.06 in. double amplitude, 10 to 2,000 Hz, per MIL-STD-202 method 204 condition F.

MECHANICAL SHOCK

1500 Gs 0.5 ms half sine per MIL-STD-202 method 213, condition F.

POWER REQUIREMENTS

4.9 to 5.1 V dc, 1 mA maximum (supplied by ROC).

INPUT ISOLATION

Isolation: 100 Ω minimum, input to output, and

input or output to case.

Voltage: 4,000 V ac (RMS) minimum, input to

output.

Capacitance: 6 pF typical, input to output.

WEIGHT

37 g (1.3 oz).

CASE

Solvent-resistant thermoplastic polyester, meets UL94V-0. Dimensions are 15 mm D by 32 mm H by 43 mm W (0.60 in. D by 1.27 in. H by 1.69 in. W), not including pins.

ENVIRONMENTAL

Meets the Environmental specifications of the ROC in which the module is installed, including Temperature, Humidity, and Transient Protection.

APPROVALS

Approved by CSA for hazardous locations Class I, Division 2, Groups A, B, C, and D.

3-34 Input and Output Modules Rev Jun/05

Page 69

ROC364 Instruction Manual

3.7.5 Discrete Output Modules—Source and Isolated

Discrete Output Source Module Specifications

FIELD WIRING TERMINALS

A: Not used. B: Positive (to field device). C: Negative.

OUTPUT

Type: Solid-state relay, current sourced, normally-

open.

Active Voltage: 11 to 30 V dc provided. Active Current: Limited to 57 mA. Inactive Current: Less than 100 µA with 30 V dc

source.

Frequency: 0 to 10 Hz maximum.

Discrete Output Isolated Module Specifications

FIELD WIRING TERMINALS

A: Positive (field device power). B: Negative. C: Not Used.

OUTPUT

Type: Solid-state relay, normally-open. Active Voltage: 11 to 30 V dc. Active Current: Fuse-limited to 1.0 A continuous at

75°C (167°F), externally supplied.

Inactive Current: Less than 100 µA at 30 V dc. Frequency: 0 to 10 Hz maximum.

POWER REQUIREMENTS

Output Source: 11 to 30 V dc, 57 mA maximum

from ROC power supply.

Module: 4.9 to 5.1 V dc. 1 mA in “Off” state and 6

mA in “On” state.

OUTPUT ISOLATION

Not isolated. Terminal C tied to power supply common.

POWER REQUIREMENTS

4.9 to 5.1 V dc. 1 mA in “Off” state and 6 mA in “On” state.

OUTPUT ISOLATION

Isolation: 100 MΩ minimum, input to output, and

input or output to case.

Voltage: 4,000 V ac (RMS) minimum, input to

output.

Capacitance: 6 pF typical, input to output.

Discrete Output Modules—Source and Isolated Common Specifications

VIBRATION

20 Gs peak or 0.06 in. double amplitude, 10 to 2,000 Hz, per MIL-STD-202 method 204 condition F.

MECHANICAL SHOCK

1500 Gs 0.5 ms half sine per MIL-STD-202, method 213, condition F.

CASE

Solvent-resistant thermoplastic polyester, meets UL94V-0. Dimensions are 15 mm D by 32 mm H by 43 W mm (0.6 in. D by 1.265 in. H by 1.690 in. W), not including pins.

3-35 Input and Output Modules Rev Jun/05

ENVIRONMENTAL

Meets the Environmental specifications of the ROC in which the module is installed, including Temperature, Humidity, and Transient Protection.

WEIGHT

37 g (1.3 oz) typical.

APPROVALS

Approved by CSA for hazardous locations Class I, Division 2, Groups A, B, C, and D.

Page 70

ROC364 Instruction Manual

3.7.6 Discrete Output Relay Module

Discrete Output Relay Module Specifications

FIELD WIRING TERMINALS

A: Normally-open contacts. B: Common. C: Normally-closed contacts.

OUTPUT

Type: SPDT dry relay contact. Maximum Contact Rating (Resistive Load):

30 V dc, 4 Amps. 125 V ac, 4 Amps.

250 V ac, 2 Amps.

Frequency: 0 to 10 Hz maximum.

OUTPUT ISOLATION

Isolation: 10 MΩ minimum, input to output, and

input or output to case.

Voltage: 3,000 V ac (RMS) minimum, input to

output.

POWER REQUIREMENTS

12 V dc Version: 4.9 to 5.1 V dc, 1 mA for module.

12 V dc, 25 mA for relay coil (energized) typical.

24 V dc Version: 4.9 to 5.1 V dc, 1 mA for module.

24 V dc, 12.5 mA for relay coil (energized) typical.

VIBRATION

21 G peak or 0.06" double amplitude, 10-2000 Hz per MIL-Std-202, Method 204, Condition F.

MECHANICAL SHOCK

1500 G 0.5 ms half sine per MIL-Std-202, Method 213, Condition F.

WEIGHT

37 g (1.3 oz) typical.

CASE

Solvent-resistant thermoplastic polyester, meets UL94V-0. Dimensions are 15 mm D by 32 mm H by 43 mm W (0.6 in. D by 1.265 in. H by 1.690 in. W), not including pins.

ENVIRONMENTAL

Meets the Environmental specifications of the ROC in which the module is installed, including Temperature, Humidity, and Transient Protection.

APPROVALS

Approved by CSA for hazardous locations Class I, Division 2, Groups A, B, C, and D.

3.7.7 Pulse Input Modules—Source and Isolated

Pulse Input Source Module Specifications

FIELD WIRING TERMINALS

A: Not used. B: Pulse Input/source voltage. C: Common.

INPUT

Type: Contact sense. Source Voltage: 11 to 30 V dc. Range: Inactive: 0 to 0.5 mA. Active: 3 to 12 mA. Source Current: Determined by source voltage

(Vs), loop resistance (Rl) and scaling resistor (Rs): I = (Vs – 1)/(2.2K + Rl + Rs)

POWER REQUIREMENTS

Source Input: 11 to 30 V dc, 6 mA maximum from

ROC power supply.

Module: 4.9 to 5.1 V dc, 1 mA maximum (supplied

by ROC).

INPUT ISOLATION

Not isolated. Terminal C tied to power supply common.

3-36 Input and Output Modules Rev Jun/05

Page 71

ROC364 Instruction Manual

Pulse Input Isolated Module Specifications

FIELD WIRING TERMINALS

A: Not used. B: Positive Pulse Input. C: Negative Pulse Input.

INPUT

Type: Two-state, current-pulse sense. Range: Inactive: 0 to 0.5 mA. Active: 3 to 12 mA. Input Current: Determined by input voltage (Vi),

loop resistance (Rl) and scaling resistor (Rs): I = (Vi – 1)/(2.2K + Rl + Rs)

Pulse Input Modules—Source and Isolated Common Specifications

INPUT

Scaling Resistor (Rs): 10 Ω supplied (see Input

Source Current equation to compute other value).

Frequency Response: 0 to 12 kHz maximum, 50%

Duty Cycle.

Input Filter: Single-pole low-pass, 10 µs time

constant.

VIBRATION

20 Gs peak or 0.06 in. double amplitude, 10 to 2,000 Hz, per MIL-STD-202 method 204 condition F.

MECHANICAL SHOCK

1500 Gs 0.5 ms half sine per MIL-STD-202, method 213, condition F.

POWER REQUIREMENTS

4.9 to 5.1 V dc, 2 mA maximum (supplied by ROC).

INPUT ISOLATION

Isolation: 100 MΩ minimum, input to output, and

input or output to case.

Voltage: 4,000 V ac (RMS) minimum, input to

output.

Capacitance: 6 pF typical, input to output.

WEIGHT

37 g (1.3 oz).

CASE

Solvent-resistant thermoplastic polyester, meets UL94V-0. Dimensions are 15 mm D by 32 mm H by 43 mm W (0.60 in. D by 1.27 in. H by 1.69 in. W), not

including pins.

ENVIRONMENTAL

Meets the Environmental specifications of the ROC in which the module is installed, including Temp-

erature, Humidity, and Transient Protection.

APPROVALS

Approved by CSA for hazardous locations Class I, Division 2, Groups A, B, C, and D.

3-37 Input and Output Modules Rev Jun/05

Page 72

ROC364 Instruction Manual

3.7.8 Slow Pulse Input Modules—Source and Isolated

Slow Pulse Input Source Module Specifications

MODULE RACK TERMINALS

A: Not used. B: Input/source voltage. C: Common.

INPUT

Type: Contact sense. Range: Inactive: 0 to 0.5 mA. Active: 2 to 9 mA. Source Voltage: 11 to 30 V dc. Source Current: Determined by source voltage

(Vs), loop resistance (Rl), and scaling resistor (Rs): I = (Vs – 1)/(3.3K + Rl + Rs)

Slow Pulse Input Isolated Module Specifications

FIELD WIRING TERMINALS

A: Not used. B: Positive input. C: Negative input.

INPUT

Type: Two-state current sense. Range: Inactive: 0 to 0.5 mA. Active: 2 to 9 mA. Current: Determined by input volt-age (Vi), loop

resistance (Rl), and scaling resistor (Rs): I = (Vi – 1)/(3.3K + Rl + Rs)

Maximum Voltage: 30 V dc forward, 5 V dc

reverse.

POWER REQUIREMENTS

Source Input: 11 to 30 V dc, 9 mA maximum from

ROC power supply.

Module: 4.9 to 5.1 V dc, 1 mA maximum (supplied

by ROC).

INPUT ISOLATION

Not isolated. Terminal C tied to power supply common.

POWER REQUIREMENTS

4.9 to 5.1 V dc, 1 mA maximum (supplied by ROC).

INPUT ISOLATION

Isolation: 100 MΩ minimum, input to output, and

input or output to case.

Voltage: 4,000 V ac (RMS) minimum, input to

output.

Capacitance: 6 pF typical, input to output.

Slow Pulse Input Modules—Source and Isolated Common Specifications

INPUT

Loop Resistance (Rl): 4.5 kΩ maximum for best

efficiency.

Scaling Resistor (Rs): 10 Ω supplied (see Input

Source Current equation to compute other value).

Frequency Response: 0 to 10 Hz maximum, 50%

Duty Cycle.

Input Filter (Debounce): 50 ms.

VIBRATION

20 Gs peak or 0.06 in. double amplitude, 10 to 2,000 Hz, per MIL-STD-202 method 204 condition F.

MECHANICAL SHOCK

1500 Gs 0.5 ms half sine per MIL-STD-202 method 213, condition F.

3-38 Input and Output Modules Rev Jun/05

WEIGHT

37 g (1.3 oz).

CASE

Solvent-resistant thermoplastic polyester, meets UL94V-0. Dimensions 15 mm D by 32 mm H by 43 mm W (0.6 in. D by 1.265 in. H by 1.690 in. W), not including pins.

ENVIRONMENTAL

Meets the Environmental specifications of the ROC in which the module is installed, including Temperature, Humidity, and Transient Protection.

APPROVALS

Approved by CSA for hazardous locations Class I, Division 2, Groups A, B, C, and D.

Page 73

ROC364 Instruction Manual

3.7.9 Pulse Input Module—Low Level

Pulse Input Module—Low Level Specifications

MODULE RACK TERMINALS

A: Not used. B: Positive Pulse Input. C: Negative Pulse Input.

INPUT

Type: Two-state, voltage-pulse sense. Active Range: 30 mV minimum to 3 V maximum,

peak-to-peak.

Frequency Response: 0 to 3 kHz, 50% Duty

Cycle.

Impedance: 500 kΩ.

POWER REQUIREMENTS

4.9 to 5.1 V dc, 2 mA maximum (supplied by ROC).

INPUT ISOLATION

Isolation: 10 MΩ minimum, input or output to case. Voltage: 4,000 V ac (RMS) minimum, input to

output.

Capacitance: 6 pF typical, input to output.

VIBRATION

20 Gs peak or 0.06 in. double amplitude, 10 to 2,000 Hz, per MIL-STD-202 method 204 condition F.

MECHANICAL SHOCK

1500 Gs 0.5 ms half sine per MIL-STD-202, method 213, condition F.

CASE

Solvent-resistant thermoplastic polyester, meets UL94V-0. Dimensions 15 mm D by 32 H mm by 43 mm (W

0.60 in. D by 1.27 in. H by 1.69 in. W), not

including pins.

WEIGHT

37 g (1.3 oz).

ENVIRONMENTAL

Meets the Environmental specifications of the ROC in which the module is installed, including Temperature, Humidity, and Transient Protection.

APPROVALS

Approved by CSA for hazardous locations Class I, Division 2, Groups A, B, C, and D.

3-39 Input and Output Modules Rev Jun/05

Page 74

ROC364 Instruction Manual

3.7.10 Resistance Temperature Detector (RTD) Input Module

Resistance Temperature Detector (RTD) Input Module Specifications

FIELD WIRING TERMINALS

A: RTD “Red” Input. B: RTD “White” Input. C: RTD “White” Input (3- or 4-wire).

INPUT

RTD Type: 100 Ω, platinum, with a temperature

coefficient of 0.3850*, 0.3902, 0.3916, 0.3923, or

0.3926 Ω/°C.

Temperature Range: Fixed at –50 to 100°C

(–58 to 212°F).

Excitation Current: 0.8 mA. Impedance: 4 MΩ minimum. Filter: Single pole, low pass, 4 Hz corner

frequency.

RESOLUTION

12 bits.

ACCURACY

± 0.1% of Input Temp. Range at Operating Temp. from 23 to 27°C (73 to 81°F). ± 0.45% of Input Temp. Range at Operating Temp. from 0 to 70°C (32 to 158°F). ± 0.8% of Input Temp. Range at Operating Temp. from –20 to 0°C (–4 to 32°F).

LINEARITY

± 0.03% ± 1 LSB independent conformity to a straight line.

* Available as an accessory.

POWER REQUIREMENT

11 to 30 V dc, 38 mA maximum, supplied by ROC power supply.

VIBRATION

20 Gs peak or 0.06 in. double amplitude, 10 to 2,000 Hz, per MIL-STD-202 method 204 condition F.

MECHANICAL SHOCK

1500 Gs 0.5 ms half sine per MIL-STD-202 method 213, condition F.

ENVIRONMENTAL

Meets the Environmental specifications of the ROC in which the module is installed, including Temperature and Humidity.

WEIGHT

37 g (1.3 oz).

CASE

Solvent-resistant thermoplastic polyester, meets UL94V-0. Dimensions are 15 mm D by 32 mm H by 43 mm W (0.60 in. D by 1.265 in. H by 1.69 in. W), not including pins.

APPROVALS

Approved by CSA for hazardous locations Class I, Division 2, Groups A, B, C, and D.

3-40 Input and Output Modules Rev Jun/05

Page 75

ROC364 Instruction Manual

3.7.11 HART Interface Module

HART Interface Module Specifications

FIELD WIRING TERMINALS

A: Loop Power (+T). B: Channel 1 (CH1). C: Channel 2 (CH2).

CHANNELS

Two HART-compatible channels, which communicate via digital signals only.

Mode: Half-duplex. Data Rate: 1200 bps asynchronous. Parity: Odd. Format: 8 bit. Modulation: Phase coherent, Frequency Shift

Keyed (FSK) per Bell 202.

Carrier Frequencies: Mark: 1200 Hz.

Space: 2200 Hz, ± 0.1%.

HART MODULES AND DEVICES SUPPORTED

Up to six HART Modules and 32 HART devices maximum.

Point-to-Point Mode: Two HART devices per

module (one per channel).

Multi-drop Mode: Up to ten HART devices per module (five per channel).

LOOP POWER

Total power supplied through module for HART devices is 20 mA per channel at 10 to 29 V dc. Each HART device typically uses 4 mA.

VIBRATION

20 Gs peak or 0.06 in. double amplitude, 10 to 2,000 Hz, per MIL-STD-202 method 204 condition F.

MECHANICAL SHOCK

1500 Gs 0.5 ms half sine per MIL-STD-202, method 213, condition F.

WEIGHT

48 g (1.7 oz) nominal.

CASE

Solvent-resistant thermoplastic polyester, meets UL94V-0. Dimensions 15 mm D by 51 mm H by 43 mm W (0.60 in. D by 2.00 in. H by 1.69 in. W), not including pins.

ENVIRONMENTAL

Meets the Environmental specifications of the ROC in which the module is installed, including Temperature, Humidity, and Surge specifications.

APPROVALS

Approved by CSA for hazardous locations Class I, Division 2, Groups A, B, C, and D.

POWER REQUIREMENTS

Loop Source: 11 to 30 V dc, 40 mA maximum

from ROC power supply.

Module: 4.9 to 5.1 V dc, 17 mA maximum.

3-41 Input and Output Modules Rev Jun/05

Page 76

ROC364 Instruction Manual

SECTION 4 – COMMUNICATIONS CARDS

4.1 Scope

This section describes the communications cards used with the Remote Operations Controllers. This section contains the following information:

Section

4.1 Scope 4-1

4.2 Product Descriptions 4-1

4.3 Installing Communications Cards 4-8

4.4 Connecting Communications Cards to Wiring 4-12

4.5 Troubleshooting and Repair 4-19

4.6 Communication Card Specifications 4-21

Page

4.2 Product Descriptions

The communications cards provide communications between the ROC and a host system or external devices. The ROC364 provide room for two communications cards. The communications cards install directly onto the Master Controller Unit (MCU) board and activate communications ports (COM1 and COM2) when installed. The following cards are available:

♦ EIA-232 (RS-232) Serial Communications Card. ♦ EIA-422 / 485 (RS-422 / 485) Serial Communications Card. ♦ Radio Modem Communications Card. ♦ Leased-Line Modem Communications Card. ♦ Dial-Up Modem Communications Card.



NOTE: Refer to Form A6090 for information concerning the optional Remote MVS

Communications Card.



NOTE: Use a standard screwdriver with a slotted (flat bladed) 1/8-inch width tip when wiring all

terminal blocks.

4-1 Communications Cards Rev Jun/05

Page 77

ROC364 Instruction Manual

4.2.1 EIA-232 (RS-232) Serial Communications Card

The EIA-232 (RS-232) communications cards meet all EIA-232 (RS-232) specifications for singleended, asynchronous data transmission over distances of up to 15.24 meters (50 feet). The EIA-232 (RS-

232) communications cards provide transmit, receive, and modem control signals. Normally, not all of the control signals are used for any single application.

LED Indicators

Figure 4-1. EIA-232 (RS-232) Serial Communications Card

The current EIA-232 (RS-232) communications card includes LED indicators that display the status of the RXD, TXD, DTR, DCD, CTS, and RTS control lines. LED indicators are detailed in Table 4-1.

Refer to Section 4.4.1, EIA-232 (RS-232) Communications Card Wiring, on page 4-13.

4-2 Communications Cards Rev Jun/05

Page 78

ROC364 Instruction Manual

Table 4-1. Communications Card LED Indicators

LED Status and Activity

RXD

TXD

DTR

DCD The DCD data carrier detect LED lights when a valid carrier tone is detected.

CTS CTS indicates a clear to send message. RTS The RTS ready to send LED lights when the modem is ready to transmit.

RI The RI is the ring indicator LED light.

DSR The DSR is the data set ready indicator LED light.

NOTE: The last three LED indicators are used only on the Dial-up modem communications card.

The RXD receive data LED blinks when data is being received. The LED is on for a space and off

for a mark.

The TXD transmit data LED blinks when data is being transmitted. The LED is on for a space and

off for a mark.

The DTR data terminal ready LED lights when the modem is ready to answer an incoming call.

When DTR goes off, a connected modem disconnects.

The OH is the off hook indicator LED light. A dial tone has been detected and the telephone line is

in use by your modem.

4-3 Communications Cards Rev Jun/05

Page 79

ROC364 Instruction Manual

4.2.2 EIA-422/485 (RS-422/485) Serial Communications Card

The EIA-422/485 (RS-422/485) communication cards meet all EIA-422/485 (RS-422/485) specifications for differential, asynchronous transmission of data over distances of up to 1220 meters (4000 feet). The EIA-422 (RS-422) drivers are designed for party-line applications where one driver is connected to, and transmits on, a bus with up to ten receivers. The EIA-485 (RS-485) drivers are designed for true multipoint applications with up to 32 drivers and 32 receivers on a single bus. Refer to Figure 4-2.



NOTE: EIA-422 (RS-422) devices cannot be used in a true multi-point application where

multiple drivers and receivers are connected to a single bus and any one of them can transmit or receive data.

LED Indicators

P4 Jumper

Figure 4-2. EIA-422/485 (RS-422/485) Serial Communications Card

The current EIA-422/485 (RS-422/485) communications card includes LED indicators that display the status of the RXD, TXD, and RTS control lines. LED indicators are detailed in Table 4-1. Jumper P4 applies to the transmit mode. The default setting (RTS jumper on) allows a multi-drop configuration, such as is normally possible with EIA-485 (RS-485) communications. Refer to Section 4.4.2, EIA-422/485 (RS-422 / 485) Communications Card Wiring, on page 4-14 for more information.

4-4 Communications Cards Rev Jun/05

Page 80

ROC364 Instruction Manual

4.2.3 Radio Modem Communications Card

The Radio Modem Communications Card sends and receives full-duplex or half-duplex, asynchronous Frequency Shift Keyed (FSK) signals to the audio circuit of a two-way radio. The modem incorporates a solid-state push-to-talk (PTT) switch for keying the radio transmitter. Refer to Figure 4-3.

LED indicators on the card show the status of the RXD, TXD, DTR, DCD, CTS, and RTS control lines. LED indicators are detailed in Table 4-1 on page 4-3.

Jumper P6 determines whether the PTT signal is isolated or grounded. Use connector P7 signals for monitoring or connecting to an analyzer. Refer to Section 4.3.1, Setting Modem Card Jumpers, on page 4-10 for more information.

The output attenuation can be reduced, as necessary, to better match the modem output to the line or radio. Plugging a resistor into the card at R2 makes the adjustment. Refer to Section 4.3.2, Setting Modem Card Attenuation Levels, on page 4-11.

Refer to Section 4.4.3, Radio Modem Communications Card Wiring, on page 4-15.

LED Indicators

CR1CR2CR3CR4CR5

CR6

FB2

FB3

FB4

RP2

R24

C26

TXDDCDCTS DTR RXD

RTS

RP1

LEASED LINE/RADIO MODEM

FB1

C10

C22

C23

C24

C25

C27

2W 2

R12

ISO

GND

C11

FB5

COM PORTS

2 4

C12

C13

C14

FB6

R10

R11

R25

C29

C28

R2 Attenuation

VR1

R26

C15 C16 R13 R14 R15

CR7

CR8 R16 C17 R17 R18

R19 R20

R21

R22

C18

R23

U10

VR3 VR4 VR5 VR6

C19

VR2

C20

DOC0247A

P6 Jumper

C21

P7 Connector

Figure 4-3. Radio Modem Communications Card

4-5 Communications Cards Rev Jun/05

Page 81

ROC364 Instruction Manual

4.2.4 Leased-Line Modem Communications Card

The Leased-Line Modem Communications Card is a 202T modem that is FCC part 68 tested for use with leased-line or private-line telephone networks. Refer to Figure 4-4. Two- or four-wire, half- or fullduplex asynchronous operation is supported at a software selectable 300, 600, and 1200 baud to Bell and CCITT standards.

LED indicators on the card show the status of the RXD, TXD, DTR, DCD, CTS, and RTS control lines. LED indicators are detailed in Table 4-1 on page 4-3.

The Leased-Line Modem Communications Card has three jumpers (P3, P4, and P5) that permit either two-wire or four-wire operation. Use connector P7 signals for monitoring or connecting to an analyzer. Refer to Section 4.3.1, Setting Modem Card Jumpers, on page 4-10 for more information.

Refer to Section 4.4.4, Leased-Line Modem Communications Card Wiring, on page 4-16.

LED Indicators

TXDDTR RXD

DCD

RTS CTS

RP1

LEASED LINE/RADIO MODEM

FB2

FB3

FB4

CR3 CR2 CR1

CR4

CR6 CR5

RP2

R24

C26

FB1

C10

C22

C23C24

C25

C27

2W 4W

R12R8R9

R11

ISO

GND

FB5

COM PORTS

C29

2 4

C12

C11

C13

C14

FB6

R10

R25

C28

R2 Attenuation

VR1

R26

VR2

P3 Jumper

P4 Jumper

P5 Jumper

C15 C16 R13 R14 R15

CR7

CR8 R16 C17 R17 R18 R19 R20

R21

R22

C18

R23

VR3 VR4 VR5 VR6

C19

C20

C21

DOC0246A

P7 Connector

U10

Figure 4-4. Leased-Line Modem Communications Card

4-6 Communications Cards Rev Jun/05

Page 82

ROC364 Instruction Manual

4.2.5 Dial-Up Modem Communications Card

The Dial-up Modem Communications Card supports V.22 bis / 2400 baud communications with autoanswer/auto-dial features. The modem card is FCC part 68 approved for use with public-switched telephone networks (PSTNs). The FCC label on the card provides the FCC registration number and the ringer equivalent. The modem card has automatic adaptive and fixed compromise equalization, eliminating the need to adjust ports or move jumpers during installation and setup. Refer to Figure 4-6 and Figure 4-5.

The modem card interfaces to two-wire, full-duplex telephone lines using asynchronous operation at data rates of 600, 1200, or 2400. The card interfaces to a PSTN through an RJ11 jack. The modem can be controlled using industry-standard AT command software. A 40-character command line is provided for the AT command set, which is compatible with EIA document TR302.2/88-08006.

The modem automatically hangs up after a configured period of communications inactivity. Automated Dial-up Spontaneous-Report-by-Exception (SRBX) alarm reporting capabilities are possible with the FlashPAC. Refer to the appropriate ROCLINK user manual for configuration information.

LED indicators on the card show the status of the RXD, TXD, DTR, DSR, RI, and OH control lines. Refer to Table 4-1. The modem card also provides EIA-232 (RS-232) level output signals for an analyzer at the COM1 or COM2.

Refer to Section 4.4.5, Dial-Up Modem Communications Card Wiring, on page 4-18.

LED Indicators

Figure 4-5. Dial-up Modem Communications Card – New

4-7 Communications Cards Rev Jun/05

DOC0389A

Page 83

ROC364 Instruction Manual

LED Indicators

FB1

TXDDTR RXD

DSR

OH RI

FB6

RP1

CR2

CR3

CR4

CR5

CR6

CR7

C8 C9

FB4

R3 R4

COM PORTS

CR1

FB5

C10

C11

C12

FB2

FB3

C13

FB7

C14

C16

C17

C18

C15

FB8

DOC0245A

C19

Figure 4-6. Dial-up Modem Communications Card – Old

4.3 Installing Communications Cards

The following procedures assume the first-time installation of a communications card in a ROC that is currently not in service. For units currently in service, refer to the procedures in Section 4.5,

Troubleshooting and Repair, on page 4-19.

Change components only in an area known to be non-hazardous.

Failure to exercise proper electrostatic discharge precautions (such as wearing a grounded wrist strap) may reset the processor or damage electronic components, resulting in interrupted operations.

To install a communications card, proceed as follows:

1. Remove the power from the ROC.

2. Remove the FlashPAC.

3. Remove the screws that hold the MCU upper cover in place, and lift off the cover.

4. Install the communications card onto the MCU. Orient the card with the COM PORTS arrow

pointing down. Plug the card into its mating connectors and gently press until the connectors firmly seat.

5. Install the retaining screw to secure the card. For Dial-up and Leased-Line communications

cards, continue with step 5; otherwise, proceed to step 7.

4-8 Communications Cards Rev Jun/05

Page 84

ROC364 Instruction Manual

6. Remove the plastic plug on the right-hand side of the ROC chassis and install the phone jack in

the hole. Figure 4-7 shows the jack location.

7. Connect the jack cable to the P2 connector on the communications card. You may discard the

square shim that accompanies the installation kit.

RJ11 Phone Jack

Figure 4-7. Phone Jack Location



NOTE: If you are installing a Dial-up or Leased-Line Modem Card, it is recommended that you

install a telephone-style surge protector between the RJ11 jack and the outside line.

8. If you are installing a Radio or Leased-Line Modem Card, be sure to set the jumpers on the card

in the proper position as described in Table 4-2, Jumper Positions for the Modem Cards, on page 4-10.

9. If you are installing a Radio or Leased-Line Modem Card, be sure to set the output attenuation

level as described in Table 4-3, Radio and Leased-Line Modem Communications Card Attenuation Levels, on page 4-11.

10. If a second communications card is to be installed, repeat steps 3 through 7. Install the second

card on top of the first communications card.

10. Reinstall the cover.

11. After installing the communications card, apply the LED identification decal to the window on

the front cover. Figure 4-8 shows the decal location.

12. Install the FlashPAC.

13. Refer to Section 4.4, Connecting Communications Cards to Wiring, on page 4-12 for information

on connecting wiring communications cards.

4-9 Communications Cards Rev Jun/05

Page 85

ROC364 Instruction Manual

COM 1

RAD/PL

RXD

TXD

DTR

DCD

CTS

RTS

1ST DECAL

Figure 4-8. Location of LED Identification Decal

4.3.1 Setting Modem Card Jumpers

COM 2

RAD/PL

RXD

TXD

DTR

DCD

CTS

RTS

2ND DECAL

DOC0118A

The Leased-Line and Radio Modem Communications Cards make use of jumpers to select certain operational modes. These jumpers must be properly positioned for the modem to operate correctly. Table 4-2 shows the operating modes and the associated jumper positions for the cards. Refer to Figure 4-3 and Figure 4-4 for jumper locations.

The Leased-Line Communications Card is set by default for 2-wire operation. To use it for 4-wire operation, jumpers P3, P4, and P5 must be placed in the positions indicated in Table 4-2.

The Radio Modem Communications Card uses jumper P6 to enable power control for keying a radio. The jumper either grounds or isolates the push-to-talk (PTT) return line. Jumper P6 has a default setting of GND (ground), but it can be set to ISO (isolated) to achieve a floating PTT, if the radio circuit requires it.

Table 4-2. Jumper Positions for the Modem Cards

Mode

2-Wire (default) 2W 2W 2W 4-Wire 4W 4W 4W

Mode

PTT Grounded (default) GND – – PTT Isolated ISO – –

Leased-Line Modem Jumpers

P3 P4 P5

Radio Modem Jumper

P6 – –

4-10 Communications Cards Rev Jun/05

Page 86

ROC364 Instruction Manual

4.3.2 Setting Modem Card Attenuation Levels

The output attenuation of the Leased-Line and Radio Modem Communications Cards is set by default to 0 dB (no attenuation). This level can be reduced, as necessary, to better match the modem output to the line or radio. The adjustment is made by plugging a resistor into the card at the location labeled R2. Refer to Figure 4-9. Table 4-3 lists resistor values and the amount of attenuation they provide.

Table 4-3. Radio and Leased-Line Modem Communications Card Attenuation Levels

Attenuation

(dB)

–2 205 K –12 15.8 K –4 82.5 K –14 11.5 K –6 47.5 K –16 8.66 K –8 30.9 K –18 6.65 K

–10 21.5 K –20 5.11 K

Notes: 1. All resistor values are nominal; 1% ¼ W resistors are acceptable.

2. Attenuation for leased or private-line operation or for a GE MCS radio is normally in this case, no resistor is needed.

3. Attenuation for a GE TMX radio is typically –20 dB.

4. Attenuation for an MDS radio is typically –10 dB.

R2 Value

(Ohms)

Attenuation

(dB)

R2 Value

(Ohms)

R2 Attenuation Resistor

COM PORTS

Figure 4-9. Location of Attenuation Resistor

4-11 Communications Cards Rev Jun/05

Page 87

ROC364 Instruction Manual

4.4 Connecting Communications Cards to Wiring

Signal wiring connections to the communications cards are made through the communications port connector and through TELCO (RJ11) connectors supplied with certain modem cards. These connections are summarized in Table 4-4 and detailed in Sections 4.4.1 to 4.4.5.



NOTE: Use a standard screwdriver with a slotted (flat bladed) 1/8" width tip when wiring all

terminal blocks.

Failure to exercise proper electrostatic discharge precautions (such as wearing a grounded wrist strap) may reset the processor or damage electronic components, resulting in interrupted operations.

Table 4-4. ROC300-Series Communications Card Signals

Comm Card

Port Pin

EIA-232 (RS-232) CARD DCD RX TX DTR COM DSR RTS CTS RI

EIA-422/485 (RS-422/485) CARD, 422 Usage

EIA-422/485 (RS-422/485) CARD, 485 Usage

RADIO MODEM RXA TXA COM PTT+ PTT–

LEASED-LINE MODEM, COMM Port, 4-wire Private Line

LEASED-LINE MODEM, RJ11 Port, 2-Wire

LEASED-LINE MODEM, RJ11 Port, 4-Wire

DIAL-UP MODEM, RJ11 Port

DIAL-UP MODEM, COMM Port (output only for analyzer)

1 2 3 4 5 6 7 8 9

RX– RX+ TX+ TX–

OUT– OUT+

TIP2 RING2 RING1 TIP1

TIP2

(BLK)

SPK RXD TXD DTR COM RI

TIP

(RED)

TIP1

(RED)

RING

(RED)

RING

(GRN)

RING1

(GRN)

TIP

(GRN)

N/A N/A N/A N/A

RING2

(YEL)

N/A N/A N/A N/A

SHUT

DOWN

+5V DSR

4-12 Communications Cards Rev Jun/05

Page 88

ROC364 Instruction Manual

4.4.1 EIA-232 (RS-232) Communications Card Wiring

Figure 4-10 shows the relationship between the EIA-232 (RS-232) signals and pin numbers for the communications port 9-pin connector.

Figure 4-10. EIA-232 (RS-232) Wiring Schematic

4-13 Communications Cards Rev Jun/05

Page 89

ROC364 Instruction Manual

4.4.2 EIA-422/485 (RS-422 / 485) Communications Card Wiring

Figure 4-11 shows the signals and pin numbers for the communications port 9-pin connector. Wiring should be twisted pair cable, one pair for transmitting and one pair for receiving. Jumper P4 controls the RTS transmit functions in the EIA-422 (RS-422) mode. Jumper P4 has a default setting of RTS for multi-drop communications. Placing jumper P4 in the ON position enables the card to continuously transmit (point-to-point).

Figure 4-12 shows the relationship between the EIA-485 (RS-485) signals and pin numbers for the communications port 9-pin connector. Wiring should be twisted-pair cable.

Figure 4-11. EIA-422 (RS-422) Wiring Schematic

Figure 4-12. EIA-485 (RS-485) Wiring Schematic

4-14 Communications Cards Rev Jun/05

Page 90

ROC364 Instruction Manual

4.4.3 Radio Modem Communications Card Wiring

The following signal lines are used with most radios:

Comm Port Signal Line Description

3 RXA Receive data 4 TXA Transmit data 5 COM ROC power supply ground 7 PTT+ Push-to-talk switch

8 PTT–

The radio modem uses jumper P6 to determine the use of the PTT return line. Refer to Section 4.3.1, Setting Modem Card Jumpers, on page 4-10.

The Radio Modem Card is shipped without a resistor installed in the R2 position. To modify the attenuation level, select a resistor (R2) as directed by Table 4-3, Radio and Leased-Line Modem Communications Card Attenuation Levels, on page 4-11.

Figure 4-13 shows the relationship between the radio modem signals and pin numbers for the communications port 9-pin connector.

Push-to-talk return (may be grounded)

Figure 4-13. Radio Modem Wiring Schematic

4-15 Communications Cards Rev Jun/05

Page 91

ROC364 Instruction Manual

The following signals, used only for monitoring or connecting to an analyzer, are available at connector P7 located at the bottom edge of the card. These signals are normally not active. To activate the signals, SHUTDOWN (pin 8) must be grounded by connecting a jumper between pin 8 and pin 2. All unused signals can be left un-terminated.

P7 Terminal Function

1 +5 volts dc 2 COM 3 DCD 4 TXD 5 DTR 6 RTS 7 RXD 8 Shutdown

4.4.4 Leased-Line Modem Communications Card Wiring

The Leased-Line Modem Card interfaces to a leased line through the RJ11 jack. Refer to Section 4.3.1, Setting Modem Card Jumpers, on page 4-10 for jumper settings (P3, P4, and P5) and Section 4.2.3, Setting Modem Card Attenuation Levels, on page 4-11 for attenuation resistor (R2) values.

The signals present depend on the mode of operation of the card, either 2-wire or 4-wire.

RJ11 Terminal

BLK (Not used) Tip2

RED Ring Ring1

GRN Tip Tip1

YEL (Not used) Ring2

Operating Mode

2-Wire 4-Wire

 NOTE: On the Leased-Line Modem Card, Tip and Ring is shown reversed to comply with

normal telephone signals and functions normally with the two signals reversed.

Figure 4-14 shows the wiring connections to the card.

4-16 Communications Cards Rev Jun/05

Page 92

ROC364 Instruction Manual

Figure 4-14. Leased-Line Modem Wiring Schematic

The 9-pin COM1 and COM2 connectors can be used to connect the modem to a private line. This connector is not FCC approved and cannot be used for leased-line operation. Present signals are:

COMM Port

1 – Tip2 2 – Ring2 6 Ring Ring1 9 Tip Tip1

Operating Mode

2-Wire 4-Wire

The following signals, used only for monitoring or connecting to an analyzer, are available at connector P7 located at the bottom edge of the card. These signals are normally not active. To activate the signals, SHUTDOWN (pin 8) must be grounded to pin 2 using a jumper. All unused signals can be left unterminated.

P7 Terminal Function

1 +5 volts dc 2 COM 3 DCD 4 TXD 5 DTR 6 RTS 7 RXD

Shutdown

4-17 Communications Cards Rev Jun/05

Page 93

ROC364 Instruction Manual

4.4.5 Dial-Up Modem Communications Card Wiring

The Dial-Up Modem Card interfaces to a PSTN line through the RJ11 jack with two wires. The following signals, used only for monitoring or connecting to an analyzer to COM1 or COM2. These signals are normally not active. To activate the signals, ground pin 7 (SHUTDOWN) to pin 5 using a jumper. All unused signals can be left unterminated. The signals present at the RJ11 connector are:

RJ11

Terminal

GRN Tip RED Ring

Operating Mode

(2-Wire)

Figure 4-15 shows the relationship between the Dial-up modem signals and pin numbers for the RJ11 and COMM port connectors.

Be careful to avoid shorting the +5 volt supply (pin 8 on the COMM port connector) to common (pin 5) or to any ground when wiring to the COMM port. Grounding pin 8 causes the ROC to halt operation and data may be lost once a restart is initiated.

Figure 4-15. Dial-Up Modem Wiring Schematic

4-18 Communications Cards Rev Jun/05

Page 94

ROC364 Instruction Manual

The following signal lines (output only) are available at the COMM port for wiring to an analyzer or monitor:

COMM Port Signal Line Description

1 SPK Speaker 2 RXD Receive data 3 TXD Transmit data 4 DTR Data terminal ready 5 COM Common 6 RI Ring indicator 7 SHUTDOWN Disable signal lines 8 +5V 5-volts dc power 9 DSR Data set ready

4.5 Troubleshooting and Repair

There are no user-serviceable parts on the communications cards. If a card appears to be operating improperly, verify that the card is set up according to the information contained in Section 4.3, Installing Communications Cards, on page 4-8. If it still fails to operate properly, the recommended repair procedure is to remove the faulty card and install a working communications card. The faulty card should be returned to your local sales representative for repair or replacement.

4.5.1 Replacing a Communications Card

To remove and replace a communications card on an in-service ROC, perform the following procedure. Be sure to observe the cautions to avoid losing data and damaging equipment.

Change components only in an area known to be non-hazardous.

Failure to exercise proper electrostatic discharge precautions (such as wearing a grounded wrist strap) may reset the processor or damage electronic components, resulting in interrupted operations.

During this procedure, all power will be removed from the ROC and devices powered by the ROC. Ensure all connected input devices, output devices, and processes remain in a safe state when power is removed from the ROC and when power is restored to the ROC.

1. To avoid losing data, perform backups as explained in Section 2, RAM Backup Procedure.

2. Disconnect power to the ROC by unplugging the power connector.

3. Remove the FlashPAC module.

4. Remove the screws that hold the cover in place, and lift off the cover.

4-19 Communications Cards Rev Jun/05

Page 95

ROC364 Instruction Manual

5. If the 6-pin header connector is still in socket J9 on the main board (just below the bottom edge

of the communications card), remove it.

6. If the communications card is a Dial-up or Leased-Line Modem Card, unplug the phone jack

cable from board connector P2.

7. Remove the retaining screw from the middle of the communications card. Using a rocking

motion to disengage the connectors, pull the card free from the main circuit board or from the card below.

8. To reinstall a communications card, orient the card with the COM PORTS arrow pointing down.

Plug the card into its mating connectors and gently press until the connectors firmly seat. Install the retaining screw to secure the card.

9. For a Dial-up or Leased-Line Modem Card, connect the phone jack cable to the board connector

P2.

10. If a second modem card was removed, repeat the previous steps.

11. If you are installing a replacement modem card, be sure to set the jumpers on the card in the

proper position (Section 4.3.1, Setting Modem Card Jumpers, on page 4-10) and to set the output attenuation level (Section 4.3.2, Setting Modem Card Attenuation Levels, on page 4-11).

12. Reinstall the FlashPAC.

13. Reconnect power to the ROC by plugging in the power connector.

14. Use ROCLINK configuration software to check the configuration data, ROC Displays, and

FSTs, and load or modify them as required. In addition, load and start any user programs as needed.

15. Verify that the ROC performs as required.

16. If you changed the configuration, save the current configuration data to memory by selecting

ROC > Flags > Write to EEPROM or Flash Memory Save Configuration as instructed in the applicable ROCLINK configuration software user manual.

17. If you changed the configuration including the history database, ROC Displays, or FSTs, save

them to disk.

4-20 Communications Cards Rev Jun/05

Page 96

ROC364 Instruction Manual

4.6 Communication Card Specifications

The following tables list the specifications for each type of communications card.

Serial Communication Cards Specifications

EIA-232D (RS-232) CARD

Meets EIA-232 (RS-232) standard for single-ended data transmission over distances of up to 15 m (50 ft).

Data Rate: Selectable from 300 to 9600 baud,

depending on the configuration software used.

Format: Asynchronous, 7 or 8-bit (software

selectable) with full handshaking.

Parity: None, odd, or even (software selectable).

EIA-422/485 (RS-422/485) CARD

Meets EIA-422 (RS-422) and EIA-485 (RS-485) standard for differential data transmission over distances of up to 1220 m (4000 ft). As many as ten devices can be connected on an EIA-422 (RS-422) bus. As many as 32 devices can be connected on an EIA-485 (RS-485) bus.

Data Rate: Selectable from 300 to 9600 bps. Format: Asynchronous, 7 or 8-bit (software

selectable).

Parity: None, odd, or even (software selectable). Termination Load: 140 Ω, jumper selectable.

LED INDICATORS

Individual LEDs for RXD, TXD, DTR, DCD, CTS, and RTS signals not all apply to EIA-422/485 (RS-422/485) communications.

POWER REQUIREMENTS

4.75 to 5.25 V dc, 0.15 W maximum (supplied by ROC).

ENVIRONMENTAL

Same as the ROC in which the card is installed. Refer to the respective ROC specifications.

DIMENSIONS

25 mm H by 103 mm W by 135 mm L (1 in. H by

4.05 in. W by 5.3 in. L).

WEIGHT

80 g (3 oz) nominal.

APPROVALS

Approved by CSA for hazardous locations Class I, Division 2, Groups A, B, C, and D.

Radio Modem Specifications

OPERATION

Mode: Full or half-duplex, direct connection to

radio.

Data Rate: Up to 1200 baud asynchronous

(software selectable).

Parity: None, odd, or even (software selectable). Format: Asynchronous, 7 or 8 bit (software

selectable).

Modulation: Phase coherent, Frequency Shift

Keyed (FSK).

Carrier Frequencies: Mark 1200 Hz ± 0.1%;

Space 2200 Hz ± 0.1%.

Input Impedance: 20 kΩ, unbalanced. Output Impedance: 600 Ω balanced. RTS-to-Transmission Delay: Configurable in

10 ms increments.

Sensitivity: –35 dBm. PTT Signal: Isolated, solid-state switch. LED Indicators: TXD, RXD, DTR, DCD, CTS, and

RTS.

POWER REQUIREMENTS

4.75 to 5.25 V dc, 0.11 W typical (supplied by ROC).

ENVIRONMENTAL

Operating Temperature: –40 to 75ºC (–40 to

167ºF).

Storage Temperature: –50 to 85ºC (–58 to

185ºF).

Operating Humidity: To 95% relative, non-

condensing.

DIMENSIONS

25 mm H by 103 W mm by 135 mm L (1 in. H by

4.05 in. W by 5.3 in. L).

WEIGHT

100 g (3.6 oz) typical.

APPROVALS

Approved by CSA for hazardous locations Class I, Division 2, Groups A, B, C, and D.

4-21 Communications Cards Rev Jun/05

Page 97

ROC364 Instruction Manual

Leased-Line Modem Specifications

OPERATION

Mode: Full or half-duplex on 2-wire or 4-wire

private channel (compatible with Bell 202T).

Data Rate: Up to 1200 baud asynchronous

(software selectable).

Parity: None, odd, or even (software selectable). Format: Asynchronous, 7 or 8 bit (software

selectable).

Modulation: Phase coherent, Frequency Shift

Keyed (FSK).

Carrier Frequencies: Mark 1200 Hz ± 0.1%;

Space 2200 Hz ± 0.1%.

Input Impedance: 600 Ω balanced transformer

input.

Output Impedance: 600 Ω balanced transformer

output.

RTS-to-Transmission Delay: Configurable in 10

ms increments.

Sensitivity: –35 dBm. Maximum Output Level: 0 dBm nominal into

600 Ω.

LED Indicators: TXD, RXD, DTR, DCD, CTS, and

RTS.

Surge Protection: Conforms to FCC part 68.

OPERATION (CONTINUED)

Certification: FCC Part 68 tested. Connector: RJ11 type.

POWER REQUIREMENTS

4.75 to 5.25 V dc, 0.11 W typical (supplied by ROC).

ENVIRONMENTAL

Operating Temperature: –40 to 75ºC (–40 to

167ºF).

Storage Temperature: –50 to 85ºC (–58 to

185ºF).

Operating Humidity: To 95% relative, non-

condensing.

DIMENSIONS

25 mm H by 103 mm W by 135 mm L (1 in. H by

4.05 in. W by 5.3 in. L).

WEIGHT

135 g (4.7 oz) typical.

APPROVALS

Approved by CSA for hazardous locations Class I, Division 2, Groups A, B, C, and D.

4-22 Communications Cards Rev Jun/05

Page 98

ROC364 Instruction Manual

Dial-Up Modem Specifications

OPERATION

Mode: Full-duplex 2-wire for Dial-up PSTN (Bell

212 compatible).

Data Rate: Up to 14.4K bps asynchronous

(software selectable).

Parity: None, odd, or even (software selectable). Format: 8, 9, 10, or 11 bits, including start, stop,

and parity (software selectable).

Modulation: V.32 and V.32 bis, V.21 and 103,

binary phase-coherent FSK, V.22 and 212A, and V.22 bis.

Transmit Amplitude: –1 dB typical. Telephone Line Impedance: 600 Ω typical. RTS-to-Transmission Delay: Configurable in 10

ms increments.

Receiver Sensitivity: Off-to-On threshold: –45

dBm. On-to-Off threshold: –48 dBm.

Maximum Output Level: 0 dBm nominal into

600 Ω.

LED Indicators: TXD, RXD, DTR, DSR, RI, and

OH.

Surge Protection: Conforms to FCC part 68 and

DOC.

Surge Isolation: 1000 V ac and 1500 V peak. Certification: FCC Part 68 approved. Connector: RJ11 type.

POWER REQUIREMENTS

4.5 to 5.5 V dc, 0.4 W maximum (supplied by ROC).

ENVIRONMENTAL

Operating Temperature: –40 to 75ºC

(–40 to 167ºF).

Storage Temperature: –50 to 85ºC

(–58 to 185ºF).

Operating Humidity: To 95% relative, non-

condensing.

DIMENSIONS

25 mm H by 103 mm W by 135 mm L (1 in. H by

4.05 in. W by 5.3 in. L).

WEIGHT

130 g (4.6 oz) typical.

FCC INFORMATION

Registration Number: DWE-25983-M5-E. Ringer Equivalent: 1.0B

APPROVALS

Approved by CSA for hazardous locations Class I, Division 2, Groups A, B, C, and D.

4-23 Communications Cards Rev Jun/05

Page 99

ROC364 Instruction Manual

SECTION 5 – I/O CONVERTER CARD

5.1 Scope

This section describes the I/O Power Converter Card optionally available for the ROC364 Remote Operations Controller. Topics covered include:

Section

Page

5.2 Product Description 5-1

5.3 Initial Installation and Setup 5-2

5.4 Troubleshooting and Repair 5-3

5.5 I/O Converter Card Specification 5-4

5.2 Product Description

The I/O Power Converter Card, which mounts on the MCU board, is used when the ROC is powered from a 12-volt power supply and 24 volts dc is required to power field transmitters (Table 5-1). A maximum of twenty five 4-to-20 milliamp loops can be accommodated by the card. If more than twenty five current loops need to be accommodated, a separate 24-volt dc power supply must be used.

Figure 5-1 shows the I/O converter card.

RP1

CR2

RP2



NOTE: Use a standard screwdriver with a slotted (flat bladed) 1/8-inch width tip when wiring all

terminal blocks.

5-1 I/O Converter Card Rev Jun/05

L1 CR1

DOC0124A

Figure 5-1. I/O Converter Card

Page 100

ROC364 Instruction Manual

Table 5-1. I/O Converter Card Requirements

MCU Input

Voltage (V dc)

12 No No 12 Yes Yes 24 No No 24 Yes No

5.3 Initial Installation and Setup

The following procedure assumes a first-time installation. For units currently in service, certain precautions must be taken to assure that data is not lost and equipment is not damaged. Refer to 5.4.1, Replacing an I/O Converter Card, on page 5-3.

When repairing units in a hazardous area, change components only in an area known to be nonhazardous.

Are 4 to 20 MA

Loops Used?

Is a Converter

Needed?

To install the converter card, proceed as follows:

1. Remove power from the ROC.

2. Remove the FlashPAC.

3. Remove the four screws securing the MCU upper cover in place, and then lift off the cover.

4. Locate connector J1 on the MCU board. If a shorting plug is plugged into J1, remove it.

5. Grasp the I/O converter card by its edges and position the card connector over connector J1 on

the MCU board. Push down firmly, but gently, to seat the card into the connector.

6. Secure the card in place using three 6-32 screws.

7. Reinstall the FlashPAC.

8. Reinstall the MCU cover.

9. Apply power to the ROC.

5-2 I/O Converter Card Rev Jun/05

Emerson ROC364 Instruction Manual

Specifications and Main Features

Frequently Asked Questions

User Manual