Emerson ROC827 User Manual

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Form Number A6175

Part Number D301217X012

March 2006

ROC827 Remote Operations Controller

Instruction Manual

Flow Computer Division

Revision Tracking Sheet

March 2006

This manual may be revised periodically to incorporate new or updated information. The revision date of each page appears at the bottom of the page opposite the page number. A change in revision date to any page also changes the date of the manual that appears on the front cover. Listed below is the revision date of each page (if applicable):

Page

Revision

Initial issue

Mar-06

ROCLINK is a trademark of one of the Emerson Process Management companies. The Emerson logo is a trademark and service mark of Emerson Electric Co. All other marks are the property of their respective owners.

© Fisher Controls International, LLC. 2006. All rights reserved. Printed in the U.S.A. www.EmersonProcess.com/flow

While this information is presented in good faith and believed to be accurate, Fisher Controls does not guarantee satisfactory results from reliance upon such information. Nothing contained herein is to be construed as a warranty or guarantee, express or implied, regarding the performance, merchantability, fitness or any other matter with respect to the products, nor as a recommendation to use any product or process in conflict with any patent. Fisher Controls reserves the right, without notice, to alter or improve the designs or specifications of the products described herein.

Issued Mar-06

ii

Contents

Chapter 1 – General Information

1-1

1.1

Scope of Manual...............................................................................................................

1-1

1.2

Hardware ..........................................................................................................................

1-2

 

1.2.1 Central Processor Unit (CPU) ............................................................................

1-5

 

1.2.2

Processor and Memory ......................................................................................

1-6

 

1.2.3

Real-TimeClock (RTC) ......................................................................................

1-6

 

1.2.4

Diagnostic Monitoring.........................................................................................

1-7

 

1.2.5

Options ...............................................................................................................

1-7

1.3

FCC Information ...............................................................................................................

1-8

1.4

Firmware...........................................................................................................................

1-8

 

1.4.1 Historical Database and Event & Alarm Log....................................................

1-11

 

1.4.2 Meter Runs and Stations..................................................................................

1-12

 

1.4.3

Flow Calculations .............................................................................................

1-12

 

1.4.4

Automatic Self Tests ........................................................................................

1-13

 

1.4.5

Low Power Modes............................................................................................

1-13

 

1.4.6 Proportional, Integral, and Derivative (PID) .....................................................

1-14

 

1.4.7 Function Sequence Table (FST) ......................................................................

1-14

1.5

ROCLINK 800 Configuration Software...........................................................................

1-15

1.6

DS800 Development Suite Software..............................................................................

1-16

1.7

Expanded Backplane......................................................................................................

1-17

1.8

Related Specification Sheets..........................................................................................

1-18

Chapter 2 – Installation and Use

2-1

2.1

Installation Requirements .................................................................................................

2-1

 

2.1.1

Environmental Requirements .............................................................................

2-2

 

2.1.2

Site Requirements ..............................................................................................

2-2

 

2.1.3

Compliance with Hazardous Area Standards ....................................................

2-3

 

2.1.4

Power Installation Requirements .......................................................................

2-4

 

2.1.5

Grounding Installation Requirements .................................................................

2-4

 

2.1.6

I/O Wiring Requirements ....................................................................................

2-5

2.2

Required Tools .................................................................................................................

2-5

2.3

Housing

.............................................................................................................................

2-5

 

2.3.1

Removing and Replacing End Caps ..................................................................

2-6

 

2.3.2

Removing and Installing Wire Channel Covers ..................................................

2-6

 

2.3.3 ............................................................

Removing and Installing Module Covers

2-7

2.4

Mounting ...............................................................................the ROC827 on a DIN Rail

2-7

 

2.4.1 .........................................................................................

Installing the DIN Rail

2-9

 

2.4.2 ...............................................................

Securing the ROC827 on the DIN Rail

2-9

 

2.4.3 .......................................................

Removing the ROC827 from the DIN Rail

2-10

2.5

ROC800 ................................................................-Series Expanded Backplane (EXP)

2-10

 

2.5.1 ...............................................................

Attaching an Expandable Backplane

2-11

 

2.5.2 ..............................................................

Removing an Expandable Backplane

2-12

2.6

Central Processor ........................................................................................Unit (CPU)

2-13

 

2.6.1 ..............................................................................

Removing the CPU Module

2-16

 

2.6.2 ................................................................................

Installing the CPU Module

2-16

2.7

License ..................................................................................................................Keys

2-17

 

2.7.1 ....................................................................................

Installing a License Key

2-18

 

2.7.2 ..................................................................................

Removing a License Key

2-19

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iii

2.8 Startup and Operation ....................................................................................................

2-19

2.8.1

Startup..............................................................................................................

2-20

2.8.2

Operation..........................................................................................................

2-20

Chapter 3 – Power Connections

3-1

3.1

Power Input Module Descriptions.....................................................................................

3-1

 

3.1.1 12-VoltDC Power Input Module(PM-12)...........................................................

3-1

 

3.1.2 24-VoltDC Power Input Module(PM-24)...........................................................

3-3

 

3.1.3 Auxiliary Output (AUX+ and AUX–)....................................................................

3-4

 

3.1.4 Switched Auxiliary Output (AUXSW+ and AUXSW–) ........................................

3-6

3.2

Determining Power Consumption.....................................................................................

3-7

 

3.2.1 Tuning the Configuration..................................................................................

3-11

3.3

Removing a Power Input Module ...................................................................................

3-20

3.4

Installing a Power Input Module .....................................................................................

3-21

3.5

Connecting the ROC827 to Wiring .................................................................................

3-21

 

3.5.1 Wiring the DC Power Input Module..................................................................

3-22

 

3.5.2 Wiring the External Batteries............................................................................

3-23

 

3.5.3 Replacing the Internal Battery..........................................................................

3-25

3.6

Related Specification Sheets..........................................................................................

3-26

Chapter 4 – Input/Output Modules

4-1

4.1

I/O Module Overview ........................................................................................................

4-1

4.2

Installation.........................................................................................................................

4-3

 

4.2.1

Installing an I/O Module......................................................................................

4-4

 

4.2.2

Removing an I/O Module....................................................................................

4-5

 

4.2.3

Wiring I/O Modules.............................................................................................

4-6

4.3

Analog Input Modules.......................................................................................................

4-6

4.4

Analog Output Modules ....................................................................................................

4-8

4.5

Discrete Input Modules.....................................................................................................

4-9

4.6

Discrete Output Modules ................................................................................................

4-10

4.7

Discrete Output Relay Modules......................................................................................

4-11

4.8

Pulse Input Modules .......................................................................................................

4-12

4.9

RTD Input Modules.........................................................................................................

4-14

 

4.9.1

Connecting the RTD Wiring..............................................................................

4-15

4.10 J and K Type Thermocouple Input Modules..................................................................

4-16

4.11

Related Specification Sheets.........................................................................................

4-21

Chapter 5 – Communications

5-1

5.1

Communications Ports and Modules Overview...............................................................

5-1

5.2

Installing Communication Modules ..................................................................................

5-3

5.3

Removing a Communications Module .............................................................................

5-4

5.4

Wiring Communications Modules ....................................................................................

5-5

5.5

Local Operator Interface (LOI).........................................................................................

5-5

 

5.5.1 Using the LOI .....................................................................................................

5-7

5.6

Ethernet Communications................................................................................................

5-7

5.7

EIA-232(RS-232)Serial Communications ......................................................................

5-9

5.8

EIA-422/485 (RS-422/485) Serial Communications Module .........................................

5-10

 

5.8.1 EIA-422/485(RS-422/485)Jumpers & Termination Resistors ........................

5-11

Issued Mar-06

iv

5.9

Dial-up Modem Communications Module......................................................................

5-12

5.10

Multi-VariableSensor (MVS) Interface Modules............................................................

5-14

5.11

HART Interface Module .................................................................................................

5-16

5.12

Related Specification Sheets.........................................................................................

5-20

Chapter 6 – Troubleshooting

6-1

6.1

Guidelines.........................................................................................................................

6-1

6.2

Checklists .........................................................................................................................

6-2

 

6.2.1

Serial Communications ......................................................................................

6-2

 

6.2.2

I/O Point..............................................................................................................

6-2

 

6.2.3

Software .............................................................................................................

6-3

 

6.2.4

Powering Up.......................................................................................................

6-3

 

6.2.5

MVS Module.......................................................................................................

6-3

6.3

Procedures .......................................................................................................................

6-4

 

6.3.1

Preserving Configuration and Log Data .............................................................

6-4

 

6.3.2

Restarting the ROC827 ......................................................................................

6-4

 

6.3.3

Troubleshooting Analog Input Modules..............................................................

6-5

 

6.3.4

Troubleshooting Analog Output Modules...........................................................

6-7

 

6.3.5

Troubleshooting Discrete Input Modules............................................................

6-7

 

6.3.6

Troubleshooting Discrete Output Modules.........................................................

6-8

 

6.3.7

Troubleshooting Discrete Output Relay Modules...............................................

6-8

 

6.3.8

Troubleshooting Pulse Input Modules................................................................

6-8

 

6.3.9

Troubleshooting RTD Input Modules .................................................................

6-9

 

6.3.10

Troubleshooting J and K Type Thermocouple Input Modules .........................

6-10

Chapter 7 – Calibration

7-1

7.1

Calibration.........................................................................................................................

7-1

7.2

Preparing for Calibration...................................................................................................

7-1

Appendix A – Glossary

A-1

 

 

 

Index

 

I-1

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v

Issued Mar-06

vi

ROC827 Instruction Manual

Chapter 1 – General Information

This manual focuses on the hardware aspects of the ROC827 Remote Operations Controller (the “ROC827”) and the ROC800-Seriesexpanded backplanes (“EXPs”). For information about the software, refer to the

ROCLINK800 Configuration Software User Manual(Form A6121).

This chapter details the structure of this manual and provides an overview of the ROC827 and its components.

In This Chapter

1.1

Scope of Manual......................................................................................

1-1

1.2

Hardware .................................................................................................

1-2

 

1.2.1 Central Processor Unit (CPU)........................................................

1-5

 

1.2.2 Processor and Memory..................................................................

1-6

 

1.2.3 Real-TimeClock (RTC)..................................................................

1-6

 

1.2.4 Diagnostic Monitoring ....................................................................

1-7

 

1.2.5 Options...........................................................................................

1-7

1.3

FCC Information ......................................................................................

1-8

1.4

Firmware..................................................................................................

1-8

 

1.4.1 Historical Database and Event & Alarm Log................................

1-12

 

1.4.2 Meter Runs and Stations .............................................................

1-12

 

1.4.3 Flow Calculations.........................................................................

1-12

 

1.4.4 Automatic Self Tests ....................................................................

1-13

 

1.4.5 Low Power Modes .......................................................................

1-14

 

1.4.6 Proportional, Integral, and Derivative (PID).................................

1-14

 

1.4.7 Function Sequence Table (FST)..................................................

1-15

1.5

ROCLINK 800 Configuration Software..................................................

1-15

1.6

DS800 Development Suite Software .....................................................

1-17

1.7

Expanded Backplane.............................................................................

1-18

1.8

Related Specification Sheets.................................................................

1-19

The ROC827 Remote Operations Controller is a microprocessor-basedcontroller that provides the functions required for a variety of field automation applications. The ROC827 is ideal for applications requiring general logic and sequencing control; historical data archiving; multiple communication ports; Proportional, Integral, and Derivative (PID) control; and flow measurement on up to twelve meter runs. When attached to the ROC827, theROC800-Seriesexpanded backplanes provide the ROC827 with increased I/O capabilities.

1.1Scope of Manual

This manual contains the following chapters:

Chapter 1

Provides an overview of the hardware and

General Information

specifications for the ROC827 and the ROC800-Series

 

expanded backplane.

Issued Mar-06

General Information

1-1

ROC827 Instruction Manual

Chapter 2

Installation and Use

Chapter 3

Power Connections

Chapter 4

Input/Output (I/O)

Modules

Chapter 5

Communications

Chapter 6

Troubleshooting

Chapter 7

Calibration

Provides information on installation, tools, wiring, mounting the ROC827, and other essential elements of the ROC827 and EXPs.

Provides information on the Power Input modules available for the ROC827 and EXPs and provides worksheets to help determine power requirements for the ROC827 configurations.

Provides information for the Input/Output (I/O) modules available for the ROC827 and EXPs.

Provides information for the built-incommunications and the optional communication modules available for the ROC827.

Provides information on diagnosing and correcting problems for the ROC827.

Provides information for calibrating Analog Inputs, HART Inputs, RTD Inputs, and MVS Inputs for the ROC827.

Glossary

Provides definitions of acronyms and terms.

Index

Provides an alphabetic listing of items and topics

 

contained in this manual.

1.2Hardware

The ROC827 is highly innovative and versatile with an integrated backplane to which the central processor unit (CPU), Power Input module, communication modules, and I/O modules connect. The ROC827 has three I/O module slots.

The ROC800-Seriesexpanded backplane (EXP) attaches to the ROC827. Each EXP provides six additional I/O module slots. The ROC827 can support up to four EXPs, for a total of 27 I/O module slots in a fully configured ROC827 (six slots per EXP plus the three I/O slots on the ROC827 itself).

The ROC827 uses a Power Input module to convert external input power to the voltage levels required by the ROC827’s electronics and to monitor voltage levels to ensure proper operation. Two Power Input modules—12Volts dc(PM-12)and 24 Volts dc(PM-24)—areavailable for the ROC827. For more information on the Power Input modules, refer toChapter 3, Power Connections.

The ROC827 supports a variety of communication protocols: ROC Plus, Modbus, Modbus TCP/IP, Modbus encapsulated in TCP/IP, and Modbus with Electronic Flow Measurement (EFM) extensions.

Figure 1-1shows the housing, typical I/O modules, and communication modules installed in a ROC827. The patented ABS (Acrylonitrile Butadiene Styrene) plastic housing has wire covers to protect the wiring terminals. The housing includes DIN rail mounts for mounting the ROC827 on a panel or in auser-suppliedenclosure.

Issued Mar-06

General Information

1-2

ROC827 Instruction Manual

Power Supply Module

I/O Module (1 of 3)

CPU

Wire Channel Cover

LOI (Local Port)

EIA-232(RS-232D)

Right End Cap

Built-inEthernet (Comm1)

Built-inEIA-232(RS-232C)

(Comm2)

Figure 1-1.ROC827 Base Unit (without Expanded Backplane)

The ROC827’s CPU contains the microprocessor, the firmware, a connector to the backplane, three built-incommunication ports, a LightEmitting Diode (LED) low power wakeup button, a RESET button, the application license key connectors, a STATUS LED indicating system integrity, diagnostic LEDs for two of the communications ports, and the main processor.

Issued Mar-06

General Information

1-3

ROC827 Instruction Manual

Figure 1-2shows a typical expanded backplane (EXP) populated with a full complement of six I/O modules. Each EXP is composed of the same plastic housing as the ROC827, contains six I/O slots, and has a powered backplane that easily attaches to the ROC827 and other EXPs.

Figure 1-2.ROC827 with One Expanded Backplane

The ROC827 and EXPs support nine types of Input/Output (I/O) modules, which can satisfy a wide variety of field I/O requirements (refer to Chapter 4, Input/Output Modules). I/O modules include:

Analog Inputs (AI).

Analog Outputs (AO).

Discrete Inputs (DI).

Discrete Outputs (DO).

Digital Relay Outputs (DOR).

HART Inputs/Outputs.

Pulse Inputs (PI) – High/Low Speed.

Resistance Temperature Detector Inputs (RTD).

J and K Type Thermocouple (T/C) Inputs.

Issued Mar-06

General Information

1-4