DYNEX MP03-260-10, MP03-260-12, MP03-260-14, MP03-260-16 Datasheet
MP03 XX 260 Series
MP03 XX 260 Series
Dual Diode Modules
Replaces December 1998 version, DS5104-2.0 DS5104-3.0 January 2000
FEATURES
■ Dual Device Module
■ Electrically Isolated Package
■ Pressure Contact Construction
■ International Standard Footprint
■ Alumina (non-toxic) Isolation Medium
APPLICATIONS
■ Rectifier Bridges
■ DC Power Bridges
■ Plating Rectifiers
■ Traction Systems
VOLTAGE RATINGS
Type
Number
Repetitive
Peak
Voltages
V
RRM
MP03/260-16
MP03/260-14
MP03/260-12
MP03/260-10
Lower voltage grades available. For full description of part
numbers see "Ordering instructions" on page 3.
1600
1400
1200
1000
Conditions
Tvj = 150oC
IRM = 30mA
V
= V
RSM
RRM
+ 100V
KEY PARAMETERS
V
RRM
I
FSM
I
(per arm) 267A
F(AV)
V
isol
CIRCUIT OPTIONS
Code
HB
G
GN
Circuit
PACKAGE OUTLINE
Module outline type code: MP03.
See Package Details for further information.
1600V
8100A
2500V
CURRENT RATINGS - PER ARM
Symbol
I
F(AV)
F(RMS)
Mean forward current
RMS value A420
Parameter Units
Conditions
Halfwave, resistive load
T
= 75oCI
case
T
case
T
case
T
heatsink
T
heatsink
= 75oC
= 85oC
= 75oC
= 85oC
Max.
267
240
235
A
A
A
A211
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MP03 XX 260 Series
SURGE RATINGS - PER ARM
Symbol Parameter
I
I2t
FSM
Surge (non-repetitive) forward current
I2t for fusing
THERMAL & MECHANICAL RATINGS
Symbol
R
th(j-c)
R
th(c-hs)
vj
T
sto
Thermal resistance - junction to case
per Diode
Thermal resistance - case to heatsink
per Diode
Virtual junction temperatureT
Storage temperature range
Parameter
Conditions Max.
VR = 0
10ms half sine;
Tj = 150˚C
VR = 50% V
VR = 0
10ms half sine;
Tj = 150˚C
VR = 50% V
Conditions
dc
halfwave
3 phase
Mounting torque = 5Nm
with mounting compound
RRM
RRM
8100
6500
328000
211000
Max.
0.21
0.22
0.23
0.05
150
-40 to 150
Units
A
A
A2s
A2s
Units
o
C/W
o
C/W
o
C/W
o
C/W
o
C
o
C
V
isol
Isolation voltage
CHARACTERISTICS
Symbol
V
FM
I
RM
V
TO
r
T
Forward voltage
Peak reverse current At V
Threshold voltage V0.84At Tvj = 150oC
On-state slope resistance
Parameter
Commoned terminals to base plate
AC RMS, 1min, 50Hz
Conditions
At 600A, T
RRM
= 25oC
case
, Tj = 150oC
2.5
Max.
1.3
30
kV
Units
V
mA
mΩ0.667At Tvj = 150oC
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MP03 XX 260 Series
ORDERING INSTRUCTIONS
Part number is made up as follows:
MP03 HB 260 - 16
MP = Pressure contact module
03 = Outline type
HB = Circuit configuration code (see "circuit options" - front page)
260 = Nominal average current rating at T
16 = V
RRM
/100
Examples:
MP03 HB260-10
MP03 G260-14
MP023GN260-12
Note: Preferred type is HB configuration. G & GN types are available for specific applications, only when requested.
MOUNTING RECOMMENDATIONS
= 75oC
case
Adequate heatsinking is required to maintain the base
temperature at 75oC if full rated current is to be achieved.
Power dissipation may be calculated by use of VTO and r
information in accordance with standard formulae. We can
provide assistance with calculations or choice of heatsink
if required.
The heatsink surface must be smooth and flat; a surface
finish of N6 (32µin) and a flatness within 0.05mm (0.002")
are recommended.
Immediately prior to mounting, the heatsink surface should
be lightly scrubbed with fine emery, Scotch Brite or a mild
chemical etchant and then cleaned with a solvent to
remove oxide build up and foreign material. Care should
be taken to ensure no foreign particles remain.
An even coating of thermal compound (eg. Unial) should be
applied to both the heatsink and module mounting surfaces.
This should ideally be 0.05mm (0.002") per surface to
T
ensure optimum thermal performance.
After application of thermal compound, place the module
squarely over the mounting holes, (or 'T' slots) in the
heatsink. Using a torque wrench, slowly tighten the
recommended fixing bolts at each end, rotating each in turn
no more than 1/4 of a revolution at a time. Continue until the
required torque of 5Nm (44lb.ins) is reached at both ends.
It is not acceptable to fully tighten one fixing bolt before
starting to tighten the others. Such action may DAMAGE the
module.
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