Dell EMC PowerEdge R740xd2
Technical Specifications
Reg ula tor y M ode l: E56 S S eries
Reg ula tor y T ype : E 56S 001
Dec 20 20
Rev . A 09
Notes, cautions, and warnings
NOTE: A NOTE indicates important information that helps you make better use of your product.
CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid
the problem.
WARNING: A WARNING indicates a potential for property damage, personal injury, or death.
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Contents
Chapter 1: Technical specifications............................................................................................... 4
Chassis dimensions..............................................................................................................................................................5
System weight......................................................................................................................................................................5
Processor specifications.................................................................................................................................................... 6
Supported operating systems...........................................................................................................................................6
PSU specifications...............................................................................................................................................................6
Cooling fans specifications................................................................................................................................................7
System battery specifications.......................................................................................................................................... 7
PCIe Expansion card riser specifications....................................................................................................................... 7
Memory specifications........................................................................................................................................................8
Storage controller specifications..................................................................................................................................... 8
Drives......................................................................................................................................................................................9
Ports and connectors specifications............................................................................................................................. 10
USB ports specifications............................................................................................................................................ 10
NIC ports specifications............................................................................................................................................. 10
Serial connector specifications.................................................................................................................................10
VGA ports specifications............................................................................................................................................ 10
IDSDM module.............................................................................................................................................................. 10
Video specifications............................................................................................................................................................11
Environmental specifications........................................................................................................................................... 11
Standard operating temperature.............................................................................................................................. 12
Thermal restrictions.....................................................................................................................................................12
Particulate and gaseous contamination specifications ...................................................................................... 14
Contents 3
Technical specifications
The technical and environmental specifications of your system are outlined in this section.
Topics:
• Chassis dimensions
• System weight
• Processor specifications
• Supported operating systems
• PSU specifications
• Cooling fans specifications
• System battery specifications
• PCIe Expansion card riser specifications
• Memory specifications
• Storage controller specifications
• Drives
• Ports and connectors specifications
• Video specifications
• Environmental specifications
1
4 Technical specifications
Chassis dimensions
Figure 1. Chassis dimensions
Table 1. Dell EMC PowerEdge R740xd2 chassis dimensions
Xa Xb Y Za Zb
482.0 mm
(18.9 inches)
NOTE: * - Zb refers to the nominal rear wall external surface, where the system board I/O connectors are located.
448.0 mm
(17.63 inches)
86.8 mm
(3.41 inches)
With bezel: 35.93
mm (1.41 inches)
Without bezel: 22.0
mm (0.866 inches)
*
810.264 mm
(31.9 inches)
Zc
844.826mm
(33.260 inches)
System weight
Table 2. Dell EMC PowerEdge R740xd2 system weight
System configuration Maximum weight (with all drives/SSDs)
24+2 x 3.5-inch drives 40 kg (88.2 lb)
Technical specifications 5
Processor specifications
Table 3. Dell EMC PowerEdge R740xd2 processor specifications
Supported processor Number of supported processors
2nd generation Intel Xeon Scalable Processor Two
Supported operating systems
The Dell EMC PowerEdge R740xd2 supports the following operating systems:
● Canonical Ubuntu LTS
● Citrix XenServer
● Microsoft Windows Server
● Red Hat Enterprise Linux
● SUSE Linux Enterprise Server
● VMware ESXi
NOTE: For more information, go to www.dell.com/ossupport.
NOTE: For more information about the specific versions and additions, go to https://www.dell.com/support/home/
Drivers/SupportedOS/poweredge-r740xd2.
PSU specifications
The Dell EMC PowerEdge R740xd2 system supports up to two AC or DC power supply units (PSUs).
Table 4. PSU specifications
PSU Class Heat
1100 W AC Platinum 4100
1100 W
Mixed Mode
HVDC (for
China and
Japan only)
750 W AC Platinum 2891
750 W
Mixed Mode
Platinum 4416
Platinum 4416
Platinum 2902
dissipation
(maximum)
BTU/hr
BTU/hr
BTU/hr
BTU/hr
BTU/hr/
Frequency Voltage AC DC Current
50/60 Hz 100–240 V
AC,
autoranging
50/60 Hz 100–240 V
AC,
autoranging
NA 200–380 V
DC,
autoranging
50/60 Hz 100–240 V
AC,
autoranging
50/60 Hz 100–240 V
AC,
autoranging
High line
100–240
V
1100 W 1050 W NA 12 A–6.5 A
1100 W NA NA 12 A–6.5 A
NA NA 1100 W 6.4 A–3.2 A
750 W NA NA 10 A–5 A
750 W NA NA 10 A–5 A
Low line
100–120 V
Platinum
(For China
only)
750 W
Mixed Mode
6 Technical specifications
Platinum 2902
2902
BTU/hr/
BTU/hr/
NA 240 V DC,
autoranging
50/60 Hz 100–240 V
AC,
autoranging
NA NA 750 W 5 A
750 W NA NA 10 A–5 A
Table 4. PSU specifications (continued)
PSU Class Heat
HVDC (for
China only)
NOTE: Heat dissipation is calculated using the PSU wattage rating.
NOTE: This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 240
V.
Platinum 2902
dissipation
(maximum)
BTU/hr
Frequency Voltage AC DC Current
NA 240 V DC,
autoranging
High line
100–240
V
NA NA 750 W 4.5 A
Low line
100–120 V
Cooling fans specifications
The Dell EMC PowerEdge R740xd2 system supports up to six high performance cooling fans.
NOTE: When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system
power consumption with the Dell Energy Smart Solution Advisor available at Dell.com/ESSA.
Table 5. Dell EMC PowerEdge R740xd2 fan support matrix
Storage PSU type Processor
24+2 x 3.5inch or 24 x
3.5-inch.
Redundant
PSUs only
count
1 Required Required Required Required Required Required
2 Required Required Required Required Required Required
Fan 1 Fan 2 Fan 3 Fan 4 Fan 5 Fan 6
NOTE: Each fan is listed in the systems management software, referenced by the respective fan number. If there is a
problem with a particular fan, you can easily identify and replace the proper fan by noting the fan numbers on the cooling
fan assembly.
System battery specifications
The Dell EMC PowerEdge R740xd2 system supports CR 2032 3.0-V lithium coin cell system battery.
PCIe Expansion card riser specifications
The Dell EMC PowerEdge R740xd2 system supports up to three PCI express (PCIe) generation expansion cards that can be
installed on the system board and expansion card risers.
Table 6. Expansion card slots supported on the system board
Processor 1 Processor 2 PCH
PCie slots on
the riser
PCIe slot-1 Unique to
PCIe slot-2 Low profile-
Card
support
Dell
half length
Riser 2
(LOM
riser)
x8
Right
riser
x16
Butterfly
riser
On
Planar
Internal
riser
Left riser On Planar
On
Planar
PCIe slot-2 Full height-
half length
x16 x8 or x16
Technical specifications 7
Table 6. Expansion card slots supported on the system board (continued)
Processor 1 Processor 2 PCH
PCie slots on
the riser
Card
support
Riser 2
(LOM
riser)
Right
riser
Butterfly
riser
On
Planar
Internal
riser
Left riser On Planar
On
Planar
PCIe slot-3 Low profile-
half length
PCIe slot-4 Low profile-
half length
PCIe slot-5
NOTE:
PCIe slot 5
has open
backend
and bigger
PCIe card
connection
s can be
inserted in
this slot.
PCIe slot-6 Low profile-
NOTE: The expansion-card slots are not hot-swappable.
Low profilehalf length
half length
Memory specifications
x8 x16
x16
x4
x4
The Dell EMC PowerEdge R740xd2 system supports 16 DDR4 registered DIMM (RDIMMs) slots. Supported memory bus
frequencies are 1866 MT/s, 2133 MT/s, 2400 MT/s, and 2666 MT/s.
Table 7. Memory specifications
DIMM type DIMM rank DIMM capacity
Single rank 8 GB 8 GB 80 GB 16 GB 128 GB
RDIMM
Dual rank 16 GB 16 GB 160 GB 32 GB 256 GB
Dual rank 32 GB 32 GB 320 GB 64 GB 512 GB
Dual rank 64 GB 64 GB 640 GB 128 GB 1024 GB
Minimum RAM Maximum RAM Minimum RAM Maximum RAM
Single processor Dual processors
Storage controller specifications
The PowerEdge R740xd2 system supports the following controller cards.
Table 8. Dell EMC PowerEdge R740xd2 system controller cards
Internal controllers External controllers
● PERC H730P
● PERC H330
● HBA330
● S140
● 12 Gbps SAS HBA
● PERC H840
8 Technical specifications
Drives
The Dell EMC PowerEdge R740xd2 system supports:
Table 9. Drive specification
Chassis options Configurations
Twenty-four drive chassis Up to twenty-four 3.5-inch (SATA or Nearline SAS drives) front accessible drives
in slots 0 through 23 and
Up to eight 2.5-inch (SAS, SATA SSDs) front accessible drives can be installed
from slots 16 through 23.
Twenty-four front + two rear drive chassis Up to twenty-four 3.5 inch (SATA or Nearline SAS drives) front accessible drives
in slots 0 through 23 and up to two 3.5-inch SAS/SATA rear accessible drives.
NOTE: For single PERC configuration, it is slot 24 to slot 25. For dual PERC
configuration including S140 software RAID, it is slot 0 to slot 1.
NOTE: 2.5-inch drives in 3.5-inch carriers are supported for SAS, and SATA SSD drives.
Hard drives configurations
Table 10. Hard drives configurations
Chassis options Configurations
Twenty-four 3.5-inch (12+12 with
single PERC)
Twenty-four 3.5-inch front + two 3.5inch rear ( 12 + 12 + 2 with single
PERC)
Twenty-four 3.5-inch front + two 3.5inch rear ( 12 + 12 + 2 rear chipset
SATA)
● Drive Bay 1 physical slot number 0 through 11
○ Logically numbered 0 through 11
● Drive Bay 2 physical slot number 12 through 23
○ Logically numbered 12 through 23
● Drive Bay 1 physical slot number 0 through 11
○ Logically numbered 0 through 11
● Drive Bay 2 physical slot number 12 through 23
○ Logically numbered 12 through 23
● Drive Bay 0 slot numbers 24 and 25
○ Two drives in the rear chassis with logically numbered 24 and 25.
● Drive Bay 1 physical slot number 0 through 11
○ Logically numbered 0 through 11
● Drive Bay 2 physical slot number 12 through 23
○ Logically numbered 12 through 23
● Drive Bay 0 slot numbers 24 and 25
○ With this configuration, two drives in the rear chassis will be logically numbered
0 and 1.
Twenty-four 3.5-inch front + two 3.5inch rear (Dual PERC: Bay 1 and 2 on
first PERC, Bay 0 on second PERC)
● Drive Bay 1 physical slot number 0 through 11
○ Logically numbered 0 through 11
● Drive Bay 2 physical slot number 12 through 23
○ Logically numbered 12 through 23
● Drive Bay 0 slot numbers 24 and 25
Technical specifications 9
Table 10. Hard drives configurations (continued)
Chassis options Configurations
○ With this configuration, two drives in the rear chassis will be logically numbered
0 and 1
Ports and connectors specifications
USB ports specifications
Table 11. Dell EMC PowerEdge R740xd2 system USB specifications
Front Rear Internal
USB port type No. of ports
USB port
type
No. of ports USB port type No. of ports
USB 2.0-compliant port One USB 3.0-
Micro USB 2.0-compliant port for iDRAC
Direct
NOTE: The micro USB 2.0 compliant port
can only be used as an iDRAC Direct or a
management port.
One
compliant
ports
Two Internal USB
3.0-compliant
port
One
NIC ports specifications
The Dell EMC PowerEdge R740xd2 system supports up to two Network Interface Controller (NIC) ports on the back panel,
which have two 1 Gbps configuration.
NOTE: You can install up to six PCIe add-on NIC cards
Serial connector specifications
The Dell EMC PowerEdge R740xd2 system supports one serial connector on the back panel, which is a 9-pin connector, Data
Terminal Equipment (DTE), 16550-compliant.
VGA ports specifications
The Dell EMC PowerEdge R740xd2 system supports one 15-pin VGA ports, on the rear of the system.
IDSDM module
The Dell EMC PowerEdge R740xd2 system supports optional Internal Dual SD module (IDSDM) module.
The module supports three microSD cards; two cards for IDSDM and one card for vFlash. In 14th generation of PowerEdge
servers, the IDSDM or vFlash module is combined into a single card module, and is available in the following configurations:
● vFlash or
● vFlash and IDSDM
Table 12. Supported microSD card storage capacity
IDSDM card vFlash card
● 16 GB ● 16 GB
10 Technical specifications
Table 12. Supported microSD card storage capacity
IDSDM card vFlash card
● 32 GB
● 64 GB
NOTE: There are two dip switches on the IDSDM or vFlash module for write-protection.
NOTE: One IDSDM card slot is dedicated for redundancy.
NOTE: Use Dell EMC branded microSD cards that are associated with the IDSDM or vFlash configured systems.
Video specifications
The Dell EMC PowerEdge R740xd2 system supports integrated Matrox G200eW3 graphics controller with 16 MB of video frame
buffer.
Table 13. Supported video resolution options
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32
NOTE: 1920 x 1080 and 1920 x 1200 resolutions are only supported in reduced blanking mode.
Environmental specifications
NOTE:
For additional information about environmental certifications, please refer to the Product Environmental Datasheet
located with the Manuals & Documents on www.dell.com/poweredgemanuals
Table 14. Temperature specifications
Temperature Specifications
Storage -40–65°C (-40–149°F)
Continuous operation (for altitude less than 950
m or 3117 ft)
Fresh air For information about fresh air, see the Expanded operating temperature
Maximum temperature gradient (operating and
storage)
10–30°C (50–86°F) with no direct sunlight on the equipment
section.
20°C/h (36°F/h)
Technical specifications 11
Table 15. Relative humidity specifications
Relative humidity Specifications
Storage 5% to 95% RH with 33°C (91°F) maximum dew point.
Atmosphere must be noncondensing at all times.
Operating 10% to 80% RH with 29°C (84.2°F) maximum dew point.
Table 16. Maximum vibration specifications
Maximum vibration Specifications
Operating 0.26 G
Storage 1.88 G
at 5 Hz to 350 Hz (all operation orientations)
rms
at 10 Hz to 500 Hz for 15 minutes (all six sides tested)
rms
Table 17. Maximum shock pulse specifications
Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y,
and z axis of 6 G for up to 11 ms.
Storage Six consecutively executed shock pulses in the positive and negative x, y,
and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.
Table 18. Maximum altitude specifications
Maximum altitude Specifications
Operating 3048 m (10,000 ft)
Storage 12,000 m (39,370 ft)
Table 19. Operating temperature derating specifications
Operating temperature derating Specifications
Up to 30°C (86°F) Maximum temperature is reduced by 1°C/300 m (1°F/547 ft), above 950
m (3,117 ft).
30–40°C (86–104°F) Maximum temperature is reduced by 1°C/175 m (1°F/319 ft), above 950 m
(3,117 ft).
40–45°C (104–113°F) Maximum temperature is reduced by 1°C/125 m (1°F/228 ft), above 950 m
(3,117 ft).
Standard operating temperature
Table 20. Standard operating temperature specifications
Standard operating temperature Specifications
Continuous operation (for altitude less than 950 m or
3117 ft)
10°C to 30°C (50°F to 86°F) with no direct sunlight on the
equipment.
Thermal restrictions
● System must operate at temperature below 30°C.
● All fans installed in the system must be from the same manufacturer.
● Fresh air condition is not supported.
● 140W processors are not supported in rear drive configuration.
● Non Dell qualified or certified processors are not supported.
● LRDIMM is not supported.
12
Technical specifications
● 10 GbE / 25 GbE OCPs require PCIe shroud with rear drive configuration if there is no PCIe card installed.
● Butterfly without riser configuration cannot support 10GbE / 25GbE OCP because PCIe shroud cannot be installed.
● Drive bays should not be in service position for more than 5 minutes because of thermal concerns. When the drive bay is
open for more than five minutes, the cooling fans spin at a higher speed to provide extra cooling to the system. Thus system
health status changes from the normal to critical state, and system event The BP1 drive bay is kept open for
an extended period of time is logged.
● GPGPU card is not supported.
● Non Dell certified peripheral cards are not supported.
● Expansion card and riser installation must follow specific Expansion card installation guidelines.
● Mellanox CX-5 dual port 100G - QSPF PCIe adapter cable is restricted to Dell NW QSPF28 Direct attach cables and Finisar
100G 85C optic cables. Non Dell certified cables are not supported.
Table 21. Thermal limitation standard
Configuration Maximum no.of processors
Butterfly
Configura
tion
Rear
Module
Configura
tion
No riser
With Butterfly
Riser
Right Riser for
1x FH adapter
card
Right Riser +
Left Riser for
2x LP adapter
cards
supported
Quantity Model
1 or 2 processors <=140 W Required Processor 1 :
1 or 2 processors <=125 W Processor 1 :
DIMM blanks Heat Sink Type of Air
Table 22. Expansion cards thermal limitation
Thermal Cooling
Tier level
5 x8 - Rear HDD Module
Bus width Full height Cards Application
Restriction
(Configuration
Type / PCIe slot)
Configuration /
Slot# 2
shroud
2U Air
Standard heat
sink
Processor 2:
1.5 U HPR
heatsink
Standard heat
sink
Processor 2: 1
U HPR
heatsink
Half height Cards Application
QLOGIC 10G Dual
port BT, QLOGIC
25G Dual port SFP
shroud
2U Air
shroud for
Rear 3.5" X
2 HDD
Restriction
(Configuration
Type / PCIe slot)
1. Butterfly Riser
2. Rear HDD
3. No Riser, No
Fan
6 x High
Performa
nce fans
Configuration /
Slot# 3, 4, 5
Module
Configuration /
Slot# 2, 3
Rear HDD
Module / Slot#
5
6 Mellanox 40G Dual
Port CXP, QSFP,
Solarflare 10G Dual
Port SF852P,
Solarflare 10G Dual
Port SF852X
Mellanox 40G Dual
Port CXP QSF,
Solarflare 10G Dual
Port SF852X,
Solarflare 10G Dual
Port SF852P
Technical specifications 13
1. Butterfly Riser
Configuration /
Slot# 3, 4, 5
2. Rear HDD
Module
Configuration /
Slot# 2, 3
Table 22. Expansion cards thermal limitation (continued)
Thermal Cooling
Tier level
10 QLOGIC 10G Quad
8 x4 - - Intel NVME
Bus width Full height Cards Application
Restriction
(Configuration
Type / PCIe slot)
Mellanox 40G Dual
Port CXP, QSFP
port QLGX
Half height Cards Application
QLOGIC 10G Quad
port QLGX
P4800X
Particulate and gaseous contamination specifications
Restriction
(Configuration
Type / PCIe slot)
1. Butterfly Riser
Configuration
Slot# 3, 4
2. Rear HDD
Module
Configuration /
Slot# 2,3
1. Butterfly Riser
Configuration /
Slot# 3, 4
2. Rear HDD
Module
Configuration /
Slot# 2, 3
Butterfly Riser
Configuration /
Slot# 3
The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous
contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage
or failure, you may need to rectify the environmental conditions. Re-mediation of environmental conditions is the responsibility
of the customer.
Table 23. Particulate contamination specifications
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1
with a 95% upper confidence limit.
NOTE: This condition applies to data center environments only. Air
filtration requirements do not apply to IT equipment designed to be
used outside a data center, in environments such as an office or
factory floor.
NOTE: Air entering the data center must have MERV11 or MERV13
filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other
conductive particles.
NOTE: This condition applies to data center and non-data center
environments.
Corrosive dust
● Air must be free of corrosive dust.
● Residual dust present in the air must have a deliquescent point less
than 60% relative humidity.
NOTE: This condition applies to data center and non-data center
environments.
14 Technical specifications
Table 24. Gaseous contamination specifications
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
Silver coupon corrosion rate <200 Å/month as defined by AHSRAE TC9.9.
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
Technical specifications 15
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