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Dell EMC PowerEdge R740
Technical Specifications
Reg ula tor y M ode l: E38 S S eries
Reg ula tor y T ype : E 38S 001
Jul y 2 020
Rev . A 05
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Notes, cautions, and warnings
NOTE: A NOTE indicates important information that helps you make better use of your product.
CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid
the problem.
WARNING: A WARNING indicates a potential for property damage, personal injury, or death.
© 2016 - 2020 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries.
Other trademarks may be trademarks of their respective owners.
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Contents
Chapter 1: Technical specifications............................................................................................... 4
System dimensions..............................................................................................................................................................4
Chassis weight..................................................................................................................................................................... 5
Processor specifications.................................................................................................................................................... 5
Supported operating systems...........................................................................................................................................6
PSU specifications...............................................................................................................................................................6
System battery specifications.......................................................................................................................................... 7
Expansion bus specifications............................................................................................................................................ 7
Memory specifications....................................................................................................................................................... 9
Storage controller specifications................................................................................................................................... 10
Drive specifications........................................................................................................................................................... 10
Drives.............................................................................................................................................................................. 10
Optical drive................................................................................................................................................................... 11
Ports and connectors specifications..............................................................................................................................11
USB ports........................................................................................................................................................................11
NIC ports.........................................................................................................................................................................11
VGA ports....................................................................................................................................................................... 11
Serial connector............................................................................................................................................................ 11
Internal Dual SD Module or vFlash card..................................................................................................................12
Video specifications...........................................................................................................................................................12
Environmental specifications...........................................................................................................................................12
Standard operating temperature.............................................................................................................................. 13
Expanded operating temperature.............................................................................................................................14
Particulate and gaseous contamination specifications....................................................................................... 15
Contents 3
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Technical specifications
The technical and environmental specifications of your system are outlined in this section.
Topics:
• System dimensions
• Chassis weight
• Processor specifications
• Supported operating systems
• PSU specifications
• System battery specifications
• Expansion bus specifications
• Memory specifications
• Storage controller specifications
• Drive specifications
• Ports and connectors specifications
• Video specifications
• Environmental specifications
1
System dimensions
This section describes the physical dimensions of the system.
4 Technical specifications
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Figure 1. System dimensions of PowerEdge R740 system
Table 1. Dimensions
System Xa Xb Y Za (with
PowerEdge R740 482.0 mm
(18.98
inches)
434.0 mm
(17.09
inches)
86.8 mm
(3.42
inches)
bezel)
35.84 mm
(1.41 inches)
Za
(without
bezel)
22.0 mm
(0.87
inches)
Zb Zc
678.8 mm
(26.72
inches)
715.5 mm
(28.17
inches)
Chassis weight
Table 2. Chassis weight
System Maximum weight (with all drives/SSDs)
2.5 inch drive systems 26.3 kg (57.98 lb)
3.5 inch drive systems 28.6 kg (63.05 lb)
Processor specifications
The PowerEdge R740 system supports up to two Intel Xeon Processor Scalable Family processors, up to 28 cores per
processor.
NOTE: Processor sockets are not hot pluggable.
Technical specifications 5
Page 6
Supported operating systems
The PowerEdge R740 supports the following operating systems:
Canonical Ubuntu LTS
Citrix XenServer
Microsoft Windows Server with Hyper-V
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
VMware ESXi
NOTE: For more information, go to www.dell.com/ossupport.
PSU specifications
The PowerEdge R740 system supports up to two AC or DC power supply units (PSUs).
Table 3. PSU specifications
PSU Class Heat
495 W AC Platinum 1908 BTU/hr
750 W AC Platinum 2891 BTU/hr 50/60 Hz 100–240 V AC,
750 W AC Titanium 2843 BTU/hr 50/60 Hz 200–240 V AC,
750 W
Mixed
Mode
HVDC (for
China
only)
750 W
Mixed
Mode
1100 W AC Platinum 4100 BTU/hr 50/60 Hz 100–240 V AC,
1100 W DC N/A 4416 BTU/hr N/A –(48 V to –60 V)
Platinum 2891 BTU/hr 50/60 Hz 100–240 V AC,
Platinum 2891 BTU/hr N/A 240 V DC,
Platinum 2891 BTU/hr 50/60 Hz 100–240 V AC,
Platinum(F
or China
only)
dissipation
(maximum)
2891 BTU/hr N/A 240 V DC,
FrequencyVoltage High line
50/60 Hz
100–240 V AC,
autoranging
autoranging
autoranging
autoranging
autoranging
autoranging
autoranging
autoranging
DC, autoranging
200v240 V
495 W 495 W NA 6.5 A–3 A
750 W 750 W NA 10 A–5 A
750 W NA 5 A
750 W 750 W NA 10 A–5 A
NA NA 750W 4.5 A
750 W 750 W NA 10 A–5 A
NA NA 750 W 5 A
1100 W 1050 W 12 A–6.5 A
NA NA 1100 W 32 A
Low line
100– 140 V
DC Current
1100 W
Mixed
Mode
HVDC (for
China and
Japan
only)
1600 W
AC
6 Technical specifications
Platinum 4100 BTU/hr 50/60 Hz 100–240 V AC,
N/A 4100 BTU/hr N/A 200–380 V DC,
Platinum 6000 BTU/hr 50/60 Hz 100–240 V AC,
autoranging
autoranging
autoranging
1100 W 1050 W 12 A–6.5 A
NA NA 1100 W 6.4 A–3.2 A
1600 W 800 W NA
10 A
Page 7
Table 3. PSU specifications (continued)
PSU Class Heat
dissipation
(maximum)
2000 WACPlatinum 7500 BTU/hr 50/60 Hz 100–240 V AC,
2400 WACPlatinum 9000 BTU/hr 50/60 Hz 100–240 V AC,
NOTE: Heat dissipation is calculated using the PSU wattage rating.
NOTE: This system is also designed to connect to the IT power systems with a phase to phase voltage not exceeding 240
V.
NOTE: PSUs rated for 1100 W Mixed Mode HVDC or 1100 W AC and higher require high-line voltage (200–240 V AC) to
supply their rated capacity.
FrequencyVoltage High line
200v240 V
2000 W 1000 W NA
autoranging
2400 W 1400 W NA
autoranging
Low line
100– 140 V
DC Current
11.5 A
16 A
System battery specifications
The PowerEdge R740 system supports CR 2032 3.0-V lithium coin cell system battery.
Expansion bus specifications
The PowerEdge R740 system supports up to eight PCI express (PCIe) generation 3 expansion cards that can be installed on the
system board using expansion card risers. The following table provides detailed information about the expansion card riser
specifications:
Table 4. Expansion card riser configurations
Expansion
card riser
Riser 1A Slot 1 Full Height Full Length x16
Riser 1B Slot 1 Full Height Full Length x8
Riser 1D Slot 1 Full Height Full Length x16
Riser 2A Slot 4 Full Height Full Length x16
Riser 2B Slot 4 Low Profile Half Length x8
PCIe slots on the
riser
Slot 3 Full Height Half Length x16
Slot 2 Full Height Full Length x8
Slot 3 Full Height Half Length x8
Slot 2 Full Height Full Length x8
Slot 3 Full Height Half Length x8
Slot 5 Full Height Full Length x8
Slot 6 Low Profile Half Length x8
Height Length Link
Riser 2C Slot 4 Low Profile Half Length x16
Riser 3A Slot 7 Full Height Full Length x8
Slot 8 Full Height Full Length x16
Technical specifications 7
Page 8
Table 5. Expansion card riser specifications
Riser
configuration
and supported
risers
Riser
configuration 0
(No riser)
Riser
configuration 1
(1B+2B)
Riser
configuration 2
(1B+2C)
Slot
description
No PCIe slots
(only rear
storage)
Four x8 slots
Three x8 and
one x16 slots
PCIe slots on
riser 1 (Height
and length)
N/A N/A N/A N/A N/A N/A
Slot 1: x8 fullheight, full
length
Slot 2: x8 fullheight, full
length
Slot 3: x8 fullheight, half
length
Slot 1: x8 fullheight, full
length
Slot 2: x8 fullheight, full
length
Slot 3: x8 fullheight, half
length
Processo
r
connectio
n
Processor
1
Processor
1
Processor
1
Processor
1
Processor
1
Processor
1
PCIe slots on
riser 2 (Height
and length)
Slot 4: x8 low
profile, half
length
Slot 4: x16 low
profile, half
length
Processor
connectio
n
Processor
1
Processor
2
PCIe slots on
riser 3 (Height
and length)
N/A N/A
N/A N/A
Processo
connecti
r
on
Riser
configuration 3
(1A+2A)
Riser
configuration 4
(1A+2A+3A)
Riser
configuration 5
(1B+2A+3A)
Two x8 and
three x16 slots
Three x8 and
four x16 slots
Six x8 and two
x16 slots
Slot 1: x16 fullheight, full
length
N/A N/A Slot 5: x8 full-
Slot 3: x16 fullheight, half
length
Slot 1: x16 fullheight, full
length
N/A N/A Slot 5: x8 full-
Slot 3: x16 fullheight, half
length
Slot 1: x8 fullheight, full
length
Slot 2: x8 fullheight, full
length
Processor1Slot 4: x16 full-
height, full length
height, full length
Processor1Slot 6: x8 low
profile, half
length
Processor1Slot 4: x16 full-
height, full length
height, full length
Processor1Slot 6: x8 low
profile, half
length
Processor1Slot 4: x16 full-
height, full length
Processor1Slot 5: x8 full-
height, full length
Processor
2
Processor
2
Processor
1
Processor2Slot 7: x8 full-
Processor2Slot 8: x16 full-
Processor
1
Processor2Slot 7: x8 full-
Processor2Slot 8: x16 full-
N/A N/A
height, full
length
height, full
length
height, full
length
height, full
length
Processor
2
Processor
2
Processor
2
Processor
2
8 Technical specifications
Slot 3: x8 fullheight, half
length
Processor1Slot 6: x8 low
profile, half
length
Processor
1
Page 9
Table 5. Expansion card riser specifications (continued)
Riser
configuration
and supported
risers
Riser
configuration 6
(1D+2A+3A)
Riser
configuration 9
(1A+2D+3A)
NOTE:
Slot
description
Five x8 and
three x16 slots
Three x8 and
four x16 slots
PCIe slots on
riser 1 (Height
and length)
Slot1: x16 fullheight, full
length
Slot 2: x8 fullheight, full
length
Slot 3: x8 fullheight, half
length
Slot 1: x16 fullheight, full
length
N/A N/A Slot 5: x8 full-
Slot 3: x16 fullheight, half
length
Processo
r
connectio
n
Processor1Slot 4: x16 full-
Processor1Slot 5: x8 full-
Processor1Slot 6: x8 low
Processor1Slot 4: x16 full-
Processor1Slot 6: x8 low
PCIe slots on
riser 2 (Height
and length)
height, full length
height, full length
profile, half
length
height, full length
height, full length
profile, half
length
Processor
connectio
n
Processor2Slot 7: x8 full-
Processor
2
Processor
1
Processor2Slot 7: x8 full-
Processor2Slot 8: x16 full-
Processor
1
PCIe slots on
riser 3 (Height
and length)
height, full
length
Slot 8: x16 fullheight, full
length
height, full
length
height, full
length
Processo
r
connecti
on
Processor
2
Processor
2
Processor
2
Processor
2
● Riser slots are not hot pluggable.
● Internal cable connectors are not hot pluggable.
Memory specifications
Table 6. Memory specifications
Memory
module
sockets
Twenty four
288-pins
DIMM
type
LRDIMM
RDIMM
NVDIMM
-N
DIMM rank
Octa rank 128 GB 128 GB 1.5 TB 256 GB 3 TB
Quad rank 64 GB 64 GB 768 GB 128 GB 1.5 TB
Single rank 8 GB 8 GB 96 GB 16 GB 192 GB
Dual rank 16 GB 16 GB 192 GB 32 GB 384 GB
Dual rank 32 GB 32 GB 384 GB 64 GB 768 GB
Dual rank 64 GB 64 GB 768 GB 128 GB 1536 GB
Single rank 16 GB Not
DIMM
capacity
Single processor Dual processors
Minimum
RAM
supported
with single
processor
Maximum
RAM
Not supported
with single
processor
Minimum RAM Maximum RAM
RDIMM: 192 GB RDIMM: 384 GB
NVDIMM-N: 16GBNVDIMM-N: 192
GB
DCPMM
NA 128 GB RDIMM:
192GB
DCPMM: 128GBDCPMM: 128GBDCPMM: 1536GBDCPMM: 1536 GB
NA 256 GB NA NA RDIMM: 192 GB LRDIMM: 1536 GB
RDIMM: 384GBRDIMM: 384 GB LRDIMM: 1536 GB
Technical specifications 9
Page 10
Table 6. Memory specifications (continued)
Memory
module
sockets
NOTE: 8 GB RDIMMs and NVDIMM-N must not be mixed.
NOTE: 64 GB LRDIMMs, 128 GB LRDIMMs must not be mixed.
NOTE: Minimum of two CPUs are required for any configurations that support NVDIMM-N.
NOTE: DCPMM can be mixed with RDIMMs and LRDIMMs.
NOTE: Mixing of DDR4 DIMM Types (RDIMM, LRDIMM), within channel, integrated memory controller, socket, or across
sockets is not supported.
NOTE: x4 and X8 DDR4 DIMM can be mixed within channel.
NOTE: Mix of Intel Data center persistent memory module operating modes (App Direct, Memory Mode) is not supported
within socket or across sockets.
DIMM
type
DIMM rank
NA 512 GB NA NA RDIMM: 384 GB RDIMM: 1536 GB
DIMM
capacity
Single processor Dual processors
Minimum
RAM
NA NA DCPMM: 2048GBDCPMM: 3072 GB
NA NA DCPMM: 4096GBDCPMM: 6144 GB
Maximum
RAM
Minimum RAM Maximum RAM
NOTE: Memory DIMM slots are not hot pluggable.
Storage controller specifications
The PowerEdge R740 system supports:
● Internal storage controller cards: PowerEdge RAID Controller (PERC) H330, PERC H730P, PERC H740P, HBA330, S140, and
Boot Optimized Server Storage (BOSS-S1).
The BOSS card is a simple RAID solution card designed specifically for booting a server's operating system. The card
supports up to two 6 Gbps M.2 SATA drives. The BOSS adapter card has a x8 connector using PCIe gen 2.0 x2 lanes,
available only in the low-profile and half-height form factor.
● External storage controller cards: PERC H840 and 12Gbps SAS HBA.
NOTE: Mini-PERC socket is not hot pluggable.
Drive specifications
Drives
The PowerEdge R740 system supports SAS, SATA, Nearline SAS hard drives or SSDs.
Table 7. Supported drive options for the PowerEdge R740 system
Drives Supported configuration
Eight drives system Up to eight 3.5 inch or 2.5 inch (SAS, SATA or Nearline SAS) front
accessible drives in slots 0 through 7
10 Technical specifications
Page 11
Table 7. Supported drive options for the PowerEdge R740 system (continued)
Drives Supported configuration
Sixteen drives system Up to sixteen 2.5 inch (SAS, SATA or SSD) front accessible drives in
slots 0 through 15
NOTE: Hard drives are hot swappable.
Optical drive
The PowerEdge R740 system supports one optional slim SATA DVD-ROM drive or DVD +/-RW drive.
Ports and connectors specifications
USB ports
The PowerEdge R740 system supports:
● Two USB 2.0-compliant ports on the front of the system
● One internal USB 3.0-compliant port
● One optional USB 3.0-compliant port on the front of the system
● One micro USB 2.0-compliant port in the front of the system for iDRAC Direct
● Two USB 3.0-compliant ports on the back of the system
NIC ports
The PowerEdge R740 system supports up to four Network Interface Controller (NIC) ports that are integrated on the network
daughter card (NDC), and are available in the following configurations:
● Four RJ-45 ports that support 10, 100 and 1000 Mbps
● Four RJ-45 ports that support 100 M, 1 G and 10 Gbps
● Four RJ-45 ports, where two ports support maximum of 10 G and the other two ports maximum of 1 G
● Two RJ-45 ports that support up to 1 Gbps and 2 SFP+ ports that support up to 10 Gbps
● Four SFP+ ports that support up to 10 Gbps
● Two SFP28 ports that support up to 25 Gbps
NOTE: You can install up to eight PCIe add-on NIC cards.
NOTE: NDC slot is not hot pluggable.
VGA ports
The Video Graphic Array (VGA) port enables you to connect the system to a VGA display. The PowerEdge R740 system
supports two 15-pin VGA ports on the front and back panels.
NOTE: The VGA ports are not hot pluggable.
Serial connector
The PowerEdge R740 system supports one serial connector on the back panel, which is a 9-pin connector, Data Terminal
Equipment (DTE), 16550-compliant.
NOTE: The Serial port is not hot pluggable.
Technical specifications 11
Page 12
Internal Dual SD Module or vFlash card
The PowerEdge R740 system supports Internal Dual SD module (IDSDM) and vFlash card. In 14th generation of PowerEdge
servers, IDSDM and vFlash card are combined into a single card module, and are available in these configurations:
● vFlash or
● IDSDM or
● vFlash and IDSDM
The IDSDM/vFlash card sits in the back of the system, in a Dell-proprietary slot. IDSDM/vFlash card supports three micro SD
cards (two cards for IDSDM and one card for vFlash). Micro SD cards capacity for IDSDM are 16/32/64 GB while for vFlash the
microSD card capacity is 16 GB.
NOTE: IDSDM and vFlash slot is not hot pluggable.
Video specifications
The PowerEdge R740 system supports integrated Matrox G200eW3 graphics controller with 16 MB of video frame buffer.
Table 8. Supported video resolution options
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32
NOTE: 1920 x 1080 and 1920 x 1200 resolutions are only supported in reduced blanking mode.
Environmental specifications
NOTE:
For additional information about environmental certifications, please refer to the Product Environmental Datasheet
located with the Manuals & Documents on www.dell.com/poweredgemanuals.
Table 9. Temperature specifications
Temperature Specifications
Storage –40°C to 65°C (–40°F to 149°F)
Continuous operation (for altitude less than 950 m or
3117 ft)
Maximum temperature gradient (operating and
storage)
12 Technical specifications
10°C to 35°C (50°F to 95°F) with no direct sunlight on the
equipment.
20°C/h (68°F/h)
Page 13
Table 10. Relative humidity specifications
Relative humidity Specifications
Storage 5% to 95% RH with 33°C (91°F) maximum dew point. Atmosphere
must be non-condensing at all times.
Operating 10% to 80% relative humidity with 29°C (84.2°F) maximum dew
point.
Table 11. Maximum vibration specifications
Maximum vibration Specifications
Operating 0.26 G
Storage 1.88 G
at 5 Hz to 350 Hz (all three axes).
rms
at 10 Hz to 500 Hz for 15 min (all six sides tested).
rms
Table 12. Maximum shock specifications
Maximum shock Specifications
Operating Six consecutively executed shock pulses in the positive and negative x,
y, and z axes of 6 G for up to 11 ms.
Storage Six consecutively executed shock pulses in the positive and negative x,
y, and z axes (one pulse on each side of the system) of 71 G for up to
2 ms.
Table 13. Maximum altitude specifications
Maximum altitude Specifications
Operating
Storage 12,000 m (39,370 ft)
3048 m (10,000 ft)
Table 14. Operating temperature de-rating specifications
Operating temperature de-rating Specifications
Up to 35°C (95°F) Maximum temperature is reduced by 1°C/300 m (1°F/547 ft) above
950 m (3,117 ft).
35°C to 40°C (95°F to 104°F) Maximum temperature is reduced by 1°C/175 m (1°F/319 ft) above
950 m (3,117 ft).
40°C to 45°C (104°F to 113°F) Maximum temperature is reduced by 1°C/125 m (1°F/228 ft) above
950 m (3,117 ft).
Standard operating temperature
Table 15. Standard operating temperature specifications
Standard operating temperature Specifications
Continuous operation (for altitude less than 950 m or
3117 ft)
Humidity percentage range 10% to 80% Relative Humidity with 29°C (84.2°F) maximum dew
10°C to 35°C (50°F to 95°F) with no direct sunlight on the
equipment.
point.
Technical specifications 13
Page 14
Expanded operating temperature
Table 16. Expanded operating temperature specifications
Expanded operating temperature Specifications
Continuous operation 5°C to 40°C at 5% to 85% RH with 29°C dew point.
NOTE: Outside the standard operating temperature (10°C to
35°C), the system can operate continuously in temperatures as low
as 5°C and as high as 40°C.
For temperatures between 35°C to 40°C, de-rate maximum allowable
temperature by 1°C per 175 m above 950 m (1°F per 319 ft).
≤ 1% of annual operating hours –5°C to 45°C at 5% to 90% RH with 29°C dew point.
NOTE: Outside the standard operating temperature (10°C to
35°C), the system can operate down to –5°C or up to 45°C for a
maximum of 1% of its annual operating hours.
For temperatures between 40°C and 45°C, de-rate maximum
allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).
NOTE: When operating in the expanded temperature range, system performance may be impacted.
NOTE: When operating in the expanded temperature range, ambient temperature warnings may be reported in the System
Event Log.
Expanded operating temperature restrictions
● 128 GB LRDIMM is not supported for FAC.
● Do not perform a cold startup below 5°C.
● The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft).
● 150 W/8 core, 165 W/12 core and higher wattage processor [Thermal Design Power (TDP)>165 W] are not supported.
● Redundant power supply unit is required.
● Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
● PCIe SSD is not supported.
● NVDIMM-Ns are not supported.
● DCPMMs are not supported.
● GPU is not supported.
● Tape backup unit is not supported.
Thermal restrictions
Following table lists the configuration required for efficient cooling.
Table 17. Thermal restrictions configuration
ConfigurationNumber
PowerEdge
R740
of
processo
rs
1 One 1U standard heat sink
Heatsink Processor/DIMM
blank
Required Not
for CPU ≤ 125 W
One 2U standard heat sink
for CPU > 125 W
DIMM
blanks
required
Type of air
shroud
Standard Four standard
Fan
fans and one
blank to cover
two fan slots
PowerEdge
R740
14 Technical specifications
2 Two 1U standard heat sink
for CPU ≤ 125 W
Not required Not
required
Standard Six standard
fans
Page 15
Table 17. Thermal restrictions configuration (continued)
ConfigurationNumber
PowerEdge
R740 with
GPU
of
processo
rs
2 Two 1U high performance
Heatsink Processor/DIMM
blank
Two 2U standard heat sink
for CPU > 125 W
Not required Not
heat sink
DIMM
blanks
required
Type of air
shroud
GPU air shroud Six high
Fan
performance
fans
Ambient temperature limitations
The following table lists configurations that require ambient temperature less than 35°C.
NOTE: The ambient temperature limit must be adhered to ensure proper cooling and to avoid excess CPU throttling, which
may impact system performance.
Table 18. Configuration based ambient temperature restrictions
System Front backplane Processor
PowerEdge
R740
8 x 3.5 inch SAS/
SATA
Thermal
Design Power
(TDP)
150 W/8 core,
165 W/12 core,
200 W, 205 W
Processor heat
sink
1U high
performance
Fan type GPU Ambient
High
performance fan
≥1 doublewidth/singlewidth
restriction
30°C
8 x 2.5 inch SAS/
SATA
16 x 2.5 inch
SAS/SATA
150 W/8 core,
165 W/12 core,
200 W, 205 W
150 W/8 core,
165 W/12 core,
200 W, 205 W
1U high
performance
1U high
performance
High
performance fan
High
performance fan
≥1 doublewidth/singlewidth
≥1 doublewidth/singlewidth
30°C
30°C
Particulate and gaseous contamination specifications
The following table defines the limitations that help avoid any equipment damage or failure from particulate and gaseous
contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and result in equipment damage
or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of
the customer.
Table 19. Particulate contamination specifications
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1
with a 95% upper confidence limit.
NOTE: The ISO Class 8 condition applies to data center
environments only. This air filtration requirement does not apply to
IT equipment designed to be used outside a data center, in
environments such as an office or factory floor.
NOTE: Air entering the data center must have MERV11 or MERV13
filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other
conductive particles.
NOTE: This condition applies to data center and non-data center
environments.
Technical specifications 15
Page 16
Table 19. Particulate contamination specifications (continued)
Particulate contamination Specifications
Corrosive dust
● Air must be free of corrosive dust.
● Residual dust present in the air must have a deliquescent point less
than 60% relative humidity.
NOTE: This condition applies to data center and non-data center
environments.
Table 20. Gaseous contamination specifications
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013.
Silver coupon corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013.
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
16 Technical specifications
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