Dell PowerEdge M610x User Manual

PowerEdge M610x

Technical Guide

PCIe expansion
capabilities in the
PowerEdge M610x
bring a new
dimension of
flexibility and
performance to
the Dell M-Series.

Dell

Dell, PowerEdge, EqualLogic, PowerVault, OpenManage, and ReadyRails are trademarks of Dell, Inc.
Citrix® and XenServer™ are trademarks of Citrix Systems, Inc. and/or one or more of its subsidiaries,
and may be registered in the United States Patent and Trademark Office and in other countries.
Intel, Xeon, and Speedstep are registered trademarks and MMX and Core are trademarks of Intel
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Company. Broadcom is a registered trademark and NetXtreme is a trademark of Broadcom
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trademark of Matrox Electronic Systems Ltd. Microsoft, Windows, Windows Server, BitLocker, and
Hyper-V are either registered trademarks or trademarks of Microsoft Corporation in the United States
and/or other countries. Mellanox is a registered trademark of Mellanox Technologies, Inc. and
ConnectX, InfiniBlast, InfiniBridge, InfiniHost, InfiniRISC, InfiniScale, and InfiniPCI are trademarks of
Mellanox Technologies, Inc. Novell is a registered trademarks of Novell, Inc., in the United States and
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Corporation in the U.S. and other countries. QLogic and PathScale are registered trademarks of
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the United States and/or other jurisdictions. vRanger, vFoglight, vConverter, Vizioncore vOptimizer,
and Vizioncore vEssentials are trademarks of Vizioncore Inc. Other trademarks and trade names may
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©Copyright 2010 Dell Inc. All rights reserved. Reproduction or translation of any part of this work
beyond that permitted by U.S. copyright laws without the written permission of Dell Inc. is unlawful
and strictly forbidden.

Revision 2 December 2010

Dell PowerEdge M610x Technical Guide ii

Dell

Table of Contents

1 Product Comparison ........................................................................................... 1

1.1 Overview .................................................................................................. 1

1.1.1 Unparalleled PowerEdge Flexibility ............................................................. 1

1.1.2 Uncompromised Performance .................................................................... 1

1.1.3 Simplified Systems Management ................................................................. 1

1.2 Product Comparison ..................................................................................... 2

2 New Technologies .............................................................................................. 4

2.1 Overview .................................................................................................. 4

3 System Information ............................................................................................ 5

3.1 Overview .................................................................................................. 5

4 Mechanical ...................................................................................................... 8

4.1 Chassis Description....................................................................................... 8

4.2 Dimensions and Weight .................................................................................. 8

4.3 Internal Module View .................................................................................... 9

4.4 Security .................................................................................................... 9

4.5 Cover Latch ............................................................................................... 9

4.6 TPM (Trusted Platform Module) ........................................................................ 9

4.7 Power Off Security ....................................................................................... 9

4.8 USB Key .................................................................................................. 10

4.9 Battery ................................................................................................... 10

4.10 Field Replaceable Units (FRU)........................................................................ 10

4.11 User Accessible Jumpers, Sockets, and Connectors ............................................... 10

5 Power, Thermal, Acoustic .................................................................................. 11

5.1 Power Supplies ......................................................................................... 11

5.2 Power Efficiency ....................................................................................... 11

5.3 Thermal Operating and Storage Specifications .................................................... 11

5.4 Acoustics ................................................................................................ 12

6 Processors ..................................................................................................... 14

6.1 Overview ................................................................................................ 14

6.2 Features ................................................................................................. 14

6.3 Supported Processors .................................................................................. 16

6.4 Processor Installation .................................................................................. 16

7 Memory ........................................................................................................ 17

7.1 Overview ................................................................................................ 17

7.2 DIMMs Supported ....................................................................................... 17

7.3 Memory Features ....................................................................................... 18

7.4 Memory Speed Limitations ............................................................................ 18

8 Chipset ........................................................................................................ 20

8.1 Overview ................................................................................................ 20

8.2 I/O Hub (IOH) ........................................................................................... 20

8.2.1 QuickPath Interconnect (QPI) .................................................................. 20

8.2.2 PCI Express ........................................................................................ 20

8.2.3 Direct Media Interface (DMI) ................................................................... 20

8.2.4 I/O Controller Hub 9 (ICH9)..................................................................... 20

8.2.5 PCI Express Mezzanine Connectors ............................................................ 21

9 BIOS ............................................................................................................ 22

9.1 Overview ................................................................................................ 22

9.2 Supported ACPI States ................................................................................. 22

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10 Embedded NICs/LAN on Motherboard (LOM) ............................................................. 23

10.1 Overview ................................................................................................ 23

10.2 Platform Networking LAN on Motherboard (LOM) Technology Overview ....................... 23

10.3 I/O Slots (I/O Mezzanine Card Options for M1000e) .............................................. 24

10.3.1 Overview .......................................................................................... 24

10.3.2 Options ............................................................................................ 24

10.3.3 PCIe Card Support ................................................................................ 24

10.3.4 NVIDIA Cards ...................................................................................... 24

10.3.5 Fusion-io Cards ................................................................................... 25

11 Storage ........................................................................................................ 26

11.1 Overview ................................................................................................ 26

11.2 Hard Disk Drive Carriers ............................................................................... 26

11.3 Empty Drive Bays ....................................................................................... 26

11.4 Diskless Configuration Support ....................................................................... 26

11.5 Hard Drive LED Indicators ............................................................................. 27

11.6 Optical Drives ........................................................................................... 27

11.7 RAID Cards .............................................................................................. 28

11.7.1 SATA Repeater .................................................................................... 28

11.7.2 PERC6/i ............................................................................................ 28

11.7.3 H200 ................................................................................................ 28

11.7.4 H700 and H800 .................................................................................... 28

11.8 LED Indicators .......................................................................................... 28

11.9 Optical Drives ........................................................................................... 28

12 Video (PCI Video) ............................................................................................ 29

13 Rack Information ............................................................................................. 30

14 Operating Systems ........................................................................................... 31

15 Virtualization ................................................................................................. 32

15.1 Resources................................................................................................ 32

15.2 Advanced Infrastructure Manager by Scalent ...................................................... 32

15.3 Vizioncore ............................................................................................... 32

16 Systems Management ........................................................................................ 34

16.1 Overview ................................................................................................ 34

16.2 Server Management .................................................................................... 34

16.3 Embedded Server Management ...................................................................... 35

16.4 Lifecycle Controller and Unified Server Configurator ............................................ 35

16.5 The iDRAC6 Enterprise ................................................................................ 36

16.6 Chassis Management Controller (CMC) .............................................................. 37

17 Peripherals .................................................................................................... 38

17.1 USB Peripherals ......................................................................................... 38

17.2 External Storage ........................................................................................ 38

Appendix A. Standards Compliance ........................................................................... 39

Appendix B. Regulatory Certifications........................................................................ 41

Appendix C. Additional Technical Specifications ........................................................... 42

Tables

Table 1. Product Comparisons ................................................................................. 2

Table 2. Product Features ...................................................................................... 5

Table 3. Operating and Storage Specifications ............................................................ 12

Table 4. Typical Configuration for Acoustical Performance Analysis ................................... 13

Table 5. Comparison of Processor Technology ............................................................ 15

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Table 6. Supported Processors ............................................................................... 16

Table 7. Maximum Supported Memory Frequencies ...................................................... 19

Table 8. Supported Video Modes ............................................................................ 29

Table 9. Unified Server Configurator Features and Description......................................... 35

Table 10. Features List for BMC, iDrac, and vFlash ........................................................ 36

Table 11. Standards Compliance and Specifications ....................................................... 39

Table 12. Technical Specifications ........................................................................... 42

Figures

Figure 1. PowerEdge M1000e ................................................................................... 8

Figure 2. Internal View .......................................................................................... 9

Figure 3. 2.5‖ HDD Carrier .................................................................................... 26

Dell PowerEdge M610x Technical Guide v

1 Product Comparison

1.1 Overview

With PCIe expansion options and a feature rich Chassis Management Controller, the Dell™
PowerEdge™ M610x allows you to efficiently run applications, consolidate your data center, and

simplify data management.

The PowerEdge M610x enables you to incorporate a vast array of PCIe-based products into the Blade
Chassis framework with enough power and cooling to efficiently deploy even the most feature-rich,
expansion-card-based solutions. With the addition of the PCIe expansion module, the PowerEdge
M610x blade server is an ideal solution for organizations that need maximum flexibility and
performance with high reliability. Maximized Gen2 PCIe expansion is finally realized within a blade.

1.1.1 Unparalleled PowerEdge Flexibility

The PowerEdge M610x PCIe expansion module includes two full-length x16 PCIe Gen2 slots with
supplemental power connectors that enable maximum wattage for one 300W dual-slot card or two
250W single-slot cards. These PCIe slots are capable of supporting everything from H-series external
RAID controllers to general-purpose computing-on-graphics processing units (GPGPU).

Now, a single M610x, equipped with a NVIDIA® Tesla™ GPGPU card, can perform over 400 Gigaflops of
double-precision computations for demanding, floating-point-intensive workloads. Communication
between the host system and the Tesla processors is maximized by providing x16 Gen2 PCIe
bandwidth while the efficient Dell M1000e chassis powers and cools the solution to its maximum
247W TDP (Thermal Design Power).

1.1.2 Uncompromised Performance

The PowerEdge M610x is an energy-efficient, optimized full-height two-socket server for
virtualization and database applications. Additional manageability features make it easy to use,
manage and deploy. As an ideal PCIe Host server, the M610x features the reliability of two 2.5‖ SAS
or SSD hot-swappable hard drives and the IO throughput of a dual-port embedded gigabit NIC and two
additional network daughtercards. Intel® Xeon® processors 5600 series, plus up to 192GBs of DDR3
memory, offer high performance with low power consumption for a variety of dense-environment
workloads. The Platinum level (+94%) powered and modularly cooled PCIe expansion module delivers
up to 8 Gigabytes per second of application throughput.

1.1.3 Simplified Systems Management

Spend more time on your business and less on maintaining your IT with embedded system
management features on the PowerEdge M610x and the Chassis Management Controller (CMC).
Simplified server and chassis management is achieved through automated discovery which automates
configuration of new hardware through a one-to-many relationship and enables pre-provisioning of
LAN/SAN resources.

In addition, one-to-many updating through the CMC and Virtual File Share simplifies the update
process for BIOS, firmware and drivers without additional software. Proactive management provides
immediate access to system status, issues and alerts through a single, easy-to-use interface that
includes one-click key functions to help quickly resolve issues.

Dell

M610x

M610

M710HD

M710

Description

Special purpose
Full-height 2S

General purpose Half­height 2S

General purpose
Half-height 2S

General purpose
Full-height 2S

Processor

2 Socket Intel® Xeon® Processor 5500 or 5600 Series

Front Side
Bus

Two Intel QuickPath Interconnect (QPI)

# Proc
Sockets

2

Max # Cores
per Socket

Up to 6

L2/L3 Cache

8MB (5500 Series) or 12MB (5600 Series)

Chipset

Intel 5500

Intel 5500

Intel 5520

Intel 5520

DIMMs

12 x DDR3 DIMMs
(800/1066/1333MHz)

12 x DDR3 DIMMs
(800/1066/1333MHz)

18 x DDR3 DIMMs
(800/1066/1333MHz)

18 x DDR3 DIMMs
(800/1066/1333MHz)

Min/Max RAM

1GB - 192GB (16GB
DIMMS)

1GB - 192GB (16GB
DIMMS)

1GB–192GB (16GB
DIMMS)

1GB - 192GB (16GB
DIMMS)

Form Factor

Full-Height Blade,
Dual
Socket/Expansion
module

Half-Height Blade,
Dual Socket

Half-Height Blade,
Dual socket

Full-Height Blade,
Dual Socket

HDD Bays
(2.5” only)

SAS: Hot-Pluggable 2

x 2.5‖
SATA: 1 x 2.5‖

SAS: Hot-Pluggable 2

x 2.5‖
SATA: 1 x 2.5‖

SAS: Hot-Pluggable 2

x 2.5‖
SSD SATA: 2 x 2.5‖

SAS: Hot-Pluggable 4

x 2.5‖
SSD SATA: 2 x 2.5‖

HDD Types

SAS/SSD

HDD
Controller

H200
H700
H800
SAS6E

H200
Non-RAID SATA (1

HDD only)
SAS6/iR
PERC6i with RAID

battery

Embedded H200

H200
SAS6/iR
PERC6i with RAID

battery

Optional HD
Controller

SAS6/iR
PERC6i with RAID
battery

SAS6/iR
PERC6i with RAID
battery

Embedded H200

SAS6/iR PERC6i with
RAID battery

Availability

Hot-plug hard drives
ECC memory
Single Device Data Correction (SDDC)
Supports memory demand and patrol

scrubbing
High-availability failover cluster support

1.2 Product Comparison

Table 1. Product Comparisons

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Dell

M610x

M610

M710HD

M710

Server
Management

Integrated Dell Remote Access Controller iDRAC6 Express/Enterprise (both standard) w/
IPMI 2.0 +vMedia/vKVM, and CMC (on the PowerEdge M1000e chassis)

Mezz Slots

2 x8 (PCI Gen 2);
Fabric B limited to a
small form factor
(SFF) mezzanine
card

2 x8 (PCI Gen 2);
Fabric B limited to a
small form factor
(SFF) mezzanine
card

2 x8 PCIe Mezzanine
Cards

1 x4 and 3 x 8 PCIe
Mezzanine Cards

IO slots

Two x16 PCIe Gen2
H800 / 6GB SAS
NVIDIA® M1060 and

M2050-204

NA

NA

NA

RAID

0,1

0,1

0,1

0,1,5

NIC/LOM

2-port Broadcom®
5709S 1Gb w/ TOE
plus optional iSCSI
Accelerator

2-port Broadcom®
5709S 1Gb w/ TOE
plus optional iSCSI
Accelerator

4 x 1GbE dual
Broadcom®
BCM5709S

4 x TOE with
optional iSCSI
offload

USB

2 external, 1
internal

2 external, 1
internal

2 x external USB 2.0
ports at front bezel

1 x internal USB port

3 x external USB 2.0
ports at front bezel

1 x internal USB port

SD Card

2: 1 for Persistent
Storage 1 for
Management

2: 1 for Persistent
Storage 1 for
Management

2 x internal SD slot
1 for Persistent

Storage
1 for Management
(can also be

configured as
redundant SD cards
for embedded
hypervisor)

1 x internal SD slot
1 for Persistent

Storage
1 for Management

TPM

Yes, except in China where TCM is the standard

Video

Matrox® G200eW integrated into iDRAC chip

Power
Supplies

See the PowerEdge M1000e Technical Guide.

Fans

See the PowerEdge M1000e Technical Guide.

Chassis

See the PowerEdge M1000e Technical Guide.

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2 New Technologies

2.1 Overview

The PowerEdge M610x offers you expandability. The M610x is a half-height blade (based on the M610
server technology) and PCIe card expansion module within a PowerEdge M1000e full-height blade
enclosure which provides the capability to use standard PCIe cards. Similar to the PowerEdge M610,
the PowerEdge M610x features:

 Dual quad- and six-core Intel Xeon processor 5500 and 5600 series
 Intel IOH (24D I/O Hub)
 Intel QuickPath Architecture
 DDR3 memory
 DIMM thermal sensors
 PCI Express Generation 2
 Internal SD Module
 iDRAC6 Express

The M610x incorporates the system board of the M610 plus a PCI module—two x16 PCIe slots. The
module’s 2nd Generation expansion slots can accommodate any standard full-length or full-height

PCIe card. Supplemental power connectors allow, for the first time in the PowerEdge family,
utilization of up to 2 x 250W or 1 x 350W PCIe cards (inclusive of GPGPUs1).

1

General-Purpose computation on Graphics Processing Units

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Feature

Technical Specifications

Processors

Intel® Xeon® processor 5500 and 5600 series quad and six-core
60W, 80W, and 95W TDP options

Chipset

Intel® 5520

Memory1

1GB/2GB/4GB/8GB/16GB 1066 and 1333MHz DDR3
12 DIMM Slots with support for up to 192GBs using RDIMMs

Drive Bays

Two 2.5‖ SAS/Solid State hot-swappable drives

Storage1

Internal Hot-Swappable Drives:

2.5‖ SAS (10K rpm): 146GB, 300GB, or 600GB

2.5‖ SAS (15K rpm): 73GB or 146GB

2.5‖ SATA (7.2k rpm): 80GB, 120GB, 160GB or 250GB, or 500GB

Solid State Drives (SSD): 100GB

Solid State Storage Cards:

Fusion-io® 160IDSS—160GB ioDrive PCIe solid state storage card
Fusion-io® 640IDSS—640GB ioDrive Duo PCIe solid state storage card

Maximum Internal Disk Storage:

Up to 1.2TB using two 2.5‖ 600GB hot-plug SAS hard drives

RAID Controller
Options

PERC H200 Modular RAID Controller (6Gb/s)
PERC H700 Modular RAID Controller (6Gb/s) with 512 MB battery-backed cache

I/O Mezzanine Card
Options

Fully populated mezzanine card slots and switch modules will yield 3 redundant I/O
fabrics per blade.

1Gb and 10Gb Ethernet:

Dual-Port Broadcom® Gb Ethernet w/ TOE (BCM-5709S)
Quad-Port Intel® Gb Ethernet
Quad-Port Broadcom® Gb Ethernet (BCM-5709S)
Dual-Port Intel® 10Gb Ethernet
Dual-Port Broadcom® 10Gb Ethernet (BCM-57711)

10Gb Enhanced Ethernet and Converged Network Adapters (CEE/DCB/FCoE):

Dual-Port Intel® 10Gb Enhanced Ethernet (FcoE Ready for Future Enablement)
Dual-Port Emulex® Converged Network Adapter (OCM10102-F-M) - Supports CEE/DCB

10GbE + FCoE
Dual-Port Qlogic® Converged Network Adapter (QME8142) - Supports CEE/DCB 10GbE

+ FCoE

3 System Information

3.1 Overview

Table 2. Product Features

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Fibre Channel:

Dual-Port QLogic® FC8 Fibre Channel Host Bus Adapter (HBA) (QME2572)
Dual-Port Emulex® FC8 Fibre Channel Host Bus Adapter (HBA) (LPe1205-M)

Infiniband:

Dual-Port Mellanox® ConnectX-2™ Dual Data Rate (DDR) and Quad Data Rate (QDR)
InfiniBand

Communications

Two embedded Broadcom® NetXtreme II™ 5709 Gigabit Ethernet NICs with failover
and load balancing.

TOE (TCP/IP Offload Engine) supported on Microsoft® Windows Server® 2003 SP1 or
higher with Scalable Networking Pack. iSCSI Offload supported on Windows Server®
2003 SP1 or higher, Red Hat® Enterprise Linux® 5, and SUSE® Linux® Enterprise Server

10. Scalable Networking Pack for Windows Server® 2003 is not required.
Boot from SAN (iSCSI and FC) supported
Optional add-in NICs: See I/O Mezzanine Card Options
Optional add-in HBAs: See I/O Mezzanine Card Options

PCIe Expansion Bay

Two 2nd-generation full-length x16 slots with supplemental power for either two
cards at 250 watt draws or one card at a 300watt draw.

GPGPU Options:

NVIDIA® Tesla™ M1060–240 core, double­width PCIe card with 4GB of memory

NVIDIA® Tesla™ M2050/M2070–448 Core,
double-width PCIe card with 3/6GB of
ECC memory

SAS/PERC Options:

Dell™ H800 PERC–Dual-port 6Gb/s SAS
RAID controller with up to 512MB cache

Dell™ SAS6E HBA–Dual-port 6Gb/s SAS
HBA

Solid State Storage Options:

Fusion-io® 160IDSS—160GB ioDrive PCIe
solid state storage card

Fusion-io® 640IDSS—640GB ioDrive Duo
PCIe solid state storage card

Operating Systems

Microsoft® Windows® Essential Business Server 2008
Microsoft® Windows Server® 2008 SP2, x86/x64 (x64 includes Hyper-V™ )
Microsoft® Windows Server® 2008 R2, x64 (includes Hyper-V™ v2)
Microsoft® Windows® HPC Server 2008
Novell® SUSE® Linux® Enterprise Server
Red Hat® Enterprise Linux®
Sun® Solaris™
For more information on the specific versions and additions, visit

http://www.dell.com/OSsupport.

Virtualization OS
Support

Microsoft® Windows Server® 2008, with Hyper-V™
VMware® vSphere™ Version 4.0 (including ESX v4.0/ ESXi™ v4.0)
Optional Embedded Hypervisors:
Citrix® XenServer™
Microsoft® Windows Server® 2008, with Hyper-V™
VMware® ESXi™ 4.1

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Management Options

Dell™ OpenManage™ software tools
Dell Management Console
Integration with 3rd party management solutions via the Dell Certified Partner

Program
Altiris™ Deployment Solution for Dell Blade Servers
Designed to help reduce deployment time from hours to minutes
Integrated Dell Remote Access Controller (iDRAC)
Out-of-Band alerting, status, inventory, and troubleshooting via Secure Web GUI /

CLI (telnet/SSH)
Console Redirection
vMedia (virtual media)—Map optical or hard drives to the blade from remote

workstations over a network
vKVM (virtual KVM) out-of-band remote console redirection—supports Java or ActiveX

plug-ins
IPMI 2.0 support

Power Supply

Supplied by Dell™ PowerEdge™ M1000e Blade Chassis

Video

Integrated Matrox® G200 w/ 8MB memory

Systems Management

BMC, IPMI2.0 compliant
Dell™ OpenManage™ featuring Dell Management Console
Unified Server Configurator
Lifecycle Controller
iDRAC6 Enterprise with optional vFlash

1

GB means 1 billion bytes and TB equals 1 trillion bytes; actual capacity varies with preloaded material and

operating environment and will be less.

Dell PowerEdge M610x Technical Guide 7

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4 Mechanical

4.1 Chassis Description

The PowerEdge M610x is a full-height blade server that requires an M1000e chassis to operate.

Figure 1. PowerEdge M1000e

The M610x server occupies 2 slots in the M1000e rack chassis for a maximum of 8 blades in one
M1000e chassis. It can be mixed with other existing Dell blades and is designed to mix with possible
future half- and full-height double-wide blades. Some highlights are:

 Two full-size standard PCI-E x16
 Front Cable Access provided for add-in cards
 Support for RAID
 Support for persistent storage (internal USB connector and two external SD card slots)

Refer to the PowerEdge M1000e Technical Guide for information on fans, power and power supply,
racks, security, and other chassis information.

4.2 Dimensions and Weight

The PowerEdge M610x dimensions and weight are as follows:

 Height: 38.5cm (15.2in)
 Width: 5cm (2in)
 Depth: 48.6cm (19.2in)
 Weight (Maximum Configuration): 11.1kg (24.5lb)

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4.3 Internal Module View

A view of the internal module is shown in Figure 2. See the Opening and Closing the Blade section in
the Installing Blade Components chapter of the Dell PowerEdge Modular Systems Hardware Owner’s
Manual for more information.

Figure 2. Internal View

4.4 Security

The M610x offers a configurable client IP address range for clients connecting to iDRAC6. For
additional information regarding the PowerEdge M610x security features, see the Dell PowerEdge
Modular Systems Hardware Owner’s Manual.

4.5 Cover Latch

The blade module includes a latch for the cover. See the Opening and Closing the Blade section in
the Installing Blade Components chapter in the Dell PowerEdge Modular Systems Hardware Owner’s
Manual for more information.

4.6 TPM (Trusted Platform Module)

The TPM is used to generate/store keys, protect/authenticate passwords, and create/store digital
certificates. TPM can also be used to enable the BitLocker™ hard drive encryption feature in Windows
Server 2008. TPM is enabled through a BIOS option and uses HMAC-SHA1-160 for binding. TCM is
available in China.

4.7 Power Off Security

Through the BIOS, the front blade server USB ports and power button can be disabled so as to not
allow any control of the system from the front of the blade. The enclosure video can also be
restricted.

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The BIOS System Setup program’s system security screen allows administrators to set the system
password, control TPM activation and reporting, clear the TPM’s memory, and disable the power

button and USB ports.

4.8 USB Key

The M610x provides an internal USB connector for a USB flash memory key. The USB memory key can
be used as a boot device, security key, or mass storage device.

4.9 Battery

A replaceable coin cell CR2032 3V battery is mounted on the planar to provide backup power for the
Real-Time Clock and CMOS RAM on the ICH9 chip

4.10 Field Replaceable Units (FRU)

The planar contains a serial EEPROM to contain FRU information including Dell part number, part
revision level, and serial number

4.11 User Accessible Jumpers, Sockets, and Connectors

For information, see the System Board Information chapter in the Dell PowerEdge Modular Systems
Hardware Owner’s Manual.

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