Dell 6CC9N Service Manual

Dell OptiPlex 7070 Small Form Factor

Service Manual

Regulatory Model: D11S

Regulatory Type: D11S004

Notes, cautions, and warnings

NOTE: A NOTE indicates important information that helps you make better use of your product.

CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the problem. WARNING: A WARNING indicates a potential for property damage, personal injury, or death.

© 2019 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other trademarks may be trademarks of their respective owners.

2019 - 06

Rev. A00

Contents

1 Working on your computer.............................................................................................................................	6
Safety instructions.............................................................................................................................................................	6
Before working inside your computer........................................................................................................................	6
Safety precautions.......................................................................................................................................................	7
Electrostatic discharge—ESD protection.................................................................................................................	7
ESD •eld service kit ....................................................................................................................................................	8
Transporting sensitive components...........................................................................................................................	9
After working inside your computer...........................................................................................................................	9
2 Technology and components........................................................................................................................	10
DDR4..................................................................................................................................................................................	10
DDR4 Details...............................................................................................................................................................	10
Memory Errors.............................................................................................................................................................	11
USB features......................................................................................................................................................................	11
USB 3.0/USB 3.1 Gen 1 (SuperSpeed USB)............................................................................................................	11
Speed...........................................................................................................................................................................	12
Applications.................................................................................................................................................................	13
Compatibility................................................................................................................................................................	13
USB Type-C.......................................................................................................................................................................	13
Alternate Mode...........................................................................................................................................................	13
USB Power Delivery...................................................................................................................................................	14
USB Type-C and USB 3.1...........................................................................................................................................	14
Advantages of DisplayPort over USB Type-C...............................................................................................................	14
HDMI 2.0............................................................................................................................................................................	14
HDMI 2.0 Features......................................................................................................................................................	14
Advantages of HDMI..................................................................................................................................................	15
Intel Optane memory........................................................................................................................................................	15
Enabling Intel Optane memory..................................................................................................................................	15
Disabling Intel Optane memory.................................................................................................................................	15
3 Removing and installing components............................................................................................................	17
Side cover..........................................................................................................................................................................	17
Removing the side cover...........................................................................................................................................	17
Installing the side cover..............................................................................................................................................	17
Expansion card..................................................................................................................................................................	18
Removing expansion card..........................................................................................................................................	18
Installing the expansion card.....................................................................................................................................	19
Coin cell battery...............................................................................................................................................................	20
Removing coin cell battery........................................................................................................................................	20
Installing the coin cell battery....................................................................................................................................	21
Hard drive assembly.........................................................................................................................................................	22
Removing the hard drive assembly..........................................................................................................................	22
Installing the hard drive assembly............................................................................................................................	23

Contents 3

Hard drive..........................................................................................................................................................................	24
Removing the hard drive ..........................................................................................................................................	24
Installing the hard drive ............................................................................................................................................	25
Bezel..................................................................................................................................................................................	25
Removing front bezel................................................................................................................................................	25
Installing front bezel...................................................................................................................................................	26
Hard drive and optical drive module...............................................................................................................................	27
Removing the hard drive and optical drive module................................................................................................	27
Installing the hard drive and optical drive module..................................................................................................	30
Optical drive......................................................................................................................................................................	33
Removing the optical drive.......................................................................................................................................	33
Installing the optical drive..........................................................................................................................................	37
Memory module................................................................................................................................................................	41
Removing memory module........................................................................................................................................	41
Installing the memory module...................................................................................................................................	42
Heatsink fan......................................................................................................................................................................	43
Removing heatsink fan..............................................................................................................................................	43
Installing the heatsink fan..........................................................................................................................................	44
Heatsink assembly...........................................................................................................................................................	45
Removing heatsink assembly....................................................................................................................................	45
Installing heatsink assembly......................................................................................................................................	46
Intrusion switch................................................................................................................................................................	47
Removing intrusion switch........................................................................................................................................	47
Installing the intrusion switch...................................................................................................................................	48
Power switch....................................................................................................................................................................	49
Removing power switch............................................................................................................................................	49
Installing the power switch.......................................................................................................................................	50
Processor...........................................................................................................................................................................	51
Removing processor...................................................................................................................................................	51
Installing the processor.............................................................................................................................................	52
M.2 PCIe SSD .................................................................................................................................................................	53
Removing the M.2 PCIe SSD ..................................................................................................................................	53
Installing the M.2 PCIe SSD.....................................................................................................................................	54
Power supply unit............................................................................................................................................................	55
Removing power supply unit or PSU.......................................................................................................................	55
Installing the power supply unit or PSU..................................................................................................................	57
Speaker.............................................................................................................................................................................	59
Removing speaker.....................................................................................................................................................	59
Installing the speaker.................................................................................................................................................	60
System board....................................................................................................................................................................	61
Removing system board............................................................................................................................................	61
Installing the system board.......................................................................................................................................	65
4 Troubleshooting...........................................................................................................................................	70
Enhanced Pre-Boot System Assessment — ePSA diagnostics................................................................................	70
Running the ePSA Diagnostics.................................................................................................................................	70
Diagnostics........................................................................................................................................................................	70

4 Contents

Diagnostic error messages..............................................................................................................................................	72
System error messages...................................................................................................................................................	75
5 Getting help.................................................................................................................................................	77
Contacting Dell.................................................................................................................................................................	77

Contents 5

Working on your computer

Safety instructions

Use the following safety guidelines to protect your computer from potential damage and to ensure your personal safety. Unless otherwise noted, each procedure included in this document assumes that the following conditions exist:

•You have read the safety information that shipped with your computer.

•A component can be replaced or, if purchased separately, installed by performing the removal procedure in reverse order.

WARNING: Disconnect all power sources before opening the computer cover or panels. After you finish working inside the computer, replace all covers, panels, and screws before connecting to the power source.

WARNING: Before working inside your computer, read the safety information that shipped with your computer. For additional safety best practices information, see the Regulatory Compliance Homepage

CAUTION: Many repairs may only be done by a certified service technician. You should only perform troubleshooting and simple repairs as authorized in your product documentation, or as directed by the online or telephone service and support team. Damage due to servicing that is not authorized by Dell is not covered by your warranty. Read and follow the safety instructions that came with the product.

CAUTION: To avoid electrostatic discharge, ground yourself by using a wrist grounding strap or by periodically touching an unpainted metal surface at the same time as touching a connector on the back of the computer.

CAUTION: Handle components and cards with care. Do not touch the components or contacts on a card. Hold a card by its edges or by its metal mounting bracket. Hold a component such as a processor by its edges, not by its pins.

CAUTION: When you disconnect a cable, pull on its connector or on its pull-tab, not on the cable itself. Some cables have connectors with locking tabs; if you are disconnecting this type of cable, press in on the locking tabs before you disconnect the cable. As you pull connectors apart, keep them evenly aligned to avoid bending any connector pins. Also, before you connect a cable, ensure that both connectors are correctly oriented and aligned.

NOTE: The color of your computer and certain components may appear differently than shown in this document.

Before working inside your computer

To avoid damaging your computer, perform the following steps before you begin working inside the computer.

1Ensure that you follow the Safety Instruction.

2Ensure that your work surface is flat and clean to prevent the computer cover from being scratched.

3Turn off your computer.

4Disconnect all network cables from the computer.

CAUTION: To disconnect a network cable, first unplug the cable from your computer and then unplug the cable from the network device.

5Disconnect your computer and all attached devices from their electrical outlets.

6Press and hold the power button while the computer is unplugged to ground the system board.

NOTE: To avoid electrostatic discharge, ground yourself by using a wrist grounding strap or by periodically touching an unpainted metal surface at the same time as touching a connector on the back of the computer.

6 Working on your computer

Safety precautions

The safety precautions chapter details the primary steps to be taken before performing any disassembly instructions.

Observe the following safety precautions before you perform any installation or break/•x procedures involving disassembly or reassembly:

•Turn off the system and all attached peripherals.

•Disconnect the system and all attached peripherals from AC power.

•Disconnect all network cables, telephone, and telecommunications lines from the system.

•Use an ESD •eld service kit when working inside any desktop to avoid electrostatic discharge (ESD) damage.

•After removing any system component, carefully place the removed component on an anti-static mat.

•Wear shoes with non-conductive rubber soles to reduce the chance of getting electrocuted.

Standby power

Dell products with standby power must be unplugged before you open the case. Systems that incorporate standby power are essentially powered while turned off. The internal power enables the system to be remotely turned on (wake on LAN) and suspended into a sleep mode and has other advanced power management features.

Unplugging, pressing and holding the power button for 15 seconds should discharge residual power in the system board.

Bonding

Bonding is a method for connecting two or more grounding conductors to the same electrical potential. This is done through the use of a •eld service electrostatic discharge (ESD) kit. When connecting a bonding wire, ensure that it is connected to bare metal and never to a painted or non-metal surface. The wrist strap should be secure and in full contact with your skin, and ensure that you remove all jewelry such as watches, bracelets, or rings prior to bonding yourself and the equipment.

Electrostatic discharge—ESD protection

ESD is a major concern when you handle electronic components, especially sensitive components such as expansion cards, processors, memory DIMMs, and system boards. Very slight charges can damage circuits in ways that may not be obvious, such as intermittent problems or a shortened product life span. As the industry pushes for lower power requirements and increased density, ESD protection is an increasing concern.

Due to the increased density of semiconductors used in recent Dell products, the sensitivity to static damage is now higher than in previous Dell products. For this reason, some previously approved methods of handling parts are no longer applicable.

Two recognized types of ESD damage are catastrophic and intermittent failures.

•Catastrophic – Catastrophic failures represent approximately 20 percent of ESD-related failures. The damage causes an immediate and complete loss of device functionality. An example of catastrophic failure is a memory DIMM that has received a static shock and immediately generates a "No POST/No Video" symptom with a beep code emitted for missing or nonfunctional memory.

•Intermittent – Intermittent failures represent approximately 80 percent of ESD-related failures. The high rate of intermittent failures means that most of the time when damage occurs, it is not immediately recognizable. The DIMM receives a static shock, but the tracing is merely weakened and does not immediately produce outward symptoms related to the damage. The weakened trace may take weeks or months to melt, and in the meantime may cause degradation of memory integrity, intermittent memory errors, etc.

The more di†cult type of damage to recognize and troubleshoot is the intermittent (also called latent or "walking wounded") failure.

Perform the following steps to prevent ESD damage:

•Use a wired ESD wrist strap that is properly grounded. The use of wireless anti-static straps is no longer allowed; they do not provide adequate protection. Touching the chassis before handling parts does not ensure adequate ESD protection on parts with increased sensitivity to ESD damage.

Working on your computer

•Handle all static-sensitive components in a static-safe area. If possible, use anti-static floor pads and workbench pads.

•When unpacking a static-sensitive component from its shipping carton, do not remove the component from the anti-static packing material until you are ready to install the component. Before unwrapping the anti-static packaging, ensure that you discharge static electricity from your body.

•Before transporting a static-sensitive component, place it in an anti-static container or packaging.

ESD field service kit

The unmonitored Field Service kit is the most commonly used service kit. Each Field Service kit includes three main components: anti-static mat, wrist strap, and bonding wire.

Components of an ESD field service kit

The components of an ESD •eld service kit are:

•Anti-Static Mat – The anti-static mat is dissipative and parts can be placed on it during service procedures. When using an anti-static mat, your wrist strap should be snug and the bonding wire should be connected to the mat and to any bare metal on the system being worked on. Once deployed properly, service parts can be removed from the ESD bag and placed directly on the mat. ESD-sensitive items are safe in your hand, on the ESD mat, in the system, or inside a bag.

•Wrist Strap and Bonding Wire – The wrist strap and bonding wire can be either directly connected between your wrist and bare metal on the hardware if the ESD mat is not required, or connected to the anti-static mat to protect hardware that is temporarily placed on the mat. The physical connection of the wrist strap and bonding wire between your skin, the ESD mat, and the hardware is known as bonding. Use only Field Service kits with a wrist strap, mat, and bonding wire. Never use wireless wrist straps. Always be aware that the internal wires of a wrist strap are prone to damage from normal wear and tear, and must be checked regularly with a wrist strap tester in order to avoid accidental ESD hardware damage. It is recommended to test the wrist strap and bonding wire at least once per week.

•ESD Wrist Strap Tester – The wires inside of an ESD strap are prone to damage over time. When using an unmonitored kit, it is a best practice to regularly test the strap prior to each service call, and at a minimum, test once per week. A wrist strap tester is the best method for doing this test. If you do not have your own wrist strap tester, check with your regional o†ce to •nd out if they have one. To perform the test, plug the wrist-strap's bonding-wire into the tester while it is strapped to your wrist and push the button to test. A green LED is lit if the test is successful; a red LED is lit and an alarm sounds if the test fails.

•Insulator Elements – It is critical to keep ESD sensitive devices, such as plastic heat sink casings, away from internal parts that are insulators and often highly charged.

•Working Environment – Before deploying the ESD Field Service kit, assess the situation at the customer location. For example, deploying the kit for a server environment is different than for a desktop or portable environment. Servers are typically installed in a rack within a data center; desktops or portables are typically placed on o†ce desks or cubicles. Always look for a large open flat work area that is free of clutter and large enough to deploy the ESD kit with additional space to accommodate the type of system that is being repaired. The workspace should also be free of insulators that can cause an ESD event. On the work area, insulators such as Styrofoam and other plastics should always be moved at least 12 inches or 30 centimeters away from sensitive parts before physically handling any hardware components

•ESD Packaging – All ESD-sensitive devices must be shipped and received in static-safe packaging. Metal, static-shielded bags are preferred. However, you should always return the damaged part using the same ESD bag and packaging that the new part arrived in. The ESD bag should be folded over and taped shut and all the same foam packing material should be used in the original box that the new part arrived in. ESD-sensitive devices should be removed from packaging only at an ESD-protected work surface, and parts should never be placed on top of the ESD bag because only the inside of the bag is shielded. Always place parts in your hand, on the ESD mat, in the system, or inside an anti-static bag.

•Transporting Sensitive Components – When transporting ESD sensitive components such as replacement parts or parts to be returned to Dell, it is critical to place these parts in anti-static bags for safe transport.

ESD protection summary

It is recommended that all •eld service technicians use the traditional wired ESD grounding wrist strap and protective anti-static mat at all times when servicing Dell products. In addition, it is critical that technicians keep sensitive parts separate from all insulator parts while performing service and that they use anti-static bags for transporting sensitive components.

8 Working on your computer

Transporting sensitive components

When transporting ESD sensitive components such as replacement parts or parts to be returned to Dell, it is critical to place these parts in anti-static bags for safe transport.

Lifting equipment

Adhere to the following guidelines when lifting heavy weight equipment:

CAUTION: Do not lift greater than 50 pounds. Always obtain additional resources or use a mechanical lifting device.

1Get a •rm balanced footing. Keep your feet apart for a stable base, and point your toes out.

2Tighten stomach muscles. Abdominal muscles support your spine when you lift, offsetting the force of the load.

3Lift with your legs, not your back.

4Keep the load close. The closer it is to your spine, the less force it exerts on your back.

5Keep your back upright, whether lifting or setting down the load. Do not add the weight of your body to the load. Avoid twisting your body and back.

6Follow the same techniques in reverse to set the load down.

After working inside your computer

After you complete any replacement procedure, ensure that you connect any external devices, cards, and cables before turning on your computer.

1 Connect any telephone or network cables to your computer.

CAUTION: To connect a network cable, first plug the cable into the network device and then plug it into the computer.

2Connect your computer and all attached devices to their electrical outlets.

3Turn on your computer.

4If required, verify that the computer works correctly by running ePSA diagnostics.

Working on your computer

Technology and components

This chapter details the technology and components available in the system.

Topics:

•DDR4

•USB features

•USB Type-C

•Advantages of DisplayPort over USB Type-C

•HDMI 2.0

•Intel Optane memory

DDR4

DDR4 (double data rate fourth generation) memory is a higher-speed successor to the DDR2 and DDR3 technologies and allows up to 512 GB in capacity, compared to the DDR3's maximum of 128 GB per DIMM. DDR4 synchronous dynamic random-access memory is keyed differently from both SDRAM and DDR to prevent the user from installing the wrong type of memory into the system.

DDR4 needs 20 percent less or just 1.2 volts, compared to DDR3 which requires 1.5 volts of electrical power to operate. DDR4 also supports a new, deep power-down mode that allows the host device to go into standby without needing to refresh its memory. Deep power-down mode is expected to reduce standby power consumption by 40 to 50 percent.

DDR4 Details

There are subtle differences between DDR3 and DDR4 memory modules, as listed below.

Key notch difference

The key notch on a DDR4 module is in a different location from the key notch on a DDR3 module. Both notches are on the insertion edge but the notch location on the DDR4 is slightly different, to prevent the module from being installed into an incompatible board or platform.

Figure 1. Notch difference

Increased thickness

DDR4 modules are slightly thicker than DDR3, to accommodate more signal layers.

10 Technology and components

Figure 2. Thickness difference

Curved edge

DDR4 modules feature a curved edge to help with insertion and alleviate stress on the PCB during memory installation.

Figure 3. Curved edge

Memory Errors

Memory errors on the system display the new ON-FLASH-FLASH or ON-FLASH-ON failure code. If all memory fails, the LCD does not turn on. Troubleshoot for possible memory failure by trying known good memory modules in the memory connectors on the bottom of the system or under the keyboard, as in some portable systems.

NOTE: The DDR4 memory is imbedded in board and not a replaceable DIMM as shown and referred.

USB features

Universal Serial Bus, or USB, was introduced in 1996. It dramatically simpli•ed the connection between host computers and peripheral devices like mice, keyboards, external drivers, and printers.

Let's take a quick look on the USB evolution referencing to the table below.

Table 1. USB evolution
Type	Data Transfer Rate	Category	Introduction Year

USB 2.0	480 Mbps	High Speed	2000
USB 3.0/USB 3.1 Gen 1	5 Gbps	Super Speed	2010
USB 3.1 Gen 2	10 Gbps	Super Speed	2013

USB 3.0/USB 3.1 Gen 1 (SuperSpeed USB)

For years, the USB 2.0 has been •rmly entrenched as the de facto interface standard in the PC world with about 6 billion devices sold, and yet the need for more speed grows by ever faster computing hardware and ever greater bandwidth demands. The USB 3.0/USB 3.1 Gen 1

Technology and components

•nally has the answer to the consumers' demands with a theoretically 10 times faster than its predecessor. In a nutshell, USB 3.1 Gen 1 features are as follows:

•Higher transfer rates (up to 5 Gbps)

•Increased maximum bus power and increased device current draw to better accommodate power-hungry devices

•New power management features

•Full-duplex data transfers and support for new transfer types

•Backward USB 2.0 compatibility

•New connectors and cable

The topics below cover some of the most commonly asked questions regarding USB 3.0/USB 3.1 Gen 1.

Speed

Currently, there are 3 speed modes de•ned by the latest USB 3.0/USB 3.1 Gen 1 speci•cation. They are Super-Speed, Hi-Speed and FullSpeed. The new SuperSpeed mode has a transfer rate of 4.8Gbps. While the speci•cation retains Hi-Speed, and Full-Speed USB mode, commonly known as USB 2.0 and 1.1 respectively, the slower modes still operate at 480Mbps and 12Mbps respectively and are kept to maintain backward compatibility.

USB 3.0/USB 3.1 Gen 1 achieves the much higher performance by the technical changes below:

•An additional physical bus that is added in parallel with the existing USB 2.0 bus (refer to the picture below).

•USB 2.0 previously had four wires (power, ground, and a pair for differential data); USB 3.0/USB 3.1 Gen 1 adds four more for two pairs of differential signals (receive and transmit) for a combined total of eight connections in the connectors and cabling.

•USB 3.0/USB 3.1 Gen 1 utilizes the bidirectional data interface, rather than USB 2.0's half-duplex arrangement. This gives a 10-fold increase in theoretical bandwidth.

With today's ever increasing demands placed on data transfers with high-de•nition video content, terabyte storage devices, high megapixel count digital cameras etc., USB 2.0 may not be fast enough. Furthermore, no USB 2.0 connection could ever come close to the 480Mbps theoretical maximum throughput, making data transfer at around 320Mbps (40MB/s) — the actual real-world maximum. Similarly, USB 3.0/USB 3.1 Gen 1 connections will never achieve 4.8Gbps. We will likely see a real-world maximum rate of 400MB/s with overheads. At this speed, USB 3.0/USB 3.1 Gen 1 is a 10x improvement over USB 2.0.

12 Technology and components

Applications

USB 3.0/USB 3.1 Gen 1 opens up the laneways and provides more headroom for devices to deliver a better overall experience. Where USB video was barely tolerable previously (both from a maximum resolution, latency, and video compression perspective), it's easy to imagine that with 5-10 times the bandwidth available, USB video solutions should work that much better. Single-link DVI requires almost 2Gbps throughput. Where 480Mbps was limiting, 5Gbps is more than promising. With its promised 4.8Gbps speed, the standard will •nd its way into some products that previously weren't USB territory, like external RAID storage systems.

Listed below are some of the available SuperSpeed USB 3.0/USB 3.1 Gen 1 products:

•External Desktop USB 3.0/USB 3.1 Gen 1 Hard Drives

•Portable USB 3.0/USB 3.1 Gen 1 Hard Drives

•USB 3.0/USB 3.1 Gen 1 Drive Docks & Adapters

•USB 3.0/USB 3.1 Gen 1 Flash Drives & Readers

•USB 3.0/USB 3.1 Gen 1 Solid-state Drives

•USB 3.0/USB 3.1 Gen 1 RAIDs

•Optical Media Drives

•Multimedia Devices

•Networking

•USB 3.0/USB 3.1 Gen 1 Adapter Cards & Hubs

Compatibility

The good news is that USB 3.0/USB 3.1 Gen 1 has been carefully planned from the start to peacefully co-exist with USB 2.0. First of all, while USB 3.0/USB 3.1 Gen 1 speci•es new physical connections and thus new cables to take advantage of the higher speed capability of the new protocol, the connector itself remains the same rectangular shape with the four USB 2.0 contacts in the exact same location as before. Five new connections to carry receive and transmitted data independently are present on USB 3.0/USB 3.1 Gen 1 cables and only come into contact when connected to a proper SuperSpeed USB connection.

Windows 8/10 will be bringing native support for USB 3.1 Gen 1 controllers. This is in contrast to previous versions of Windows, which continue to require separate drivers for USB 3.0/USB 3.1 Gen 1 controllers.

Microsoft announced that Windows 7 would have USB 3.1 Gen 1 support, perhaps not on its immediate release, but in a subsequent Service Pack or update. It is not out of the question to think that following a successful release of USB 3.0/USB 3.1 Gen 1 support in Windows 7, SuperSpeed support would trickle down to Vista. Microsoft has con•rmed this by stating that most of their partners share the opinion that Vista should also support USB 3.0/USB 3.1 Gen 1.

USB Type-C

USB Type-C is a new, tiny physical connector. The connector itself can support various exciting new USB standards like USB 3.1 and USB power delivery (USB PD).

Alternate Mode

USB Type-C is a new connector standard that is very small. It is about a third the size of an old USB Type-A plug. This is a single connector standard that every device should be able to use. USB Type-C ports can support a variety of different protocols using “alternate modes,” which allows you to have adapters that can output HDMI, VGA, DisplayPort, or other types of connections from that single USB port

Technology and components

USB Power Delivery

The USB PD speci•cation is also closely intertwined with USB Type-C. Currently, smartphones, tablets, and other mobile devices often use a USB connection to charge. A USB 2.0 connection provides up to 2.5 watts of power — that'll charge your phone, but that's about it. A laptop might require up to 60 watts, for example. The USB Power Delivery speci•cation ups this power delivery to 100 watts. It's bidirectional, so a device can either send or receive power. And this power can be transferred at the same time the device is transmitting data across the connection.

This could spell the end of all those proprietary laptop charging cables, with everything charging via a standard USB connection. You could charge your laptop from one of those portable battery packs you charge your smartphones and other portable devices from today. You could plug your laptop into an external display connected to a power cable, and that external display would charge your laptop as you used it as an external display — all via the one little USB Type-C connection. To use this, the device and the cable have to support USB Power Delivery. Just having a USB Type-C connection doesn't necessarily mean they do.

USB Type-C and USB 3.1

USB 3.1 is a new USB standard. USB 3's theoretical bandwidth is 5 Gbps same as of USB 3.1 Gen 1, while USB 3.1 Gen 2's bandwidth is 10 Gbps. That's double the bandwidth, as fast as a •rst-generation Thunderbolt connector. USB Type-C isn't the same thing as USB 3.1. USB Type-C is just a connector shape, and the underlying technology could just be USB 2 or USB 3.0. In fact, Nokia's N1 Android tablet uses a USB Type-C connector, but underneath it's all USB 2.0 — not even USB 3.0. However, these technologies are closely related.

Advantages of DisplayPort over USB Type-C

•Full DisplayPort audio/video (A/V) performance (up to 4K at 60Hz)

•Reversible plug orientation and cable direction

•Backwards compatibility to VGA, DVI with adaptors

•SuperSpeed USB (USB 3.1) data

•Supports HDMI 2.0a and is backwards compatible with previous versions

HDMI 2.0

This topic explains the HDMI 2.0 and its features along with the advantages.

HDMI (High-De•nition Multimedia Interface) is an industry-supported, uncompressed, all-digital audio/video interface. HDMI provides an interface between any compatible digital audio/video source, such as a DVD player, or A/V receiver and a compatible digital audio and/or video monitor, such as a digital TV (DTV). The intended applications for HDMI TVs, and DVD players. The primary advantage is cable reduction and content protection provisions. HDMI supports standard, enhanced, or high-de•nition video, plus multichannel digital audio on a single cable.

HDMI 2.0 Features

•HDMI Ethernet Channel - Adds high-speed networking to an HDMI link, allowing users to take full advantage of their IP-enabled devices without a separate Ethernet cable

•Audio Return Channel - Allows an HDMI-connected TV with a built-in tuner to send audio data "upstream" to a surround audio system, eliminating the need for a separate audio cable

•3D - De•nes input/output protocols for major 3D video formats, paving the way for true 3D gaming and 3D home theater applications

•Content Type - Real-time signaling of content types between display and source devices, enabling a TV to optimize picture settings based on content type

•Additional Color Spaces - Adds support for additional color models used in digital photography and computer graphics

•4K Support - Enables video resolutions far beyond 1080p, supporting next-generation displays that will rival the Digital Cinema systems used in many commercial movie theaters

14 Technology and components

•HDMI Micro Connector - A new, smaller connector for phones and other portable devices, supporting video resolutions up to 1080p

•Automotive Connection System - New cables and connectors for automotive video systems, designed to meet the unique demands of the motoring environment while delivering true HD quality

Advantages of HDMI

•Quality HDMI transfers uncompressed digital audio and video for the highest, crispest image quality.

•Low -cost HDMI provides the quality and functionality of a digital interface while also supporting uncompressed video formats in a simple, cost-effective manner

•Audio HDMI supports multiple audio formats from standard stereo to multichannel surround sound

•HDMI combines video and multichannel audio into a single cable, eliminating the cost, complexity, and confusion of multiple cables currently used in A/V systems

•HDMI supports communication between the video source (such as a DVD player) and the DTV, enabling new functionality

Intel Optane memory

Intel Optane memory functions only as a storage accelerator. It neither replaces nor adds to the memory (RAM) installed on your computer.

NOTE: Intel Optane memory is supported on computers that meet the following requirements:

•7th Generation or higher Intel Core i3/i5/i7 processor

•Windows 10 64-bit version 1607 or higher

•Intel Rapid Storage Technology driver version 15.9.1.1018 or higher

Table 2. Intel Optane memory specifications
Feature	Specifications

Interface	PCIe 3x2 NVMe 1.1
Connector	M.2 card slot (2230/2280)
Con•gurations supported	• 7th Generation or higher Intel Core i3/i5/i7 processor
	• 7th Generation or higher Intel Core i3/i5/i7 processor
	• Windows 10 64-bit version 1607 or higher
	• Intel Rapid Storage Technology driver version 15.9.1.1018 or
	higher
Capacity	32 GB

Enabling Intel Optane memory

1On the taskbar, click the search box, and type "Intel Rapid Storage Technology".

2Click Intel Rapid Storage Technology.

3On the Status tab, click Enable to enable the Intel Optane memory.

4On the warning screen, select a compatible fast drive, and then click Yes to continue enabling Intel Optane memory.

5Click Intel Optane memory > Reboot to enable the Intel Optane memory.

NOTE: Applications may take up to three subsequent launches after enablement to see the full performance benefits.

Disabling Intel Optane memory

CAUTION: After disabling Intel Optane memory, do not uninstall the driver for Intel Rapid Storage Technology as it will result in a blue screen error. The Intel Rapid Storage Technology user interface can be removed without uninstalling the driver.

Technology and components

NOTE: Disabling Intel Optane memory is required before removing the SATA storage device, accelerated by the Intel Optane memory module, from the computer.

1On the taskbar, click the search box, and then type "Intel Rapid Storage Technology".

2Click Intel Rapid Storage Technology. The Intel Rapid Storage Technology window is displayed.

3On the Intel Optane memory tab, click Disable to disable the Intel Optane memory.

4Click Yes if you accept the warning. The disabling progress is displayed.

5Click Reboot to complete disabling Intel Optane memory and restart your computer.

16 Technology and components

Removing and installing components

Side cover

Removing the side cover

1Follow the procedure in Before working inside your computer.

2To remove the cover:

aSlide the release latch on the back side of your system until it gives a click sound to unlock the side cover [1].

bSlide and lift the side cover from the system [2].

Installing the side cover

1Place the cover on the system and slide the cover until it clicks into place [1].

2The release latch automatically locks the side cover to the system [2].

Removing and installing components

3 Follow the procedure in After working inside your computer

Expansion card

Removing expansion card

1Follow the procedure in Before working inside your computer.

2Remove the Side cover.

3To remove the expansion card:

aPull the metal tab to open the expansion card latch [1].

bPull the release tab at the base of the expansion card [2].

NOTE: Applies to x16 card slot, x1 card has no release tab.

c Disconnect and lift the expansion card away from the connector on the system board [3].

18 Removing and installing components

Installing the expansion card

1Insert the expansion card into the connector and press the expansion card until it clicks into place [1]

2Close the expansion card latch and press it until it clicks into place [2].

Removing and installing components

3Install the Side cover.

4Follow the procedure in After working inside your computer.

Coin cell battery

Removing coin cell battery

CAUTION: Removing coin cell battery may reset the motherboard.

1Follow the procedure in Before working inside your computer.

2Remove the:

aSide cover

bExpansion card

3 To remove the coin cell battery:

aUsing a plastic scribe press the release latch until the coin cell battery pops out [1].

bRemove the coin cell battery from the system [2].

20 Removing and installing components

Installing the coin cell battery

1Place the coin cell battery with "+" sign facing up in the slot on the system board [1].

2Press the battery into the connector until it locks into place [2].

Removing and installing components

3 Install the:

aExpansion cards

bSide cover

4 Follow the procedure in After working inside your computer.

Hard drive assembly

Depending on the con•guration you choose, you will have either one 3.5–inch hard drive assembly or two 2.5–inch hard drive assembly.

Removing the hard drive assembly

1Follow the procedure in Before working inside your computer.

2Remove the Side cover.

3To remove the hard drive:

aDisconnect the hard drive data cable and power cable from the connectors on the hard drive [1, 2].

bPush the release tab and lift the hard drive assembly from the system [3].

22 Removing and installing components

Installing the hard drive assembly

1Align the tabs on the hard drive assembly with the slots on the chassis at 30 degree angle [1].

2Press the hard drive assembly so that it gets secured to the hard drive and optical drive cage [2].

3Connect the hard drive data cable and hard drive power cable to the connectors on the hard drive [3,4]

Removing and installing components

4Install the Side cover.

5Follow the procedure in After working inside your computer.

Hard drive

Removing the hard drive

NOTE: For configurations shipped with 3.5-inch HDD, follow the same procedure to remove the HDD from its bracket.

1Follow the procedure in Before working inside your computer.

2Remove the:

aSide cover

bhard drive assembly

3 Flex the hard drive bracket [1], lift the hard drive [2], and then slide out from the hard drive bracket [3].

NOTE: Follow the same procedure to remove another 2.5-inch hard drive on the other side of the bracket.

24 Removing and installing components

+ 53 hidden pages