The µPD16877 is monolithic quad H-bridge driver LSI which uses power MOSFETs in the output stages. By using
the MOS process, this driver IC has substantially improved saturation voltage and power consumption as compared
with conventional driver circuits using bipolar transistors.
By eliminating the charge pump circuit, the current during power-OFF is drastically decreased.
In addition, a low-voltage malfunction prevention circuit is also provided that prevents the IC from malfunctioning
when the supply voltage drops.
As the package, a 24-pin plastic TSSOP is adopted to enable the creation of compact, slim application sets.
This driver IC can drive two stepping motor at the same time, and is ideal for driving stepping motors in the lens of
a camcorder.
FEATURES
Four H bridge circuits employing power MOSFETs
Low current consumption by eliminating charge pump
VM pin current when power-OFF: 10 µA MAX. VDD pin current: 10 µA MAX.
Input logic frequency: 100 kHz
3-V power supply
Minimum operating supply voltage: 2.5 V
Low voltage malfunction prevention circuit
24-pin plastic TSSOP (5.72 mm (225))
ORDERING INFORMATION
Part NumberPackage
µ
PD16877MA-6A524-pin plastic TSSOP (5.72 mm (225))
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. S13964EJ1V0DS00 (1st edition)
Date Published March 2000 N CP(K)
Printed in Japan
ParameterSymbolConditionRatingUnit
Control block supply v ol t ageV
Output block supply v ol tageV
Input voltageV
Output terminal voltageV
Output current
Power consumptionP
Peak junction temperatureT
Storage temperature rangeT
DD
M
IN
OUT
D(DC)
I
D(pulse)
I
T
CH(MAX)
stg
DC
PW ≤ 10 ms, Duty ≤ 5%
RECOMMENDED OPERATING CONDITIONS
When mounted on a glass epoxy board (10 cm
ParameterSymbolConditionMIN.TYP.MAX.Unit
Control block supply v ol t ageV
Output block supply v ol tageV
Output currentI
Operating frequencyf
Operating temperature rangeT
Peak junction temperatureT
DD
M
D(DC)
IN
A
CH(MAX)
××××
DC
IN, EN terminal100kHz
10 cm
10 cm
1 mm, 15% copper foil)
××××
1 mm, 15% copper foil)
××××
2.55.5V
2.75.5V
0.2+0.2A
−
1085
−
0.5 to +6.0V
−
0.5 to +6.0V
−
DD
0.5 to V
−
+ 0.5V
6.2V
0.3A/ch
±
0.7A/ch
±
0.7W
150
55 to +150
−
125
C
°
C
°
C
°
C
°
CHARACTERISTICS (Unless otherwise specified, VDD = VM = 3 V, TA = 25
ParameterSymbolConditionMIN.TYP.MAX.Unit
Off state VM pin currentI
VDD pin currentI
High level input currentI
Low level input currentI
Input pull down resistanceR
High level input voltageV
Low level input voltageV
H-bridge ON resistanceR
Low voltage malfunction
prevention circuit operati ng voltage
H bridge output turn-on timet
H bridge output turn-off timet
H bridge output rise timet
H bridge output fall timet
M(OFF)
DD
IH
IL
IND
IH
IL
ON
DDS1
V
DDS2
V
ONH
OFFH
r
f
All control terminal: L l evel10
All control terminal: L l evel10
DD
VIN = V
VIN = 0 V
1.0
−
50200k
DD
2.5 V ≤ VDD ≤ 5.5 V
0.7 × V
3.00.3 × V
−
2.5 V ≤ VM, VDD ≤ 5.5 V
Upper + lower
VM = 5 V
−10°C ≤
VM = 3 V
−10°C ≤
RM = 20
Figure 1
A
T
≤ +85°C
A
T
≤ +85°C
Ω
0.82.5V
0.652.5V
0.10.41.0
C)
°°°°
0.06mA
VDD+0.3V
3.0
0.720
0.20. 5
70200ns
A
µ
A
µ
A
µ
Ω
DD
V
Ω
s
µ
s
µ
s
µ
2
Data Sheet S13964EJ1V0DS00
Figure 1. Switching time condition
100%
µµµµ
PD16877
50%
V
IN
50%
0%
t
ONH
t
OFFH
t
OFFH
t
ONH
100%100%
90%90%
50%
I
D
0%
t
10%10%
−10%
f
−50%−50%
−90%−90%
t
r
−100%
50%
−10%
t
r
t
f
The current flowing in the direction from
A
to OUT_B is assumed to be (+).
OUT_
FUNCTION TABLE
Channel 1Channel 2
1
EN
HLHLHLHL
HHLHHHLH
LLZZLLZZ
LHZZLHZZ
IN
1
OUT
1A
OUT
1B
EN
2
IN
2
OUT
2A
OUT
2B
Channel 3Channel 4
3
EN
HLHLHLHL
HHLHHHLH
LLZZLLZZ
LHZZLHZZ
IN
3
OUT
3A
OUT
3B
EN
4
IN
4
OUT
4A
OUT
H: High-level, L: Low-level, Z: High impedance
4B
Data Sheet S13964EJ1V0DS00
3
PIN CONNECTION
µµµµ
PD16877
V
OUT
PGND
OUT
OUT
PGND
OUT
V
IN
EN
IN
EN
M1
1
1A
2
3
2A
4
3A
5
6
4A
7
M4
8
1
9
1
10
2
11
2
12
24
23
22
21
20
19
18
17
16
15
14
13
V
DD
OUT
PGND
OUT
V
M23
OUT
PGND
OUT
EN
4
IN
4
EN
3
IN
3
1B
2B
3B
4B
Pin No.Pin namePin functionPin No.Pin namePin function
Number of times: 3 tim es max; Number of day: none;
Flux: Rosin-based flux wi th little chlorine cont ent (chlorine: 0.2Wt% max.) is
recommended.
Package peak temperature: 215°C; Time: 40 secs. max. (200°C min.);
Number of times: 3 tim es max.; Number of day: none;
Flux: Rosin-based flux wi th little chlorine cont ent (chlorine: 0.2 Wt% max.) is
recommended.
Package peak temperature: 260°C; Time: 10 secs. max.;
Preheating temperature: 120°C max.; Number of tim e s: once;
Flux: Rosin-based flux wi th little chlorine cont ent (chlorine: 0.2 Wt% max.) is
recommended.
.
Caution Do not use two or more soldering methods in combination.
“Semiconductor Device
Recommended
Condition Symbol
IR35-00-3
VP15-00-3
WS60-00-1
10
Data Sheet S13964EJ1V0DS00
NOTES FOR CMOS DEVICES
1PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note:
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and transported
in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work bench and floor should be grounded. The operator should be grounded using
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need
to be taken for PW boards with semiconductor devices on it.
2HANDLING OF UNUSED INPUT PINS FOR CMOS
Note:
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels
of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused
DD
pin should be connected to V
being an output pin. All handling related to the unused pins must be judged device by device and
related specifications governing the devices.
or GND with a resistor, if it is considered to have a possibility of
µµµµ
PD16877
3STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note:
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the
reset signal is received. Reset operation must be executed immediately after power-on for devices
having reset function.
Data Sheet S13964EJ1V0DS00
11
µµµµ
PD16877
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98. 8
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