Note Though VSS and VEE are internally connected, be sure to connect all the power supply pins (VDD, VSS,
VLCD, and VEE).
3
Page 4
PIN FUNCTIONS
µ
PD16431A
Symbol
SEG1/KS1 to
SEG8/KS8
SEG9 to SEG48
SEG49/LED1 to
SEG56/LED8
COM1 to COM4
SCK
DATA
STB
LCD/LED
Note
OE
Name
Segment output/key
source output
Segment output
Segment output/LED
output pins
Common output
Shift clock input
Data input/output
Strobe input
LCD/LED select
Output enable input
No.
25 to 32
33 to 72
73 to 80
21 to 24
7
8
9
10
11
Description
These pins serve as LCD segment output pins and key
source output pins for key scanning.
LCD segment output pins
These pins can be used as LCD segment output or LED
output pins depending on the setting of the LCD/LED pin.
LCD common output pins
Data shift clock. Data is read at the rising edge, and is
output at the falling edge of this clock.
This pin inputs a command or display data, or outputs
key data.
A command or data is input at the rising edge of the shift
clock, starting from the most significant bit. Key data is
output at the falling edge of the shift clock, starting from
the most significant bit.
This pin serves as an open-drain pin in the output mode.
Data can be input when this signal goes low. When it
goes high, command processing is performed.
When this signal goes high, the SEGn/LEDm pins function
as LCD segment output pins; when it goes low, they
function as LED driver output pins. The LED driver has a
drive capability of 15 mA and is N-ch open drain.
When this signal goes low, all the segment output and
LED output pins are off (SEGn = COMn = VLCD). Internal
data are saved.
OSCIN
OSCOUT
SYNC
KEY1 to KEY4
KEY REQ
VDD
VSS
VLCD
VEE
VLC1 to VLC3
Oscillation input
Oscillation output
Synchronizing signal
Key data input
Key request output
Logic power supply
Logic GND
LCD drive power supply
LCD GND
Power supply for LCD
drive
12
13
14
2 to 5
6
15
1
16
20
17 to 19
Connect a resistor for oscillation circuit across these pins.
A synchronizing signal input pin. When two or more
µ
PD16431A’s are used, each device is wired-ORed. This
pin must be pulled up when this chip is used alone.
Key data input pins for key scanning
This signal goes high when a key is pressed (key data = H).
Read the key data only while this pin is high.
Power supply pin for internal logic
GND pin for internal logic and LED output
Power supply pin for LCD drive
GND pin for LCD drive
Power supply for driving dot matrix LCD
Note At OE = L, the key data cannot be written correctly, even when the display ON/OFF of the status
command is set to the “normal operation” (10). Also, in this state, unnecessary waveforms are
generated from between SEG
1/KS1 to SEG8/KS8 during the key scanning period. (The display is OFF.)
4
Page 5
µ
PD16431A
CONFIGURATION OF SHIFT REGISTER
Two shift registers, an 8-bit command register and a 56-bit display register, are provided. The first 8 bits
of input data are recognized as a command and are sent to the command register, and the 9th bit and those
that follow are recognized as display data and are sent to the display register.
8-bit shift register
MSBLSB
56-bit shift register
MSBLSB
SEG56/LED
8
Display data (LCD, LED)
The meaning of the display data is as follows:
LCD: 0 → off, 1 → on
LED: 0 → on, 1 → off
Be sure to transfer 56 bits of display data.
CONFIGURATION OF OUTPUT LATCH
MSBLSB
SEG56/LED
SEG56/LED
SEG56/LED
8
8
8
b7
b0
Command
SEG
1
SEG
1
COM1 (latch address
SEG1COM2 (latch address
SEG1COM3 (latch address
Transfer direction
Note
: 00)
Note
: 01)
Note
: 10)
SEG56/LED
8
Note Bits b3 and b4 of status command (Refer to page 8.)
SEG1COM4 (latch address
Note
: 11)
5
Page 6
KEY MATRIX CONFIGURATION
An example of key matrix configurations is shown below.
1) When pressing three or more times is assumed:
A configuration example is shown below. In this configuration, 0 to 32 ON switches can be
recognized.
µ
PD16431A
KEY1
=
KEY2
KEY3
KEY4
KS2KS3KS4KS5KS6KS7KS8KS1
C
2) When pressing twice or more times is assumed:
A configuration example is shown below. In this configuration, 0 to 2 ON switches can be recognized.
KEY1
=
KEY2
KEY3
KEY4
Diode A
KS2KS3KS4KS5KS6KS7KS8KS1
In this configuration, pressing three or more times may cause OFF switches to be determined to be ON.
For example, if SW2 to SW4 are ON and KS
1 has been selected (high level) as shown below, SW3 in which
current I1 is running is supposed to be detected to be ON. However, since SW2 and SW4 are ON, current
2 runs thus resulting in SW1 to be recognized as being ON.
I
SW1SW2
KEY1
=
KEY2
KEY3
KEY4
I2
I1
SW3SW4
KS2KS3KS4KS5KS6KS7KS8
KS1
Select
6
Page 7
µ
PD16431A
If diode A is not available, not only the key data may not be read normally but the LCD display may be
affected or ICs may be damaged or deteriorated.
For example, if SW1 and SW2 are ON and KS1 has been selected (high level) as shown below, this will
cause not only current I
1 which is supposed to run but also short-circuited current I2 of KS1 to KS2 to run.
It is possible that this will then cause the following three problems:
(1)Since the level to KEY2 is not correctly sent, the key data cannot be latched correctly.
(2)If KS
2 is used as SEG2 as well, the LCD display may be distorted (such as causing unintended segments
to light up).
(3)Since the short-circuited current (current I2) of KS2 (high level) to KS2 (low level) runs, ICS may be
damaged or deteriorated
KEY1
SW1SW2
KEY2
I1
KEY3
KEY4
I2
=
KS2KS3KS4KS5KS6KS7KS8
KS1
Select
(high level)
Non Select
(low level)
7
Page 8
µ
PD16431A
CONFIGURATION OF KEY DATA LATCH
The key data is latched as illustrated below and is read by a read command, starting from the most
significant bit. Key data is read once a frame and latched when coinciding with the immediadtely preceding
data. In other words, it requires at least 2 frames from the time the key is pressed till data is confirmed to
be the key data (the key request becoming H).
32-bit latch/SHIFT register
MSBLSB
KS
KS
8
7
The key data is 0 when off and 1 when on.
KEY INPUT EQUIVALENT CIRCUIT
Pull-down
control signal
KS
3
KEY
4
KS
KEY
KS
6
KS
5
KS
4
KS
KEY
2
1
KEY
1
2
3
KEY nTo key latch
• The pull-down control signal goes high only during key
source output and turns on the pull-down transistor.
• The on-resistance of the pull-down transistor is several kΩ.
8
Page 9
µ
PD16431A
COMMAND
A command sets a display mode and a status.
The first 1 byte input after the STB pin has fallen is regarded as a command.
If the STB pin is made low while a command/data is transferred, serial communication is initialized, and
the command/data being transferred is made invalid (the command/data that has been already transferred
remains valid, however).
(1) Display setting command
µ
This command initializes the
PD16431A and sets a duty cycle, frame frequency, drive voltage supply
method, test mode, and whether the µPD16431A operates as the master or a slave.
When this command is executed, display is forcibly turned off and key scanning is stopped. To resume
the display, the normal operation of the “status command” must be executed. Note, however, that nothing
Application Circuit Example (with LED, 1/4 duty, 1/3 bias)
µ
PD16431A
t
PLZ
LCD
To microcomputer
R
4
n
COM
2
840
SEG1/KS
1
SEG
to
8
/KS
SEG
SEG
8
9
to
48
V
LCD
R
8
8
Key matrix
8 × 4
LED
LED
n
KEY
n
V
EE
R
2
R
1
GND+6 V
8
4
R
1
: 1 k to 10 kΩ
R
2
R
R
R
R
: 1/2 R1
5
, R
6
: 1 k to 10 kΩ
7
: 100 kΩ TYP.
8
: 330 to 1 kΩ
1
through R2 are not necessary when
the internal drive voltage is selected
(V
LC1
through V
LC3
are open).
V
DD
R
5
V
DD
R
6
DATA
SCK
STB
KEY REQ
OE
LCD/LED
µ
PD16431A
SYNC.
OSC
IN
R
7
OSC
OUT
VDDV
SSVLCDVLC1VLC2VLC3
R
1
+5 V GND
31
Page 32
µ
PD16431A
Note Example of external source circuit (when 1/2 bias)
VDDV
SS
V
LC0
V
LC1
V
LC2
V
LC3
V
EE
R
1
R
1
R
1
+5 V GND+6 VGND
The application circuits and their parameters are for references only and are not intended for use in actual design-in's.
= 1 k to 10 kΩ
(approx.)
32
Page 33
80 PIN PLASTIC LQFP ( 14)
µ
PD16431A
A
B
4160
4061
detail of lead end
2180
F
G
H
M
IJ
201
K
P
NOTE
N
Each lead centerline is located within 0.13 mm (0.005 inch) of
its true position (T.P.) at maximum material condition.
L
C
D
S
M
ITEM MILLIMETERSINCHES
Q
A16.0±0.20.630±0.008
B14.0±0.10.551
C14.0±0.10.551
D
F
G
H0.30±0.100.012
I
J
K
L0.5±0.20.020
M0.1250.005
N0.10
P1.4±0.10.055±0.004
Q
R3°3°
S1.7 MAX.
R
+0.005
–0.004
+0.005
–0.004
16.0±0.2
0.825
0.825
0.13
0.65 (T.P.)
1.0±0.2
+0.10
–0.05
0.125±0.0750.005±0.003
+7°
–3°
0.630±0.008
0.032
0.032
+0.004
–0.005
0.005
0.026 (T.P.)
+0.009
0.039
–0.008
+0.008
–0.009
+0.004
–0.002
0.004
+7°
–3°
0.067 MAX.
S80GC-65-7ET-1
33
Page 34
µ
PD16431A
REFERENCE
Document NameDocument No.
NEC Semiconductor Device Reliability/Quality Control SystemIEI-1212
Quality grade on NEC Semiconductor DevicesIEI-1209
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
“Standard“, “Special“, and “Specific“. The Specific quality grade applies only to devices developed based on
a customer designated “quality assurance program“ for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices in “Standard“ unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact NEC Sales Representative in advance.
Anti-radioactive design is not implemented in this product.
34
M4 94.11
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