Datasheet UPD16311GC-AB6 Datasheet (NEC)

DATA SHEET



DATA SHEET

MOS INTEGRATED CIRCUIT

PD16311

1/8- to 1/16-DUTY FIPTM (VFD) CONTROLLER/DRIVER

The

PD16311 is a FIP (Fluorescent Indicator Panel or Vacuum Fluorescent Display) controller/driver that is



driven on a 1/8- to 1/16 duty factor. It consists of 12 segment output lines, 8 grid output lines, 8 segment/grid output
drive lines, a display memory, a control circuit, and a key scan circuit. Serial data is input to the PD16311 through a
three-line serial interface. This FIP controller/driver is ideal as a peripheral device of a single-chip microcomputer.

FEATURES

• Many display modes (12-segment & 16-digit to 20-segment & 8-digit)

• Key scanning (12  4 matrices)

• Dimming circuit (eight steps)

• High-voltage output (VDD  35 V max).

• LED ports (5 chs., 20 mA max).

• General-purpose input port (4 bits)

• No external resistor necessary for driver outputs (P-ch open-drain + pull-down resistor output)

• Serial interface (CLK, STB, DIN, D

OUT

)

ORDERING INFORMATION

Part Number Package



PD16311GC-AB6 52-pin plastic QFP ( 14)

Document No. IC-3306 (1st edition)
Date Published March 1997 P
Printed in Japan

1993©

BLOCK DIAGRAM



PD16311

DOUT

CLK

STB

V

DD

Key
Key

SW1

SW

DIN

Command decoder

Serial I/F

Display memory
20 bit × 16 Word

R

OSC

Timing generator

key scan

Key data memory (4 × 12)

Dimming

circuit

20 12

20-bit output latch

8

8

8

Data selector

Seg

Seg12

Seg13/Grid16

driver

Segment/grid

Seg20/Grid9

1

Grid1

1

to

4

4

16 8

16-bit shift register

Grid driver Segment driver

Grid8

5-bit latch

to

4

4

4-bit latch

LED1 LED5

VDD

(+5 V)

SS

V

(0 V)

EE

V

(−30 V)

2

PIN CONFIGURATION (Top View)

52 OSC

51 VSS50 LED1



PD16311

49 LED2

48 LED3

47 LED4

46 LED5

45 VDD

44 Grid1

43 Grid2

42 Grid3

41 Grid4

40 Grid5

1SW1

2SW2

3SW3

4SW4

5DOUT

6DIN

7IC

8CLK

9STB

10KEY

1

11KEY2

12KEY3

13KEY4

39 Grid6

38 Grid7

37 Grid8

36 Seg20/Grid9

35 Seg19/Grid10

34 VEE

33 VDD

32 Seg18/Grid11

31 Seg17/Grid12

30 Seg16/Grid13

29 Seg15/Grid14

28 Seg14/Grid15

27 Seg13/Grid16

14VDD

15Seg1/KS1

16Seg2/KS2

17Seg3/KS3

18Seg4/KS4

Use all the power pins. Leave the IC pin open.

19Seg5/KS5

20Seg6/KS6

21Seg7/KS7

22Seg8/KS8

23Seg9/KS9

24Seg10/KS10

25Seg11/KS11

26Seg12/KS12

3

Pin Function

Pin No. Symbol Pin Name Description

6DINData input Inputs serial data at rising edge of shift clock, starting from lower

bit.

5D

9 STB Strobe Initializes serial interface at rising or falling edge to make

8 CLK Clock input Reads serial data at rising edge, and outputs data at falling edge.

52 OSC Oscillator pin Connect resistor for determining oscillation frequency to this pin.

15 to 26 Seg1/KS1 to

44 to 37 Grid1 to Grid
27 to 32

35 to 36
50 to 46 LED1 to LED
10 to 13 Key1 to Key

1 to 4 SW1 to SW

14, 33, 45 V

51 V
34 V

7 IC Internally connected Be sure to leave this pin open (this pin is at VDD level).

OUT

12

12

/KS

Seg

Seg13/Grid16 to

20

9

/Grid

Seg

DD

SS

EE

Data output Outputs serial data at falling edge of shift clock, starting from

lower bit. This is N-ch open-drain output pin.



PD16311 waiting for reception of command. Data input after
STB has fallen is processed as command. While command data
is processed, current processing is stopped, and serial interface
is initialized. While STB is high, CLK is ignored.

High-voltage output

Segment output pins (Dual function as key source)

(segment)

6

High-voltage output (grid) Grid output pins
High-voltage output

These pins are selectable for segment or grid output.

(segment/grid)

5

LED output CMOS output. +20 mA max.

4

Key data input Data input to these pins is latched at end of display cycle.

4

Switch input These pins constitute 4-bit general-purpose input port.
Logic power 5 V  10 %
Logic ground Connect this pin to GND of system.
Pull-down level VDD  35 V max.



PD16311

4



PD16311

Display RAM Address and Display Mode

The display RAM stores the data transmitted from an external device to the PD16311 through the serial interface,

and is assigned addresses as follows, in units of 8 bits:

Seg

1

00 H
03 H
06 H
09 H
0 CH
0 FH
12 H
15 H
18 H
1 BH
1 EH
21 H
24 H
27 H
2 AH
2 DH

L

L

L

L

L

L

L

L

L

L

L

L

L

L

L

L

Seg

4

00 H
03 H
06 H

09 H
0 CH
0 FH

12 H

15 H

18 H
1 BH
1 EH

21 H

24 H

27 H
2 AH
2 DH

U

U

U

U

U

U

U

U

U

U

U

U

U

U

U

U

Seg

8

01 H
04 H
07 H
0 AH
0 DH
10 H
13 H
16 H
19 H
1 CH
1 FH
22 H
25 H
28 H
2 BH
2 EH

Seg

L

L

L

L

L

L

L

L

L

L

L

L

L

L

L

L

12

01 H
04 H
07 H
0 AH

0 DH

10 H
13 H
16 H

19 H
1 CH
1 FH

22 H

25 H

28 H
2 BH
2 EH

Seg

U

U

U

U

U

U

U

U

U

U

U

U

U

U

U

U

16

02 H
05 H
08 H
0 BH
0 EH
11 H
14 H
17 H
1 AH
1 DH
20 H
23 H
26 H
29 H
2 CH
2 FH

Seg

L

L

L

L

L

L

L

L

L

L

L

L

L

L

L

L

20

DIG
DIG
DIG
DIG
DIG
DIG
DIG
DIG
DIG
DIG
DIG
DIG1
DIG
DIG
DIG
DIG

1

2

3

4

5

6

7

8

9

10

11

2

13

14

15

16

0

b

XX H

4

b3b

L

XX H

7

b

U

Lower 4 bits Higher 4 bits

Only the lower 4 bits of the addresses assigned to Seg17 through Seg20 are valid, and the higher 4 bits are

ignored.

5



PD16311

Key Matrix and Key-Input Data Storage RAM

The key matrix is of 12  4 configuration, as shown below.

KEY

1

KEY

2

KEY

3

KEY

4

1

2

3

4

5

6

7

8

9

10

11

/KS

1

Seg

/KS

2

Seg

/KS

3

Seg

/KS

4

Seg

/KS

5

Seg

/KS

6

Seg

/KS

7

Seg

/KS

8

Seg

/KS

9

Seg

/KS

10

Seg

/KS

11

Seg

12

/KS

12

Seg

The data of each key is stored as illustrated below, and is read by a read command, starting from the least

significant bit.

KEY1…KEY4KEY1…KEY

4

Seg1/KS
Seg3/KS
Seg5/KS
Seg7/KS
Seg9/KS

Seg11/KS

1

3

5

7

9

11

Seg2/KS
Seg4/KS
Seg6/KS

Seg8/KS
Seg10/KS
Seg12/KS

2

4

6

8

10

12

Reading sequence

b0------------b3 b4------------b7

When the most significant bit of data (Seg12 b7) has been read, the least significant bit of the next data (Seg1 b0) is

read.

LED Port

Data is written to the LED port by a write command, starting from the least significant bit of the port. When a bit of
this port is 0, the corresponding LED lights; when the bit is 1, the LED goes off. The data of bits 6 through 8 is
ignored.

MSB

−−−b4 b3 b2 b1 b0

Don't care

LSB

LED1
LED2
LED3
LED4
LED5

On power application, all the LEDs remain dark.

6



PD16311

SW Data

The SW data is read by a read command, starting from the least significant bit. Bits 5 through 8 of the SW data

are 0.

MSB

0 0 0 0 b3 b2 b1 b0

LSB

SW1
SW2
SW3
SW4

Command

A command sets the display mode and status of the FIP driver.
The first 1 byte input to the PD16311 through the D

IN

pin after the STB pin has fallen is regarded as a command.

If STB is made high while a command/data is transmitted, serial communication is initialized, and the

command/data being transmitted is invalid (however, the command/data already transmitted remains valid).

(1) Display mode setting command

This command initializes the PD16311 and selects the number of segments and number of grids (1/8 to 1/16
duty, 12 segments to 20 segments).
When this command is executed, display is forcibly turned off, and key scanning is also stopped. To resume
display, a display ON command must be executed. If the same mode is selected, however, nothing is
performed.

MSB

00−−b3 b2 b1 b0

Don't care

LSB

Selects display mode
0xxx
1000
1001
1010
1011
1100
1101
1110
1111

On power application, the 16-digit, 12-segment mode is selected.

: 8 digits, 20 segments
: 9 digits, 19 segments
: 10 digits, 18 segments
: 11 digits, 17 segments
: 12 digits, 16 segments
: 13 digits, 15 segments
: 14 digits, 14segments
: 15 digits, 13 segments
: 16 digits, 12 segments

7

(2) Data setting command

This command sets data write and data read modes.



PD16311

MSB

01−−b3 b2 b1 b0

Don't care

LSB

Sets data write and read modes.
00

: Writes data to display memory.

01

: Writes data to LED port.

10

: Reads key data.

11

: Reads SW data.

Sets address increment mode (display memory).
01: Increments address after data has been written.

: Fixes address.

Sets test mode
01: Normal operation

: Test mode

On power application, the normal operation mode and address increment mode are set.

(3) Address setting command

This command sets an address of the display memory.

MSB

1 1 b5 b4 b3 b2 b1 b0

LSB

Address (00H - 2FH)

If address 30H or higher is set, the data is ignored, until a correct address is set.

On power application, the address is set to 00H.

8

(4) Display control command



PD16311

MSB

10−−b3 b2 b1 b0

Don't care

LSB

Sets dimming quantity.
000

: Sets pulse width to 1/16.

001

: Sets pulse width to 2/16.

010

: Sets pulse width to 4/16.

011

: Sets pulse width to 10/16.

100

: Sets pulse width to 11/16.

101

: Sets pulse width to 12/16.

110

: Sets pulse width to 13/16.

111

: Sets pulse width to 14/16.

Turns on/off display.
01: Display off (key scan continues*)

: Display on

On power application, the 1/16-pulse width is set and the display is turned off.

*: On power application, key scanning is stopped.

9

Key Scanning and Display Timing

T

DISP

= 500 s

µ

Key scan data



PD16311

SEG Output DIG1

G

1

DIG2 DIG3

DIGn

1/16

DISP

G

2

G

3

G

n

T

DISP

1 frame = T

× (n + 1)

One cycle of key scanning consists of two frames, and data of 12  4 matrices is stored in RAM.

DIG1

10

Serial Communication Format

Reception (command/data write)

STB



PD16311

If data is contiguous

D

CLK

IN

b0 b1 b2 b6 b7

123 78

Transmission (data read)

STB

D

IN

CLK 123456 12345678

D

OUT

Because the D

b0 b1 b2 b3 b4 b5

Data reading command is set. Data reading starts.

OUT

pin is an N-ch, open-drain output pin, be sure to connect an external pull-up resistor to this pin

b6 b7

(1 k to 10 k).

*: When data is read, a wait time t

WAIT

of 1 s is necessary since the rising of the eighth clock that has set the

command, until the falling of the first clock that has read the data.

t

WAIT

*

b0 b1 b2 b3 b4 b5

11



PD16311

ABSOLUTE MAXIMUM RATINGS (Ta = 25

C, VSS = 0 V)

PARAMETER SYMBOL RATINGS UNIT
Logic Supply Voltage V
Driver Supply Voltage V
Logic Input Voltage V
FIP Driver Output Voltage V
LED Driver Output Current I
FIP Driver Output Current I

Power Dissipation P
Operating Ambient Temperature T
Storage Temperature T

Derate at 9.6 mW/C at T

*:

a

= 25 C or higher.

DD

EE

I1

O2

O1

O2

D

opt

stg



0.5 to +7.0 V

VDD +0.5 to VDD 40 V



0.5 to V

VEE 0.5 to VDD +0.5 V

+25 mA



40 (grid)



15 (segment)

1200* mW



40 to +85



65 to +150

RECOMMENDED OPERATING CONDITIONS (Ta =

PARAMETER SYMBOL MIN. TYP. MAX. UNIT TEST CONDITIONS
Logic Supply Voltage V
High-Level Input Voltage V
Low-Level Input Voltage V
Driver Supply Votlage V

DD

IH

IL

EE

4.5 5 5.5 V

DD

0.7  V
0 0.3
0V

DD

+0.5 V

20 to +70

DD

V



DD

V

DD

 35 V

mA



C



C

C, VSS = 0 V)

V
V

Maximum power consumption P

MAX

. = FIP driver dissipation + RL dissipation + LED driver dissipation + dynamic

power consumption

Where segment current = 3 mA, grid current = 15 mA, and LED current = 20 mA,
FIP driver dissipation = number of segments  6 + number of grids/(number of grids + 1)  30 (mW)
RL dissipation = (VDD  VEE)2/50  (segment + 1) (mW)
LED driver dissipation = number of LEDs  20 (mW)
Dynamic power consumption = VDD  5 (mW)

Example
Where VEE = 30 V, VDD = 5 V, and in 16-segment and 12-digit modes,
FIP driver dissipation = 16  6 +12/13  35 = 128
RL dissipation = 352/50  17 = 417
LED driver dissipation = 5  20 = 100
Dynamic power consumption = 5  5 = 25

Total 670 mW

12



PD16311

ELECTRICAL SPECIFICATIONS (Ta =

PARAMETER SYMBOL MIN. TYP. MAX. UNIT TEST CONDITIONS
High-Level Output Voltage V
Low-Level Output Voltage V
Low-Level Output Voltage V
High-Level Output Current I
High-Level Output Current I

Driver Leakage Current I
Output Pull-Down Resistor R
Input Current I
High-Level Input Voltage V
Low-Level Input Voltage V
Hysteresis Voltage V
Dynamic Current Consumption I

OH1

OL1

OL2

OH21

OH22

OLEAK

L

I

IH

IL

H

DDdyn

SWITCHING CHARACTERISTICS (Ta =

20 to +70

0.9 V



3mAV



15 mA V

50 100 150 K

0.7 V

C, VDD = 4.5 to 5.5 V, VSS = 0 V, VEE = VDD

DD

1 V LED1  LED5, I

0.4 V D



10



1

DD

0.3 V

V LED1  LED5, I



AV





AV

V

DD

V

OUT

OL2

, I

= 4 mA

O

= VDD 2 V, Seg1 to Seg

O

= VDD 2 V, Grid1 to Grid8,

13

/ Grid16 to Seg

Seg

O

= VDD 35 V, driver off

Driver output

I

= VDD or V

OH1

OL1

SS

= 1 mA
= 20 mA

0.35 V CLK, DIN, STB
5 mA Under no load, display off

20 to +70

C, VDD = 4.5 to 5.5 V, VEE =

30 V)

12/

Grid

35 V)

12

9

PARAMETER SYMBOL MIN. TYP. MAX. UNIT TEST CONDITIONS
Oscillation Frequency t
Propagation Delay Time t

Rise Time t

Fall time t
Maximum Clock Frequency f
Input Capacitance C

TIMING CONDITIONS (Ta =

20 to +70

PARAMETER SYMBOL MIN. TYP. MAX. UNIT TEST CONDITIONS
Clock Pulse Width PW
Strobe Pulse Width PW
Data Setup Time t
Data Hold Time t
Clock-Strobe Time t
Wait Time t

OSC

PLZ

PZL

t

TZH1

TZH2

t

THZ

max.

I

CLK

STB

SETUP

HOLD

CLK-STB

WAIT

350 500 650 kH z R = 56 k

300 ns CLK  D
100 ns CL = 15 pF, RL = 10 k

2

0.5

120



sCL = 300 pF Seg1 to Seg



s Grid1 to Grid8,



sCL = 300 pF, Segn, Grid

1 MHz Duty = 50 %

15 pF

C, VDD = 4.5 to 5.5 V)

400 ns

1
100 ns
100 ns

1

1



s



s CLK   STB



s CLK   CLK *



OUT



12

13

/Grid16 to

Seg

20

9

/Grid

Seg

n



*: Refer to page 11.

13

Switching Characteristic Waveform

f

OSC

OSC

50 %

STB



PD16311

PWSTB

CLK

DIN

DOUT

Sn/Gn

PWCLK PWCLK

tSETUP tHOLD

90 %

10 %

tPZL

tTHZ tTZH

tCLK-STB

tPLZ

14

Applications

Updating display memory by incrementing address

STB

CLK

D

IN

Command 2 Command 3 Data 1 Data n Command 4Command 1

Command 1: sets display mode
Command 2: sets data
Command 3: sets address
Data 1 to n: transfers display data (48 bytes max.)
Command 4: controls diplay



PD16311

Updating specific address

STB

CLK

D

IN

Command 1: sets data
Command 2: sets address
Data: display data

Command 2 Data Command 2 DataCommand 1

15



PD16311

RECOMMENDED SOLDERING CONDITIONS

The following conditions (see table below) must be met when soldering this product. Please consult with our sales

officers in case other soldering process is used or in case soldering is done under different conditions.



PD16311GC-AB6



Soldering process Soldering conditions Symbol

Infrared ray reflow Peak package’s surface temperature: 235 C or below,

Reflow time: 30 seconds or below (210 C or higher),
Number of reflow process: 2, Exposure limit*: None

VPS Peak package’s surface temperature: 215 C or below,

Reflow time: 40 seconds or below (200 C or higher),
Number of reflow process: 2, Exposure limit*: None

Wave soldering Solder temperature: 260 C or below,

Flow time: 10 seconds or below,
Number of flow process: 1, Exposure limit*: None

Partial heating method Terminal temperature: 300 C or below,

Flow time: 10 seconds or below,
Exposure limit*: None

Exposure limit before soldering after dry-pack package is opened.

*

Storage conditions: 25 C and relative humidity at 65 % or less.

Do not apply more than a single process at once, except for “Partial heating method”.

Note

IR35-00-2

VP15-00-2

WS60-00-1

16

52 PIN PLASTIC QFP (14 × 14)

A
B



PD16311

39

40

27

26

CD

52

1

14

13

F

G

H

M

I

P

J

K

M

N

NOTE

Each lead centerline is located within 0.20 mm (0.008 inch) of
its true position (T.P.) at maximum material condition.

L

detail of lead end

S

Q

ITEM MILLIMETERS INCHES

A 17.6±0.4 0.693±0.016
B 14.0±0.2 0.551

C 14.0±0.2 0.551
D 17.6±0.4 0.693±0.016

F 1.0 0.039
G 1.0 0.039

H 0.40±0.10 0.016

I 0.20 0.008

J 1.0 (T.P.) 0.039 (T.P.)
K 1.8±0.2 0.071

L 0.8±0.2 0.031

M 0.15 0.006
N 0.10 0.004

P 2.6 0.102
Q 0.1±0.1 0.004±0.004
R5°±5° 5°±5°
S 3.0 MAX. 0.119 MAX.

R

+0.10
–0.05

P52GC-100-AB6-4

+0.009
–0.008

+0.009
–0.008

+0.004
–0.005

+0.008
–0.009

+0.009
–0.008

+0.004
–0.003

17

[MEMO]



PD16311

18

[MEMO]



PD16311

19

PD16311

FIPTM is a trademark of NEC Corporation.

No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on
a customer designated "quality assurance program" for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.

Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.

M4 96. 5