Datasheet UPC8182TB-E3, UPC8182TB Datasheet (NEC)

PRELIMINARY DATA SHEET

BIPOLAR ANALOG INTEGRATED CI RCUIT

PC8182TB

µµµµ

3 V, 2.9 GHz SILICON MMIC

MEDIUM OUTPUT POWER AMPLIFIER

FOR MOBILE COMMUNICATIONS

DESCRIPTION

The

PC8182TB is a silicon monolithic integrated circuit designed as amplifier for mobile communications. This

µ

IC is low current consumption and wide band than µPC2771TB.

This IC is manufactured using NEC’s 25 GHz fT UHS0 silicon bipolar process. This process uses direct silicon
nitride passivation film and gold electrodes. These materials can protect the chip surface from pollution and prevent
corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.

FEATURES

• High-density surface mounting : 6-pin super minimold package (2.0 × 1.25 × 0.9 mm)

• Supply voltage : VCC = 2.7 to 3.3 V

• Circuit current : ICC = 30 mA TYP. @ VCC = 3.0 V

• Medium output power : P

• Power gain : GP = 21.5 dB TYP. @ f = 0.9 GHz

• Upper limit operating frequency : fu = 2.9 GHz TYP. @ 3 dB bandwidth

O(1dB)

= +9.5 dBm TYP. @ f = 0.9 GHz

O(1dB)

P

= +9.0 dBm TYP. @ f = 1.9 GHz

O(1dB)

P

= +8.0 dBm TYP. @ f = 2.4 GHz

GP = 20.5 dB TYP. @ f = 1.9 GHz
GP = 20.5 dB TYP. @ f = 2.4 GHz

APPLICATION

• Buffer amplifiers on 1.9 GHz to 2.4 GHz mobile communications system.

ORDERING INFORMATION

Part Number Package Marking Supplying Form

µ

PC8182TB-E3 6-pin super minimold C3F Embossed tape 8 mm wide.

1, 2, 3 pins face to perforat i on side of the tape.
Qty 3 kp/reel.

Remark

To order evaluation samples, please contact your local NEC sales office.

(Part number for sample order:

Caution Electro-static sensitive devices

The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.

Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.

PC8182TB)

µ

Document No. P14543EJ1V0DS00 (1st edition)
Date Published December 1999 N CP(K)
Printed in Japan

©

1999

PIN CONNECTIONS

µµµµ

PC8182TB

(Top View)

3

2

1

4

5

6

C3F

PRODUCT LINE-UP (TA = +25 °C, VCC = V

u

Part No.

PC2762T 2.9 +8.0 @ f = 0.9 GHz 13.0 @ f = 0.9 GHz 26.5 6-pin m i ni m ol d C1Z

µ

PC2762TB +7.0 @ f = 1.9 GHz 15.5 @ f = 1.9 GHz 6-pin super minimold

µ

PC2763T 2.7 +9.5 @ f = 0.9 GHz 20.0 @ f = 0.9 GHz 27.0 6-pin m i ni m ol d C2A

µ

PC2763TB +6.5 @ f = 1.9 GHz 21.0 @ f = 1.9 GHz 6-pin super minimold

µ

PC2771T 2.2 +11.5 @ f = 0.9 GHz 21.0 @ f = 0.9 GHz 36.0 6-pin m i ni m ol d C2H

µ

PC2771TB +9.5 @ f = 1.5 GHz 21.0 @ f = 1.5 GHz 6-pin super minimold

µ

PC8182TB

µ

f

(GHz)

2.9 +9.0 @ f = 1.9 GHz 20.5 @ f = 1.9 GHz 30.0 C3F
+8.0 @ f = 2.4 GHz 20.5 @ f = 2.4 GHz

O (1 dB)

P

(dBm)

(Bottom View)

4

5

6

out

= 3.0 V, ZS = ZL = 50

3

2

1

)

ΩΩΩΩ

G

(dB)

P

CC

I

(mA)

Pin No. Pin Name

1 INPUT
2GND
3GND
4OUTPUT
5GND
6V

Package Marking

6-pin super minimold

CC

Remark

Notice

Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.

The package size distinguishes between minimold and super minimold.

2

Preliminary Data Sheet P14543EJ1V0DS00

SYSTEM APPLICATION EXAMPLE

Digital cellular telephone

µµµµ

PC8182TB

TX

SW

RX

PA

µ

PC8182TB

÷N

PLL

Phase
shifter

0 °

90 °

DEMO

PLL

I

Q

I

Q

Preliminary Data Sheet P14543EJ1V0DS00

3

PIN EXPLANATION

µµµµ

PC8182TB

Applied

Pin No. Pin Name

1 INPUT – – Signal input pi n. A internal

4 OUTPUT Vol t age

6VCC2.7 to 3.3 – Power supply pi n, whi ch biases

2
3
5

GND 0 – Ground pin. This pi n should be

Voltage

(V)

as same

CC

as V
through
external
inductor

Pin
Voltage

Note

(V)

– Signal output pi n. The inductor

Function and Applications Internal Equivalent Circ ui t

matching circuit, configured with
resistors, enables 50
connection over a wide band.
A multi-feedback ci rcuit is
designed to cancel the
deviations of h
This pin must be coupled to
signal source with capac i t or for
DC cut.

must be attached between V
and output pins to supply
current to the internal output
transistors.

the internal input transis tor.
This pin should be externally
equipped with bypass capaci t or
to minimize its i m pedance.

connected to system ground
with minimum inductanc e.
Ground pattern on the board
should be formed as wide as
possible.
All the ground pins must be
connected together with wide
ground pattern to decrease
impedance difference.

Ω

FE

and resistance.

6

CC

4

1

3

GND GND

52

Pin voltage is measured at V

Note

4

CC

= 3.0 V.

Preliminary Data Sheet P14543EJ1V0DS00

ABSOLUTE MAXIMUM RATINGS

Parameter Symbol Conditions Ratings Unit

µµµµ

PC8182TB

Supply Voltage V
Total Circuit Current I
Power Dissipation P

CC

CC

TA = +25 °C, pin 4 and 6 3.6 V
TA = +25 °C60mA

D

Mounted on double copper clad
50 × 50 × 1.6 mm epoxy glass P WB

(T
Operating Ambient Temperature T
Storage Temperature T
Input Power P

A

stg

in

TA = +25 °C +10 dBm

RECOMMENDED OPERATING CONDITIONS

Parameter Symbol MIN. TYP. MAX. Unit Remark

Supply Voltage V

Operating Ambient Temperature T

CC

A

200 mW

A

= +85 °C)

40 to +85

−

55 to +150

−

C

°

C

°

2.7 3.0 3.3 V Same voltage should be applied
to pin 4 and 6.

40 +25 +85 °C

−

−

Preliminary Data Sheet P14543EJ1V0DS00

5

µµµµ

PC8182TB

ELECTRICAL CHARACTERISTICS (TA = +25 °C, VCC = V

Parameter Symbol Test Conditions MIN. TYP. MAX. Unit

O (1dB)

P

O (sat)

CC

No signal 22.0 30. 0 38.0 mA

P

f = 0.9 GHz
f = 1.9 GHz
f = 2.4 GHz

f = 1.9 GHz
f = 2.4 GHz

u

3 dB down below from gain at f = 0.1 GHz 2.8 2.9

f = 1.9 GHz
f = 2.4 GHz

in

f = 0.9 GHz
f = 1.9 GHz
f = 2.4 GHz

out

f = 0.9 GHz
f = 1.9 GHz
f = 2.4 GHz
f = 0.9 GHz
f = 1.9 GHz
f = 2.4 GHz
f = 0.9 GHz, Pin = −5 dBm

in

f = 1.9 GHz, P
f = 2.4 GHz, P

= −5 dBm

in

= −5 dBm

Circuit Current I
Power Gain G

Noise Figure NF f = 0.9 GHz

Upper Limit Operating Frequency f
Isolation ISL f = 0.9 GHz

Input Return Loss RL

Output Return Loss RL

1 dB Gain Compression Output
Level

Saturated Output Power Level P

out

= 3.0 V, ZS = ZL = 50

)

ΩΩΩΩ

19.0

17.5

18.0

−

−

−

30
27
28

6
8
9
8
9

11
+7.5
+7.0
+5.5

−

−

−

21.5

20.5

20.5

4.5

4.5

5.0

33
32
31

8
10
12
10
11
14

+9.5
+9.0

+8.0
+10.5
+10.0

+9.5

25.0

23.5

24.0

6.0

6.0

6.5

−

−

−

−

−

−

−

−

−

−

−

−

−

−

−

−

dB

dB

GHz

dB

dB

dB

dBm

dBm

6

Preliminary Data Sheet P14543EJ1V0DS00

TEST CIRCUIT

1 000 pF

3

C

µµµµ

PC8182TB

V

CC

1

C

1 000 pF

6

1

2, 3, 5

4

L

C

2

1 000 pF

50 Ω50 Ω

OUTIN

COMPONENTS OF TEST CIRCUIT EXAMPLE OF ACTUAL APPLICATION COMPONENTS
FOR MEASURING ELECTRICAL
CHARACTERISTICS

Type Value Type V al ue Operating Frequency

2

C1, C

3

C

L Bias Tee 1 000 nH 10 nH 2.0 GHz or hi gher

Bias Tee 1 000 pF C1 to C3Chip capacitor 1 000 pF 100 MHz or hi gher

Capacitor 1 000 pF L Chip inductor 100 nH 100 MHz or higher

INDUCTOR FOR THE OUTPUT PIN

The internal output transistor of this IC consumes 20 mA, to output medium power. To supply current for output
transistor, connect an inductor between the Vcc pin (pin 6) and output pin (pin 4). Select large value inductance, as
listed above.

The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum
voltage drop to output enable high level. In terms of AC, the inductor make output-port-impedance higher to get
enough gain. In this case, large inductance and Q is suitable.

For above reason, select an inductance of 100 Ω or over impedance in the operating frequency. The gain is a
peak in the operating frequency band, and suppressed at lower frequencies.

The recommendable inductance can be chosen from example of actual application components list as shown
above.

CAPACITORS FOR THE VCC, INPUT, AND OUTPUT PINS

Capacitors of 1 000 pF are recommendable as the bypass capacitor for the Vcc pin and the coupling capacitors
for the input and output pins.

The bypass capacitor connected to the Vcc pin is used to minimize ground impedance of Vcc pin. So, stable bias
can be supplied against Vcc fluctuation.

The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial
impedance. Their capacitance are therefore selected as lower impedance against a 50 Ω load. The capacitors thus
perform as high pass filters, suppressing low frequencies to DC.

To obtain a flat gain from 100 MHz upwards, 1 000 pF capacitors are used in the test circuit. In the case of under
10 MHz operation, increase the value of coupling capacitor such as 10 000 pF. Because the coupling capacitors are
determined by equation, C = 1/(2πRfc).

Preliminary Data Sheet P14543EJ1V0DS00

7

ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD

AMP-2

Top View

321

C3F

Mounting direction

→

456

IN OUT

CC

L

V

CC

C

µµµµ

PC8182TB

COMPONENT LIST

C 1 000 pF

L Example: 10 nH

Value

Notes

1.

30 × 30 × 0.4 mm double sided copper clad polyimide board.

2.

Back side: GND pattern

3.

Solder plated on pattern

4.

: Through holes

8

Preliminary Data Sheet P14543EJ1V0DS00

PACKAGE DIMENSIONS

6 PIN SUPER MINIMOLD (UNIT: mm)

µµµµ

PC8182TB

0.22 ±0.1 0.13

0.1 MIN.

2.1 ±0.1

1.25 ±0.1

0.65 0.65

1.3

2.0 ±0.2

0.9 ±0.1

0.7

+0.1
–0.02

0 to 0.1

Preliminary Data Sheet P14543EJ1V0DS00

9

µµµµ

PC8182TB

NOTES ON CORRECT USE

(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).

All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to the VCC pin.
(4) The inductor must be attached between VCC and output pins. The inductance value should be determined in

accordance with desired frequency.
(5) The DC cut capacitor must be attached to input pin.

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered under the following recommended conditions. For soldering methods and

conditions other than those recommended below, contact your NEC sales representative.

Soldering Method Soldering Conditions Recommended Condition Symbol

Infrared Reflow Package peak temperature: 235 ° C or bel ow

Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limi t: None

VPS Package peak temperature: 215 °C or below

Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limi t: None

Wave Soldering Soldering bath temperature: 260 °C or below

Time: 10 seconds or less
Count: 1, Exposure limi t: None

Partial Heating Pin temperature: 300 °C

Time: 3 seconds or less (per side of device)
Exposure limit: None

After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.

Note

Note

Note

Note

Note

IR35-00-3

VP15-00-3

WS60-00-1

–

Caution Do not use different soldering methods together (except for partial heating).

For details of recommended soldering conditions for surface mounting, refer to information document

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E)

.

10

Preliminary Data Sheet P14543EJ1V0DS00

[MEMO]

µµµµ

PC8182TB

Preliminary Data Sheet P14543EJ1V0DS00

11

µµµµ

PC8182TB

ATTENTION

OBSERVE PRECAUTIONS

FOR HANDLING

ELECTROSTATIC

SENSITIVE

DEVICES

• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.

• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.

• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.

• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.

• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.

• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.

M7 98. 8