Datasheet TZA3044U-T-C2, TZA3044U-C2, TZA3044T-C2 Datasheet (Philips)

DATA SH EET

Product specification
Supersedes data of 1999 Mar 16
File under Integrated Circuits, IC19

1999 Nov 03

INTEGRATED CIRCUITS

TZA3044; TZA3044B

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet
postamplifiers

1999 Nov 03 2

Philips Semiconductors Product specification

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet postamplifiers

TZA3044; TZA3044B

FEATURES

• PincompatiblewiththeNE/SA5224andNE/SA5225but
with extended power supply range and less external
component count

• Wideband operation from 1.0 kHz to 1.25 GHz typical

• Applicable in 622 Mbits/s SDH/SONET receivers and

1.25 Gbits/s Gigabit Ethernet receivers

• Single supply voltage from 3.0 to 5.5 V

• Positive Emitter Coupled Logic (PECL) compatible data

outputs

• Positive Emitter Coupled Logic (PECL) compatible
status outputs (TTL compatible status outputs for the
TZA3044B)

• Programmable input signal level detection to be
adjusted using a single external resistor

• On-chip DC offset compensation without external
capacitor.

APPLICATIONS

• Digital fibre optic receiver for SDH/SONET STM4/OC12
and Gigabit Ethernet applications

• Wideband RF gain block.

GENERAL DESCRIPTION

The TZA3044 is a high gain limiting amplifier that is
designed to process signals from fibre optic preamplifiers
like the TZA3043 and TZA3023. It is pin compatible with
the NE/SA5224 and NE/SA5225 but with extended power
supply range, and needs less external components.
Capable of operating up to 1.25 Gbits/s, the chip has input
signalleveldetectionwithauser-programmablethreshold.
The data and level detection status outputs are differential
outputs for optimum noise margin and ease of use.
The TZA3044B has the same functionality as the
TZA3044, but with TTL compatible status outputs
(pins ST and STQ), and TTL compatible JAM input.

ORDERING INFORMATION

TYPE

NUMBER

PACKAGE

NAME DESCRIPTION VERSION

TZA3044T SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
TZA3044TT TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1
TZA3044U − bare die in waffle pack carriers; die dimensions 1.55 × 1.55 mm −
TZA3044BT SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
TZA3044BTT TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1
TZA3044BU − bare die in waffle pack carriers; die dimensions 1.55 × 1.55 mm −

1999 Nov 03 3

Philips Semiconductors Product specification

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet postamplifiers

TZA3044; TZA3044B

BLOCK DIAGRAM

Fig.1 Block diagram.

The numbers in brackets refer to the pad numbers of the bare die version.

handbook, full pagewidth

MGR240

(3, 4, 6, 9)
3

15 (29)

(17) 9

16 (30)

(1, 14)
1

(11, 12)
6

(13)
7

2
(2, 10, 15, 21, 26)

(19, 20, 22, 25)11(27, 28)

14

25 kΩ

DC-OFFSET

COMPENSATION

RECTIFIER

A1 A2 A3

A4

BAND GAP

REFERENCE

1 kΩ

TZA3044

SUB

TEST

AGND V

CCA

CF

STQ

(18) 10

ST

(16) 8

JAM

(23) 12

DOUTQ

(24) 13

DOUT

DGND V

CCD

V

ref

RSET

5 (8)

DINQ

4 (7)

DIN

Fig.2 Pin configuration of TZA3044T and

TZA3044BT.

handbook, halfpage

TZA3044T

TZA3044BT

MGR241

1
2
3
4
5
6
7
8

16
15
14
13
12
11
10

9

SUB

TEST

AGND

DIN

DINQ

V

CCA

CF

JAM

STQ

ST

DGND

DOUTQ

DOUT

V

CCD

V

ref

RSET

Fig.3 Pin configuration of TZA3044TT and

TZA3044BTT.

handbook, halfpage

TZA3044TT

TZA3044BTT

MBK998

1
2
3
4
5
6
7
8

16
15
14
13
12
11
10

9

SUB

TEST

AGND

DIN

DINQ

V

CCA

CF

JAM

STQ

ST

DGND

DOUTQ

DOUT

V

CCD

V

ref

RSET

1999 Nov 03 4

Philips Semiconductors Product specification

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet postamplifiers

TZA3044; TZA3044B

PINNING

Note

1. Pin type abbreviations: O = Output, I = Input, S = power Supply and A = Analog function.

SYMBOL

PIN

TZA3044T

TZA3044TT

PAD

TZA3044U

TYPE

(1)

DESCRIPTION

SUB 1 1, 14 S substrate pin; must be at the same potential as pin AGND
TEST 2 2, 10, 15,

21, 26

− for test purpose only; to be left open in the application

AGND 3 3, 4, 6, 9 S analog ground; must be at the same potential as pin DGND
DIN 4 7 I differential input; complementary to pin DINQ; DC bias level is set

internally at approximately 2.1 V

DINQ 5 8 I differential input; complementary to pin DIN; DC bias level is set

internally at approximately 2.1 V

V

CCA

6 11, 12 S analog supply voltage; must be at the same potential as pin V

CCD

CF 7 13 A input for connection of capacitor to set time constant of level

detector input filter (optional); the capacitor should be connected
between V

CCA

and pin CF

JAM 8 16 I PECL-compatible input (TTL compatible for the TZA3044B);

controls the output buffers pins DOUTand DOUTQ; when a LOW
signal is applied, the outputs will follow the input signal; when a
HIGH signal is applied, the output buffers will latch into LOW and
HIGH states respectively; when not connected, pin JAM is actively
pulled LOW

STQ 9 17 O PECL-compatible status output of the input signal level detector

(TTL compatible for the TZA3044B); when the input signal is below
the user-programmed threshold level, this output is HIGH;
complementary to pin ST

ST 10 18 O PECL-compatible status output of the input signal level detector

(TTL compatible for the TZA3044B); when the input signal is below
the user-programmed threshold level, this output is LOW;
complementary to pin STQ

DGND 11 19, 20, 22,

25

S digital ground; must be at the same potential as pin AGND

DOUTQ 12 23 O PECL-compatible differential output; forced into a HIGH condition

when pin JAM is HIGH; complementary to pin DOUT

DOUT 13 24 O PECL-compatible differential output; forced into a LOW condition

when pin JAM is HIGH; complementary to pin DOUTQ

V

CCD

14 27, 28 S digital supply voltage; must be at the same potential as V

CCA

V

ref

15 29 O band gap reference voltage; typical value is 1.2 V; internal series

resistor of 1 kΩ

RSET 16 30 A input signal level detector programming; nominal DC voltage is

V

CCA

− 1.5 V; threshold level is set by connecting an external

resistor between V

CCA

and pin RSET or by forcing a current into
pin RSET; default value for this resistor is 180 kΩ which
corresponds with approximately 4 mV (p-p) differential input signal

n.c. − 5, 31, 32 − not connected

1999 Nov 03 5

Philips Semiconductors Product specification

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet postamplifiers

TZA3044; TZA3044B

FUNCTIONAL DESCRIPTION

The TZA3044 accepts up to 1.25 Gbits/s data streams,
with amplitudes from 2 mV (p-p) up to 1.5 V (p-p)
single-ended. The input signal will be amplified andlimited
to differential PECL output levels (see Fig.1).

The input buffer A1 presents an impedance of
approximately 4.5 kΩ to the data stream on the inputs DIN
and DINQ. The input can be used both single-ended and
differential, but differential operation is preferred for better
performance.

Because of the high gain of the postamplifier, a very small
offset voltage would shift the decision level in such a way
that the input sensitivity decreases drastically. Therefore a
DC offset compensation circuit is implemented in the
TZA3044, which keeps the input of buffer A3 at its toggle
point in the absence of any input signal.

An input signal level detection is implemented to check if
the input signal is above the user-programmed level.
The outcome of this test is available at the PECL
outputs ST and STQ (TTL for the TZA3044B). This flag
can also be used to prevent the PECL outputs DOUT and
DOUTQ from reacting to noise in the absence of a valid
input signal, by connecting pin STQ to pin JAM. This
guarantees that data will only be transmitted when the
input signal-to-noise ratio is sufficient for low bit error rate
system operation.

PECL logic

The logic level symbol definitions for PECL are shown in
Fig.4.

Input biasing

The inputs, pins DIN and DINQ, are DC biased at
approximately 2.1 V by an internal reference generator
(see Fig.5). The TZA3044 can be DC coupled, but AC
coupling is preferred. In case of DC coupling, the driving
source must operate within the allowable input signal
range (1.3 V to V

CCA

). Also a DC offset voltage of more
than a few millivolts should be avoided, since the internal
DC offset compensation circuit has a limited correction
range.

If AC coupling is used to remove any DC compatibility
requirement, the coupling capacitors must be large
enough to pass the lowest input frequency of interest.
For example, 1 nF coupling capacitors react with the
internal 4.5 kΩ input bias resistors to yield a lower −3dB
frequency of 35 kHz. This then sets a limit on the
maximum number of consecutive pulses that can be
sensed accurately at the system data rate. Capacitor
tolerance and resistor variation must be included for an
accurate calculation.

DC-offset compensation

A control loop connected between the inputs of buffer A3
andamplifier A1 (see Fig.1) will keep theinputof buffer A3
at its toggle point in the absence of any input signal.
Because of the active offset compensation which is
integrated in the TZA3044, no external capacitor is
required. The loop time constant determines the lower
cut-off frequency of the amplifier chain, which is set at
approximately 850 Hz.

Input signal level detection

The TZA3044 allows for user-programmable input signal
leveldetectionand can automatically disable the switching
of the PECL outputs if the input signal is below a set
threshold. This prevents the outputs from reacting to noise
in the absence of avalid input signal, and insures that data
will only be transmitted when the signal-to-noise ratio of
the input signal is sufficient for low bit-error-rate system
operation. Complementary PECL (TTL forthe TZA3044B)
flags (pins ST and STQ) indicate whether the input signal
is above or below the programmed threshold level.

The input signal is amplified and rectified before being
compared to a programmable threshold reference. A filter
isincluded to prevent noise spikes from triggeringthe level
detector. This filter has a nominal 1 µs time constant and
additional filtering can be achieved by using an external
capacitor between V

CCA

and pin CF (the internal driving
impedance nominally is 25 kΩ). The resultant signal is
then compared to a threshold current through pin RSET.
This current can be set by connecting an external resistor
between V

CCA

and pin RSET, or by forcing a current into

pin RSET (see Fig.6).

1999 Nov 03 6

Philips Semiconductors Product specification

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet postamplifiers

TZA3044; TZA3044B

The relationship between the threshold current and the
detected input voltage is approximately:

(1)

In the formulas (1) and (3), the voltage on
pins DIN and DINQ is measured as peak-to-peak value.

Since the voltage on pin RSET is held constant at 1.5 V
below V

CCA

, the current flowing into this pin will be:

(2)

Combining these two formulas results in a generalformula
to calculate R

ADJ

for a given input signal level detection:

(3)

Example: Detection should occur if the differential voltage
of the input signals drops below 4 mV (p-p). In this case, a
reference current of 0.0018 × 0.004 = 7.2 µA should flow
into pin RSET. This can be set using a current source or
simply by connecting a resistor of the appropriate value.
The resistor must be connected between V

CCA

and

pin RSET. In this example the value would be:

The hysteresis is fixed internally at 3 dB electrical. In the
example of above, a differential level below 4 mV (p-p) of
the input signal will drive pin ST to LOW, and an input
signal level above 5.7 mV (p-p) will drive pin ST to HIGH.

A function is provided to automatically disable the signal
transmission when the chip senses that the input signal is
below the programmed threshold level. This function can
be put into operation by connecting pin JAM with pin STQ.
When the input signal is below the programmed threshold
level, the data outputs are then forced to a predetermined
state (pin DOUT = LOW and pin DOUTQ = HIGH).

Response time of the input signal level detection circuit is
determined by the time constant of the input capacitors,
together with the filter time constant (1 µs internal plus the
additional capacitor at pin CF). For SDH/SONET
applications couple capacitors of 1.5 nF are
recommended, leading to a high-pass frequency of

approximately 30 kHz and a maximum assert time of
30 µs.

Dissipation

Since the thermal resistance from junction to ambient
R

th(j-a)

of the TSSOP package is higher than the thermal
resistance of the SO package (see Chapter “Thermal
characteristics”), the dissipation should be considered
when using the TZA3044TT version.

The formula to calculate the worst case die temperature is:

(4)

where

T

j

= junction temperature

T

amb

= ambient temperature

R

th(j-a)

= thermal resistance from junction to ambient

P

max

= maximum power dissipation.

For the TZA3044T (SO package), the worst case die
temperatureTj=85+115×0.3 = 119.5 °Cwhichis below
the maximum operating temperature.

For the TZA3044TT (TSSOP package), the worst casedie
temperature Tj=85+150×0.3 = 130 °C which is higher
than the maximum operating temperature, and therefore
strongly discouraged. It is recommended to lower the
thermalresistancefromjunctiontoambient, e.g. by means
of a dedicated board layout.

However, if the ambient temperature is limited to 75 °Cor
the power supply is limited to 3.3 ±0.3 V, the junction
temperature will stay below the maximum value without
further precautions.

Output circuits

The output circuit of ST and STQ is given in Fig.7.
The output circuit of DOUT and DOUTQ is given in Fig.8.
Some PECL termination schemes are given in Fig.9.

I

RSET

0.0018 V

DINVDINQ

–()A[]×=

I

RSET

1.5

R

ADJ

-------------

A[]=

R

ADJ

830

V

DINVDINQ

–()

--------------------------------------

Ω[]=

R

ADJ

830

0.004

-------------- -

207.5 kΩ==

T

j

T

ambRth j a–()

P×

max

+=

1999 Nov 03 7

Philips Semiconductors Product specification

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet postamplifiers

TZA3044; TZA3044B

handbook, halfpage

MGS812

(1)

(2)

V

OL(min)

V

OL(max)

V

OH(min)

V

OH(max)

V

CC

GND

Fig.4 Logic level symbol definitions for PECL.

(1) Output signal on pin DOUT or pin ST; complementary to output signal (2).
(2) Output signal on pin DOUTQ or pin STQ; complementary to output signal (1)

Fig.5 Data input circuit DIN and DINQ.

MGR958

handbook, halfpage

1 mA

2.1 V

DINQ

4.5 kΩ

DIN

V

CC

4.5 kΩ

1999 Nov 03 8

Philips Semiconductors Product specification

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet postamplifiers

TZA3044; TZA3044B

handbook, halfpage

MGS815

RSET

I

RSET

R

ADJ

V

CCA

TZA3044

V

RSET

Fig.6 Level detect input circuit RSET.

V

RSET=VCCA

− 1.5 V

handbook, full pagewidth

10 kΩ

ST

V

CC

V

CC

V

LOW

V

HIGH

MGS816

ST

Fig.7 Output circuit ST and STQ for the TZA3044 (left) and TZA3044B (right).

Output STQ is complementary to output ST.

Fig.8 PECL output circuit DOUT and DOUTQ.

handbook, halfpage

MGR247

105 Ω 105 Ω

V

CC

DOUTQ

DOUT

0.5 mA

9 mA

0.5 mA

1999 Nov 03 9

Philips Semiconductors Product specification

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet postamplifiers

TZA3044; TZA3044B

Fig.9 PECL output termination schemes.

handbook, full pagewidth

V

OQ

V

O

V

IQ

V

I

R1 = 50 Ω R1 = 50 Ω

Zo = 50 Ω

VCC − 2 V

MGR248

handbook, full pagewidth

V

OQ

V

O

V

IQ

V

I

Zo = 50 Ω

GND

VCC = 3.3 V

MGR249

R1 = 127 Ω

R2 = 82.5 Ω

R1 = 127 Ω

R2 = 82.5 Ω

handbook, full pagewidth

V

OQ

V

O

V

IQ

V

I

R1 = 83.3 Ω

R2 = 125 Ω

R1 = 83.3 Ω

R2 = 125 Ω

Zo = 50 Ω

GND

VCC = 5.0 V

MGR250

1999 Nov 03 10

Philips Semiconductors Product specification

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet postamplifiers

TZA3044; TZA3044B

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

Note

1. For the TZA3044B the minimum value is −0.5 V for ST and STQ outputs.

HANDLING

This device is ESD sensitive and should be handled with care. Precautions should be taken to avoid damage through
electrostatic discharge. This is particularly important during assembly and handling of the bare die. Additional safety can
be obtained by bonding the V

CC

and GND pads first, the remaining pads may then be bonded to their external

connections in any order.

THERMAL CHARACTERISTICS

Note

1. Thermal resistance from junction to ambient is determined with the IC soldered on a standard single-sided
57 × 57 × 1.6 mmFR4 epoxy printed-circuit board with 35 µm thickcoppertraces. The measurements are performed
in still air.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CC

supply voltage −0.5 +6 V

V

n

DC voltage

pins DIN, DINQ, CF, JAM and RSET −0.5 V

CC

+ 0.5 V

pins ST, STQ, DOUT and DOUTQ note 1 V

CC

− 2VCC+ 0.5 V

pin V

ref

−0.5 +3.2 V

I

n

DC current

pins DIN, DINQ, CF and JAM −1+1mA
pins ST, STQ, DOUT and DOUTQ −25 +10 mA
pin V

ref

−2 +2.5 mA

pin RSET −2+2mA

P

tot

total power dissipation − 300 mW

T

stg

storage temperature −65 +150 °C

T

j

junction temperature − 150 °C

T

amb

ambient temperature −40 +85 °C

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

thermal resistance from junction to ambient note 1

SO16 package 115 K/W
TSSOP16 package 150 K/W

1999 Nov 03 11

Philips Semiconductors Product specification

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet postamplifiers

TZA3044; TZA3044B

CHARACTERISTICS

For typical values T

amb

=25°C and VCC= 3.3 V; minimum and maximum values are valid over the entire ambient
temperature range and supply voltage range; all voltages are measured with respect to ground; unless otherwise
specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply

V

CC

supply voltage 3 3.3 5.5 V

I

CCD

digital supply current notes 1 and 2 − 18 31 mA

I

CCA

analog supply current note 2 − 15 24 mA

P

tot

total power dissipation notes 1 and 2 − 110 300 mW

T

j

junction temperature −40 − +125 °C

T

amb

ambient temperature −40 +25 +85 °C

Input signal pins DIN and DINQ

V

i(se)(p-p)

single-ended input signal
voltage (peak-to-peak)

note 3 0.002 − 1.5 V

V

i(dif)(p-p)

differential input signal
voltage (peak-to-peak)

note 3 0.004 − 3.0 V

V

I

 absolute input signal voltage 1.3 2.1 V

CCA

V

V

IO(eq)

equivalent input signal offset
voltage

−−50 µV

V

IO(cor)

inputoffsetvoltagecorrection note 4; positive − 3 − mV

note 4; negative −−3−mV

R

i

input resistance single-ended 2.9 4.5 7.6 kΩ

C

i

input capacitance single-ended; note 5 −−2.5 pF

V

n(i)(rms)

equivalent input RMS noise
voltage

notes 5 and 6 − 100 145 µV

Input signal level detect pin RSET

I

RSET

reference current notes 5 and 7 5 − 60 µA

V

RSET

reference voltage referred to V

CCA

V

CCA

− 1.65 V

CCA

− 1.5 V

CCA

− 1.4 V

V

th(p-p)

threshold adjusting range
(single-ended, peak-to-peak)

Vi= 1.25 Gbits/s PRBS
27− 1 sequence; note 5

2 − 12 mV

hys hysteresis electrically measured 236dB
R

F

filter resistance 14 25 41 kΩ

t

F

filter time constant CF = 0; note 5 0.5 1.0 2.0 µs

PECL output pins DOUT and DOUTQ

V

OL

LOW-level output voltage note 8 VCC− 1.84 − VCC− 1.6 V

V

OH

HIGH-level output voltage note 8 VCC− 1.1 − VCC− 0.9 V

t

r

rise time 20% to 80%; note 5 − 200 250 ps

t

f

fall time 80% to 20%; note 5 − 200 250 ps

t

PWD

pulse width distortion note 5 −−30 ps

f

−3dB(l)

low frequency −3 dB point − 0.85 1.5 kHz

f

−3dB(h)

high frequency −3 dB point note 9 − 1000 − MHz

1999 Nov 03 12

Philips Semiconductors Product specification

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet postamplifiers

TZA3044; TZA3044B

Notes

1. PECL outputs (pins DOUT, DOUTQ, ST and STQ) are not connected.

2. Maximum currents are specified at Tj= 125 °C, VCC= 5.5 V and worst case processing.

3. 2 mV (p-p) single-ended is the minimum input signal to achieve full clipping of the output signal. Typical an input

signal of 0.8 mV (p-p) single-ended results in a Bit Error Rate (BER) of less than 10

−10

.

4. If the input is DC coupled, the preceding amplifier’s output offset voltage should not exceed these limits, in order to

avoid malfunctioning of the DC offset compensation circuit.

5. Specifications guaranteed by design and characterisation. Each device is tested at full operating speed to guarantee

RF functionality.

6.

7. The reference current can be set by connecting a resistor between V

CCA

and pin RSET. The corresponding input
signallevel detect range isfrom 2 to 12 mV (p-p) single-ended. SeeSection “Input signal level detection” for detailed
information.

8. RL=50Ω connected to a level of VCC− 2 V (see Fig.9).

9. Large signal response of TZA3044T and TZA3044TT show very little deviation, although the small signal frequency
response of the TZA3044TT is more flat and shows a larger bandwidth.

10. Internal pull-down resistor of 500 kΩ to DGND.

11. Internal series resistor of 1 kΩ.

PECL output pins ST and STQ (TZA3044)

V

OL

LOW-level output voltage note 8 VCC− 1.84 − VCC− 1.6 V

V

OH

HIGH-level output voltage note 8 VCC− 1.1 − VCC− 0.9 V

C

L

load capacitance RL= ∞−−20 pF

R

L

=1kΩ−−100 pF

R

L

=50Ω−−1000 pF

TTL output pins ST and STQ (TZA3044B)

V

OL

LOW-level output voltage IOL = 4 mA −−0.4 V

V

OH

HIGH-level output voltage IOH = −400 µA 2.4 −−V

PECL input pin JAM (TZA3044)

V

IL

LOW-level input voltage −−V

CC

− 1.49 V

V

IH

HIGH-level input voltage VCC− 1.165 −−V

I

I(JAM)

JAM input current note 10 −20 − +20 µA

TTL input pin JAM (TZA3044B)

V

IL

LOW-level input voltage −−0.8 V

V

IH

HIGH-level input voltage 2.0 −−V

I

I(JAM)

JAM input current note 10 −20 − +20 µA

Reference voltage output pin V

ref

V

ref

reference voltage note 11 1.165 1.20 1.235 V

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Input RMS noise

total output RMS noise

low frequency gain

------------------------------------------------------------

=

1999 Nov 03 13

Philips Semiconductors Product specification

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet postamplifiers

TZA3044; TZA3044B

TYPICAL PERFORMANCE CHARACTERISTICS

Fig.10 Total power supply current as function of

junction temperature.

PECL outputs not connected
(1) VCC= 5.5 V.
(2) VCC= 3.0 V.

handbook, halfpage

−40 0 40 120

50

20

10

40

MGR959

30

80

I

CC

(mA)

Tj (°C)

(2)

(1)

Fig.11 Differential output voltage as function of

junction temperature.

handbook, halfpage

1.40

1.16

1.32

1.36

MGR960

−40 0 40 12080
Tj (°C)

1.28

1.24

1.20

V

o(dif)
(V)

V

o(dif)=VDOUT

− V

DOUTQ

.

Fig.12 Differential output voltage as function of

differential input voltage.

handbook, halfpage

1

1.1

1.2

1.3

1.4

MGR961

10

−3

10

−2

10

−1

110

V

i(dif)(p-p)

(V)

V

o(dif)

(V)

V

o(dif)=VDOUT

− V

DOUTQ

.

Fig.13 Differential output rise time and fall time as

function of differential input voltage.

handbook, halfpage

100

140

180

220

260

MGR962

t

(ps)

10

−3

10

−2

10

−1

110

t

r

t

f

V

i(dif)(p-p)

(V)

1999 Nov 03 14

Philips Semiconductors Product specification

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet postamplifiers

TZA3044; TZA3044B

Fig.14 Differential output rise time and fall time as

function of junction temperature.

handbook, halfpage

−40 0 40 120

300

100

0

200

MGR963

80

t

(ps)

Tj (°C)

t

r

t

f

Fig.15 Status detect level as function of I

RSET

.

V

i(dif)=VDIN

− V

DINQ

.
(1) Input high threshold for 1 0 1 0 pattern (pin ST = HIGH).
(2) Input high threshold for 27− 1 PRBS pattern (pin ST = HIGH).
(3) Input low threshold for 1 0 1 0 pattern (pin ST = LOW).
(4) Input low threshold for 27− 1 PRBS pattern (pin ST = LOW).

handbook, halfpage

51525 45

20

10

0

40

MGR964

50

30

35

I

RSET

(µA)

(1)

(2)

(4)

(3)

V

i(dif)

(mV)

Fig.16 Status detect level as function of junction

temperature.

handbook, halfpage

−40 0 40 120

20

10

0

30

MGR965

40

80

Tj (°C)

V

i(dif)

(mV)

(1)

(2)

(3)

(4)

V

i(dif)=VDIN

− V

DINQ

.
(1) Input high threshold for 1 0 1 0 pattern (pin ST = HIGH).
(2) Input high threshold for 27− 1 PRBS pattern (pin ST = HIGH).
(3) Input low threshold for 1 0 1 0 pattern (pin ST = LOW).
(4) Input low threshold for 27− 1 PRBS pattern (pin ST = LOW).

Fig.17 Status detect hysteresis as function of

I

RSET

.

(1) 1 0 1 0 pattern.
(2) 27− 1 PRBS pattern.

handbook, halfpage

6

2

0

4

MGR966

51525 4535

I

RSET

(µA)

hys

(dB)

(2)

(1)

1999 Nov 03 15

Philips Semiconductors Product specification

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet postamplifiers

TZA3044; TZA3044B

Fig.18 Status detect hysteresis as function of

junction temperature.

handbook, halfpage

−40 0 40 120

4

2

1

3

MGR967

80

hys

(dB)

Tj (°C)

(2)

(1)

(1) I

RSET

=45µA.

(2) I

RSET

=10µA.

Fig.19 Status detect ratio as function of I

RSET

.

where V

i(dif)

= input low threshold (pin ST = LOW).

(1) 2

7

− 1 PRBS pattern.

(2) 1 0 1 0 pattern.

Ratio

I

RSET

V

idif()

--------------

=

handbook, halfpage

0.003

0.001

0

0.002

MGR968

51525 4535

I

RSET

(µA)

Ratio
(A/V)

(2)

(1)

Fig.20 Pulse Width Distortion (t

PWD

) as function of

differential input voltage.

handbook, halfpage

0

10

20

30

40

MGR969

10

−3

10

−2

10

−1

110

t

PWD

(ns)

V

i(dif)(p-p)

(V)

Fig.21 V

RSET

as function of junction temperature.

handbook, halfpage

−40 0 40 120

1.555

1.535

1.525

1.545

MGR970

80

Tj (°C)

(2)

(1)

V

RSET

(V)

V

RSET=VCCA

− 1.5 V.
(1) VCC= 5.5 V.
(2) VCC= 3.0 V.

1999 Nov 03 16

Philips Semiconductors Product specification

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet postamplifiers

TZA3044; TZA3044B

Fig.22 Differential output waveform with 4 mV differential input voltage.

handbook, full pagewidth

MGR956

200 mV/div

Fig.23 Differential output waveform with 2 V differential input voltage.

handbook, full pagewidth

MGR957

200 mV/div

1999 Nov 03 17

Philips Semiconductors Product specification

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet postamplifiers

TZA3044; TZA3044B

APPLICATION INFORMATION

Fig.24 Application diagram.

The numbers in brackets refer to the pad numbers of the bare die version.

handbook, full pagewidth

MGR251

(23) 12

DOUTQ

(24) 13

DOUT

1 kΩ

50 Ω 50 Ω

1.5 nF

1.5 nF

100 nF

180 kΩ

TZA3044

(1, 14)

1

(19, 20, 22, 25)

11

SUB

(16)

8

JAM

(17)

9

STQ

(18)

10

ST

(3, 4, 6, 9)

3

AGND

V

CC

6

(11, 12)

V

CCA

16

(30)

RSET

7

(13)

CF

15

(29)

V

ref

14

(27, 28)

V

CCD

DGND

data outdata in

level detect
status

VCC − 2 V

5 (8)

DINQ

4 (7)

DIN

100 nF

1999 Nov 03 18

Philips Semiconductors Product specification

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet postamplifiers

TZA3044; TZA3044B

This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in

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g

ewidth

MGR252

(23) 12

DOUTQ

6

OUT

7

OUTQ

(24) 13

DOUT

1 kΩ

50 Ω 50 Ω

1.5 nF

1.5 nF

100 nF

4 pF

1 µF

noise filter:
1-pole, 800 MHz

100 Ω

61 kΩ

TZA3043T TZA3044

(1, 14)

1

(19, 20, 22, 25)

11

SUB

(16)

8

JAM

(17)

9

STQ

(18)

10

ST

(3, 4, 6, 9)

3

AGND

8

V

CC

V

CC

6

(11, 12)

V

CCA

16

(30)

RSET

7

(13)

CF

15

(29)

V

ref

14

(27, 28)

V

CCD

DGND

data out

level detect
status

VCC − 2 V

5 (8)

DINQ

4 (7)

DIN

3

1

22 nF

680 nF

100 nF

(1) (1) (1)

2

GND4GND5GND

IPhoto

DREF

Fig.25 Gigabit Ethernet receiver using the TZA3043T and TZA3044.

(1) Ferrite bead e.g. Murata BLM10A700S.
The numbers in brackets refer to the pad numbers of the bare die version.

1999 Nov 03 19

Philips Semiconductors Product specification

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet postamplifiers

TZA3044; TZA3044B

This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in

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n

dbook, full pagewidth

MBK999

(23) 12

DOUTQ

6

OUT

7

OUTQ

(24) 13

DOUT

1 kΩ

50 Ω 50 Ω

1.5 nF

1.5 nF

100 nF

8 pF

noise filter:
1-pole, 400 MHz

100 Ω

61 kΩ

TZA3023T TZA3044

(1, 14)

1

(19, 20, 22, 25)

11

SUB

(16)

8

JAM

(17)

9

STQ

(18)

10

ST

(3, 4, 6, 9)

3

AGND

8

V

CC

V

CC

6

(11, 12)

V

CCA

16

(30)

RSET

7

(13)

CF

15

(29)

V

ref

14

(27, 28)

V

CCD

DGND

data out

level detect
status

VCC − 2 V

5 (8)

DINQ

4 (7)

DIN

3

IPhoto

1

DREF

680 nF

100 nF

7.5
pF

1.1
pF

16.4 nH

16.4 nH

optional noise filter:
3-pole, 470 MHz Bessel

(1) (1) (1)

2

GND4GND5GND

Fig.26 STM4/OC12 receiver using the TZA3023T and TZA3044.

(1) Ferrite bead e.g. Murata BLM10A700S.
The numbers in brackets refer to the pad numbers of the bare die version.

1999 Nov 03 20

Philips Semiconductors Product specification

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet postamplifiers

TZA3044; TZA3044B

BONDING PADS

Note

1. The x and y coordinates represent the position of the
centre of the pad with respect to the centre of the die
(see Fig.27).

SYMBOL PAD

COORDINATES

(1)

XY

SUB 1 −235.7 +647.8
TEST 2 −392.8 +647.8
AGND 3 −532.8 +647.8
AGND 4 −647.8 +507.1
n.c. 5 −647.8 +350.0
AGND 6 −647.8 +210.0
DIN 7 −647.8 +70.0
DINQ 8 −647.8 −70.0
AGND 9 −647.8 −210.0
TEST 10 −647.8 −350.0
V

CCA

11 −647.8 −507.1

V

CCA

12 −532.8 −647.8
CF 13 −392.8 −647.8
SUB 14 −235.7 −647.8
TEST 15 −78.6 −647.8
JAM 16 +61.4 −647.8
STQ 17 +218.5 −647.8
ST 18 +375.6 −647.8
DGND 19 +532.7 −647.8
DGND 20 +647.8 −507.1
TEST 21 +647.8 −350.0
DGND 22 +647.8 −210.0
DOUTQ 23 +647.8 −70.0
DOUT 24 +647.8 +70.0
DGND 25 +647.8 +210.0
TEST 26 +647.8 +350.0
V

CCD

27 +647.8 +507.1
V

CCD

28 +532.7 +647.8
V

ref

29 +392.7 +647.8
RSET 30 +235.6 +647.8
n.c. 31 +78.5 +647.8
n.c. 32 −78.6 +647.8

1999 Nov 03 21

Philips Semiconductors Product specification

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet postamplifiers

TZA3044; TZA3044B

Physical characteristics of bare die

PARAMETER VALUE

Glass passivation 2.1 µm PSG (PhosphoSilicate Glass) on top of 0.65 µm oxynitride
Bonding pad dimension minimum dimension of exposed metallization is 90 × 90 µm (pad size = 100 × 100 µm)
Metallization 1.22 µm W/AlCu/TiW
Thickness 380 µm nominal
Size 1.55 × 1.55 mm (2.4 mm

2

)
Backing silicon; electrically connected to GND potential through substrate contacts
Attache temperature <440 °C; recommended die attache is glue
Attache time <15 s

Fig.27 Bonding pad locations of TZA3044U and TZA3044BU.

handbook, full pagewidth

AGND 4

V

CCD

27

TEST

26

DGND

25

DOUT

24

DOUTQ

23

DGND

22

TEST21

DGND

20

AGND

6

DIN

7

DINQ

8

AGND 9

TEST 10

V

CCA

11

n.c.

5

TZA3044U

TZA3044BU

12

V

CCA

3

AGND2TEST1SUB32n.c.31n.c.30RSET29V

ref

28

V

CCD

13CF14

SUB

15

TEST

16

JAM

17

STQ

18ST19

DGND

MGR242

1.55

(1)

mm

1.55

(1)

mm

x

y

0

0

(1) Typical value.

1999 Nov 03 22

Philips Semiconductors Product specification

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet postamplifiers

TZA3044; TZA3044B

PACKAGE OUTLINES

X

w M

θ

A

A

1

A

2

b

p

D

H

E

L

p

Q

detail X

E

Z

e

c

L

v M

A

(A )

3

A

8

9

1

16

y

pin 1 index

UNIT

A

max.

A1A2A

3

b

p

cD

(1)E(1) (1)

eHELLpQZywv θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

1.75

0.25

0.10

1.45

1.25

0.25

0.49

0.36

0.25

0.19

10.0

9.8

4.0

3.8

1.27

6.2

5.8

0.7

0.6

0.7

0.3

8
0

o
o

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.0

0.4

SOT109-1

95-01-23
97-05-22

076E07S MS-012AC

0.069

0.010

0.004

0.057

0.049

0.01

0.019

0.014

0.0100

0.0075

0.39

0.38

0.16

0.15

0.050

1.05

0.041

0.244

0.228

0.028

0.020

0.028

0.012

0.01

0.25

0.01 0.004

0.039

0.016

0 2.5 5 mm

scale

SO16: plastic small outline package; 16 leads; body width 3.9 mm

SOT109-1

1999 Nov 03 23

Philips Semiconductors Product specification

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet postamplifiers

TZA3044; TZA3044B

UNIT A

1

A2A

3

b

p

cD

(1)E(2) (1)

eHELLpQZywv θ

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

5.1

4.9

4.5

4.3

0.65

6.6

6.2

0.4

0.3

0.40

0.06

8
0

o
o

0.13 0.10.21.0

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT403-1 MO-153

94-07-12
95-04-04

w M

b

p

D

Z

e

0.25

18

16

9

θ

A

A

1

A

2

L

p

Q

detail X

L

(A )

3

H

E

E

c

v M

A

X

A

y

0 2.5 5 mm

scale

TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm

SOT403-1

A

max.

1.10

pin 1 index

1999 Nov 03 24

Philips Semiconductors Product specification

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet postamplifiers

TZA3044; TZA3044B

SOLDERING
Introduction to soldering surface mount packages

Thistextgivesaverybriefinsight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not alwayssuitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

Wave soldering

Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackageswithleadsonfoursides,thefootprintmust
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

1999 Nov 03 25

Philips Semiconductors Product specification

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet postamplifiers

TZA3044; TZA3044B

Suitability of surface mount IC packages for wave and reflow soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

PACKAGE

SOLDERING METHOD

WAVE REFLOW

(1)

BGA, SQFP not suitable suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable

(2)

suitable

PLCC

(3)

, SO, SOJ suitable suitable

LQFP, QFP, TQFP not recommended

(3)(4)

suitable

SSOP, TSSOP, VSO not recommended

(5)

suitable

1999 Nov 03 26

Philips Semiconductors Product specification

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet postamplifiers

TZA3044; TZA3044B

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

BARE DIE DISCLAIMER

All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of
ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be separately
indicated in the data sheet. There is no post waffle pack testing performed on individual die. Although the most modern
processes are utilized for wafer sawing and die pick and place into waffle pack carriers, Philips Semiconductors has no
control of third party procedures in the handling, packing or assembly of the die. Accordingly, Philips Semiconductors
assumes no liability for device functionality or performance of the die or systems after handling, packing or assembly of
the die. It is the responsibility of the customer to test and qualify their application in which the die is used.

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

1999 Nov 03 27

Philips Semiconductors Product specification

SDH/SONET STM4/OC12 and

1.25 Gbits/s Gigabit Ethernet postamplifiers

TZA3044; TZA3044B

NOTES

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

1999

68

Philips Semiconductors – a w orldwide compan y

For all other countries apply to: Philips Semiconductors,

International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,

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Belgium: see The Netherlands
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Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
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Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
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Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone], Fax [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

Printed in The Netherlands 465012/100/03/pp28 Date of release: 1999 Nov 03 Document order number: 9397 750 06335