Datasheet TYN612RG Specification

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Page 1

Sensitive and Standard

TN12, TS12 and TYNx12 Series

12 A SCRS

Main features

Symbol Value Unit

T(RMS)

DRM/VRRM

12 A

600 to 1000 V

0.2 to 15 mA

Description

Available either in sensitive (TS12) or standard (TN12 / TYN) gate triggering levels, the 12 A SCR series is suitable to fit all modes of control, found in applications such as overvoltage crowbar protection, motor control circuits in power tools and kitchen aids, inrush current limiting circuits, capacitive discharge ignition and voltage regulation circuits.

Available in through-hole or surface-mount packages, they provide an optimized performance in a limited space area.

DPAK

(TN12-B / TS12-B)

IPAK

(TN12-H / TS12-H)

Order codes

Part Numbers Marking

TN1215-x00B TN1215x00

TN1215-x00B-TR TN1215x00

TN1215-x00G TN1215x00G

PAK

(TN12-G)

TO-220AB

(TYNx12RG)

TN1215-x00G-TR TN1215x00G

TN1215-x00H TN1215x00

TS1220-x00B TS1220x00

TS1220-x00B-TR TS1220x00

TS1220-x00H TS1220x00

TYNx12RG TYNx12

TYNx12TRG TYNx12T

March 2007 Rev 6 1/12

www.st.com

Page 2

Characteristics TN12, TS12 and TYNx12 Series

1 Characteristics

Table 1. Absolute ratings (limiting values)

Value

Symbol Parameter

TN12-G

TYN12

TN12-B/H TS12-B/H

Unit

T(RMS)

T(AV)

TSM

dI/dt

G(AV)

RGM

Table 2. Sentitive electrical characteristics (Tj = 25° C, unless otherwise specified)

RMS on-state current (180° conduction angle) Tc = 105° C 12 A

Average on-state current (180° conduction angle) Tc = 105° C 8 A

= 8.3 ms

Non repetitive surge peak on-state current

tI²t Value for fusing tp = 10 ms Tj = 25° C 98 60 A

Critical rate of rise of on-state current I

= 2 x IGT , tr ≤ 100 ns

= 10 ms 140 110

F = 60 Hz T

= 25° C

= 125° C 50 A/µs

145 115

Peak gate current tp = 20 µs Tj = 125° C 4 A

Average gate power dissipation Tj = 125° C 1 W

Storage junction temperature range

stg

Operating junction temperature range

- 40 to + 150

- 40 to + 125

Maximum peak reverse gate voltage (for TN12 and TYN12 only) 5 V

Symbol Test Conditions TS1220 Unit

RGIRG

dV/dt V

DRM

RRM

VD = 12 V RL = 140 Ω

VD = V

RL = 3.3 kΩ RGK = 220 Ω Tj = 125° C MIN. 0.1 V

DRM

= 10 µA MIN. 8 V

IT = 50 mA RGK = 1 kΩ MAX. 5 mA

IG = 1 mA RGK = 1 kΩ MAX. 6 mA

= 65 % V

RGK = 220 Ω Tj = 125° C MIN. 5 V/µs

DRM

ITM = 24 A tp = 380 µs Tj = 25° C MAX. 1.6 V

Threshold voltage Tj = 125° C MAX. 0.85 V

Dynamic resistance Tj = 125° C MAX. 30 mΩ

Tj = 25° C

DRM

= V

RRM

RGK = 220 Ω

= 125° C 2 mA

MAX. 200 µA

MAX. 0.8 V

5µA

MAX.

° C

2/12

Page 3

TN12, TS12 and TYNx12 Series Characteristics

Table 3. Standard electrical characteristics (Tj = 25° C, unless otherwise specified)

TN1215 TYN

Symbol Test Conditions

B / H G x12T x12

Unit

VD = 12 V RL = 33 Ω

dV/dt V

DRM

RRM

Table 4. Thermal resistance

VD = V

IT = 500 mA Gate open MAX. 40 30 15 30 mA

IG = 1.2 I

= 67 % V

ITM = 24 A tp = 380 µs Tj = 25° C MAX. 1.6 V

Threshold voltage Tj = 125° C MAX. 0.85 V

Dynamic resistance Tj = 125° C MAX. 30 mΩ

DRM

RL = 3.3 kΩ Tj = 125° C MIN. 0.2 V

DRM

Gate open Tj =125° C MIN. 200 40 200 V/µs

DRM

= V

RRM

Tj = 25° C

= 125° C 2 mA

MAX. 15 5 15

MAX. 1.3 V

MAX. 80 60 30 60 mA

5µA

MAX.

Symbol Parameter Value Unit

MIN. 2 0.5 2

th(j-c)

th(j-a)

Junction to case (DC) 1.3 ° C/W

(1)

= 0.5 cm²DPAK 70

(1)

= 1 cm²D2PA K 4 5

Junction to ambient (DC)

IPAK 100

° C/W

1. S = Copper surface under tab

Figure 1. Maximum average power

dissipation versus average on-state current

P(W)

α = 180°

0123456789

I (A)

T(AV)

360°

TO-220AB 60

Figure 2. Average and D.C. on-state current

versus case temperature

I (A)

T(AV)

0 25 50 75 100 125

3/12

D.C.

α = 180°

T (°C)

case

Page 4

Characteristics TN12, TS12 and TYNx12 Series

Figure 3. Average and D.C. on-state current

versus ambient temperature (device mounted on FR4 with recommended pad layout) (DPAK)

I (A)

T(AV)

3.0

2.5

2.0

1.5

α = 180°

1.0

0.5

0.0

0 25 50 75 100 125

D.C.

DPAK

T (°C)

amb

Figure 5. Relative variation of thermal

impedance junction to ambient versus pulse duration (recommended pad layout, FR4 PC board for DPAK)

K=[Z /R

1.00

0.10

0.01

th(j-a) th(j-a)

1E-2 1E-1 1E+0 1E+1 1E+2 5E+2

]

DPAK

t (s)

TO-220AB / IPAK

Figure 4. Relative variation of thermal

impedance junction to case versus pulse duration

K=[Z /R

th(j-c) th(j-c)

1.0

0.5

0.2

0.1 1E-3 1E-2 1E-1 1E+0

]

t (s)

Figure 6. Relative variation of gate trigger

current and holding current versus junction temperature for TS12 series

I,I,I[T] /

GTHL j

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

-40 -20 0 20 40 60 80 100 120 140

I ,I ,I [T =25°C]

GT H L j

T (°C)

IH& I

R = 1k

Figure 7. Relative variation of gate trigger

current and holding current versus junction temperature for TN12 and TYNx12 series

I,I,I[T] /

GT H L j

2.4

2.2

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

-40 -20 0 20 40 60 80 100 120 140

4/12

I ,I ,I [T =25°C]

GT H L j

T (°C)

IH& I

Figure 8. Relative variation of holding

current versus gate-cathode resistance (typical values) for TS12 series

I [R ] / I [ =1k ]

HGK HΩRGK

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0 1E-2 1E-1 1E+0 1E+1

R(k)GKΩ

Tj= 25°C

Page 5

TN12, TS12 and TYNx12 Series Characteristics

Figure 9. Relative variation of dV/dt immunity

versus gate-cathode resistance (typical values) for TS12 series

dV/dt[R ] / dV/dt[ =220 ]

10.0

1.0

0.1

0 200 400 600 800 1000 1200

ΩR

R(k)GKΩ

Tj= 125°C

V = 0.67 x V

D DRM

Figure 11. Surge peak on-state current versus

number of cycles

I (A)

TSM

150 140 130 120 110 100

90 80 70 60 50 40 30 20 10

1 10 100 1000

TS12

Repetitive T =105°C

TN12 / TYN12

Non repetitive T initial=25°C

Number of cycles

t =10ms

One cycle

Figure 10. Relative variation of dV/dt immunity

versus gate-cathode capacitance (typical values) for TS12 series

dV/dt[C ] / dV/dt[ =220 ]GKΩR

4.0

V = 0.67 x V

D DRM

= 125°C

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

0 25 50 75 100 125 150

R = 220

C (nF)

Figure 12. Non-repetitive surge peak on-state

current for a sinusoidal pulse with width tp < 10 ms, and corresponding values of I²t

TSM

dI/dt limitation

TSM

t (ms)

TS12

I t

TN12 / TYN12

T initial = 25°C

TS12

I (A), I t (A s)

2000

1000

100

0.01 0.10 1.00 10.00

Figure 13. On-state characteristics (maximum

values)

I (A)

200

T max.:

V =0.85V

100

R =30m

Tj=max

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

T =25°C

V (V)

Figure 14. Thermal resistance junction to

ambient versus copper surface under tab (epoxy printed circuit board FR4, copper thickness: 35 µm) (DPAK and D

R (°C/W)

th(j-a)

100

0 2 4 6 8 101214161820

5/12

DPAK

S(cm²)

PAK )

Page 6

Ordering information scheme TN12, TS12 and TYNx12 Series

2 Ordering information scheme

Figure 15. TN12 series

TN 12 15 - 600 B (-TR)

Standard SCR series

Current

12 = 12 A

Sensitivity

15 = 15 mA

Voltage

600 = 600 V 800 = 800 V

1000 = 1000 V

Packag e

B = DPAK

G = D PAK H = IPAK

Packing mode

Blanck = Tube

-TR = Tape and Reel (DPAK and

Figure 16. TS12 series

D PAK)

Sensitive SCR series

Current

12 = 12 A

Sensitivity

20 = 200 µA

Voltage

600 = 600 V 700 = 700 V

Packag e

B = DPAK H = IPAK

Packing mode

Blanck = Tube

-TR = Tape and Reel

Figure 17. TYNx12 series

Standard SCR series

Voltage

10 = 1000 V

Current

12 = 12 A

Sensitivity

Blanck = 15 mA T = 5 mA

Packing mode

RG = Tube

6 = 600 V 8 = 800 V

TS 12 20 - 600 B (-TR)

TYN 6 12 T RG

6/12

Page 7

TN12, TS12 and TYNx12 Series Package information

Table 5. Product selector

Voltage (xxx)

Part Numbers

Sensitivity Package

600 V 700 V 800 V 1000 V

TN1215-xxxB X X 15 mA DPAK

TN1215-xxxG X X 15 mA D

PA K

TN1215-xxxH X X 15 mA IPAK

TS1220-xxxB X X 0.2 mA DPAK

TS1220-xxxH X 0.2 mA IPAK

TYNx12 X X X 15 mA TO-220AB

TYNx12T X X X 5 mA TO-220AB

3 Package information

● Epoxy meets UL94, V0

Table 6. TO-220AB dimensions

Dimensions

Ref.

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 15.20 15.90 0.598 0.625

Ø I

a1 3.75 0.147

a2 13.00 14.00 0.511 0.551

B 10.00 10.40 0.393 0.409

b1 0.61 0.88 0.024 0.034

b2 1.23 1.32 0.048 0.051

C 4.40 4.60 0.173 0.181

c1 0.49 0.70 0.019 0.027

c2 2.40 2.72 0.094 0.107

e 2.40 2.70 0.094 0.106

F 6.20 6.60 0.244 0.259

ØI 3.75 3.85 0.147 0.151

I4 15.80 16.40 16.80 0.622 0.646 0.661

L 2.65 2.95 0.104 0.116

l2 1.14 1.70 0.044 0.066

l3 1.14 1.70 0.044 0.066

M2.60 0.102

7/12

Page 8

Package information TN12, TS12 and TYNx12 Series

Table 7. IPAK dimensions

Dimensions

Ref.

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 2.20 2.40 0.086 0.094

A1 0.90 1.10 0.035 0.043

A3 0.70 1.30 0.027 0.051

B 0.64 0.90 0.025 0.035

B2 5.20 5.40 0.204 0.212

B3 0.95 0.037

B5 0.30 0.035

C 0.45 0.60 0.017 0.023

C2 0.48 0.60 0.019 0.023

D 6 6.20 0.236 0.244

E 6.40 6.60 0.252 0.260

e2.28 0.090

G 4.40 4.60 0.173 0.181

H 16.10 0.634

L 9 9.40 0.354 0.370

L1 0.8 1.20 0.031 0.047

L2 0.80 1 0.031 0.039

8/12

V1 10° 10°

Page 9

TN12, TS12 and TYNx12 Series Package information

Table 8. DPAK dimensions

Dimensions

Ref.

Min. Max. Min. Max.

A 2.20 2.40 0.086 0.094

A1 0.90 1.10 0.035 0.043

A2 0.03 0.23 0.001 0.009

B 0.64 0.90 0.025 0.035

B2 5.20 5.40 0.204 0.212

C 0.45 0.60 0.017 0.023

C2 0.48 0.60 0.018 0.023

D 6.00 6.20 0.236 0.244

E 6.40 6.60 0.251 0.259

0.60 MIN.

G 4.40 4.60 0.173 0.181

H 9.35 10.10 0.368 0.397

L2 0.80 typ. 0.031 typ.

L4 0.60 1.00 0.023 0.039

V2 0° 8° 0° 8°

Figure 18. DPAK footprint dimensions (in millimeters)

Millimeters Inches

6.7

6.7 3 3

1.6

2.3

1.6

9/12

Page 10

Package information TN12, TS12 and TYNx12 Series

Table 9. D

PAK dimensions

2mm min. FLAT ZONE

Dimensions

Ref.

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 4.30 4.60 0.169 0.181

A1 2.49 2.69 0.098 0.106

A2 0.03 0.23 0.001 0.009

B 0.70 0.93 0.027 0.037

B2 1.25 1.40 0.048 0.055

C 0.45 0.60 0.017 0.024

C2 1.21 1.36 0.047 0.054

D 8.95 9.35 0.352 0.368

E 10.00 10.28 0.393 0.405

G 4.88 5.28 0.192 0.208

L 15.00 15.85 0.590 0.624

L2 1.27 1.40 0.050 0.055

L3 1.40 1.75 0.055 0.069

R 0.40 0.016

V2 0° 8° 0° 8°

Figure 19. D2PAK footprint dimensions (in millimeters)

16.90

10.30

8.90

3.70

5.08

1.30

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

10/12

Page 11

TN12, TS12 and TYNx12 Series Ordering information

4 Ordering information

Ordering type

(1)

Marking

TN1215-x00B TN1215x00 DPAK 0.3 g 75 Tube

TN1215-x00B-TR TN1215x00 DPAK 0.3 g 2500 Tape and reel

TN1215-x00G TN1215x00G D

TN1215-x00G-TR TN1215x00G D

TN1215-x00H TN1215x00 IPAK 0.3 g 75 Tube

TS1220-x00B TS1220x00 DPAK 0.3 g 75 Tube

TS1220-x00B-TR TS1220x00 DPAK 0.3 g 2500 Tape and reel

TS1220-x00H TS1220x00 IPAK 0.3 g 75 Tube

TYNx12RG TYNx12 TO-220AB 2.3 g 50 Tube

TYNx12TRG TYNx12T TO-220AB 2.3 g 50 Tube

1. x (6, 7, 8, 10) depends upon voltage

(1)

Package Weight Base qty Delivery mode

PAK 1.5 g 50 Tube

PAK 1.5 g 1000 Tape and reel

5 Revision history

Date Revision Description of Changes

Sep-2000 3 Last update.

25-Mar-2005 4 TO-220AB delivery mode changed from bulk to tube.

14-Oct-2005 5

08-Mar-2007 6

Changed sensitivity values in Ta bl e 5 for TYNx12 (30 to 15 mA) and TYNx12T ( 15 to 5 mA). Added ECOPACK statement.

Reformatted to current standard.

Figure 15: TN12 series product name corrected. Figure 16: TS12 series product name corrected.

11/12

Page 12

TN12, TS12 and TYNx12 Series

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