Datasheet TP3070V-XG, TP3070V-G, TP3070AV-XG, TP3070AV-G Datasheet (NATIONAL SEMICONDUCTOR)

Page 1
TP3070, TP3071, TP3070-X COMBO
®
II Programmable PCM CODEC/Filter
General Description
The TP3070 and TP3071 are second-generation combined PCM CODEC and Filter devices optimized for digital switch­ing applications on subscriber line and trunk cards. Using advanced switched capacitor techniques, COMBO II com­bines transmit bandpass and receive lowpass channel filters with a companding PCM encoder and decoder. The devices are A-law and µ-law selectable and employ a conventional serial PCM interface capable of being clocked up to
4.096 MHz. A number of programmable functions may be controlled via a serial control port.
Channel gains are programmable over a 25.4 dB range in each direction, and a programmable filter is included to en­able Hybrid Balancing to be adjusted to suit a wide range of loop impedance conditions. Both transformer and active SLIC interface circuits with real or complex termination im­pedances can be balanced by this filter, with cancellation in excess of 30 dB being readily achievable when measured across the passband against standard test termination net­works.
To enable COMBO II to interface to the SLIC control leads, a number of programmable latches are included; each may be configured as either an input or an output. The TP3070 pro­vides 6 latches and the TP3071 5 latches.
Features
n Complete CODEC and FILTER system including:
— Transmit and receive PCM channel filters — µ-law or A-law companding encoder and decoder — Receive power amplifier drives 300 — 4.096 MHz serial PCM data (max)
n Programmable Functions:
— Transmit gain: 25.4 dB range, 0.1 dB steps — Receive gain: 25.4 dB range, 0.1 dB steps — Hybrid balance cancellation filter — Time-slot assignment; up to 64 slots/frame — 2 port assignment (TP3070) — 6 interface latches (TP3070) — A or µ-law — Analog loopback — Digital loopback
n Direct interface to solid-state SLICs n Simplifies transformer SLIC; single winding secondary n Standard serial control interface n 80 mW operating power (typ) n 1.5 mW standby power (typ) n Designed for CCITT and LSSGR applications n TTL and CMOS compatible digital interfaces n Extended temperature versions available for −40˚C to
+85˚C (TP3070V-X)
Note: See also AN-614, COMBO II application guide.
COMBO®and TRI-STATE®are registered trademarks of National SemiconductorCorporation.
April 1994
TP3070, TP3071, TP3070-X COMBO II Programmable PCM CODEC/Filter
© 1999 National Semiconductor Corporation DS008635 www.national.com
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Block Diagram
Connection Diagrams
Pin Descriptions
Pin Description
V
CC
+5V±5%power supply.
V
BB
−5V±5%power supply.
GND Ground. All analog and digital signals are
referenced to this pin.
FS
X
Transmit Frame Sync input. Normally a pulse or squarewave with an 8 kHz repetition rate is applied to this input to define the start of the transmit time slot assigned to this device (non-delayed data timing mode), or the start of the transmit frame (delayed data timing mode using the internal time-slot assignment counter).
DS008635-1
FIGURE 1.
DS008635-4
Order Number TP3070V
(0˚C to +70˚C)
Order Number TP3070V-X
(−40˚C to +85˚C)
See NS Package Number V28A
DS008635-2
Order Number TP3071J
See NS Package Number J20A
Order Number TP3071N
See NS Package Number N20A
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Pin Descriptions (Continued)
Pin Description
FS
R
Receive Frame Sync input. Normally a pulse or squarewave with an 8 kHz repetition rate is applied to this input to define the start of the receive time slot assigned to this device (non-delayed data timing mode), or the start of the receive frame (delayed data timing mode using the internal time-slot assignment counter).
BCLK Bit clock input used to shift PCM data into and
out of the D
R
and DXpins. BCLK may vary from 64 kHz to 4.096 MHz in 8 kHz increments, and must be synchronous with MCLK.
MCLK Master clock input used by the switched
capacitor filters and the encoder and decoder sequencing logic. Must be 512 kHz, 1.536 MHz, 1.544 MHz, 2.048 MHz or 4.096 MHz and synchronous with BCLK.
VF
X
I The Transmit analog high-impedance input.
Voice frequency signals present on this input are encoded as an A-law or µ-law PCM bit stream and shifted out on the selected D
X
pin.
VF
R
O The Receive analog power amplifier output,
capable of driving load impedances as low as 300(depending on the peak overload level required). PCM data received on the assigned D
R
pin is decoded and appears at this output
as voice frequency signals.
D
X
0
D
X
1
D
X
1 is available on the TP3070 only; DX0is available on all devices. These Transmit Data TRI-STATE
®
outputs remain in the high impedance state except during the assigned transmit time slot on the assigned port, during which the transmit PCM data byte is shifted out on the rising edges of BCLK.
TS
X
0
TSX1
TSX1 is available on the TP3070 only; TSX0is available on all devices. Normally these open-drain outputs are floating in a high impedance state except when a time-slot is active on one of the D
X
outputs, when the
appropriate TS
X
output pulls low to enable a
backplane line-driver.
D
R
0
D
R
1
D
R
1 is available on the TP3070 only; DR0is available on all devices. These receive data inputs are inactive except during the assigned receive time slot of the assigned port when the receive PCM data is shifted in on the falling edges of BCLK.
CCLK Control Clock input. This clock shifts serial
control information into or out from CI/O or CI and CO when the CS input is low, depending on the current instruction. CCLK may be asynchronous with the other system clocks.
Pin Description
CI/O This is the Control Data I/O pin which is
provided on the TP3071. Serial control information is shifted to or read from COMBO II on this pin when CS is low. The direction of the data is determined by the current instruction as defined in
Table 1
.
CI This is a separate Control Input, available only
on the TP3070. It can be connected to CO if required.
CO This is a separate Control Output, available
only on the TP3070. It can be connected to CI if required.
CS
Chip Select input. When this pin is low, control information can be written to or read from COMBO II via the CI/O pin (or CI and CO).
IL5–IL0 IL5 through IL0 are available on the TP3070.
IL4 through IL0 are available on the TP3071. Each Interface Latch I/O pin may be individually programmed as an input or an output determined by the state of the corresponding bit in the Latch Direction Register (LDR). For pins configured as inputs, the logic state sensed on each input is latched into the Interface Latch Register (ILR) whenever control data is written to COMBO II, while CS is low, and the information is shifted out on the CO (or CI/O) pin. When configured as outputs, control data written into the ILR appears at the corresponding IL pins.
MR This logic input must be pulled low for normal
operation of COMBO II. When pulled momentarily high (at least 1 µsec.), all programmable registers in the device are reset to the states specified under “Power-On Initialization”.
NC No Connection. Do not connect to this pin. Do
not route traces through this pin.
Functional Description
POWER-ON INITIALIZATION
When power is first applied, power-on reset circuitry initial­izes the COMBO II and puts it into the power-down state. The gain control registers for the transmit and receive gain sections are programmed to OFF (00000000), the hybrid balance circuit is turned off, the power amp is disabled and the device is in the non-delayed timing mode. The Latch Di­rection Register (LDR) is pre-set with all IL pins programmed as inputs, placing the SLIC interface pins in a high imped­ance state. The CI/O pin is set as an input ready for the first control byte of the initialization sequence. Other initial states in the Control Register are indicated in Section 2.0.
Areset to these same initial conditions may also be forced by driving the MR pin momentarily high. This may be done ei­ther when powered-up or down. For normal operation this pin must be pulled low.If not used, MR should be hard-wired to ground.
The desired modes for all programmable functions may be initialized via the control port prior to a Power-up command.
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Functional Description (Continued)
POWER-DOWN STATE
Following a period of activity in the powered-up state the power-down state may be re-entered by writing any of the control instructions into the serial control port with the “P” bit set to “1” as indicated in
Table1
. It is recommended that the chip be powered down before writing any additional instruc­tions. In the power-down state, all non-essential circuitry is de-activated and the D
X
0 (and DX1) outputs are in the high
impedance TRI-STATE condition. The coefficients stored in the Hybrid Balance circuit and the
Gain Control registers, the data in the LDR and ILR, and all control bits remain unchanged in the power-down state un­less changed by writing new data via the serial control port, which remains active. The outputs of the Interface Latches also remain active, maintaining the ability to monitor and control the SLIC.
TRANSMIT FILTER AND ENCODER
The Transmit section input, VF
X
I, is a high impedance sum­ming input which is used as the differencing point for the in­ternal hybrid balance cancellation signal. No external com­ponents are necessary to set the gain. Following this circuit is a programmable gain/attenuation amplifier which is con­trolled by the contents of the Transmit Gain Register (see Programmable Functions section). An active pre-filter then precedes the 3rd order high-pass and 5th order low-pass switched capacitor filters. The A/D converter has a com­pressing characteristic according to the standard CCITT A or µ255 coding laws, which must be selected by a control in­struction during initialization (see
Table1
and
Table2
).A pre­cision on-chip voltage reference ensures accurate and highly stable transmission levels. Any offset voltage arising in the gain-set amplifier,the filters or the comparator is canceled by an internal auto-zero circuit.
Each encode cycle begins immediately following the as­signed Transmit time-slot. The total signal delay referenced to the start of the time-slot is approximately 165 µs (due to the Transmit Filter) plus 125 µs (due to encoding delay), which totals 290 µs. Data is shifted out on D
X
0orDX1 during
the selected time slot on eight rising edges of BCLK.
DECODER AND RECEIVE FILTER
PCM data is shifted into the Decoder’s Receive PCM Regis­ter via the D
R
0orDR1 pin during the selected time-slot on the 8 falling edges of BCLK. The Decoder consists of an ex­panding DAC with either A or µ255 law decoding character­istic, which is selected by the same control instruction used to select the Encode law during initialization. Following the Decoder is a 5th order low-pass switched capacitor filter with integral Sin x/x correction for the 8 kHz sample and hold. A programmable gain amplifier, which must be set by writing to the Receive Gain Register, is included, and finally a Power Amplifier capable of driving a 300load to
±
3.5V, a 600
load to
±
3.8V or a 15 kload to±4.0V at peak overload.
A decode cycle begins immediately after the assigned re­ceive time-slot, and 10 µs later the Decoder DAC output is updated. The total signal delay is 10 µs plus 120 µs (filter de­lay) plus 62.5 µs (
1
⁄2frame) which gives approximately 190
µs.
PCM INTERFACE
The FS
X
and FSRframe sync inputs determine the begin­ning of the 8-bit transmit and receive time-slots respectively. They may have any duration from a single cycle of BCLK HIGH to one MCLK period LOW. Two different relationships may be established between the frame sync inputs and the actual time-slots on the PCM busses by setting bit 3 in the Control Register (see
Table 2
). Non-delayed data mode is similar to long-frame timing on the TP3050/60 series of de­vices (COMBO); time-slots begin nominally coincident with the rising edge of the appropriate FS input. The alternative is to use Delayed Data mode, which is similar to short-frame sync timing on COMBO, in which each FS input must be high at least a half-cycle of BCLK earlier than the time-slot. The Time-SlotAssignment circuit on the device can only be used with Delayed Data timing.
When using Time-SlotAssignment, the beginning of the first time-slot in a frame is identified by the appropriate FS input. The actual transmit and receive time-slots are then deter­mined by the internal Time-Slot Assignment counters.
X
0/1 output shifts data out from the PCM register on the rising edges of BCLK. TS
X
0 (or TSX1 as appropriate) also pulls low for the first 71⁄
2
bit times of the time-slot to control the TRI-STATE Enable of a backplane line-driver. Serial PCM data is shifted into the selected D
R
0/1 input during each assigned Receive time-slot
on the falling edges of BCLK. D
X
0orDX1 and DR0orDR1
are selectable on the TP3070 only, see Section 6.
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Functional Description (Continued)
TABLE 1. Programmable Register Instructions
Function Byte 1 (Note 1) Byte 2 (Note 1)
76543210 76543210
Single Byte Power-Up/Down PXXXXX0X None Write Control Register P 000001X See
Table 2
Read-Back Control Register P 000011X See
Table 2
Write to Interface Latch Register P 000101X See
Table 4
Read Interface Latch Register P 000111X See
Table 4
Write Latch Direction Register P 001001X See
Table 3
Read Latch Direction Register P 001011X See
Table 3
Write Receive Gain Register P 010001X See
Table 8
Read Receive Gain Register P 010011X See
Table 8
Write Transmit Gain Register P 010101X See
Table 7
Read Transmit Gain Register P 010111X See
Table 7
Write Receive Time-Slot/Port P 100101X See
Table 6
Read-Back Receive Time-Slot/Port P 100111X See
Table 6
Write Transmit Time-Slot/Port P 101001X See
Table 6
Read-Back Transmit Time-Slot/Port P 101011X See
Table 6
Write Hybrid Balance Register 1 P 011001X
Derive from
Optimization
Routine in
TP3077SW
Program
Read Hybrid Balance Register 1 P 011011X Write Hybrid Balance Register 2 P 011101X Read Hybrid Balance Register 2 P 011111X Write Hybrid Balance Register 3 P 100001X Read Hybrid Balance Register 3 P 100011X
Note 1: Bit 7 of bytes 1 and 2 is always the first bit clocked into or out from the CI, CO or CI/O pin. X=don’t care. Note 2: “P” is the power-up/down control bit, see “Power-Up/Down Control” section. (“0”=Power Up, “1”=Power Down) Note 3: Other register address codes are invalid and should not be used.
SERIAL CONTROL PORT
Control information and data are written into or read-back from COMBO II via the serial control port consisting of the control clock CCLK, the serial data input/output CI/O, (or separate input, CI, and output, CO, on the TP3070 only), and the Chip Select input, CS. All control instructions require 2 bytes, as listed in
Table1
, with the exception of a single byte power-up/down command. The byte 1 bits are used as fol­lows: bit 7 specifies power up or power down; bits 6, 5, 4 and 3 specify the register address; bit 2 specifies whether the in­struction is read or write; bit 1 specifies a one or two byte in­struction; and bit 0 is not used.
To shift control data into COMBO II, CCLK must be pulsed 8 times while CS is low. Data on the CI/O (or CI) input is shifted into the serial input register on the falling edge of each CCLK pulse. After all data is shifted in, the contents of the input shift register are decoded, and may indicate that a 2nd byte of control data will follow. This second byte may ei­ther be defined by a second byte-wide CS pulse or may fol­low the first contiguously, i.e. it is not mandatory for CS to re­turn high between the first and second control bytes. At the end of CCLK8 in the 2nd control byte the data is loaded into the appropriate programmable register. CS may remain low continuously when programming successive registers, if de­sired. However, CS should be set high when no data trans­fers are in progress.
To readback Interface Latch data or status information from COMBO II, the first byte of the appropriate instruction is
strobed in while CS is low, as defined in
Table1
. CS must be kept low, or be taken low again for a further 8 CCLK cycles, during which the data is shifted onto the CO or CI/O pin on the rising edges of CCLK. When CS is high the CO or CI/O pin is in the high-impedance TRI-STATE, enabling the CI/O pins of many devices to be multiplexed together.
If CS returns high during either byte 1 or byte 2 before all eight CCLK pulses of that byte occur, both the bit count and byte count are reset and register contents are not affected. This prevents loss of synchronization in the control interface as well as corruption of register data due to processor inter­rupt or other problem. When CS returns low again, the de­vice will be ready to accept bit 1 of byte 1 of a new instruc­tion.
Programmable Functions
1.0 POWER-UP/DOWN CONTROL
Following power-on initialization, power-up and power-down control may be accomplished by writing any of the control in­structions listed in
Table1
into COMBO II with the “P” bit set to “0” for power-up or “1” for power-down. Normally it is rec­ommended that all programmable functions be initially pro­grammed while the device is powered down. Power state control can then be included with the last programming in­struction or the separate single-byte instruction. Any of the programmable registers may also be modified while the de-
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Programmable Functions (Continued)
When a power-up command is given, all de-activated circuits are activated, but the TRI-STATE PCM output(s), D
X
0 (and
D
X
1), will remain in the high impedance state until the sec-
ond FS
X
pulse after power-up.
2.0 CONTROL REGISTER INSTRUCTION
The first byte of a READ or WRITE instruction to the Control Register is as shown in
Table1
. The second byte has the fol-
lowing bit functions:
TABLE 2. Control Register Byte 2 Functions
Bit Number and Name
76 5 43210 Function
F
1F0
MA IA DN DL AL PP
0 0 MCLK=512 kHz 0 1 MCLK=1.536
or 1.544 MHz
1 0 MCLK=2.048 MHz
(Note 4)
1 1 MCLK=4.096 MHz
0 X Select µ-255 law (Note 4) 1 0 A-law, Including Even
Bit Inversion
1 1 A-law, No Even Bit Inversion
0 Delayed Data Timing 1 Non-Delayed Data
Timing (Note 4)
0 0 Normal Operation
(Note 4) 1 X Digital Loopback 0 1 Analog Loopback
0 Power Amp Enabled in PDN 1 Power Amp Disabled in
PDN (Note 4)
Note 4: State at power-on initialization. (Bit 4=0)
2.1 Master Clock Frequency Selection
A Master clock must be provided to COMBO II for operation of the filter and coding/decoding functions. The MCLK fre­quency must be either 512 kHz, 1.536 MHz, 1.544 MHz,
1
and F0(see
Table2
) must be set during initial-
ization to select the correct internal divider.
2.2 Coding Law Selection
Bits “MA” and “IA” in
Table 2
permit the selection of µ255
coding or A-law coding, with or without even bit inversion.
2.3 Analog Loopback
Analog Loopback mode is entered by setting the “AL” and “DL” bits in the Control Register as shown in
Table 2
.Inthe
analog loopback mode, the Transmit input VF
X
I is isolated
from the input pin and internally connected to the VF
R
O out­put, forming a loop from the Receive PCM Register back to the Transmit PCM Register. The VF
R
O pin remains active,
and the programmed settings of the Transmit and Receive
gains remain unchanged, thus care must be taken to ensure that overload levels are not exceeded anywhere in the loop. Hybrid balance must be disabled for meaningful analog loop­back function.
2.4 Digital Loopback
Digital Loopback mode is entered by setting the “AL” and “DL” bits in the Control Register as shown in
Table 2
. This mode provides another stage of path verification by enabling data written into the Receive PCM Register to be read back from that register in any Transmit time-slot at D
X
0/1. In digital loopback, the decoder will remain functional and output a signal at VF
R
O. If this is undesirable, the receive output can be turned off by programming the receive gain register to all zeros.
3.0 INTERFACE LATCH DIRECTIONS
Immediately following power-on, all Interface Latches as­sume they are inputs, and therefore all IL pins are in a high impedance state. Each IL pin may be individually pro­grammed as a logic input or output by writing the appropriate instruction to the LDR, see
Table 1
and
Table 3
. For mini­mum power dissipation, unconnected latch pins should be programmed as outputs. For the TP3071, L5 should always be programmed as an output.
Bits L
5–L0
must be set by writing the specified instruction to
the LDR with the L bits in the second byte set as follows:
TABLE 3. Byte 2 Functions of Latch Direction Register
Byte 2 Bit Number
76543210
L
0
L1L2L3L4L5XX
LnBit IL Direction
0 Input 1 Output
X=don’t care
INTERFACE LATCH STATES
Interface Latches configured as outputs assume the state determined by the appropriate data bit in the 2-byte instruc­tion written to the Interface Latch Register (ILR) as shown in
Table1
and
Table4
. Latches configured as inputs will sense the state applied by an external source, such as the Off-Hook detect output of a SLIC. All bits of the ILR, i.e. sensed inputs and the programmed state of outputs, can be read back in the 2nd byte of a READ from the ILR.
It is recommended that during initialization, the state of IL pins to be configured as outputs should be programmed first, followed immediately by the Latch Direction Register.
TABLE 4. Interface Latch Data Bit Order
Bit Number
76543210
D
0
D1D2D3D4D5XX
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Programmable Functions (Continued)
TABLE 5. Coding Law Conventions
µ255 law
True A-law with A-law without
even bit inversion even bit inversion
MSB LSB MSB LSB MSB LSB
V
IN
=
+Full Scale 10000000 10101010 11111111
V
IN
=
0V 11111111 11010101 10000000
01111111 01010101 00000000
V
IN
=
−Full Scale 00000000 00101010 01111111
Note 5: The MSB is always the first PCM bit shifted in or out of COMBO II.
TABLE 6. Time-Slot and Port Assignment Instruction
Bit Number and Name Function
7 6 5 43210
EN PS T
5
T
4
T
3
T
2
T
1
T
0
(Note 6) (Note 7)
0 0 X XXXXXDisable D
X
0 Output (Transmit Instruction)
Disable D
R
0 Input (Receive Instruction)
0 1 X XXXXXDisable D
X
1 Output (Transmit Instruction)
Disable D
R
1 Input (Receive Instruction)
1 0 Assign One Binary Coded Time-Slot from 0–63 Enable D
X
0 Output (Transmit Instruction)
Assign One Binary Coded Time-Slot from 0–63 Enable D
R
0 Input (Receive Instruction)
1 1 Assign One Binary Coded Time-Slot from 0–63 Enable D
X
1 Output (Transmit Instruction)
Assign One Binary Coded Time-Slot from 0–63 Enable D
R
1 Input (Receive Instruction)
Note 6: The “PS” bit MUST always be set to 0 for the TP3071. Note 7: T5 is the MSB of the Time-slot assignment bit field. Time slot bits should be set to “000000” for both transmit and receive when operating in non-delayed
data timing mode.
5.0 TIME-SLOT ASSIGNMENT
COMBO II can operate in either fixed time-slot or time-slot assignment mode for selecting the Transmit and Receive PCM time-slots. Following power-on, the device is automati­cally in Non-Delayed Timing mode, in which the time-slot al­ways begins with the leading (rising) edge of frame sync in­puts FS
X
and FSR. Time-Slot Assignment may only be used
with Delayed Data timing; see
Figure 5
.FSXand FSRmay have any phase relationship with each other in BCLK period increments.
Alternatively, the internal time-slot assignment counters and comparators can be used to access any time-slot in a frame, using the frame sync inputs as marker pulses for the begin­ning of transmit and receive time-slot 0. In this mode, a frame may consist of up to 64 time-slots of 8 bits each. A time-slot is assigned by a 2-byte instruction as shown in
Table 1
and
Table 6
. The last 6 bits of the second byte indi­cate the selected time-slot from 0–63 using straight binary notation. When writing a timeslot and port assignment regis­ter, if the PCM interface is currently active, it is immediately deactivated to prevent possible bus clashes. A new assign­ment becomes active on the second frame following the end of the Chip-Select for the second control byte. Rewriting of register contents should not be performed during the talking period of a connection to prevent waveform distortion caused by loss of a sample which will occur with each regis­ter write. The “EN” bit allows the PCM inputs, D
R
0/1, or out-
puts, D
X
0/1, as appropriate, to be enabled or disabled.
Time-Slot Assignment mode requires that the FS
X
and FS
R
pulses must conform to the delayed data timing format shown in
Figure 5
.
6.0 PORT SELECTION
On the TP3070 only, an additional capability is available; 2 Transmit serial PCM ports, D
X
0 and DX1, and 2 Receive se-
rial PCM ports, D
R
0 and DR1, are provided to enable two-way space switching to be implemented. Port selections for transmit and receive are made within the appropriate time-slot assignment instruction using the “PS” bit in the sec­ond byte. The PS bit selects either Port 0 or Port 1. Both ports cannot be active at the same time.
On the TP3071, only ports D
X
0 and DR0 are available, there-
fore the “PS” bit MUST always be set to 0 for these devices.
Table 6
shows the format for the second byte of both trans-
mit and receive time-slot and port assignment instructions.
7.0 TRANSMIT GAIN INSTRUCTION BYTE 2
The transmit gain can be programmed in 0.1 dB steps by writing to the Transmit Gain Register as defined in
Table 1
and
Table7
. This corresponds to a range of 0 dBm0 levels at
VF
X
I between 1.619 Vrms and 0.087 Vrms (equivalent to
+6.4 dBm to −19.0 dBm in 600). To calculate the binary code for byte 2 of this instruction for
any desired input 0 dBm0 level in Vrms, take the nearest in­teger to the decimal number given by:
200 x log
10
(V/0.08595)
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Programmable Functions (Continued)
and convert to the binary equivalent. Some examples are given in
Table7
and a complete tabulation is given in Appen-
dix I of AN-614. It should be noted that the Transmit (idle channel) Noise and
Transmit Signal to Total Distortion are both specified with transmit gain set to 0 dB (Gain Register set to all ones). At high transmit gains there will be some degradation in noise performance for these parameters. See Application Note AN-614 for more information on this subject.
TABLE 7. Byte 2 of Transmit Gain Instruction
Bit Number 0 dBm0 Test Level (Vrms)
76543210 atVF
X
I
00000000 NoOutput (Note 8) 00000001 0.087 00000010 0.088
—— 11111110 1.600 11111111 1.619
Note 8: Analog signal path is cut off, but DXremains active and will output codes representing idle noise.
8.0 RECEIVE GAIN INSTRUCTION BYTE 2
The receive gain can be programmed in 0.1 dB steps by writ­ing to the Receive Gain Register as defined in
Table 1
and
Table8
. Note the following restrictions on output drive capa-
bility: a) 0 dBm0 levels 1.96 Vrms at VF
R
O may be driven into a load of 15 kto GND; receive gain set to 0 dB (Gain Register set to all ones)
b) 0 dBm0 levels 1.85 Vrms at VF
R
O may be driven into a load of 600to GND; receive gain set to −0.5 dB
c) 0 dBm0 levels 1.71 Vrms at VF
R
O may be driven into a load of 300to GND; receive gain set to −1.2 dB
To calculate the binary code for byte 2 of this instruction for any desired output 0 dBm0 level in Vrms, take the nearest in­teger to the decimal number given by:
200 x log
10
(V/0.1043)
and convert to the binary equivalent. Some examples are given in
Table8
and a complete tabulation is given in Appen-
dix I of AN-614.
TABLE 8. Byte 2 of Receive Gain Instruction Bit Number 0 dBm0 Test Level (Vrms)
76543210 atVF
R
O
00000000 NoOutput (Low Z to GND) 00000001 0.105 00000010 0.107
—— 11111110 1.941 11111111 1.964
9.0 HYBRID BALANCE FILTER
The Hybrid Balance Filter on COMBO II is a programmable filter consisting of a second-order section, Hybal1, followed by a first-order section, Hybal2, and a programmable attenu-
ator. Either of the filter sections can be bypassed if only one is required to achieve good cancellation. A selectable 180 degree inverting stage is included to compensate for inter­face circuits which also invert the transmit input relative to the receive output signal. The 2nd order section is intended mainly to balance low frequency signals across a trans­former SLIC, and the first order section to balance midrange to higher audio frequency signals.
As a 2nd order section, Hybal1 has a pair of low frequency zeroes and a pair of complex conjugate poles. When config­uring Hybal1, matching the phase of the hybrid at low to mid-band frequencies is most critical. Once the echo path is correctly balanced in phase, the magnitude of the cancella­tion signal can be corrected by the programmable attenua­tor.
The 2nd order mode of Hybal1 is most suitable for balancing interfaces with transformers having high inductance of 1.5 Henries or more. An alternative configuration for smaller transformers is available by converting Hybal1 to a simple first-order section with a single real low-frequency pole and zero. In this mode, the pole/zero frequency may be pro­grammed.
Hybal2, the higher frequency first-order section, is provided for balancing an electronic SLIC, and is also helpful with a transformer SLIC in providing additional phase correction for mid and high-band frequencies, typically 1 kHz to 3.4 kHz. Such a correction is particularly useful if the test balance im­pedance includes a capacitor of 100 nF or less, such as the loaded and non-loaded loop test networks in the United States. Independent placement of the pole and zero location is provided.
Figure 2
shows a simplified diagram of the local echo path for a typical application with a transformer interface. The magnitude and phase of the local echo signal, measured at VF
X
I, are a function of the termination impedance ZT, the line
transformer and the impedance of the 2W loop, Z
L
. If the im­pedance reflected back into the transformer primary is ex­pressed as Z
L
' then the echo path transfer function from
VF
R
OtoVFXI is:
H(w)=Z
L
'/(ZT+ZL') (1)
9.1 PROGRAMMING THE FILTER
On initial power-up, the Hybrid Balance filter is disabled. Be­fore the hybrid balance filter can be programmed it is neces­sary to design the transformer and termination impedance in order to meet system 2W input return loss specifications, which are normally measured against a fixed test impedance (600 or 900in most countries). Only then can the echo path be modeled and the hybrid balance filter programmed. Hybrid balancing is also measured against a fixed test im­pedance, specified by each national Telecom administration to provide adequate control of talker and listener echo over the majority of their network connections. This test imped­ance is Z
L
in
Figure 2
. The echo signal and the degree of transhybrid loss obtained by the programmable filter must be measured from the PCM digital input, D
R
0, to the PCM digi-
tal output, D
X
0, either by digital test signal analysis or by
conversion back to analog by a PCM CODEC/Filter.
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Page 9
Programmable Functions (Continued)
Three registers must be programmed in COMBO II to fully configure the Hybrid Balance Filter as follows:
Register 1: select/de-select Hybrid Balance Filter;
invert/non-invert cancellation signal; select/de-select Hybal2 filter section; attenuator setting.
Register 2: select/de-select Hybal1 filter;
set Hybal1 to 2nd order or 1st order; pole and zero frequency selection.
Register 3: program pole frequency in Hybal2 filter;
program zero frequency in Hybal2 filter.
Equation (1)
) and design a matching hybrid balance filter configuration. Alternatively, the frequency re­sponse of the echo path can be measured and the hybrid balance filter designed to replicate it.
A Hybrid Balance filter design guide and software optimiza­tion program are available under license from National Semi­conductor Corporation; order TP3077SW.
Applications Information
Figure 3
shows a typical application of the TP3071 together with a typical monolithic SLIC. Four of the IL latches are con­figured as outputs to control the relay drivers on the SLIC, while IL4 is an input for the Supervision signal.
POWER SUPPLIES
While the pins of the TP3070 COMBO II devices are well protected against electrical misuse, it is recommended that the standard CMOS practice of applying GND to the device before any other connections are made should always be followed. In applications where the printed circuit card may be plugged into a hot socket with power and clocks already present, extra long pins on the connector should be used for ground and V
BB
. In addition, a Schottky diode should be con-
nected between V
BB
and ground.
To minimize noise sources, all ground connections to each device should meet at a common point as close as possible to the device GND pin in order to prevent the interaction of ground return currents flowing through a common bus im­pedance. Power supply decoupling capacitors of 0.1 µF should be connected from this common device ground point to V
CC
and VBBas close to the device pins as possible. V
CC
and VBBshould also be decoupled with Low Effective Series Resistance Capacitors of at least 10 µF located near the card edge connector.
Further guidelines on PCB layout techniques are provided in Application NoteAN-614, “ COMBO II
Programmable PCM
CODEC/Filter Family Application Guide”.
DS008635-5
FIGURE 2. Simplified Diagram of Hybrid Balance Circuit
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Page 10
Applications Information (Continued)
DS008635-7
FIGURE 3. Typical Application with Monolithic SLIC
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Page 11
Absolute Maximum Ratings (Note 9)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
V
CC
to GND 7V
Voltage at VF
X
IV
CC
+ 0.5V to VBB− 0.5V
Voltage at any Digital Input V
CC
+ 0.5V to GND − 0.5V
Storage Temperature Range −65˚C to + 150˚C V
BB
to GND −7V
Current at VF
R
0
±
100 mA
Current at any Digital Output
±
50 mA
Lead Temperature
(Soldering, 10 sec.) 300˚C
Electrical Characteristics
Unless otherwise noted, limits printed in BOLD characters are guaranteed for V
CC
=
+5V
±
5%,V
BB
=
−5V
±
5%;T
A
=
0˚C to
+70˚C (−40˚C to +85˚C for TP3070-X) by correlation with 100%electrical testing at T
A
=
25˚C. All other limits are assured by correlation with other production tests and/or product design and characterization. All signals referenced to GND. Typicals specified at V
CC
=
+5V, V
BB
=
−5V, T
A
=
25˚C.
Symbol Parameter Conditions Min Typ Max Units
DIGITAL INTERFACES
V
IL
Input Low Voltage All Digital Inputs (DC Meas.) (Note 10) 0.7 V
V
IH
Input High Voltage All Digital Inputs (DC Meas.) (Note 10) 2.0 V
V
OL
Output Low Voltage DX0, DX1, TSX0, TSX1 and CO, I
L
=
3.2 mA,
0.4 V
All Other Digital Outputs, I
L
=
1mA
V
OH
Output High Voltage DX0, DX1 and CO, I
L
=
−3.2 mA, 2.4 V
All Other Digital Outputs (except TS
X
), I
L
=
−1 mA
All Digital Outputs, I
L
=
−100 µA V
CC
− 0.5 V
I
IL
Input Low Current Any Digital Input, GND<V
IN
<
V
IL
−10 10 µA
I
IH
Input High Current Any Digital Input except MR, V
IH
<
V
IN
<
V
CC
−10 10 µA
MR Only −10 100 µA
I
OZ
Output Current in DX0, DX1, TSX0, TSX1, CO and CI/O (as an Output) High Impedance IL5–IL0 When Selected as Inputs −10 10 µA State (TRI-STATE) GND
<
V
OUT
<
V
CC
−40˚C to +85˚C (TP3070-X) −30 30 µA
ANALOG INTERFACES
I
VFXI
Input Current, VFXI −3.3V<VFXI<3.3V −10.0 10.0 µA
R
VFXI
Input Resistance −3.3V<VFXI<3.3V 390 620 k
VOS
X
Input Offset Voltage Transmit Gain=0 dB 200 mV Applied at VF
X
I Transmit Gain=25.4 dB 10 mV
RL
VFRO
Load Resistance Receive Gain=0 dB 15k
Receive Gain=−0.5 dB 600 Receive Gain=−1.2 dB 300
CL
VFRO
Load Capacitance RL
VFRO
300 200 pF
CL
VFRO
from VFROtoGND
RO
VFRO
Output Resistance Steady Zero PCM Code Applied to 1.0 3.0
D
R
0orDR1
VOS
R
Output Offset Alternating±Zero PCM Code Applied to −200 200 mV Voltage at V
FRO
DR0orDR1, Maximum Receive Gain
POWER DISSIPATION
I
CC
0 Power Down Current CCLK, CI/O, CI, CO,=0.4V, CS=2.4V
Interface Latches Set as Outputs with No Load, 0.1 0.6 mA All Other Inputs Active, Power Amp Disabled
I
BB
0 Power Down Current As Above −0.1 −0.3 mA
−40˚C to +85˚C (TP3070-X) −0.4 mA
I
CC
1 Power Up Current CCLK, CI/O, CI, CO=0.4V, CS=2.4V
No Load on Power Amp 8.0 11.0 mA Interface Latches Set as Outputs with No Load
−40˚C to +85˚C (TP3070-X) 13.0 mA
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Page 12
Electrical Characteristics (Continued)
Unless otherwise noted, limits printed in BOLD characters are guaranteed for V
CC
=
+5V
±
5%,V
BB
=
−5V
±
5%;T
A
=
0˚C to
+70˚C (−40˚C to +85˚C for TP3070-X) by correlation with 100%electrical testing at T
A
=
25˚C. All other limits are assured by correlation with other production tests and/or product design and characterization. All signals referenced to GND. Typicals specified at V
CC
=
+5V, V
BB
=
−5V, T
A
=
25˚C.
Symbol Parameter Conditions Min Typ Max Units
POWER DISSIPATION
I
BB
1 Power Up Current As Above −8.0 −11.0 mA
−40˚C to +85˚C (TP3070-X) −13.0 mA
I
CC
2 Power Down Current Power Amp Enabled 2.0 3.0 mA
−40˚C to +85˚C (TP3070-X) 4.0 mA
I
BB
2 Power Down Current Power Amp Enabled −2.0 −3.0 mA
−40˚C to +85˚C (TP3070-X) −4.0 mA
Note 9: “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits.
Note 10: See definitions and timing conventions section.
Timing Specifications
Unless otherwise noted, limits printed in BOLD characters are guaranteed for V
CC
=
+5V
±
5%;V
BB
=
−5V
±
5%;T
A
=
0˚C to
+70˚C (−40˚C to +85˚C for TP3070-X) by correlation with 100%electrical testing at T
A
=
25˚C. All other limits are assured by correlation with other production tests and/or product design and characterization. All signals referenced to GND. Typicals specified at V
CC
=
+5V, V
BB
=
−5V, T
A
=
25˚C.
All timing parameters are measured at V
OH
=
2.0V and V
OL
=
0.7V.
See Definitions and Timing Conventions section for test methods information.
Symbol Parameter Conditions Min Typ Max Units
MASTER CLOCK TIMING
f
MCLK
Frequency of MCLK Selection of Frequency is 512 kHz
Programmable (See
Table 5
) 1536 kHz
1544 kHz 2048 kHz 4096 kHz
t
WMH
Period of MCLK High Measured from VIHto VIH(Note 11) 80 ns
t
WML
Period of MCLK Low Measured from VILto VIL(Note 11) 80 ns
t
RM
Rise Time of MCLK Measured from VILto V
IH
30 ns
t
FM
Fall Time of MCLK Measured from VIHto V
IL
30 ns
t
HBM
HOLD Time, BCLK LOW TP3070 Only 50 ns to MCLK HIGH
t
WFL
Period of FSXor FSRLow Measured from VILto V
IL
1 MCLK Period
PCM INTERFACE TIMING
f
BCLK
Frequency of BCLK May Vary from 64 kHz to 4096 kHz 64 4096 kHz
in 8 kHz Increments
t
WBH
Period of BCLK High Measured from VIHto V
IH
80 ns
t
WBL
Period of BCLK Low Measured from VILto V
IL
80 ns
t
RB
Rise Time of BCLK Measured from VILto V
IH
30 ns
t
FB
Fall Time of BCLK Measured from VIHto V
IL
30 ns
t
HBF
Hold Time, BCLK Low 30 ns to FS
X/R
High or Low
t
SFB
Setup Time, FS
X/R
30 ns
High to BCLK Low
t
DBD
Delay Time, BCLK High Load=100 pF Plus 2 LSTTL Loads 80 ns to Data Valid −40˚C to +85˚C (TP3070-X) 90 ns
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Page 13
Timing Specifications (Continued)
Unless otherwise noted, limits printed in BOLD characters are guaranteed for V
CC
=
+5V
±
5%;V
BB
=
−5V
±
5%;T
A
=
0˚C to
+70˚C (−40˚C to +85˚C for TP3070-X) by correlation with 100%electrical testing at T
A
=
25˚C. All other limits are assured by correlation with other production tests and/or product design and characterization. All signals referenced to GND. Typicals specified at V
CC
=
+5V, V
BB
=
−5V, T
A
=
25˚C.
All timing parameters are measured at V
OH
=
2.0V and V
OL
=
0.7V.
See Definitions and Timing Conventions section for test methods information.
Symbol Parameter Conditions Min Typ Max Units
PCM INTERFACE TIMING
t
DBZ
Delay Time, BCLK Low to DX0/1 DX0/1 Disabled is measured at V
OL
or VOHaccording to
Figure 4
or
Figure 5
Disabled if FSXLow, FSXLow to D
X
0/1 disabled if 8th BCLK 15 80 ns
Low, or BCLK High to D
X
0/1
Disabled if FS
X
High −40˚C to +85˚C (TP3070-X) 15 100 ns
t
DBT
Delay Time, BCLK High to TS
X
Low if FSXHigh, or FSXHigh to TS
X
Low if BCLK High (Non Delayed Mode); BCLK High to TS
X
Low (Delayed Data Mode)
Load=100 pF Plus 2 LSTTL Loads 60 ns
t
ZBT
TRI-STATE Time, BCLK Low to TS
X
High if FSXLow, FSXLow to TSXHigh if 8th BCLK Low, or BCLK High to TSXHigh if FS
X
High
15 60 ns
t
DFD
Delay Time, FS
X/R
Load=100 pF Plus 2 LSTTL Loads,
High to Data Valid Applies if FS
X/R
Rises Later than 80 ns BCLK Rising Edge in Non-Delayed Data Mode Only
−40˚C to +85˚C (TP3070-X) 90 ns
t
SDB
Setup Time, DR0/1 30 ns Valid to BCLK Low
t
HBD
Hold Time, BCLK 15 ns Low to D
R
0/1 Invalid −40˚C to +85˚C (TP3070-X) 15 ns
SERIAL CONTROL PORT TIMING
f
CCLK
Frequency of CCLK 2048 kHz
t
WCH
Period of CCLK High Measured from VIHto V
IH
160 ns
t
WCL
Period of CCLK Low Measured from VILto V
IL
160 ns
t
RC
Rise Time of CCLK Measured from VILto V
IH
50 ns
t
FC
Fall Time of CCLK Measured from VIHto V
IL
50 ns
t
HCS
Hold Time, CCLK Low CCLK1 10 ns to CS Low
t
HSC
Hold Time, CCLK CCLK 8 100 ns Low to CS High
t
SSC
Setup Time, CS 60 ns Transition to CCLK Low
t
SSCO
Setup Time, CS 50 ns Transition to CCLK High
t
SDC
Setup Time, CI (CI/O) 50 ns Data In to CCLK Low
t
HCD
Hold Time, CCLK 50 ns Low to CI/O Invalid
t
DCD
Delay Time, CCLK High Load=100 pF plus 2 LSTTL Loads 80 ns to CI/O Data Out Valid −40˚C to +85˚C (TP3070-X) 100 ns
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Page 14
Timing Specifications (Continued)
Unless otherwise noted, limits printed in BOLD characters are guaranteed for V
CC
=
+5V
±
5%;V
BB
=
−5V
±
5%;T
A
=
0˚C to
+70˚C (−40˚C to +85˚C for TP3070-X) by correlation with 100%electrical testing at T
A
=
25˚C. All other limits are assured by correlation with other production tests and/or product design and characterization. All signals referenced to GND. Typicals specified at V
CC
=
+5V, V
BB
=
−5V, T
A
=
25˚C.
All timing parameters are measured at V
OH
=
2.0V and V
OL
=
0.7V.
See Definitions and Timing Conventions section for test methods information.
Symbol Parameter Conditions Min Typ Max Units
SERIAL CONTROL PORT TIMING
t
DSD
Delay Time, CS Low Applies Only if Separate 80 ns to CO (CI/O) Valid CS used for Byte 2
−40˚C to +85˚C (TP3070-X) 100 ns
t
DDZ
Delay Time, CS or 9th CCLK High to CO (CI/O) High Impedance
Applies to Earlier of CS High or 9th CCLK High 15 80 ns
INTERFACE LATCH TIMING
t
SLC
Setup Time, IL to Interface Latch Inputs Only 100 ns CCLK 8 of Byte 1
t
HCL
Hold Time, IL Valid from 50 ns 8th CCLK Low (Byte 1)
t
DCL
Delay Time CCLK 8 of Interface Latch Outputs Only 200 ns Byte2toIL C
L
=
50 pF
MASTER RESET PIN
t
WMR
Duration of 1 µs Master Reset High
Note 11: Applies only to MCLK Frequencies 1.536 MHz. At 512 kHz a 50:50±2%Duty Cycle must be used.
Timing Diagrams
DS008635-8
FIGURE 4. Non Delayed Data Timing Mode
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Page 15
Timing Diagrams (Continued)
DS008635-9
FIGURE 5. Delayed Data Timing Mode
(Time Slot Zero Only)
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Page 16
Timing Diagrams (Continued)
DS008635-10
FIGURE 6. Control Port Timing
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Page 17
Transmission Characteristics
Unless otherwise noted, limits printed in BOLD characters are guaranteed for V
CC
=
+5V
±
5%,V
BB
=
−5V
±
5%;T
A
=
0˚C to
+70˚C (−40˚C to +85˚C for TP3070-X) by correlation with 100%electrical testing at T
A
=
25˚C. f=1015.625 Hz, VF
X
I
=
0 dBm0, D
R
0orDR1=0 dBm0 PCM code. Transmit and receive gains programmed for maximum 0 dBm0 test levels (0 dB gain), hybrid balance filter disabled. All other limits are assured by correlation with other production tests and/or product de­sign and characterization. All signals referenced to GND. Typicals specified at V
CC
=
+5V, V
BB
=
−5V, T
A
=
25˚C.
Symbol Parameter Conditions Min Typ Max Units
AMPLITUDE RESPONSE
Absolute Levels The Maximum 0 dBm0 Levels are:
VF
X
I 1.619 Vrms
VF
R
O (15 kLoad) 1.964 Vrms
The Minimum 0 dBm0 Levels are:
VF
X
I 87.0 mVrms
VF
R
O (Any Load 300) 105.0 mVrms Overload Levels are 3.17 dBm0 (µLaw) and 3.14 dBm0 (A-Law)
G
XA
Transmit Gain Transmit Gain Programmed for Maximum Absolute Accuracy 0 dBm0 Test Level. (All 1’s in gain register)
Measure Deviation of Digital Code from Ideal 0 dBm0 PCM Code at D
X
0/1.
T
A
=
25˚C −0.15 0.15 dB
G
XAG
Transmit Gain T
A
=
25˚C, V
CC
=
5V, V
BB
=
5V Variation with Programmed Gain from 0 dB to 19 dB Programmed Gain (0 dBm0 Levels of 1.619 Vrms to
0.182 Vrms) −0.1 0.1 dB Programmed Gain from 19.1 dB to 25.4 dB (0 dBm0 Levels of 0.180 Vrms to
0.087 Vrms) −0.3 0.3 dB
Note:±0.1 dB min/max is available as a selected
part.
G
XAF
Transmit Gain Relative to 1015.625 Hz, (Note 15) Variation with Minimum Gain
<
G
X
<
Maximum Gain
Frequency f=60 Hz −26 dB
f=200 Hz −1.8 −0.1 dB f=300 Hz to 3000 Hz −0.15 0.15 dB f=3400 Hz −0.7 0.0 dB f=4000 Hz −14 dB f 4600 Hz. Measure Response −32 dB at Alias Frequency from 0 kHz to 4 kHz. G
X
=
0 dB, VF
X
I=1.619 Vrms Relative to 1015.625 Hz f=62.5 Hz −24.9 dB f=203.125 Hz −1.7 −0.1 dB f=343.75 Hz −0.15 0.15 dB f=515.625 Hz −0.15 0.15 dB f=2140.625 Hz −0.15 0.15 dB f=3156.25 Hz −0.15 0.15 dB f=3406.250 Hz −0.74 0.0 dB f=3984.375 Hz −13.5 dB Relative to 1062.5 Hz (Note 15) f=5250 Hz, Measure 2750 Hz −32 dB f=11750 Hz, Measure 3750 Hz −32 dB f=49750 Hz, Measure 1750 Hz −32 dB
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Page 18
Transmission Characteristics (Continued)
Unless otherwise noted, limits printed in BOLD characters are guaranteed for V
CC
=
+5V
±
5%,V
BB
=
−5V
±
5%;T
A
=
0˚C to
+70˚C (−40˚C to +85˚C for TP3070-X) by correlation with 100%electrical testing at T
A
=
25˚C. f=1015.625 Hz, VF
X
I
=
0 dBm0, D
R
0orDR1=0 dBm0 PCM code. Transmit and receive gains programmed for maximum 0 dBm0 test levels (0 dB gain), hybrid balance filter disabled. All other limits are assured by correlation with other production tests and/or product de­sign and characterization. All signals referenced to GND. Typicals specified at V
CC
=
+5V, V
BB
=
−5V, T
A
=
25˚C.
Symbol Parameter Conditions Min Typ Max Units
AMPLITUDE RESPONSE
G
XAT
Transmit Gain Measured Relative to GXA,V
CC
=
5V,
Variation with V
BB
=
−5V, −0.1 0.1 dB
Temperature Minimum gain
<
G
X
<
Maximum Gain
−40˚C to +85˚C (TP3070-X) −0.15 0.15 dB
G
XAL
Transmit Gain Sinusoidal Test Method. Variation with Signal Reference Level=0 dBm0. Level VF
X
I=−40 dBm0 to +3 dBm0 −0.2 0.2 dB
VF
X
I=−50 dBm0 to −40 dBm0 −0.4 0.4 dB
VF
X
I=−55 dBm0 to −50 dBm0 −1.2 1.2 dB
G
RA
Receive Gain Receive Gain Programmed for Maximum Absolute Accuracy 0 dBm0 Test Level (All 1’s in
Gain Register). Apply 0 dBm0 PCM Code to D
R
0orDR1. Measure VFRO.
T
A
=
25˚C −0.15 0.15 dB
G
RAG
Receive Gain T
A
=
25˚C, V
CC
=
5V, V
BB
=
−5V Variation with Programmed Gain from 0 dB to 19 dB Programmed Gain (0 dBm0 Levels of 1.964 Vrms to
0.220 Vrms) −0.1 0.1 dB Programmed Gain from 19.1 dB to 25.4 dB (0 dBm0 Levels of 0.218 Vrms to
0.105 Vrms) −0.3 0.3 dB
Note:±0.1 dB min/max is available as a selected
part.
G
RAT
Receive Gain Measured Relative to GRA. Variation with Temperature V
CC
=
5V, V
BB
=
−5V. −0.1 0.1 dB
Minimum Gain
<
G
R
<
Maximum Gain
−40˚C to +85˚C (TP3070-X) −0.15 0.15 dB
G
RAF
Receive Gain Relative to 1015.625 Hz, (Note 15) Variation with Frequency D
R
0orDR1=0 dBm0 code.
Minimum Gain
<
G
R
<
Maximum Gain f=200 Hz −0.25 0.15 dB f=300 Hz to 3000 Hz −0.15 0.15 dB f=3400 Hz −0.7 0.0 dB f=4000 Hz −14 dB G
R
=
0 dB, D
R
0=0 dBm0 Code,
G
X
=
0 dB (Note 15) f=296.875 Hz −0.15 0.15 dB f=1875.00 Hz −0.15 0.15 dB f=2906.25 Hz −0.15 0.15 dB f=2984.375 Hz −0.15 0.15 dB f=3406.250 Hz −0.74 0.0 dB f=3984.375 Hz −13.5 dB
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Page 19
Transmission Characteristics (Continued)
Unless otherwise noted, limits printed in BOLD characters are guaranteed for V
CC
=
+5V
±
5%,V
BB
=
−5V
±
5%;T
A
=
0˚C to
+70˚C (−40˚C to +85˚C for TP3070-X) by correlation with 100%electrical testing at T
A
=
25˚C. f=1015.625 Hz, VF
X
I
=
0 dBm0, D
R
0orDR1=0 dBm0 PCM code. Transmit and receive gains programmed for maximum 0 dBm0 test levels (0 dB gain), hybrid balance filter disabled. All other limits are assured by correlation with other production tests and/or product de­sign and characterization. All signals referenced to GND. Typicals specified at V
CC
=
+5V, V
BB
=
−5V, T
A
=
25˚C.
Symbol Parameter Conditions Min Typ Max Units
AMPLITUDE RESPONSE
G
RAL
Receive Gain Sinusoidal Test Method. Variation with Signal Reference Level=0 dBm0. Level D
R
0=−40 dBm0 to +3 dBm0 −0.2 0.2 dB
D
R
0=−50 dBm0 to −40 dBm0 −0.4 0.4 dB
D
R
0=−55 dBm0 to − 50 dBm0 −1.2 1.2 dB
D
R
0=3.1 dBm0
R
L
=
600,G
R
=
−0.5 dB −0.2 0.2 dB
R
L
=
300,G
R
=
−1.2 dB −0.2 0.2 dB
ENVELOPE DELAY DISTORTION WITH FREQUENCY
D
XA
Tx Delay, Absolute f=1600 Hz 315 µs
D
XR
Tx Delay, Relative to D
XA
f=500–600 Hz 220 µs f=600–800 Hz 145 µs f=800–1000 Hz 75 µs f=1000–1600 Hz 40 µs f=1600–2600 Hz 75 µs f=2600–2800 Hz 105 µs f=2800–3000 Hz 155 µs
D
RA
Rx Delay, Absolute f=1600 Hz 200 µs
D
RR
Rx Delay, Relative to D
RA
f=500–1000 Hz −40 µs f=1000–1600 Hz −30 µs f=1600–2600 Hz 90 µs f=2600–2800 Hz 125 µs f=2800–3000 Hz 175 µs
NOISE
N
XC
Transmit Noise, C Message (Note 12) 12 15 dBrnC0 Weighted, µ-law Selected All ‘1’s in Gain Register
N
XP
Transmit Noise, P Message (Note 12) −74 −67 dBm0p Weighted, A-law Selected All ‘1’s in Gain Register
N
RC
Receive Noise, C Message PCM Code is Alternating Positive 8 11 dBrnC0 Weighted, µ-law Selected and Negative Zero
N
RP
Receive Noise, P Message PCM Code Equals Positive Zero −82 −79 dBm0p Weighted, A-law Selected
N
RS
Noise, Single Frequency f=0 kHz to 100 kHz, Loop Around −53 dBm0
Measurement, VF
X
I=0 Vrms
PPSR
X
Positive Power Supply V
CC
=
5.0 V
DC
+ 100 mVrms
Rejection, Transmit f=0 kHz–4 kHz (Note 13) 36 dBC
f=4 kHz–50 kHz 30 dBC
NPSR
X
Negative Power Supply V
BB
=
−5.0 V
DC
+ 100 mVrms
Rejection, Transmit f=0 kHz–4 kHz (Note 13) 36 dBC
f=4 kHz–50 kHz 30 dBC
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Page 20
Transmission Characteristics (Continued)
Unless otherwise noted, limits printed in BOLD characters are guaranteed for V
CC
=
+5V
±
5%,V
BB
=
−5V
±
5%;T
A
=
0˚C to
+70˚C (−40˚C to +85˚C for TP3070-X) by correlation with 100%electrical testing at T
A
=
25˚C. f=1015.625 Hz, VF
X
I
=
0 dBm0, D
R
0orDR1=0 dBm0 PCM code. Transmit and receive gains programmed for maximum 0 dBm0 test levels (0 dB gain), hybrid balance filter disabled. All other limits are assured by correlation with other production tests and/or product de­sign and characterization. All signals referenced to GND. Typicals specified at V
CC
=
+5V, V
BB
=
−5V, T
A
=
25˚C.
Symbol Parameter Conditions Min Typ Max Units
NOISE
PPSR
R
Positive Power Supply PCM Code Equals Positive Zero Rejection, Receive V
CC
=
5.0 V
DC
+ 100 mVrms
Measure VF
R
O f=0 Hz–4000 Hz 36 dBC f=4 kHz–25 kHz 40 dB f=25 kHz–50 kHz 36 dB
NPSR
R
Negative Power Supply PCM Code Equals Positive Zero Rejection, Receive V
BB
=
−5.0 V
DC
+ 100 mVrms
Measure VF
R
O f=0 Hz–4000 Hz 36 dBC f=4 kHz–25kHz 40 dB f=25 kHz–50 kHz 36 dB
SOS Spurious Out-of-Band 0 dBm0, 300 Hz to 3400 Hz Input PCM
Signals at the Channel Code Applied at D
R
0 (or DR1)
Output 4600 Hz–7600 Hz −30 dB
7600 Hz–8400 Hz −40 dB 8400 Hz–50,000 Hz −30 dB
DISTORTION
STD
X
Signal to Total Distortion Sinusoidal Test Method
STD
R
Transmit or Receive Level=3.0 dBm0 33 dBC Half-Channel, µ-law Selected=0 dBm0 to − 30 dBm0 36 dBC
=
−40 dBm0 30 dBC
=
−45 dBm0 25 dBC
STD
RL
Signal to Total Distortion Sinusoidal Test Method Receive with Level=+3.1 dBm0 Resistive Load R
L
=
600,G
R
=
−0.5 dB 33 dBC
R
L
=
300,G
R
=
−1.2 dB 33 dBC
SFD
X
Single Frequency −46 dB Distortion, Transmit
SFD
R
Single Frequency −46 dB Distortion, Receive
IMD Intermodulation Distortion Transmit or Receive
Two Frequencies in the Range −41 dB 300 Hz–3400 Hz
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Page 21
Transmission Characteristics (Continued)
Unless otherwise noted, limits printed in BOLD characters are guaranteed for V
CC
=
+5V
±
5%,V
BB
=
−5V
±
5%;T
A
=
0˚C to
+70˚C (−40˚C to +85˚C for TP3070-X) by correlation with 100%electrical testing at T
A
=
25˚C. f=1015.625 Hz, VF
X
I
=
0 dBm0, D
R
0orDR1=0 dBm0 PCM code. Transmit and receive gains programmed for maximum 0 dBm0 test levels (0 dB gain), hybrid balance filter disabled. All other limits are assured by correlation with other production tests and/or product de­sign and characterization. All signals referenced to GND. Typicals specified at V
CC
=
+5V, V
BB
=
−5V, T
A
=
25˚C.
Symbol Parameter Conditions Min Typ Max Units
CROSSTALK
CT
X-R
Transmit to Receive Crosstalk, 0 dBm0 Transmit Level
f=300 Hz–3400 Hz
−90 −75 dB
D
R
=
Idle Code
CT
R-X
Receive to Transmit Crosstalk, 0 dBm0 Receive Level
f=300 Hz–3400 Hz
−90 −70 dB
(Note 13)
Note 12: Measured by grounded input at VFXI. Note 13: PPSR
X
, NPSRX, and CT
R–X
are measured with a −50 dBm0 activation signal applied to VFXI.
Note 14: A signal is Valid if it is above V
IH
or below VILand Invalid if it is between VILand VIH. For the purposes of this specification the following conditions apply:
a) All input signals are defined as: V
IL
=
0.4V, V
IH
=
2.7V, t
R
<
10 ns, t
F
<
10 ns.
b) t
R
is measured from VILto VIH.tFis measured from VIHto VIL. c) Delay Times are measured from the input signal Valid to the output signal Valid. d) Setup Times are measured from the data input Valid to the clock input Invalid. e) Hold Times are measured from the clock signal Valid to the data input Invalid. f) Pulse widths are measured from V
IL
to VILor from VIHto VIH.
Note 15: A multi-tone test technique is used.
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Page 22
Definitions and Timing Conventions
DEFINITIONS
V
IH
VIHis the D.C. input level above which an input level is guaranteed to appear as a logical one. This parameter is to be measured by performing a functional test at reduced clock speeds and nomi­nal timing, (i.e., not minimum setup and hold times or output strobes), with the high level of all driving signals set to V
IH
and maximum supply voltages applied to the device.
V
IL
VILis the D.C. input level below which an input level is guaranteed to appear as a logical zero to the device. This param­eter is measured in the same manner as V
IH
but with all driving signal low levels
set to V
IL
and minimum supply voltages
applied to the device.
V
OH
VOHis the minimum D.C. output level to which an output placed in a logical one state will converge when loaded at the maximum specified load current.
V
OL
VOLis the maximum D.C. output level to which an output placed in a logical zero state will converge when loaded at the maximum specified load current.
Threshold Region The threshold region is the range of in-
put voltages between V
IL
and VIH.
Valid Signal A signal is Valid if it is in one of the valid
logic states. (i.e., above V
IH
or below
V
IL
). In timing specifications, a signal is deemed valid at the instant it enters a valid state.
Invalid signal A signal is invalid if it is not in a valid
logic state, i.e., when it is in the thresh­old region between V
IL
and VIH. In timing specifications, a signal is deemed In­valid at the instant it enters the threshold region.
TIMING CONVENTIONS
For the purposes of this timing specification the following conventions apply.
Input Signals All input signals may be characterized
as: V
L
=
0.4V,V
H
=
2.4V,t
R
<
10 ns, t
F
<
10 ns.
Period The period of the clock signal is desig-
nated as t
Pxx
wherexxrepresents the mnemonic of the clock signal being specified.
Rise Time Rise times are designated as t
Ryy
, where yy represents a mnemonic of the signal whose rise time is being specified. t
Ryy
is
measured from V
IL
to VIH.
Fall Time Fall times are designated as t
Fyy
, where yy represents a mnemonic of the signal whose fall time is being specified. t
Fyy
is
measured from V
IH
to VIL.
Pulse Width High The high pulse width width is designated
as t
WzzH
, where zz represents the mne­monic of the input or output signal whose pulse width is being specified. High
pulse widths are measured from V
IH
to
V
IH
.
Pulse Width Low The low pulse width is designated as
t
WzzL
, where zz represents the mne­monic of the input or output signal whose pulse width is being specified. Low pulse widths are measured from V
IL
to VIL.
Setup Time Setup times are designated as t
Swwxx
, where ww represents the mnemonic of the input signal whose setup time is be­ing specified relative to a clock or strobe input represented by mnemonic xx. Setup times are measured from the ww Valid to xx Invalid.
Hold Time Hold times are designated as T
Hwwxx
, where ww represents the mnemonic of the input signal whose hold time is being specified relative to a clock or strobe in­put represented by the mnemonic xx. Hold times are measured from xx Valid to ww Invalid.
Delay Time Delay times are designated as
T
Dxxyy
[ IHIL], where xx represents the mnemonic of the input reference signal and yy represents the mnemonic of the output signal whose timing is being specified relative to xx. The mnemonic may optionally be terminated by an H or L to specify the high going or low going transition of the output signal. Maximum delay times are measured from xx Valid to yy Valid. Minimum delay times are measured from xx Valid to yy Invalid. This parameter is tested under the load conditions specified in the Conditions column of the Timing Specifications sec­tion of this datasheet.
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Page 23
23
Page 24
Physical Dimensions inches (millimeters) unless otherwise noted
Ceramic Dual-In-Line Package (J)
Order Number TP3071J
NS Package Number J20A
Ceramic Dual-In-Line Package (J)
Order Number TP3070J
NS Package Number J28A
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Page 25
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Molded Dual-In-Line Package (N)
Order Number TP3071N
NS Package Number N20A
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Page 26
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DE­VICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMI­CONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or sys­tems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose fail­ure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be rea­sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
National Semiconductor Corporation
Americas Tel: 1-800-272-9959 Fax: 1-800-737-7018 Email: support@nsc.com
www.national.com
National Semiconductor Europe
Fax: +49 (0) 1 80-530 85 86
Email: europe.support@nsc.com Deutsch Tel: +49 (0) 1 80-530 85 85 English Tel: +49 (0) 1 80-532 78 32 Français Tel: +49 (0) 1 80-532 93 58 Italiano Tel: +49 (0) 1 80-534 16 80
National Semiconductor Asia Pacific Customer Response Group
Tel: 65-2544466 Fax: 65-2504466 Email: sea.support@nsc.com
National Semiconductor Japan Ltd.
Tel: 81-3-5639-7560 Fax: 81-3-5639-7507
Plastic Leaded Chip Carrier (V)
Order Number TP3070V or TP3070V-X
NS Package Number V28A
TP3070, TP3071, TP3070-X COMBO II Programmable PCM CODEC/Filter
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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