Datasheet TEA1083AT-C1, TEA1083A-C1, TEA1083-C1 Datasheet (Philips)

DATA SH EET

Product specification
File under Integrated circuits, IC03A

March 1994

INTEGRATED CIRCUITS

TEA1083; TEA1083A

Call progress monitor for line
powered telephone sets

March 1994 2

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

TEA1083; TEA1083A

FEATURES

• Internal supply
– Optimum current split-up
– Low constant current (adjustable) in transmission IC
– Nearly all line current available for monitoring
– Stabilized supply voltage

• Loudspeaker amplifier with a fixed gain of 35 dB

• Volume controlled by potentiometer

• Power-down input (TEA1083A only)

• Loudspeaker enable input.

GENERAL DESCRIPTION

The TEA1083/83A is a bipolar IC which has been
designed for use in line powered telephone sets. It is
intended to offer a monitoring facility of the line signal via

a loudspeaker during on-hook dialling. The TEA1083/83A
is intended for use in conjunction with a transmission
circuit of the TEA1060 family. The device uses a part of the
available line current via the internal supply circuit.
The loudspeaker amplifier, which consists of a preamplifier
and a power amplifier, amplifies the received line signals
from the transmission circuit when enabled via the LSE
input. The loudspeaker amplifier can also be used to
amplify dialling tones from the dialler IC. The power
amplifier contains a push-pull output stage to drive the
loudspeaker in a Single Ended Load (SEL) configuration.
The internal voltage stabilizer can be used to supply
external devices. By activating the power-down (PD) input
of the TEA1083A, the current consumption of the circuit
will be reduced, this enables pulse dialling or flash (register
recall).
An internal start circuit ensures normal start-up of the
transmission IC.

QUICK REFERENCE DATA

ORDERING INFORMATION

Notes

1. SOT97-1; 1998 Jun 18.

2. SOT38-1; 1998 Jun 18.

3. SOT162-1; 1998 Jun 18.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I

SUP

input current range 3.0 − 120 mA

V

BB

stabilized supply current − 2.95 − V

I

SUP

current consumption PD = HIGH; TEA1083A only − 50 −µA

G

v

voltage gain of loudspeaker amplifier − 35 − dB

I

SUP

minimum input current PO = 10 mW (typ) into 50 Ω− 10 − mA

T

amb

operating ambient temperature range −25 −+75 °C

EXTENDED TYPE

NUMBER

PACKAGE

PINS PIN POSITION MATERIAL CODE

TEA1083 8 DIL PLASTIC SOT97D

(1)

TEA1083A 16 DIL PLASTIC SOT38

(2)

TEA1083AT 16 SOL PLASTIC SOT162AG

(3)

March 1994 3

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

TEA1083; TEA1083A

Fig.1 Block diagram (TEA1083).

handbook, full pagewidth

MGR045

SUPPLY

PRE-

AMPLIFIER

START-

CIRCUIT

POWER

AMPLIFIER

ENABLE
CIRCUIT

2

3

8

SUP

SREF

1
4

LSI1

5

LSI2

6

LSE

7

QLS

V

SS

V

BB

TEA1083

Fig.2 Block diagram (TEA1083A/AT).

handbook, full pagewidth

MGR046

SUPPLY

PD

PRE-

AMPLIFIER

START-

CIRCUIT

POWER

AMPLIFIER

ENABLE
CIRCUIT

2

3

16

SUP

3, 5, 6, 7,
10, 11, 14

n.c.

SREF

12
1

PD

8

LSI1

9

LSI2

13

LSE

15

QLS

V

SS

V

BB

TEA1083A

TEA1083AT

March 1994 4

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

TEA1083; TEA1083A

Fig.3 Pin configuration (TEA1083).

handbook, halfpage

1
2
3
4

8
7
6
5

MGR047

TEA1083

V

BB
QLSSUP
LSE

LSI2

LSI1

SREF

V

SS

Fig.4 Pin configuration (TEA1083A/AT).

handbook, halfpage

TEA1083A

TEA1083AT

MGR048

1
2
3
4
5
6
7
8

16
15
14
13
12
11
10

9

V

SS

SUP

n.c.

SREF

n.c.
n.c.
n.c.

LSI1

LSI2

n.c.

n.c.

PD

LSE

n.c.

QLS

V

BB

PINNING

SYMBOL

PIN

DIL16

PIN

DIL8

DESCRIPTION

V

SS

1 1 negative supply terminal
SUP 2 2 positive supply terminal
n.c. 3 − not connected
SREF 4 3 supply reference input
n.c. 5 − not connected
n.c. 6 − not connected
n.c. 7 − not connected
LSI1 8 4 loudspeaker amplifier input 1
LSI2 9 5 loudspeaker amplifier input 2
n.c. 10 − not connected
n.c. 11 − not connected
PD 12 − power-down input
LSE 13 6 loudspeaker enable input
n.c. 14 − not connected
QLS 15 7 loudspeaker amplifier output
V

BB

16 8 stabilized supply voltage

March 1994 5

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

TEA1083; TEA1083A

Table 1 Comparison of the TEA108X family.

PRODUCT CONDITIONS TEA1083 TEA1083A TEA1085/85A

Application area note 1 call progress monitoring listening-in
PD facility − XX
MUTE or LSE facility note 2 X X X
Dynamic limiter −− X
Howling limiter −− X
V

BB

setting −− X
SEL note 3 X X X
BTL note 3 −− X
Number of pins note 4 8 16 24

Notes

1. A call progress monitor is recommended by the
European Telecommunications Standards Institute
(ETSI) for telephone sets with automatic on-hook
dialling facilities so that audible, or visual, progress of
a call attempt can be monitored. In accordance with
the ETSI (at a frequency of 440 Hz and a line level of
20 dBm (600 Ω)), a minimum level of 50 dBA shall be
guaranteed at a distance of 50 cm from the set. This
corresponds to a minimum level of approximately
100 mV (RMS) (PO≥ 0.2 mW) across a loudspeaker;
Philips type AD2071/Z50.

A listening-in set has to offer the user more facilities
e.g. howling limiting to reduce annoying loudspeaker
and line signals. Dynamic limiting of the loudspeaker
signal, with respect to supply conditions, can also be
required. Acoustic output levels for listening-in sets are
approximately 70 to 75 dBA. This corresponds to a
loudspeaker level of approximately 1 mV (RMS)
(PO≈ 20 mW).

2. The MUTE function of the TEA1085A has a logic input;
the MUTE function of the TEA1085 has a toggle input.

3. SEL: loudspeaker connected in a single-ended-load
configuration
BTL: loudspeaker connected in a bridge-tied-load
configuration

4. Consult the product specification for the package
outline/s.

FUNCTIONAL DESCRIPTION

The TEA1083/83A is normally used in conjunction with a
transmission circuit of the TEA1060 family. The circuit
must be connected between the positive line terminal
(pin 2) and pin SLPE of the transmission IC. The
transmission characteristics (impedance, gain settings,
etc.) are not affected.
An interconnection between the TEA1083/83A and a
member of the TEA1060 family is illustrated in Fig.5.

Supplies SUP, SREF, V

BB

and V

SS

In Fig.6 the line current is divided into ITR for the
transmission IC and I

SUP

for the monitoring circuit

TEA1083/83A.
ITR is constant:
ITR=V

int

/ R20

I

SUP=Iline

− ICC− I

TR

Where:

• V

int

is an internal temperature compensated reference

voltage of 500 mV (typ) between pins SUP and SREF

• R20 is a resistor connected between SUP and SREF

• ICC is the internal current consumption of the TEA106X

(approximately 1 mA).

A practical value for resistor R20 is 150 Ω; this produces a
current of approximately 3.3 mA (typ) for ITR and I

SUP

is

approximately equal to I

line

− 4.3 mA.

March 1994 6

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

TEA1083; TEA1083A

The circuit stabilizes its own supply voltage at VBB.
Transistor TR1 provides the supplies for the internal
circuits. Transistor TR2 is used to minimize signal
distortion on the line by momentarily diverting the input
current to VSS whenever the instantaneous value of the
voltage at V

SUP

drops below the supply voltage VBB. VBB is
fixed to a typical value of 2.95 V.
The supply at VBB is decoupled with respect to VSS by a
220 µF capacitor (C20).

The DC voltage (V

SUP

− VSS) is determined by the

transmission IC and V

int

; thus

V

SUP

− VSS = V

LN−SLPE

+ V

int

.
The reference voltage of the transmission IC has to be
adjusted to a level where V

SUP

− V

BB (max)

is greater than
400 mV. The minimum voltage space between SUP and
VBB (400 mV) is required to maintain a 'high' efficiency of
the internal supply for mean speech levels. V

BB (max)

is the

specified maximum level.
The internal current consumption of the TEA1083/83A

(I

SUP0

) is typically 2.5 mA (where V

SUP

− VSS= 3.6 V).

The current I

SUP0

consists of currents I

BIAS

(approximately

0.4 mA) for the circuitry connected to SUP and I

BB0

(approximately 2.1 mA) for the internal circuitry connected
to VBB(see Fig.6).

LOUDSPEAKER AMPLIFIER (LSI1/LSI2 and QLS)

The TEA1083/83A has symmetrical inputs at LSI1 and
LSI2. The input signal is normally taken from the earpiece
output of the transmission circuit (see Fig.5) and/or from
the signal output of the DTMF generator via a resistive
attenuator.
The attenuation factor must be chosen in accordance with
the output levels from the transmission IC and/or DTMF
generator and, in accordance with the required output
power and permitted signal distortion from the
loudspeaker signal.

The output QLS drives the loudspeaker as a single-ended
load. The output stage has been optimized for use with a
50 Ω loudspeaker (e.g. Philips type AD2071). The
loudspeaker amplifier is enabled when the LSE input goes
HIGH. The gain of the amplifier is fixed at 35 dB.

Volume control of the loudspeaker signal can be obtained
by using a level control at the input (see Fig.5).

The maximum voltage swing at the QLS output is
V

O(p-p)

= 2.5 V (typical with 50 Ω load). The input level

V

LSI

is approximately 16 mV(rms) and the supply current

I

SUP

> 11 mA. In this condition the signal is limited by the
available voltage space (VBB). Higher input levels and/or
lower supply currents will result in an increase of the
harmonic distortion due to signal clipping.

With a limit of 2.5 V (p-p), the maximum output swing is
dependent on the supply current and loudspeaker
impedance. It can be approximated, for low distortions, by
the following equation:

V

O(p-p)

=2×(I

SUP

− I

SUPO

) ×π×R

LS

Where;

• V

O(p-p)

= the peak-to-peak level of the loudspeaker

• RLS= the loudspeaker impedance

• I

SUPO

= 2.5 mA (typ.)

POWER-DOWN INPUT (PD)

During pulse dialling or register recall (timed loop break)
the telephone line is interrupted, thereby breaking the
supply current to the transmission IC. The capacitor
connected to V

BB

provides the supply for the

TEA1083/83A during the supply breaks.
By making the PD input HIGH during the loop break, the

requirement on the capacitor is eased and, consequently,
the internal current consumption I

BB0

(see Fig.5) is
reduced from 2.1 mA to 400 µA typically. Transistors TR1
and TR2 are inhibited during power-down and the bias
current is reduced from approximately 400 µA to
approximately 50 µA with V

SUP

= 3.6 V in the following

equation:
I

SUP(PD)

= I

BIAS(PD)

= (V

SUP

− 2Vd)/Ra

Where 3.6 < V

SUP

< VBB+ 3V

2Vd is the voltage drop across 2 internal diodes
(approximately 1.3 V)

Ra is an internal resistor (typical 50 kΩ)

LOUDSPEAKER ENABLE INPUT (LSE)

The LSE input has a pull-down structure. It switches the
loudspeaker amplifier, in the monitoring condition, by
applying a HIGH level at the input. The amplifier is in the
standby condition when LSE is LOW (input open-circuit or
connected to V

SS

).

March 1994 7

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

TEA1083; TEA1083A

Fig.5 Interconnection with a transmission IC of the TEA106X family.

handbook, full pagewidth

MGR049

TEA106x

V

CC

LN

V

EE SLPE

QR

IR

MIC

TEA1083

TEA1083A

SREF SUP V

BB

V

SS

LSI1 LSI2

LSE

QLS

PD

line

Fig.6 Supply arrangement.

handbook, full pagewidth

MGR050

TEA106x

V

CC

LN

V

EE

V

EE

SLPE

TEA1083

TEA1083A

V

SS

V

BB

I

line

I

TR

SUP

C28

I

SUP

V

SUP

I

BBO

I

BIAS

I

CC

R1

C1

R9

SLPE

R20

VOLTAGE

STABILIZER

TR1

TR2

SREF

V

int

TR1/TR2

CONTROL

line

March 1994 8

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

TEA1083; TEA1083A

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC134)

THERMAL RESISTANCE

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

SUP

Supply voltage

continuous − 12 V
during switch-on or line interruption − 13.2 V

V

SUP

Repetitive supply voltage from 1 ms to
5 s with 12 Ω current limiting resistor
in series with supply

− 28 V

V

SREF

Supply reference voltage VSS − 0.5 V

SUP

+ 0.5 V

V Voltage on all other pins V

SS

− 0.5 VBB + 0.5 V

I

SUP

Supply current see Fig.6 − 120 mA

P

tot

Total power dissipation T

amb

= 75 °C; Tj = 125 °C
TEA1083 − 500 mW
TEA1083A − 769 mW
TEA1083AT − 555 mW

T

stg

Storage temperature range −40 +125 °C

T

amb

Operating ambient temperature range −25 +75 °C

T

j

Junction temperature −+125 °C

SYMBOL PARAMETER THERMAL RESISTANCE

R

th j-a

from junction to ambient in free air (TEA1083) 100 K/W
from junction to ambient in free air (TEA1083A) 65 K/W
from junction to ambient in free air (TEA1083AT) 90 K/W

March 1994 9

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

TEA1083; TEA1083A

Fig.7 Safe operating area; see Table 2 (TEA1083).

handbook, halfpage

212

MGR051

120

40

60

80

100

46810

V

SUP

− VSS (V)

(3)

(2)

(1)

I

SUP

(mA)

Fig.8 Safe operating areas see Table 3

(TEA1083A).

handbook, halfpage

212

MGR052

120

40

60

80

100

46810

V

SUP

− VSS (V)

(2)

(3)

(1)

I

SUP

(mA)

Fig.9 Safe operating area; see Table 4

(TEA1083AT).

handbook, halfpage

212

MGR053

120

40

60

80

100

46810

V

SUP

− VSS (V)

(2)

(3)

(1)

I

SUP

(mA)

Table 2

Table 3

Table 4

CURVE T

amb

P

tot

155°C 700 mW
265°C 600 mW
375°C 500 mW

CURVE T

amb

P

tot

155°C 1077 mW
265°C 923 mW
375°C 769 mW

CURVE T

amb

P

tot

155°C 777 mW
265°C 666 mW
375°C 555 mW

March 1994 10

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

TEA1083; TEA1083A

CHARACTERISTICS

V

SUP

= 3.6 V; VSS = 0 V; I

SUP

= 15 mA; V

SUP

= 0 V (RMS); f = 800 Hz; T

amb

= 25 °C; PD = LOW; LSE = HIGH;

loudspeaker amplifier load = 50 Ω; all measurements taken in test circuit Fig.10; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

SUP

Minimum DC input voltage − VBB + 0.6 − V

V

SUP−SREF

Internal reference voltage 400 500 600 mV

V

BB

Stabilized supply voltage I

SUP

= 15 mA 2.75 2.95 3.15 V

∆V

BB

Variation of supply voltage from I

SUP

= 15 to 120 mA − 15 − mV

∆V

BB

/∆T Variation of supply voltage with

temperature, referred to 25 °C

T

amb

= −25 to +75 °C;

I

sup

= 15 mA

−±0.2 − mV/K

I

SUP

Minimum operating current − 2.5 4.0 mA

THD Distortion of AC signal between

SUP and V

EE

V

SUP(RMS)

= 1 V − 0.3 − %

V

no(RMS)

Noise between SUP and V

EE

(RMS value)

psophometrically
weighted (P53 curve)

−−71 − dBmp

Current consumption in
power-down condition

PD = HIGH

I

SUP

V

SUP

= 3.6 V − 50 75 µA

I

BB

VBB = 2.95 V − 400 550 µA

Loudspeaker amplifier inputs LSI1 and LSI2

Z

i

input impedance (LSI1 and LSI2) single ended 7.5 9.5 11.5 kΩ

differential (LSI1 to LSI2) 15 19 23 kΩ

G

v

Voltage gain from LSI1/2 to QLS I

SUP

= 15 mA;

Vi = 2 mV (RMS)

34 35 36 dB

∆G

v

Total gain variation with input
signal from 2 mV(RMS) to
10 mV(RMS)

− 0.2 − dB

∆G/∆T Total gain variation with

temperature referred to 25 °C

T

amb

= −25 to +75 °C −±0.4 − dB

Output capabilities

V

O(p-p)

Maximum output voltage
(peak-to-peak value)

THD = 3%; 50 Ω load 2.0 2.5 − V

V

O(p-p)

Output voltage (peak-to-peak
value)

Vi= 10 mV(RMS);
I

SUP

= 15 mA;

V

SUP−VEE

= 1 V (RMS)

− 1.6 − V

V

no(RMS)

Noise output voltage (RMS
value)

1kΩ between inputs
LSI1 and LSI2;
psophometrically
weighted (P53 curve)

− 250 −µV

Power-down input (PD) (TEA1083A only)

V

IL

LOW level input voltage 0 − 0.3 V

V

IH

HIGH level input voltage 1.5 − V

BB

V

I

PD

Input current PD = HIGH − 2.3 2.8 µA

March 1994 11

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

TEA1083; TEA1083A

Notes to figure 10

1. I

SUP=IIN

− I

TR

2.

3.

4. The pin numbers in parenthesis refer to the TEA1083A/AT

5. LSE has to be HIGH to measure the voltage gain

6. PD has to be HIGH to measure in PD conditions

7. The pins not shown in the TEA1060 are left open-circuit

8. An impedance in series with pin SUP (e.g. an ammeter) should
be avoided as it interferes with the values of I

TR

and I

SUP

.

LSE input

V

IL

LOW level input voltage 0 − 0.3 V

V

IH

HIGH level input voltage 1.5 − V

BB

V

I

I

Input current LSE = HIGH − 510µA

∆G Reduction of gain from LSI1/LSI2

to QLS

LSE = LOW 60 80 − dB

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Fig.10 Test circuit.

handbook, full pagewidth

MGR054

TEA1060

V

CC

V

CC

V

CC

V

LSI

LN

V

EE SLPEREGSTAB

MIC+

GAS1 MIC−

72

GAS2

3

QR+

5

GAR

6

8

C3

4.7
µF

C21
220

µF

C20
470

µF

C1

100

µF

R5

3.6
kΩ

R

LS

50 Ω

R1
620 Ω

R20
150 Ω

R9
20 Ω

16910

115

TEA1083

(TEA1083A)

V

BB

SREF

V

SS

LSE QLS

7 (15)(13) 6

PD

(12)

LSI1

(8) 4

LSI2

(9) 5

1 (1)

8 (16)3 (4)

SUP

2 (2)

18

I

TR

I

in

I

line

I

CC

A

V

SUP

V

SUP − VSREF

I

SUP

I

BB

V

O

V

BB

Gv20 log

V

o

V

LSI

-----------

=

I

TR

V

SUP SREF–

R20

-------------------------------=

March 1994 12

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

TEA1083; TEA1083A

APPLICATION INFORMATION

An application of the TEA1083/83A, in conjunction with a
member of the TEA1060 family, is illustrated in figure 11.
The TEA1083/83A is used for call progress monitoring
during on-hook dialling. The dialling facilities are
performed by a microcontroller (e.g. PCD3344,
PCD3349).
Only the most important components have been shown.
For detailed information refer to a data sheet of the
TEA1060 family.
The electronic hook switch can be replaced by a
mechanical system (hook switch) with a hold/release
function which is intended for on-hook dialling.

o

ok, full pagewidth

MGR055

V

EE

Z

bal

PD

GAR

QR

DTMF

12
6
5

13

MIC−

V

CC

LN

10 16 18

MIC+

7

8

REG SLPE

R4

MICROCONTROLLER AND

INTERFACE CIRCUITRY

ENABLE

DTMFDP/FLMUTE

15 1

C3

4.7
µF

R9
20 Ω

R22

2.2
kΩ

MUTE

14

IR

11

TEA1060

50 kΩ

R21

2.2 kΩ

C2

10 µF

L1

150 µH

C14

150 nF

100 nF

C5

(12)

6

QLS

LSE

(15)
7

(13)

PD

4 (8) 5 (9) 1 (1)

LSI1 LSI2

V

SS

SREF V

BB

TEA1083

(TEA1083A)

SUP

3 (4) 8 (16)2 (2)

C22

220

nF

C23
220

nF

47 µF

C21

C1

100

µF

C24

150 nF

R20
150 Ω

R1

620 Ω
R2
130 kΩ

R8

390 Ω

R3

3.9 kΩ

C20
220

µF

V

SS

V

DD

XTAL

CRS

cradle switch

line-interrupter
electronic
hook switch

a/b

line

b/a

Fig.11 Application example when the TEA1083/83A is used in conjunction with the TEA1060.

Pin numbers in parenthesis refer to the TEA1083A/AT.

March 1994 13

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

TEA1083; TEA1083A

PACKAGE OUTLINES

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

SOT97-1

92-11-17
95-02-04

UNIT

A

max.

12

b

1

(1) (1)

(1)

b

2

cD E e M

Z

H

L

mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

min.

A

max.

b

max.

w

M

E

e

1

1.73

1.14

0.53

0.38

0.36

0.23

9.8

9.2

6.48

6.20

3.60

3.05

0.2542.54 7.62

8.25

7.80

10.0

8.3

1.154.2 0.51 3.2

inches

0.068

0.045

0.021

0.015

0.014

0.009

1.07

0.89

0.042

0.035

0.39

0.36

0.26

0.24

0.14

0.12

0.010.10 0.30

0.32

0.31

0.39

0.33

0.0450.17 0.020 0.13

b

2

050G01 MO-001AN

M

H

c

(e )

1

M

E

A

L

seating plane

A

1

w M

b

1

e

D

A

2

Z

8

1

5

4

b

E

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

pin 1 index

DIP8: plastic dual in-line package; 8 leads (300 mil)

SOT97-1

March 1994 14

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

TEA1083; TEA1083A

UNIT

A

max.

1 2

b

1

cEe M

H

L

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT38-1

92-10-02
95-01-19

A

min.

A

max.

b

max.

w

M

E

e

1

1.40

1.14

0.055

0.045

0.53

0.38

0.32

0.23

21.8

21.4

0.86

0.84

6.48

6.20

0.26

0.24

3.9

3.4

0.15

0.13

0.2542.54 7.62

0.30

8.25

7.80

0.32

0.31

9.5

8.3

0.37

0.33

2.2

0.087

4.7 0.51 3.7

0.15

0.021

0.015

0.013

0.009

0.010.100.0200.19

050G09 MO-001AE

M

H

c

(e )

1

M

E

A

L

seating plane

A

1

w M

b

1

e

D

A

2

Z

16

1

9

8

b

E

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

(1) (1)

D

(1)

Z

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

SOT38-1

March 1994 15

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

TEA1083; TEA1083A

UNIT

A

max.

A

1

A2A

3

b

p

cD

(1)E(1) (1)

eHELLpQ

Z

ywv θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

2.65

0.30

0.10

2.45

2.25

0.49

0.36

0.32

0.23

10.5

10.1

7.6

7.4

1.27

10.65

10.00

1.1

1.0

0.9

0.4

8
0

o
o

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT162-1

8

16

w M

b

p

D

detail X

Z

e

9

1

y

0.25

075E03 MS-013AA

pin 1 index

0.10

0.012

0.004

0.096

0.089

0.019

0.014

0.013

0.009

0.41

0.40

0.30

0.29

0.050

1.4

0.055

0.419

0.394

0.043

0.039

0.035

0.016

0.01

0.25

0.01

0.004

0.043

0.016

0.01

X

θ

A

A

1

A

2

H

E

L

p

Q

E

c

L

v M

A

(A )

3

A

0 5 10 mm

scale

SO16: plastic small outline package; 16 leads; body width 7.5 mm

SOT162-1

95-01-24
97-05-22

March 1994 16

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

TEA1083; TEA1083A

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(order code 9398 652 90011).

DIP

S

OLDERING BY DIPPING OR BY WAVE

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.
Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

W

AVE SOLDERING

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

R

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

March 1994 17

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

TEA1083; TEA1083A

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

March 1994 18

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

TEA1083; TEA1083A

NOTES

March 1994 19

Philips Semiconductors Product specification

Call progress monitor for line powered
telephone sets

TEA1083; TEA1083A

NOTES

Internet: http://www.semiconductors.philips.com

Philips Semiconductors – a worldwide company

© Philips Electronics N.V. 1998 SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Middle East: see Italy
Netherlands: Postbus 90050, 5600PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
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Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
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Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
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United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. [phone],

Fax. [phone]
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220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
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Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
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Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
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Tel. [phone], Fax. [phone]
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Tel. [phone], Fax. [phone]
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Tel. [phone], Fax. [phone]
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Tel. [phone], Fax. [phone]

Hungary: seeAustria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie BesantRoad, Worli, MUMBAI 400 025,
Tel. [phone], Fax.[phone]

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext.2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
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Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax.[phone]

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
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Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
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Printed in The Netherlands 415102/00/02/pp20 Date of release: March 1994 Document order number: 9397 750 nnnnn