Datasheet TEA1081T-C2, TEA1081-C2 Datasheet (Philips)

DATA SH EET

Product specification
Supersedes data of February 1988
File under Integrated Circuits, IC03

September 1994

INTEGRATED CIRCUITS

Philips Semiconductors

TEA1081

Supply circuit with power-down for
telephone set peripherals

September 1994 2

Philips Semiconductors Product specification

Supply circuit with power-down for
telephone set peripherals

TEA1081

FEATURES

• High input impedance for audio signals

• Low DC series resistance

• High output current

• Large audio signal handling capability

• Low distortion

• Two modes of operation:

– output voltage that follows the DC line voltage
– regulated output voltage

• Power-down input

• Low number of external components.

GENERAL DESCRIPTION

The TEA1081 is an integrated circuit for use in
line-powered telephone sets to supply peripheral circuits
for extended dialling and/or loudspeaker facilities.

The IC uses a part of the surplus line current normally
drawn by the voltage regulator of the speech/transmission
circuit. A power-down function isolates the IC from its load
and reduces the input current.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

LN

operating DC line voltage 2.5 − 12.0 V

V

O

DC output voltage 2.0 − 10.0 V

∆V

LN-O

voltage drop from line to output IO=0mA − 0.5 − V

R

S

internal series resistance − 20 −Ω

I

O

output current (pin 7) VLN=4V

TEA1081 −−30 mA
TEA1081T −−20 mA

V

LN(rms)

AC line voltage (RMS value) VLN=4V; IO=15mA;

THD=2%

− 1.5 − V

I

INT

internal supply current VLN=4V; IO= 0 mA;

PD = LOW; VSP= V

O

− 0.8 1.4 mA

T

amb

operating ambient temperature −25 − +70 °C

TYPE NUMBER

PACKAGE

NAME DESCRIPTION VERSION

TEA1081 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

TEA1081T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

September 1994 3

Philips Semiconductors Product specification

Supply circuit with power-down for
telephone set peripherals

TEA1081

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

MLC166

A2

A1

A3

1/2 V

O

POWER-

DOWN

REFERENCE

CURRENT

8
4

6

SP
PD

VA

7

QS

TR2

TR1

0.5 V

R

S

1

LN

5

IF

3

AD

2

VN

TEA1081

PINNING

SYMBOL PIN DESCRIPTION

LN 1 positive line terminal
VN 2 negative line terminal
AD 3 amplifier decoupling
PD 4 power-down input
IF 5 low-pass filter input
VA 6 output voltage adjustment
QS 7 power supply output
SP 8 supply input; power-down circuit

Fig.2 Pin configuration.

age

1
2
3
4

8
7
6
5

SP
QS
VA
IF

LN
VN
AD
PD

TEA1081

MLC167

September 1994 4

Philips Semiconductors Product specification

Supply circuit with power-down for
telephone set peripherals

TEA1081

FUNCTIONAL DESCRIPTION

The TEA1081 is a supply interface between telephone line
and peripheral devices in the telephone set. The high input
impedance of the circuit allows direct connection to the
telephone line (via a diode bridge). An inductor function is
obtained by amplifier A1, resistor RS (see Fig.1) and an
external low-pass RC filter.

Under the control of amplifier A2, transistor TR1 supplies
peripheral devices and transistor TR2 minimizes line
signal distortion by momentarily diverting input current to
ground whenever the instantaneous value of the line
voltage drops below the output voltage.

Internal circuits are biased by a temperature and line
voltage compensated reference current source.

The power-down circuit isolates the supply circuit from
external circuitry.

Line terminals: LN and VN (pins 1 and 2)

The input terminals LN and VN can be connected directly
to the line. The minimum DC line voltage required at the
input is expressed by formula (1); see also Table 1.

(1)

Table 1 Explanation of formula (1).

The internal current (I

INT

) at IO = 0 mA is typically 0.8 mA
at VLN = 4 V and reaches a maximum of 1.4 mA at
VLN=12V.

Supply terminals: QS and VA (pins 7 and 6)

Peripheral devices are supplied from QS (pin 7). Two
modes of output voltage regulation are available.

OUTPUT VOLTAGE FOLLOWS LINE VOLTAGE (SEE FIG.3)
The TEA1081 operates in this mode when there is no

external resistor (RV) between QS and VA (see Fig.6).

SYMBOL DESCRIPTION

I

1

input current

R

S

internal series resistance

V

LNmin

minimum instantaneous line voltage
(1.4 V at IO = 5 mA)

V

LN(P)

required peak level of AC line voltage

V

LNI1RS

× V

LNminVLN P()

V()++=

The output voltage follows the line voltage and is
expressed by formula (2); see also Table 2.

(2)

Table 2 Explanation of formula (2).

R

EGULATED OUTPUT VOLTAGE (SEE FIG.4)

The circuit operates in this mode when an external resistor
(RV) is connected between QS and VA (see Fig.6).

The output voltage is held constant at VO = 2 × I6× RV (V)
as soon as the line voltage
VLN>(2×I6×RV+I1×RS+ 0.5) (V)

The control current I6 is typically 20 µA.

SYMBOL DESCRIPTION

V

LN

line voltage

I

1

input current

R

S

internal series resistance

V

O

V

LNI1RS

0.5+×()– V()=

Fig.3 Output voltage as a function of line voltage.

Application without RV.
(1) I1 = 5 mA.
(2) I1 = 20 mA.
(3) I1 = 30 mA; not valid for TEA1081T.

handbook, halfpage

010

10

0

2

MLC168

4

6

8

2468

V

O

(V)

V (V)

LN

(1)

(2)

(3)

September 1994 5

Philips Semiconductors Product specification

Supply circuit with power-down for
telephone set peripherals

TEA1081

Input and output currents I1 and IO (pins 1 and 7)

The maximum available current into pin 1 (I

1

) is

determined by:

• The minimum line current (I

LINEmin

) that is available for

the telephone set

• The specified minimum input current (I

LNmin

) for the

speech/transmission circuit.

That is I

1max

= I

LINEmin

− I

LNmin

.

At V

LN(rms)

< 150 mV, the input current I1is approximately:

I1=I

INT

+k×IO (mA)

Where:

I

INT

= internal supply current (0.8 mA at VLN= 4 V);

k = correction factor (k < 1.1 for the specified output
current range).

With large line signals the instantaneous line voltage may
drop below VO+ 0.4 V. Normally (when VLN>VO+ 0.4 V),
instantaneous current flows from LN to QS (pin 1 to pin 7)
to the output load.

When VLN<VO+ 0.4 V, the instantaneous current is
diverted to pin 2 to prevent distortion of the line signal.

Fig.4 Output voltage as a function of line voltage.

RV connected between QS and VA.
(1) I1 = 5 mA.
(2) I1 = 20 mA.
(3) I1 = 30 mA; not valid for TEA1081T.

handbook, halfpage

0

6

4

2

0

210

MLC169

468

(1)

(2)

(3)

V

O

(V)

V (V)

LN

V

R = 100 kΩ

75 kΩ

50 kΩ

Input current at V

LN(rms)

= 1 V and without R

V

approximates to:
I1 = I

INT

+2×IO (mA)

The maximum supply current (within the specified output
current limits) available for peripheral devices is shown by:

I

Omax

=

Where:

I

LINEmin

is the minimum line current of the telephone set;

I

LNmin

is the specified minimum input current of the

speech/transmission circuit.

Input low-pass filter: IF (pin 5)

The input impedance between LN and VN at audio
frequencies is determined by the filter elements C

L

(between pins 1 and 5), RL (between pins 5 and 7) and the
internal resistor RS(typical value 20 Ω).

At audio frequencies the TEA1081 behaves as an inductor
of the value LI= CL× RL× RS (H). The typical value of LI at
CL = 2.2 µF and RL = 100 kΩ is 4.4 H.

Amplifier decoupling: AD (pin 3)

To ensure stability, a 68 pF decoupling capacitor is
required between AD (pin 3) and LN (pin 1).
If I

Omin

< 1.5 mA, a 47 pF capacitor has to be added

between AD (pin 3) and VA (pin 6).

Power-down inputs: PD and SP (pins 4 and 8)

During pulse dialling or register recall, or if the input current
to pin 1 is insufficient to maintain the output current, the
supply to peripheral devices can be switched off by
activating the PD input at pin 4. With PD = HIGH, the input
current is reduced to 40 µA (typ.) at V

LN

= 4 V and the

internal circuits are isolated from the load at QS (pin 7).
The power-down circuit is supplied via the SP input (pin 8).

SP can be wired to QS in conditions where VO>V

SPmin

during line interruptions. When VO<V

SPmin

, SP should be
wired to an external supply point (e.g. to VCC of the
TEA1060 family circuit).

When power-down is not required, the PD and SP inputs
can be left open-circuit.

I

LINEminILNmin

– I

INT

–

2

-----------------------------------------------------------

September 1994 6

Philips Semiconductors Product specification

Supply circuit with power-down for
telephone set peripherals

TEA1081

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

LN

positive line voltage continuous − 12 V

during switch-on or line interruptions − 12.5 V

V

LN(RM)

repetitive peak line voltage for a
1 ms pulse per 5 s

12 Ω resistor in series with pin 1 − 28 V

V

I

input voltage (all other terminals) VVN− 0.5 VLN+ 0.5 V

I

1

DC input current

TEA1081 − 120 mA
TEA1081T − 80 mA

I

I

input current (all other terminals) −1+1mA

P

tot

total power dissipation see Fig.5

T

amb

operating ambient temperature −25 +70 °C

T

stg

storage temperature −40 +125 °C

T

j

junction temperature − +125 °C

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air

TEA1081 120 K/W
TEA1081T (mounted on a printed-circuit board of 50 × 50 × 1.5 mm) 260 K/W

Fig.5 Power derating curves.

(1) TEA1081.
(2) TEA1081T.

handbook, halfpage

0 40 120

800

600

200

0

400

MLC170

8020 10060

(1)

(2)

P

tot

(mW)

T ( C)

amb

o

September 1994 7

Philips Semiconductors Product specification

Supply circuit with power-down for
telephone set peripherals

TEA1081

CHARACTERISTICS

V

LN

= 4 V; V

LN(rms)

= 100 mV; IO= 5 mA; f = 300 to 3400 Hz; RL= 100 kΩ; CL= 2.2 µF; RV=75kΩ; T

amb

=25°C;

unless otherwise specified; see Fig.6.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

LN

operating DC line voltage 2.5 − 12.0 V

V

LNmin

minimum instantaneous line voltage −−1.4 V

V

LNmax

maximum instantaneous line voltage 12.0 −−V

Characteristics with R

V

=75kΩ connected between pins 6 and 7 and CL=10µF

I

1

input current (pin 1) V

LN(rms)

=0V − 5.8 − mA

V

LN(rms)

= 1.5 V; IO=15mA − 30 − mA

V

O

output voltage (pin 7) − 3.0 − V

∆V

O

variation of output voltage over the
ranges of:

line voltage V

LN

=4to6V − 100 − mV

temperature T

amb

= +25 to −25 °C −−100 − mV

temperature T

amb

= +25 to +75 °C −−100 − mV

output current I

O

=5to20mA −−100 − mV

I

6

control current (pin 6) − 20 −µA

Characteristics without R

V

I

1

input current (pin 1) V

LN(rms)

=0V − 6.0 − mA

V

LN(rms)

= 1.5 V; IO=15mA − 31 − mA

∆V

LN-O

voltage drop from line to output IO=0mA − 0.5 − V

I

O

= 15 mA; V

LN(rms)

= 1.5 V − 1.1 − V

I

O

output current (pin 7)

TEA1081 −−30 mA
TEA1081T −−20 mA

R

S

internal series resistance − 20 −Ω

I

INT

internal supply current IO= 0 mA; PD = LOW; VSP=VO− 0.8 1.4 mA

I

O

= 0 mA; PD = HIGH (note 1);

VSP>2V

− 40 60 µA

THD total harmonic distortion V

LN(rms)

= 1.5 V −−2%
BRL balance return loss 600 Ω reference 25 −−dB
V

LN(2H)

second harmonic level of line voltage f = 500 Hz; VLN= 0 dBm;

Z

line

= 600 Ω

−−58 − dBm

V

LN(3H)

third harmonic level of line voltage f = 500 Hz; VLN= 0 dBm;

Z

line

= 600 Ω

−−60 − dBm

V

ni(rms)

noise voltage on input terminal
(RMS value)

V

LN(rms)

=0V; RL= 600 Ω;

P53 curve

−−83 − dBmp

Power-down input (pin 4)

V

IL

LOW level input voltage −−0.3 V

V

IH

HIGH level input voltage 1.5 − V

SP

V

I

4

input current −−10 µA

September 1994 8

Philips Semiconductors Product specification

Supply circuit with power-down for
telephone set peripherals

TEA1081

Note

1. Power-down circuit supplied via external source.

APPLICATION INFORMATION

Power-down input (pin 8)

V

8

supply voltage for power-down 2 − V

LN

V

I

8

supply current to power-down circuit V8=3V −−70 µA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Fig.6 Application diagram.

handbook, full pagewidth

MLC171

TELEPHONE

LINE

SPEECH/

TRANSMISSION

CIRCUIT

V

LN

TEA1081

AD
PD
SP

VA

QS

IFLN

VN

3
4

8

2

7

6

51

PERIPHERAL

CIRCUITS

V

O

I

1

I

O

C

O

R = 100 kΩ

L

R

V

C =
47 pF

S

C =
68 pF

D

C = 2.2 µF

L

September 1994 9

Philips Semiconductors Product specification

Supply circuit with power-down for
telephone set peripherals

TEA1081

PACKAGE OUTLINES

Fig.7 Plastic dual in-line package; 8 leads (300 mil); DIP8; SOT97-1.

Dimensions in mm.

handbook, full pagewidth

8.25

7.80

0.38 max

10.0

8.3

7.62

MSA252 - 1

6.48

6.20

1.73 max

5

8

41

1.15
max

0.53
max

0.254 M

3.2

max

4.2

max

3.60

3.05

9.8

9.2

2.54
(3x)

0.51
min

seating plane

September 1994 10

Philips Semiconductors Product specification

Supply circuit with power-down for
telephone set peripherals

TEA1081

Fig.8 Plastic small outline package; 8 leads; body width 3.9 mm (SO8; SOT96-1).

Dimensions in mm.

handbook, full pagewidth

pin 1

index

0.7

0.3

0.49

0.36

1.27

0.25 M
(8x)

1

4

5

0.1 SS

5.0

4.8

4.0

3.8

6.2

5.8

A

8

MBC180 - 1

0.25

0.19

0.7

0.6

1.75

1.35

1.45

1.25

detail A

1.0

0.5

0.25

0.10

0 to 8

o

September 1994 11

Philips Semiconductors Product specification

Supply circuit with power-down for
telephone set peripherals

TEA1081

SOLDERING
Plastic dual in-line packages

B

Y DIP OR WAVE

The maximum permissible temperature of the solder is
260 °C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low-voltage soldering iron below the seating plane
(or not more than 2 mm above it). If its temperature is
below 300 °C, it must not be in contact for more than 10 s;
if between 300 and 400 °C, for not more than 5 s.

Plastic small-outline packages

BYWAVE
During placement and before soldering, the component

must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.

A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.

B

Y SOLDER PASTE REFLOW

Reflow soldering requires the solder paste (a suspension
of fine solder particles, flux and binding agent) to be
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45 °C.

R

EPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING

IRON OR PULSE

-HEATED SOLDER TOOL)

Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between 270
and 320 °C. (Pulse-heated soldering is not recommended
for SO packages.)

For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.

September 1994 12

Philips Semiconductors Product specification

Supply circuit with power-down for
telephone set peripherals

TEA1081

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

September 1994 13

Philips Semiconductors Product specification

Supply circuit with power-down for
telephone set peripherals

TEA1081

NOTES

September 1994 14

Philips Semiconductors Product specification

Supply circuit with power-down for
telephone set peripherals

TEA1081

NOTES

September 1994 15

Philips Semiconductors Product specification

Supply circuit with power-down for
telephone set peripherals

TEA1081

NOTES

Philips Semiconductors

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For all other countries apply to: Philips Semiconductors,
International Marketing and Sales, Building BE-p,
P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands,
Telex 35000 phtcnl, Fax. [phone]

SCD34 © Philips Electronics N.V. 1994

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413061/1500/02/pp16 Date of release: September 1994
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