Datasheet TDA3867T Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA3867T

Quasi-split sound processor with
two FM demodulators

Preliminary specification
File under Integrated Circuits, IC02

January 1992

Philips Semiconductors Preliminary specification

Quasi-split sound processor with two FM demodulators TDA3867T

FEATURES

• Quasi-split sound processor for all FM standards e.g. B/G

• Reduction of spurious video signals by tracking function and AFC for the vision carrier reference circuit; (indispensable

for NICAM)

• AF2 signal automatically muted (at B/G) by the input signal level

GENERAL DESCRIPTION

Symmetrical IF input and gain controlled wideband IF amplifier.
AGC generation due to peak sync Reference amplifier for the regeneration of the vision carrier.
Optimized limiting amplifier for AM suppression in the regenerated vision carrier signal and 90° phase shifter.
Intercarrier mixer for FM sound, output with low-pass filter.
Separate signal processing for 5.5 and 5.74 MHz intercarriers.
Wide supply voltage range, only 300 mW power dissipation at 5 V.

QUICK REFERENCE DATA

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

P

I

P

V

i IF

V

o

supply voltage (pin 24) 4.5 5 8.8 V
supply current (pin 24) − 60 72 mA
IF input sensitivity (−3 dB) − 70 100 µV

audio output signal (RMS value) − 1 − V
THD total harmonic distortion − 0.5 − %
S/N (W) weighted signal-to-noise ratio

for FM − 68 − dB
for FM with 6 kHz sinus vision modulation − 56 − dB

ORDERING AND PACKAGE INFORMATION

EXTENDED

TYPE NUMBER

PINS PIN POSITION MATERIAL CODE

TDA3867T 28 mini-pack plastic SOT136A

PACKAGE

(1)

Note

1. SOT136-1; 1997 January 8.

January 1992 2

Philips Semiconductors Preliminary specification

Quasi-split sound processor with two FM demodulators TDA3867T

Fig.1 Block diagram.

January 1992 3

Philips Semiconductors Preliminary specification

Quasi-split sound processor with two FM demodulators TDA3867T

PINNING

SYMBOL PIN DESCRIPTION

n.c. 1 not connected
n.c. 2 not connected
C

AGC

3 charge capacitor for AGC
n.c. 4 not connected
n.c. 5 not connected
MATR 6 input for stereo matrix correction
FM2R1 7 reference circuit for FM2 (5.74 MHz)
FM2R2 8 reference circuit for FM2 (5,74 MHz)
AF2 9 AF2 output (AF out of 5.74 MHz)
AF1 10 AF1 output (AF out of 5.5 MHz)
FM1R1 11 reference circuit for FM1 (5.5 MHz)
FM1R2 12 reference circuit for FM1 (5.5 MHz)
n.c. 13 not connected
VC-R1 14 reference circuit for the vision carrier (38.9 MHz)
VC-R2 15 reference circuit for the vision carrier (38.9 MHz)
TRACK 16 DC output level for tracking
n.c. 17 not connected
FM1I 18 intercarrier input for FM1 (5.5 MHz)
C

AF1

19 DC-decoupling capacitor for FM1 demodulator (AF1)
ICO 20 intercarrier output signal (5.5/5.74 MHz)
C

AF2

21 DC-decoupling capacitor for FM2 demodulator (AF2)
FM2I 22 intercarrier input for FM2 (5.74 MHz)
GND 23 ground (0 V)
V

P

24 +5 to +8 V supply voltage
n.c. 25 not connected
n.c. 26 not connected
FMIF1 27 IF difference input 1 (B/G standard, 38.9 MHz)
FMIF2 28 IF difference input 2 (B/G standard, 38.9 MHz)

PIN CONFIGURATION

Fig.2 Pin configuration.

January 1992 4

Philips Semiconductors Preliminary specification

Quasi-split sound processor with two FM demodulators TDA3867T

FUNCTIONAL DESCRIPTION

The quasi-split sound processor is
suitable for all FM standards
(e. g. B/G).
The AGC detector uses peak sync
level. Sound carrier SC1 (5.5 MHz)
provides AF1, sound carrier SC2
(5.74 MHz) provides AF2. With no
sound carrier SC2 on pin 22, AF2
output is muted. The mute circuit
prevents false signal recognition in
the stereo decoder at high IF signal
levels when no second sound carrier
exists (mono) and an AF signal is
present in the identification signal
frequency range.
With 1 mV on pin 22, under
measurement conditions, AF2 is
switched on (see limiting amplifier).
Weak input signals at pins 27 and 28
generate noise on pin 22, which is
present in the intercarrier signal and
passes through the 5.74 MHz filter.
Noise on pin 22 inhibits muting. No
misinterpretation due to white noise
occurs in the stereo decoder; when
non-correlated noise masks the
identification signal frequencies,
which may be present in sustained
tone signals. The stereo decoder
remains switched to mono.

The series capacitor Cs in the

38.9 MHz resonant circuit provides a
notch at the sound carrier frequency
in order to provide more attenuation
for the sound carrier in the vision
carrier reference channel. The ratio of
parallel/series capacitor depends on
the ratio of VC/SC frequency and has
to be adapted to other TV
transmission standards if necessary,
according to

C

CPfVCfSC⁄()

S

2

-CP.=

The result is an improved “intercarrier
buzz” (up to 10 dB improvement in
sound channel 2 with 250 kHz video
modulation for B/G stereo) or
suppression of 350 kHz video
modulated beat frequency in the
digitally-modulated NICAM
subcarrier. The picture carrier for
quadrature demodulation in the
intercarrier mixer is not exactly
90 degrees due to the shift variation
in the integrated phase shift network.
The tuning of the LC reference circuit
to provide optimal video suppression
at the intercarrier output is not the
same as that to provide optimal
intercarrier buzz suppression. In
order to optimize the AF signal
performance, a fine tuning for the
optimal S/N at the sound channel 2
(from 5.74 MHz) may be performed
with a 250 kHz square wave video
modulation.

Measurements at the demodulators:
For all signal-to-noise measurements
the generator must meet the following
specifications;

phase modulation errors< 0.5 degree
for B/W-jumps intercarrier
signal-to-noise ratio as measured
with “TV demodulator AMF2”
(weighted S/N)
must be > 60 dB at 6 kHz sine wave
modulation of the B/W-signal.

Signal-to-noise ratios are measured
with ∆f=±50 kHz deviation and
f

= 1 kHz; with a deviation of

m

±27 kHz the S/N ratio is deteriorated
by 5.3 dB.

January 1992 5

Philips Semiconductors Preliminary specification

Quasi-split sound processor with two FM demodulators TDA3867T

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134).

SYMBOL PARAMETER MIN. MAX. UNIT

V

P

V

n

P

tot

T

stg

T

amb

V

ESD

Note

1. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor.

supply voltages (pin 24) − 8.8 V
input and output voltage (pins 9, 10, 18, 20, 22, 27 and 28) 0 V

P

V
total power dissipation 0 635 mW
storage temperature range −25 150 °C
operating ambient temperature range 0 70 °C
electrostatic handling

(1)

all pins except 27 and 28 ±500 − V
pins 27 and 28 +400 − V

−500 − V

January 1992 6

Philips Semiconductors Preliminary specification

Quasi-split sound processor with two FM demodulators TDA3867T

CHARACTERISTICS

= 5 V and T

V

P1

f

= 33.158 MHz.

SC2

Vision carrier (VC) modulated with different video signals, modulation depth 100 % (proportional to 10 % residual
carrier).
Vision carrier amplitude (RMS value) V
VC/SC2 = 20 dB. Sound carriers (SC1, SC2) modulated with f = 1 kHz and deviation ∆f=±50 kHz and deviation
∆f=±50 kHz unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P

I

P

IF amplifier (pins 27-28)
R

I

C

I

V

I

V

i IF

∆G

v

B IF bandwidth −3dB 50 70 − MHz
V

3

Resonance amplifier (pins 14-15)
V

o

R

14-15

L inductance Fig.3 and 4 − 0.247 −µH
C capacitance C
Q

L

V

14, 15

Intercarrier mixer output (pin 20)
V

o

B IF bandwidth −1dB − 8.5 − MHz

V

VID/V20

V

VC

R

20

I

o

I

20

V

20

=25°C, measurements taken in Fig.3 with fVC= 38.9 MHz, f

amb

= 10 mV; vision to sound carrier ratios are VC/SC1 = 13 dB and

i VC

= 33.4 MHz and

SC1

supply voltage.range (pin 24) 4.5 5 8.8 V
supply current (pin 24) VP=5V 48 6072mA

input resistance 1.75 2.2 2.65 kΩ
input capacitance 1.0 1.5 2.2 pF
DC potential, voltage (pins 27 and 28) − 1.75 − V
maximum input signal (RMS value) Vo= +1 dB 70 100 − mV
input signal sensitivity (RMS value) −3 dB intercarrier signal

− 70 100 µV

reduction on pin 20

IF gain control range 60 63 − dB

voltage range for gain control (pin 3) G

vision carrier amplitude

min

− G

max

1.7 − 2.6 V

fo= 38.9 MHz − 270 − mV

(peak-to-peak value)
operating resistance − 4 − kΩ

=27pF − 68 − pF

S

Q-factor of resonant circuit Qo=90 − 40 −
DC voltage (pins 14 and 15) − VP−1 − V

output signal for 5.5 MHz (RMS value) 71 95 125 mV
output signal for 5.74 MHz (RMS value) 32 43 56 mV

−3dB − 10 − MHz
residual video AM on intercarrier note 1 − 310%
residual vision carrier (RMS value) 1st/2nd harmonic;

− 0.5 1 mV

(38.9/77.8 MHz)
output resistance (emitter follower) 1 mA emitter current − 30 −Ω
allowable AC output current (pin 20) −−±0.7 mA
allowable DC output current −−−2mA
DC voltage − 1.75 − V

January 1992 7

Philips Semiconductors Preliminary specification

Quasi-split sound processor with two FM demodulators TDA3867T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Limiting amplifiers (pins 18 and 22)

V

i

R

18, 22

V

18, 22

V

i

∆V

i

Tracking automatic frequency control (AFC) of the vision carrier reference circuit.
V

o

F

TR

S AFC steepness (open loop) for

minimum input signal (RMS value) −3 dB AF signal − 300 450 µV
maximum input signal (RMS value) 200 −−mV
input resistance − 560 −Ω
DC voltage − 0 − V
level detector threshold for no muting

only 5.74 MHz channel − 1 − mV
(RMS value, pin 22)

hysteresis of level detector − 5 − dB

tracking output voltage range (pin 16) note 5 VP1−3.3 − VP1−1V
tracking reducing factor for

black picture − 9 −
white test picture − 4 −
50 % grey picture − 6 −

black picture −−8−mV/kHz
white test picture −−3−mV/kHz
50 % grey picture −−5.5 − mV/kHz

FM1 and FM2 demodulators

Measurements with FM IF input signals of 5.5 MHz and 5.74 MHz with V

i IF (rms)

= 10 mV (f

= 1 kHz, deviation

mod

∆f=±50 kHz) on pins 18 and 22 without ceramic filters, RS=50Ω.
De-emphasis of 50 µs and V5=VP (B/G standard). QL−factor = 11 for resonant circuits at pins 7-8 and 11-12.

V

IC

intercarrier signals

− 100 − mV

(RMS values, pins 7-8 and 11-12)

V

DC

V

o

DC voltage (pins 7, 8, 11 and 12) − 1.8 − V
AF output signals

0.75 0.95 1.20 V

(RMS values, pins 9 and 10)

∆V

o

R

9, 10

V

9, 10

I

9, 10

difference of AF signals
between channels (pins 9 and 10)

output resistance − 100 −Ω
DC voltage − 2.1 − V
allowed AC current of emitter output

pin 6 open-circuit;

−−1dB

note 2

note 3 −−±1.5 mA
(peak value)

maximum allowed DC output current −−−2mA

THD total harmonic distortion − 0.5 1.0 %
V

o

α

AM

AF output signal (RMS value) THD = 1.5 % 1.25 −−V
AM suppression 1 kHz, m = 0.3 48 54 − dB

S/N(W) weighted signal-to-noise ratio CCIR 468-3 64 68 − dB
B AF bandwidth −3 dB 0.02 − 100 kHz

α

CR

V

6

crosstalk attenuation (pins 9-10) 60 70 − dB
adjusting voltage for AF2 signal (pin 6) note 4 0 − 5V

January 1992 8

Philips Semiconductors Preliminary specification

Quasi-split sound processor with two FM demodulators TDA3867T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

∆G

AF2

V

19, 21

Audio frequency performance in B/G standard unless otherwise specified.
Measurements on AF outputs (pins 9 and 10)

V

o

dV

9

S/N(W) weighted signal-to-noise ratio CCIR 468-3

RR ripple rejection all standards; f

minimum gain range due to V

6

typical gain range due to V

due to V

6
6

−1.5 − 1.0 dB

−2.5 − 1.5 dB

DC voltage (pins 19 and 21) − 1.7 − V

AF signal attenuation Vi= 400 µV;

mute: AF2 on pin 9 5.74 MHz on pin 22 70 −−dB

DC level deviation after mute switching − 525mV

on output pin 10 de-emphasis 50 µs

black picture f
2T/20T pulses with white bar f
6 kHz sine wave, B/W-modulated f
250 kHz square wave B/W-modulated f

= 5.5 MHz 59 63 − dB

i

= 5.5 MHz 57 61 − dB

i

= 5.5 MHz 52 56 − dB

i

= 5.5 MHz 50 56 − dB

i

on output pin 9

black picture f
2T/20T pulses with white bar f
6 kHz sine wave, B/W-modulated f
250 kHz square wave B/W-modulated f

= 5.742 MHz 57 61 − dB

i

= 5.742 MHz 55 59 − dB

i

= 5.742 MHz 50 54 − dB

i

= 5.742 MHz 50 56 − dB

i

=70Hz

R

30 40 − dB

VR= 200 mV (p-p)

Notes to the characteristics

1. Spurious intercarrier AM: m = (A−B)/A (wherein A = signal at sync; B = signal with 100 % picture modulation.)

2. AF2 signal can be adjusted by V

6

3. For larger current: RL> 2.2 kΩ (pin 9 or 10 to GND) in order to increase the bias current of the output emitter follower.

4. If not used, pin 6 should not be connected.

5. Automatic frequency control (AFC) of the vision carrier reference circuit (pins 14 and 15) for reducing spurious video
signals in the stereo/dual sound modes. The factor of reducing FTR at a deviation ∆fVC specifies the ratio of spurious
signals with/without tracking function.

January 1992 9

Philips Semiconductors Preliminary specification



Quasi-split sound processor with two FM demodulators TDA3867T

(1) CP= 47 pF with the optional use of

tracking (because of C

Fig.3 Test and application circuit (for application SAW-filters must be used).

of the varicaps).

o

Fig.4 Frequency response of the 38.9 MHz reference circuit.

January 1992 10

(1) simple resonance circuit (without Cs)

–=

C

P

=27pF

s

(2) resonance circuit with C

C

SCP

C

= 27 pF (Fig.3)

S

2

f

VC



-------­f



SC

Philips Semiconductors Preliminary specification

Quasi-split sound processor with two FM demodulators TDA3867T

Fig.5 Internal circuits.

January 1992 11

Philips Semiconductors Preliminary specification

Quasi-split sound processor with two FM demodulators TDA3867T

PACKAGE OUTLINE

SO28: plastic small outline package; 28 leads; body width 7.5 mm

D

c

y

Z

28

pin 1 index

1

e

15

14

w M

b

p

SOT136-1

E

H

E

Q

A

2

A

1

L

p

L

detail X

(A )

A

X

v M

A

A

3

θ

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE
VERSION

SOT136-1

A

max.

2.65

0.10

A

0.30

0.10

0.012

0.004

1

A2A3b

2.45

0.25

2.25

0.096

0.01

0.089

IEC JEDEC EIAJ

075E06 MS-013AE

p

0.49

0.36

0.019

0.014

0.32

0.23

0.013

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

18.1

7.6

7.4

0.30

0.29

1.27

0.050

17.7

0.71

0.69

REFERENCES

January 1992 12

eHELLpQ

10.65

10.00

0.419

0.394

1.4

0.055

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

PROJECTION

0.25

0.25 0.1

0.01

0.01

EUROPEAN

ywv θ

Z

0.9

0.4

0.035

0.004

0.016

ISSUE DATE

95-01-24
97-05-22

o

8

o

0

Philips Semiconductors Preliminary specification

Quasi-split sound processor with two FM demodulators TDA3867T

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in

“IC Package Databook”

our

Reflow soldering

Reflow soldering techniques are suitable for all SO
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

(order code 9398 652 90011).

Wave soldering

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

January 1992 13

Philips Semiconductors Preliminary specification

Quasi-split sound processor with two FM demodulators TDA3867T

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

January 1992 14