Datasheet TDA3858 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA3858

Quasi-split sound processor for all
standards

Product specification
File under Integrated Circuits, IC02

June 1994

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3858

FEATURES

• Quasi-split sound processor for all standards e. g. B/G
(FM sound) and L (AM sound)

• Reducing of spurious video signals by tracking function
and AFC for the vision carrier reference circuit;
(recommended for NICAM)

• Automatic muting of the AF2 signal (at B/G) by the input
level

• AM signal processing for L standard and switching over
the audio signal

• Stereo matrix correction

• Layout-compatible with TDA3856 (24 pins) and

GENERAL DESCRIPTION

Separate symmetrical IF inputs for FM or AM sound.
Gain controlled wideband IF amplifier, input select switch.

AGC generation due to peak sync for FM or mean signal
level for AM. Reference amplifier for the regeneration of
the vision carrier. Optimized limiting amplifier for AM
suppression in the regenerated vision carrier signal and
90° phase shifter.

Intercarrier mixer for FM sound, output with low-pass filter.
Separate signal processing for 5.5 and 5.74 MHz
intercarriers. Wide supply voltage range, only 300 mW
power dissipation at 5 V.

TDA3857 (20 pins).

QUICK REFERENCE DATA

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

P1

V

P2

Data at V

I

P

V

i IF

V

O (RMS)

V

O (RMS)

P1

supply voltage (pin 27) 4.5 5 8.8 V
alternative supply voltage (pin 28) 10.8 12 13.2 V

=5 V

supply current (pin 27) − 60 72 mA
IF input sensitivity (−3 dB) − 70 100 µV
audio output signal for FM (B/G) − 1 − V
audio output signal for AM (L) − 0.6 − V

THD total harmonic distortion

for FM − 0.5 − %
for AM − 1 − %

S/N (W) weighted signal-to-noise ratio

for FM − 68 − dB
for AM − 56 − dB

ORDERING INFORMATION

PACKAGE

EXTENDED

TYPE NUMBER

PINS

PIN

POSITION

MATERIAL CODE

TDA3858 32 shrink DIL plastic SOT232

Note

1. SOT 232-1; 1996 November 21.

June 1994 2

(1)

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3858

Fig.1 Block diagram (B/G and L).

June 1994 3

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3858

PINNING

SYMBOL PIN DESCRIPTION

AMIF1 1 AM IF difference input 1 for L standard (32.4 MHz)
AMIF2 2 AM IF difference input 2 for L standard (32.4 MHz)
n.c. 3 not connected
C

AGC

C

AM

MODE 6 3-state input for standard select
MATR 7 input for stereo matrix correction
FM2R1 8 reference circuit for FM2 (5.74 MHz)
FM2R2 9 reference circuit for FM2 (5.74 MHz)
AF2 10 AF2 output (AF out of 5.74 MHz)
AF1 11 AF1 output (AF out of 5.5 MHz or AM)
FM1R1 12 reference circuit for FM1 (5.5 MHz)
FM1R2 13 reference circuit for FM1 (5.5 MHz)
n.c. 14 not connected
n.c. 15 not connected
VC-R1 16 reference circuit for the vision carrier (38.9 MHz)
VC-R2 17 reference circuit for the vision carrier (38.9 MHz)
n.c. 18 not connected
TRACK 19 DC output level for tracking
C

AFAM

FM1l 21 intercarrier input for FM1 (5.5. MHz)
C

AF1

ICO 23 intercarrier output signal (5.5/5.74 MHz)
C

AF2

FM2I 25 intercarrier input for FM2 (5.74 MHz)
GND 26 ground (0 V)
V

P1

V

P2

C

REF

n.c. 30 not connected
FMIF1 31 IF difference input 1 for B/G standard (38.9 MHz)
FMIF2 32 IF difference input 2 for B/G standard (38.9 MHz)

4 charge capacitor for AGC (FM and AM)
5 charge capacitor for AM AGC

20 DC decoupling capacitor for AM demodulator (AF-AM)

22 DC decoupling capacitor for FM1 demodulator (AF1)

24 DC decoupling capacitor for FM2 demodulator (AF2)

27 +5 to +8 V supply voltage (pin 28 not connected)
28 + 12 V supply voltage (pin 27 not connected)
29 charge capacitor for reference voltage

Fig.2 Pin configuration.

June 1994 4

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3858

FUNCTIONAL DESCRIPTION

The quasi-split sound processor is
suitable for all standards. Dependent
on the voltage at pin 6 either FM
mode (B/G) or AM mode (L) is
selected.

B/G standard (FM mode)

Pins 31 and 32 are active, AGC
detector uses peak sync level. Sound
carrier SC1 (5.5 MHz) provides AF1,
sound carrier SC2 (5.74 MHz)
provides AF2.

Muting

With no sound carrier SC2 at pin 25,
AF2 output is muted (in mid-position
of the standard select switch FM
mode without muting of AF2 is
selected).
The mute circuit prevents false signal
recognition in the stereo decoder at
high IF signal levels when no second
sound carrier exists (mono) and an
AF signal is present in the
identification signal frequency range.
With 1 mV at pin 25, under
measurement conditions, AF2 is
switched on (see limiting amplifier).
Weak input signals at pins 31 and 32
generate noise at pin 25, which is
present in the intercarrier signal and
passes through the 5.74 MHz filter.
Noise at pin 25 inhibits muting. No
misinterpretation due to white noise
occurs in the stereo decoder, when
non-correlated noise masks the
identification signal frequencies,
which may be present in sustained
tone signals. The stereo decoder
remains switched to mono.

L standard (AM mode)

Pins 1 and 2 are active, AGC detector
uses mean signal level. The audio
signal from the AM demodulator is
output on AF1, with AF2 output
muted.

Sound carrier notch filter for an
improved intercarrier buzz

The series capacitor Csin the

38.9 MHz resonant circuit provides a
notch at the sound carrier frequency
in order to provide more attenuation
for the sound carrier in the vision
carrier reference channel. The ratio of
parallel/series capacitor depends on
the ratio of VC/SC frequency and has
to be adapted to other TV
transmission standards if necessary,
according to the formula
CS=CP(fVC/fSC)2− CP.

The result is an improved intercarrier
buzz (up to 10 dB improvement in
sound channel 2 with 250 kHz video
modulation for B/G stereo) or
suppression of 350 kHz video
modulated beat frequency in the
digitally-modulated NICAM
subcarrier.

Intercarrier buzz fine tuning with
250 kHz square wave video
modulation

The picture carrier for quadrature
demodulation in the intercarrier mixer
is not exactly 90 degrees due to the
shift variation in the integrated phase
shift network. The tuning of the LC
reference circuit to provide optimal
video suppression at the intercarrier
output is not the same as that to
provide optimal intercarrier buzz
suppression. In order to optimize the
AF signal performance, a fine tuning
for the optimal S/N at the sound
channel 2 (from 5.74 MHz) may be
performed with a 250 kHz square
wave video modulation.

Measurements at the demodulators

For all signal-to-noise measurements
the generator must meet the following
specifications:

phase modulation errors < 0.5°for
B/W-jumps

intercarrier signal-to-noise ratio as
measured with ‘TV-demodulator
AMF2’ (weighted S/N) must
be > 60 dB at 6 kHz sine wave
modulation of the B/W-signal.

Signal-to-noise ratios are measured
with ∆f = ±50 kHz deviation and
f

= 1 kHz; with a deviation of

mod

±30 kHz the S/N ratio is deteriorated
by 4.5 dB.
.

June 1994 5

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3858

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER MIN. MAX. UNIT

V

P1

V

P2

V

I

V

I(12 V)

P

tot

T

stg

T

amb

V

ESD

supply voltage (pin 27) − 8.8 V
supply voltage (pin 28) − 13.2 V
voltage (pins 1, 2, 6, 10, 11, 21, 23, 25, 31and 32) 0 V

V

P

voltage at 12 V supply (pin 6) 0 5.5 V
total power dissipation 0 950 mW
storage temperature −25 +150 °C
operating ambient temperature 0 +70 °C
electrostatic handling (note 1)

all pins except pins 1, 2, 31 and 32 ±500 − V
pins 1, 2, 31 and 32 +400 − V

−500 − V

Note to the Limiting Values

1. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor.

June 1994 6

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3858

CHARACTERISTICS

= 5 V (pin 27) and T

V

P

f

= 33.158 MHz. Vision carrier (VC) modulated with different video signals, modulation depth 100% (proportional to

SC2

10% residual carrier).
Vision carrier amplitude (RMS value) V
VC/SC2 = 20 dB. Sound carriers (SC1, SC2) modulated with f = 1 kHz and deviation ∆f = 50 kHz, unless otherwise
specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P1

V

P2

I

P1

supply voltage (pin 27) pin 28 not

supply voltage (pin 28) pin 27 not

supply current (pin 27) VP1=5 V 48 60 72 mA
IF source control (pin 6)
V

6

input voltage in order to obtain

standards

B/G (FM) with automatic muting pin 6 connected 2.8 − V

B/G (FM) without muting pin 6 connected or

L(AM sound) pin 6 connected 0 − 0.8 V
I

6

V

6(12 V)

input current V6= V

maximum input voltage (pin 6) supply at pin 28 −−5.5 V
IF input not activated (pins 1-2 or 31-32)
R

V

α

I
I
16-17

input resistance −−100 Ω
DC input voltage (pins 1, 2 or 31, 32) LOW set internally −−0.1 V
crosstalk attenuation of IF input

switch

= +25 °C; measurements taken in Fig.3 with fVC= 38.9 MHz, f

amb

= 10 mV; vision to sound carrier ratios are VC/SC1 = 13 dB and

i VC

4.5 5 8.8 V

connected

10.8 12 13.2 V

connected

pin 6 open-circuit − 2.8 − V

1.3 − 2.3 V
alternative
measure: 22 kΩ to
GND

P1

V

=0 V −−−300 µA

6

−−100 µA

note 1 50 56 − dB

= 33.4 MHz and

SC1

P1

V

IF amplifier (pins 1-2 or 31-32)
R

I

C

I

V

I

input resistance 1.8 2.2 − kΩ
input capacitance − 2.0 2.6 pF
DC potential, voltage (pins 1, 2, 31,

32)

V

i IF (RMS)

maximum input signal (RMS value) Vo= +1 dB 70 100 − mV
input signal sensitivity B/G standard

(RMS value, pins 31-32)

−3 dB intercarrier
signal reduction at
pin 23

input signal sensitivity L standard
(RMS value, pin 1-2)

−3 dB intercarrier
signal reduction at
pin 11

June 1994 7

− 1.75 − V

− 70 100 µV

− 70 100 µV

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3858

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

4

∆G

v

B IF bandwidth −3 dB 50 70 − MHz
Resonance amplifier (pins 16-17)
V

o (p-p)

R

16-17

L inductance Figs 3 and 5 − 0.247 −µH
C capacitance − 68 − pF
Q

L

V

16, 17

Intercarrier mixer output (pin 23)
V

o(RMS)

B IF bandwidth −1 dB 6 8.5 − MHz

V

VID/V23

V

VC (RMS)

R

23

I

o

I

23

V

23

voltage for gain control (pin 4) 1.7 − 2.6 V
IF gain control 60 63 − dB

vision carrier amplitude

fo= 38.9 MHz − 270 − mV

(peak-to-peak value)
operating resistance − 4 − kΩ

Q-factor of resonant circuit Qo=90 − 40 −
DC voltage (pins 16 and 17) − VP1− 1 − V

output signal for 5.5 MHz (RMS

71 95 125 mV

value)
output signal for 5.74 MHz

32 43 56 mV

(RMS value)

−3 dB 7 10 − MHz

residual video AM on intercarrier note 2 − 310%
residual vision carrier (RMS value) 1st/2nd harmonic

− 0.5 1 mV
(38.9/77.8 MHz)

output resistance (emitter follower) 1 mA emitter current − 30 −Ω
allowable AC output current (pin 23) −−±0.7 mA
allowable DC output current −−−2mA
DC voltage LC-circuit at pin 16,

1.5 1.75 2.0 V
17 adjusted to
minimum video
content at pin 23

Limiting amplifiers (pins 21 and 25)
v

i(RMS)

minimum input signal (RMS value) −3 dB AF signal − 300 450 µV
maximum input signal (RMS value) 200 −−mV

R

21, 25

V

21, 25

V

i(RMS)

∆V

i

input resistance 450 560 700 Ω
DC voltage − 0 − V
level detector threshold for no muting

(RMS value, pin 25)

only 5.74 MHz
channel

hysteresis of level detector 4 7 12 dB

June 1994 8

0.8 1.2 1.7 mV

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3858

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Tracking Automatic Frequency Control (AFC) of the vision carrier reference circuit

V

0 19

F

TR

S AFC steepness (open loop) for

FM1 and FM2 demodulators

Measurements with FM IF input signals of 5.5 MHz and 5.74 MHz with V
∆f = ±50 kHz) at pins 21 and 25 without ceramic filters, RS=50Ω.
De-emphasis 50 µs and V6= VP1(B/G standard).
QL-factor = 11 for resonant circuits at pins 8-9 and 12-13 (including IC).

V

IC(RMS)

V DC voltage (pins 8, 9, 12 and 13) − 1.8 − V
V

o(RMS)

∆V

o

R

10, 11

V

10, 11

I

10, 11 (M)

I

10, 11

THD total harmonic distortion − 0.5 1.0 %
V

o(RMS)

α

AM

S/N(W) weighted signal-to-noise ratio CCIR468-3 64 68 − dB
B AF bandwidth (−3 dB)

α

CR

V

7

tracking output voltage (pin 19) note 3 VP1− 3.3 − VP1− 1V
tracking reducing factor for

black picture − 9 −
white test picture − 4 −
50% grey picture − 6 −

black picture −−8−mV/kHz
white test picture −−3−mV/kHz
50% grey picture −−5.5 − mV/kHz

intercarrier signals

i IF (RMS)

= 10 mV (f

− 100 − mV

= 1 kHz, deviation

mod

(RMS values, pins 8-9 and 12-13)

AF output signals

0.84 0.95 1.07 V

(RMS values, pins 10 and 11)
difference of AF signals between

note 4 −−1dB

channels (pins 10 and 11)
output resistance 75 100 130 Ω
DC voltage 1.8 2.1 2.4 V
allowed AC current of emitter output

note 5 −−±1.5 mA

(peak value)
maximum allowed DC output current −−−2mA

AF output signal (RMS value) THD = 1.5% 1.25 −− V
AM suppression 1 kHz; m = 0.3 48 54 − dB

lower limit −−20 Hz

upper limit 100 −− kHz
crosstalk attenuation (pins 10-11) 60 70 − dB
adjustment voltage for AF2 note 6

minimum output

− 0 − V

signal
maximum output

− 5 − V

signal

June 1994 9

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3858

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

∆G

AF2min

∆G

AF2max

V

22, 24

AM demodulator V6 = 0 V (AM mode)
input signal at pins 1-2: SC = 32.4 MHz; f

V

o(RMS)

R

11

I

o (M)

I

11

V

11

THD total harmonic distortion Fig.4 − 12%
S/N(W) weighted signal-to-noise ratio CCIR468-3 50 56 − dB
B AF bandwidth (−3 dB)

V

20

AF signal switches

input signals: AM carrier into pin 1, 2 see part AM demodulator

the output signals are related to the signals described in the demodulator parts.
V

o/Vomute

V

oAM/VoFm

V

oFM/VoAM

dV

10, 11

gain for minimum V
gain for maximum V

out

out

V7=0 V −1.5 −2.5 − dB
V7= 5 V 1.0 1.5 − dB

DC voltage (pins 22 and 24) − 1.8 − V

mod

AF output signal at pin 11 (RMS

= 1 kHz; m = 0.8; V

i AM (RMS)

= 10 mV

530 600 675 mV

value)
output resistance (pin 11) 75 100 130 Ω
maximum AC output current (peak

note 5 −−±1.5 mA

value)
maximum DC output current −−−2mA
DC voltage 1.8 2.1 2.4 V

lower limit −−20 Hz

upper limit 100 −− kHz
DC voltage (pin 20) − 2 − V

FM intercarrier into pin 21 see part FM demodulator
no signal in pin 25 (AF2)

AF2 mute attenuation (pin 10) B/G mode; V6=VP70 −− dB
AF1 AM signal (pin 1 1) attenuation of

unwanted FM signal

L mode; V6=0;
FM: modulated;

70 −− dB

AM: unmodulated

AF1 FM signal (pin 1 1) attenuation of
unwanted AM signal

B/G mode; V6=VP;
FM: unmodulated;

70 −− dB

AM: modulated

DC jump at the AF outputs switching to FM or

− 525mV

AM sound or Mute

June 1994 10

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3858

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

AF performance for FM operation (standard B/G)

input signals: B/G IF input signal (pin 31, 32)

unmodulated sound carriers
different video modulation (100%)

the output signals are related to the signals described in the demodulator parts.
(S+N)/N(W) weighted signal-to-noise ratio CCIR468-3;

de-emphasis 50 µs
black picture f
2T/20T pulses with white bar f
6 kHz sine wave, B/W-modulated f
250 kHz square wave,

B/W-modulated
black picture f
2T/20T pulses with white bar f
6 kHz sine wave, B/W-modulated f
250 kHz square wave,

B/W-modulated

= 5.5 MHz 59 63 − dB

i

= 5.5 MHz 57 61 − dB

i

= 5.5 MHz 52 56 − dB

i

f

= 5.5 MHz 50 54 − dB

i

= 5.742 MHz 57 61 − dB

i

= 5.742 MHz 55 59 − dB

i

= 5.742 MHz 50 54 − dB

i

f

= 5.742 MHz 48 52 − dB

i

Ripple rejection of the AF outputs (B/G and L standard)

RR ripple rejection

V

on VP/V

ripple

ripple

on V

out

V

= 200 mV;

R(p-p)

fR= 70 Hz

30 40 − dB

Notes to the characteristics

1. Crosstalk attenuation of IF input switch, measured at R
input signal V

= 20 mV (pins 31-32). AGC voltage V4set to a value to achieve V

i (RMS)

= 470 Ω (instead of LC circuit);

16-17

= 20 mV (pins 16-17).

o(RMS)

After switching (V6= 0 V) measure attenuation.
IF coupling with OFWG3203 and OFWL9350 (Siemens).

2. Spurious intercarrier AM: m = (A − B)/A (A = signal at sync; B = signal with 100% picture modulation).

3. Automatic Frequency Control (AFC) of the vision carrier reference circuit (pins 16 and 17) for reducing spurious video
signals in the stereo/dual sound modes. The factor of reducing FTRat a deviation ∆fVCspecifies the ratio of spurious
signals with/without tracking function.

4. AF signal can be adjusted by V7.

5. For larger current: RL> 2.2 kΩ (pin 10 or 11 to GND) in order to increase the bias current of the output emitter
follower.

6. If not used, pin 7 should not be connected.

June 1994 11

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3858

(1) CP= 47 pF with the optional use of
tracking (because of C

of the varicaps).

0

Fig.3 Test and application circuit for standards B/G and L (for application SAW-filters must be used).

For 12 V supply at pin 28, the capacitors shown at pin 27 must be connected to pin 28.

June 1994 12

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3858

Fig.4 Total harmonic distortion (THD) as a function of audio frequency at AM standard (V6= 0).

(1) simple resonant circuit
(2) resonant circuit with CP=68pF

CS=CP(fVC/fSC)2− C
CS= 27 pF (see Fig.3)

P

Fig.5 Frequency response of the 38.9 MHz reference circuit.

June 1994 13

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3858

APPLICATION INFORMATION

Fig.6 Internal circuits (continued in Fig.7).

June 1994 14

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3858

Fig.7 Internal circuits (continued from Fig.6).

June 1994 15

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3858

PACKAGE OUTLINE

SDIP32: plastic shrink dual in-line package; 32 leads (400 mil)

D

seating plane

L

Z

32

pin 1 index

e

b

SOT232-1

M

E

A

2

A

A

1

w M

b

1

17

E

c

(e )

M

1

H

1

0 5 10 mm

scale

DIMENSIONS (mm are the original dimensions)

A

A

A

UNIT b

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

mm

OUTLINE

VERSION

SOT232-1

max.

4.7 0.51 3.8

12

min.

max.

IEC JEDEC EIAJ

1.3

0.8

b

1

0.53

0.40

REFERENCES

0.32

0.23

cEe M

(1) (1)

D

29.4

28.5

June 1994 16

9.1

8.7

16

(1)

Z

L

3.2

2.8

EUROPEAN

PROJECTION

M

10.7

10.2

E

12.2

10.5

e

1

w

H

0.181.778 10.16

ISSUE DATE

92-11-17
95-02-04

max.

1.6

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3858

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in

“IC Package Databook”

our

Soldering by dipping or by wave

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

(order code 9398 652 90011).

with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

stg max

). If the

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

June 1994 17