Datasheet TDA3856T, TDA3856 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA3856

Quasi-split sound processor for all
standards

Product specification
File under Integrated Circuits, IC02

June 1994

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3856

FEATURES

• Quasi-split sound processor for all standards e. g. B/G (FM sound) and L (AM sound)

• Automatic muting of the AF2 signal (at B/G) by the input level

• AM signal processing for L standard and switching over the audio signal

• Layout-compatible with TDA3858 (32 pins) and TDA3857 (20 pins).

GENERAL DESCRIPTION

Separate symmetrical IF inputs for FM or AM sound.
Gain controlled wideband IF amplifier, input select switch. AGC generation due to peak sync for FM or mean signal level
for AM. Reference amplifier for the regeneration of the vision carrier. Optimized limiting amplifier for AM suppression in
the regenerated vision carrier signal and 90° phase shifter. Intercarrier mixer for FM sound, output with low-pass filter.
Separate signal processing for 5.5 and 5.74 MHz intercarriers. Wide supply voltage range, only 300 mW power
dissipation at 5 V.

QUICK REFERENCE DATA

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

P

I

P

V

i IF

V

o(RMS)

V

o(RMS)

supply voltage (pin 21) 4.5 5 8.8 V
supply current − 60 72 mA
IF input sensitivity (−3 dB) − 70 100 µV
audio output signal for FM (B/G) − 1 − V
audio output signal for AM (L) − 0.6 − V

THD total harmonic distortion

for FM − 0.5 − %
for AM − 1 − %

S/N (W) weighted signal-to-noise ratio

for FM − 68 − dB
for AM − 56 − dB

ORDERING INFORMATION

PACKAGE

EXTENDED

TYPE NUMBER

PINS

PIN

POSITION

MATERIAL CODE

TDA3856 24 shrink DIL plastic SOT234

TDA3856T 24 SO plastic SOT137

(1)
(2)

Note

1. SOT234-1; 1996 November 28.

2. SOT137-1; 1996 November 28.

June 1994 2

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3856

Fig.1 Block diagram (B/G and L).

June 1994 3

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3856

PINNING

SYMBOL PIN DESCRIPTION

AMIF1 1 AM IF difference input 1 for L standard (32.4 MHz)
AMIF2 2 AM IF difference input 2 for L standard (32.4 MHz)
C

AGC

C

AM

MODE 5 3-state input for standard select
FM2R1 6 reference circuit for FM2 (5.74 MHz)
FM2R2 7 reference circuit for FM2 (5.74 MHz)
AF2 8 AF2 output (AF out of 5.74 MHz)
AF1 9 AF1 output (AF out of 5.5 MHz or AM)
FM1R1 10 reference circuit for FM1 (5.5 MHz)
FM1R2 11 reference circuit for FM1 (5.5 MHz)
VC-R1 12 reference circuit for the vision carrier (38.9 MHz)
VC-R2 13 reference circuit for the vision carrier (38.9 MHz)
C

AFAM

FM1| 15 intercarrier input for FM1 (5.5 MHz)
C

AF1

ICO 17 intercarrier output signal (5.5/5.74 MHz)
C

AF2

FM2I 19 intercarrier input for FM2 (5.74 MHz)
GND 20 ground (0 V)
V

P

C

REF

FMIF1 23 IF difference input 1 for B/G standard (38.9 MHz)
FMIF2 24 IF difference input 2 for B/G standard (38.9 MHz)

3 charge capacitor for AGC (FM and AM)
4 charge capacitor for AM AGC

14 DC decoupling capacitor for AM demodulator (AF-AM)

16 DC decoupling capacitor for FM1 demodulator (AF1)

18 DC decoupling capacitor for FM2 demodulator (AF2)

21 +5 to +8 V supply voltage
22 charge capacitor for reference voltage

Fig.2 Pin configuration.

June 1994 4

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3856

FUNCTIONAL DESCRIPTION

The quasi-split sound processor is suitable for all
standards.
Dependent on the voltage at pin 5 either FM mode (B/G)
or AM mode (L) is selected.

B/G standard (FM mode)

Pins 23 and 24 are active, AGC detector uses peak sync
level. Sound carrier SC1 (5.5 MHz) provides AF1, sound
carrier SC2 (5.74 MHz) provides AF2.

Muting

With no sound carrier SC2 at pin 19, AF2 output is muted
(in mid-position of the standard select switch FM mode
without muting of AF2 is selected).
The mute circuit prevents false signal recognition in the
stereo decoder at high IF signal levels when no second
sound carrier exists (mono) and an AF signal is present in
the identification signal frequency range.
With 1 mV at pin 19, under measurement conditions, AF2
is switched on (see limiting amplifier). Weak input signals
at pins 23 and 24 generate noise at pin 19, which is
present in the intercarrier signal and passes through the

5.74 MHz filter. Noise at pin 19 inhibits muting. No
misinterpretation due to white noise occurs in the stereo
decoder, when non-correlated noise masks the
identification signal frequencies, which may be present in
sustained tone signals. The stereo decoder remains
switched to mono.

L standard (AM mode)

Pins 1 and 2 are active, AGC detector uses mean signal
level. The audio signal from the AM demodulator is output
on AF1, with AF2 output muted.

Sound carrier notch filter for an improved intercarrier
buzz

The series capacitor C

in the 38.9 MHz resonant circuit

s

provides a notch at the sound carrier frequency in order to
provide more attenuation for the sound carrier in the vision
carrier reference channel. The ratio of parallel/series
capacitor depends on the ratio of VC/SC frequency and
has to be adapted to other TV transmission standards if
necessary, according to the formula Cs= CP(fvc/fsc)2− CP.
The result is an improved intercarrier buzz (up to 10 dB
improvement in sound channel 2 with 250 kHz video
modulation for B/G stereo) or suppression of 350 kHz
video modulated beat frequency in the digitally-modulated
NICAM subcarrier.

Intercarrier buzz fine tuning with 250 kHz square
wave video modulation

The picture carrier for quadrature demodulation in the
intercarrier mixer is not exactly 90 degrees due to the shift
variation in the integrated phase shift network. The tuning
of the LC reference circuit to provide optimal video
suppression at the intercarrier output is not the same as
that to provide optimal intercarrier buzz suppression. In
order to optimize the AF signal performance, a fine tuning
for the optimal S/N at the sound channel 2 (from 5.74 MHz)
may be performed with a 250 kHz square wave video
modulation.

Measurements at the demodulators

For all signal-to-noise measurements the generator must
meet the following specifications: phase modulation
errors < 0.5° for B/W-jumps
intercarrier signal-to-noise ratio as measured with
‘TV-demodulator AMF2’ (weighted S/N) must be > 60 dB
at 6 kHz sine wave modulation of the B/W-signal.
Signal-to-noise ratios are measured with ∆f=±50 kHz
deviation and f

= 1 kHz; with a deviation of ±30 kHz the

mod

S/N ratio is deteriorated by 4.5 dB.

June 1994 5

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3856

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER MIN. MAX. UNIT

V

P1

V

I

P

tot

T

stg

T

amb

V

ESD

Note to the Limiting Values

1. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor.

supply voltage (pin 21) − 8.8 V
voltage (pins 1, 2, 5, 8, 9, 15, 17, 19, 23 and 24) 0 V

P

V
total power dissipation 0 650 mW
storage temperature −25 +150 °C
operating ambient temperature 0 +70 °C
electrostatic handling (note 1)

all pins except pins 1, 2, 23 and 24 ±500 − V
pins 1, 2, 23 and 24 +400 − V

−500 − V

CHARACTERISTICS

= 5 V and T

V

P

f

= 33.158 MHz. Vision carrier (VC) modulated with different video signals, modulation depth 100% (proportional to

SC2

= +25 °C; measurements taken in Fig.3 with fvc= 38.9 MHz, f

amb

= 33.4 MHz and

SC1

10% residual carrier).
Vision carrier amplitude (RMS value) V

= 10 mV; vision to sound carrier ratios are VC/SC1 = 13 dB and

iVC

VC/SC2 = 20 dB. Sound carriers (SC1, SC2) modulated with f = 1 kHz and deviation ∆f = 50 kHz, unless otherwise
specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P

I

P

supply voltage (pin 21) 4.5 5 8.8 V

supply current (pin 21) 48 60 72 mA
IF source control (pin 5)
V

5

input voltage in order to obtain standards

B/G (FM) with automatic muting pin 5 connected 2.8 − V

V

P

pin 5 open-circuit − 2.8 − V

B/G (FM) without muting pin 5 connected or

1.3 − 2.3 V
alternative measure:
22 kΩ to GND

L (AM sound) pin 5 connected 0 − 0.8 V

I

5

input current V5=V

V

=0 V −−−300 µA

5

P

−−100 µA

IF input not activated (pins 1-2 or 23-24)
R

V

α

I
I
12-13

input resistance −−100 Ω
DC input voltage (pins 1, 2 or 23, 24) LOW set internally −−0.1 V

crosstalk attenuation of IF input switch note 1 50 56 − dB
IF amplifier (pins 1-2 or 23-24)
R

I

C

I

input resistance 1.8 2.2 − kΩ

input capacitance − 2.0 2.6 pF

June 1994 6

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3856

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

I

V

i IF (RMS)

V

3

∆G

v

B IF bandwidth −3 dB 50 70 − MHz
Resonance amplifier (pins 12-13)
V

o (p-p)

R

12-13

L inductance Figs 3 and 5 − 0.247 −µH
C capacitance − 68 − pF
Q

L

V

12, 13

Intercarrier mixer output (pin 17)
V

o (RMS)

B IF bandwidth −1 dB 6 8.5 − MHz

V

VID/V17

V

VC(RMS

R

17

I

o

I

17

V

17

DC potential, voltage (pins 1, 2, 23, 24) − 1.75 − V

maximum input signal (RMS value) Vo= +1 dB 70 100 − mV

input signal sensitivity B/G standard

(RMS value, pins 32-24)

input signal sensitivity L standard

(RMS value, pins 1-2)

−3 dB intercarrier signal
reduction at pin 17

−3 dB intercarrier signal
reduction at pin 9

− 70 100 µV

− 70 100 µV

voltage for gain control (pin 3) 1.7 − 2.6 V

IF gain control 60 63 − dB

vision carrier amplitude

fo= 38.9 MHz − 270 − mV

(peak-to-peak value)

operating resistance − 4 − kΩ

Q-factor of resonant circuit Qo=90 − 40 −

DC voltage (pins 12 and 13) − VP− 1 − V

output signal for 5.5 MHz (RMS value) 71 95 125 mV

output signal for 5.74 MHz (RMS value) 32 43 56 mV

−3 dB 7 10 − MHz

residual video AM on intercarrier note 2 − 310%

) residual vision carrier (RMS value) 1st/2nd harmonic

− 0.5 1 mV

(38.9/77.8 MHz)
output resistance (emitter follower) 1 mA emitter current − 30 −Ω
allowable AC output current (pin 17) −−±0.7 mA
allowable DC output current −−−2mA
DC voltage LC-circuit at pin 12, 13

1.5 1.75 2.0 V
adjusted to minimum
video content at pin 17

Limiting amplifiers (pins 15 and 19)
V

i (RMS)

minimum input signal (RMS value) −3 dB AF signal − 300 450 µV
maximum input signal (RMS value) 200 −− mV

R

15, 19

V

15, 19

V

i (RMS)

input resistance 450 560 700 Ω
DC voltage − 0 − V
level detector threshold for no muting

(RMS value, pin 19)

∆V

i

hysteresis of level detector 4 7 12 dB

June 1994 7

only 5.74 MHz channel 0.8 1.2 1.7 mV

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3856

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

FM1 and FM2 demodulators

Measurements with FM IF input signals of 5.5 MHz and 5.74 MHz with V

i IF (RMS)

= 10 mV (f
∆f=±50 kHz) at pins 15 and 19 without ceramic filters, Rs=50Ω.
De-emphasis 50 µs and V5=VP(B/G standard).
QL-factor = 11 for resonant circuits at pins 6-7 and 10-11 (including IC).

V

IC (RMS)

intercarrier signals

− 100 − mV

(RMS values, pins 6-7 and 10-11)
V DC voltage (pins 6, 7, 10 and 11) − 1.8 − V
V

o(RMS)

AF output signals

0.84 0.95 1.07 V

(RMS values, pins 8 and 9)
∆V

o

difference of AF signals between

−−1dB

channels (pins 8 and 9)
R

8, 9

V

8, 9

I

8, 9(M)

output resistance 75 100 130 Ω

DC voltage 1.8 2.1 2.4 V

allowed AC current of emitter output

note 3 −−±1.5 mA

(peak value)
I

8, 9

maximum allowed DC output current −−−2mA
THD total harmonic distortion − 0.5 1.0 %
V

o(RMS)

α

AM

AF output signal (RMS value) THD = 1.5% 1.25 −− V

AM suppression 1 kHz; m = 0.3 48 54 − dB
S/N(W) weighted signal-to-noise ratio CCIR468-3 64 68 − dB
B AF bandwidth (−3 dB)

lower limit −−20 Hz
upper limit 100 −− kHz

α

CR

V

16, 18

AM demodulator V
input signals at pins 1-2: SC = 32.4 MHz; f

V

o (RMS)

R

9

I

o (M)

I

9

V

9

crosstalk attenuation (pins 9-8) 60 70 − dB

DC voltage (pins 16 and 18) − 1.8 − V

= 0 V (AM mode)

5

= 1 kHz; m = 0.8; V

mod

i AM (RMS)

= 10 mV
AF output signal at pin 9 (RMS value) 530 600 675 mV
output resistance (pin 9) 75 100 130 Ω
maximum AC output current (peak value) note 3 −−±1.5 mA
maximum DC output current −−−2mA
DC voltage 1.8 2.1 2.4 V

THD total harmonic distortion Fig.4 − 12 %
S/N(W) weighted signal-to-noise ratio CCIR468-3 50 56 − dB
B AF bandwidth (−3 dB)

lower limit −−20 Hz
upper limit 100 −− kHz

V

14

DC voltage (pin 14) − 2 − V

= 1 kHz, deviation

mod

June 1994 8

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3856

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

AF signal switches

input signals: AM carrier into pin 1, 2 see part AM demodulator

FM intercarrier into pin 15 see part FM demodulator
no signal in pin 19 (AF2)

the output signals are related to the signals described in the demodulator parts.
V

o/Vomute

V

oAM/VoFM

V

oFM/VoAM

dV

8, 9

AF2 mute attenuation (pin 8) B/G mode; V5=V
AF1 FM signal (pin 9) attenuation of

unwanted FM signal

L mode; V5=0;
FM: modulated;

P

AM: unmodulated

AF1 AM signal (pin 9) attenuation of
unwanted AM signal

B/G mode; V5=V
FM: unmodulated;

P;

AM: modulated

DC jump at the AF outputs switching to FM or AM

sound or Mute

70 −− dB
70 −− dB

70 −− dB

− 525mV

AF performance for FM operation (standard B/G)

input signals: B/G IF input signal (pin 23, 24)

unmodulated sound carriers
different video modulation (100%)

the output signals are related to the signals described in the demodulator parts.
(S+N)/N(W) weighted signal-to-noise ratio CCIR468-3;

de-emphasis 50 µs
black picture f
2T/20T pulses with white bar f
6 kHz sine wave, B/W-modulated f
250 kHz square wave, B/W-modulated f
black picture f
2T/20T pulses with white bar f
6 kHz sine wave, B/W-modulated f
250 kHz square wave, B/W-modulated f

= 5.5 MHz 59 63 − dB

i

= 5.5 MHz 57 61 − dB

i

= 5.5 MHz 52 56 − dB

i

= 5.5 MHz 50 54 − dB

i

= 5.742 MHz 57 61 − dB

i

= 5.742 MHz 55 59 − dB

i

= 5.742 MHz 50 54 − dB

i

= 5.742 MHz 48 52 − dB

i

Ripple rejection of the AF outputs (B/G and L standard)

RR ripple rejection

V

on VP/V

ripple

ripple

on V

out

V

= 200 mV;

R(p-p)

fR=70Hz

30 40 − dB

Notes to the characteristics

1. Crosstalk attenuation of IF input switch, measured at R
input signal V

= 20 mV (pins 23-24). AGC voltage V3set to a value to achieve V

i (RMS)

= 470 Ω (instead of LC circuit);

12-13

= 20 mV (pins 12-13).

o (RMS)

After switching (V5= 0 V) measure attenuation.
IF coupling with OFWG3203 and OFWL9350 (Siemens).

2. Spurious intercarrier AM: m = (A − B)/A (A = signal at sync; B = signal with 100% picture modulation).

3. For larger current: RL> 2.2 kΩ (pin 8 or 9 to GND) in order to increase the bias current of the output emitter follower.

June 1994 9

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3856

Fig.3 Test and application circuit for standards B/G and L (for application SAW-filters must be used).

June 1994 10

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3856

Fig.4 Total harmonic distortion (THD) as function of audio frequency at AM standard (V5= 0).

(1) simple resonant circuit
(2) resonant circuit with CP=68pF

Cs=CP (fVC/fSC)2− C
Cs= 27 pF (see Fig.3)

P

Fig.5 Frequency response of the 38.9 MHz reference circuit.

June 1994 11

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3856

APPLICATION INFORMATION

Fig.6 Internal circuits (continued in Fig.7).

June 1994 12

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3856

Fig.7 Internal circuits (continued from Fig.6).

June 1994 13

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3856

PACKAGE OUTLINES

SDIP24: plastic shrink dual in-line package; 24 leads (400 mil)

D

seating plane

L

Z

24

pin 1 index

e

b

b

1

13

SOT234-1

M

E

A

2

A

A

1

w M

c

E

(e )

M

1

H

1

0 5 10 mm

scale

DIMENSIONS (mm are the original dimensions)

A

A

A

UNIT b

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

mm

OUTLINE

VERSION

SOT234-1

max.

4.7 0.51 3.8

12

min.

max.

IEC JEDEC EIAJ

1.3

0.8

b

1

0.53

0.40

REFERENCES

cEe M

0.32

0.23

(1) (1)

D

22.3

21.4

June 1994 14

9.1

8.7

12

(1)

Z

L

3.2

2.8

EUROPEAN

PROJECTION

M

10.7

10.2

E

12.2

10.5

e

1

w

H

0.181.778 10.16

ISSUE DATE

92-11-17
95-02-04

max.

1.6

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3856

SO24: plastic small outline package; 24 leads; body width 7.5 mm

D

c

y

Z

24

pin 1 index

1

e

13

12

w M

b

p

SOT137-1

E

H

E

Q

A

2

A

1

L

p

L

detail X

(A )

A

X

v M

A

A

3

θ

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE
VERSION

SOT137-1

A

max.

2.65

0.10

A1A

0.30

0.10

0.012

0.004

A3b

2

2.45

0.25

2.25

0.096

0.01

0.089

IEC JEDEC EIAJ

075E05 MS-013AD

0.49

0.36

0.019

0.014

p

0.32

0.23

0.013

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

15.6

7.6

7.4

0.30

0.29

1.27

0.050

15.2

0.61

0.60

REFERENCES

June 1994 15

eHELLpQ

10.65

10.00

0.419

0.394

1.4

0.055

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

PROJECTION

0.25

0.25 0.1

0.01

0.01

EUROPEAN

ywv θ

Z

0.9

0.4

0.035

0.004

0.016

ISSUE DATE

95-01-24
97-05-22

o

8

o

0

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3856

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in

“IC Package Databook”

our

(order code 9398 652 90011).

SDIP

SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

AVE SOLDERING

W
Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

EPAIRING SOLDERED JOINTS

R
Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

June 1994 16

Philips Semiconductors Product specification

Quasi-split sound processor for all standards TDA3856

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

June 1994 17