Page 1
DATA SH EET
Product specification
File under Integrated Circuits, IC02
March 1991
INTEGRATED CIRCUITS
TDA3843
Sound-IF circuit for TV AM-sound
standard L and L’
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March 1991 2
Philips Semiconductors Product specification
Sound-IF circuit for TV AM-sound
standard L and L’
TDA3843
GENERAL DESCRIPTION
The TDA3843 performs the AM-sound demodulation for the L- and L’-standard.
Features
• 5 to 8 V power supply and an alternative 12 V power supply
• Low power consumption (200 mW) at 5 V supply voltage
• New AC-coupled wideband IF-amplifier (high dynamic ranges, less intermodulation)
• In-phase wideband AM demodulator without external reference circuit
• Reduced THD figures even for low AF frequencies (typical 1%)
• Stabilizer circuit for ripple rejection and constant output signals
• All pins are ESD protected
QUICK REFERENCE DATA
PACKAGE OUTLINE
16-lead DIL; plastic (opposite bent leads) (SOT38WBE); SOT38-1; 1996 December 4.
PARAMETER SYMBOL MIN. TYP. MAX. UNIT
Supply voltage (pin 14) V
P1
4.5 5 8.8 V
Supply voltage (pin 11) V
P2
10.8 12 13.2 V
Supply current I
11, 14-13
− 40 48 mA
Minimum IF input (RMS value) V
1-16
− 70 100 µV
IF control range ∆G
V
60 63 − dB
AF output signal (RMS value) V
6-13
− 550 − mV
Signal plus weighted-noise to
weighted-noise ratio
(CCIR 468-3) S + W/W 50 56 − dB
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March 1991 3
Philips Semiconductors Product specification
Sound-IF circuit for TV AM-sound
standard L and L’
TDA3843
Fig.1 Block diagram.
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March 1991 4
Philips Semiconductors Product specification
Sound-IF circuit for TV AM-sound
standard L and L’
TDA3843
Fig.2 Input/output loading diagram.
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March 1991 5
Philips Semiconductors Product specification
Sound-IF circuit for TV AM-sound
standard L and L’
TDA3843
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
CHARACTERISTICS
V
P1
= 5 V (see note 1); T
amb
= 25 °C; unless otherwise specified
PARAMETER SYMBOL MIN. MAX. UNIT
Supply voltage (pin 14) V
P1
4.5 8.8 V
Supply voltage (pin 11) V
P2
10.8 13.2 V
Operating ambient temperature range T
amb
0 + 70 °C
Storage temperature range T
stg
−25 + 125 °C
Total power dissipation at V
P2
P
tot
− 635 mW
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Current consumption I
11
− 40 48 mA
IF amplifier
Input resistance R
1-16
− 2 − kΩ
Input capacitance C
1-16
− 2.5 − pF
Minimum IF input signal
(RMS value) note 2 V
1-16
− 70 100 µV
Maximum IF input signal
(RMS value) note 3 V
1-16
70 100 − mV
Gain control range 60 63 − dB
IF bandwidth −3dB 50 70 − MHz
DC potential V
1/16-3
− 1.7 − V
AM demodulator
note 4
AF output signal (RMS value) V
6-13
440 550 660 mV
AF bandwidth −3 dB, note 5 V
6-13
0.02 −>100 kHz
Total harmonic distortion THD − 12%
Signal plus weighted-noise
to weighted-noise ratio
(CCIR 468-3) note 6 S+W/W 50 56 − dB
DC potential V
6-13
− 1.8 − V
Output resistance emitter follower
with 0.5 mA bias
current R
6
− 200 −Ω
Allowable AC output current
(peak-to-peak value) note 7 ±I
6
−−0.3 mA
Allowable DC output current −I
6
−−1mA
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Philips Semiconductors Product specification
Sound-IF circuit for TV AM-sound
standard L and L’
TDA3843
Notes to the characteristics
1. Using the power supply voltage range VP1 = 5 to 8 V, the performance will not essentially change. Using the power
supply voltage range, VP2 = 12 V, the performance will be comparable with the performance at VP1 = 5 to 8 V. The
unused power supply pin must not be connected.
2. Start of gain control (low IF input signal) at −3 dB AF signal reduction at pin 6.
3. End of gain control (high IF input signal) at +1 dB AF signal expansion at pin 6.
4. Sound carrier = 32.4 MHz modulated with f = 1 kHz and a modulation depth m = 80%.
IF input signal V
1-16
= 10 mV (RMS value).
5. A maximum value of 100 kHz is guaranteed, but, typically a maximum value of 700 kHz is found.
6. The capacitor at pin 4 may be omitted, but then the S+W/W figure will be degraded by up to 8 dB in the IF voltage
range 1 mV up to 100 mV.
7. If a higher AC output current is required, an external resistor must be connected from the output to ground. This is
to increase the bias current of the emitter follower (note, the maximum allowable DC output current).
Ripple rejection
V
ripple
< 200 mV
(peak-to-peak),
50 to 100 Hz,
measured at 70 Hz
AF signal output αRR = V
ripple
on VP/V
ripple on
V
O
αRR
30 40 − dB
IF filter
Proposal for sound carrier
filter for L-standard Fig.5
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
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March 1991 7
Philips Semiconductors Product specification
Sound-IF circuit for TV AM-sound
standard L and L’
TDA3843
Fig.3 Test circuit, 5 V supply.
Fig.4 Test circuit, 12 V supply.
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Philips Semiconductors Product specification
Sound-IF circuit for TV AM-sound
standard L and L’
TDA3843
Where SC = sound carrier and PC = picture carrier.
Fig.5 AM IF filter for standard L.
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March 1991 9
Philips Semiconductors Product specification
Sound-IF circuit for TV AM-sound
standard L and L’
TDA3843
PACKAGE OUTLINE
UNIT
A
max.
1 2
b
1
cEe M
H
L
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT38-1
92-10-02
95-01-19
A
min.
A
max.
b
max.
w
M
E
e
1
1.40
1.14
0.055
0.045
0.53
0.38
0.32
0.23
21.8
21.4
0.86
0.84
6.48
6.20
0.26
0.24
3.9
3.4
0.15
0.13
0.2542.54 7.62
0.30
8.25
7.80
0.32
0.31
9.5
8.3
0.37
0.33
2.2
0.087
4.7 0.51 3.7
0.15
0.021
0.015
0.013
0.009
0.010.100.0200.19
050G09 MO-001AE
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w M
b
1
e
D
A
2
Z
16
1
9
8
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1) (1)
D
(1)
Z
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
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Philips Semiconductors Product specification
Sound-IF circuit for TV AM-sound
standard L and L’
TDA3843
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
(order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the printed-circuit board has been pre-heated, forced cooling may
be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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