Datasheet TDA3843 Datasheet (Philips)

Page 1
INTEGRATED CIRCUITS
DATA SH EET
TDA3843
Sound-IF circuit for TV AM-sound standard L and L’
Product specification File under Integrated Circuits, IC02
March 1991
Page 2
Philips Semiconductors Product specification
Sound-IF circuit for TV AM-sound
TDA3843
standard L and L’

GENERAL DESCRIPTION

The TDA3843 performs the AM-sound demodulation for the L- and L’-standard.

Features

5 to 8 V power supply and an alternative 12 V power supply
Low power consumption (200 mW) at 5 V supply voltage
New AC-coupled wideband IF-amplifier (high dynamic ranges, less intermodulation)
In-phase wideband AM demodulator without external reference circuit
Reduced THD figures even for low AF frequencies (typical 1%)
Stabilizer circuit for ripple rejection and constant output signals
All pins are ESD protected

QUICK REFERENCE DATA

PARAMETER SYMBOL MIN. TYP. MAX. UNIT
Supply voltage (pin 14) V Supply voltage (pin 11) V Supply current I Minimum IF input (RMS value) V IF control range G AF output signal (RMS value) V Signal plus weighted-noise to
weighted-noise ratio (CCIR 468-3) S + W/W 50 56 dB
P1 P2
11, 14-13
1-16
V
6-13
4.5 5 8.8 V
10.8 12 13.2 V
40 48 mA
70 100 µV 60 63 dB
550 mV

PACKAGE OUTLINE

16-lead DIL; plastic (opposite bent leads) (SOT38WBE); SOT38-1; 1996 December 4.
Page 3
Philips Semiconductors Product specification
Sound-IF circuit for TV AM-sound standard L and L’
TDA3843
Fig.1 Block diagram.
Page 4
Philips Semiconductors Product specification
Sound-IF circuit for TV AM-sound standard L and L’
TDA3843
March 1991 4
Fig.2 Input/output loading diagram.
Page 5
Philips Semiconductors Product specification
Sound-IF circuit for TV AM-sound
TDA3843
standard L and L’

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER SYMBOL MIN. MAX. UNIT
Supply voltage (pin 14) V Supply voltage (pin 11) V Operating ambient temperature range T Storage temperature range T Total power dissipation at V
P2
P1 P2 amb stg
P
tot

CHARACTERISTICS

= 5 V (see note 1); T
V
P1
= 25 °C; unless otherwise specified
amb
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Current consumption I
11
IF amplifier
Input resistance R Input capacitance C
1-16 1-16
Minimum IF input signal
(RMS value) note 2 V
1-16
Maximum IF input signal
(RMS value) note 3 V
1-16
Gain control range 60 63 dB IF bandwidth 3dB 50 70 MHz DC potential V
AM demodulator
note 4
AF output signal (RMS value) V AF bandwidth 3 dB, note 5 V
1/16-3
6-13 6-13
Total harmonic distortion THD 12% Signal plus weighted-noise
to weighted-noise ratio (CCIR 468-3) note 6 S+W/W 50 56 dB
DC potential V
6-13
Output resistance emitter follower
with 0.5 mA bias current R
6
Allowable AC output current
(peak-to-peak value) note 7 ±I
Allowable DC output current I
6 6
4.5 8.8 V
10.8 13.2 V 0 + 70 °C
25 + 125 °C
635 mW
40 48 mA
2 k
2.5 pF
70 100 µV
70 100 mV
1.7 V
440 550 660 mV
0.02 −>100 kHz
1.8 V
200 −Ω
−−0.3 mA
−−1mA
Page 6
Philips Semiconductors Product specification
Sound-IF circuit for TV AM-sound
TDA3843
standard L and L’
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
V
< 200 mV
Ripple rejection
AF signal output αRR = V
IF filter
Proposal for sound carrier
filter for L-standard Fig.5
Notes to the characteristics
1. Using the power supply voltage range VP1 = 5 to 8 V, the performance will not essentially change. Using the power supply voltage range, VP2 = 12 V, the performance will be comparable with the performance at VP1 = 5 to 8 V. The unused power supply pin must not be connected.
2. Start of gain control (low IF input signal) at 3 dB AF signal reduction at pin 6.
3. End of gain control (high IF input signal) at +1 dB AF signal expansion at pin 6.
4. Sound carrier = 32.4 MHz modulated with f = 1 kHz and a modulation depth m = 80%. IF input signal V
5. A maximum value of 100 kHz is guaranteed, but, typically a maximum value of 700 kHz is found.
6. The capacitor at pin 4 may be omitted, but then the S+W/W figure will be degraded by up to 8 dB in the IF voltage range 1 mV up to 100 mV.
7. If a higher AC output current is required, an external resistor must be connected from the output to ground. This is to increase the bias current of the emitter follower (note, the maximum allowable DC output current).
= 10 mV (RMS value).
1-16
ripple
(peak-to-peak), 50 to 100 Hz, measured at 70 Hz
ripple
on VP/V V
ripple on
O
αRR
30 40 dB
Page 7
Philips Semiconductors Product specification
Sound-IF circuit for TV AM-sound standard L and L’
TDA3843
Fig.3 Test circuit, 5 V supply.
Fig.4 Test circuit, 12 V supply.
Page 8
Philips Semiconductors Product specification
Sound-IF circuit for TV AM-sound standard L and L’
Where SC = sound carrier and PC = picture carrier.
TDA3843
Fig.5 AM IF filter for standard L.
Page 9
Philips Semiconductors Product specification
Sound-IF circuit for TV AM-sound standard L and L’

PACKAGE OUTLINE

DIP16: plastic dual in-line package; 16 leads (300 mil); long body
D
seating plane
L
Z
16
e
b
b
1
9
A
w M
TDA3843

SOT38-1

M
E
A
2
A
1
c
(e )
1
M
H
pin 1 index
1
0 5 10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT
mm
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
A
max.
4.7 0.51 3.7
OUTLINE VERSION
SOT38-1
min.
A
1 2
max.
0.15
IEC JEDEC EIAJ
050G09 MO-001AE
b
1.40
1.14
0.055
0.045
b
0.53
0.38
0.021
0.015
1
cEe M
0.32
0.23
0.013
0.009
REFERENCES
D
21.8
21.4
0.86
0.84
8
scale
(1) (1)
6.48
6.20
0.26
0.24
E
(1)
Z
e
0.30
1
0.15
0.13
M
L
3.9
3.4
E
8.25
7.80
0.32
0.31
EUROPEAN
PROJECTION
9.5
8.3
0.37
0.33
w
H
0.2542.54 7.62
0.010.100.0200.19
ISSUE DATE
92-10-02 95-01-19
max.
2.2
0.087
Page 10
Philips Semiconductors Product specification
Sound-IF circuit for TV AM-sound
TDA3843
standard L and L’
SOLDERING Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
(order code 9398 652 90011).
). If the printed-circuit board has been pre-heated, forced cooling may
stg max

DEFINITIONS

Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
March 1991 10
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