Datasheet TDA3668AT Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA3668AT

Very low dropout voltage/quiescent
current 5 V regulator with
overvoltage switch off

Preliminary specification
Supersedes data of 1999 Nov 23
File under Integrated Circuits, IC01

2000 Feb 01

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current
5 V regulator with overvoltage switch off

FEATURES

• Fixed 5 V, 100 mA regulator

• Supply voltage range up to 50 V

• Very low quiescent current of 15 µA (typical value)

• Very low dropout voltage

• High ripple rejection

• Very high stability

– Electrolytic capacitors:Equivalent Series Resistance

(ESR) < 38 Ω at I

– Other capacitors: 100 nF at 200 µA ≤ I

REG

≤ 25 mA

REG

≤ 100 mA.

• Pin compatible family TDA3661 to TDA3676

• Protections:

– Reverse polarity safe (down to −25 V without high

reverse current)

– Negative transient of 50 V (RS=10Ω, t < 100 ms)

– Able to withstand voltages up to 18 V at the output

– ESD protected for all pins
– DC short-circuit safe to ground and VP of regulator

– Temperature protection at Tj> 150 °C
– Load dump protection, which will switch off V

GENERAL DESCRIPTION

The TDA3668AT is a fixed 5 V voltage regulator with a
very low dropout voltage and quiescent current, which
operates over a wide supply voltage range.

The regulator should use a supply voltage of VP≤ 50 V.
It has a temperature range of −40 °C ≤ T
and it is available as an automotive version in an
SO8 package.

TDA3668AT

(supply line may be short-circuited)

output

during load dump.

≤ +125 °C,

amb

REG

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

P

I

q

supply voltage regulator on 3 14.4 24 V

load dump; t ≤ 50 ms; t

quiescent supply current VP= 14.4 V; I

REG

≥ 2.5 ms −−50 V

r

=0mA − 15 30 µA

Regulator output

V

REG

V

REG(drop)

output voltage 8 V ≤ VP≤ 22 V; I

6V≤V
T

amb

V

P

T

amb

dropout voltage VP= 4.5 V; I

≤24 V; I

P

≤ 125 °C

= 14.4 V;0.5 mA ≤ I

≤ 125 °C

REG

= 0.5 mA 4.8 5.0 5.2 V

REG
REG

= 0.5 mA;

≤ 100 mA;

REG

4.75 5.0 5.25 V

4.75 5.0 5.25 V

=50mA − 0.18 0.3 V

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TDA3668AT SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

2000 Feb 01 2

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current
5 V regulator with overvoltage switch off

BLOCK DIAGRAM

handbook, halfpage

V

P

8

BAND GAP

TDA3668AT

REGULATOR

PROTECTION

2, 3, 6, 7

GND

THERMAL

MGS588

TDA3668AT

1

REG

Fig.1 Block diagram.

PINNING

SYMBOL PIN DESCRIPTION

REG 1 regulator output
GND 2, 3, 6, and 7 ground; note 1
n.c. 4 and 5 not connected
V

P

8 supply voltage

Note

1. For the SO8 package all GND pins are connected to
theleadframeandcanalsobeusedtoreducethetotal
thermal resistance R

by soldering these pins to a

th(j-a)

ground plane. The ground plane on the top side of the
Printed-Circuit Board (PCB) acts like a heat spreader.

handbook, halfpage

REG

1
2

TDA3668AT

3

GND

4

n.c.

MGS589

Fig.2 Pin configuration.

V

8

P

GNDGND

7

GND

6

n.c.

5

2000 Feb 01 3

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current
5 V regulator with overvoltage switch off

FUNCTIONAL DESCRIPTION

The TDA3668AT is a fixed 5 V regulator which can deliver
output currents up to 100 mA. The regulator is available in
an SO8 package. The regulator is intended for portable,
mains, telephone and automotive applications.
To increase the lifetime of batteries, a specially built-in
clamp circuit keeps the quiescent current of this regulator
very low, also in dropout and full load conditions.

Theregulatorremains operational down to very low supply
voltages and at lower voltages it switches off.

A temperature protection circuit is included, which
switches off the regulator output at a junction temperature
above 150 °C.

A new output circuit guarantees the stability of the
regulator for a capacitor output circuit with an ESR up to
38 Ω. This is very attractive as the ESR of an electrolytic
capacitor increases strongly at low temperatures
(no expensive tantalum capacitor is required).

handbook, halfpage

50

V

P

(V)

14.4

TDA3668AT

MGS590

t

r

t

f

t (ms)

A load dump circuit (see Fig.3) and an overvoltage
protection circuit is built-in which will switch off the IC

Fig.3 Load dump pulse.

above 28 V (typical value).

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

supply voltage operating − 24 V

load dump − 50 V
V
P

P(rp)
tot

reverse polarity supply voltage non-operating −−25 V
total power dissipation temperature of PCB ground

− 4.1 W

plane is 25 °C
T

stg

T

amb

T

j

storage temperature non-operating −55 +150 °C
ambient temperature −40 +125 °C
junction temperature operating −40 +150 °C

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R
R

th(j-a)
th(j-c)

thermal resistance from junction to ambient in free air; soldered 125 K/W
thermal resistance from junction to case to centre pins; soldered 30 K/W

QUALITY SPECIFICATION

In accordance with

“SNW-FQ-611E”

.

2000 Feb 01 4

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current

TDA3668AT

5 V regulator with overvoltage switch off

CHARACTERISTICS

VP= 14.4 V; T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply voltage: pin V

V

P

I

q

Regulator output: pin REG; note 2
V

REG

V

REG(drop)

V

REG(stab)

∆V

REG(line)

∆V

REG(load)

SVRR supply voltage ripple

I

REG(crl)

I

LO(rp)

=25°C; measured in test circuit of Fig.4; unless otherwise specified.

amb

P

supply voltage regulator operating; note 1 3 14.4 24 V

load dump; t
overvoltage protection; regulator

≤ 50 ms; tr≥ 2.5 ms −−50 V

f

24 28 − V

switched off

quiescent current VP= 4.5 V; I

V

= 14.4 V; I

P

6V≤V
6V≤V

≤22 V; I

P

≤22 V; I

P

output voltage 8 V ≤ VP≤ 22 V; I

6V≤V
T

amb

≤24 V; I

P

≤ 125 °C

0.5 mA ≤ I
T

≤ 125 °C

amb

dropout voltage VP= 4.5 V; I

T

≤ 85 °C

amb

=0mA − 10 −µA

REG

=0mA − 15 30 µA

REG

=10mA − 0.2 0.5 mA

REG

=50mA − 1.4 2.5 mA

REG

= 0.5 mA 4.8 5.0 5.2 V

REG

REG

REG

= 0.5 mA;

REG

≤ 100 mA;

= 50 mA;

4.75 5.0 5.25 V

4.75 5.0 5.25 V

− 0.18 0.3 V

long-term stability voltage − 20 − mV/1000 h
line input regulation voltage 8 V ≤ VP≤ 22 V; I

load output regulation
voltage

rejection
current limit V
output leakage current at

7V≤V
T

amb

0.5 mA ≤ I
T

amb

f

P(ripple)

I

REG

REG

VP= −15 V; V

≤22 V; I

P

≤ 85 °C

≤ 50 mA;

REG

≤ 125 °C

= 120 Hz; V

= 0.5 mA

> 4.5 V 0.17 0.25 − A

REG

= 0.5 mA − 130mV

REG
REG

= 0.5 mA;

− 150mV

− 10 50 mV

P(ripple)(rms)

=1V;

50 60 − dB

≤ 0.3 V − 1 500 µA

reverse polarity

Notes

1. The regulator output will follow V

if VP<V

P

REG+VREG(drop)

.

2. Limiting values as applicable for device type: VP≤ 50 V and −40 °C ≤ T

2000 Feb 01 5

≤ +125 °C.

amb

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current
5 V regulator with overvoltage switch off

TEST AND APPLICATION INFORMATION

andbook, halfpage

V

P

(1)

C1
1 µF

(1) C1 is optional (to minimize supply noise only).

81

TDA3668AT

2, 3, 6, 7

MGS591

Fig.4 Test circuit.

C2
10 µF

V

REG

= 5 V

TDA3668AT

2

10

handbook, halfpage

ESR

(Ω)

10

1

−1

10

−1

10

(1) Maximum ESR at 200 µA ≤ I
(2) Minimum ESR only when I

(1)

stable region

(2)

11010

≤ 100 mA.

REG

≤ 200 µA.

REG

Fig.5 Curve for selecting the value of the output

capacitor.

MDA961

C2 (µF)

2

Noise

The output noise is determined by the value of the output
capacitor. The noise figure is measured at a bandwidth of
10 Hz to 100 kHz (see Table 1).

Table 1 Noise figures

OUTPUT

NOISE FIGURE (µV)

CURRENT

I

REG

(mA)

C2 = 10 µFC2=47µF C2 = 100 µF

0.5 550 320 300
50 650 400 400

Stability

The regulator is stabilized with an external capacitor
connectedto the output. The value ofthis capacitor can be
selected using the diagrams shown in Figs 5 and 6.
The following four examples show the effects of the
stabilization circuit using different values for the output
capacitor.

3

10

handbook, halfpage

ESR

(Ω)

2

10

22

10

1

−1

10

110 10

stable region

Fig.6 ESR as a function of I

value of the output capacitor.

MDA962

2

10

I

(mA)

REG

for selecting the

REG

3

2000 Feb 01 6

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current
5 V regulator with overvoltage switch off

EXAMPLE 1
The regulator is stabilized with an electrolytic capacitor of

68 µF (ESR = 0.5 Ω). At T
value is decreased to 22 µF and the ESR is increased
to 3.5 Ω. The regulator will remain stable at a temperature
of T

amb

= −40 °C.

EXAMPLE 2
The regulator is stabilized with an electrolytic capacitor of

10 µF (ESR = 3.3 Ω). At T
value is decreased to 3 µF and the ESR is increased to
20 Ω. The regulator will remain stable at a temperature of
T

= −40 °C.

amb

EXAMPLE 3
The regulator is stabilized with a 100 nF MKT capacitor

connected to the output. Full stability is guaranteed when
the output current is larger then 200 µA. Because the
thermal influence on this capacitor value is almost zero,
the regulator will remain stable at a temperature of
T

= −40 °C.

amb

= −40 °C, the capacitor

amb

= −40 °C, the capacitor

amb

TDA3668AT

For successful operation of the IC (maximum output
current capability) special attention has to be given to the
PCB ground plane required as heatsink, the thermal
capacity of the heatsink and its ability to transfer heat to
the external environment. For the SO8 package it is
possible to reduce the total thermal resistance from
125 to 50 K/W.

APPLICATION CIRCUIT WITH BACKUP FUNCTION
Sometimes a backup function is needed to supply, for

example, a microcontroller for a short period of time when
the supply voltage spikes to 0 V (or even −1 V).

This function can easily be built with the TDA3668AT by
using an output capacitor with a large value. When the
supply voltage is 0 V (or −1 V), only a small current will
flow into pin REG from this output capacitor (a few µA).

The application circuit is given in Fig.7.

EXAMPLE 4
The regulator is stabilized with a 100 nF capacitor in

parallelwithanelectrolyticcapacitorof10 µF connected to
the output.

The regulator is now stable under all conditions and
independent of:

• The ESR of the electrolytic capacitor

• The value of the electrolytic capacitor

• The output current.

Application circuits

The maximum output current of the regulator equals:

150 T

–

–

VPV

amb

5–()×

P

amb

–()×

REG

(mA)=

I

REG max()

When T

amb

=

------------------------------------------------------­R

th(j-a)

150 T

------------------------------------­100 V

=21°C and VP= 14 V the maximum output

current equals 140 mA.

andbook, halfpage

V

P

(1)

C1
1 µF

(1) C1 is optional (to minimizesupply noise only).
(2) C2 ≤ 4700 µF.

81

C2

TDA3668AT

2, 3, 6, 7

MGS592

Fig.7 Application circuit with backup function.

V

= 5 V

REG

(2)

2000 Feb 01 7

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current

TDA3668AT

5 V regulator with overvoltage switch off

Additional application information

This section gives typical curves for various parameters measured on the TDA3668AT. Standard test conditions are:
VP= 14.4 V; T

25

handbook, halfpage

I

q

(µA)

20

15

10

5

amb

=25°C.

MDA947

I

q

(mA)

4

3

2

1

handbook, halfpage

MDA949

0

010

I

= 0 mA.

REG

20 30

V

P

Fig.8 Quiescent current as a function of the

supply voltage.

handbook, halfpage

2

I

q

(mA)

1.5

1

0.5

0

−40 0

(1) Iqat 50 mA load.
(2) Iqat 10 mA load.

(1)

(2)

40 80

120

(V)

MDA951

Tj (°C)

160

0

010 50

20 30

40

VP (V)

Fig.9 Quiescent current increase as a function of

high supply voltage.

0.48

handbook, halfpage

I

q

(mA)

0.44

0.40

0.36
5

I

= 10 mA.

REG

10 15

MDA948

VP (V)

2520

Fig.10 Quiescent current as a function of the

junction temperature.

2000 Feb 01 8

Fig.11 Quiescent current as a function of the

supply voltage.

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current
5 V regulator with overvoltage switch off

MDA950

VP (V)

2520

I

q

(mA)

1.8

1.6

1.4

2

5

handbook, halfpage

10 15

handbook, halfpage

4

I

q

(mA)

3

2

1

0

0 20 100

40 60

TDA3668AT

MDA952

80

I

(mA)

REG

I

= 50 mA.

REG

Fig.12 Quiescent current as a function of the

supply voltage.

5.10

handbook, halfpage

V

REG

(V)

5.05

5.00

4.95

−50 200

050

100 150

MDA953

T

(°C)

j

Fig.13 Quiescent current as a function of the

output current.

handbook, halfpage

6

V

REG
(V)

4

2

0

−50 200

050

100 150

MDA955

T

(°C)

j

I

= 0 mA.

REG

Fig.14 Output voltage as a function of the junction

temperature.

2000 Feb 01 9

I

= 0 mA.

REG

Fig.15 Output voltage thermal protection as a

function of the junction temperature.

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current
5 V regulator with overvoltage switch off

500

handbook, halfpage

V

REG(drop)

(mV)

400

300

200

100

040

80 120

MDA957

I

(mA)

REG

handbook, halfpage

V

REG
(V)

TDA3668AT

I

REG

MDA954

(mA)

6

4

2

0

0

100

200 300

Fig.16 Dropout voltage as a function of the output

current.

−30

handbook, halfpage

SVRR

(dB)

−40

−50

(1)

−60

(2)

(3)

−70
10

I

= 10 mA; C2 = 10 µF.

REG

(1) SVRR at RL= 100 Ω.
(2) SVRR at RL= 500 Ω.
(3) SVRR at RL=10kΩ.

2

10

3

10

MDA956

(1)

(2)

(3)

4

10

f (Hz)

VP= 8 V with pulsed load.

Fig.17 Fold back protection mode.

5

10

Fig.18 SVRR as a function of the ripple frequency.

2000 Feb 01 10

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current
5 V regulator with overvoltage switch off

PACKAGE OUTLINE

SO8: plastic small outline package; 8 leads; body width 3.9 mm

D

c

y

Z

8

5

TDA3668AT

SOT96-1

E

H

E

A

X

v M

A

A

pin 1 index

1

e

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

A

max.

1.75

0.069

A1A2A

0.25

1.45

0.10

1.25

0.010

0.057

0.004

0.049

0.25

0.01

b

3

p

0.49

0.25

0.36

0.19

0.019

0.0100

0.014

0.0075

UNIT

inches

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

4

w M

b

p

0 2.5 5 mm

scale

(1)E(2)

cD

5.0

4.8

0.20

0.19

eHELLpQZywv θ

4.0

1.27

3.8

0.16

0.050

0.15

2

A

6.2

5.8

0.244

0.228

Q

3

A

θ

0.25 0.10.25

0.010.010.041 0.004

(1)

0.7

0.3

0.028

0.012

o

8

o

0

L

p

L

0.7

0.6

0.028

0.024

(A )

1

detail X

1.0

1.05

0.4

0.039

0.016

OUTLINE

VERSION

SOT96-1

IEC JEDEC EIAJ

076E03 MS-012

REFERENCES

2000 Feb 01 11

EUROPEAN

PROJECTION

ISSUE DATE

97-05-22
99-12-27

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current
5 V regulator with overvoltage switch off

SOLDERING
Introduction to soldering surface mount packages

Thistextgivesaverybriefinsighttoacomplextechnology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
totheprinted-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

TDA3668AT

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackageswithleadsonfoursides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Wave soldering

Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

2000 Feb 01 12

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current

TDA3668AT

5 V regulator with overvoltage switch off

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

BGA, LFBGA, SQFP, TFBGA not suitable suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable

(3)

PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

, SO, SOJ suitable suitable

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

The package footprint must incorporate solder thieves downstream and at the side corners.

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

SOLDERING METHOD

WAVE REFLOW

(2)

(3)(4)
(5)

suitable

suitable
suitable

(1)

.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

2000 Feb 01 13

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current
5 V regulator with overvoltage switch off

NOTES

TDA3668AT

2000 Feb 01 14

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current
5 V regulator with overvoltage switch off

NOTES

TDA3668AT

2000 Feb 01 15

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Tel. [phone], Fax. [phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]

Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax. [phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. [phone], Fax [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone], Fax [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

2000

Internet: http://www.semiconductors.philips.com

69

Printed in The Netherlands 753503/03/pp16 Date of release: 2000 Feb 01 Document order number: 9397 750 06799