Datasheet TDA3666AT, TDA3666 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA3666

Very low dropout voltage/quiescent
current 10 V voltage regulator

Preliminary specification
File under Integrated Circuits, IC01

2000 Apr 26

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current
10 V voltage regulator

FEATURES

• Fixed 10 V, 100 mA regulator

• Supply voltage range up to 33 V (45 V)

• Very low quiescent current of 15 µA (typical value)

• Very low dropout voltage

• High ripple rejection

• Very high stability:

– Electrolytic capacitors:Equivalent Series Resistance

(ESR) < 30 Ω at I

– Other capacitors: 100 nFat 200 µA ≤ I

≤ 25 mA (see Fig.6)

REG

REG

≤ 100 mA.

• Pin compatible family TDA3662 to TDA3666

• Protections:

– Reverse polarity safe (down to −25 V without high

reverse current)

– Negative transient of 50 V (RS=10Ω and

t < 100 ms)

– Able to withstand voltages up to 18 V at the output

– ESD protection on all pins
– DC short-circuit safe to ground and VP of the

– Temperature protection (at Tj> 150 °C).

GENERAL DESCRIPTION

The TDA3666 isa fixed 10 V voltage regulatorwith a very
lowdropoutvoltageandquiescentcurrent,whichoperates
over a wide supply voltage range.

The IC is available as:

• TDA3666: VP≤ 45 V; −40 °C ≤ T
SO4 package (automotive)

• TDA3666AT: VP≤ 45 V; −40 °C ≤ T
SO8 package (automotive).

(supply line may be short-circuited)

regulator output

amb

amb

TDA3666

≤ +125 °C and

≤ +125 °C and

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

P

input supply voltage regulator on

TDA3666 3 14.4 45 V
TDA3666AT 3 14.4 45 V

I

q

quiescent supply current VP= 14.4 V; I

=0mA − 15 30 µA

REG

Voltage regulator

V

REG

V

REG(drop)

output voltage 13 V ≤ VP≤ 22 V; I

13 V ≤ V
V

P

0.5 mA ≤ I

dropout voltage VP= 9.3 V; I

T

amb

P

= 14.4 V;

≤ 85 °C

≤ 45 V; I

≤ 100 mA

REG

REG

= 0.5 mA 9.5 10 10.5 V

REG

= 0.5 mA 9.4 10 10.6 V

REG

9.4 10 10.6 V

= 50 mA;

− 0.18 0.3 V

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGES

TDA3666 SO4 plastic small outline package; 4 leads; body width 3.5 mm SOT223-1
TDA3666AT SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

2000 Apr 26 2

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current
10 V voltage regulator

BLOCK DIAGRAM

handbook, halfpage

1 (8)

V

P

REGULATOR

BAND GAP

TDA3666

PROTECTION

2, 4 (2, 3, 6, 7)

GND

THERMAL

3 (1)

MBL130

TDA3666

REG

Pin numbers in brackets refer to the SO8 version.

Fig.1 Block diagram.

PINNING

PIN

SYMBOL

DESCRIPTION

SO4 SO8

V

P

1 8 supply voltage
GND 2 and 4 2, 3, 6 and 7 ground; note 1
REG 3 1 regulator output
n.c. − 4 and 5 not connected

Note

1. For the SO8 package all pins GND are connected to the lead frame and can also be used to reduce the total thermal
resistance R

by soldering these pins to a ground plane. The ground plane on the top side of the PCB acts like a

th(j-a)

heat spreader.

2000 Apr 26 3

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current
10 V voltage regulator

handbook, halfpage

GND

4

TDA3666

132

V

P

GND

REG

MGU151

handbook, halfpage

REG

GND

n.c.

1
2

TDA3666AT

3
4

MBL129

TDA3666

V

8

P

GNDGND

7

GND

6

n.c.

5

Fig.2 Pin configuration of SO4.

FUNCTIONAL DESCRIPTION

The TDA3666 is a fixed 10 V regulator which can deliver
output currents up to 100 mA. The regulator is available in
SO8 and SO4 packages. The regulator is intended for
portable, mains, telephone and automotive applications.
To increase the lifetime of batteries, a specially built-in
clamp circuit keeps the quiescent current of this regulator
very low, also in dropout and full load conditions.

Theregulatorremainsoperationaldown to very low supply
voltages and below this voltage it switches off.

Fig.3 Pin configuration of SO8.

Atemperatureprotectioncircuitisincludedwhichswitches
the regulator output off at a junction temperature
above 150 °C.

A new output circuit guarantees the stability of the
regulator for a capacitor output circuit with an ESR up
to 22 Ω (see Figs 5 and 6). This is very attractive as the
ESR of an electrolytic capacitor increases strongly at low
temperatures (no expensive tantalum capacitor is
required).

2000 Apr 26 4

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current

TDA3666

10 V voltage regulator

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

V

P(rp)

P

tot

T

stg

T

amb

T

j

supply voltage

TDA3666 − 45 V

TDA3666AT − 45 V
reverse polarity supply voltage non-operating −−25 V
total power dissipation

TDA3666AT temperature of copper area

− 4.1 W

is 25 °C

TDA3666 T

=25°C − 5W

amb

storage temperature non-operating −55 +150 °C
ambient temperature operating

TDA3666 −40 +125 °C

TDA3666AT −40 +125 °C
junction temperature operating −40 +150 °C

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

thermal resistance from junction to ambient

SO8 in free air; soldered in 125 K/W

SO4 in free air; soldered in 100 K/W

R

th(j-c)

thermal resistance from junction to case

SO8 to centre pins; soldered in 30 K/W

SO4 in free air 25 K/W

QUALITY SPECIFICATION

In accordance with

“SNW-FQ-611E”

.

2000 Apr 26 5

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current

TDA3666

10 V voltage regulator

CHARACTERISTICS

VP= 14.4 V; T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply voltage: pin V

V

P

I

q

Regulator output: pin REG; note 2
V

REG

V

REG(drop)

V

REG(stab)

∆V

REG(line)

∆V

REG(load)

SVRR supply voltage ripple rejection f

I

REG(crl)

I

LO(rp)

=25°C; measured with test circuit (see Fig.4); unless otherwise specified.

amb

P

supply voltage regulator operating; note 1

TDA3666 3 14.4 45 V
TDA3666AT 3 14.4 45 V

quiescent supply current VP= 4.5 V; I

V

= 14.4 V; I

P

9.5 V ≤ V

9.5 V ≤ V

P
P

output voltage 13 V ≤ VP≤ 22 V; I

0.5 mA ≤ I
T

≤ 125 °C

amb

11 V ≤ V
T

amb

P

≤ 125 °C

dropout voltage VP= 9.3 V; I

T

≤ 85 °C

amb

=0mA − 10 −µA

REG

=0mA − 15 30 µA

REG

≤ 22 V; I
≤ 22 V; I

≤ 100 mA;

REG

≤ 45 V; I

REG

=10mA − 0.2 0.5 mA

REG

=50mA − 1.4 2.5 mA

REG

= 0.5 mA 9.5 10 10.5 V

REG

9.4 10 10.6 V

= 0.5 mA

REG

=50mA;

9.4 10 10.6 V

− 0.18 0.3 V

output voltage long-term stability − 20 − mV/1000 h
line regulation voltage 12 V ≤ VP≤ 22 V; I

12 V ≤ V

load regulation voltage 0.5 mA ≤ I

T

amb

= 120 Hz;

i

V

i(ripple)

I

REG

output current limit V
output leakage current at

REG

VP= −15 V; V

≤ 45 V; I

P

≤ 100 mA;

REG

≤ 125 °C

= 1 V (RMS);

= 0.5 mA

> 9.3 V 0.17 0.25 − A

REG

= 0.5 mA − 130mV

REG

= 0.5 mA − 150mV

REG

− 10 50 mV

50 60 − dB

≤ 0.3 V − 1 500 µA

reverse polarity

Notes

1. The regulator output will follow V

if VP<V

P

REG+VREG(drop)

.

2. Limiting values as applicable for both device types: VP≤ 45 V and −40 °C ≤ T

2000 Apr 26 6

≤ +125 °C.

amb

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current
10 V voltage regulator

TEST AND APPLICATION INFORMATION

handbook, halfpage

V

P

C1

1 µF

C1 is optional (to minimize supply noise only).

13

TDA3666

2, 4

Fig.4 Test circuit (SO4).

MBL131

C2
10 µF

V

REG

= 10 V

TDA3666

2

10

handbook, halfpage

ESR

(Ω)

10

1

−1

10

10

(1) Maximum ESR at 200 µA ≤ I
(2) Minimum ESR only when I

(2)

−1

(1)

stable region

11010

≤ 100 mA.

REG

≤ 200 µA.

REG

Fig.5 Graph for selecting the value of the output

capacitor.

MDA961

C2 (µF)

2

Noise

The output noise is determined by the value of the output
capacitor. The noise figure is measured at a bandwidth of
10 Hz to 100 kHz (see Table 1).

Table 1 Noise figures

OUTPUT

NOISE FIGURE (µV)

CURRENT

I

REG

(mA)

C2 = 10 µFC2=47µF C2 = 100 µF

0.5 550 320 300
50 650 400 400

Stability

The regulator is stabilized with an external capacitor
connectedto the output. The value of thiscapacitor can be
selected using the diagrams shown in Figs 5 and 6.
The following four examples show the effects of the
stabilization circuit using different values for the output
capacitor.

3

10

handbook, halfpage

ESR

(Ω)

2

10

22

10

1

−1

10

110 10

stable region

Fig.6 ESR as a function of I

value of the output capacitor.

MDA962

2

10

I

(mA)

REG

for selecting the

REG

3

2000 Apr 26 7

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current
10 V voltage regulator

EXAMPLE 1
The regulator is stabilized with an electrolytic capacitor of

68 µF (ESR = 0.5 Ω). At T
value is decreased to 22 µF and the ESR is increased
to 3.5 Ω. The regulator will remain stable at a temperature
of T

amb

= −40 °C.

EXAMPLE 2
The regulator is stabilized with an electrolytic capacitor of

10 µF (ESR = 3.3 Ω). At T
value is decreased to 3 µF and the ESR is increased
to 20 Ω. The regulator will remain stable at a temperature
of T

amb

= −40 °C.

EXAMPLE 3
The regulator is stabilized with a 100 nF MKT capacitor

connected to the output. When the output current is over
200 µA full stability is guaranteed.

Because the thermal influence on the capacitor value is
almost zero, the regulator will remain stable at a
temperature of T

amb

= −40 °C.

= −40 °C, the capacitor

amb

= −40 °C, the capacitor

amb

TDA3666

Application circuit with backup function

Sometimes a backup function is needed to supply, for
example, a microcontroller for a short period of time when
the supply voltage spikes to 0 V (or even −1 V).

Thisfunction can easily be built with the TDA3666 by using
an output capacitor with a large value. When the supply
voltage is 0 V (or −1 V), only a small current will flow into
pin REG from this output capacitor (a few µA).

The application circuit is given in Fig.7.

handbook, halfpage

V

P

C1

1 µF

13

TDA3666

C2

V

REG

= 10 V

EXAMPLE 4
The regulator is stabilized with a 100 nF capacitor in

parallelwith an electrolytic capacitor of 10 µF connected to
the output.

The regulator is now stable under all conditions and
independent of:

• The ESR of the electrolytic capacitor

• The value of the electrolytic capacitor

• The output current.

Application circuits

The maximum output current of the regulator equals:

150 T

–

I

REG max()

When T

amb

=

----------------------------------------------------------­R

th j a–()

150 T

=

---------------------------------------- ­100 V

=21°C and VP= 19 V the maximum output

VPV

–

amb

P

amb

–()×

10–()×

REG

mA()

current equals 140 mA.
The total thermal resistance of the TDA3666 can be

decreased from 125 to 50 K/W for the SO8 version. For
the SO4 version it can be decreased from 100 to 40 K/W
when GND pins 2 and 4 of the package are soldered to
the printed-circuit board.

2, 4

MBL132

C1 isoptional (to minimize supply noise only).
C2 ≤ 4700µF.

Fig.7 Application circuit with backup function

(SO4 version).

2000 Apr 26 8

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current

TDA3666

10 V voltage regulator

Additional application information

This section gives typical curves for various parameters measured on the TDA3666AT. Standard test conditions are:
VP= 14.4 V; T

25

handbook, halfpage

I

q

(µA)

20

15

10

5

0

010

amb

=25°C.

MDA947

20 30

V

(V)

P

handbook, halfpage

4

I

q

(mA)

3

2

1

0

010 50

20 30

40

MDA949

VP (V)

I

= 0 mA.

REG

Fig.8 Quiescent current as a function of the

supply voltage.

handbook, halfpage

2

I

q

(mA)

1.5

1

0.5

0

−40 0

(1) Iqat 50 mA load.
(2) Iqat 10 mA load.

(1)

(2)

40 80

120

MDA951

Tj (°C)

160

Fig.9 Quiescent current increase as a function of

high supply voltage.

0.48

handbook, halfpage

I

q

(mA)

0.44

0.40

0.36
5

I

= 10 mA.

REG

10 15

MDA948

VP (V)

2520

Fig.10 Quiescent current as a function of the

junction temperature.

2000 Apr 26 9

Fig.11 Quiescent current as a function of the

supply voltage.

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current
10 V voltage regulator

MDA950

VP (V)

2520

I

q

(mA)

1.8

1.6

1.4

2

5

handbook, halfpage

10 15

handbook, halfpage

4

I

q

(mA)

3

2

1

0

0 20 100

40 60

TDA3666

MDA952

80

I

(mA)

REG

I

= 50 mA.

REG

Fig.12 Quiescent current as a function of the

supply voltage.

10.10

handbook, halfpage

V

REG

(V)

10.05

10.00

9.95

−50 200

050

100 150

MGU152

T

(

°C)

j

Fig.13 Quiescent current as a function of the

output current.

12

handbook, halfpage

V

REG
(V)

9

6

3

0

−50 200

050

100 150

MGU153

T

(

°C)

j

I

= 0 mA.

REG

Fig.14 Output voltage as a function of the junction

temperature.

2000 Apr 26 10

I

= 0 mA.

REG

Fig.15 Output voltage thermal protection as a

function of the junction temperature.

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current
10 V voltage regulator

500

handbook, halfpage

V

REG(drop)

(mV)

400

300

200

100

040

80 120

MDA957

I

(mA)

REG

handbook, halfpage

V

REG

(V)

TDA3666

I

REG

MGU154

(mA)

12

9

6

3

0

0

100

200 300

Fig.16 Dropout voltage as a function of the output

current.

−30

handbook, halfpage

SVRR

(dB)

−40

−50

(1)

−60

(2)

(3)

−70
10

C2 = 10 µF.
(1) SVRR at RL=10kΩ.
(2) SVRR at RL= 500 Ω.
(3) SVRR at RL= 100 Ω.

2

10

3

10

MDA956

(1)

(2)

(3)

4

10

f (Hz)

VP= 11.5 V and pulsed load.

Fig.17 Foldback protection mode.

5

10

Fig.18 SVRR as a function of the ripple frequency.

2000 Apr 26 11

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current

TDA3666

10 V voltage regulator

PACKAGE OUTLINES

SO4: plastic small outline package; 4 leads; body width 3.5 mm SOT223-1

D

c

y

b

1

4

E

H

E

A

X

v M

A

132

Z

DIMENSIONS (mm are the original dimensions)

A

UNIT A

mm

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

max.

1.8

A

0.10

0.02

1

1.7

1.5

e

b

A

0.25

p

3

0.85

0.65

2

b

p

e

1

cD

b

1

3.15

0.35

2.95

0.25

w M

0 2 4 mm

scale

(1)

(1)

e

E

6.7

3.7

3.3

2.3

6.3

A

e1H

4.6

7.3

6.7

Q

A

2

A

1

L

L

detail X

LpQywv

L

E

1.02

1.75

0.62

1.0

0.8

0.1 0.10.2

(A3)

p

Z

1.2

0.7

θ

θ

10°

0°

OUTLINE
VERSION

SOT223-1 TO-261

IEC JEDEC EIAJ

REFERENCES

2000 Apr 26 12

EUROPEAN

PROJECTION

ISSUE DATE

99-08-04
99-12-15

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current
10 V voltage regulator

SO8: plastic small outline package; 8 leads; body width 3.9 mm

D

c

y

Z

8

5

TDA3666

SOT96-1

E

H

E

A

X

v M

A

A

pin 1 index

1

e

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

A

max.

1.75

0.069

A1A2A

0.25

1.45

0.10

1.25

0.010

0.057

0.004

0.049

0.25

0.01

b

3

p

0.49

0.25

0.36

0.19

0.019

0.0100

0.014

0.0075

UNIT

inches

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

4

w M

b

p

0 2.5 5 mm

scale

(1)E(2)

cD

5.0

4.8

0.20

0.19

eHELLpQZywv θ

4.0

1.27

3.8

0.16

0.050

0.15

2

A

6.2

5.8

0.244

0.228

Q

3

A

θ

0.25 0.10.25

0.010.010.041 0.004

0.7

0.3

0.028

0.012

(1)

o

8

o

0

L

p

L

0.7

0.6

0.028

0.024

(A )

1

detail X

1.0

1.05

0.4

0.039

0.016

OUTLINE

VERSION

SOT96-1

IEC JEDEC EIAJ

076E03 MS-012

REFERENCES

2000 Apr 26 13

EUROPEAN

PROJECTION

ISSUE DATE

97-05-22
99-12-27

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current
10 V voltage regulator

SOLDERING
Introduction to soldering surface mount packages

Thistext gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
totheprinted-circuitboardby screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

Wave soldering

Conventional single wave soldering is not recommended
forsurface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

TDA3666

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

2000 Apr 26 14

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current

TDA3666

10 V voltage regulator

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

BGA, SQFP not suitable suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable

(3)

PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

, SO, SOJ suitable suitable

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

The package footprint must incorporate solder thieves downstream and at the side corners.

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

WAVE REFLOW

(2)

(3)(4)
(5)

SOLDERING METHOD

(1)

suitable

suitable
suitable

.

2000 Apr 26 15

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current

TDA3666

10 V voltage regulator

DATA SHEET STATUS

DATA SHEET STATUS

Objective specification Development This data sheet contains the design target or goal specifications for

Preliminary specification Qualification Thisdata sheet contains preliminarydata, and supplementarydata will be

Product specification Production This data sheet contains final specifications. Philips Semiconductors

Note

1. Please consult the most recently issued data sheet before initiating or completing a design.

DEFINITIONS
Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
atthese or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentation or warranty that such applicationswillbe
suitable for the specified use without further testing or
modification.

PRODUCT

STATUS

DEFINITIONS

product development. Specification may change in any manner without
notice.

published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.

reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.

DISCLAIMERS
Life support applications  These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomers using or selling theseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuse of any of these products, conveys no licenceortitle
under any patent, copyright, or mask work right to these
products,andmakesnorepresentationsorwarrantiesthat
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

(1)

2000 Apr 26 16

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current
10 V voltage regulator

NOTES

TDA3666

2000 Apr 26 17

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current
10 V voltage regulator

NOTES

TDA3666

2000 Apr 26 18

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current
10 V voltage regulator

NOTES

TDA3666

2000 Apr 26 19

Philips Semiconductors – a w orldwide compan y

Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

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Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

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Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
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252042 KIEV, Tel. [phone], Fax. [phone]

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United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

2000

Internet: http://www.semiconductors.philips.com

69

Printed in The Netherlands 753503/25/01/pp20 Date of release: 2000 Apr 26 Document order number: 9397 750 06703