Datasheet TDA3664, TDA3664TT Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA3664

Very low dropout voltage/quiescent
current 5 V voltage regulator

Product specification
Supersedes data of 2000 Dec 08
File under Integrated Circuits, IC01

2000 Dec 14

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current
5 V voltage regulator

FEATURES
General

• Fixed 5 V, 100 mA regulator

• Supply voltage range up to 45 V

• Very low quiescent current of 15 µA (typical value)

• Very low dropout voltage

• High ripple rejection

• Very high stability:

– Electrolytic capacitors:Equivalent Series Resistance

(ESR) <22 Ω at worst-case condition

– Other capacitors: 100 nF at 200 µA ≤ I

REG

≤ 100 mA.

• Pin compatible family TDA3662 up to TDA3666.

Protections

• Reverse polarity safe (down to −25 V without high
reverse current)

• Negative transient of 50 V (RS=10Ω and t < 100 ms)

• Able to withstand voltages up to 18 V at the output

(supply line may be short-circuited)

• ESD protection on all pins

• DC short-circuit safe to ground and VP of the regulator

output

• Temperature protection (Tj> 150 °C).

GENERAL DESCRIPTION

TheTDA3664 is a fixed 5 V voltage regulator with very low
dropout voltage/quiescent current, which operates over
a wide supply voltage range.

The regulator is available as:

• TDA3664: SO4 package (automotive)

• TDA3664AT: SO8 package (automotive)

• TDA3664TT: TSSOP8 package (automotive).

Automotive: VP≤ 45 V and −40 °C ≤ T

TDA3664

≤ +125 °C.

amb

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

P

I

q

supply voltage regulator on 3 14.4 45 V
quiescent supply current VP= 14.4 V; I

=0mA − 15 30 µA

REG

Voltage regulator

V

REG

regulator output voltage 6 V ≤ VP≤ 22 V; I

8V≤V

0.5 mA ≤ I

≤45 V; I

P

REG

≤ 100 mA;

= 0.5 mA 4.8 5.0 5.2 V

REG

= 0.5 mA 4.75 5.0 5.25 V

REG

4.75 5.0 5.25 V

VP= 14.4 V

V

REG(drop)

dropout voltage VP= 4.5 V; I

T

≤ 85 °C

amb

REG

= 50 mA;

− 0.18 0.3 V

2000 Dec 14 2

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current

TDA3664

5 V voltage regulator

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

TDA3664 SO4 plastic small outline package; 4 leads; body width 3.5 mm SOT223-1
TDA3664AT SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
TDA3664TT TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1

BLOCK DIAGRAM

handbook, halfpage

1 (8)

V

P

BANDGAP

PACKAGE

REGULATOR

3 (1)

REG

TDA3664

Pin numbers in brackets refer to the SO8 and TSSOP8 version.

Fig.1 Block diagram.

THERMAL

PROTECTION

2, 4 (3)

MGL809

GND

2000 Dec 14 3

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current
5 V voltage regulator

PINNING

SYMBOL

SO4 SO8 TSSOP8

V

P

1 8 8 supply voltage
GND 2 and 4 3 3 ground
REG 3 1 1 regulator output
n.c. − 2, 4, 5, 6 and 7 2,4, 5, 6 and 7 not connected

handbook, halfpage

GND

4

132

V

P

GND

REG

MGL810

PIN

handbook, halfpage

1

REG

2

n.c. n.c.

GND n.c.

n.c. n.c.

3
4

TDA3664

TDA3664

DESCRIPTION

V

8

P

7
6
5

MDA959

Fig.2 Pin configuration of SO4.

FUNCTIONAL DESCRIPTION

The TDA3664 is a fixed 5 V regulator which can deliver
output currents up to 100 mA. The regulator is available in
SO8, TSSOP8 and SO4 packages. The regulator is
intended for portable, mains, telephone and automotive
applications. To increase the lifetime of batteries,
a specially built-in clamp circuit keeps the quiescent
current of this regulator very low, also in dropout and full
load conditions.

Fig.3 Pin configuration of SO8 and TSSOP8.

Theregulatorremains operational down to very low supply
voltages, below which it switches off.

A temperature protection is included, which switches the
regulator output off at IC temperatures above 150 °C.

A new output structure guarantees the stability of the
regulator with an ESR (worst-case) up to 22 Ω,
see Figs 5 and 6. This is very attractive as the ESR of an
electrolytic capacitor increases strongly at low
temperatures (no expensive tantalum capacitor required).

2000 Dec 14 4

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current

TDA3664

5 V voltage regulator

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

V

P(rp)

P

tot

T

stg

T

amb

T

j

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

R

th(j-c)

supply voltage − 45 V
reverse polarity supply voltage non-operating −−25 V
total power dissipation temperature of copper area

TDA3664AT − 0.8 W

is 25 °C

TDA3664TT − 0.65 W

TDA3664 − 5W
storage temperature non-operating −55 +150 °C
ambient temperature operating −40 +125 °C
junction temperature operating −40 +150 °C

thermal resistance from junction to ambient in free air; soldered in

SO8 155 K/W

TSSOP8 220 K/W

SO4 100 K/W
thermal resistance from junction to case (SO4 only) in free air 25 K/W

QUALITY SPECIFICATION

In accordance with

“SNW-FQ-611E”

.

2000 Dec 14 5

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current

TDA3664

5 V voltage regulator

CHARACTERISTICS

VP= 14.4 V; T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply voltage

V

P

I

q

Regulator output: pin REG

V

REG

∆V

REG(line)

∆V

REG(load)

SVRR supply voltage ripple

V

REG(drop)

I

REG(crl)

V

REG(stab)

I

LO(rp)

=25°C; measured in test circuit (see Fig.4); unless otherwise specified.

amb

supply voltage regulator operating; note 1 3 14.4 45 V
quiescent current VP= 4.5 V; I

V

= 14.4 V; I

P

6V≤V
6V≤V

≤22 V; I

P

≤22 V; I

P

output voltage 8 V ≤ VP≤ 22 V, I

=25°C

T

amb

8V≤V

≤22 V, I

P

0.5 mA ≤ I
6V≤V

≤45 V 4.75 5.0 5.25 V

P

line regulation voltage 8 V ≤ VP≤ 16 V; I

7V≤V
7V≤V

≤22 V; I

P

≤45 V; I

P

load regulation voltage 0.5 mA ≤ I

f

= 120 Hz; V

i

rejection

I

REG

= 0.5 mA
dropout voltage VP= 4.5 V; I
current limit V

> 4.5 V 0.17 0.25 − A

REG

=0mA − 10 −µA

REG

=0mA − 15 30 µA

REG

=10mA − 0.2 0.5 mA

REG

= 50 mA; note 2 − 1.4 2.5 mA

REG

= 0.5 mA;

REG

= 0.5 mA 4.75 5.0 5.25 V

REG

≤ 100 mA; note 2 4.75 5.0 5.25 V

REG

= 0.5 mA − 110mV

REG

= 0.5 mA − 130mV

REG

= 0.5 mA − 150mV

REG

≤ 50 mA − 10 50 mV

REG

= 1 V (RMS);

i(ripple)

= 50 mA; T

REG

≤ 85 °C − 0.18 0.3 V

amb

4.8 5.0 5.2 V

50 60 − dB

long-term stability − 20 − mV/1000 h
output leakage current

VP= −15 V, V

≤ 0.3 V − 1 500 µA

REG

at reverse polarity

Notes

1. The regulator output will follow V

2. TDA3664TT: I

≤ 15 mA at T

REG

if VP<V

P

amb

REG+VREG(drop)

≤ 125 °C; I

≤ 30 mA at T

REG

2000 Dec 14 6

.

≤ 85 °C.

amb

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current
5 V voltage regulator

TEST AND APPLICATION INFORMATION

handbook, halfpage

V

P

(1)

C1

1 µF

(1) C1 is optional (to minimizesupply noise only).
(2) C2 = 10 µF.
(3) V

REG

=5V.

13

TDA3664

2, 4

Fig.4 Test circuit (SO4).

MDA960

C2

REG

(2)

(3)

TDA3664

2

10

handbook, halfpage

ESR

(Ω)

10

1

−1

10

−1

10

(1) Maximum ESR at 200 µA ≤ I
(2) Minimum ESR only when I

(1)

stable region

(2)

11010

≤ 100 mA.

REG

≤ 200 µA.

REG

Fig.5 Graph for selecting the value of the output

capacitor C2.

MDA961

C2 (µF)

2

Noise

The output noise is determined by the value of the output
capacitor (see Table 1).

Table 1 Noise figures

OUTPUT

NOISE FIGURE (µV)

(1)

CURRENT

IO(mA)

CO=10µFCO=47µFCO= 100 µF

0.5 550 320 300
50 650 400 400

Note

1. Measured at a bandwidth of 10 Hz to 100 kHz.

Stability

Theregulatorisstabilizedwithanexternal capacitor on the
output. The value of this capacitor can be selected using
thediagramsshowninFigs 5 and 6. The four examples on
the next page show the effects of the stabilization circuit
using different values for the output capacitor.

3

10

handbook, halfpage

ESR

(Ω)

2

10

22

10

1

−1

10

110 10

stable region

Fig.6 ESR as a function of I

value of the output capacitor.

MDA962

2

10

I

(mA)

REG

for selecting the

REG

3

2000 Dec 14 7

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current
5 V voltage regulator

EXAMPLE 1
The regulator is stabilized with an electrolytic output

capacitor of 68 µF (ESR = 0.5 Ω). At−40 °C, the capacitor
value is decreased to 22 µF and the ESR is increased to

3.5 Ω. The regulator will remain stable at a temperature of

−40 °C.

EXAMPLE 2
The regulator is stabilized with an electrolytic output

capacitor of 10 µF (ESR = 3.3 Ω). At−40 °C, the capacitor
value is decreased to 3 µF and the ESR is increased to
20 Ω. The regulator will remain stable at a temperature of

−40 °C.

EXAMPLE 3
The regulator is stabilized with a 100 nF MKT capacitor on

the output. Full stability is guaranteed when the output
current is over 200 µA.

Because the thermal influence on this capacitor value is
almost zero, the regulator will remain stable at
a temperature of −40 °C.

TDA3664

When T
140 mA at VP=14 V.

The total thermal resistance of the TDA3664 (SOT223-1
package) can be decreased to lower values when pin 4
and body of the package are soldered to the printed-circuit
board.

Application circuit with backup function

Sometimes, a backup function is needed to supply, for
example, a microcontroller for a short period of time when
the supply voltage spikes to 0 V (or even −1 V).

ThisfunctioncanbeeasilybuiltwiththeTDA3664byusing
a large output capacitor. When the supply voltage is 0 V
(or −1 V), only a small current will flow into pin REG from
this large output capacitor (a few µA).

The application circuit is given in Fig.7.

=21°C, the maximum output current equals

amb

EXAMPLE 4
The regulator is stabilized with a 100 nF capacitor in

parallel with a electrolytic capacitor of 10 µF on the output.
The regulator is now stable under all conditions and

independent of:

• The ESR of the electrolytic capacitor

• The value of the electrolytic capacitor

• The output current.

Application circuits

The maximum output current of the regulator equals:

150 T

–

I

REG max()

= (mA)

------------------------------------­100 V

150 T

–

=

------------------------------------------------------­R

th(j-a)

amb

5–()×

P

amb

VPV

–()×

REG

handbook, halfpage

V

P

(1)

C1

1 µF

(1) C1 is optional (to minimizesupply noise only).
(2) C2 ≤ 4700 µF.
(3) V

REG

=5V.

13

TDA3664

2, 4

C2

MDA960

REG

(2)

Fig.7 Application circuit with backup function

(SO4 version).

(3)

2000 Dec 14 8

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current

TDA3664

5 V voltage regulator

Additional application information

This section gives typical curves for various parameters measured on the TDA3664AT. Standard test conditions are:
VP= 14.4 V; T

25

handbook, halfpage

I

q

(µA)

20

15

10

5

amb

=25°C.

MDA947

I

q

(mA)

4

3

2

1

handbook, halfpage

MDA949

0

010

I

= 0 mA.

REG

20 30

V

P

Fig.8 Quiescent current as a function of the

supply voltage.

handbook, halfpage

2

I

q

(mA)

1.5

1

0.5

0

−40 0

(1) Iqat 50 mA load.
(2) Iqat 10 mA load.

(1)

(2)

40 80

120

(V)

MDA951

Tj (°C)

160

0

010 50

20 30

40

VP (V)

Fig.9 Quiescent current increase at high supply

voltage.

0.48

handbook, halfpage

I

q

(mA)

0.44

0.40

0.36
5

I

= 10 mA.

REG

10 15

MDA948

VP (V)

2520

Fig.10 Quiescent current as a function of the

junction temperature.

2000 Dec 14 9

Fig.11 Quiescent current as a function of the

supply voltage.

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current
5 V voltage regulator

MDA950

VP (V)

2520

I

q

(mA)

1.8

1.6

1.4

2

5

handbook, halfpage

10 15

handbook, halfpage

4

I

q

(mA)

3

2

1

0

0 20 100

40 60

TDA3664

MDA952

80

I

(mA)

REG

I

= 50 mA.

REG

Fig.12 Quiescent current as a function of the

supply voltage.

5.10

handbook, halfpage

V

REG
(V)

5.05

5.00

4.95

−50 200

050

100 150

MDA953

T

(°C)

j

Fig.13 Quiescent current as a function of the load

current.

handbook, halfpage

6

V

REG
(V)

4

2

0

−50 200

050

100 150

MDA955

T

(°C)

j

I

= 0 mA.

REG

Fig.14 Output voltage as a function of the junction

temperature.

2000 Dec 14 10

I

= 0 mA.

REG

Fig.15 Output voltage thermal protection as a

function of the junction temperature.

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current
5 V voltage regulator

500

handbook, halfpage

V

REG(drop)

(mV)

400

300

200

100

040

80 120

MDA957

I

(mA)

REG

handbook, halfpage

V

REG
(V)

TDA3664

I

REG

MDA954

(mA)

6

4

2

0

0

100

200 300

Fig.16 Dropout voltage as a function of load

current.

−30

handbook, halfpage

SVRR

(dB)

−40

−50

(1)

−60

(2)

(3)

−70
10

(1) SVRR at RL=10kΩ.
(2) SVRR at RL= 500 Ω.
(3) SVRR at RL= 100 Ω.

2

10

3

10

4

10

f (Hz)

MDA956

(1)

(2)

(3)

VP= 8 V; pulsed load.

Fig.17 Foldback protection mode.

5

10

Fig.18 SVRR as a function of the ripple frequency

(Co=10µF).

2000 Dec 14 11

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current

TDA3664

5 V voltage regulator

PACKAGE OUTLINES

SO4: plastic small outline package; 4 leads; body width 3.5 mm SOT223-1

D

c

y

b

1

4

E

H

E

A

X

v M

A

132

Z

DIMENSIONS (mm are the original dimensions)

A

UNIT A

mm

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

max.

1.8

A

0.10

0.02

1

1.7

1.5

e

b

A

0.25

p

3

0.85

0.65

2

b

p

e

1

cD

b

1

3.15

0.35

0.25

6.7

6.3

2.95

w M

0 2 4 mm

scale

(1)

(1)

e

E

3.7

2.3

3.3

A

e1H

4.6

7.3

6.7

Q

A

2

A

1

L

L

detail X

LpQywv

L

E

1.02

1.75

0.62

1.0

0.8

0.1 0.10.2

(A3)

p

Z

1.2

0.7

θ

θ

10°

0°

OUTLINE
VERSION

SOT223-1 TO-261

IEC JEDEC EIAJ

REFERENCES

2000 Dec 14 12

EUROPEAN

PROJECTION

ISSUE DATE

99-08-04
99-12-15

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current
5 V voltage regulator

SO8: plastic small outline package; 8 leads; body width 3.9 mm

D

c

y

Z

8

5

TDA3664

SOT96-1

E

H

E

A

X

v M

A

A

pin 1 index

1

e

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

mm

inches

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

A

max.

1.75

0.069

A1A2A

0.25

1.45

0.10

1.25

0.010

0.057

0.004

0.049

0.25

0.01

b

3

p

0.49

0.25

0.36

0.19

0.019

0.0100

0.014

0.0075

4

w M

b

p

0 2.5 5 mm

scale

(1)E(2)

cD

5.0

4.8

0.20

0.19

eHELLpQZywv θ

4.0

1.27

3.8

0.16

0.050

0.15

2

A

6.2

5.8

0.244

0.228

Q

3

A

θ

0.25 0.10.25

0.010.010.041 0.004

(1)

0.7

0.3

0.028

0.012

o

8

o

0

L

p

L

0.7

0.6

0.028

0.024

(A )

1

detail X

1.0

1.05

0.4

0.039

0.016

OUTLINE

VERSION

SOT96-1

IEC JEDEC EIAJ

076E03 MS-012

REFERENCES

2000 Dec 14 13

EUROPEAN

PROJECTION

ISSUE DATE

97-05-22
99-12-27

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current
5 V voltage regulator

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm

D

y

Z

8

c

5

E

H

E

TDA3664

SOT505-1

A

X

v M

A

A

pin 1 index

14

e

DIMENSIONS (mm are the original dimensions)

A

A

A

UNIT

max.

mm

1.10

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE
VERSION

SOT505-1

1

0.15

0.05

A3b

2

0.95

0.25

0.80

IEC JEDEC EIAJ

p

0.45

0.25

w M

b

p

(1)E(2)

ceD

0.28

3.10

0.15

3.10

2.90

2.90

REFERENCES

2.5 5 mm0

scale

0.65

2

A

1

LH

E

5.10

4.70

detail X

L

p

0.70

0.40

L

(A3)

L

p

EUROPEAN

PROJECTION

θ

wyv

0.1 0.10.10.94

A

(1)

θ

Z

0.70

6°

0.35

0°

ISSUE DATE

99-04-09

2000 Dec 14 14

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current
5 V voltage regulator

SOLDERING
Introduction to soldering surface mount packages

Thistextgivesaverybriefinsighttoacomplextechnology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering can still be used for
certainsurfacemountICs,butitisnot suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
totheprinted-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.

Wave soldering

Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

TDA3664

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackageswithleadsonfoursides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

2000 Dec 14 15

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current

TDA3664

5 V voltage regulator

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

BGA, LFBGA, SQFP, TFBGA not suitable suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable

(3)

PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

, SO, SOJ suitable suitable

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

The package footprint must incorporate solder thieves downstream and at the side corners.

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

SOLDERING METHOD

WAVE REFLOW

(2)

(3)(4)
(5)

suitable

suitable
suitable

(1)

.

2000 Dec 14 16

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current

TDA3664

5 V voltage regulator

DATA SHEET STATUS

DATA SHEET STATUS

Objective specification Development This data sheet contains the design target or goal specifications for

Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be

Product specification Production This data sheet contains final specifications. Philips Semiconductors

Note

1. Please consult the most recently issued data sheet before initiating or completing a design.

DEFINITIONS
Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseoratanyotherconditionsabovethosegiveninthe
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationorwarrantythat such applications will be
suitable for the specified use without further testing or
modification.

PRODUCT

STATUS

DEFINITIONS

product development. Specification may change in any manner without
notice.

published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.

reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.

DISCLAIMERS
Life support applications  These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomersusingorselling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuseofanyoftheseproducts, conveys no licence or title
under any patent, copyright, or mask work right to these
products,andmakesnorepresentationsor warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

(1)

2000 Dec 14 17

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current
5 V voltage regulator

NOTES

TDA3664

2000 Dec 14 18

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current
5 V voltage regulator

NOTES

TDA3664

2000 Dec 14 19

Philips Semiconductors – a w orldwide compan y

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For all other countries apply to: Philips Semiconductors,
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© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
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under patent- or other industrial or intellectual property rights.

2000

Internet: http://www.semiconductors.philips.com

70

Printed in The Netherlands 753503/05/pp20 Date of release: 2000 Dec 14 Document order number: 9397750 07866